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CN117658641B - Method for preparing high-density SiC ceramic based on selective laser 3D printing and two-step sintering - Google Patents

Method for preparing high-density SiC ceramic based on selective laser 3D printing and two-step sintering Download PDF

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CN117658641B
CN117658641B CN202311580946.5A CN202311580946A CN117658641B CN 117658641 B CN117658641 B CN 117658641B CN 202311580946 A CN202311580946 A CN 202311580946A CN 117658641 B CN117658641 B CN 117658641B
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殷杰
王康龙
刘学建
黄政仁
刘雷敏
姚秀敏
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Shanghai Institute of Ceramics of CAS
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Abstract

The invention belongs to the technical field of additive manufacturing, and relates to a method for preparing high-density SiC ceramic based on selective laser 3D printing and two-step sintering. The method comprises the following steps: s1, weighing raw materials: weighing raw materials comprising silicon carbide, a carbon source and a binder according to the following proportion, wherein the content of silicon carbide powder is 35-65 vol%, the content of the carbon source is 30-60 vol% and the content of the binder is 5-25 vol% based on 100vol% of the total volume fraction of the silicon carbide, the carbon source and the binder; s2, forming: the mixture fully mixed by the raw materials is 3D printed into a biscuit by selective laser; s3, glue discharging: performing glue discharging on the biscuit to obtain a preform; s4, under-silicon reaction sintering: carrying out under-silicon reaction sintering on the buried silicon of the preform, wherein the mass of silicon used for the buried silicon is 40% -95% of the mass of silicon required by complete reaction between the silicon and carbon of the preform during theoretical calculation, so as to obtain a first sintered body; s5, solid phase sintering under normal pressure: and carrying out normal-pressure solid-phase sintering on the first sintered body to obtain the high-density SiC ceramic.

Description

一种基于选区激光3D打印和两步烧结制备高致密SiC陶瓷的 方法A method for preparing high-density SiC ceramics based on selective laser 3D printing and two-step sintering

技术领域Technical Field

本发明属于增材制造技术领域,具体涉及一种基于选区激光3D打印和两步烧结制备高致密SiC陶瓷的方法。The present invention belongs to the technical field of additive manufacturing, and specifically relates to a method for preparing high-density SiC ceramics based on selective laser 3D printing and two-step sintering.

背景技术Background Art

SiC陶瓷因具有低密度、高强度、耐高温、耐辐照、化学稳定性高、耐腐蚀等优异性能,被认为是可在极端环境下应用的理想候选材料,在航空航天、装甲、空间反射镜、核能、化工、半导体等国防与工业重大领域中得到广泛应用。然而,现在国防与工业应用等场合经常要求使用复杂形状的SiC陶瓷,但SiC陶瓷的强共价键特征给SiC陶瓷产品的成型制造带来了极大难题与挑战。SiC ceramics are considered to be ideal candidate materials for use in extreme environments due to their excellent properties such as low density, high strength, high temperature resistance, radiation resistance, high chemical stability, and corrosion resistance. They are widely used in major defense and industrial fields such as aerospace, armor, space reflectors, nuclear energy, chemicals, and semiconductors. However, now defense and industrial applications often require the use of complex-shaped SiC ceramics, but the strong covalent bond characteristics of SiC ceramics have brought great difficulties and challenges to the molding and manufacturing of SiC ceramic products.

对于复杂结构陶瓷构件,传统机械加工方法的加工周期长、成本高,且最终零部件的表面质量及尺寸精度难以得到保证。凝胶注模成型或直接凝固注模成型等陶瓷近净成型工艺虽然可以简化或省去二次机械加工,但其对模具的依赖程度较高且在制造大尺寸整体零部件时往往存在气孔、翘曲及裂纹等问题。3D打印又称增材制造,是一种累积制造技术,先通过计算机建模软件建造所需三维模型,再将建成的三维模型“分区”成逐层的截面(即切片),从而指导打印机逐层打印。3D打印的出现有效解决了这些问题,其在异形构件的制备方面存在着天然优势。For ceramic components with complex structures, traditional machining methods have long processing cycles and high costs, and the surface quality and dimensional accuracy of the final parts are difficult to guarantee. Although ceramic near-net-shape forming processes such as gel casting or direct solidification injection molding can simplify or eliminate secondary machining, they are highly dependent on molds and often have problems such as pores, warping and cracks when manufacturing large-sized integral parts. 3D printing, also known as additive manufacturing, is a cumulative manufacturing technology that first builds the required three-dimensional model through computer modeling software, and then "partitions" the built three-dimensional model into layer-by-layer cross-sections (i.e. slices) to guide the printer to print layer by layer. The emergence of 3D printing effectively solves these problems, and it has a natural advantage in the preparation of special-shaped components.

