CN117626201A - DLC sputtering plasma coating process and coating device - Google Patents
DLC sputtering plasma coating process and coating device Download PDFInfo
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- CN117626201A CN117626201A CN202311644806.XA CN202311644806A CN117626201A CN 117626201 A CN117626201 A CN 117626201A CN 202311644806 A CN202311644806 A CN 202311644806A CN 117626201 A CN117626201 A CN 117626201A
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- 238000000576 coating method Methods 0.000 title claims abstract description 50
- 239000011248 coating agent Substances 0.000 title claims abstract description 39
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 19
- 238000005507 spraying Methods 0.000 claims abstract description 30
- 230000007246 mechanism Effects 0.000 claims description 48
- 238000000034 method Methods 0.000 claims description 30
- 230000008569 process Effects 0.000 claims description 28
- 238000007747 plating Methods 0.000 claims description 26
- 238000013519 translation Methods 0.000 claims description 26
- 230000007306 turnover Effects 0.000 claims description 20
- 230000008878 coupling Effects 0.000 claims description 15
- 238000010168 coupling process Methods 0.000 claims description 15
- 238000005859 coupling reaction Methods 0.000 claims description 15
- 229920000742 Cotton Polymers 0.000 claims description 11
- 238000004140 cleaning Methods 0.000 claims description 11
- 238000002347 injection Methods 0.000 claims description 11
- 239000007924 injection Substances 0.000 claims description 11
- 238000009434 installation Methods 0.000 claims description 7
- 239000007921 spray Substances 0.000 claims description 5
- 230000009471 action Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 17
- 238000013461 design Methods 0.000 abstract description 7
- 238000009713 electroplating Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007888 film coating Substances 0.000 description 2
- 238000009501 film coating Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000005381 potential energy Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0605—Carbon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention belongs to the technical field of plasma coating, in particular to a DLC sputtering plasma coating process and a coating device, comprising a vacuum chamber, wherein a fixing frame is arranged at the top end of the vacuum chamber, a spraying assembly is fixedly connected at the bottom end of the fixing frame, the spraying assembly comprises a spraying source and a target, a rotating frame is rotatably connected inside the vacuum chamber and below the spraying assembly, the rotating frame is driven by an external servo motor, a plurality of mounting grooves are uniformly formed in the outer part of the rotating frame, an elastic limiting frame is arranged outside the mounting grooves, a connecting frame is inserted in the rotating frame, a plurality of biasing electrodes are fixedly connected in the connecting frame, and the biasing electrodes are in one-to-one correspondence with the mounting grooves; through the design of the power supply assembly, other bias electrodes in the rotating frame do not need to be supplied with power at any time, the effect of electroplating on the workpiece to be processed is achieved, and the purpose of saving energy is achieved.
Description
Technical Field
The invention belongs to the technical field of plasma coating, and particularly relates to a DLC sputtering plasma coating process and a DLC sputtering plasma coating device.
Background
DLC is an abbreviation of Diamond-like carbon, is translated into Chinese "Diamond-like carbon", DLC coating is one of various coating materials used in PVD electroplating treatment, and DLC vacuum coating has the advantages of high hardness, high resistivity, good optical performance and the like, so that the DLC vacuum coating has been widely applied.
PVD is a modern electroplating technology, and magnetron sputtering is one of PVD technologies, and has the advantages of simple equipment, easy control, large coating area, strong adhesion and the like, and the magnetron sputtering technology is to improve the plasma density by introducing a magnetic field on the surface of a target cathode and utilizing the constraint of the magnetic field on charged particles so as to increase the sputtering rate.
In the prior art, when DLC film coating is performed by a magnetron sputtering technology, a roller type is often adopted, namely, a substrate is arranged on a roller, the substrate is coated with the film by rotating the roller and rotating the roller to rotate and circulate along with the roller to pass through a target material, so that a bias system is required to be formed by always supplying power to the interior of the roller by using a direct current power supply, namely, workpieces which are not in a film coating working interval are required to be always supplied with power, and the bias system is a large loss for enterprise energy.
Therefore, the invention provides a DLC sputtering plasma coating process and a DLC sputtering plasma coating device.
Disclosure of Invention
In order to overcome the deficiencies of the prior art, at least one technical problem presented in the background art is solved.
The technical scheme adopted for solving the technical problems is as follows: the invention discloses a DLC sputtering plasma coating device, which comprises a vacuum chamber, wherein the top end of the vacuum chamber is provided with a fixing frame, the bottom end of the fixing frame is fixedly connected with a spraying assembly, the spraying assembly comprises a spraying source and a target, a rotating frame is rotatably connected to the inside of the vacuum chamber and positioned below the spraying assembly, the rotating frame is driven by an external servo motor, a plurality of mounting grooves are uniformly formed in the outside of the rotating frame, an elastic limiting frame is arranged in the outside of the mounting grooves, a connecting frame is inserted in the rotating frame, a plurality of biasing electrodes are fixedly connected in the connecting frame, the biasing electrodes are in one-to-one correspondence with the mounting grooves, negative bias can be generated when the spraying assembly is opposite to the biasing electrodes, a compact film layer can be plated on the surface of a workpiece to be plated, and a power supply assembly is arranged in the rotating frame and is used for supplying power to the biasing electrodes corresponding to the mounting grooves just opposite to the spraying assembly.
