CN117799075A - Cleavage device and cleavage method - Google Patents
Cleavage device and cleavage method Download PDFInfo
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- CN117799075A CN117799075A CN202311809675.6A CN202311809675A CN117799075A CN 117799075 A CN117799075 A CN 117799075A CN 202311809675 A CN202311809675 A CN 202311809675A CN 117799075 A CN117799075 A CN 117799075A
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 29
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention provides a cleavage device and a cleavage method, which relate to the technical field of semiconductors, and can be used for fixing a cleavage line of a product to be cleaved when the first platform and the second platform are moved to be contacted with each other, a test line can be drawn on the upper surface of the product to be cleaved by a cutter, a CCD camera can be used for shooting the test line and displaying a scratch graph of the test line, an angle adjusting mechanism can adjust the pitching angle and the autorotation angle of the cutter according to the scratch graph, so that the cutter tip of the cutter is contacted with the upper surface of the product to be cleaved at an optimal scribing angle, and the optimal scribing angle can also be the angle of the cutter tip of the cutter perpendicular to the product to be cleaved, so that the cleavage line with high precision, good flatness and good stability can be drawn on the product to be cleaved, and the cutter tip of the cutter is kept in contact with the product to be cleaved at the optimal scribing angle by adjusting the pitching angle and the autorotation angle of the cutter, so that the stability of the cleavage effect is good.
Description
Technical Field
The present invention relates to the field of semiconductor technologies, and in particular, to a cleaving apparatus and a cleaving method.
Background
At present, in the manufacturing process of semiconductor chips, wafer cleavage is an important link, and the used cleavage equipment is mainly divided into a split machine type and an integrated machine type, and a front scribing and back splitting method and a front scribing and front splitting method are respectively adopted.
For split machine type cleavage equipment, firstly, scribing operation is carried out on the front surface of a wafer on a scribing machine so as to ensure that the subsequent cleavage process can be smoothly split along scribing, then the wafer is transferred to a splitting machine, and after the scribing surface is inverted by turning over the wafer, a chopper is adopted to press down so that the wafer is split along scribing, so that the bar is obtained. However, the split-type cleavage operation is performed on two sets of equipment, repeated alignment is required for the wafer, the alignment process is complex and time-consuming, and errors are easily generated in the two alignments.
And to the cleavage equipment of integrative model, at the front of wafer at first operation of marking off, then directly use the sword at the front of wafer along marking off roll extrusion completion split, although need not repeatedly fix a position the wafer, but because the process of marking off can break the sediment, the piece can appear near the edge of a knife, in the process of rolling repeatedly, can make the piece produce and shift, cause the front of wafer to be dirty to the sword is usually diamond to the sword, the sword is in long-time use, the knife tip of sword can be worn and torn, leads to the knife tip to change with the contact angle of waiting cleavage product, can influence the stability of cleavage effect.
Disclosure of Invention
In view of the above, the present invention provides a cleaving apparatus and a cleaving method to solve the problems that the front side of the wafer is dirty during the cleaving process, and the stability of the cleaving effect of the dicing blade is poor after long-term use.
The technical scheme of the invention is realized as follows:
in one aspect, the invention provides cleavage equipment, which comprises a platform, an angle adjusting mechanism, a scribing cutter, a CCD camera and a thimble;
the platform is used for fixing a product to be cleaved, and comprises a first platform and a second platform which are oppositely arranged, wherein the first platform and the second platform can move towards a direction approaching to or away from each other;
the scribing cutter is movably arranged above the platform and is used for generating a test line or a cleavage line on the upper surface of the product to be cleaved;
the CCD camera is arranged above the platform and is used for shooting the test line and displaying a scratch graph of the test line;
the angle adjusting mechanism is in driving connection with the scribing cutter, and is used for adjusting the pitching angle and the autorotation angle of the scribing cutter according to the scratch graph, so that the cutter point of the scribing cutter is in contact with the product to be cleaved at the optimal scribing angle, and the cleavage line is scribed on the product to be cleaved;
The thimble is movably arranged below the platform, and the thimble is used for being lifted to be propped against the lower surface of the product to be cleaved and moving along the cleavage line so that the product to be cleaved is naturally cleaved along the cleavage line.
On the basis of the above technical scheme, preferably, the cleavage device further comprises a negative pressure generator, wherein a plurality of micropores are respectively arranged on the first platform and the second platform, and the negative pressure generator is respectively communicated with the micropores so as to generate negative pressure in the micropores.
On the basis of the above technical scheme, preferably, the cleavage device further comprises a crystal expansion iron ring and a cleavage blue film, the crystal expansion iron ring is arranged on the first platform and the second platform, the cleavage blue film is stretched and attached to the crystal expansion iron ring, a product to be cleaved is attached to the cleavage blue film, and the negative pressure generator is used for generating negative pressure in the micropores to adsorb the cleavage blue film.
On the basis of the above technical scheme, preferably, the angle adjusting mechanism comprises a mounting frame, a first rotating shaft, a supporting frame, a rotation angle adjusting part and a pitching angle adjusting part, wherein the mounting frame is fixedly arranged, one end of the supporting frame is rotatably mounted on the mounting frame through the first rotating shaft, the pitching angle adjusting part is in driving connection with the supporting frame, the rotation angle adjusting part is mounted on the supporting frame, and the rotation angle adjusting part is in driving connection with the scratching blade, the pitching angle adjusting part is used for driving the supporting frame to rotate around the axis of the first rotating shaft so as to drive the scratching blade to rotate around the axis of the first rotating shaft, and the rotation angle adjusting part is used for driving the scratching blade to rotate around the direction perpendicular to the first rotating shaft.