选区激光打印(SLS)是一种粉末床快速制造工艺,工作原理为:首先进行粉末床的预热,这可以减少热应力从而有助于防止烧结构件裂纹的形成。预热完成后,辊轮或刮刀在粉末床上铺粉,经过高能激光束(如CO2激光)选择性烧结粉末,首层制造完成。随后供粉缸和成型缸各自上升下降一层配合铺粉、成型。如此重复建造直至所需三维构件制造完成。SLS具有可以制备大尺寸复杂形状构件、无需支撑、材料利用率高、加工效率高等优势,能快速成型复杂结构零部件实现近净形制造。目前,SLS应用于陶瓷材料零件制备主要有直接、间接成型两种方式。直接SLS成型是以高能量密度的激光照射粉体实现成型和烧结-体化。直接SLS成型制造的陶瓷部件极易产生裂纹,这导致最终产品的机械性能不佳。间接SLS成型是激光照射在聚合物粉末粘结陶瓷粉体上实现复杂陶瓷部件的成型,后经热处理方式烧结成陶瓷成品。间接SLS方法可以作为一种合适的方式,通过烧结成分中的低熔点聚合物粘结剂,然后以缓慢的加热速度去除粘结剂,随后进行炉内烧结,以提高最终密度,避免产品出现裂纹,从而形成无裂纹样品。Selective laser printing (SLS) is a powder bed rapid manufacturing process. The working principle is as follows: first, the powder bed is preheated, which can reduce thermal stress and help prevent the formation of cracks in sintered components. After preheating, a roller or scraper spreads powder on the powder bed, and the powder is selectively sintered by a high-energy laser beam (such as a CO2 laser), and the first layer is manufactured. Then the powder supply cylinder and the forming cylinder each rise and fall one layer to cooperate with powder spreading and forming. This construction is repeated until the required three-dimensional component is manufactured. SLS has the advantages of being able to prepare large-sized and complex-shaped components, no support required, high material utilization, and high processing efficiency. It can quickly form complex structural parts to achieve near-net shape manufacturing. At present, SLS is mainly used in the preparation of ceramic material parts in two ways: direct and indirect molding. Direct SLS molding is to irradiate powder with high-energy density laser to achieve molding and sintering-bodying. Ceramic parts manufactured by direct SLS molding are very prone to cracks, which leads to poor mechanical properties of the final product. Indirect SLS molding is to irradiate the polymer powder bonded ceramic powder with a laser to achieve the molding of complex ceramic parts, and then sinter them into ceramic products by heat treatment. The indirect SLS method can be used as a suitable way to form crack-free samples by sintering the low melting point polymer binder in the composition and then removing the binder with a slow heating rate followed by furnace sintering to increase the final density and avoid cracks in the product.

目前,间接选区激光3D打印制造出的陶瓷样品密度低、孔隙多、力学性能低,远远达不到服役所需的性能,必须通过后续热处理来改善性能。现在主要的烧结致密化方法为反应烧结法(LSI)、化学气相法(CVI)和前驱体浸渍热解法(PIP)。然而,间接选区激光打印结合LSI的工艺存在碳化硅基体中游离硅含量多(>10vol%)的问题,而游离硅的存在容易导致碳化硅陶瓷制品的低抗弯强度(≤100MPa)、高脆性(断裂韧性≤1MPa·m1/2),且当服役温度超过1400℃时,烧结体的强度随着游离硅的熔化迅速下降,游离硅的存在也使得基体的耐酸碱腐蚀性能变差;CVI和PIP法都存在工艺重复周期长且易产生封闭内孔等问题。At present, the ceramic samples manufactured by indirect selective laser 3D printing have low density, many pores and low mechanical properties, which are far from the performance required for service. Subsequent heat treatment is necessary to improve the performance. The main sintering densification methods are reactive sintering (LSI), chemical vapor phase method (CVI) and precursor impregnation pyrolysis (PIP). However, the process of indirect selective laser printing combined with LSI has the problem of high free silicon content (>10vol%) in the silicon carbide matrix, and the presence of free silicon easily leads to low bending strength (≤100MPa) and high brittleness (fracture toughness ≤1MPa·m1/2) of silicon carbide ceramic products. When the service temperature exceeds 1400℃, the strength of the sintered body decreases rapidly with the melting of free silicon. The presence of free silicon also makes the acid and alkali corrosion resistance of the matrix worse. Both CVI and PIP methods have problems such as long process repetition cycle and easy to produce closed inner pores.

发明内容Summary of the invention

针对现有技术的上述问题,本发明提供一种基于选区激光3D打印结合“欠硅”反应烧结和常压固相烧结的两步烧结工艺制备高致密SiC陶瓷的方法。与反应烧结致密化方法相比,本发明所述方法得到的高致密SiC陶瓷成品中无游离硅残留,有利于提升SiC陶瓷制品的高温力学性能和耐酸碱腐蚀性能。本发明通过以下技术方案实现上述目的:In view of the above problems in the prior art, the present invention provides a method for preparing high-density SiC ceramics based on a two-step sintering process of selective laser 3D printing combined with "under-siliconized" reaction sintering and atmospheric solid phase sintering. Compared with the reaction sintering densification method, the high-density SiC ceramics obtained by the method of the present invention have no free silicon residue in the finished product, which is beneficial to improving the high-temperature mechanical properties and acid and alkali corrosion resistance of SiC ceramic products. The present invention achieves the above purpose through the following technical solutions:

本发明提供一种基于选区激光3D打印和两步烧结制备高致密SiC陶瓷的方法。所述方法包括以下步骤:The present invention provides a method for preparing high-density SiC ceramics based on selective laser 3D printing and two-step sintering. The method comprises the following steps:

S1称量原料:按照以下比例称量包括碳化硅、碳源和粘结剂的原料,其中,以碳化硅、碳源和粘结剂的总体积分数为100vol%计,碳化硅粉体的含量为35~65vol%,碳源的含量为30~60vol%,粘结剂的含量为5~25vol%;S1 weighing raw materials: weighing raw materials including silicon carbide, carbon source and binder according to the following proportions, wherein, based on the total volume fraction of silicon carbide, carbon source and binder as 100 vol%, the content of silicon carbide powder is 35-65 vol%, the content of carbon source is 30-60 vol%, and the content of binder is 5-25 vol%;

S2成型:将上述原料充分混合的混合料通过选区激光3D打印成素坯;S2 molding: the mixture of the above raw materials is fully mixed into a blank by selective laser 3D printing;

S3排胶:对素坯进行排胶得到预制体;S3 debinding: debinding the green blank to obtain a preform;

S4欠硅反应烧结:将预制体埋硅进行欠硅反应烧结,埋硅所使用的硅质量为理论计算时该硅和预制体的碳完全反应需要的硅质量的40%~95%,得到第一烧结体;S4: silicon-deficient reaction sintering: the preform is buried with silicon for silicon-deficient reaction sintering, the mass of silicon used for the buried silicon is 40% to 95% of the mass of silicon required for complete reaction between the silicon and the carbon of the preform in theoretical calculation, to obtain a first sintered body;

S5常压固相烧结:将第一烧结体常压固相烧结得到高致密SiC陶瓷。S5 normal pressure solid phase sintering: the first sintered body is subjected to normal pressure solid phase sintering to obtain a high-density SiC ceramic.