Preferably, the power supply assembly comprises a limit rod, the limit rod is inserted in the connecting frame and is rotationally connected with the connecting frame, a guide rod is slidably connected in the interior of the limit rod and is located under the injection assembly, a conductive plate is fixedly connected to the top end of the guide rod, a power supply core is inserted in the interior of the limit rod, the power supply core is far away from one end of the rotating frame, an inserting seat is arranged at one end of the power supply core, an installation groove is formed in the interior of the limit rod and between the vacuum chamber and the power supply core, a reset spring is fixedly connected in the installation groove, a wire is fixedly connected between the guide rod and the power supply core, the wire is communicated with the conductive plate, the length of the wire is in interference arrangement, a plurality of clamping grooves in one-to-one correspondence with the bias electrodes are formed in the interior of the connecting frame, conductive blocks in communication with the bias electrodes are arranged in the clamping grooves, and chamfering is formed in both sides of the conductive plate and the clamping grooves.
Preferably, cleaning cotton is installed on the inner wall of the connecting frame and between the clamping grooves, and the length of the cleaning cotton is matched with the length of the conducting plate.
Preferably, a plate turnover mechanism is arranged in the vacuum chamber and below the rotating frame, and the plate turnover mechanism is used for turning over a product plated with one-side coating to realize double-side plating.
Preferably, the panel turnover mechanism comprises a panel turnover mechanism and a rotating mechanism, the panel turnover mechanism is used for conveying a product coated with a surface coating to the rotating mechanism, the rotating mechanism comprises a limiting frame, two sides of the limiting frame are rotationally connected with the inner wall of a vacuum chamber through connecting rods, a driving wheel is fixedly connected to the outer side of one side of the rotating frame, which is far away from an inserting seat, a driven wheel is meshed with the bottom of the driving wheel, the driven wheel is fixedly connected with the connecting rods, through grooves are formed in two sides of the limiting frame, limiting assemblies are arranged at four corners of the limiting frame, the limiting assemblies are used for preventing workpieces from falling when the rotating mechanism performs panel turnover operation, and a pushing frame is fixedly connected to the inner side of the vacuum chamber and positioned under the limiting frame and comprises a cylinder and a tray arranged on the cylinder.
Preferably, the board connecting mechanism comprises a pair of arc bracing piece, arc bracing piece top surface rigid coupling has the sucking disc, arc bracing piece bottom sliding connection has arc hydraulic pressure seat, board connecting mechanism is still including installing a plurality of electronic push rods inside the rotating turret, and is a plurality of electronic push rods and mounting groove one-to-one, a pair of arc bracing piece outside all is provided with translation subassembly, translation subassembly is used for with work piece propelling movement to rotary mechanism inside.
Preferably, the translation subassembly includes the mount pad, one side rigid coupling that the mount pad is close to the locating rack has the electric rail, the inside sliding connection of electric rail has the electric slider, electric slider top rigid coupling has the translation push pedal, electric rail both sides all are provided with the guide rail, the inside rotation of guide rail is connected with a plurality of leading wheels, guide rail one end and mount pad rigid coupling.
Preferably, a guide frame is arranged on one side of the guide rail far away from the electric guide rail, and a support rod is fixedly connected between the guide frame and the bottom surface of the inner wall of the vacuum chamber.
Preferably, the limiting assembly comprises a control box, and a horizontal electric push plate and a vertical electric push plate are fixedly connected between the control box and the limiting frame.
A DLC sputter plasma coating process, which performs a coating operation using a DLC sputter plasma coating apparatus as described in any one of the above, the process comprising the steps of:
s1, sequentially placing workpieces to be processed in the mounting groove, and limiting the workpieces by an elastic limiting frame;
s2, the rotating frame rotates to convey the workpiece to the position right below the spraying assembly;
s3, the power supply assembly operates to supply power to the bias electrode positioned right below the spraying assembly, and the spraying assembly is opposite to the bias electrode at the moment;
s4, negative bias is generated between the spray assembly and the bias electrode, a compact film layer is plated on the surface of the workpiece to be plated, and coating plating is completed;
s5, the rotating frame rotates again to repeat the steps until all the workpieces are plated.
The beneficial effects of the invention are as follows:
1. according to the DLC sputtering plasma coating process and the DLC sputtering plasma coating device, other bias electrodes in the rotating frame do not need to be powered at any time through the design of the power supply assembly, so that the effect of electroplating on only workpieces to be processed is achieved, and the purpose of saving energy is achieved.
2. According to the DLC sputtering plasma coating process and the coating device, the connecting frame is rotationally connected with the limiting rod, so that the limiting rod cannot rotate along with the connecting frame in the rotating process, and the special power supply effect on a machined part is realized by arranging the conducting plate on the spraying assembly.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a cross-sectional view of a vacuum chamber according to the present invention;
FIG. 3 is a schematic view of a turret structure according to the present invention;
FIG. 4 is a cross-sectional view of a turret according to the present invention;
FIG. 5 is an enlarged view of a portion of FIG. 4A in accordance with the present invention;
FIG. 6 is a schematic view of a turret structure according to another embodiment of the invention;
FIG. 7 is a schematic view of an arc-shaped support bar according to the present invention;
FIG. 8 is a schematic view of a limiting frame structure in the present invention;
fig. 9 is a process flow diagram of the present invention.
