CN117564905A - Automatic crystal support surface glue removing system - Google Patents
Automatic crystal support surface glue removing system Download PDFInfo
- Publication number
- CN117564905A CN117564905A CN202311656318.0A CN202311656318A CN117564905A CN 117564905 A CN117564905 A CN 117564905A CN 202311656318 A CN202311656318 A CN 202311656318A CN 117564905 A CN117564905 A CN 117564905A
- Authority
- CN
- China
- Prior art keywords
- crystal support
- crystal
- support
- glue
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Liquid Crystal (AREA)
Abstract
The invention relates to the technical field of crystal bar processing, in particular to an automatic crystal support surface glue removing system, which comprises a crystal support conveying line for continuously conveying a crystal support to be glue removed, wherein the crystal support conveying line is provided with a crystal support overturning mechanism, an electromagnetic glue removing mechanism, a resin plate separating mechanism, a glue shoveling mechanism, a polishing and polishing mechanism, an ultrasonic cleaning mechanism and a drying mechanism, wherein the crystal support overturning mechanism, the electromagnetic glue removing mechanism is used for heating the surface of the crystal support, the resin plate separating mechanism is used for pushing away a resin plate on the crystal support, the glue shoveling mechanism is used for shoveling the surface of the crystal support, the polishing and polishing mechanism is used for polishing the surface of the crystal support, and the ultrasonic cleaning mechanism is used for cleaning the surface of the crystal support; the crystal support overturning mechanism is used for overturning and positioning the crystal support; a crystal support feeding mechanism is arranged beside the crystal support overturning mechanism; under the cooperation of each mechanism, realize whole automatic line of removing glue, each mechanism simple structure and independent setting are more simple and convenient when producing and maintaining each mechanism to the cost is reduced.
Description
Technical Field
The invention relates to the technical field of crystal bar processing, in particular to an automatic crystal support surface glue removing system.
Background
In many fields, such as semiconductors, optics, lasers, etc., it is desirable to use precision crystalline materials, such as silicon, germanium, etc.; these crystalline materials often require elaborate processing and handling to ensure that their geometry and physical properties meet the requirements of a particular application. At present, the photovoltaic crystal bar is required to be subjected to bar sticking treatment before being processed, and the bar sticking process comprises crystal bar feeding, code spraying and overturning, microwave heating, visual seam adjustment, bottom cleaning, crystal bar crystal support assembling and the like; after the slicing process of the crystal bar is completed, the crystal support needs to be recycled, however, the process of recycling the crystal support includes: the method comprises the steps of firstly carrying out heating treatment on the surface of a crystal support, taking down a resin plate on the crystal support after heating is finished, then carrying out glue shoveling treatment and polishing treatment on the surface of the crystal support, and finally carrying out ultrasonic cleaning to remove residual glue after the glue shoveling treatment so as to facilitate subsequent adhesion with a crystal bar. The existing crystal support glue removing equipment at present comprises the following concrete steps:
the Chinese patent document with publication number of CN113909173A discloses a crystal tray glue removing device, which specifically discloses: comprises a steam box mechanism and a photoresist removing main body mechanism which are sequentially arranged in sequence; the steam box mechanism comprises a feeding lifting transplanting, a steam box and a discharging lifting transplanting which are sequentially arranged; a crystal support conveying chain plate machine is further arranged in the steam box; the main gumming mechanism comprises a main gumming frame body, and a lifting step conveying mechanism A, a five-sided gumming mechanism, an angular gumming polishing mechanism, a cleaning mechanism, a drying mechanism, a lifting step conveying mechanism B and a finished product crystal support rack are sequentially arranged on the main gumming frame body; the equipment replaces the original manual glue removal, realizes the working procedures of automatic glue steaming, steam box conveying, step moving, glue removal, polishing, cleaning, drying and the like of the crystal support, reduces the labor intensity and the labor cost, and improves the production efficiency and the consistency of the surface of a finished product.
From the above, the existing crystal support photoresist removing device realizes automatic photoresist removing treatment on the crystal support through the lifting step conveying mechanism A, the five-side photoresist removing mechanism, the corner photoresist removing polishing mechanism, the cleaning mechanism, the drying mechanism, the lifting step conveying mechanism B and the finished crystal support placing frame on the photoresist removing main frame body. However, each mechanism on the existing crystal support glue removing equipment is relatively complex, and the cost is relatively high when each mechanism is produced and maintained, so that an automatic crystal support surface glue removing system is provided to solve the technical problems.
Disclosure of Invention
The invention aims to provide an automatic crystal support surface glue removing system aiming at the defects of the prior art so as to solve the technical problem of higher cost in the production and maintenance of the existing crystal support glue removing equipment.
In order to achieve the above purpose, the technical scheme of the invention is as follows:
an automatic crystal support surface glue removing system comprises a crystal support conveying line for continuously conveying a crystal support to be glue removed, wherein the crystal support conveying line is provided with a crystal support overturning mechanism, an electromagnetic glue removing mechanism, a resin plate separating mechanism, a glue shoveling mechanism, a grinding and polishing mechanism, an ultrasonic cleaning mechanism and a drying mechanism, wherein the crystal support overturning mechanism, the electromagnetic glue removing mechanism is used for heating the surface of the crystal support, the resin plate separating mechanism is used for pushing away a resin plate on the crystal support, the glue shoveling mechanism is used for shoveling the surface of the crystal support, the grinding and polishing mechanism is used for polishing the surface of the crystal support, the ultrasonic cleaning mechanism is used for cleaning the surface of the crystal support, and the drying mechanism is used for drying the surface of the crystal support; the crystal support overturning mechanism is used for overturning and positioning the crystal support and is arranged at the initial end of the crystal support conveying line, and the drying mechanism is arranged at the tail end of the crystal support conveying line; a crystal support feeding mechanism is arranged beside the crystal support turnover mechanism so as to convey the crystal support to be gummed to the crystal support turnover mechanism;
The glue shoveling mechanism comprises a fourth support frame which is arranged together with the crystal support conveying line, a fixing frame is arranged on the fourth support frame, and a movable plate which slides back and forth along the crystal support conveying direction and a driving mechanism for driving the movable plate to slide are arranged on the fixing frame; the movable plate is provided with a top surface glue shoveling mechanism for shoveling the top surface of the crystal support, the movable plate is provided with a pair of second fixing plates respectively arranged at two sides of the top surface glue shoveling mechanism, and the second fixing plates at two sides are respectively provided with a side surface glue shoveling mechanism for shoveling the side surface of the crystal support.
Further, the crystal support feeding mechanism comprises a first supporting frame and an electromagnet for sucking the crystal support, a first movable mechanism capable of moving in multiple axes is arranged on the first supporting frame, and the electromagnet is arranged on the first movable mechanism, so that the electromagnet is driven to move freely.
Further, the crystal support overturning mechanism comprises a second support frame arranged at the initial end of the crystal support conveying line, a first support bearing is arranged on the second support frame, a first rotating shaft is rotatably arranged on the first support bearing, and the axial direction of the first rotating shaft is parallel to the conveying direction of the crystal support conveying line; a pair of overturning tooth forks for overturning the crystal support are arranged on the first rotating shaft; the second support frame is provided with a turnover motor, a first gear is arranged on an output shaft of the turnover motor and a first rotating shaft, and a first toothed belt is wound on the first gear.