较佳地,步骤S4中,欠硅反应烧结的参数为:烧结气氛为真空,烧结温度为1500~1800℃,烧结时间为0.5~3小时。Preferably, in step S4, the parameters of the silicon-deficient reaction sintering are: the sintering atmosphere is vacuum, the sintering temperature is 1500-1800° C., and the sintering time is 0.5-3 hours.

较佳地,步骤S5中,常压固相烧结的参数为:烧结气氛为惰性气氛,(最高)烧结温度为2000~2300℃,(最高)烧结温度的保温时间为0.5~2h。Preferably, in step S5, the parameters of the atmospheric pressure solid phase sintering are: the sintering atmosphere is an inert atmosphere, the (maximum) sintering temperature is 2000-2300° C., and the holding time of the (maximum) sintering temperature is 0.5-2 h.

较佳地,所述碳源为碳黑、碳微球或石墨;所述粘结剂为聚合物,优选为热塑性树脂和/或热固性树脂;更优选地,所述粘结剂为酚醛树脂。Preferably, the carbon source is carbon black, carbon microspheres or graphite; the binder is a polymer, preferably a thermoplastic resin and/or a thermosetting resin; more preferably, the binder is a phenolic resin.

较佳地,所述原料除了碳化硅、碳源和粘结剂以外,还包括碳化硼,其中,碳化硼的用量为碳化硅的0.5~8wt%。Preferably, the raw materials include boron carbide in addition to silicon carbide, a carbon source and a binder, wherein the amount of boron carbide is 0.5-8wt% of the silicon carbide.

较佳地,步骤S3中,排胶温度为800~1000℃,排胶时间为0.5~1小时。Preferably, in step S3, the debinding temperature is 800-1000° C., and the debinding time is 0.5-1 hour.

较佳地,所述方法还包括:欠硅反应烧结前,将排胶后的预制体在前驱体溶液中进行真空浸渍或加压浸渍,随后进行高温热解;优选地,所述前驱体浸渍液为质量分数30~70%的酚醛树脂有机溶液。Preferably, the method further comprises: before the under-silicon reaction sintering, vacuum impregnating or pressure impregnating the debinded preform in a precursor solution, followed by high-temperature pyrolysis; preferably, the precursor impregnation solution is an organic solution of phenolic resin with a mass fraction of 30 to 70%.

较佳地,所述高致密SiC陶瓷的主要物相为2H-C和6H-SiC。Preferably, the main phases of the high-density SiC ceramic are 2H-C and 6H-SiC.

较佳地,所述高致密SiC陶瓷的开气孔隙率为1%~2%,密度为3.0~3.1g/cm3Preferably, the high-density SiC ceramic has an open porosity of 1% to 2% and a density of 3.0 to 3.1 g/cm 3 .

较佳地,所述高致密SiC陶瓷的抗弯强度为280MPa以上,弹性模量为300GPa以上。Preferably, the high-density SiC ceramic has a flexural strength of 280 MPa or more and an elastic modulus of 300 GPa or more.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

图1为实施例1“欠硅”反应烧结和常压固相烧结制备的SiC陶瓷XRD图;FIG1 is an XRD pattern of SiC ceramics prepared by “silicon-deficient” reaction sintering and pressureless solid phase sintering in Example 1;

图2为实施例1“欠硅”反应烧结和常压固相烧结制备的SiC陶瓷SEM图;FIG2 is a SEM image of SiC ceramics prepared by “silicon-deficient” reaction sintering and pressureless solid phase sintering in Example 1;

图3为对比例1过硅反应烧结的第一烧结体背散射SEM图(a)以及过硅反应烧结和常压固相烧结制备的SiC陶瓷二次电子SEM图(b);FIG3 is a backscattered SEM image (a) of the first sintered body of Comparative Example 1 through silicon reaction sintering and a secondary electron SEM image (b) of SiC ceramics prepared through silicon reaction sintering and atmospheric pressure solid phase sintering;

图4为对比例2仅常压固相烧结制备的SiC陶瓷二次电子SEM图;FIG4 is a secondary electron SEM image of SiC ceramics prepared by solid phase sintering at normal pressure only in Comparative Example 2;

图5为对比例3制备的SiC陶瓷XRD图;FIG5 is an XRD pattern of SiC ceramics prepared in Comparative Example 3;

图6为对比例3制备的SiC陶瓷背散射SEM图(a)和二次电子SEM图(b)。FIG6 is a backscattered SEM image (a) and a secondary electron SEM image (b) of the SiC ceramic prepared in Comparative Example 3.

具体实施方式DETAILED DESCRIPTION

通过下述实施方式进一步说明本发明,应理解,下述实施方式仅用于说明本发明,而非限制本发明。在没有特殊说明的情况下,各百分含量指质量百分含量。以下示例性说明本发明所述基于选区激光3D打印和两步烧结制备高致密SiC陶瓷的方法。The present invention is further described by the following embodiments. It should be understood that the following embodiments are only used to illustrate the present invention, but not to limit the present invention. Unless otherwise specified, each percentage refers to the percentage by mass. The following is an exemplary description of the method for preparing high-density SiC ceramics based on selective laser 3D printing and two-step sintering according to the present invention.

称量原料。按照以下比例称量包括碳化硅、碳源和粘结剂的原料,其中,以碳化硅、碳源和粘结剂的总体积分数为100vol%计,碳化硅粉体的含量为35~65vol%,碳源的含量为30~60vol%,粘结剂的含量为5~25vol%。Weigh the raw materials. Weigh the raw materials including silicon carbide, carbon source and binder according to the following proportions, wherein, based on the total volume fraction of silicon carbide, carbon source and binder as 100 vol%, the content of silicon carbide powder is 35-65 vol%, the content of carbon source is 30-60 vol%, and the content of binder is 5-25 vol%.

