CN117629282A - Wireless Wen Zhen sensor, wireless monitoring system and periodic working method of wireless monitoring system - Google Patents
Wireless Wen Zhen sensor, wireless monitoring system and periodic working method of wireless monitoring system Download PDFInfo
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- 238000012544 monitoring process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 17
- 230000000737 periodic effect Effects 0.000 title abstract description 11
- 238000006243 chemical reaction Methods 0.000 claims abstract description 14
- 230000005540 biological transmission Effects 0.000 claims abstract description 12
- 230000001133 acceleration Effects 0.000 claims description 42
- 238000012986 modification Methods 0.000 claims description 13
- 230000004048 modification Effects 0.000 claims description 13
- 238000004891 communication Methods 0.000 claims description 12
- 230000003750 conditioning effect Effects 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- 238000012545 processing Methods 0.000 claims description 8
- 230000006870 function Effects 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 239000000523 sample Substances 0.000 claims description 5
- 238000001914 filtration Methods 0.000 claims description 3
- 230000008447 perception Effects 0.000 claims 2
- 238000009434 installation Methods 0.000 abstract description 8
- 238000001514 detection method Methods 0.000 abstract description 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 abstract description 2
- 238000009851 ferrous metallurgy Methods 0.000 abstract description 2
- 229910052744 lithium Inorganic materials 0.000 abstract description 2
- 230000008054 signal transmission Effects 0.000 abstract 1
- 230000005291 magnetic effect Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 8
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910001416 lithium ion Inorganic materials 0.000 description 4
- 238000004382 potting Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 1
- QJVKUMXDEUEQLH-UHFFFAOYSA-N [B].[Fe].[Nd] Chemical compound [B].[Fe].[Nd] QJVKUMXDEUEQLH-UHFFFAOYSA-N 0.000 description 1
- QVFWZNCVPCJQOP-UHFFFAOYSA-N chloralodol Chemical compound CC(O)(C)CC(C)OC(O)C(Cl)(Cl)Cl QVFWZNCVPCJQOP-UHFFFAOYSA-N 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910001172 neodymium magnet Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W4/00—Services specially adapted for wireless communication networks; Facilities therefor
- H04W4/30—Services specially adapted for particular environments, situations or purposes
- H04W4/38—Services specially adapted for particular environments, situations or purposes for collecting sensor information
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
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Abstract
The utility model relates to a ferrous metallurgy field provides a wireless Wen Zhen sensor, wireless monitoring system and periodic working method thereof, gather temperature signal and vibration signal by temperature sensing module and vibration sensing module, because the signal that temperature sensing module and vibration sensing module gathered is analog quantity signal, consequently, need through AD conversion chip with analog quantity signal conversion digital quantity signal, send digital quantity signal to MCU by AD conversion chip again, MCU calculates and send the calculated value to upper computer system through wireless data transceiver module after receiving digital quantity signal, can realize the detection of vibration signal and temperature signal simultaneously, and the outside transmission of signal adopts wireless transmission's form, the sensor is inside to pass through lithium subcell energy supply, can avoid the laying of cable and the installation of cable testing bridge.
Description
Technical Field
The application relates to the field of ferrous metallurgy, in particular to a wireless Wen Zhen sensor, a wireless monitoring system and a periodic working method thereof.
Background
When steel works at home and abroad operate, most of used key equipment is rotating equipment, and in the early stage of undeveloped technology, the maintenance of the key equipment by the steel works is mainly overhauled at regular intervals, and the mode leads to insufficient maintenance or excessive maintenance.
With advances and developments in the scientific and technological arts, equipment maintenance for rotating equipment has shifted from periodic service to predictive maintenance. In performing predictive maintenance, a device failure prediction technique based on a vibration signal and a temperature signal is one of the main technical means for realizing a device predictive maintenance function, and thus a rotary device is beginning to require installation of a vibration sensor and a temperature sensor.