In the figure: 1. a vacuum chamber; 2. a fixing frame; 3. a jetting assembly; 4. a rotating frame; 5. a connecting frame; 6. a limit rod; 7. a power socket; 8. a power supply core; 9. a conductive plate; 10. a bias electrode; 11. a guide rod; 12. a return spring; 13. a wire; 14. cleaning cotton; 15. an elastic limit frame; 16. a driving wheel; 17. driven wheel; 18. a limiting frame; 19. a control box; 20. a horizontal electric push plate; 21. a vertical electric push plate; 22. a push frame; 23. a suction cup; 24. an arc-shaped supporting rod; 25. an arc hydraulic seat; 26. a mounting base; 27. an electrical rail; 28. translating the push plate; 29. a connecting rod; 30. a guide rail; 31. a guide wheel; 32. a guide frame; 33. and (5) an electric push rod.
Detailed Description
The invention is further described in connection with the following detailed description in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
As shown in fig. 1 to 3, the DLC sputtering plasma coating process and coating device according to the embodiments of the invention include a vacuum chamber 1, a fixing frame 2 is mounted at the top end of the vacuum chamber 1, a spraying component 3 is fixedly connected at the bottom end of the fixing frame 2, the spraying component 3 includes a spraying source and a target, a rotating frame 4 is rotatably connected below the spraying component 3 in the vacuum chamber 1, the rotating frame 4 is driven by an external servo motor, a plurality of mounting grooves are uniformly formed in the outer portion of the rotating frame 4, an elastic limiting frame 15 is arranged in the outer portion of the mounting groove, a connecting frame 5 is inserted in the inner portion of the rotating frame 4, a plurality of bias electrodes 10 are fixedly connected in the inner portion of the connecting frame 5, and when a plurality of bias electrodes 10 are in one-to-one correspondence with the mounting grooves, the spraying component 3 is opposite to the bias electrodes 10, a power supply component is arranged in the rotating frame 4 for supplying power to the corresponding bias electrodes 10 which are opposite to the surface of a workpiece to be plated; during operation, the vacuum pump is communicated with the inside of the vacuum chamber 1, so that the inside of the vacuum chamber 1 is vacuumized, when the vacuum chamber is specifically used, a workpiece to be processed in the vacuum chamber 1 is firstly placed in the mounting groove in sequence and is limited by the elastic limiting frame 15, the elastic limiting frame 15 is made of rubber, the size of the elastic limiting frame is slightly smaller than that of the workpiece to be processed, the friction force provided by the workpiece in the process of rotating along with the rotating frame 4 is required to be ensured to be enough to support the workpiece to not fall, the rotating frame 4 starts to rotate, the workpiece is sequentially sent to the position right below the spraying component 3, at the moment, the power supply component in the rotating frame 4 starts to operate, so that power is supplied to the biasing electrode 10 positioned right below the spraying component 3, negative bias voltage is generated between the spraying component 3 and the biasing electrode 10, coating plating is realized, and through the design of the power supply component, the other biasing electrode 10 in the rotating frame 4 does not need to be supplied with power at any time, and the purpose of carrying out electroplating on the workpiece to be processed only is realized, and the purpose of saving energy is achieved.
As shown in fig. 2 to 5, the power supply assembly comprises a limit rod 6, the limit rod 6 is inserted into the connecting frame 5 and is rotationally connected with the connecting frame 5, a guide rod 11 is slidingly connected under the injection assembly 3 and inside the limit rod 6, a conductive plate 9 is fixedly connected to the top end of the guide rod 11, a power supply core 8 is inserted into the limit rod 6, a power socket 7 is installed at one end, far away from the rotating frame 4, of the power supply core 8, an installation groove is formed between the vacuum chamber 1 and the power supply core 8 and inside the limit rod 6, a return spring 12 is fixedly connected to the outside of the guide rod 11 and inside of the installation groove, a wire 13 is fixedly connected between the guide rod 11 and the power supply core 8, the wire 13 is communicated with the conductive plate 9, a plurality of clamping grooves corresponding to the bias electrodes 10 one by one are formed in the inside of the connecting frame 5, the clamping grooves are matched with the conductive plate 9, a conductive block communicated with the bias electrodes 10 is installed inside the clamping grooves, and chamfer angles are formed on both sides of the conductive plates 9;
in operation, the reason that the rotary plating device integrally supplies power to the rotary mechanism is mainly to facilitate the wiring of the circuit, if the power supply circuit is supplied to each plating area independently, the power supply circuit is very easy to wind due to rotation, but in the embodiment of the invention, the connecting frame 5 is rotationally connected with the limiting rod 6, so that the limiting rod 6 can not rotate along with the connecting frame 5 in the rotating process, the clamping groove in the connecting frame 5 rotates in the rotating process, when the bias electrode 10 to be processed rotates to the position right below the injection assembly 3, the clamping groove is positioned right above the guide rod 11 at the moment, the elastic potential energy of the reset spring 12 is set in advance, the reset spring 12 is reset to push the guide rod 11 out of the limiting rod 6, and then the conductive plate 9 is driven to be in contact with the conductive block in the clamping groove, therefore, the bias electrode 10 positioned under the spray assembly 3 is electrified, and the bias electrodes 10 at other parts cannot be electrified because the conductive plate 9 is not arranged, so that the effect of electrifying a single bias electrode 10 is realized, and the power supply core 8 is arranged in the limit rod 6, the power supply is carried out by connecting an external power supply through the power socket 7 at the end part of the power supply core 8, so that the power supply is more stable, the conductive plate 9 is not required to rotate in the power supply process, meanwhile, the conductive plate 9 and the clamping grooves are arranged in a chamfering way at two sides of the clamping grooves, after the machining is finished, the conductive plate 9 and the clamping grooves can be more easily separated when the connecting frame 5 drives the clamping grooves to rotate, the conversion of a power supply object is facilitated, meanwhile, the length interference setting of the conductive wire 13 can effectively prevent the conductive rod 11 from excessively dragging the conductive wire 13 in the up-down reciprocating motion process, damaging the wires 13 causes problems in the power supply, improving the stability of the device.