On the basis of the above technical scheme, preferably, the rotation angle adjusting part comprises a first rotating shaft, a second rotating shaft, a first bevel gear, a second bevel gear and a first bevel gear, the supporting frame comprises a first supporting rod and a second supporting rod, the first supporting rod and the second supporting rod are intersected, the first rotating shaft is rotatably mounted on the first supporting rod, the first rotating shaft and the first rotating shaft are arranged in parallel, the opposite ends of the first rotating shaft are respectively provided with the first bevel gear and the first bevel gear, the second rotating shaft is rotatably mounted on the second supporting rod, the second rotating shaft and the first rotating shaft are vertically arranged, one end of the second rotating shaft is provided with the second bevel gear, the first bevel gear and the second bevel gear are meshed, the other end of the second rotating shaft is provided with the cutter, the first bevel gear is driven to rotate around the axis of the first rotating shaft through rotation, and the second bevel gear is driven to rotate around the axis of the second bevel gear, and the second bevel gear is driven to rotate around the axis of the second rotating shaft.
On the basis of the above technical scheme, preferably, the pitch angle adjusting part comprises a second hand wheel, a first gear, a second gear, a first connecting rod and a second connecting rod, wherein the first connecting rod is rotatably mounted on the mounting frame, the first connecting rod and the first rotating shaft are arranged in parallel, the second hand wheel and the first gear are respectively arranged at the opposite ends of the first connecting rod, one end of the second connecting rod is connected with the supporting frame, the second gear is arranged at the other end of the second connecting rod, the second gear is meshed with the first gear, the second connecting rod and the first connecting rod are mutually arranged in parallel, the second hand wheel is rotated to drive the first connecting rod and the first gear to rotate around the axis of the first connecting rod, and the first gear drives the second gear and the second connecting rod to rotate around the axis of the first connecting rod so as to drive the supporting frame to rotate around the axis of the first rotating shaft.
On the basis of the above technical scheme, preferably, the first platform and the second platform are arranged in the frame, and the frame is provided with a chip adsorption port, and the chip adsorption port faces to the product to be cleaved and is used for adsorbing chips generated in the scribing process.
In another aspect, the present invention provides a cleaving method, using the cleaving apparatus as described above, comprising the steps of:
s1, fixedly placing a product to be cleaved on a first platform and a second platform;
s2, scribing a test line on the upper surface of the product to be cleaved by using a scribing cutter, shooting the test line in real time by using a CCD camera, and displaying a scratch graph of the test line through a display;
s3, adjusting the pitching angle and the autorotation angle of the scribing cutter according to the scratch graph to enable the cutter point of the scribing cutter to be in contact with the product to be cleaved at an optimal scribing angle;
s4, scribing a cleavage line on the upper surface of the product to be cleaved by using the scribing cutter;
s5, lifting the thimble from between the first platform and the second platform to be abutted against the lower surface of the product to be cleaved, wherein the thimble and the cleavage line are oppositely arranged;
s6, driving the ejector pin to move along the cleavage line so as to enable the product to be cleaved to be naturally cleaved along the cleavage line.
On the basis of the above technical solution, preferably, the fixing the product to be cleaved on the first platform and the second platform includes: placing a crystal-expanded iron ring on the first platform and the second platform, stretching a cleavage blue film and attaching the cleavage blue film on the crystal-expanded iron ring, attaching the product to be cleaved on the cleavage blue film, and generating negative pressure in micropores on the first platform and the second platform by using a negative pressure generator so as to adsorb and fix the cleavage blue film.
On the basis of the above technical solution, preferably, before the raising the ejector pin from below the platform to abut against the lower surface of the product to be cleaved, the method further includes: and moving the first platform and the second platform to a preset distance in a direction away from each other, and generating negative pressure in the micropores of the first platform and the second platform by using the negative pressure generator so as to adsorb and fix the expanded iron ring.
Compared with the prior art, the cleavage equipment and the cleavage method have the following beneficial effects:
(1) Through setting up first platform and second platform, first platform and second platform can be moved towards each other being close to or the direction that is kept away from each other, when first platform and second platform move to be contacted each other, can be used for fixing the product to be cleaved, can cut out the test line on the upper surface of the product to be cleaved with the sword, CCD camera can be used for shooting the test line and showing the scratch graph of test line, can pass through angle adjustment mechanism according to the scratch graph and adjust pitch angle and rotation angle of the sword, make the knife tip of sword contact with the upper surface of the product to be cleaved with the optimum angle of marking off, the optimum angle of marking off can also be said the angle of cutting off perpendicular to the angle of product to be cleaved, thereby can cut out the cleavage line of high accuracy, good flatness, stability on the product to be cleaved, and even if the sword is worn, also can make the knife tip of sword keep the optimum angle of marking off contact with the product to be cleaved, make the stability of cleavage effect good;
(2) According to the method, the thimble is movably arranged below the platform, the first platform and the second platform are moved in the direction away from each other by a preset distance, so that the thimble can be lifted from between the first platform and the second platform to be propped against the lower surface of a product to be cleaved, namely, the needle point of the thimble is propped against the lower surface of the product to be cleaved, and the needle point of the thimble is arranged opposite to the cleavage line, so that the thimble can be driven to move along the cleavage line, the product to be cleaved is naturally cleaved along the cleavage line, and therefore, repeated scratching of the scratching knife on the cleavage line is not needed, the scratching knife is lifted to the standby height, and inverted splinters are completed through the thimble, so that chips can be prevented from being rolled to the surface of the product to be cleaved;
(3) According to the angle adjusting mechanism, the mounting frame and the supporting frame are arranged, the supporting frame is rotatably mounted on the mounting frame through the first rotating shaft, the pitching angle adjusting part is in driving connection with the supporting frame and used for driving the supporting frame to rotate around the first rotating shaft, the autorotation angle adjusting part is mounted on the supporting frame and is in driving connection with the scribing cutter, and the autorotation angle adjusting part is used for driving the scribing cutter to rotate around the direction perpendicular to the first rotating shaft, so that the pitching angle and the autorotation angle of the scribing cutter can be respectively adjusted, and the scribing cutter can be ensured to be contacted with a product to be cleaved at an optimal scribing angle;
(4) This application is equipped with a plurality of micropores through respectively on first platform and second platform, and negative pressure generator can communicate with a plurality of micropores respectively, when needing to fix the product of waiting to cleave, can produce negative pressure in the micropore and adsorb the fixed product of waiting to cleave for wait to cleave product and first platform and second platform and laminate together tightly, thereby make the roughness of waiting to cleave product better, can conveniently score on waiting to cleave the product.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic and schematic illustration of a cleavage apparatus according to the present invention;
FIG. 2 is a top view of a second platform of the first platform of the present invention;
FIG. 3 is a schematic and simplified illustration of the structure of the scoring blade of the present invention when scoring;
FIG. 4 is a schematic illustration of the structure of the thimble of the present invention during cleaving;
FIG. 5 is a schematic view of the angle adjusting mechanism of the present invention;
FIG. 6 is a flow chart showing the steps of a cleavage method according to the present invention;
FIG. 7 is a first scratch pattern of a test line of the present invention;
fig. 8 is a second scratch pattern of the test line of the present invention.