The detection of vibration signals and temperature signals in the industrial field is mainly realized by a wired sensor, and the temperature sensor and the vibration sensor are arranged separately. The sensor is connected to the IO module of the PLC system of the low-voltage distribution room through the cable, so that the amount of the cable of the sensor is large, the amount of the cable bridge is correspondingly increased, the problem of high investment cost is caused, and meanwhile, the problem of huge installation workload is caused by cable laying and the cable bridge.
Disclosure of Invention
In order to reduce investment cost of online monitoring of status signals of rotating equipment and reduce workload of cabling and installation of a cable bridge, the application provides a wireless Wen Zhen sensor, a wireless monitoring system and a periodic working method thereof.
In a first aspect, the present application provides a wireless Wen Zhenchuan sensor, including a sensor housing, a vibration sensing module, a temperature sensing module, a sensor signal board, a sensor circuit board, and an antenna, wherein the vibration sensing module, the temperature sensing module, the sensor signal board, the sensor circuit board, and the antenna are all located within the sensor housing;
the vibration sensing module is fixed on the upper surface of the sensor signal board;
the temperature sensing module comprises a temperature sensing probe which is positioned on the lower surface of the sensor signal board, is embedded in the bottom of the sensor shell and is close to the outer surface of the bottom of the sensor shell;
the sensor circuit main board is arranged above the sensor signal board and is connected with the sensor signal board through a pin header;
the sensor circuit main board comprises a PCB substrate, a wireless data transceiver module and electronic components; the wireless data transceiver module is arranged on the upper part of the PCB substrate and is electrically connected with the antenna; the electronic components are arranged at the lower part of the PCB substrate and comprise a microcontroller, an AD conversion chip and an instrument operational amplifier.
Optionally, the sensor further comprises an upper cover, and the top of the sensor housing is open; the top of the outer wall of the sensor shell and the bottom of the inner wall of the upper cover are respectively provided with mutually meshed threads.
Optionally, a groove is formed in the bottom of the sensor housing, a magnetic block is installed in the groove, and the outer end face of the magnetic block is flush with the outer surface of the bottom of the sensor housing.
Optionally, the sensor signal board is fixed in the sensor housing through a fixing seat; the sensor signal board both sides are offered the fixed orifices respectively, the fixing base is totally two and all offer the screw on it, the fixed orifices with the screw passes through the screw connection.
Optionally, the sensor further comprises a battery, and the electronic component further comprises an LDO linear power supply chip; the LDO linear power chip is electrically connected with the pin header, the wireless data transceiver module, the battery and other electronic components.
Optionally, a battery support plate is arranged inside the sensor housing, the battery support plate is connected with the sensor circuit main board, two vertical plates are respectively arranged on two sides of the upper surface of the battery support plate, the battery is placed between the two vertical plates, and the side part of the battery is in contact with the vertical plates.
In a second aspect, the present application provides a wireless monitoring system based on the wireless Wen Zhen sensor, comprising:
the temperature sensing module is used for collecting temperature signals of the tested equipment and sending the temperature signals to the signal conditioning circuit;
the vibration sensing module is used for collecting vibration signals of the tested equipment and sending the vibration signals to the signal conditioning circuit;
the signal conditioning circuit is used for receiving the temperature signal and the vibration signal, filtering and amplifying the received signals, and then sending the processed signals to the AD acquisition module;
the AD acquisition module is used for receiving the processed signals, converting the processed signals into digital signals and then sending the digital signals to the microcontroller;
the microcontroller is used for receiving the digital signals, converting the digital signals into corresponding acceleration values and temperature values according to the linear relation between the voltage values and the vibration acceleration values or the temperature values, and then transmitting the acceleration values and the temperature values to the wireless data receiving and transmitting module;
and the wireless data receiving and transmitting module is used for receiving the acceleration value and the temperature value and transmitting the acceleration value and the temperature value to the upper computer system.