As shown in fig. 5, cleaning cotton 14 is installed on the inner wall of the connecting frame 5 and between the plurality of clamping grooves, and the length of the cleaning cotton 14 is adapted to the length of the conductive plate 9; during operation, in the rotating process of the connecting frame 5, the cleaning cotton 14 in the connecting frame can rotate along with the connecting frame, and the cleaning cotton 14 can clean the surface of the conductive plate 9 in the rotating process, so that the situation of poor contact between the conductive plate 9 and the conductive column is reduced, and the running stability of equipment is improved.
As shown in fig. 1 to 8, a plate turnover mechanism is installed inside the vacuum chamber 1 and below the rotating frame 4, and the plate turnover mechanism is used for turning over a product plated with one-side coating to realize double-side plating; when the double-sided plating device is in use, a workpiece is often required to be plated on both sides, after one side is plated, the traditional plating device is required to stop the machine to take out the workpiece and turn over the workpiece, and then the workpiece is plated again, so that the operation is time-consuming and labor-consuming, and meanwhile, the interior of the vacuum chamber 1 is required to be vacuumized for the second time, so that the energy loss is large.
As shown in fig. 6 to 7, the panel turnover mechanism comprises a panel turnover mechanism and a rotating mechanism, the panel turnover mechanism is used for conveying a product coated with a surface coating to the rotating mechanism, the rotating mechanism comprises a limit frame 18, two sides of the limit frame 18 are rotationally connected with the inner wall of a vacuum chamber 1 through a connecting rod 29, a driving wheel 16 is fixedly connected to the outer part of one side of the rotating frame 4, which is far away from a power socket 7, a driven wheel 17 is meshed with the bottom of the driving wheel 16, the driven wheel 17 is fixedly connected with the connecting rod 29, through grooves are formed in two sides of the limit frame 18, limit components are mounted at four corners of the limit frame 18, the limit components are used for preventing workpieces from falling when the rotating mechanism performs panel turnover operation, a pushing frame 22 is fixedly connected to the inner part of the vacuum chamber 1 and is positioned under the limit frame 18, and the pushing frame 22 comprises a cylinder and a tray mounted on the cylinder;
during working, it should be noted that, in the embodiment of the invention, a plurality of mounting grooves can be formed according to requirements, six in the embodiment is taken as an example, during specific plating, the servo motor controls the rotating frame 4 to rotate for one sixth of a circle each time, so as to realize the switching of workpieces, when the first workpiece is plated and rotates for one third of a circle, the plate turnover mechanism operates, firstly, the plate receiving structure sends the workpiece into the limiting frame 18, then the limiting assembly limits the limiting frame 18, the above process is synchronous with the plating process of the workpiece and is completed before the plating of the workpiece is completed, after the plating of a new workpiece is completed, the servo motor controls the rotating frame 4 to rotate for one sixth of a circle again, during the process, the driving wheel 16 simultaneously drives the driven wheel 17 to rotate, and the sizes of the driving wheel 16 and the driven wheel 17 are set, when the driving wheel 16 rotates for one sixth of a circle, the driven wheel 17 just rotates for one circle, so the driven wheel 17 at the moment drives the connecting rod 29 to rotate, the connecting rod 29 rotates to drive the limiting frame 18 to rotate, namely the limiting frame 18 at the moment drives the workpiece to rotate for one circle, so that the plated surface faces upwards, at the moment, the empty mounting groove is just above the limiting frame 18, at the moment, the limiting assembly does not limit the workpiece any more, meanwhile, the push frame 22 moves, the air cylinder pushes the tray to drive the workpiece to move and push the workpiece into the mounting groove and is limited by the elastic limiting frame 15, one surface which is not plated faces one side far from the rotating frame 4, in the process, the plate connecting mechanism synchronously operates, the cycle can be completed, the above steps are repeated until all the workpieces are plated on both sides, so that the effect of starting all the workpieces on one time is achieved, it should be noted that the parameters between the structural members can be adjusted according to the number of the actual mounting slots to achieve the above effects.