Reference numerals:
1. a first platform; 2. a second platform; 3. an angle adjusting mechanism; 31. a mounting frame; 32. a first rotation shaft; 33. a support frame; 331. a first support bar; 332. a second support bar; 34. a rotation angle adjusting unit; 341. a first rotating shaft; 342. a second rotating shaft; 343. a first bevel gear; 344. a second bevel gear; 345. a first hand wheel; 35. a pitch angle adjusting section; 351. the second hand wheel; 352. a first gear; 353. a second gear; 354. a first connecting rod; 355. a second connecting rod; 4. scribing knife; 5. a CCD camera; 6. a thimble; 7. a product to be cleaved; 8. micropores; 9. a crystal-expanded iron ring; 10. cleaving the blue film; 11. a frame; 12. a debris adsorbing port; 13. an upper material loading and unloading frame; 14. a loading and unloading mechanical arm; 15. an alarm.
Detailed Description
The following description of the embodiments of the present invention will clearly and fully describe the technical aspects of the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
On the one hand, as shown in fig. 1 to 4, a cleavage apparatus of the present invention includes a first stage 1, a second stage 2, an angle adjusting mechanism 3, a dicing blade 4, a CCD camera 5, and a thimble 6;
wherein the first platform 1 and the second platform 2 are oppositely arranged, the first platform 1 and the second platform 2 can move towards a direction approaching to or separating from each other, and the first platform 1 and the second platform 2 are used for fixing a product 7 to be cleaved;
the scribing cutter 4 is movably arranged above the product 7 to be cleaved, and the scribing cutter 4 is used for scribing a test line or a cleavage line on the upper surface of the product 7 to be cleaved;
the CCD camera 5 is arranged towards the product 7 to be cleaved, and the CCD camera 5 is used for shooting the test line and displaying a scratch graph of the test line;
the angle adjusting mechanism 3 is in driving connection with the scribing cutter 4, and the angle adjusting mechanism 3 is used for adjusting the pitching angle and the autorotation angle of the scribing cutter 4 according to the scratch graph, so that the cutter point of the scribing cutter 4 is in contact with the product 7 to be cleaved at an optimal scribing angle, and the cleavage line is scribed on the product 7 to be cleaved;
the thimble 6 is movably arranged below the product 7 to be cleaved, and the thimble 6 is used for being lifted to be propped against the lower surface of the product 7 to be cleaved and moving along the cleavage line so that the product 7 to be cleaved is naturally cleaved along the cleavage line.
Specifically, the cleavage apparatus may include a first stage 1, a second stage 2, an angle adjusting mechanism 3, a scribing cutter 4, a CCD camera 5, and a thimble 6, wherein the first stage 1 and the second stage 2 may be both work tables of a semicircular structure, and the first stage 1 and the second stage 2 may be located on the same horizontal plane and may move in directions approaching each other or moving away from each other, when the product 7 to be cleaved needs to be fixed, the first stage 1 and the second stage 2 may be moved in directions approaching each other to contact each other to form a circular work table, and the product 7 to be cleaved may be fixed on the circular work table.
The scribing cutter 4 can be movably arranged above the first platform 1 and the second platform 2, so to speak, the scribing cutter 4 is movably arranged above the product 7 to be cleaved, and the scribing cutter 4 can scribe a test line or a cleavage line on the upper surface of the product 7 to be cleaved, more clearly, when the angle of the scribing cutter 4 needs to be adjusted, the test line can be firstly scribed on the product 7 to be cleaved, and the test line is a scribing line with a relatively short length.
The CCD camera 5 can be arranged towards the product 7 to be cleaved, so to speak, the CCD camera 5 can be arranged towards the test line, the CCD camera 5 can be used for shooting the test line, and a scratch graph of the test line can be displayed through the CCD camera 5, and whether the contact angle between the scratching knife 4 and the product 7 to be cleaved is kept in a vertical state can be clearly seen after the scratch graph is amplified.
The angle adjusting mechanism 3 can be in driving connection with the scribing cutter 4, the angle adjusting structure can be used for adjusting the pitching angle and the autorotation angle of the scribing cutter 4 according to the scratch shape presented by the scratch graph, so that the contact angle between the cutter tip of the scribing cutter 4 and the product 7 to be cleaved is the optimal angle, the scribing cutter 4 is provided with a plurality of cutter faces, when one of the cutter faces is worn seriously, the scribing cutter 4 can be directly autorotated by 90 degrees or 180 degrees to replace a new cutter face to be contacted with the product 7 to be cleaved, and the new cutter face can be quickly replaced to be contacted with the product 7 to be cleaved.
More clearly, when the scribing graph of the test line is shown in fig. 7, the shape of the scribing line is distorted, and the thickness of the scribing line is different, which indicates that the tip of the scribing cutter 4 and the product 7 to be cleaved are not kept in a mutually perpendicular state, the contact angle of the scribing cutter 4 and the product 7 to be cleaved can be adjusted by adjusting the pitch angle and the rotation angle of the scribing cutter 4, after each adjustment, one scribing line can be scribed on the product 7 to be cleaved again, and the pitch angle and the rotation angle of the scribing cutter 4 can be continuously adjusted according to the newly scribed test line, and then the scribing step and the adjusting step are repeated until the scribing graph of the test line is shown in fig. 8, which indicates that one scribing line is straight on the product 7 to be cleaved, and the thickness of the scribing line is identical, at this time, the contact angle of the tip of the surface cutter 4 and the product 7 to be cleaved can be the optimal angle, and the scribing line can be scribed on the product 7 to be extended along the length direction of the product 7 to be cleaved by the scribing cutter 4.