In a third aspect, the present application provides a periodic operation method of a wireless monitoring system, including:
s1: the AD acquisition module converts analog quantity signals acquired by the vibration sensing module and the temperature sensing module into digital quantity signals, and the AD acquisition module sends the digital quantity signals to the microcontroller;
s2: the microcontroller calculates a voltage value of a vibration signal according to the voltage reference and the bit number of the AD acquisition module, and calculates a vibration acceleration value according to the linear relation between the voltage value and the acceleration of the vibration sensing module; similarly, calculating a temperature value;
s3: the microcontroller packages and encapsulates the vibration acceleration value and the temperature value according to a wireless transmission protocol format, calls a wireless data transmission function and transmits a first data packet containing the vibration acceleration value and the temperature value to the wireless data transceiver module; the wireless data receiving and transmitting module transmits the first data packet to a gateway of a wireless network; the gateway sends the first data packet to an upper computer system;
s4: the upper computer system packages and encapsulates the cycle time modification instruction and then sends the cycle time modification instruction to the wireless data transceiver module; the main program of the microcontroller judges whether the wireless data transceiver module receives a second data packet containing a periodical time modification instruction, if yes, the step S5 is executed, and if not, the step S6 is executed;
s5: the main program carries out data processing on the second data packet, and the main program assigns the processed data to a cycle time set value T2;
s6: the main program clears the current value T1 of the period time, and invokes a sleep instruction to enable the microcontroller to enter a sleep state;
s7: after the microcontroller enters a sleep state, the timer is interrupted to keep in a working state, a program statement of T1=T1+1 is executed in a timer interruption function, whether T1 is equal to T2 is judged, if yes, a step S8 is executed;
s8: and the main program calls a wake-up instruction to enable the microcontroller to enter a working state, and steps S1-S3 are executed.
Optionally, in the program initialization, the peripheral module is configured as a serial port, a timer, an SPI communication interface, or an I2C communication interface. Optionally, when the main program performs data processing on the second data packet, the data processing is configured to enable the main program to unpack the second data packet according to a wireless transmission protocol format.
According to the technical scheme, the temperature sensing module and the vibration sensing module collect temperature signals and vibration signals of tested equipment, the temperature sensing module and the vibration sensing module collect signals which are analog signals, so that the analog signals are converted into digital signals through an AD conversion chip, the digital signals are sent to an MCU (micro controller unit) through the AD conversion chip, the MCU receives the digital signals and then calculates the digital signals, and calculated values are sent to an upper computer system through a wireless data transceiver module, so that detection of the vibration signals and the temperature signals can be simultaneously achieved, the signals are sent outwards in a wireless transmission mode, the sensor is powered by a battery, and cable laying and cable bridge installation can be avoided; during MCU operation, the wireless data transceiver module can also be used for receiving the cycle time modification instruction sent by the upper computer system, then sending the cycle time modification instruction to the MCU, and the MCU modifies the cycle time set value T2, thereby changing the working interval of the MCU and realizing remote setting. According to the embodiment, the working state of the sensor is divided into the sleep mode and the working mode, when the sensor is in the sleep mode, the acquisition of vibration signals and temperature signals and the sending of wireless signals are not carried out, and a serial port, a communication interface and the like in the MCU peripheral module also stop working, so that the electric energy consumption can be reduced.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings that are needed in the embodiments will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
FIG. 1 is a schematic diagram of a wireless Wen Zhenchuan sensor according to an exemplary embodiment of the present application;
FIG. 2 is a circuit block diagram of a sensor circuit board shown in an exemplary embodiment of the present application;
FIG. 3 is a schematic diagram of a sensor circuit board according to an exemplary embodiment of the present application;
FIG. 4 is a block diagram of a circuit module of a wireless monitoring system according to an exemplary embodiment of the present application;
FIG. 5 is another circuit block diagram of a wireless monitoring system according to an exemplary embodiment of the present application;
fig. 6 is a flow chart of a periodic method of operation as illustrated in an exemplary embodiment of the present application.