As shown in fig. 6 to 7, the plate-receiving mechanism includes a pair of arc-shaped support rods 24, the top surfaces of the arc-shaped support rods 24 are fixedly connected with suckers 23, the bottom ends of the arc-shaped support rods 24 are slidably connected with arc-shaped hydraulic seats 25, the plate-receiving mechanism further includes a plurality of electric push rods 33 installed inside the rotating frame 4, the plurality of electric push rods 33 are in one-to-one correspondence with the installation grooves, and translation assemblies are arranged outside the pair of arc-shaped support rods 24 and used for pushing workpieces into the rotating mechanism;
when the work piece of one side of will plating breaks away from the rotating frame 4, at first electronic push rod 33 moves to release the inside of work piece from rotating frame 4, it is to be noted that, the setting position of electronic push rod 33 needs to depend on the inclination of sucking disc 23, electric push rod 33 should not set up in the central point department of mounting groove promptly, like this, the work piece can receive a slope power when ejecting the work piece by electronic push rod 33, and the bottom of work piece can not break away from under the spacing of elasticity spacing frame 15, so the work piece can break away from the inside of rotating frame 4 in a slope gesture at this moment, it is ensured that the position of adjusting electronic push rod 33 makes this slope's gesture and the inclination looks adaptation of sucking disc 23, thereby make sucking disc 23 can steadily contact with the work piece, and adsorb the work piece, then under the effect of work piece dead weight, sucking disc 23 can drive arc bracing piece 24 and extrude arc hydraulic seat 25, thereby arc 24 can shrink into the inside of arc hydraulic seat 25 and, in this process sucking disc 23 can drive the work piece and fall on the translation subassembly, the work piece can be followed by translation subassembly, the work piece can be peeled off from the inside of rotating mechanism to one side of work piece can reach one side of plating through the inside of rotating frame 4.
As shown in fig. 6 to 7, the translation assembly includes a mounting seat 26, one side of the mounting seat 26, which is close to the limiting frame 18, is fixedly connected with an electric rail 27, an electric slider is slidably connected inside the electric rail 27, a translation push plate 28 is fixedly connected to the top of the electric slider, guide rails 30 are disposed on both sides of the electric rail 27, a plurality of guide wheels 31 are rotatably connected inside the guide rails 30, and one end of the guide rail 30 is fixedly connected with the mounting seat 26;
when the workpiece falls onto the translation assembly, the workpiece is supported by the electric guide rail 27 and the guide rail 30, the electric slide block is started at the moment to drive the translation push plate 28 to move along the electric guide rail 27, the translation push plate 28 moves to be in contact with the workpiece and push the workpiece to slide after being separated from the sucker 23 until the sucker 23 slides into the limit frame 18 from the through groove at the side part of the limit frame 18, the next turning plate operation is performed, the guide wheel 31 is designed to facilitate the sliding of the workpiece, the design of the mounting seat 26 and the guide rail 30 should not contact with the limit frame 18, enough overturning gaps of the limit frame 18 should be reserved between the mounting seat 26 and the guide rail 30 and the bottom surface of the through groove of the limit frame 18, and meanwhile, the top surfaces of the mounting seat 26 and the guide rail 30 should be matched with the bottom surface of the through groove of the limit frame 18 so as to ensure that the workpiece can slide into the limit frame 18.
As shown in fig. 6 to 7, a guide frame 32 is arranged on one side of the guide rail 30 far away from the electric guide rail 27, and a support rod is fixedly connected between the guide frame 32 and the bottom surface of the inner wall of the vacuum chamber 1; during operation, through setting up the leading truck 32 in leading truck 30 both sides, can play the effect of direction to the slip of work piece, through adjusting the shape of leading truck 32, make its terminal shape and the shape looks adaptation of spacing 18 logical groove to the effect that the work piece of being convenient for slides into inside the spacing 18 has been reached.
As shown in fig. 8, the limiting assembly comprises a control box 19, wherein a horizontal electric push plate 20 and a vertical electric push plate 21 are fixedly connected between the control box 19 and the limiting frame 18; during operation, through setting up horizontal electric push plate 20 and vertical electric push plate 21, at the in-process that the work piece entered into spacing 18 inside, horizontal electric push plate 20 that is located the bottom, vertical electric push plate 21 that keeps away from translation subassembly one side stretch out in step, support and spacing the work piece, after the work piece gets into spacing 18 inside completely, horizontal electric push plate 20 that is located the top surface, vertical electric push plate 21 that is close to translation subassembly one side stretch out in step, thereby lock the work piece, after the upset is accomplished, horizontal electric push plate 20 that is located the top surface withdraw earlier, push plate 22 is with the inside back of the ejecting spacing 18 of work piece, vertical electric push plate 21 that is close to translation subassembly one side withdraw, thereby be convenient for next work piece get into spacing 18 inside, so just reach the spacing effect to the work piece, provide the basis for the upset of work piece.
