CN117641710A - Anti-interference high-frequency high-speed layer-missing reference stacking structure - Google Patents

Abstract

The invention discloses an anti-interference high-frequency high-speed layer-missing reference stacking structure, which relates to the field of high-frequency high-speed signal line layer-missing reference design, and comprises the following steps: carrying out hollowing treatment between the lower part of the high-frequency high-speed line and the GND layer to form a hollowing area; the structure of the hollowed-out area is a reflux path of the high-frequency high-speed line and the signal reference layer; a radiation shielding line is arranged on the radiation signal layer close to the hollowed-out area, and a radiation shielding hole is arranged on the radiation shielding line; the invention can effectively shield the power supply layer and the sensitive signal layer to form an edge radiation effect, avoid the interference of edge radiation on the high-frequency high-speed line and greatly reduce the signal noise and the signal burr of the high-frequency high-speed signal line.

Description

Anti-interference high-frequency high-speed layer-missing reference stacking structure

Technical Field

The invention relates to the field of high-frequency high-speed signal line layer-missing reference design, in particular to an anti-interference high-frequency high-speed layer-missing reference stacking structure.

Background

The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.

Currently, in high frequency and high speed designs, to meet the full link impedance consistency, a layer reference design, i.e. a layer missing reference design, is generally required. The layer missing reference is to empty the transmission channel of the signal from the transmission line to the impedance mutation position generated by a three-dimensional structure, and remove the adjacent part of the reference plane under the pad of the three-dimensional structure, so that the distance between the signal layer and the reference layer is large enough, and the layer missing design meets the impedance control requirement. However, the lack of a layer design structure, the corresponding power supply layer and sensitive signal layer are easy to form an edge radiation effect, and the structure is easy to cause interference to the formation of high-frequency high-speed signal layers. Meanwhile, the high-frequency high-speed signal line can also interfere with other signals of the missing layer design structure.

In the existing design, in order to ensure the impedance consistency of the impedance mutation position of the high-frequency high-speed signal line, only the first layer under the high-frequency high-speed signal line is hollowed, partial scholars propose to increase the high-frequency high-speed signal line to reduce loss and hollowed the layers under the high-frequency high-speed signal line, the impedance consistency is only considered in the design mode, the electromagnetic interference problem caused by the three-dimensional structure formed after hollowing is not considered, the electromagnetic interference problem is mainly represented by the fact that the high-frequency high-speed signal line generates strong electromagnetic radiation on the three-dimensional structure, sensitive signals in the hollowed three-dimensional structure are seriously affected, and the power layer and the radiation layer exposed by the hollowed three-dimensional structure also radiate electromagnetic signals outwards, so that the electromagnetic interference influence on the high-frequency high-speed signal line is caused.

In a word, in the existing design mode of the missing layer reference, the high-frequency high-speed signal line can form electromagnetic interference on other signals of the missing layer design structure, and the corresponding power supply layer and sensitive signal layer easily form an edge radiation effect, so that space radiation is exposed through the three-dimensional structure, and interference is formed on the high-frequency high-speed signal line. Not only greatly increases signal noise and signal burrs generated by high-frequency high-speed signal line transmission, but also increases the problem of electromagnetic compatibility of a product system.

According to the current reference design mode of the high-frequency high-speed signal line layer shortage, in addition, in the current printed board design, the following problems can occur in the current design mode:

1. when the line width is increased and then the corresponding lower layers are hollowed, the high-frequency high-speed signal line can form electromagnetic interference on other signals of the layer-lacking design structure, and the electromagnetic compatibility problem of a product system is greatly increased.

2. The hollowed three-dimensional structure is easy to form an edge radiation effect, space radiation is exposed through the three-dimensional structure, so that interference is formed on the high-frequency high-speed signal wire, and signal noise and signal burrs of the high-frequency high-speed signal wire are greatly increased.

3. Meanwhile, the superimposed electromagnetic field formed by the high-frequency high-speed signal wire and the power supply layer is superimposed, so that larger electromagnetic radiation hazard is formed, and the instability of the product is increased.

Disclosure of Invention

The invention aims at: aiming at the problems existing in the prior art, the anti-interference high-frequency high-speed layer-missing reference stacking structure is provided, electromagnetic signals generated by a high-frequency high-speed signal wire can be coupled to the GND radiation shielding hole, the phenomenon that the high-frequency high-speed signal wire can form electromagnetic interference on other signals of a layer-missing design structure can be avoided, the electromagnetic compatibility problem of a product system is greatly increased, and the reliability of electronic products is also greatly improved.