Wherein:
1. the sensor comprises a sensor shell, 2, an upper cover, 3, a vibration sensing module, 4, a temperature sensing module, 5, a magnetic block, 6, a sensor signal board, 7, a sensor circuit main board, 71, a PCB substrate, 72, a wireless data transceiver module, 73, a microcontroller, 74, an AD conversion chip, 75, an instrument operational amplifier, 76, an LDO linear power supply chip, 8, a battery, 9, an antenna, 10, a fixed seat, 11, a screw, 12, a battery support board, 13 and a vertical plate.
Detailed Description
Reference will now be made in detail to the embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The embodiments described in the examples below do not represent all embodiments consistent with the present application. Merely as examples of systems and methods consistent with some aspects of the present application as detailed in the claims.
Referring to fig. 1, a first aspect of the present embodiment provides a wireless Wen Zhenchuan sensor, which includes a sensor housing 1, a cover 2, a vibration sensing module 3, a temperature sensing module 4, a magnet 5, a sensor signal board 6, a sensor circuit board 7, a battery 8, and an antenna 9.
The sensor housing 1 is made of stainless steel, is in a cylindrical shape with an opening at the top, has a circular wall thickness of 2-3 mm, a diameter of 25-50 mm and a housing height of 50-100 mm.
The outer wall top of the sensor housing 1 and the inner wall bottom of the upper cover 2 are respectively provided with mutually meshed threads, and the sensor housing 1 and the upper cover 2 are connected through threads, so that the upper cover 2 can be quickly disassembled and assembled.
A groove is formed in the bottom of the sensor shell 1, the magnetic block 5 is arranged in the groove, the outer end face of the magnetic block 5 is flush with the outer surface of the bottom of the sensor shell 1, the magnetic block 5 is made of a ferromagnetic material, such as a neodymium iron boron ferromagnetic iron, and therefore a magnetic attraction base of the sensor is formed. The groove and the magnetic block 5 are of annular structures, the magnetic attraction base is convenient for the field installation of the sensor, punching and tapping are not needed in the installation process, and the sensor is convenient to detach during maintenance.
In other embodiments of the present application, the grooves and the magnet blocks 5 may be circular or other shapes.
The vibration sensing module 3 is welded on the upper surface of the sensor signal board 6, and the two are electrically connected, and the vibration sensing module 3 adopts a MEMS acceleration sensor or a piezoelectric acceleration sensor and other sensors, and has the characteristics of small volume, light weight, quick response, high sensitivity, measurable acceleration of an object to be measured and the like.
The temperature sensing module 4 comprises a temperature sensing probe which is embedded in the solid bottom of the sensor shell 1 and is electrically connected with the sensor signal board 6, the temperature sensing probe is close to the outer surface of the bottom of the sensor shell 1, the bottom of the sensor is attached to the surface of the tested device, and the temperature sensing module 4 can rapidly detect the temperature value of the tested device.
The sensor signal board 6 is circular, the diameter of the sensor signal board is 2-3 mm smaller than the inner diameter of the sensor housing 1, the sensor signal board is fixed in the sensor housing 1 through the fixing base 10, fixing holes are respectively formed in two sides of the sensor signal board 6, screw holes are formed in the two sides of the fixing base 10, and the sensor signal board 6 is fixed on the fixing base 10 by screwing screws 11 into the screw holes after penetrating through the fixing holes.
The sensor circuit board 7 is circular and is arranged above the sensor signal board 6, the diameter of the sensor circuit board is the same as that of the sensor signal board 6, the sensor circuit board 7 is fixed on a pin arrangement female seat of the sensor signal board 6 through single-row pins or double-row pins, and the pin spacing of the pin arrangement is preferably 1.27mm.
Fig. 2 is a circuit block diagram of a sensor circuit board.
Referring to fig. 2, the sensor circuit board 7 includes a signal conditioning circuit, an AD acquisition circuit, a microcontroller, a wireless data transceiver module, and a power management circuit. The wireless data transceiver module can adopt a Lora module, a Zigbee module or an NB-IOT module.