As shown in fig. 9, a DLC sputtering plasma coating process for coating an object with a DLC sputtering plasma coating apparatus as described in any one of the above, comprising the steps of:
s1, sequentially placing workpieces to be processed in the mounting groove, and limiting the workpieces by an elastic limiting frame 15;
s2, rotating the rotating frame 4 to convey the workpiece to the position right below the spraying assembly 3;
s3, the power supply assembly operates to supply power to the bias electrode 10 positioned right below the spraying assembly 3, and the spraying assembly 3 is opposite to the bias electrode 10 at the moment;
s4, negative bias is generated between the spray assembly 3 and the bias electrode 10, a compact film layer is plated on the surface of the workpiece to be plated, and coating plating is completed;
s5, the rotating frame 4 rotates again to repeat the steps until all the workpieces are plated.
Working principle: the inside of the vacuum chamber 1 is communicated with an external vacuum pump for vacuumizing the inside of the vacuum chamber 1, when the vacuum chamber 1 is specifically used, a workpiece to be processed in the vacuum chamber 1 is sequentially placed in an installation groove and is limited by an elastic limiting frame 15, the elastic limiting frame 15 is made of rubber, the size of the elastic limiting frame is slightly smaller than that of the workpiece to be processed, the friction force provided by the workpiece in the process of rotating along with a rotating frame 4 is required to be ensured to be enough to support the workpiece without dropping, the rotating frame 4 starts to rotate, the workpiece is sequentially sent to the position right below an injection assembly 3, at the moment, a power supply assembly in the rotating frame 4 starts to operate, so that power is supplied to a bias electrode 10 positioned right below the injection assembly 3, negative bias is generated between the injection assembly 3 and the bias electrode 10, coating plating is realized, and other bias electrodes 10 in the rotating frame 4 do not need to be supplied with power at any time through the design of the power supply assembly, so that the effect of plating of the workpiece to be processed is realized, and the purpose of saving energy is achieved;
the reason that the rotary plating device adopts the whole power supply of the rotary mechanism is mainly to facilitate the wiring of the circuit, if the power supply is independently supplied to each plating area, the power supply circuit is very easy to wind due to rotation, but the embodiment of the invention adopts the mode that the connecting frame 5 is rotationally connected with the limiting rod 6, so that the limiting rod 6 can not rotate along with the connecting frame 5 in the rotating process, the clamping groove in the connecting frame 5 rotates in the rotating process, when the bias electrode 10 to be processed rotates to the position right below the spraying assembly 3, the clamping groove is just above the guide rod 11 at the moment, the elastic potential energy of the reset spring 12 is arranged in advance, so that the guide rod 11 is in an energy storage state in the initial state, and the reset spring 12 is reset to push out of the limiting rod 6, so that the conductive plate 9 is driven to be contacted with the conductive block in the clamping groove, therefore, the bias electrode 10 positioned under the spray assembly 3 is electrified, and the bias electrodes 10 at other parts cannot be electrified because the conductive plate 9 is not arranged, so that the effect of electrifying a single bias electrode 10 is realized, and the power supply core 8 is arranged in the limit rod 6, the power supply is carried out by connecting an external power supply through the power socket 7 at the end part of the power supply core 8, so that the power supply is more stable, the conductive plate 9 is not required to rotate in the power supply process, meanwhile, the conductive plate 9 and the clamping grooves are arranged in a chamfering way at two sides of the clamping grooves, after the machining is finished, the conductive plate 9 and the clamping grooves can be more easily separated when the connecting frame 5 drives the clamping grooves to rotate, the conversion of a power supply object is facilitated, meanwhile, the length interference setting of the conductive wire 13 can effectively prevent the conductive rod 11 from excessively dragging the conductive wire 13 in the up-down reciprocating motion process, damaging the wire 13 causes problems in power supply, improving the stability of the device;
in the rotating process of the connecting frame 5, the cleaning cotton 14 in the connecting frame can rotate along with the connecting frame, and the cleaning cotton 14 can clean the surface of the conducting plate 9 in the rotating process, so that the situation of poor contact between the conducting plate 9 and the conducting column is reduced, and the running stability of equipment is improved;
the workpiece is often plated on two sides, after one side is plated, the traditional plating equipment needs to stop the machine to take out the workpiece and turn over the workpiece, and then the workpiece is plated again, so that the operation is time-consuming and labor-consuming, and meanwhile, the interior of the vacuum chamber 1 is required to be vacuumized for the second time, so that the energy loss is high;
it should be noted that, in the embodiment of the present invention, a plurality of mounting slots may be formed according to the requirement, in the embodiment, six mounting slots are taken as an example, during specific plating, the servo motor controls the rotating frame 4 to rotate for one sixth of a turn at a time, so as to realize the switching of workpieces, when the first workpiece is plated and rotated for one third of a turn, the plate turnover mechanism operates, firstly, the plate turnover mechanism sends the workpiece to the inside of the limiting frame 18, then the limiting assembly limits the limiting frame 18, the above process is synchronous with the plating process of the workpiece, and is completed before the plating of the workpiece is completed, after the plating of a new workpiece is completed, the servo motor controls the rotating frame 4 to rotate for one sixth of a turn again, in this process, the driving wheel 16 drives the driven wheel 17 to rotate at the same time, and by setting the sizes of the driving wheel 16 and the driven wheel 17, when the driving wheel 16 rotates for one sixth of a circle, the driven wheel 17 just rotates for one circle, so the driven wheel 17 at the moment drives the connecting rod 