The technical scheme of the invention is as follows:

an anti-interference high frequency high speed hypo-lamination reference stack comprising: carrying out hollowing treatment between the lower part of the high-frequency high-speed line and the GND layer to form a hollowing area; the structure of the hollowed-out area is a reflux path of the high-frequency high-speed line and the signal reference layer; and a radiation shielding line is arranged on the radiation signal layer close to the hollowed-out area, and a radiation shielding hole is arranged on the radiation shielding line.

Further, the width of the high-frequency high-speed line is W, the height of the hollowed area is h, the width W1 of the radiation shielding line is W2, the interval width between the radiation shielding line and the radiation signal layer is D1.

Further, W and W1 satisfy the following dimensional requirements: w1 is more than or equal to W.

Further, W and W2 satisfy the following dimensional requirements: w2 is more than or equal to 3W.

Further, D1 and W1 satisfy the following dimensional requirements: d1 is less than or equal to W1.

Further, the high-frequency high-speed line is a microstrip line or a strip line.

Further, the high-frequency high-speed line is a microstrip line, and the width W thereof is confirmed by the following formula:

wherein: z is Z ₀ Is single-ended impedance epsilon _r Is of dielectric constant, h ₁ Is a line thickness.

Further, the high-frequency high-speed line is a strip line, and the width W thereof is confirmed by the following formula:

wherein: z is Z ₀ Is single-ended impedance epsilon _r Is of dielectric constant, h ₁ Is a line thickness.

Further, the D1 is between 0.2mm and 1mm, and the distance between the radiation shielding holes is between 1mm and 5mm.

Compared with the prior art, the invention has the beneficial effects that:

1. an anti-interference high frequency high speed hypo-lamination reference stack comprising: carrying out hollowing treatment between the lower part of the high-frequency high-speed line and the GND layer to form a hollowing area; the structure of the hollowed-out area is a reflux path of the high-frequency high-speed line and the signal reference layer; a radiation shielding line is arranged on the radiation signal layer close to the hollowed-out area, and a radiation shielding hole is arranged on the radiation shielding line; the shielding device can effectively shield the power supply layer and the sensitive signal layer to form an edge radiation effect, so that interference of edge radiation to a high-frequency high-speed line is avoided, and signal noise and signal burrs of the high-frequency high-speed signal line are greatly reduced.

2. The high-frequency high-speed reference stacking structure comprises a radiation shielding wire, a radiation shielding hole is formed in the radiation shielding wire, electromagnetic signals generated by a high-frequency high-speed signal wire are coupled to the radiation shielding hole, electromagnetic interference to other signals of a layer-missing design structure caused by the high-frequency high-speed signal wire can be avoided, the electromagnetic compatibility problem of a product system is greatly increased, and the reliability of electronic products is also greatly improved.

Drawings

FIG. 1 is a top view of an anti-interference high frequency high speed buildup-less reference laminate printed board;

FIG. 2 is a cross-sectional view of an anti-interference high frequency high speed laminate-missing reference laminate;

FIG. 3 is a diagram of an anti-interference high frequency high speed overlay reference path;

FIG. 4 is a plan view of an anti-interference high frequency high speed laminated reference laminated radiation shielding structure;

FIG. 5 is a cross-sectional view of an anti-interference high frequency high speed laminated reference laminated radiation shield;

fig. 6 is a plan view of an anti-interference high-frequency high-speed reference stacked printed board application.

Detailed Description

It is noted that relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The features and capabilities of the present invention are described in further detail below in connection with examples.

Example 1

Referring to fig. 1-6, an anti-interference high frequency high speed missing layer reference stack comprises:

carrying out hollowing treatment between the lower part of the high-frequency high-speed line and the GND layer to form a hollowing region (namely hollowing the corresponding stratum and the radiation signal layer under the corresponding high-frequency high-speed line until the GND layer is encountered, the hollowing treatment is stopped, and the hollowing treatment is generally multiple layers); the structure of the hollowed-out area is a reflux path of the high-frequency high-speed line and the signal reference layer; a radiation shielding line is arranged on the radiation signal layer close to the hollowed-out area, and a radiation shielding hole is arranged on the radiation shielding line;

the radiation shielding wire and the radiation shielding hole can effectively shield the interference of the high-frequency high-speed wire on the signal layer, avoid the edge radiation effect formed by the power supply layer and the sensitive signal layer, and greatly reduce the signal noise and the signal burr of the high-frequency high-speed signal wire;

the electromagnetic signal generated by the high-frequency high-speed signal wire can be coupled to the radiation shielding hole through the structure, so that electromagnetic interference caused by other signals of the layer-lacking design structure due to the high-frequency high-speed signal wire can be avoided, the electromagnetic compatibility problem of a product system is greatly increased, and the reliability of an electronic product is also greatly improved.