Fig. 3 is a schematic structural diagram of a sensor circuit board.
Referring to fig. 3, the sensor circuit board 7 includes a PCB substrate 71, a wireless data transceiver module 72, electronic components, and wires for electrically connecting the electronic components and the PCB substrate 71. The wireless data transceiver module 72 is disposed on the upper portion of the PCB substrate 71 and electrically connected to the antenna 9. The PCB substrate 71 is provided with electronic components at a lower portion thereof, for example: MCU 73 (microcontroller), AD conversion chip 74, instrumentation operational amplifier 75, and LDO linear power chip 76; the LDO linear power chip 76 is electrically connected with the battery 8, and the LDO linear power chip 76 distributes voltage to each electronic component and the wireless data transceiver module 72 through the power management circuit and supplies power to the sensor signal board 6 through the pin header and the pin header socket.
The antenna 9 is composed of a core material made of FPC material and a plastic shell, and the FPC material can be folded, so that the antenna is conveniently arranged in an arc. The antenna 9 is hidden in the sensor housing 1, and has the advantage over an external antenna that the sensor is not damaged by external objects or human factors at will after installation.
The battery 8 is a non-rechargeable lithium-ion battery, such as an ER26500 battery, with a capacity of 9000mAh and a volume of 26mm 50mm. The battery 8 supplies power for the operation of the sensor without cabling; referring to fig. 1, in order to facilitate fixing of the lithium-ion battery, a battery support plate 12 is disposed inside the sensor housing 1, the battery support plate 12 is connected with the sensor circuit board 7 through a pin and a pin socket, so that the sensor can be conveniently disassembled and assembled, two vertical plates 13 are respectively disposed on two sides of the upper surface of the battery support plate 12, the lithium-ion battery is placed between the two vertical plates 13, and the side parts of the lithium-ion battery are in contact with the vertical plates 13.
The antenna 9 is disposed on the upper surface of the battery support plate 12, outside one of the risers 13.
The sensor housing 1 is internally encapsulated and protected by heat-conducting potting adhesive, and the potting adhesive surface covers the sensor circuit main board 7 until the potting adhesive is flush with the battery support plate 12. The heat-conducting pouring sealant has the advantages of good heat conductivity, flame retardance, low viscosity, good leveling property, soft rubber-like formed by curing, good impact resistance, strong adhesive force, insulation, moisture resistance, shock resistance, oxidation resistance, leakage resistance and the like, and can enable the sensor to achieve the protection grade above IP 65.
Fig. 4 and 5 are block diagrams of circuit blocks of the wireless monitoring system.
Referring to fig. 4, an embodiment of the present application further provides a wireless monitoring system for monitoring a temperature value and a vibration acceleration value of a rotating device, the system comprising:
the temperature sensing module is used for collecting temperature signals of the tested equipment and sending the temperature signals to the signal conditioning circuit;
the vibration sensing module is used for collecting vibration signals of the tested equipment and sending the vibration signals to the signal conditioning circuit;
the signal conditioning circuit is used for receiving the temperature signal and the vibration signal, filtering and amplifying the received signals, and then sending the processed signals to the AD acquisition module;
the AD acquisition module is used for receiving the processed signals, converting the processed signals into digital signals and then sending the digital signals to the microcontroller;
the microcontroller is used for receiving the digital signals, converting the digital signals into corresponding acceleration values and temperature values according to the linear relation between the voltage values and the vibration acceleration values and the temperature values, and then sending the acceleration values and the temperature values to the wireless data receiving and transmitting module;
and the wireless data receiving and transmitting module is used for receiving the acceleration value and the temperature value and transmitting the acceleration value and the temperature value to the upper computer system.