29 to rotate, the connecting rod 29 rotates to drive the limiting frame 18 to rotate, namely, the limiting frame 18 at the moment drives the workpiece to rotate for one circle, so that the plated surface faces upwards, at the moment, the empty mounting groove is just above the limiting frame 18, at the moment, the limiting assembly does not limit the workpiece any more, meanwhile, the push frame 22 moves, the air cylinder pushes the tray to drive the workpiece to move and push the workpiece into the mounting groove and is limited by the elastic limiting frame 15, one surface which is not plated faces one side far away from the rotating frame 4, in the process, the plate connecting mechanism synchronously operates, the cycle can be completed, the above steps are repeated until all the workpieces are plated on both sides, the effect of starting all the workpieces on one occasion is achieved, and the requirement is that, parameters among the structural members can be adjusted according to the number of the actual mounting grooves so as to achieve the effects;
when a workpiece on one surface to be plated is required to be separated from the rotating frame 4, firstly, the electric push rod 33 operates so as to push the workpiece out of the rotating frame 4, and it is required to be explained that the setting position of the electric push rod 33 is required to be determined according to the inclination angle of the sucker 23, namely, the electric push rod 33 should not be arranged at the central position of the mounting groove, so that when the electric push rod 33 pushes out the workpiece, the workpiece can be subjected to an inclined force, the bottom of the workpiece can not be separated under the limit of the elastic limit frame 15, and therefore, the workpiece can be separated from the rotating frame 4 in an inclined posture, and the situation that the position of the electric push rod 33 is adjusted so that the inclined posture is matched with the inclination angle of the sucker 23 is ensured, so that the sucker 23 can be stably contacted with the workpiece and the workpiece is adsorbed, and then under the action of the dead weight of the workpiece, the sucker 23 can drive the arc-shaped support rod 24 to squeeze the arc-shaped hydraulic seat 25, and in the arc-shaped support rod 24 can retract into the arc-shaped hydraulic seat 25, in the process, the sucker 23 can drive the workpiece to fall onto the translation assembly, and finally the workpiece can be translated from the rotating assembly to the rotating mechanism, and the workpiece can be automatically stripped from the rotating frame 4 through the rotating mechanism;
when a workpiece falls onto the translation assembly, the workpiece is supported by the electric guide rail 27 and the guide rail 30, at the moment, the electric slide block is started to drive the translation push plate 28 to move along the electric guide rail 27, the translation push plate 28 moves to be in contact with the workpiece and pushes the workpiece to slide after being separated from the sucker 23 until the sucker 23 slides into the limit frame 18 from a through groove at the side part of the limit frame 18, so that the next turning plate operation is performed, the design of the guide wheel 31 can facilitate the sliding of the workpiece, and the design of the mounting seat 26 and the guide rail 30 should not contact with the limit frame 18, a gap enough for the turnover of the limit frame 18 should be reserved between the mounting seat 26 and the guide rail 30 and the bottom surface of the through groove of the limit frame 18 are matched, so that the workpiece can slide into the limit frame 18;
the guide frames 32 are arranged on the two sides of the guide rail 30, so that the sliding of the workpiece can be guided, and the shape of the tail end of the guide frame 32 is matched with the shape of the through groove of the limit frame 18 by adjusting the shape of the guide frame 32, so that the effect of facilitating the workpiece to slide into the limit frame 18 is achieved;
through setting up horizontal electric push plate 20 and vertical electric push plate 21, in the in-process that the work piece enters into spacing 18 inside, horizontal electric push plate 20 that is located the bottom, vertical electric push plate 21 that is far away from translation subassembly one side stretch out in step, support and spacing to the work piece, after the work piece gets into spacing 18 inside completely, horizontal electric push plate 20 that is located the top surface, vertical electric push plate 21 that is close to translation subassembly one side stretch out in step, thus lock the work piece, after the upset is accomplished, horizontal electric push plate 20 that is located the top surface withdraw earlier, after the overhead pushing frame 22 is ejecting the work piece inside of spacing 18, vertical electric push plate 21 that is close to translation subassembly one side withdraw, thereby the next work piece of being convenient for gets into inside the spacing 18, so just reach the spacing effect to the work piece, provide the basis for the upset of work piece;
it should be noted that, in the embodiment of the present invention, more electronic control devices are involved, for example: the electric control devices are controlled by the microcomputer to act, so that interference among mutual acts is avoided.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. A DLC sputter plasma coating device, characterized in that: including vacuum chamber (1), mount (2) are installed on vacuum chamber (1) top, the bottom rigid coupling of mount (2) has injection subassembly (3), injection subassembly (3) are including spraying source, target, the inside of vacuum chamber (1) and the below rotation that is located injection subassembly (3) are connected with rotating turret (4), rotating turret (4) are through outside servo motor drive, a plurality of mounting grooves have evenly been seted up to the outside of rotating turret (4), the mounting groove outside is provided with elasticity spacing frame (15), the inside grafting of rotating turret (4) has link (5), the inside rigid coupling of link (5) has a plurality of bias electrode (10), a plurality of bias electrode (10) and mounting groove one-to-one, can produce negative bias when injection subassembly (3) and bias electrode (10) are relative and then can plate the dense rete of one deck on the work piece surface that waits to plate, rotating turret (4) inside is provided with the subassembly, the inside of rotating turret (4) is just to be used for to the bias electrode (10) that the power supply module (3) corresponds to the power supply groove.