The thimble 6 can be movably arranged below the product 7 to be cleaved, that is, the thimble 6 is movably arranged below the first platform 1 and the second platform 2, when the scribing cutter 4 scribes a cleavage line on the upper surface of the product 7 to be cleaved, the first platform 1 and the second platform 2 can be moved along a direction away from each other by a preset distance, a gap is formed between the first platform 1 and the second platform 2, the thimble 6 can be lifted to abut against the lower surface of the product 7 to be cleaved, the thimble 6 can be arranged opposite to the cleavage line, and the thimble 6 can also be moved along the cleavage line, so that the product 7 to be cleaved can be naturally cleaved along the cleavage line.
Therefore, the tip of the scribing cutter 4 can be kept in contact with the product 7 to be cleaved at an optimal scribing angle by adjusting the pitch angle and the rotation angle of the scribing cutter 4, so that the stability of the cleavage effect is good, and the thimble 6 can move along the cleavage line on the lower surface of the product 7 to be cleaved, so that the product 7 to be cleaved is naturally cleaved along the cleavage line, thereby avoiding repeated scribing of the scribing cutter 4 on the cleavage line and rolling of chips to the surface of the product 7 to be cleaved.
As shown in fig. 2, in some embodiments, the cleaving apparatus further includes a negative pressure generator, and the first stage 1 and the second stage 2 are respectively provided with a plurality of micro-holes 8, and the negative pressure generator is respectively in communication with the plurality of micro-holes 8 to generate a negative pressure in the micro-holes 8.
Specifically, the cleavage device may further include a negative pressure generator, the first platform 1 and the second platform 2 may be ceramic micro-pore 8 platforms, the first platform 1 and the second platform 2 may be provided with a plurality of micro-pores 8, the plurality of micro-pores 8 may be arranged in an array, the negative pressure generator may be respectively communicated with the plurality of micro-pores 8, so that the product 7 to be cleaved may be adsorbed by generating negative pressure in the micro-pores 8, and the product 7 to be cleaved and the first platform 1 and the second platform 2 may be tightly attached together, so that the flatness of the product 7 to be cleaved is better, and the product 7 to be cleaved may be conveniently scribed.
As shown in fig. 2 to 4, in some embodiments, the cleaving apparatus further includes a die-expanding iron ring 9 and a cleavage blue film 10, the die-expanding iron ring 9 is disposed on the first stage 1 and the second stage 2, the cleavage blue film 10 is stretched and attached to the die-expanding iron ring 9, the product 7 to be cleaved is attached to the cleavage blue film 10, and the negative pressure generator is used for generating negative pressure in the micro-holes 8 to adsorb the cleavage blue film 10 or the die-expanding iron ring 9.
Specifically, the cleavage apparatus may further include a die-expanded iron ring 9 and a cleavage blue film 10, the die-expanded iron ring 9 being a metal ring-shaped article made of a high-strength and high-hardness material, the iron ring being capable of fixing a product to be cleaved by means of a patch, the die-expanded iron ring 9 being capable of being placed on outer rings of the first stage 1 and the second stage 2.
The cleavage blue film 10 is a special electronic grade adhesive tape, has the characteristics of high ductility, stable viscosity and the like, and is commonly used for protecting and supporting wafers, crystal grains and the like, the cleavage blue film 10 can be tightly adhered to the surface of the crystal expansion iron ring 9, and the product 7 to be cleaved can be adhered to the cleavage blue film 10, so that the product 7 to be cleaved can be prevented from displacement, dropping and breaking in the transmission and cleavage processes.
When the product 7 to be cleaved needs to be fixed, the first platform 1 and the second platform 2 are contacted with each other to form a circular workbench, and negative pressure can be generated in the plurality of micropores 8 through the negative pressure generator to adsorb the cleavage blue film 10, so that the cleavage blue film 10 is fixed on the first platform 1 and the second platform 2, and the product 7 to be cleaved can be firmly attached on the first platform 1 and the second platform 2.
When the thimble 6 needs to be contacted with the lower surface of the product 7 to be cleaved, the first platform 1 and the second platform 2 can be moved a predetermined distance in a direction away from each other, but to ensure that the first platform 1 and the second platform 2 are respectively contacted with the opposite sides of the expanded iron ring 9, that is, the expanded iron ring 9 is still placed on the first platform 1 and the second platform 2, negative pressure can be generated in the plurality of micro holes 8 by the negative pressure generator to adsorb the expanded iron ring 9, so that the expanded iron ring 9 is firmly fixed on the first platform 1 and the second platform 2, that is, the cleavage blue film 10 can be tightened, so that the product 7 to be cleaved is also in a tightened state, the thimble 6 is lifted from between the first platform 1 and the second platform 2 to be contacted with the lower surface of the product 7 to be cleaved, and the thimble 6 is moved along the cleavage line, so that the product 7 to be cleaved naturally along the cleavage line.
As shown in fig. 5, in some embodiments, the angle adjusting mechanism 3 includes a mounting frame 31, a first rotation shaft 32, a support frame 33, a rotation angle adjusting portion 34 and a pitch angle adjusting portion 35, where the mounting frame 31 is fixedly disposed, one end of the support frame 33 is rotatably mounted on the mounting frame 31 through the first rotation shaft 32, the pitch angle adjusting portion 35 is drivingly connected with the support frame 33, the rotation angle adjusting portion 34 is mounted on the support frame 33, and the rotation angle adjusting portion 34 is drivingly connected with the scribe blade 4, the pitch angle adjusting portion 35 is used for driving the support frame 33 to rotate around the axis of the first rotation shaft 32 so as to drive the scribe blade 4 to rotate around the axis of the first rotation shaft 32, and the rotation angle adjusting portion 34 is used for driving the scribe blade 4 to rotate around a direction perpendicular to the first rotation shaft 32.