The vibration sensing module can select an ADXL354 type acceleration chip, when the acceleration range is 2g, the linear relation is 400mV/g, and the voltage value of the X axis of the vibration sensor is assumed to be 600mV, and the corresponding acceleration is 1.5g;
referring to fig. 5, the vibration sensing module may also select a MEMS acceleration chip with digital output, so that a signal conditioning circuit and an AD acquisition module can be omitted, the system is simpler, the cost is lower, the MEMS acceleration chip is directly connected to a communication interface of the microcontroller through an SPI interface or an I2C interface, the microcontroller reads digital values of an X axis, a Y axis or a Z axis of the MEMS acceleration chip, and converts the digital values into acceleration values according to a linear relationship between the digital values and acceleration of a MEMS acceleration chip data manual, for example, an ADXL355 type acceleration chip, when the equivalent range is 2g, the linear relationship is 256000/g, assuming that the digital value of the X axis is 128000, and the corresponding acceleration value is 0.5g.
Fig. 6 is a flow chart of a periodic method of operation as illustrated in an exemplary embodiment of the present application.
Referring to fig. 6, an embodiment of the present application further provides a periodic operation method of a wireless monitoring system, where the method is used to make the sensor operate or sleep according to a period time, and before the operation, the system clock of the MCU, a peripheral module, and an input/output state of a GPIO (general purpose input and output) are configured in an initialized manner, where the peripheral module includes a serial port, a timer, an SPI communication interface, or an I2C communication interface of the microcontroller, and the method includes:
s1: the AD conversion chip converts analog quantity signals acquired by the vibration sensing module and the temperature sensing module into digital quantity signals; the MCU is connected with the AD conversion chip through an SPI bus or an I2C bus to acquire the digital quantity signal;
s2: the MCU calculates the voltage value of the vibration signal according to the voltage reference and the bit number of the AD conversion chip, and calculates the vibration acceleration value according to the linear relation between the voltage value and the acceleration of the vibration sensing module; similarly, calculating a temperature value;
s3: packaging and packaging the vibration acceleration value and the temperature value according to a wireless transmission protocol format, and then calling a wireless data transmission function by the MCU to transmit a first data packet containing the vibration acceleration value and the temperature value to a wireless data transceiver module; the wireless data receiving and transmitting module transmits the first data packet to a gateway of a wireless network; the gateway sends the first data packet to an upper computer system;
the communication protocol format is selected from LoraWan communication protocol format or other wireless communication protocol format.
S4: the upper computer system packages and encapsulates the cycle time modification instruction and then sends the cycle time modification instruction to the wireless data receiving and sending module, and the main program of the MCU judges whether the wireless data receiving and sending module receives a second data packet containing the cycle time modification instruction, if so, the step S5 is executed; if not, executing step S6;
s5: the main program carries out data processing on the second data packet, and the main program assigns the processed data to a cycle time set value T2;
and the data processing is to unpack the second data packet according to a wireless transmission protocol format for the main program.
S6: the main program clears the current value T1 of the period time, and invokes a sleep instruction to enable the MCU to enter a sleep state;
s7: after the MCU enters a sleep state, the timer is interrupted to keep a working state, a program statement of T1=T1+1 is executed in a timer interruption function, whether T1 is equal to T2 is judged, if yes, a step S8 is executed;
s8: and the main program calls a wake-up instruction to enable the MCU to enter a working state, and steps S1-S3 are executed.
In this embodiment, during the operation of the MCU, the wireless data transceiver module may be further configured to receive a cycle time modification instruction sent by the host computer system, and send the cycle time modification instruction to the MCU, where the MCU modifies the cycle time set point T2, thereby changing the working interval of the MCU and implementing remote setting. According to the embodiment, the working state of the sensor is divided into the sleep mode and the working mode, when the sensor is in the sleep mode, the acquisition of vibration signals and temperature signals and the sending of wireless signals are not carried out, and a serial port, a communication interface and the like in the MCU peripheral module also stop working, so that the electric energy consumption can be reduced.