Further, the electromagnetic degumming mechanism comprises a third support frame which is arranged together with the crystal support conveying line, a first guide rod which is vertically arranged is fixedly arranged on the third support frame, and a first lifting plate is slidingly arranged on the first guide rod; a first fixing plate is fixedly arranged at the top end of the first guide rod, a first cylinder with a downward telescopic rod is arranged on the first fixing plate, and the end part of the telescopic rod of the first cylinder is fixedly arranged with the first lifting plate; the first lifting plate is provided with a heating coil arranged above the crystal support conveying line.
Further, the resin plate separating mechanism comprises a fixed seat arranged on the third supporting frame, a guide cylinder horizontally arranged is arranged on the fixed seat, a sliding rod is slidably arranged on the guide cylinder, the sliding direction of the sliding rod is perpendicular to the conveying direction of the crystal support, a pushing plate for pushing away the resin plate on the crystal support is arranged on the end part of the sliding rod, and a pushing cylinder for pushing the pushing plate to move is further arranged on the fixed seat.
Further, the glue shoveling mechanism further comprises a positioning mechanism arranged on the fourth supporting frame so as to fix the crystal support at a specified position; a plurality of first washing water guns for spraying water are arranged on the movable plate, a first liquid collecting frame for collecting waste liquid is arranged on the fourth support frame, the first liquid collecting frame is arranged below the positioning mechanism and is provided with an opening at the bottom, and a first waste liquid recovery mechanism arranged below the opening is also arranged on the fourth support frame.
Further, the top surface glue shoveling mechanism comprises a second lifting frame and a driving part, wherein the second lifting frame is arranged on the second fixed plate in an up-and-down movable mode, the driving part drives the second lifting frame to move up and down, and a first tool apron capable of sliding up and down is arranged on the second lifting frame; a pair of first shovel blades for shoveling out glue are fixedly arranged on the first cutter seat; a first spring is arranged between the second lifting frame and the first tool apron so as to apply downward force to the first tool apron;
the side glue shoveling mechanism comprises a second air cylinder arranged on a second fixed plate, a telescopic rod of the second air cylinder faces to the first shovel blade, a fixed block is fixedly arranged on the telescopic rod of the second air cylinder, a second cutter seat is slidingly arranged on the fixed block, and the sliding direction of the second cutter seat is perpendicular to the conveying direction of the crystal support; a second spring is arranged between the fixed block and the second tool apron; a pair of second shovel blades for shoveling glue are fixedly arranged on the second knife rest.
Further, the grinding and polishing mechanism comprises a fifth support frame which is arranged together with the crystal support conveying line, a glue removing mechanism for removing glue on the glue coating surface of the crystal support is arranged on the fifth support frame, and a second flushing water gun for spraying water is arranged on the glue removing mechanism; the crystal support conveying line is provided with a gluing surface grinding mechanism for polishing a gluing surface of the crystal support and a side grinding mechanism for polishing the side edge of the crystal support, and the gluing surface grinding mechanism and the side grinding mechanism are both provided with a second flushing water gun.
Further, the ultrasonic cleaning mechanism comprises an ultrasonic cleaning tank, a sixth supporting frame is arranged at the side of the ultrasonic cleaning tank, and a second movable mechanism for performing multi-axis movement is arranged on the sixth supporting frame; a rotating plate is horizontally and rotatably arranged at the bottom end of the second movable mechanism, and an adjusting motor for driving the rotating plate to rotate is arranged on the second movable mechanism; the rotating plate is provided with a crystal support clamp for carrying the crystal support.
Further, the drying mechanism comprises a seventh supporting frame, the crystal support conveying line is arranged on the seventh supporting frame, a pair of normal-temperature air knives used for drying the crystal support are arranged on the seventh supporting frame, the normal-temperature air knives are arranged above the crystal support conveying line, a long-strip air outlet is formed in the bottom of the normal-temperature air knives, and the length of the air outlet is larger than the width of the crystal support.
The invention has the beneficial effects that: when the crystal support conveying device is operated, the crystal support to be glue removed is conveyed onto the crystal support overturning mechanism through the crystal support feeding mechanism, the crystal support is overturned and positioned under the action of the crystal support overturning mechanism, the overturned crystal support is directly placed on the crystal support conveying line, and then the crystal support is conveyed through the crystal support conveying line; the crystal support is conveyed to an electromagnetic degumming mechanism, the crystal support is heated under the action of the electromagnetic degumming mechanism, glue between the crystal support and a resin plate is melted after being heated, then the heated crystal support is conveyed to a resin plate separating mechanism to push away the resin plate on the crystal support, separation of the crystal support and the resin plate is achieved, the crystal support is conveyed to a glue shoveling mechanism after separation, glue on the surface of the crystal support is shoveled off, the crystal support is conveyed to a grinding and polishing mechanism after shoveling, and grinding and polishing treatment are carried out on the surface of the crystal support after shoveling, so that the glue remained on the surface of the crystal support is removed; after polishing is finished, cleaning the surface of the crystal support through an ultrasonic cleaning mechanism to thoroughly remove stains on the surface of the crystal support, and finally drying through a drying mechanism to finish the photoresist removing treatment of the crystal support; under the cooperation of each mechanism, realize whole automatic line of removing glue, each mechanism simple structure and independent setting are more simple and convenient when producing and maintaining each mechanism to the cost is reduced.
Drawings
FIG. 1 is a schematic view of a surface photoresist removing line of a wafer carrier according to the present invention.
Fig. 2 is a schematic structural diagram of a crystal support feeding mechanism of the present invention.
Fig. 3 is a schematic structural diagram of the crystal support turnover mechanism of the present invention.
Fig. 4 is a schematic structural view of the electromagnetic degumming mechanism and the resin plate detachment mechanism of the present invention.
Fig. 5 is a schematic structural view of the glue shoveling mechanism of the present invention.
Fig. 6 is a schematic view of a part of the structure of the glue shoveling mechanism of the present invention.
Fig. 7 is a schematic structural diagram of a top surface glue shoveling mechanism and a side surface glue shoveling mechanism of the invention.
FIG. 8 is a schematic view of the polishing mechanism of the present invention.
FIG. 9 is a schematic view of a part of the polishing mechanism of the present invention.
FIG. 10 is a schematic view of another view angle of the polishing mechanism of the present invention.
Fig. 11 is a schematic structural view of the adhesive removing mechanism of the present invention.
Fig. 12 is a schematic structural view of the adhesive surface grinding mechanism of the present invention.
FIG. 13 is a schematic view of a side grinding mechanism according to the present invention.
Fig. 14 is a schematic structural view of the ultrasonic cleaning mechanism of the present invention.
Fig. 15 is a schematic structural view of a drying mechanism according to the present invention.