碳化硅粉体的平均粒径可为0.5~100μm。The average particle size of the silicon carbide powder may be 0.5 to 100 μm.

碳源包括但不限于炭黑、碳微球(MCMB)或石墨等其他碳源。碳源粉体的粒径可为5~50μm。The carbon source includes but is not limited to carbon black, carbon microbeads (MCMB) or other carbon sources such as graphite. The particle size of the carbon source powder can be 5 to 50 μm.

粘结剂可为聚合物。例如,如热塑性树脂和/或热固性树脂。具体可采用酚醛树脂作为粘结剂。The binder may be a polymer, such as a thermoplastic resin and/or a thermosetting resin. Specifically, a phenolic resin may be used as the binder.

在一些技术方案中,所述原料除了碳化硅、碳源和粘结剂以外,还包括碳化硼。碳化硼能够在常压固相烧结过程中提高烧结驱动力。例如,碳化硼的用量可为碳化硅的0.5~8wt%。In some technical solutions, the raw materials include boron carbide in addition to silicon carbide, carbon source and binder. Boron carbide can increase the sintering driving force during the pressureless solid phase sintering process. For example, the amount of boron carbide can be 0.5-8wt% of silicon carbide.

混料。将上述原料混合均匀得到混合料。可通过球磨进行混料。球磨为本领域的常规操作,本领域技术人员可以根据需要对相应参数进行调整。球磨时间和球磨转速可以根据需要进行变化。例如,球磨转速为50~100转/分钟,球磨时间控制在1~4小时。球磨过程中,物料和球磨介质(研磨球)的质量比可根据需要进行变化。例如,物料和球磨介质的质量比可为1:1.5。可在球磨罐中进行球磨。例如,采用SiC介质的研磨球。Mixing. The above raw materials are mixed evenly to obtain a mixture. Mixing can be performed by ball milling. Ball milling is a routine operation in the art, and those skilled in the art can adjust the corresponding parameters as needed. The ball milling time and the ball milling speed can be changed as needed. For example, the ball milling speed is 50 to 100 rpm, and the ball milling time is controlled at 1 to 4 hours. During the ball milling process, the mass ratio of the material and the ball milling medium (grinding balls) can be changed as needed. For example, the mass ratio of the material and the ball milling medium can be 1:1.5. Ball milling can be performed in a ball milling jar. For example, grinding balls with SiC media are used.

在球磨过程中,将上述原料和研磨球加入球磨罐中,然后进行球磨。优选分批次加入酚醛树脂。这有利于激光打印时固态酚醛树脂更好地粘结原料粉体和避免团聚,使得素坯强度较高。可分两次加入酚醛树脂粉体。During the ball milling process, the above raw materials and grinding balls are added to a ball milling jar and then ball milled. Phenolic resin is preferably added in batches. This is conducive to better bonding of the solid phenolic resin to the raw material powder and avoiding agglomeration during laser printing, so that the green blank has higher strength. The phenolic resin powder can be added in two times.

作为示例,将碳化硅、碳源、碳化硼、约40~60wt%的酚醛树脂与研磨球加入球磨罐中,球磨2.5小时后,加入剩余的酚醛树脂,继续进行球磨,直至所有物料混合均匀。As an example, silicon carbide, a carbon source, boron carbide, about 40-60 wt% of phenolic resin and grinding balls are added to a ball mill. After ball milling for 2.5 hours, the remaining phenolic resin is added and the ball milling is continued until all the materials are evenly mixed.

过筛。可将混合料过50~70目筛。过筛能够避免球磨过程中颗粒团聚产生的团聚体影响激光打印质量。Sieve. The mixed material can be sieved through a 50-70 mesh sieve. Sieve can prevent the agglomerates produced by the agglomeration of particles during the ball milling process from affecting the laser printing quality.

成型。使用激光打印成型所需模型(形状)的素坯。激光打印成型为本领域的常规操作,本领域技术人员可以根据需要对相应参数进行调整。例如对碳化硅部件进行三维建模,将设计文件保持为STL格式,并将STL格式文件展示的图形样件激光打印成为高精度实物样件。可使用CO2激光器进行激光打印。一些实施方式中,将复相粉体铺设成一定厚度并预热,随后层层铺排粉体进行激光打印。铺粉厚度可为0.05~0.3mm。预热温度可为60~110℃。激光功率可为15~120W。Molding. Use laser printing to form a blank of the required model (shape). Laser printing is a routine operation in this field, and those skilled in the art can adjust the corresponding parameters as needed. For example, for three-dimensional modeling of silicon carbide parts, the design file is kept in STL format, and the graphic samples displayed in the STL format file are laser printed into high-precision physical samples. A CO2 laser can be used for laser printing. In some embodiments, the complex phase powder is laid to a certain thickness and preheated, and then the powder is laid layer by layer for laser printing. The powder laying thickness can be 0.05 to 0.3 mm. The preheating temperature can be 60 to 110°C. The laser power can be 15 to 120W.

排胶。排胶温度可为800~1000℃,排胶时间可为0.5~1小时。例如,将素坯以2~3℃/min的升温速率升温至200~300℃,继续以1~2℃/min的升温速率升温至600~700℃,然后以1~3℃/min升温至800~1000℃并在800~1000℃保温0.5~1h。Debinding. The debinding temperature can be 800-1000°C, and the debinding time can be 0.5-1 hour. For example, the green blank is heated to 200-300°C at a heating rate of 2-3°C/min, and then heated to 600-700°C at a heating rate of 1-2°C/min, and then heated to 800-1000°C at a heating rate of 1-3°C/min and kept at 800-1000°C for 0.5-1h.