Specifically, the angle adjusting mechanism 3 may include a mounting frame 31, a first rotation shaft 32, a support frame 33, a rotation angle adjusting portion 34, and a pitch angle adjusting portion 35, the mounting frame 31 may be fixedly provided, and the mounting frame 31 may have a rotation mounting portion thereon, the first rotation shaft 32 may be rotatably mounted in the rotation mounting portion, and one end of the support frame 33 may be connected to the first rotation shaft 32, so that the support frame 33 may be rotated about an axis of the first rotation shaft 32 with respect to the mounting frame 31.
The pitching angle adjusting part 35 can be in driving connection with the supporting frame 33, the rotation angle adjusting part 34 can be installed on the supporting frame 33, and the rotation angle adjusting part 34 can be in driving connection with the scribing cutter 4, when the pitching angle adjusting part 35 drives the supporting frame 33 to rotate around the axis of the first rotating shaft 32, the scribing cutter 4 can be driven to rotate around the axis of the first rotating shaft 32 through the supporting frame 33, so that the pitching angle of the scribing cutter 4 can be adjusted, the rotation angle adjusting part 34 can drive the scribing cutter 4 to rotate around the direction perpendicular to the first rotating shaft 32, so that the rotation angle of the scribing cutter 4 can be adjusted, and the scribing cutter 4 can keep optimal scribing angle contact with a product 7 to be cleaved.
Preferably, the rotation angle adjusting part 34 and the pitch angle adjusting part 35 may be respectively provided with a protractor or a micrometer, and the angle of the saw blade 4 may be finely adjusted by measuring the angle of adjustment by the protractor and the micrometer, so that the angle of the saw blade 4 may be more precisely adjusted.
As shown in fig. 5, in some embodiments, the rotation angle adjusting portion 34 includes a first rotating shaft 341, a second rotating shaft 342, a first bevel gear 343, a second bevel gear 344 and a first hand wheel 345, the supporting frame 33 includes a first supporting rod 331 and a second supporting rod 332, the first supporting rod 331 and the second supporting rod 332 are intersected, the first rotating shaft 341 is rotatably mounted on the first supporting rod 331, the first rotating shaft 341 and the first rotating shaft 32 are disposed in parallel, two opposite ends of the first rotating shaft 341 are respectively provided with the first hand wheel 345 and the first bevel gear 343, the second rotating shaft 342 is rotatably mounted on the second supporting rod 332, the second rotating shaft 342 and the first rotating shaft 32 are vertically disposed, one end of the second rotating shaft 342 is provided with the second bevel gear 344, the first bevel gear 343 and the second bevel gear 344 are meshed, the other end of the second rotating shaft 342 is provided with the cutter 4, and the first bevel gear 345 is driven by rotating the first hand wheel 345 to rotate around the second bevel gear 343, and the cutter 4 is driven by rotating around the second rotating shaft 343 around the first rotating shaft 342.
Specifically, the rotation angle adjusting part 34 may include a first shaft 341, a second shaft 342, a first bevel gear 343, a second bevel gear 344, and a first hand wheel 345, in this embodiment, the support frame 33 may include a first support rod 331 and a second support rod 332, the first support rod 331 and the second support rod 332 may be disposed to intersect, preferably, the first support rod 331 and the second support rod 332 are disposed to be perpendicular to each other, and one end of the first support rod 331 may be rotatably mounted on the mounting frame 31 through the first rotation shaft 32 such that the first support rod 331 may rotate about the axis of the first rotation shaft 32 and the second support rod 332 is driven to rotate about the axis of the first rotation shaft 32.
The first rotating shaft 341 may be rotatably installed on the first supporting rod 331, and the first rotating shaft 341 and the first rotating shaft 32 are disposed in parallel, and opposite ends of the first rotating shaft 341 may be provided with a first hand wheel 345 and a first bevel gear 343, respectively, so that the first bevel gear 343 may be driven to rotate about the axis of the first rotating shaft 341 by rotating the first hand wheel 345.
The second rotating shaft 342 may be rotatably mounted on the second supporting rod 332, and the second rotating shaft 342 may be vertically disposed with the first rotating shaft 32, or may be said that the second rotating shaft 342 and the first rotating shaft 341 are vertically disposed with each other, one end of the second rotating shaft 342 near the first rotating shaft 341 may be provided with a second bevel gear 344, the second bevel gear 344 is meshed with the first bevel gear 343, and the other end of the second rotating shaft 342 is provided with a cutter 4, so that when the first bevel gear 343 rotates around the axis of the first rotating shaft 341, the first bevel gear 343 drives the second bevel gear 344 to rotate around the axis of the second rotating shaft 342, and drives the cutter 4 to rotate around the axis of the second rotating shaft 342, thereby adjusting the rotation angle of the cutter 4.
As shown in fig. 5, in some embodiments, the pitch angle adjusting portion 35 includes a second hand wheel 351, a first gear 352, a second gear 353, a first connecting rod 354 and a second connecting rod 355, where the first connecting rod 354 is rotatably mounted on the mounting frame 31, and the first connecting rod 354 and the first rotating shaft 32 are disposed in parallel, opposite ends of the first connecting rod 354 are respectively provided with the second hand wheel 351 and the first gear 352, one end of the second connecting rod 355 is connected with the supporting frame 33, the other end of the second connecting rod 355 is provided with the second gear 353, the second gear 353 is meshed with the first gear 352, the second connecting rod 355 and the first connecting rod 354 are disposed parallel to each other, the second hand wheel 351 is rotated to drive the first connecting rod 354 and the first gear 352 to rotate around the axis of the first connecting rod 354, and the second connecting rod 355 is driven to rotate around the axis of the first connecting rod 354 to drive the supporting frame 33 to rotate around the axis of the first rotating shaft 32.