2. The DLC sputter plasma coating apparatus as defined in claim 1, wherein: the utility model provides a power supply assembly includes gag lever post (6), peg graft in the inside of link (5) and rotate with link (5) and be connected, the inside of gag lever post (6) just is located injection assembly (3) sliding connection under guide bar (11), guide bar (11) top rigid coupling has current conducting plate (9), peg graft in the inside of gag lever post (6) has power core (8), power core (8) are kept away from the one end of rotating frame (4) and are installed plug-in socket (7), the inside of gag lever post (6) just is located and has seted up the mounting groove between vacuum chamber (1) and power core (8), guide bar (11) outside just is located mounting groove inside rigid coupling and has reset spring (12), the rigid coupling has wire (13) between guide bar (11) and power core (8), wire (13) and current conducting plate (9) intercommunication, the length of wire (13) is the setting up, the inside of link (5) is seted up a plurality of interference card blocks (10) and current conducting plate (9) and the inside of biasing card, the chamfer is connected with current conducting plate (9) all with the inside of biasing card block (10).
3. A DLC sputter plasma coating apparatus as defined in claim 2, characterized in that: cleaning cotton (14) is arranged on the inner wall of the connecting frame (5) and between the clamping grooves, and the length of the cleaning cotton (14) is matched with the length of the conducting plate (9).
4. The DLC sputter plasma coating apparatus as defined in claim 1, wherein: the vacuum chamber (1) is internally provided with a turnover plate mechanism below the rotating frame (4), and the turnover plate mechanism is used for turning over a product plated with one-side coating to realize double-sided plating.
5. The DLC sputtering plasma coating apparatus according to claim 4, wherein: the utility model provides a board mechanism includes fishplate bar mechanism and rotary mechanism, fishplate bar mechanism is used for sending the product that plates one side coating to rotary mechanism on, rotary mechanism includes spacing (18), all rotate through connecting rod (29) between spacing (18) both sides and the inner wall of vacuum chamber (1) and be connected, one side outside rigid coupling that inserts electric seat (7) was kept away from to rotating stand (4) has action wheel (16), action wheel (16) bottom meshing has from driving wheel (17), from driving wheel (17) and connecting rod (29) fixed connection, logical groove has all been seted up to spacing (18) both sides, spacing subassembly is all installed in spacing (18) four corners department, spacing subassembly is used for preventing that the work piece from dropping when rotary mechanism turns over the board operation, the inside of vacuum chamber (1) just is located the rigid coupling under spacing (18) has push-down frame (22), push-down frame (22) include the cylinder and install the tray on the cylinder.
6. The DLC sputtering plasma coating apparatus according to claim 5, wherein: the utility model discloses a work piece pushing mechanism, including board connecting mechanism, board connecting mechanism includes a pair of arc bracing piece (24), arc bracing piece (24) top surface rigid coupling has sucking disc (23), arc bracing piece (24) bottom sliding connection has arc hydraulic pressure seat (25), board connecting mechanism is still including installing a plurality of electronic push rods (33) inside rotating turret (4), a plurality of electronic push rods (33) and mounting groove one-to-one, a pair of arc bracing piece (24) outside all is provided with translation subassembly, translation subassembly is used for pushing the work piece to rotary mechanism inside.
7. The DLC sputter plasma coating apparatus as defined in claim 6, wherein: the translation subassembly includes mount pad (26), one side rigid coupling that mount pad (26) is close to spacing (18) has electric guide rail (27), electric guide rail (27) inside sliding connection has electric slider, electric slider top rigid coupling has translation push pedal (28), electric guide rail (27) both sides all are provided with guided way (30), inside rotation of guided way (30) is connected with a plurality of leading wheels (31), guided way (30) one end and mount pad (26) rigid coupling.
8. The DLC sputtering plasma coating apparatus according to claim 7, wherein: one side of the guide rail (30) far away from the electric guide rail (27) is provided with a guide frame (32), and a support rod is fixedly connected between the guide frame (32) and the bottom surface of the inner wall of the vacuum chamber (1).
9. The DLC sputtering plasma coating apparatus according to claim 5, wherein: the limiting assembly comprises a control box (19), and a horizontal electric push plate (20) and a vertical electric push plate (21) are fixedly connected between the control box (19) and the limiting frame (18).
10. A DLC sputter plasma coating process using a DLC sputter plasma coating device as defined in any of the preceding claims 1 to 9, characterized in that: the process comprises the following steps:
s1, sequentially placing workpieces to be processed in an installation groove, and limiting the workpieces by an elastic limiting frame (15);
s2, rotating a rotating frame (4) to convey the workpiece to the position right below the spraying assembly (3);
s3, the power supply assembly operates to supply power to the bias electrode (10) positioned right below the spraying assembly (3), and the spraying assembly (3) is opposite to the bias electrode (10);
s4, negative bias is generated between the spray assembly (3) and the bias electrode (10), a compact film layer is plated on the surface of the workpiece to be plated, and coating plating is completed;
s5, the rotating frame (4) rotates again to repeat the steps until all the workpieces are plated.
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