欠硅反应烧结。将排胶得到的预制体埋硅进行欠硅反应烧结。上述反应烧结过程中,埋硅所使用的硅质量为理论计算时该硅和预制体的碳完全反应需要的硅质量的40%~95%。通常认为理论计算时1mol的碳需要1mol的硅反应生成SiC。如果埋硅所使用的硅质量低于理论计算时该硅和预制体的碳完全反应需要的硅质量的40%,会导致烧结体孔隙偏多,即使后续再进行常压固相烧结也难以致密化。如果埋硅所使用的硅质量高于理论计算时该硅和预制体的碳完全反应需要的硅质量的95%,会导致反应烧结后的第一烧结体中存在游离硅,而该游离硅会继续残留在常压固相烧结后的碳化硅陶瓷成品中。本发明采用“欠硅”反应烧结,可以保证烧结体的致密度在极大提高的同时无游离硅存在,这助于后续的常压固相烧结实现进一步致密化。发明人曾使用过硅反应烧结,发现过硅反应烧结的烧结体游离硅含量多,在常压固相烧结工艺中形成硅蒸汽进而挥发,导致碳化硅陶瓷成品的孔隙率增加,无法烧结致密化。Under-silicon reaction sintering. The preform obtained by debinding is buried in silicon for under-silicon reaction sintering. In the above reaction sintering process, the mass of silicon used for burying silicon is 40% to 95% of the mass of silicon required for the complete reaction of the silicon and the carbon of the preform in theoretical calculation. It is generally believed that 1 mol of carbon requires 1 mol of silicon to react to generate SiC in theoretical calculation. If the mass of silicon used for burying silicon is lower than 40% of the mass of silicon required for the complete reaction of the silicon and the carbon of the preform in theoretical calculation, it will cause the sintered body to have too many pores, and it will be difficult to densify even if normal pressure solid phase sintering is performed later. If the mass of silicon used for burying silicon is higher than 95% of the mass of silicon required for the complete reaction of the silicon and the carbon of the preform in theoretical calculation, free silicon will exist in the first sintered body after reaction sintering, and the free silicon will continue to remain in the finished silicon carbide ceramic after normal pressure solid phase sintering. The present invention adopts "under-silicon" reaction sintering, which can ensure that the density of the sintered body is greatly improved while no free silicon exists, which helps the subsequent normal pressure solid phase sintering to achieve further densification. The inventors have used silicon reaction sintering and found that the sintered body produced by silicon reaction sintering has a high content of free silicon, which forms silicon vapor and then evaporates during the atmospheric pressure solid phase sintering process, resulting in an increase in the porosity of the silicon carbide ceramic product and an inability to sinter to densify.

欠硅反应烧结的烧结气氛为真空,烧结温度为1500~1800℃,烧结时间为0.5~3小时。例如,真空度为-10至-100Pa。The sintering atmosphere of the silicon-deficient reaction sintering is vacuum, the sintering temperature is 1500-1800° C., and the sintering time is 0.5-3 hours. For example, the vacuum degree is -10 to -100 Pa.

对欠硅反应烧结后的第一烧结体进行常压固相烧结。常压固相烧结的参数为:烧结气氛为惰性气氛(如氩气气氛),(最高)烧结温度为2000~2300℃,(最高)烧结温度的保温时间为0.5~2h。例如,以5~10℃/min的升温速率升温至1200℃,直接继续以3~5℃/min的升温速率升温至1800℃,随后直接以1~3℃/min的升温速率升温至2000~2300℃并在2000~2300℃保温0.5~2h。The first sintered body after the silicon-deficient reaction sintering is subjected to pressureless solid phase sintering. The parameters of pressureless solid phase sintering are: the sintering atmosphere is an inert atmosphere (such as argon atmosphere), the (maximum) sintering temperature is 2000-2300°C, and the (maximum) sintering temperature holding time is 0.5-2h. For example, the temperature is raised to 1200°C at a heating rate of 5-10°C/min, and the temperature is directly raised to 1800°C at a heating rate of 3-5°C/min, and then the temperature is directly raised to 2000-2300°C at a heating rate of 1-3°C/min and kept at 2000-2300°C for 0.5-2h.

欠硅反应烧结后的第一烧结体通常没有完全致密化。第一烧结体的孔隙率大约在5~15%左右。因此,优选对欠硅反应烧结后的第一烧结体进行常压固相烧结以进一步致密化。The first sintered body after the silicon-deficient reaction sintering is usually not completely densified. The porosity of the first sintered body is about 5-15%. Therefore, it is preferred to perform normal pressure solid phase sintering on the first sintered body after the silicon-deficient reaction sintering to further densify it.

作为可选的技术方案,还可以将排胶后的预制体在前驱体溶液中进行真空浸渍或加压浸渍,然后再高温热解。这样有利于进一步提高坯体的密度。所述浸渍和热解为常规步骤。浸渍和热解的工艺条件可由本领域技术人员根据需要进行调整。前驱体溶液可为酚醛树脂溶液或其它前驱体溶液。作为示例,酚醛树脂溶液的溶剂为乙醇,质量分数为30~70%。As an optional technical solution, the preform after debinding can also be vacuum impregnated or pressurized impregnated in a precursor solution, and then pyrolyzed at high temperature. This is conducive to further improving the density of the green body. The impregnation and pyrolysis are conventional steps. The process conditions of impregnation and pyrolysis can be adjusted by those skilled in the art as needed. The precursor solution can be a phenolic resin solution or other precursor solutions. As an example, the solvent of the phenolic resin solution is ethanol, with a mass fraction of 30 to 70%.

本发明所述高致密SiC陶瓷的主要物相为2H-C和6H-SiC。The main phases of the high-density SiC ceramics of the present invention are 2H-C and 6H-SiC.

根据阿基米德排水法测试SiC陶瓷的开气孔率和密度。一些技术方案中,本发明所述SiC陶瓷的开气孔率为1%~2%,密度为3.0~3.1g/cm3The open porosity and density of SiC ceramics were tested according to the Archimedean drainage method. In some technical solutions, the open porosity of the SiC ceramics of the present invention is 1% to 2%, and the density is 3.0 to 3.1 g/cm 3 .