The reference numerals include:
1. a crystal support feeding mechanism; 1001. a first support frame; 1002. a first movable mechanism; 1003. feeding trolley for crystal support;
2. A crystal support turnover mechanism; 2002. a crystal support conveying line; 2001. a second support frame; 2003. a first support bearing; 2004. a first rotation shaft; 2005. turning over the tooth fork; 2006. a first gear; 2007. a turnover motor; 2008. a first toothed belt;
3. an electromagnetic degumming mechanism; 3001. a third support frame; 3002. a first guide bar; 3003. a first lifting plate; 3004. a first fixing plate; 3005. a first cylinder; 3006. a heating coil; 3007. an anti-collision plate; 3008. a guide plate;
4. a resin plate detachment mechanism; 4001. a fixing seat; 4002. a guide cylinder; 4003. a slide bar; 4004. a push plate; 4005. a pushing cylinder; 4006. a deflector; 4008. a resin plate collecting frame;
5. a glue shoveling mechanism; 51. a fourth support frame; 52. a fixing frame; 53. a movable plate; 531. a first slide rail; 532. a first slider; 533. a second fixing plate; 54. a driving mechanism; 55. a top surface glue shoveling mechanism; 5501. a second lifting frame; 5502. a second slide rail; 5503. a second slider; 5504. a mounting base; 5505. a second servo motor; 5506. a second screw rod; 5507. a first tool apron; 5508. a second guide bar; 5509. a first spring; 5510. a first blade; 56. a side glue shoveling mechanism; 5601. a second cylinder; 5602. a fixed block; 5603. a second tool apron; 5604. a third guide bar; 5605. a second spring; 5606. a second blade; 57. a first flushing gun; 58. a positioning mechanism; 59. a first liquid collecting frame; 510. a first waste liquid recovery mechanism;
6. Grinding and polishing mechanism; 61. a fifth support frame; 62. a housing; 63. a transparent window; 64. a glue removing mechanism; 6401. a third fixing plate; 6402. a fifth guide bar; 6403. a second mounting plate; 6404. a third lifting plate; 6405. a fifth cylinder; 6406. a second support bearing; 6407. a second rotation shaft; 6408. a first grinding wheel; 6409. a first motor; 6410. a second gear; 6411. a third gear; 6412. a second toothed belt; 65. a second flushing gun; 66. a protective shell; 67. a second baffle; 68. a gummed surface grinding mechanism; 6801. a first mounting frame; 6802. a sixth cylinder; 6803. a first support base; 6804. a second motor; 6805. a grinding disc; 69. a side grinding mechanism; 6901. a second mounting frame; 6902. a seventh cylinder; 6903. a second support base; 6904. a third motor; 6905. a second grinding wheel; 610. a second liquid-collecting frame; 611. a second waste liquid recovery mechanism;
7. an ultrasonic cleaning mechanism; 71. an ultrasonic cleaning tank; 72. a sixth support frame; 73. a second movable mechanism; 74. a rotating plate; 75. adjusting a motor; 76. a crystal support clamp;
8. a drying mechanism; 81. a seventh support frame; 82. a normal temperature air knife; 83. an ion wind bar; 84. a temperature sensor.
Detailed Description
The following describes an automated crystal support surface photoresist removal system in detail with reference to the accompanying drawings.
As shown in fig. 1, an embodiment of an automatic crystal support surface glue removing system of the present invention includes a crystal support conveying line 2002 for continuously conveying a crystal support to be glue removed, wherein a crystal support turnover mechanism 2, an electromagnetic glue removing mechanism 3 for heating a crystal support surface, a resin plate separating mechanism 4 for pushing away a resin plate on the crystal support, a glue shoveling mechanism 5 for shoveling the crystal support surface, a grinding and polishing mechanism 6 for polishing the crystal support surface, an ultrasonic cleaning mechanism 7 for cleaning the crystal support surface, and a drying mechanism 8 for drying the crystal support surface are sequentially arranged on the crystal support conveying line 2002; the crystal support turnover mechanism 2 is used for turnover positioning of the crystal support and is arranged at the initial end of the crystal support conveying line 2002, the drying mechanism 8 is arranged at the tail end of the crystal support conveying line 2002, and in addition, the crystal support feeding mechanism 1 is arranged beside the crystal support turnover mechanism 2 so as to convey the crystal support to be subjected to glue removal onto the crystal support turnover mechanism 2. Specifically, firstly, a crystal support to be glue removed is conveyed to a crystal support overturning mechanism 2 through a crystal support feeding mechanism 1, under the action of the crystal support overturning mechanism 2, the crystal support is overturned and positioned, the overturned crystal support is directly placed on a crystal support conveying line 2002, and then the crystal support is conveyed through the crystal support conveying line 2002; the crystal support is conveyed to the electromagnetic degumming mechanism 3, under the action of the electromagnetic degumming mechanism 3, the crystal support is heated and melted (the crystal support to be glued is glued with the resin plate), then the heated crystal support is conveyed to the resin plate detachment mechanism 4 to push away the resin plate on the crystal support, the crystal support and the resin plate are separated, the crystal support is conveyed continuously after the separation, the crystal support is conveyed to the glue shoveling mechanism 5, so that the glue on the surface of the crystal support is shoveled, the crystal support is conveyed to the grinding and polishing mechanism 6 after the removal, and the surface of the crystal support after the glue shoveling is ground and polished, so that the glue remained on the surface of the crystal support is removed; after polishing is finished, cleaning the surface of the crystal support through an ultrasonic cleaning mechanism 7 to thoroughly remove stains on the surface of the crystal support, and finally drying through a drying mechanism 8 to finish the photoresist removing treatment of the crystal support; under the cooperation of each mechanism, realize whole automatic line of removing glue, each mechanism simple structure and independent setting are more simple and convenient when producing and maintaining each mechanism to the cost is reduced.
As shown in fig. 2, the crystal support feeding mechanism 1 comprises a first support frame 1001 and an electromagnet 1003 for sucking a crystal support, wherein a first movable mechanism 1002 capable of performing multi-axis movement is arranged on the first support frame 1001, and the electromagnet 1003 is arranged on the first movable mechanism 1002; under the action of the first moving mechanism 1002, the electromagnet 1002 can be carried to move up and down, left and right and back and forth freely, so that automatic feeding treatment of the crystal support is realized. A crystal support feeding trolley 1004 for loading crystal supports to be glue removed is placed below the first moving mechanism 1002, the first moving mechanism 1002 moves with the electromagnet 1002, and after the crystal supports are sucked, the crystal supports can be carried to carry out feeding treatment, so that the crystal supports are carried to the crystal support overturning mechanism 2 to carry out overturning and positioning treatment.
As shown in fig. 3, the crystal support turnover mechanism 2 includes a second support frame 2001 disposed at an initial end of the crystal support conveying line 2002, wherein a pair of first support bearings 2003 are disposed on the second support frame 2001, and a first rotation shaft 2004 is rotatably disposed on the first support bearings 2003, and an axial direction of the first rotation shaft 2004 is parallel to a conveying direction of the crystal support conveying line 2002; a pair of overturning tooth forks 2005 for overturning the crystal support is arranged on the first rotating shaft 2004, after the crystal support is placed on the overturning tooth forks 2005, the first rotating shaft 2004 is driven to rotate 180 degrees, the overturning tooth forks 2005 can overturn 180 degrees to overturn the crystal support, so that one side with a resin plate faces upwards, the overturn crystal support is directly placed on the crystal support conveying line 2002, the crystal support is overturned, and automatic positioning of the crystal support is realized. However, in order to drive the first rotation shaft 2004 to rotate, a turnover motor 2007 is mounted on the second support frame 2001, a first gear 2006 is provided on an output shaft of the turnover motor 2007 and on the first rotation shaft 2004, and a first toothed belt 2008 is wound around the first gear 2006. When the crystal support feeding mechanism 1 places the crystal support on the turnover tooth fork 2005, the turnover motor 2007 is started, under the transmission action of the first gear 2006 and the first toothed belt 2008, the turnover tooth fork 2005 rotates by driving the first rotation shaft 2004, after the crystal support is turned over by 180 degrees with the crystal support, the crystal support is just placed on the crystal support conveying line 2002, and the crystal support conveying line 2002 conveys the crystal support to be conveyed to the next electromagnetic degumming procedure for heating treatment.