According to the technical scheme, the embodiment of the application provides the wireless Wen Zhen sensor, the wireless monitoring system and the periodic working method thereof, the temperature sensing module and the vibration sensing module collect temperature signals and vibration signals of tested equipment, and because the signals collected by the temperature sensing module and the vibration sensing module are analog signals, the analog signals are required to be converted into digital signals through the AD conversion chip, the digital signals are transmitted to the MCU through the AD conversion chip, the MCU receives the digital signals and then calculates the digital signals, the calculated values are transmitted to the upper computer system through the wireless data transceiver module, the detection of the vibration signals and the temperature signals can be simultaneously realized, the signals are transmitted outwards in a wireless transmission mode, the sensor is powered by the lithium sub-battery, and the laying of cables and the installation of cable bridges can be avoided.
The foregoing detailed description of the embodiments is merely illustrative of the general principles of the present application and should not be taken in any way as limiting the scope of the invention. Any other embodiments developed in accordance with the present application without inventive effort are within the scope of the present application for those skilled in the art.
Claims (10)
1. The utility model provides a wireless Wen Zhenchuan sensor, includes sensor shell (1), vibration perception module (3), temperature perception module (4), sensor signal board (6), sensor circuit board (7) and antenna (9) all are located in sensor shell (1), its characterized in that:
the vibration sensing module (3) is fixed on the upper surface of the sensor signal board (6);
the temperature sensing module (4) comprises a temperature sensing probe which is positioned on the lower surface of the sensor signal board (6), and the temperature sensing probe is embedded in the bottom of the sensor shell (1) and is close to the outer surface of the bottom of the sensor shell (1);
the sensor circuit board (7) is arranged above the sensor signal board (6), and the sensor circuit board (7) is connected with the sensor signal board (6) through a pin header;
the sensor circuit main board (7) comprises a PCB substrate (71), a wireless data transceiver module (72) and electronic components; the wireless data transceiver module (72) is arranged at the upper part of the PCB substrate (71) and is electrically connected with the antenna (9); the electronic components are arranged on the lower portion of the PCB substrate (71), and the electronic components comprise a microcontroller (73), an AD conversion chip (74) and an instrument operational amplifier (75).
2. The wireless Wen Zhenchuan sensor of claim 1, further comprising an upper cover (2), the top opening of the sensor housing (1); the top of the outer wall of the sensor shell (1) and the bottom of the inner wall of the upper cover (2) are respectively provided with mutually meshed threads.
3. The wireless Wen Zhenchuan sensor according to claim 1, wherein a groove is formed in the bottom of the sensor housing (1), a magnet (5) is mounted in the groove, and the outer end surface of the magnet (5) is flush with the outer surface of the bottom of the sensor housing (1).
4. The wireless Wen Zhenchuan sensor according to claim 1, wherein the sensor signal board (6) is fixed in the sensor housing (1) by a fixing base (10);
the sensor signal board (6) both sides are offered the fixed orifices respectively, fixing base (10) are two altogether and all offer the screw on it, the fixed orifices with the screw passes through screw (11) and connects.
5. The wireless Wen Zhenchuan sensor of claim 1, further comprising a battery (8), the electronic component further comprising an LDO linear power chip (76); the LDO linear power chip (76) is electrically connected with the pin header, the wireless data transceiver module (72), the battery (8) and other electronic components.
6. The wireless Wen Zhenchuan sensor according to claim 5, wherein a battery support plate (12) is disposed inside the sensor housing (1), the battery support plate (12) is connected to the sensor circuit board (7), two vertical plates (13) are disposed on both sides of the upper surface of the battery support plate (12), the battery (8) is disposed between the two vertical plates (13), and the side portion of the battery (8) is in contact with the vertical plates (13).