In this embodiment, specifically, the width of the high-frequency high-speed line is W, the height of the hollowed area is h, the width W1 of the radiation shielding line, the width of the interval between the radiation shielding line and the radiation signal layer is W2, the diameter of the radiation shielding hole is D1, the diameter D1 of the radiation shielding hole is between 0.2mm and 1mm, and the interval between the radiation shielding holes is between 1mm and 5mm.

In the present embodiment, specifically, W and W1 satisfy the following dimensional requirements: w1 is more than or equal to W; w and W2 meet the following dimensional requirements: w2 is more than or equal to 3W; d1 and W1 satisfy the following dimensional requirements: d1 is less than or equal to W1.

In this embodiment, specifically, the high-frequency high-speed line is a microstrip line or a strip line;

in the case of a microstrip line, the width W of the high-frequency high-speed line is confirmed by the following formula:

microstrip line impedance calculation mode:

in the case of a strip line, the width W of the high-frequency high-speed line is confirmed by the following formula:

strip line impedance calculation mode:

wherein: z is Z ₀ Is single-ended impedance epsilon _r Is of dielectric constant, h ₁ Is a line thickness.

The foregoing examples merely represent specific embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the present application. It should be noted that, for those skilled in the art, several variations and modifications can be made without departing from the technical solution of the present application, which fall within the protection scope of the present application.

This background section is provided to generally present the context of the present invention and the work of the presently named inventors, to the extent it is described in this background section, as well as the description of the present section as not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present invention.

Claims (9)

1. An anti-interference high frequency high speed laminate missing reference stack, comprising: carrying out hollowing treatment between the lower part of the high-frequency high-speed line and the GND layer to form a hollowing area; the structure of the hollowed-out area is a reflux path of the high-frequency high-speed line and the signal reference layer; and a radiation shielding line is arranged on the radiation signal layer close to the hollowed-out area, and a radiation shielding hole is arranged on the radiation shielding line.

2. The anti-interference high-frequency high-speed missing layer reference structure according to claim 1, wherein the width of the high-frequency high-speed line is W, the height of the hollowed-out area is h, the width of the radiation shielding line is W1, the width of the interval between the radiation shielding line and the radiation signal layer is W2, and the diameter of the radiation shielding hole is D1.

3. The anti-interference high frequency high speed hypo-lamination reference lamination of claim 2, wherein W and W1 meet the following dimensional requirements: w1 is more than or equal to W.

4. An anti-interference high frequency high speed hypo-lamination reference lamination according to claim 2, wherein W and W2 meet the following dimensional requirements: w2 is more than or equal to 3W.

5. The anti-interference high frequency high speed hypo-lamination reference lamination according to claim 2, wherein D1 and W1 satisfy the following dimensional requirements: d1 is less than or equal to W1.

6. The anti-interference high-frequency high-speed laminated-lacking reference structure according to claim 2, wherein the high-frequency high-speed line is a microstrip line or a strip line.

7. The anti-interference high-frequency high-speed laminated-lacking reference structure according to claim 6, wherein the high-frequency high-speed line is a microstrip line, and the width W of the microstrip line is confirmed by the following formula:

wherein: z is Z ₀ Is single-ended impedance epsilon _r Is of dielectric constant, h ₁ Is a line thickness.

8. The anti-interference high frequency high speed laminate shortage reference structure according to claim 6, wherein the high frequency high speed line is a strip line, and the width W thereof is confirmed by the following formula:

wherein: z is Z ₀ Is single-ended impedance epsilon _r Is of dielectric constant, h ₁ Is a line thickness.

9. An anti-interference high frequency high speed hypo-lamination reference lamination according to claim 2, wherein D1 is between 0.2mm and 1mm, and the spacing between each radiation shielding hole is between 1mm and 5mm.