As shown in fig. 4, the electromagnetic degumming mechanism 3 includes a third supporting frame 3001 mounted together with the crystal support conveying line 2002, a first guiding rod 3002 vertically arranged is fixedly arranged on the third supporting frame 3001, a first lifting plate 3003 is slidingly arranged on the first guiding rod 3002, and the first lifting plate 3003 moves up and down on the first guiding rod 3002; the first fixing plate 3004 is fixedly arranged on the top end of the first guide rod 3002, a first air cylinder 3005 with a downward telescopic rod is arranged on the first fixing plate 3004, the telescopic rod end of the first air cylinder 3005 is fixedly arranged with the first lifting plate 3003, and when the first air cylinder 3005 is operated, the first lifting plate 3003 can be driven to move up and down on the first guide rod 3002. In addition, a heating coil 3006 disposed above the susceptor conveying line 2002 is provided on the first lifting plate 3003, and the heating principle is as follows: by using a high-frequency alternating current to flow to the conductor curled into a ring shape, a magnetic beam is generated, the metal is placed in the conductor, the magnetic beam penetrates through the metal body, an eddy current (rotating current) is generated in the direction of self-paying with the magnetic beam, the induced current generates heat under the influence of the eddy current, and when the crystal support conveying line 2002 conveys the crystal support, the crystal support passes under the heating coil 3006, and glue on the surface of the crystal support can be heated in the passing process. In addition, when the first cylinder 3005 drives the first lifting plate 3003 to move up and down, the first lifting plate 3003 carries the heating coil 3006 to move up and down, so as to adjust the height of the heating coil 3006 to adapt to crystal holders with different heights, so that the distance between the heating coil 3006 and the surface of the crystal holder is always kept between 20mm and 40mm. Additionally, an anti-collision plate 3007 is further disposed on the first lifting plate 3003, and under the action of the anti-collision plate 3007, the crystal support is prevented from contacting the heating coil 3006 due to the exceeding height of the crystal support before passing the heating coil 3006. A guide plate 3008 is installed on the third support frame 3001, and after the susceptor passes through the heating coil 3006, guide processing is performed by the guide plate 3008 so that the susceptor can be accurately transferred to the next resin plate detachment process.
Further, the resin plate separating mechanism 4 comprises a fixing base 4001 arranged on the third supporting frame 3001, wherein a horizontally arranged guide cylinder 4002 is arranged on the fixing base 4001, a slide rod 4003 is slidably arranged on the guide cylinder 4002, the sliding direction of the slide rod 4003 is perpendicular to the conveying direction of the crystal support, a push plate 4004 for pushing away the resin plate on the crystal support is arranged on the end part of the slide rod 4003, and a pushing cylinder 4005 for pushing the push plate 4004 to move is further arranged on the fixing base 4001. Specifically, after the glue on the surface of the crystal support is heated by the heating coil 3006, the glue is conveyed to a position at which the glue is appointed to be separated from the resin plate through the crystal support conveying line 2002, and as the glue between the crystal support and the resin plate is heated and melted, the pushing plate 4004 is pushed to move by the pushing cylinder 4005 so as to push away the resin plate on the surface of the crystal support, thereby realizing separation of the crystal support and the resin plate, and the next crystal support surface glue shoveling process can be performed after the resin plate is separated. In addition, a deflector 4006 for guiding the resin plate is provided on the third support frame 3001, and a resin plate collecting frame 4008 for collecting the resin plate is provided beside the third support frame 3001; after the pushing plate 4004 pushes the resin plate away from the tray, the resin plate falls into the resin plate collecting frame 4008 by the baffle 4006 to perform recovery processing on the resin plate.
As shown in fig. 5-6, the glue shoveling mechanism 5 includes a fourth supporting frame 51 together with a crystal support conveying line 2002, a fixing frame 52 is provided on the fourth supporting frame 51, and a movable plate 53 sliding back and forth along the crystal support conveying direction is provided on the fixing frame 52, however, in order to enable the movable plate 53 to slide back and forth on the fixing frame 52 stably, a first sliding rail 531 is fixedly provided on the fixing frame 52, and a first sliding block 532 is fixedly provided on the movable plate 53, wherein the first sliding block 532 is slidably provided on the first sliding rail 531, and the movable plate 53 is stably slidably provided on the fixing frame 52 under the cooperation of the first sliding rail 531 and the first sliding block 532; the fixed frame 52 is further provided with a driving mechanism 54 for automatically sliding the movable plate 53, and the movable plate 53 is driven to automatically move back and forth in the direction of conveyance of the susceptor on the fixed frame 52 by the driving mechanism 54.
Wherein, a top surface glue shoveling mechanism 55 for shoveling the top surface of the crystal support is arranged on the movable plate 53, after the crystal support is conveyed to a specified position by the crystal support conveying line 2002, the top surface glue shoveling mechanism 55 is operated so as to be contacted with the top surface of the crystal support, and then a driving mechanism 54 is operated so as to drive the movable plate 53 to move back and forth on the fixed frame 52, and glue shoveling treatment is carried out on the top surface of the crystal support through the top surface glue shoveling mechanism 55; in addition, a pair of second fixing plates 533 respectively disposed on two sides of the top surface glue shoveling mechanism 55 are disposed on the movable plate 53, and side surface glue shoveling mechanisms 56 for shoveling the side surfaces of the crystal support are disposed on the second fixing plates 533 on two sides, the top surface glue shoveling mechanism 55 and the side surface glue shoveling mechanism 56 operate simultaneously, so that the top surface glue shoveling mechanism 55 and the side surface glue shoveling mechanism contact with the top surface and the side surface of the crystal support respectively, and finally the driving mechanism 54 operates, so that the movable plate 53 is driven to slide back and forth on the fixing frame 52 along the conveying direction of the crystal support, and the movable plate 53 carries the top surface glue shoveling mechanism 55 and the side surface glue shoveling mechanism 56 to move back and forth on the crystal support, so as to carry out glue shoveling treatment on the top surface and the side surface.