根据标准陶瓷三点弯曲强度测试SiC陶瓷的弯曲强度和弹性模量。一些技术方案中,本发明所述SiC陶瓷的三点抗弯强度为280MPa以上,弹性模量为300GPa以上。The bending strength and elastic modulus of SiC ceramics are tested according to the standard ceramic three-point bending strength test. In some technical solutions, the three-point bending strength of the SiC ceramics of the present invention is above 280 MPa, and the elastic modulus is above 300 GPa.

线收缩率的测试:收缩率=(烧结前的样品长度-烧结后的样品长度)/烧结前样品长度。一些技术方案中,本发明所述SiC陶瓷的收缩率为3%~4%。Test of linear shrinkage: shrinkage = (sample length before sintering - sample length after sintering) / sample length before sintering. In some technical solutions, the shrinkage of the SiC ceramics of the present invention is 3% to 4%.

综上所述,本发明所述基于选区激光3D打印和两步烧结制备SiC陶瓷的方法得到了高致密的SiC陶瓷,不存在第二相或晶界无玻璃相,晶界干净,无游离硅残留,具有优异的力学强度,烧结收缩率低,高温性能良好,耐酸碱腐蚀性能优异。In summary, the method for preparing SiC ceramics based on selective laser 3D printing and two-step sintering described in the present invention obtains highly dense SiC ceramics, without the presence of a second phase or a glass phase at the grain boundaries, with clean grain boundaries and no free silicon residue, excellent mechanical strength, low sintering shrinkage, good high temperature performance, and excellent acid and alkali corrosion resistance.

下面进一步列举实施例以详细说明本发明。同样应理解,以下实施例只用于对本发明进行进一步说明,不能理解为对本发明保护范围的限制,本领域的技术人员根据本发明的上述内容作出的一些非本质的改进和调整均属于本发明的保护范围。下述示例具体的工艺参数等也仅是合适范围中的一个示例,即本领域技术人员可以通过本文的说明做合适的范围内选择,而并非要限定于下文示例的具体数值。The following examples are further listed to illustrate the present invention in detail. It should also be understood that the following examples are only used to further illustrate the present invention and cannot be understood as limiting the scope of protection of the present invention. Some non-essential improvements and adjustments made by those skilled in the art based on the above content of the present invention belong to the scope of protection of the present invention. The specific process parameters and the like in the following examples are also only examples within a suitable range, that is, those skilled in the art can make a selection within a suitable range through the description herein, and are not limited to the specific values exemplified below.

实施例1Example 1

基于选区激光3D打印和两步烧结制备高致密SiC陶瓷的方法具体包括以下步骤:The method for preparing high-density SiC ceramics based on selective laser 3D printing and two-step sintering specifically includes the following steps:

(1)分别称取1442g碳化硅、1420g碳微球、22g碳化硼和230g酚醛树脂。其中,以碳化硅、碳源和粘结剂的总体积分数为100vol%计,碳化硅的含量为35vol%,碳化硼的含量为50vol%,粘结剂的含量为15vol%。所述碳化硼的用量为碳化硅的1.5wt%。将上述原料球磨均匀得到混合料。具体球磨过程为:将全部的碳化硅、全部的碳微球、全部的碳化硼、40wt%的酚醛树脂、碳化硅磨球(占碳化硅陶瓷的所有原料质量之和的1.5倍)加入球磨罐中,球磨0.5h后,加入剩余的酚醛树脂,继续球磨1.5小时。球磨转速为75转/分钟。(1) Weigh 1442g of silicon carbide, 1420g of carbon microspheres, 22g of boron carbide and 230g of phenolic resin respectively. Wherein, based on the total volume fraction of silicon carbide, carbon source and binder as 100vol%, the content of silicon carbide is 35vol%, the content of boron carbide is 50vol%, and the content of binder is 15vol%. The amount of boron carbide used is 1.5wt% of silicon carbide. The above raw materials are ball-milled to obtain a mixture. The specific ball-milling process is: add all silicon carbide, all carbon microspheres, all boron carbide, 40wt% of phenolic resin, silicon carbide grinding balls (accounting for 1.5 times the sum of the mass of all raw materials of silicon carbide ceramics) into a ball mill, after ball milling for 0.5h, add the remaining phenolic resin, and continue ball milling for 1.5 hours. The ball milling speed is 75 rpm.

(2)将球磨后的混合料过60目筛,使用SLS打印成所需形状的素坯零件。(2) The ball-milled mixture is passed through a 60-mesh sieve and printed into a green blank part of the desired shape using SLS.

(3)将打印好的素坯零件置于石墨坩埚于900℃排胶处理0.5小时得到预制体。(3) The printed green blank parts are placed in a graphite crucible and subjected to a debinding treatment at 900°C for 0.5 hours to obtain a preform.

(4)将排胶后的预制体采用真空烧结炉欠硅反应烧结得到第一烧结体。烧结温度为1550℃,烧结时间为0.5小时,真空度为-16Pa。埋硅所使用的硅质量为理论计算时该硅和预制体的碳完全反应需要的硅质量的80%。(4) The preform after debinding is subjected to silicon-depleted reaction sintering in a vacuum sintering furnace to obtain a first sintered body. The sintering temperature is 1550°C, the sintering time is 0.5 hours, and the vacuum degree is -16 Pa. The mass of silicon used for buried silicon is 80% of the mass of silicon required for complete reaction between the silicon and the carbon of the preform in theoretical calculation.

(5)将第一烧结体置于石墨坩埚中进行常压固相烧结,烧结气氛为氩气,以5℃/min升温速率升温至1200℃,直接继续以3℃/min的升温速率升温至1800℃,随后直接以1℃/min的升温速率升温至2000℃并保温1h。(5) The first sintered body was placed in a graphite crucible for solid-phase sintering at normal pressure in an argon atmosphere. The temperature was raised to 1200°C at a heating rate of 5°C/min, and then directly raised to 1800°C at a heating rate of 3°C/min, and then directly raised to 2000°C at a heating rate of 1°C/min and kept at that temperature for 1 h.