7. A wireless monitoring system based on the wireless Wen Zhen sensor, comprising:
the temperature sensing module is used for collecting temperature signals of the tested equipment and sending the temperature signals to the signal conditioning circuit;
the vibration sensing module is used for collecting vibration signals of the tested equipment and sending the vibration signals to the signal conditioning circuit;
the signal conditioning circuit is used for receiving the temperature signal and the vibration signal, filtering and amplifying the received signals, and then sending the processed signals to the AD acquisition module;
the AD acquisition module is used for receiving the processed signals, converting the processed signals into digital signals and then sending the digital signals to the microcontroller;
the microcontroller is used for receiving the digital signals, converting the digital signals into corresponding acceleration values and temperature values according to the linear relation between the voltage values and the vibration acceleration values or the temperature values, and then transmitting the acceleration values and the temperature values to the wireless data receiving and transmitting module;
and the wireless data receiving and transmitting module is used for receiving the acceleration value and the temperature value and transmitting the acceleration value and the temperature value to the upper computer system.
8. A method of periodically operating a wireless monitoring system, comprising:
s1: the AD acquisition module converts analog quantity signals acquired by the vibration sensing module and the temperature sensing module into digital quantity signals, and the AD acquisition module sends the digital quantity signals to the microcontroller;
s2: the microcontroller calculates a voltage value of a vibration signal according to the voltage reference and the bit number of the AD acquisition module, and calculates a vibration acceleration value according to the linear relation between the voltage value and the acceleration of the vibration sensing module; similarly, calculating a temperature value;
s3: the microcontroller packages and encapsulates the vibration acceleration value and the temperature value according to a wireless transmission protocol format, calls a wireless data transmission function and transmits a first data packet containing the vibration acceleration value and the temperature value to the wireless data transceiver module; the wireless data receiving and transmitting module transmits the first data packet to a gateway of a wireless network; the gateway sends the first data packet to an upper computer system;
s4: the upper computer system packages and encapsulates the cycle time modification instruction and then sends the cycle time modification instruction to the wireless data transceiver module; the main program of the microcontroller judges whether the wireless data transceiver module receives a second data packet containing a periodical time modification instruction, if yes, the step S5 is executed, and if not, the step S6 is executed;
s5: the main program carries out data processing on the second data packet, and the main program assigns the processed data to a cycle time set value T2;
s6: the main program clears the current value T1 of the period time, and invokes a sleep instruction to enable the microcontroller to enter a sleep state;
s7: after the microcontroller enters a sleep state, the timer is interrupted to keep in a working state, a program statement of T1=T1+1 is executed in a timer interruption function, whether T1 is equal to T2 is judged, if yes, a step S8 is executed;
s8: and the main program calls a wake-up instruction to enable the microcontroller to enter a working state, and steps S1-S3 are executed.
9. The method of claim 8, wherein the peripheral module is configured as a serial port, a timer, an SPI communication interface, or an I2C communication interface during the program initialization.
10. The method of claim 8, wherein when the main program performs data processing on the second data packet, the data processing is configured such that the main program unpacks the second data packet according to a wireless transmission protocol format.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118190067A (en) * | 2024-03-12 | 2024-06-14 | 苏州市职业大学 | An intelligent sensor for autonomously monitoring temperature and vibration in multiple time periods |
| CN119223368A (en) * | 2024-11-29 | 2024-12-31 | 济南嘉宏科技有限责任公司 | A wireless temperature and vibration monitoring system and control method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118190067A (en) * | 2024-03-12 | 2024-06-14 | 苏州市职业大学 | An intelligent sensor for autonomously monitoring temperature and vibration in multiple time periods |
| CN118190067B (en) * | 2024-03-12 | 2024-09-20 | 苏州市职业大学 | Multi-period autonomous monitoring temperature-vibration intelligent sensor |
| CN119223368A (en) * | 2024-11-29 | 2024-12-31 | 济南嘉宏科技有限责任公司 | A wireless temperature and vibration monitoring system and control method |
| CN119223368B (en) * | 2024-11-29 | 2025-06-06 | 济南嘉宏科技有限责任公司 | A wireless temperature and vibration monitoring system and control method |
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