Further, in order to stably perform the shoveling treatment on the crystal support, a positioning mechanism 58 for fixing the crystal support at a specified position is provided on the fourth support frame 51, when the crystal support conveying line 2002 conveys the crystal support to the specified position, the crystal support conveying line 2002 stops running, and then the positioning mechanism 58 is operated to fix the crystal support placed on the crystal support conveying line 2002, so that the crystal support is fixed, and then the subsequent shoveling treatment can be performed; under the action of the positioning mechanism 58, the crystal support is prevented from moving in the process of shoveling the crystal support, so that the shoveling effect is affected. However, in order to improve the glue shoveling effect of the top surface glue shoveling mechanism 55 and the side surface glue shoveling mechanism 56, a plurality of first flushing water guns 57 for spraying water are arranged on the movable plate 53, and when the top surface glue shoveling mechanism 55 and the side surface glue shoveling mechanism 56 shovels glue on the crystal support, the first flushing water guns 57 are started so as to wash away the shoveled glue residues, and the glue on the crystal support is softened after meeting water through the first flushing water guns 57, so that the top surface glue shoveling mechanism 55 and the side surface glue shoveling mechanism 56 can better carry out glue shoveling treatment. However, in order to save processing cost, the fourth support frame 51 is provided with a first liquid collecting frame 59 for collecting waste liquid, the first liquid collecting frame 59 is disposed below the positioning mechanism 58 and has an opening at the bottom thereof, the fourth support frame 51 is further provided with a first waste liquid recovery mechanism 510 disposed below the opening, the generated waste liquid flows into the first liquid collecting frame 59 in the process of performing the shoveling treatment on the crystal support by the top face shoveling mechanism 55 and the side face shoveling mechanism 56, the waste liquid is collected through the first liquid collecting frame 59, and finally flows out from the bottom opening of the first liquid collecting frame 59 and flows into the first waste liquid recovery mechanism 510 for recovery treatment, so that the waste liquid is recovered and reused, and the processing cost is reduced.
As shown in fig. 7, the top surface glue shoveling mechanism 55 includes a second lifting frame 5501 movably disposed on a second fixing plate 533 and a driving part for driving the second lifting frame 5501 to move up and down, wherein a second guide rod 5508 capable of sliding up and down is disposed on the second lifting frame 5501, a first tool apron 5507 is fixedly disposed on a bottom end of the second guide rod 5508, and the first tool apron 5507 is disposed on the second lifting frame 5501 capable of sliding up and down under the action of the second guide rod 5508; in addition, a pair of first blades 5510 for removing glue are fixedly arranged on the first blade holder 5507, the first blades 5510 are arranged in an eight shape, a first spring 5509 is arranged on the second guide rod 5508, and the first spring 5509 is arranged between the second lifting frame 5501 and the first blade holder 5507 to apply downward force on the first blade holder 5507. After the crystal support is conveyed to a designated position, the driving part is operated to drive the second lifting frame 5501 to move downwards, the second lifting frame 5501 carries the first cutter seat 5507 and the first shovel blade 5510 to move downwards together, after the first shovel blade 5510 contacts with the top surface of the crystal support, the driving part continues to drive the second lifting frame 5501 to move downwards for a certain distance, so that the first spring 5509 is compressed to apply downward force to the first cutter seat 5507, and finally the driving mechanism 54 is operated, so that the first shovel blade 5510 slides back and forth on the top surface of the crystal support to shovel glue on the crystal support; moreover, under the buffering action of the first spring 5509, the first shovel blade 5510 can adapt to the shoveling surfaces with different degrees.
The driving part comprises a mounting seat 5504 and a second servo motor 5505 arranged on the movable plate 53 through the mounting seat 5504, an output shaft of the second servo motor 5505 is arranged downwards, a second screw rod 5506 is arranged on the output shaft of the second servo motor 5505, and the second screw rod 5506 is in threaded connection with the second lifting frame 5501; after the second servo motor 5505 is started, the second screw rod 5506 is driven to rotate, and under the action of the second screw rod 5506, the second lifting frame 5501 is driven to move up and down on the second fixed plate 533. In order to enable the second lifting frame 5501 to stably move up and down on the second fixed plate 533, a second sliding rail 5502 which is vertically arranged is fixedly arranged on the second fixed plate 533, a second sliding block 5503 is fixedly arranged on the second lifting frame 5501, the second sliding block 5503 is arranged on the second sliding rail 5502 in a sliding manner, and the second lifting frame 5501 moves up and down more stably under the cooperation of the second sliding block 5503 and the second sliding rail 5502.
Further, the side glue shoveling mechanism 56 includes a second air cylinder 5601 mounted on a second fixed plate 533, and a telescopic rod of the second air cylinder 5601 faces the first shovel blade 5510, wherein a fixed block 5602 is fixedly arranged on the telescopic rod of the second air cylinder 5601, a third guide rod 5604 is fixedly arranged on the fixed block 5602, an axial direction of the third guide rod 5604 is perpendicular to a conveying direction of the crystal support, a second cutter seat 5603 is slidingly arranged on the third guide rod 5604, and the second cutter seat 5603 can move towards a direction approaching or separating from the crystal support under the action of the third guide rod 5604; a second spring 5605 is arranged on the third guide rod 5604, the second spring 5605 is arranged between the fixed block 5602 and the second knife holder 5603, a pair of second shovel knives 5606 for shoveling glue are fixedly arranged on the second knife holder 5603, and the second shovel knives 5606 are arranged in an eight shape. Similarly, after the crystal support is conveyed to the designated position, the second cylinder 5601 is operated to push the second shovel blade 5606 to be in contact with the side edge of the crystal support, and under the buffering action of the second spring 5605, the second shovel blade 5606 can adapt to the glue shoveling surfaces of different degrees.
As shown in fig. 8-10, the grinding and polishing mechanism 6 includes a fifth support frame 61 that is disposed together with the crystal support conveying line 2002, a glue removing mechanism 64 for removing glue from a glue-coated surface of the crystal support is disposed on the fifth support frame 61, the crystal support conveying line 2002 passes under the glue removing mechanism 64 during conveying of the crystal support, when the glue removing mechanism 64 is operated, the glue removing mechanism 64 removes glue from a glue-coated surface (top surface) of the crystal support while the crystal support passes through the glue removing mechanism 64, and under the cooperation of the crystal support conveying line 2002 and the glue removing mechanism 64, glue is automatically removed from the glue-coated surface (top surface) of the crystal support during continuous conveying of a plurality of crystal supports; in addition, in order to improve the glue removing efficiency of the glue removing mechanism 64, a second flushing water gun 65 for spraying water is arranged on the glue removing mechanism 64, and when the glue removing mechanism 64 removes glue on the glue coated surface of the crystal support, the second flushing water gun 65 is started, so that the removed glue residues are flushed away, and the second flushing water gun 65 is used for cooling the glue removing process, so that the service life of the glue removing mechanism 64 is prolonged; additionally, a protecting shell 66 for covering the glue removing mechanism 64 is further arranged on the crystal support conveying line 2002, and under the action of the protecting shell 66, the glue removing mechanism 64 is protected, and water sprayed by the second flushing water gun 65 is prevented from splashing onto the glue removing mechanism 64 in the glue removing process, so that the operation of the glue removing mechanism 64 is affected.
However, in order to further improve the photoresist removing effect, a photoresist surface grinding mechanism 68 for polishing a photoresist surface (top surface) of the wafer and a side grinding mechanism 69 for polishing a side of the wafer are provided on the wafer carrier transport line 2002, and a second flushing gun 65 is provided on each of the photoresist surface grinding mechanism 68 and the side grinding mechanism 69; specifically, during the process of conveying the crystal support, the crystal support conveying line 2002 passes through the lower part of the glue removing mechanism 64, and the glue removing mechanism 64 is used for removing glue on the glue coated surface (top surface) of the crystal support, after the glue removing is completed, the crystal support passes through the lower part of the glue coated surface grinding mechanism 68, and the glue coated surface (top surface) of the crystal support is ground and polished through the glue coated surface grinding mechanism 68, so that the glue remained on the glue coated surface (top surface) of the crystal support is removed; finally, the crystal support passes through the lower part of the side grinding mechanism 69, so that grinding and polishing treatment is carried out on two sides of the crystal support in the length direction, and the residual glue on the crystal support is thoroughly removed; the adhesive removing efficiency is further improved by the cooperation of the adhesive surface grinding mechanism 68 and the side edge grinding mechanism 69.