图1为实施例1“欠硅”反应烧结和常压固相烧结制备的SiC陶瓷XRD图。可以看出,样品主要物相为2H-C和6H-SiC相。由于XRD图中无单质硅的衍射峰,因此本发明所述SiC陶瓷成品中没有硅残留。FIG1 is an XRD graph of SiC ceramics prepared by "silicon-deficient" reaction sintering and pressureless solid phase sintering in Example 1. It can be seen that the main phases of the sample are 2H-C and 6H-SiC phases. Since there is no diffraction peak of elemental silicon in the XRD graph, there is no silicon residue in the SiC ceramic product of the present invention.

图2为实施例1“欠硅”反应烧结和常压固相烧结制备的SiC陶瓷SEM图。可以看出,SiC颗粒结合紧密,无明显孔隙,表明本发明所述方法的烧结效果优异,有助于SiC陶瓷的致密化。Figure 2 is a SEM image of SiC ceramics prepared by "silicon-deficient" reaction sintering and pressureless solid phase sintering in Example 1. It can be seen that the SiC particles are tightly combined without obvious pores, indicating that the sintering effect of the method of the present invention is excellent and helps to densify SiC ceramics.

结合图1和图2,本发明所述方法得到的高致密SiC陶瓷成品中无游离硅残留,能够充分促进烧结致密化。1 and 2 , the high-density SiC ceramic product obtained by the method of the present invention has no free silicon residue, which can fully promote sintering densification.

实施例2Example 2

与实施例1基本相同,区别仅在于:步骤(1)中,称取取1648g碳化硅、1279g碳微球、25g碳化硼和230g酚醛树脂。其中,以碳化硅、碳源和粘结剂的总体积分数为100vol%计,碳化硅的含量为40vol%,碳源的含量为45vol%,粘结剂的含量为15vol%。所述碳化硼的用量为碳化硅的1.5wt%。The method is basically the same as Example 1, except that: in step (1), 1648 g of silicon carbide, 1279 g of carbon microspheres, 25 g of boron carbide and 230 g of phenolic resin are weighed. Wherein, based on the total volume fraction of silicon carbide, carbon source and binder being 100 vol%, the content of silicon carbide is 40 vol%, the content of carbon source is 45 vol%, and the content of binder is 15 vol%. The amount of boron carbide is 1.5 wt% of silicon carbide.

对比例1Comparative Example 1

与实施例1基本相同,区别仅在于:步骤(3)中,埋硅所使用的硅质量为理论计算时该硅和预制体的碳完全反应需要的硅质量的150%。The method is basically the same as Example 1, except that in step (3), the mass of silicon used for embedding silicon is 150% of the mass of silicon required for complete reaction between the silicon and the carbon of the preform in theoretical calculation.

图3为对比例1过硅反应烧结的第一烧结体SEM图(a)与过硅反应烧结和常压固相烧结制备的SiC陶瓷SEM图(b)。可以看出,图(a)中存在明显的硅衬度,这是由于大量的游离硅(偏白色)填充在SiC基体(灰色)之间。而且,过硅反应烧结的第一烧结体游离硅含量多,在常压固相烧结工艺中形成硅蒸汽进而挥发,导致碳化硅陶瓷成品的孔隙率增加,无法烧结致密化,参见图(b)。Figure 3 is a SEM image (a) of the first sintered body sintered by silicon reaction in comparative example 1 and a SEM image (b) of SiC ceramics prepared by silicon reaction sintering and pressureless solid phase sintering. It can be seen that there is an obvious silicon contrast in Figure (a), which is due to a large amount of free silicon (white) filled between the SiC matrix (gray). Moreover, the first sintered body sintered by silicon reaction has a high content of free silicon, which forms silicon vapor and then volatilizes in the pressureless solid phase sintering process, resulting in an increase in the porosity of the finished silicon carbide ceramic, which cannot be sintered to densify, see Figure (b).

对比例2Comparative Example 2

与实施例1基本相同,区别仅在于:省略步骤(4),即将预制体直接进行常压固相烧结。The method is basically the same as Example 1, except that step (4) is omitted, that is, the preform is directly subjected to normal pressure solid phase sintering.

图4为对比例2仅常压固相烧结的SiC陶瓷SEM图。可以看出,样品孔隙多,碳化硅颗粒排布疏松,存在较多孔隙。这是因为仅常压固相烧结无法实现预制体的烧结致密化。Figure 4 is a SEM image of SiC ceramics sintered only at atmospheric pressure in Comparative Example 2. It can be seen that the sample has many pores, the silicon carbide particles are loosely arranged, and there are many pores. This is because atmospheric pressure solid phase sintering alone cannot achieve sintering densification of the preform.

对比例3Comparative Example 3

与实施例1基本相同,区别仅在于:省略步骤(5)。The method is basically the same as Example 1, except that step (5) is omitted.

图5为对比例3制备的SiC陶瓷XRD图。图6为对比例3制备的SiC陶瓷背散射SEM图(a)和二次电子形貌SEM图(b)。可以看出,图(a)中没有明显的硅衬度,这表明SiC陶瓷中无游离硅,但是图(b)显示SiC陶瓷成品中也存在较多孔隙。Figure 5 is an XRD graph of the SiC ceramic prepared in Comparative Example 3. Figure 6 is a backscattering SEM image (a) and a secondary electron morphology SEM image (b) of the SiC ceramic prepared in Comparative Example 3. It can be seen that there is no obvious silicon contrast in Figure (a), which indicates that there is no free silicon in the SiC ceramic, but Figure (b) shows that there are also many pores in the finished SiC ceramic.

对比例4Comparative Example 4

与实施例1基本相同,区别仅在于:步骤(3)中,埋硅所使用的硅质量为理论计算时该硅和预制体的碳完全反应需要的硅质量的150%,且省略步骤(5)。测试结果表明,SiC陶瓷中存在较多游离硅。The method is basically the same as Example 1, except that in step (3), the mass of silicon used for embedding silicon is 150% of the mass of silicon required for complete reaction between the silicon and the carbon of the preform in theoretical calculation, and step (5) is omitted. The test results show that there is a lot of free silicon in SiC ceramics.

对比例5Comparative Example 5

与实施例1基本相同,区别仅在于:步骤(3)中,埋硅所使用的硅质量为理论计算时该硅和预制体的碳完全反应需要的硅质量的30%。The method is basically the same as Example 1, except that in step (3), the mass of silicon used for embedding silicon is 30% of the mass of silicon required for complete reaction between the silicon and the carbon of the preform in theoretical calculation.

对比例5的硅使用量较少,会导致埋粉的硅和预制体中的碳反应不佳,进一步使得上述反应引起的膨胀填充效果不佳,反应烧结体会存在大量孔隙,后续即使常压固相烧结也难以进一步致密化。The amount of silicon used in comparative example 5 is relatively small, which will lead to poor reaction between the buried silicon and the carbon in the preform, further resulting in poor expansion and filling effect caused by the above reaction. The reaction sintered body will have a large number of pores, and subsequent solid-phase sintering at normal pressure will be difficult to further densify.

表1选区激光3D打印两步烧结制备SiC陶瓷的性能:Table 1 Properties of SiC ceramics prepared by two-step sintering of selected area laser 3D printing:

从表1可以看出,对比例1的抗弯强度和弹性模量偏低。这是由于对比例1的SiC陶瓷存在大量游离硅,在常压固相烧结阶段游离硅形成硅蒸汽并挥发,促使在碳化硅基体中形成大量孔隙,这不利于常压固相烧结的致密化。对比例2具有高气孔率,且抗弯强度很低,这是由于如果不进行埋硅反应烧结而直接常压固相烧结会导致SiC陶瓷结构疏松。对比例3的抗弯强度和弹性模量偏低,开气孔率偏高,这是因为仅进行欠硅反应烧结不足以完成SiC陶瓷的烧结致密。As can be seen from Table 1, the flexural strength and elastic modulus of Comparative Example 1 are relatively low. This is because there is a large amount of free silicon in the SiC ceramic of Comparative Example 1. During the solid-phase sintering stage at normal pressure, the free silicon forms silicon vapor and volatilizes, which causes a large number of pores to form in the silicon carbide matrix, which is not conducive to the densification of solid-phase sintering at normal pressure. Comparative Example 2 has a high porosity and very low flexural strength. This is because direct solid-phase sintering at normal pressure without buried silicon reaction sintering will result in a loose structure of the SiC ceramic. The flexural strength and elastic modulus of Comparative Example 3 are relatively low, and the open porosity is relatively high. This is because only under-silicon reaction sintering is not enough to complete the sintering and densification of SiC ceramics.

Claims (10)

1. A method for preparing high-density SiC ceramic based on selective laser 3D printing and two-step sintering, which is characterized by comprising the following steps:
S1, weighing raw materials: weighing raw materials comprising silicon carbide, a carbon source and a binder according to the following proportion, wherein the content of silicon carbide powder is 35-65 vol%, the content of the carbon source is 30-60 vol% and the content of the binder is 5-25 vol% based on 100vol% of the total volume fraction of the silicon carbide, the carbon source and the binder;
s2, forming: the mixture fully mixed by the raw materials is 3D printed into a biscuit by selective laser;
S3, glue discharging: performing glue discharging on the biscuit to obtain a preform;
S4, under-silicon reaction sintering: carrying out under-silicon reaction sintering on the buried silicon of the preform, wherein the mass of silicon used for the buried silicon is 40% -95% of the mass of silicon required by complete reaction between the silicon and carbon of the preform during theoretical calculation, so as to obtain a first sintered body; the parameters of the under-silicon reaction sintering are as follows: the sintering atmosphere is vacuum, the sintering temperature is 1500-1800 ℃, and the sintering time is 0.5-3 hours;
S5, solid phase sintering under normal pressure: carrying out normal-pressure solid-phase sintering on the first sintered body to obtain high-density SiC ceramic; the parameters of the normal pressure solid phase sintering are as follows: the sintering atmosphere is inert atmosphere, the sintering temperature is 2000-2300 ℃, and the heat preservation time of the sintering temperature is 0.5-2 h.
2. The method of claim 1, wherein the carbon source is carbon black, carbon microspheres, or graphite; the binder is a thermoplastic resin and/or a thermosetting resin.
3. The method of claim 2, wherein the binder is a phenolic resin.
4. The method of claim 1, wherein the feedstock comprises boron carbide in addition to silicon carbide, a carbon source and a binder, wherein the boron carbide is present in an amount of 0.5 to 8wt% of the silicon carbide.
5. The method according to claim 1, wherein in step S3, the temperature of the paste is 800 to 1000 ℃ and the paste discharging time is 0.5 to 1 hour.
6. The method according to claim 1, wherein the method further comprises: before under-silicon reaction sintering, the preform after glue discharge is subjected to vacuum impregnation or pressure impregnation in a precursor solution, and then high-temperature pyrolysis is carried out.
7. The method according to claim 6, wherein the precursor solution is a phenolic resin organic solution with a mass fraction of 30-70%.
8. The method of claim 1, wherein the main phases of the highly dense SiC ceramic are 2H-C and 6H-SiC.
9. The method of claim 1, wherein the high-density SiC ceramic has an open gas porosity of 1% to 2% and a density of 3.0 to 3.1 g/cm 3.
10. The method of claim 1, wherein the high density SiC ceramic has a flexural strength of 280 MPa or more and an elastic modulus of 300GPa or more.
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