Specifically, the pitch angle adjusting part 35 may include a second hand wheel 351, a first gear 352, a second gear 353, a first connecting rod 354 and a second connecting rod 355, the first connecting rod 354 may be rotatably mounted on the mounting frame 31, and the first connecting rod 354 may be disposed in parallel with the first rotation shaft 32, opposite ends of the first connecting rod 354 may be provided with the second hand wheel 351 and the first gear 352, respectively, the second connecting rod 355 may be disposed in parallel with the first connecting rod 354, and one end of the second connecting rod 355 is connected with the support frame 33, and the other end of the second connecting rod 355 may be provided with the second gear 353, and the second gear 353 is engaged with the first gear 352.
When the second hand wheel 351 is rotated, the first gear 352 can be driven to rotate around the axis of the first connecting rod 354, and the first gear 352 and the second gear 353 are meshed, so that the second gear 353 can be driven to rotate, and the second gear 353 can drive the support frame 33 to rotate around the axis of the first connecting rod 354 through the second connecting rod 355 in the rotating process, so that the scribing cutter 4 mounted on the support frame 33 can be driven to rotate around the axis of the first connecting rod 354, and the pitching angle of the scribing cutter 4 can be adjusted.
Preferably, the rotation angle adjusting part 34 may further include a first locking member and a second locking member, the first locking member is disposed on the first hand wheel 345, the second locking member is disposed on the second hand wheel 351, when the scribing cutter 4 needs to be fixed, the first hand wheel 345 and the first supporting rod 331 may be connected through the first locking member, so that the first hand wheel 345 cannot rotate, the rotation angle of the scribing cutter 4 cannot be adjusted, the second hand wheel 351 and the mounting frame 31 may be connected through the second locking member, and therefore the pitch angle of the scribing cutter 4 cannot be adjusted, and the scribing cutter 4 may be fixed.
As shown in fig. 1, in some embodiments, the cleaving apparatus further includes a frame 11, the first stage 1 and the second stage 2 are disposed in the frame 11, and a chip adsorbing port 12 is disposed on the frame 11, and the chip adsorbing port 12 is disposed towards the product 7 to be cleaved, and is used for adsorbing chips generated in the scribing process.
Specifically, the cleaving apparatus may further include a frame 11, the first stage 1 and the second stage 2 may be disposed inside the frame 11, and the frame 11 may further be provided with a chip adsorbing port 12, the chip adsorbing port 12 may be disposed toward the product 7 to be cleaved, and when the scribing blade 4 is scribing an upper surface of the product 7 to be cleaved, chips generated in the scribing process may be adsorbed through the chip adsorbing port 12, and the chips may be discharged from the surface of the product 7 to be cleaved, thereby further avoiding the chips from contaminating the product 7 to be cleaved.
Preferably, the frame 11 may further be provided with an upper and lower material frame 13 and an upper and lower material mechanical arm 14, the product 7 to be cleaved may be stored in the upper and lower material frame 13, the expanded iron ring 9 may be placed on the first platform 1 and the second platform 2 by the upper and lower material mechanical arm 14, and the product 7 to be cleaved may be grabbed from the upper and lower material frame 13 and placed on the first platform 1 and the second platform 2 by the upper and lower material mechanical arm 14, so as to realize automatic feeding and discharging.
Preferably, the frame 11 is further provided with an alarm 15, and the alarm 15 may give a warning when a fault occurs during scribing or cleaving.
On the other hand, as shown in fig. 6, a cleavage method of the present invention, to which the cleavage apparatus as described above is applied, comprises the steps of:
S1, fixedly placing a product 7 to be cleaved on a first platform 1 and a second platform 2;
s2, scribing a test line on the upper surface of the product 7 to be cleaved by using a scribing cutter 4, shooting the test line in real time by using a CCD camera 5, and displaying a scratch graph of the test line through a display;
s3, adjusting the pitching angle and the autorotation angle of the scribing cutter 4 according to the scratch graph, so that the cutter point of the scribing cutter 4 is contacted with the product 7 to be cleaved at an optimal scribing angle;
s4, scribing a cleavage line on the upper surface of the product 7 to be cleaved by using the scribing cutter 4;
s5, lifting the thimble 6 from between the first platform 1 and the second platform 2 to be abutted against the lower surface of the product 7 to be cleaved, wherein the thimble 6 and the cleavage line are oppositely arranged;
s6, driving the thimble 6 to move along the cleavage line so as to naturally cleave the product 7 to be cleaved along the cleavage line.
Specifically, in step S1, the first stage 1 and the second stage 2 may be moved in a direction approaching each other such that the first stage 1 and the second stage 2 are in contact with each other, the product 7 to be cleaved may be placed on the first stage 1 and the second stage 2, and the product 7 to be cleaved may be adsorbed and fixed by generating negative pressure in the micro-holes 8 by the negative pressure generator such that the product 7 to be cleaved is firmly attached to the first stage 1 and the second stage 2.
Preferably, the step S1 may further include a step of placing the expanded iron ring 9 on the first stage 1 and the second stage 2, and attaching the cleavage blue film 10 to the expanded iron ring 9 in a stretched film manner, and the product 7 to be cleaved may be attached to the cleavage blue film 10, and then generating negative pressure to adsorb the cleavage blue film 10 in the micro holes 8 of the first stage 1 and the second stage 2 by the negative pressure generator, so that the cleavage blue film 10 is firmly attached to the first stage 1 and the second stage 2, thereby attaching and fixing the product 7 to be cleaved on the first stage 1 and the second stage 2, increasing the flatness of the product 7 to be cleaved, and making scribing smoother.
In step S2, a scribe line may be scribed on the upper surface of the product 7 to be cleaved by using the scribe knife 4, where the scribe line is a scribe line with a relatively short length, and simultaneously, the scribe line may be photographed in real time by using the CCD camera 5, and a scribe pattern of the scribe line may be displayed by a display, as shown in fig. 7 and 8, and the shape of the scribe may be clearly observed after the scribe pattern is enlarged.
In step S3, the pitch angle and the rotation angle of the scribe blade 4 may be adjusted by observing the shape of the scribe in the scribe graph, so that the tip of the scribe blade 4 contacts the product 7 to be cleaved at the optimal scribing angle, more clearly, as shown in fig. 7, when the shape of the scribe line is skewed and asymmetric, and the thickness of the scribe line is different, it is indicated that the tip of the scribe blade 4 and the product 7 to be cleaved do not keep a state perpendicular to each other, such as the test line is thicker and more chips are broken, it is indicated that the plane of the blade surface of the scribe blade 4 contacts the product or the angle is too large, and the blade does not contact the product, at this time, the thickness of the scribe blade and the amount of the broken slag may be adjusted by adjusting the pitch angle of the scribe blade 4; if the shadow areas on the two sides of the test line are asymmetric or the scratches of the test line are displayed in a shallower or shallower manner, the two sides of the scratch line can be symmetric and have consistent depths by adjusting the rotation angle of the scribing cutter 4.
The contact angle between the scribing cutter 4 and the product 7 to be cleaved is adjusted by adjusting the pitch angle and the rotation angle of the scribing cutter 4, after each adjustment, a test line can be scribed on the product 7 to be cleaved, the pitch angle and the rotation angle of the scribing cutter 4 are continuously adjusted according to the newly scribed test line, and then the scribing step and the adjustment step are repeated until a test line with a straight scribing line and consistent thickness of the scribing line is scribed on the product 7 to be cleaved, as shown in fig. 8, and at this time, the contact angle between the cutter point of the surface scribing cutter 4 and the product 7 to be cleaved can be the optimal angle.
In step S4, a dicing blade 4 may be used to scribe a dicing line on the upper surface of the product to be diced 7, the dicing line extending along the length direction of the product to be diced 7, and the dicing line being straight in scratches and uniform in size of scratches.
Before step S5, the first platform 1 and the second platform 2 may be moved by a predetermined distance in a direction away from each other, so that a gap is formed between the first platform 1 and the second platform 2, and the cleavage line may be disposed opposite to the gap, but to ensure that the first platform 1 and the second platform 2 are respectively contacted with opposite sides of the expanded metal ring 9, that is, the expanded metal ring 9 is still placed on the first platform 1 and the second platform 2, a negative pressure generator may generate a negative pressure to adsorb the expanded metal ring 9 in the plurality of micro holes 8, so that the expanded metal ring 9 is firmly fixed on the first platform 1 and the second platform 2, that is, the cleavage blue film 10 may be stretched, so that the product 7 to be cleaved is also in a stretched state, and the product 7 to be cleaved may be conveniently and subsequently cleaved by using the thimble 6.
In step S5, the ejector pins 6 may be raised up to the cleavage height, so that the ejector pins 6 may be raised from between the first platform 1 and the second platform 2 to abut against the lower surface of the product 7 to be cleaved, and the ejector pins 6 may be disposed opposite to the cleavage line.
The step S5 may be preceded by a step of measuring the stress to which the surface of the product 7 to be cleaved is subjected by the stress measuring module, specifically, using a laser generator to generate laser, irradiating the surface of the product 7 to be cleaved by a semi-transparent mirror, and irradiating the reflected light onto an optical sensor at the semi-transparent mirror position, where the optical sensor is a four-quadrant silicon photocell, capable of directly converting light energy into electric energy, and further displaying the measured stress result on a display, where the stress result may display the degree of warpage of the surface of the product 7 to be cleaved, and where the thimble 6 may be raised or lowered according to the stress result to adapt the degree of warpage of the surface of the product 7 to be cleaved, thereby better cleaving the product 7 to be cleaved.
In step S6, the ejector pins 6 may be driven to move along the cleavage line, so that the product 7 to be cleaved may be cleaved naturally along the cleavage line, and therefore, after the cleavage line is scribed, the product 7 to be cleaved may be directly broken by the bottom ejector pins 6, thereby reducing the possibility of cracking and dirt introduced by the broken pieces to the maximum extent, and effectively controlling the degree of deviation of the cleavage plane from the crystalline phase in the breaking process.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (10)
1. The cleavage device is characterized by comprising a first platform (1), a second platform (2), an angle adjusting mechanism (3), a scribing cutter (4), a CCD camera (5) and a thimble (6);
the first platform (1) and the second platform (2) are oppositely arranged, the first platform (1) and the second platform (2) can move towards a direction approaching to or away from each other, and the first platform (1) and the second platform (2) are used for fixing a product (7) to be cleaved;
the scribing cutter (4) is movably arranged above the product (7) to be cleaved, and the scribing cutter (4) is used for scribing a test line or a cleavage line on the upper surface of the product (7) to be cleaved;
the CCD camera (5) is arranged towards the product (7) to be cleaved, and the CCD camera (5) is used for shooting the test line and displaying a scratch graph of the test line;
the angle adjusting mechanism (3) is in driving connection with the scribing cutter (4), and the angle adjusting mechanism (3) is used for adjusting the pitching angle and the autorotation angle of the scribing cutter (4) according to the scratch graph, so that the cutter point of the scribing cutter (4) is contacted with the product (7) to be cleaved at the optimal scribing angle, and the cleavage line is scribed on the product (7) to be cleaved;
The thimble (6) is movably arranged below the product (7) to be cleaved, and the thimble (6) is used for being lifted to be propped against the lower surface of the product (7) to be cleaved and moving along the cleavage line so that the product (7) to be cleaved is naturally cleaved along the cleavage line.
2. The cleaving apparatus of claim 1, wherein: the device further comprises a negative pressure generator, wherein a plurality of micropores (8) are respectively arranged on the first platform (1) and the second platform (2), and the negative pressure generator is respectively communicated with a plurality of micropores (8) so as to generate negative pressure in the micropores (8).
3. The cleaving apparatus of claim 2, wherein: still include expanded brilliant iron ring (9) and cleavage blue membrane (10), expanded brilliant iron ring (9) place in first platform (1) with on second platform (2), cleavage blue membrane (10) stretch film is attached on expanded brilliant iron ring (9), wait to cleave product (7) to attach on cleavage blue membrane (10), negative pressure generator is used for producing the negative pressure absorption in micropore (8) cleavage blue membrane (10).
4. The cleaving apparatus of claim 1, wherein: the angle adjusting mechanism (3) comprises a mounting frame (31), a first rotating shaft (32), a supporting frame (33), a rotation angle adjusting part (34) and a pitching angle adjusting part (35), wherein the mounting frame (31) is fixedly arranged, one end of the supporting frame (33) is rotatably mounted on the mounting frame (31) through the first rotating shaft (32), the pitching angle adjusting part (35) is in driving connection with the supporting frame (33), the rotation angle adjusting part (34) is mounted on the supporting frame (33), the rotation angle adjusting part (34) is in driving connection with the cutter (4), the pitching angle adjusting part (35) is used for driving the supporting frame (33) to rotate around the axis of the first rotating shaft (32) so as to drive the cutter (4) to rotate around the axis of the first rotating shaft (32), and the rotation angle adjusting part (34) is used for driving the cutter (4) to rotate around the direction perpendicular to the first rotating shaft (32).
5. The cleaving apparatus of claim 4, wherein: the rotation angle adjusting part (34) comprises a first rotating shaft (341), a second rotating shaft (342), a first bevel gear (343), a second bevel gear (344) and a first bevel gear (343), the supporting frame (33) comprises a first supporting rod (331) and a second supporting rod (332), the first supporting rod (331) and the second supporting rod (332) are arranged in an intersecting mode, the first rotating shaft (341) is rotatably mounted on the first supporting rod (331), the first rotating shaft (341) and the first rotating shaft (32) are arranged in parallel, the opposite ends of the first rotating shaft (341) are respectively provided with the first hand wheel (345) and the first bevel gear (343), the second rotating shaft (342) is rotatably mounted on the second supporting rod (332), the second rotating shaft (342) and the first rotating shaft (32) are vertically arranged, one end of the second rotating shaft (342) is provided with the second bevel gear (344), the first bevel gear (341) and the second bevel gear (344) are rotatably mounted on the opposite ends of the first rotating shaft (341) and the second rotating shaft (342) are rotatably meshed with the first bevel gear (343) around the first rotating shaft (4), the first bevel gear (343) drives the second bevel gear (344) to rotate around the axis of the second rotating shaft (342) so as to drive the scribing cutter (4) to rotate around the axis of the second rotating shaft (342).
6. The cleaving apparatus of claim 4, wherein: the pitch angle adjusting part (35) comprises a second hand wheel (351), a first gear (352), a second gear (353), a first connecting rod (354) and a second connecting rod (355), wherein the first connecting rod (354) is rotatably mounted on the mounting frame (31), the first connecting rod (354) is parallel to the first rotating shaft (32), the second hand wheel (351) and the first gear (352) are respectively arranged at two opposite ends of the first connecting rod (354), one end of the second connecting rod (355) is connected with the supporting frame (33), the second gear (353) is meshed with the first gear (352), the second connecting rod (355) is parallel to the first connecting rod (354), the second hand wheel (351) is rotated to drive the first connecting rod (354) and the first gear (352) to rotate around the axis of the first connecting rod (354), and the second gear (353) is driven to rotate around the axis of the first connecting rod (354) and the first gear (352) to rotate around the axis of the first connecting rod (32).
7. The cleaving apparatus of claim 1, wherein: still include frame (11), first platform (1) and second platform (2) set up in frame (11), just be equipped with piece absorption mouth (12) on frame (11), piece absorption mouth (12) orientation wait to cleave product (7) setting for adsorb the piece that the marking off in-process produced.
8. A cleavage method, characterized by applying the cleavage apparatus as claimed in any one of claims 1 to 7, comprising the steps of:
s1, fixedly placing a product (7) to be cleaved on a first platform (1) and a second platform (2);
s2, scribing a test line on the upper surface of the product (7) to be cleaved by using a scribing cutter (4), shooting the test line in real time by using a CCD camera (5), and displaying a scratch graph of the test line through a display;
s3, adjusting the pitching angle and the autorotation angle of the scribing cutter (4) according to the scratch graph, so that the cutter point of the scribing cutter (4) is contacted with the product (7) to be cleaved at an optimal scribing angle;
s4, scribing a cleavage line on the upper surface of the product (7) to be cleaved by using the scribing cutter (4);
s5, lifting the thimble (6) from between the first platform (1) and the second platform (2) to be abutted against the lower surface of the product (7) to be cleaved, wherein the thimble (6) and the cleavage line are oppositely arranged;
S6, driving the ejector pin (6) to move along the cleavage line so as to enable the product (7) to be cleaved to be naturally cleaved along the cleavage line.
9. The cleaving method according to claim 8, wherein the fixedly placing of the product (7) to be cleaved on the first platform (1) and the second platform (2) comprises: placing a crystal-expanded iron ring (9) on the first platform (1) and the second platform (2), stretching a cleavage blue film (10) on the crystal-expanded iron ring (9), attaching a product (7) to be cleaved on the cleavage blue film (10), and generating negative pressure in micropores (8) on the first platform (1) and the second platform (2) by using a negative pressure generator so as to adsorb and fix the cleavage blue film (10).
10. The cleaving method according to claim 9, characterized in that before said raising the pins (6) from below the platform to abut against the lower surface of the product (7) to be cleaved, it further comprises: and moving the first platform (1) and the second platform (2) to a preset distance in a direction away from each other, and generating negative pressure in the micropores (8) of the first platform (1) and the second platform (2) by using the negative pressure generator so as to adsorb and fix the expanded-crystal iron ring (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311809675.6A CN117799075A (en) | 2023-12-26 | 2023-12-26 | Cleavage device and cleavage method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311809675.6A CN117799075A (en) | 2023-12-26 | 2023-12-26 | Cleavage device and cleavage method |
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| CN117799075A true CN117799075A (en) | 2024-04-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118487101A (en) * | 2024-05-27 | 2024-08-13 | 武汉锐晶激光芯片技术有限公司 | Wafer splitting device and wafer splitting method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118487101A (en) * | 2024-05-27 | 2024-08-13 | 武汉锐晶激光芯片技术有限公司 | Wafer splitting device and wafer splitting method |
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