In addition, a shell 62 for covering the glue removing mechanism 64, the glue spreading surface grinding mechanism 68 and the side grinding mechanism 69 is arranged on the fifth supporting frame 61, and water is prevented from splashing to other equipment in the process of removing glue and polishing the crystal support under the action of the shell 62; and, a plurality of transparent windows 63 are arranged on the shell 62, and the processing condition of the crystal support can be observed in real time through the transparent windows 63. However, in order to save the cost of removing the glue, a second liquid collecting frame 610 for collecting the waste liquid is disposed on the fifth support frame 61, the second liquid collecting frame 610 is disposed below the crystal support conveying line 2002 and has an opening at the bottom thereof, and a second waste liquid recycling mechanism 611 disposed below the opening is further disposed on the fifth support frame 61, so that the waste liquid generated during the process of removing the glue and polishing the crystal support by the glue removing mechanism 64, the glue spreading surface polishing mechanism 68 and the side polishing mechanism 69 flows into the second liquid collecting frame 610, the waste liquid is collected by the second liquid collecting frame 610, and finally flows out from the bottom opening of the second liquid collecting frame 610 and flows into the second waste liquid recycling mechanism 611 for recycling, thereby reducing the processing cost.
As shown in fig. 11, the glue removing mechanism 64 includes a third fixing plate 6401 disposed on the crystal support conveying line 2002 and a fifth guide rod 6402 fixedly disposed on the third fixing plate 6401, the fifth guide rod 6402 is vertically disposed and fixedly provided with a second mounting plate 6403 at the bottom end thereof, a third lifting plate 6404 is slidingly disposed on the fifth guide rod 6402, a fifth air cylinder 6405 with a telescopic rod disposed downward is disposed on the second mounting plate 6403, and the telescopic rod end of the fifth air cylinder 6405 is fixedly disposed with the third lifting plate 6404, under the action of the fifth air cylinder 6405, so as to drive the third lifting plate 6404 to move up and down on the fifth guide rod 6402. Wherein, a pair of second support bearings 6406 are mounted on the third lifting plate 6404, and a second rotating shaft 6407 is rotatably arranged on each second support bearing 6406, the second rotating shafts 6407 are symmetrically arranged, a first grinding wheel 6408 for removing glue on the surface of the crystal support is arranged on the second rotating shaft 6407, and in addition, a driving component for driving the second rotating shaft 6407 to synchronously rotate is arranged on the third lifting plate 6404; specifically, when the glue-removing process is required to be performed on the glue-coated surface (top surface) of the crystal support, the fifth cylinder 6405 is started first, so that the third lifting plate 6404 is pushed to move downwards, the third lifting plate 6404 carries the driving component and the first grinding wheel 6408 to move downwards together, so that the first grinding wheel 6408 contacts with the surface of the crystal support, finally, the driving component is operated, the second rotating shafts 6407 on two sides are driven to rotate synchronously, and the second rotating shafts 6407 carry the first grinding wheel 6408 to rotate, so that the glue-removing process is performed on the crystal support.
Further, the driving part comprises a first motor 6409 arranged on a third lifting plate 6404, a second gear 6410 is arranged on an output shaft of the first motor 6409, third gears 6411 are arranged on end parts of the second rotating shafts 6407 on two sides, and a second toothed belt 6412 is wound on the second gears 6410 and the third gears 6411 on two sides; when the second rotating shaft 6407 needs to be driven to synchronously rotate, the first motor 6409 is started, so that the second gear 6410 is driven to rotate, and under the transmission action of the second toothed belt 6412 and the third gears 6411 on two sides, the second rotating shaft 6407 on two sides is driven to synchronously rotate, so that automatic glue removing treatment of the crystal support is realized. Additionally, the first grinding wheel 6408 is disposed on the outer side of the protective shell 66, and a second baffle 67 for shielding water stains is fixedly disposed on the protective shell 66, and the second baffle 67 is disposed above the first grinding wheel 6408, so as to prevent the water stains from splashing under the action of the second baffle 67.
As shown in fig. 12, the glue spreading surface grinding mechanism 68 includes a first mounting frame 6801 fixedly arranged on the crystal support conveying line 2002 and a sixth air cylinder 6802 arranged on the first mounting frame 6801, wherein a telescopic rod of the sixth air cylinder 6802 is downward arranged, and a first supporting seat 6803 is fixedly arranged on the telescopic rod of the sixth air cylinder 6802, and when the sixth air cylinder 6802 is started, the first supporting seat 6803 is driven to move up and down; a second motor 6804 with a downward output shaft is arranged on the first supporting seat 6803, and a grinding disc 6805 for grinding and polishing the crystal support adhesive (top surface) is fixedly arranged on the output shaft of the second motor 6804. After the crystal support is subjected to the photoresist removing treatment by the first grinding wheel 6408, the crystal support conveying line 2002 conveys the crystal support to the lower part of the grinding disc 6805, then the sixth air cylinder 6802 is started, the sixth air cylinder 6802 drives the second motor 6804 and the grinding disc 6805 to move downwards, the second motor 6804 drives the grinding disc 6805 to rotate, and after the grinding disc 6805 is contacted with the photoresist (top surface) of the crystal support, the crystal support conveying line 2002 conveys the crystal support, and the photoresist (top surface) of the crystal support is ground and polished by the grinding disc 6805, so that the photoresist removing effect is further improved.
As shown in fig. 13, the side grinding mechanism 69 includes a second mounting rack 6901 fixedly arranged on the crystal support conveying line 2002 and a pair of seventh air cylinders 6902 arranged on the second mounting rack 6901, wherein the telescopic rods of the seventh air cylinders 6902 face to one side far away from each other, and the telescopic rod end parts of the seventh air cylinders 6902 are fixedly provided with second supporting seats 6903, and when the seventh air cylinders 6902 on two sides are started at the same time, the second supporting seats 6903 on two sides can be driven to move towards the direction close to or far away from each other; the second supporting seats 6903 on two sides are respectively provided with a third motor 6904 with an output shaft arranged downwards, and the output shafts of the third motors 6904 are respectively fixedly provided with a second grinding wheel 6905 for grinding and polishing the side edges of the crystal support in the length direction. After the crystal support is ground and polished by the grinding disc 6805, the crystal support conveying line 2002 conveys the crystal support between the second grinding wheels 6905, then simultaneously starts the seventh air cylinders 6902 on two sides, drives the third motors 6904 on two sides and the second grinding wheels 6905 to move towards directions close to each other, so that the second grinding wheels 6905 are in contact with the side edges of the crystal support, finally simultaneously starts the third motors 6904 on two sides, and drives the second grinding wheels 6905 to rotate to grind and polish the side edges of the crystal support in the length direction.
As shown in fig. 14, the ultrasonic cleaning mechanism 7 includes an ultrasonic cleaning tank 71, and a crystal support conveyor line 2002 is respectively disposed at two sides of the ultrasonic cleaning tank 71, wherein a sixth support frame 72 is disposed at a side of the ultrasonic cleaning tank 71, and a second movable mechanism 73 for performing multi-axis movement is disposed on the sixth support frame 72; a rotating plate 77 is horizontally rotatably provided at the bottom end of the second movable mechanism 73, and an adjusting motor 78 for driving the rotating plate 77 to rotate is provided at the second movable mechanism 73, and the rotating plate 77 is driven to rotate under the action of the adjusting motor 78, thereby adjusting the angle of the rotating plate 77; a susceptor clamp 79 for carrying a susceptor is provided on the rotation plate 77.
Specifically, when the crystal support conveying line 2002 conveys the crystal support to the position close to the ultrasonic cleaning tank 71, the second moving mechanism 73 is firstly operated to drive the crystal support clamp 79 to be arranged at two sides of the crystal support, the adjusting motor 78 is operated to drive the rotating plate 77 to rotate, so that the angle of the crystal support clamp 79 is adjusted, the crystal support clamp 79 is aligned with the crystal support, and finally the crystal support clamp 79 is operated to clamp the crystal support, and under the cooperation of the second moving mechanism 73 and the crystal support clamp 79, the crystal support on the crystal support conveying line 2002 is conveyed into the ultrasonic cleaning tank 71 to be cleaned; after the wafer support is cleaned, the wafer support in the ultrasonic cleaning tank 71 is taken out through the wafer support clamp 79 and is replaced on the wafer support conveying line 2002 so as to convey the wafer support to the next process, namely a drying process, and the cleaned wafer support is dried.
As shown in fig. 15, the drying mechanism 8 includes a seventh supporting frame 81, a crystal support conveying line 2002 is disposed on the seventh supporting frame 81, a pair of normal temperature air knives 82 for drying the crystal support are disposed on the seventh supporting frame 81, the normal temperature air knives 82 are disposed above the crystal support conveying line 2002, and a long air outlet is disposed at the bottom of the normal temperature air knives, the length of the air outlet is greater than the width of the crystal support, and the crystal support conveying line 2002 can pass through the lower side of the normal temperature air knives 82 in the process of conveying the crystal support, and the crystal support is dried by the pair of normal temperature air knives 82. In addition, an ion wind bar 83 is also provided on the seventh support 81, and is a special device for static electricity elimination, when the surface of the crystal support is negatively charged, it attracts the positive charges in the radiation area, and when the surface of the crystal support is positively charged, it attracts the negative charges in the radiation area, so that the static electricity on the surface of the object is neutralized, and the purpose of eliminating the static electricity is achieved. The seventh supporting frame 81 is provided with a temperature sensor 84, and the temperature of the dried crystal support is detected by the temperature sensor 84 to prevent the surface temperature of the crystal support from being too high after the photoresist is removed.
In view of the above, the present invention has the above-mentioned excellent characteristics, so that it can be used to improve the performance and practicality of the prior art, and is a product with great practical value.
The foregoing is merely exemplary of the present invention, and those skilled in the art should not be considered as limiting the invention, since modifications may be made in the specific embodiments and application scope of the invention in light of the teachings of the present invention.
Claims (10)
1. An automatic change brilliant support surface and remove gluey system which characterized in that: the device comprises a crystal support conveying line (2002) for continuously conveying a crystal support to be gummed, wherein the crystal support conveying line (2002) is provided with a crystal support turnover mechanism (2), an electromagnetic degumming mechanism (3), a resin plate separating mechanism (4), a gum shoveling mechanism (5), a grinding and polishing mechanism (6), an ultrasonic cleaning mechanism (7) and a drying mechanism (8), wherein the crystal support turnover mechanism (2), the electromagnetic degumming mechanism (3) is used for heating the surface of the crystal support, the resin plate separating mechanism (4) is used for pushing away the resin plate on the crystal support, the gum shoveling mechanism (5) is used for shoveling the surface of the crystal support, the grinding and polishing mechanism (6) is used for polishing the surface of the crystal support, the ultrasonic cleaning mechanism (7) is used for cleaning the surface of the crystal support, and the drying mechanism (8) is used for drying the surface of the crystal support; the crystal support overturning mechanism (2) is used for overturning and positioning the crystal support and is arranged at the initial end of the crystal support conveying line (2002), and the drying mechanism (8) is arranged at the tail end of the crystal support conveying line (2002); a crystal support feeding mechanism (1) is arranged beside the crystal support turnover mechanism (2) so as to convey the crystal support to be glued to the crystal support turnover mechanism (2);
The glue shoveling mechanism (5) comprises a fourth support frame (51) which is arranged together with the crystal support conveying line (2002), a fixing frame (52) is arranged on the fourth support frame (51), and a movable plate (53) which slides back and forth along the crystal support conveying direction and a driving mechanism (54) which is used for driving the movable plate (53) to slide are arranged on the fixing frame (52); the movable plate (53) is provided with a top surface glue shoveling mechanism (55) for shoveling the top surface of the crystal support, the movable plate (53) is provided with a pair of second fixing plates (533) respectively arranged on two sides of the top surface glue shoveling mechanism (55), and the second fixing plates (533) on two sides are respectively provided with a side surface glue shoveling mechanism (56) for shoveling the side surface of the crystal support.
2. An automated crystal clear surface removal system according to claim 1, wherein: the crystal support feeding mechanism (1) comprises a first supporting frame (1001) and an electromagnet (1008) for sucking the crystal support, a first movable mechanism (1002) capable of performing multi-axis movement is arranged on the first supporting frame (1001), the electromagnet (1008) is arranged on the first movable mechanism (1002), and the first movable mechanism (1002) drives the electromagnet (1008) to perform free movement.
3. An automated crystal clear surface removal system according to claim 1, wherein: the crystal support overturning mechanism (2) comprises a second supporting frame (2001) arranged at the initial end of the crystal support conveying line (2002), a first supporting bearing (2003) is arranged on the second supporting frame (2001), a first rotating shaft (2004) is rotatably arranged on the first supporting bearing (2003), and the axial direction of the first rotating shaft (2004) is parallel to the conveying direction of the crystal support conveying line (2002); a pair of overturning tooth forks (2005) for overturning the crystal support are arranged on the first rotating shaft (2004); a turnover motor (2007) is arranged on the second support frame (2001), a first gear (2006) is arranged on an output shaft of the turnover motor (2007) and a first rotating shaft (2004), and a first toothed belt (2008) is wound on the first gear (2006).
4. An automated crystal clear surface removal system according to claim 1, wherein: the electromagnetic degumming mechanism (3) comprises a third supporting frame (3001) which is arranged together with the crystal support conveying line (2002), a first guide rod (3002) which is vertically arranged is fixedly arranged on the third supporting frame (3001), and a first lifting plate (3003) is slidingly arranged on the first guide rod (3002); a first fixing plate (3004) is fixedly arranged at the top end of the first guide rod (3002), a first air cylinder (3005) with a downward telescopic rod is arranged on the first fixing plate (3004), and the telescopic rod end part of the first air cylinder (3005) is fixedly arranged with the first lifting plate (3003); a heating coil (3006) arranged above the crystal support conveying line (2002) is arranged on the first lifting plate (3003).
5. An automated crystal clear surface removal system according to claim 1, wherein: the resin plate separating mechanism (4) comprises a fixed seat (4001) arranged on a third supporting frame (3001), a guide cylinder (4002) horizontally arranged is arranged on the fixed seat (4001), a sliding rod (4003) is slidably arranged on the guide cylinder (4002), the sliding direction of the sliding rod (4003) is perpendicular to the conveying direction of the crystal support, a pushing plate (4004) for pushing away the resin plate on the crystal support is arranged on the end part of the sliding rod (4003), and a pushing cylinder (4005) for pushing the pushing plate (4004) to move is further arranged on the fixed seat (4001).
6. An automated crystal clear surface removal system according to claim 1, wherein: the glue shoveling mechanism (5) further comprises a positioning mechanism (58) arranged on the fourth supporting frame (51) so as to fix the crystal support at a specified position; a plurality of first flushing water guns (57) for spraying water are arranged on the movable plate (53), a first liquid collecting frame (59) for collecting waste liquid is arranged on the fourth supporting frame (51), the first liquid collecting frame (59) is arranged below the positioning mechanism (58) and is provided with an opening at the bottom, and a first waste liquid recovery mechanism (510) arranged below the opening is further arranged on the fourth supporting frame (51).
7. The automated crystal clear surface removal system of claim 6, wherein: the top surface glue shoveling mechanism (55) comprises a second lifting frame (5501) which is arranged on the second fixed plate (533) in an up-and-down movable mode and a driving part which drives the second lifting frame (5501) to move up and down, and a first tool apron (5507) which can slide up and down is arranged on the second lifting frame (5501); a pair of first shovel blades (5510) for shoveling out glue are fixedly arranged on the first tool apron (5507); a first spring (5509) is arranged between the second lifting frame (5501) and the first tool holder (5507) so as to apply downward force to the first tool holder (5507);
The side glue shoveling mechanism (56) comprises a second air cylinder (5601) arranged on a second fixed plate (533), a telescopic rod of the second air cylinder (5601) faces to the first shovel blade (5510), a fixed block (5602) is fixedly arranged on the telescopic rod of the second air cylinder (5601), a second cutter seat (5603) is slidingly arranged on the fixed block (5602), and the sliding direction of the second cutter seat (5603) is perpendicular to the conveying direction of the crystal support; a second spring (5605) is arranged between the fixed block (5602) and the second tool apron (5603); a pair of second shovel blades (5606) for shoveling glue are fixedly arranged on the second knife rest (5603).
8. An automated crystal clear surface removal system according to claim 1, wherein: the grinding and polishing mechanism (6) comprises a fifth support frame (61) which is arranged together with the crystal support conveying line (2002), a glue removing mechanism (64) for removing glue on the glue coated surface of the crystal support is arranged on the fifth support frame (61), and a second flushing water gun (65) for spraying water is arranged on the glue removing mechanism (64); the wafer support conveying line (2002) is provided with a gluing surface grinding mechanism (68) for polishing a wafer support gluing surface and a side edge grinding mechanism (69) for polishing a side edge of the wafer support, and the gluing surface grinding mechanism (68) and the side edge grinding mechanism (69) are both provided with a second flushing water gun (65).
9. An automated crystal clear surface removal system according to claim 1, wherein: the ultrasonic cleaning mechanism (7) comprises an ultrasonic cleaning tank (71), a sixth supporting frame (72) is arranged beside the ultrasonic cleaning tank (71), and a second movable mechanism (73) for performing multi-axis movement is arranged on the sixth supporting frame (72); a rotating plate (77) is horizontally and rotatably arranged at the bottom end of the second movable mechanism (73), and an adjusting motor (78) for driving the rotating plate (77) to rotate is arranged on the second movable mechanism (73); a wafer carrier clamp (79) for carrying the wafer carrier is arranged on the rotating plate (77).
10. An automated crystal clear surface removal system according to claim 1, wherein: the drying mechanism (8) comprises a seventh supporting frame (81), the crystal support conveying line (2002) is arranged on the seventh supporting frame (81), a pair of normal-temperature air knives (82) for drying the crystal support are arranged on the seventh supporting frame (81), the normal-temperature air knives (82) are arranged above the crystal support conveying line (2002) and are provided with strip-shaped air outlets at the bottom, and the length of each air outlet is larger than the width of each crystal support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311656318.0A CN117564905A (en) | 2023-12-05 | 2023-12-05 | Automatic crystal support surface glue removing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311656318.0A CN117564905A (en) | 2023-12-05 | 2023-12-05 | Automatic crystal support surface glue removing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117564905A true CN117564905A (en) | 2024-02-20 |
Family
ID=89895438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311656318.0A Pending CN117564905A (en) | 2023-12-05 | 2023-12-05 | Automatic crystal support surface glue removing system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117564905A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117920685A (en) * | 2024-03-22 | 2024-04-26 | 杭州中为光电技术有限公司 | A remove gluey equipment for brilliant support |
-
2023
- 2023-12-05 CN CN202311656318.0A patent/CN117564905A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117920685A (en) * | 2024-03-22 | 2024-04-26 | 杭州中为光电技术有限公司 | A remove gluey equipment for brilliant support |
| CN117920685B (en) * | 2024-03-22 | 2024-07-16 | 杭州中为光电技术有限公司 | A remove gluey equipment for brilliant support |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100197090B1 (en) | Method for fabricating semiconductor wafer and system therefor | |
| CN117564905A (en) | Automatic crystal support surface glue removing system | |
| TW201200297A (en) | Sand-blasting apparatus and method for shaping product with same | |
| CN210413093U (en) | Laser cutting equipment | |
| CN110405574B (en) | Automatic grinding production line | |
| CN107598710B (en) | Automatic glass edging machine for protecting lens of camera | |
| CN205129594U (en) | Axle bush self - cleaning device | |
| CN110919383A (en) | Mechanical claw welding and milling assembly equipment | |
| CN109571234B (en) | Full-automatic grinding production line | |
| CN110899702A (en) | Metal part assembly line 3D printing method and device | |
| CN105049561B (en) | Mobile phone film production line | |
| CN108972171A (en) | A kind of cutting edge grinding machine | |
| CN202240826U (en) | Full-automatic polishing machine for diamond saw blade matrix | |
| CN115319299B (en) | Multifunctional laser marking machine | |
| CN212240239U (en) | A CNC machine tool with chip removal function | |
| CN112658504A (en) | Laser cutting device convenient to clearance | |
| CN108044355B (en) | Laser grinding wheel scribing machine and composite material cutting method | |
| CN115502483A (en) | Battery deburring equipment | |
| CN104959892B (en) | Crystal blank grinding system | |
| CN209986696U (en) | Full-automatic edge grinding machine for glass | |
| CN209998927U (en) | Full-automatic internal polishing machine | |
| CN221364262U (en) | Crystal support surface grinding and polishing mechanism | |
| CN210476455U (en) | Automatic grinding production line | |
| CN212242586U (en) | Rotary disc type pad printing machine | |
| CN220498610U (en) | Carbon fiber plate surface treatment device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |