CN117559119A - Radiating elements and base station antennas - Google Patents

Abstract

The present disclosure relates to a radiating element comprising a radiator with a radiating arm, the radiator being configured to emit a first electromagnetic radiation within a predetermined first operating frequency band, a parasitic metal pattern, a resonant circuit being formed between the radiating arm and the parasitic metal pattern of the radiator, the resonant circuit being configured to allow an operating current on the radiating arm within the first operating frequency band to pass, while blocking an induced current induced on the radiating arm within a second operating frequency band. Furthermore, the disclosure also relates to a base station antenna with the radiating element.

Description

Radiating element and base station antenna

Technical Field

The present disclosure relates generally to radio communications, and more particularly to a radiating element and associated base station antenna.

Background

Cellular communication systems are well known in the art. In cellular communication systems, a geographical area is divided into a series of areas, which are referred to as "cells" served by individual base stations. A base station may include one or more base station antennas configured to provide two-way radio frequency ("RF") communication with mobile subscribers within a cell served by the base station.

In many cases, each base station is divided into "sectors". In the most common configuration, the hexagonal cell is divided into three 120 ° sectors, each sector being served by one or more base station antennas generating a radiation pattern or "antenna beam" having an azimuth half-power beamwidth (HPBW) of about 65 °. Typically, the base station antennas are mounted on a tower structure, wherein the antenna beams generated by the base station antennas are directed outwards. Base station antennas are typically implemented as linear or planar phased arrays of radiating elements.

To accommodate the increasing cellular traffic, cellular operators have increased cellular services in various new frequency bands. While in some cases it is possible to use a so-called linear array of "wideband" or "ultra wideband" radiating elements to provide services in multiple frequency bands, in other cases it is desirable to use a linear or planar array of different radiating elements to support services in different frequency bands.

As the number of frequency bands increases, sectorization increases become more and more common (e.g., dividing a cell into six, nine, or even twelve sectors), and the number of base station antennas deployed at a typical base station increases significantly. However, there are often limitations to the number of base station antennas that can be deployed at a given base station due to local zoning regulations and/or weight of antenna towers, wind load limitations, and the like. In order to increase the capacity without further increasing the number of base station antennas, so-called multiband antennas have been introduced in which a plurality of linear arrays of radiating elements are included in a single antenna. A very common multiband antenna comprises a linear array of "low band" radiating elements for providing service in some or all of the 617-960MHz bands, and a linear array of "mid band" radiating elements for providing service in some or all of the 1427-2690MHz bands. These linear arrays of low-band and mid-band radiating elements are typically mounted in a side-by-side fashion.

However, in a multiband antenna, radiating elements of different frequency bands may interfere with each other. For example, the low-band radiating elements may have a large scattering effect on nearby mid-band radiating elements and/or high-band radiating elements, thereby affecting performance, e.g., lobe width, etc., of the mid-band radiating elements and/or high-band radiating elements.

In order to avoid the above-mentioned scattering effects, in some known prior art chokes may be introduced on the radiating arms of the low-band radiating elements, so as to suppress mid-band currents and/or high-band currents excited on the radiating arms. In some cases, the choke may be formed by a gap introduced to break the radiating arm. In some cases, the choke may be formed by a bent section functioning as an inductive section.

Referring to fig. 1, a schematic diagram of a radiator 1 of a low-band radiating element known in the prior art is shown. Each of the four radiating arms of the radiator 1 may be broken into a plurality of arm sections 2. The individual arm sections 2 can be connected via bent, narrower inductive sections 3, which can act as chokes.

Referring to fig. 2, a simplified equivalent circuit diagram of one resonant circuit on the radiating arm of the radiating element of fig. 1 is shown. The arm section 2 of the radiating arm may function as a capacitive section and the bent narrower section 3 may function as an inductive section. Thus, the capacitive section and the inductive section may form an LC series resonant circuit, which may be configured to suppress mid-band and/or high-band currents excited on the radiating arm. It will be appreciated that the equivalent circuit diagram of the resonant circuit is a simplified circuit diagram in which the parasitic capacitance and/or parasitic inductance, which are negligible in value, are omitted. Parasitic capacitances can also be formed, for example, between two adjacent arm sections.

However, accompanying the choke, the radiation performance of the low-band radiating element itself can be negatively affected. In some cases, the choke may undesirably change, e.g., increase, the impedance of the low-band radiating element, making impedance matching difficult, and thus the return loss worsens. Furthermore, the choke may undesirably increase the radiation loss of the low-band radiating element, so that the antenna gain is lowered. These problems become more pronounced as the number of chokes on the radiating arms increases.

Disclosure of Invention

It is therefore an object of the present disclosure to provide a radiating element and a base station antenna that overcome at least one of the drawbacks of the prior art.

According to a first aspect of the present disclosure there is provided a radiating element comprising:

a radiator with a radiating arm, the radiator being configured to emit first electromagnetic radiation within a predetermined first operating frequency band,

a parasitic metal pattern forming a resonant circuit between the radiating arm of the radiator and the parasitic metal pattern, the resonant circuit configured to allow an operating current on the radiating arm to pass within a first operating frequency band and to block an induced current induced on the radiating arm within a second operating frequency band.

According to a second aspect of the present disclosure, there is provided a radiating element comprising:

a dielectric substrate;

a radiator disposed on the first major surface of the dielectric structure, the radiator configured to emit first electromagnetic radiation within a predetermined first operating frequency band; and

a parasitic metal pattern disposed on the second major surface of the dielectric structure, the parasitic metal pattern configured to electromagnetically interact with the radiator for suppressing induced currents induced on the radiator within the second operating frequency band.

According to a third aspect of the present disclosure, there is provided a base station antenna comprising:

a first array of radiating elements configured to emit first electromagnetic radiation within a predetermined first operating frequency band, wherein at least a portion of the first array of radiating elements are configured as radiating elements according to some embodiments of the present disclosure; and

a second array of radiating elements configured to emit second electromagnetic radiation within a predetermined second operating frequency band.

Drawings

The disclosure is described in more detail below with reference to the accompanying drawings by means of specific embodiments. The schematic drawings are briefly described as follows:

fig. 1 is a schematic view of a radiator of a radiating element known in the prior art, with a plurality of chokes.

Fig. 2 is a simplified equivalent circuit diagram of one resonant circuit formed on the radiator of fig. 1.

Fig. 3 is a schematic perspective view of a base station antenna with a radome removed, according to some embodiments of the present disclosure.

Fig. 4 is a schematic perspective view of a radiating element according to some embodiments of the present disclosure, wherein the feed post is not shown.

Fig. 5 is a schematic diagram of a radiator of the radiating element in fig. 4.

Fig. 6 is a schematic diagram of a parasitic metal pattern of the radiating element in fig. 4.

Fig. 7A and 7B are some variations of radiators of radiating elements according to some embodiments of the present disclosure.

Fig. 8A, 8B, 8C, and 8D are some variations of parasitic metal patterns of radiating elements according to some embodiments of the present disclosure.

Fig. 9 is a schematic perspective view of a radiating element according to further embodiments of the present disclosure, wherein the feed post is not shown.

Fig. 10 is a schematic view of a radiator of the radiating element in fig. 9.

Fig. 11 is a schematic diagram of a parasitic metal pattern of the radiating element in fig. 9.

Fig. 12 is a simplified equivalent circuit diagram of one resonant circuit formed on a radiating element according to some embodiments of the present disclosure.

Detailed Description

The present disclosure will be described below with reference to the accompanying drawings, which illustrate several embodiments of the present disclosure. It should be understood, however, that the present disclosure may be presented in many different ways and is not limited to the embodiments described below; indeed, the embodiments described below are intended to more fully convey the disclosure to those skilled in the art and to fully convey the scope of the disclosure. It should also be understood that the embodiments disclosed herein can be combined in various ways to provide yet additional embodiments.

It should be understood that the terminology herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the present disclosure. All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art unless otherwise defined. Well-known functions or constructions may not be described in detail for brevity and/or clarity.

In this document, spatially relative terms such as "upper," "lower," "left," "right," "front," "rear," "high," "low," and the like may be used to describe one feature's relationship to another feature in the figures. It will be understood that the spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, when the device in the figures is inverted, features that were originally described as "below" other features may be described as "above" the other features. The device may also be otherwise oriented (rotated 90 degrees or at other orientations) and the relative spatial relationship will be explained accordingly.

In this document, the term "a or B" includes "a and B" and "a or B", and does not include exclusively only "a" or only "B", unless otherwise specifically indicated.

In this document, the terms "schematic" or "exemplary" mean "serving as an example, instance, or illustration," rather than as a "model" to be replicated accurately. Any implementation described herein by way of example is not necessarily to be construed as preferred or advantageous over other implementations. Furthermore, this disclosure is not limited by any expressed or implied theory presented in the preceding technical field, background, brief summary or the detailed description.

As used herein, the term "substantially" is intended to encompass any minor variation due to design or manufacturing imperfections, tolerances of the device or element, environmental effects and/or other factors.

In this context, the term "part" may be any proportion of parts. For example, it may be greater than 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90%, or even 100%, i.e., all.

In addition, for reference purposes only, the terms "first," "second," and the like may also be used herein, and are thus not intended to be limiting. For example, the terms "first," "second," and other such numerical terms referring to structures or elements do not imply a sequence or order unless clearly indicated by the context.

The present disclosure relates to a radiating element that may include a feed post, a radiator, and a parasitic metal pattern between which a desired resonant circuit may be formed such that the radiating element has a cloaking that meets predetermined design requirements. The stealth of the radiation element may be understood as the transparency or invisibility of the radiation element to electromagnetic radiation in a specific operating frequency band (hereinafter referred to as second operating frequency band) outside the own operating frequency band (hereinafter referred to as first operating frequency band), so that electromagnetic radiation in the second operating frequency band may radiate forward with low loss and low distortion substantially unaffected by the radiation element. In other words, the stealth of the radiation element is understood to mean that the radiation element has a suppressing or attenuating effect on the induced currents in the second operating frequency band such that the radiation element is substantially unable to radiate outwards scattered electromagnetic radiation in the second operating frequency band.

The radiation element according to the present disclosure can effectively achieve a suppression effect or an attenuation effect on an induced current in the second operation frequency band without a choke or with only a small number of chokes based on electromagnetic effects between the radiator and the parasitic metal pattern, thereby improving impedance matching performance of the radiation element.

Some embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings.

Referring to fig. 3, fig. 3 is a schematic perspective view of a base station antenna 100 with a radome removed, according to some embodiments of the present disclosure.

The base station antenna 100 may be mounted on a raised structure, such as an antenna tower, pole, building, water tower, etc., such that its longitudinal axis may extend substantially perpendicular to the ground.

The base station antenna 100 is typically mounted within a radome (not shown) that provides environmental protection. The base station antenna 100 may include a reflector plate 10, and the reflector plate 10 may include a metal surface that provides a ground plane and reflects, e.g., redirects, electromagnetic waves arriving at it to propagate forward.

The base station antenna 100 may include a radiating element array disposed at the front side of the reflection plate 10. The radiating element array may include a plurality of columns of radiating elements arranged in a longitudinal direction V. The longitudinal direction V may be in the direction of the longitudinal axis of the base station antenna 100 or parallel to the longitudinal axis. The longitudinal direction V is perpendicular to the horizontal direction H and the forward direction F. Each radiating element is mounted to extend forward (in the forward direction F) from the reflecting plate 10.

The base station antenna 100 may be a multi-band antenna. The term "multi-band antenna" refers to an antenna having two or more radiating elements operating in different frequency bands. The multi-band antenna includes a dual-band antenna and an antenna supporting services in three or more frequency bands.

In the illustrated embodiment, the base station antenna 100 may include a plurality of columns of first radiating elements 20 and a plurality of columns of second radiating elements 21 arranged at the front side of the reflection plate 10. The operating frequency band of the first radiating element 20 may be, for example, 617-960MHz or a sub-band thereof. The operating frequency band of the second radiating element 21 may be, for example, 1427-2690MHz or a sub-band thereof. In other words, the first radiating element 20 may be configured as a low frequency band radiating element capable of operating within a predetermined first operating frequency band and emitting first electromagnetic radiation within the first operating frequency band. The second radiating element 21 may be configured as a mid-band radiating element to operate within a predetermined second operating frequency band and emit second electromagnetic radiation within the second operating frequency band. The first radiation element 20 may extend forward from the reflection plate 10 farther than the second radiation element 21.

Depending on the manner in which the first radiating elements 20 are fed, the columns of first radiating elements 20 may be configured to form a plurality of separate first antenna beams (for each polarization) within the first operating frequency band, or may be configured to form a single antenna beam (for each polarization) within the first operating frequency band. Depending on the way the second radiating elements 21 are fed, the columns of second radiating elements 21 may be configured to form a plurality of separate second antenna beams (for each polarization) within the second operating frequency band, or may be configured to form a single second antenna beam (for each polarization) within the second operating frequency band.

It should be understood that the base station antenna 100 may further include a plurality of columns of third radiating elements (not shown) disposed at the front side of the reflection plate 10. The third radiating element may be configured as a high-band radiating element, the operating band of which may be, for example, 3.1-4.2 GHz or a sub-band thereof.

The radiating element 20 according to some embodiments of the present disclosure may be a low frequency radiating element, i.e. the first radiating element 20 described above. In other embodiments, the radiating element 20 according to some embodiments of the present disclosure may also be a wideband radiating element, the operating frequency band of which may not be limited to the first operating frequency band.

Next, referring to fig. 4 to 6, the radiation element 20 according to some embodiments of the present disclosure will be described in detail. The radiating element 20 may include a radiator 30 and a parasitic metal pattern 40. Based on the electromagnetic action between the radiator 30 and the parasitic metal pattern 40, the desired scattering suppression effect is effectively achieved with no or less chokes to the radiator 30. The present disclosure forms a resonant circuit 50 based on electromagnetic interaction between the radiator 30 and the parasitic metal pattern 40, the resonant circuit 50 may be configured to allow the passage of an operating current on the radiator 30 that is within a first operating frequency band while preventing the formation of an induced current on the radiator 30 that is within a second operating frequency band.

As shown in fig. 4 and 5, radiating element 20 may include a first dipole radiator 30-1 for a first polarization and a second dipole radiator 30-2 for a second polarization, where first dipole radiator 30-1 may include a first dipole arm 31 and a second dipole arm 32, and where second dipole radiator 30-2 may include a third dipole arm 33 and a fourth dipole arm 34. In some embodiments, each dipole arm may be a ring-shaped radiating arm. As shown in the figures, each dipole arm may be a square ring radiating arm. It should be understood that the dipole arm shape may be varied and is not limited thereto. In some embodiments, the dipole arms may be bar-shaped dipole arms. In some embodiments, the dipole arms may be polygonal radiating arms, such as diamond radiating arms. In some embodiments, the dipole arms may be annular radiating arms or petal-shaped radiating arms (see fig. 9).

As shown in fig. 4 and 6, parasitic metal pattern 40 of radiating element 20 may include a first pattern portion 42-1 for first dipole arm 31, a second pattern portion 42-2 for second dipole arm 32, a third pattern portion 42-3 for third dipole arm 33, and a fourth pattern portion 42-4 for fourth dipole arm 34. The respective pattern portions 42 may be pattern units separated from each other or may be pattern units continuous with each other. It is also possible that only some dipole arms 31, 32, 33, 34 are assigned corresponding pattern portions 42. In some embodiments, each pattern portion 42 may be configured as a pattern unit of substantially the same shape. In other embodiments, at least some of the pattern portions 42 may have different shapes. Each pattern portion 42 may have a profile substantially corresponding to the dipole arms 31, 32, 33, 34. For example, each pattern portion 42 may have a square profile or an annular profile. To create a symmetrical electromagnetic environment, the parasitic metal pattern 40 of the radiating element 20 may have an axisymmetric and/or centrosymmetric arrangement. Referring to fig. 8A, 8B, 8C, and 8D, some variations of the parasitic metal pattern 40 are shown. It should be understood that the design of the parasitic metal pattern 40 may be varied. In other embodiments, the parasitic metal pattern 40 may be configured as a metamaterial surface with periodically arranged cells. In some embodiments, the parasitic metal pattern 40 may be configured as a patch element.

The radiating element 20 may comprise a dielectric structure, such as a dielectric substrate 22, the radiator 30 may be arranged on a first main surface of the dielectric substrate 22, and the parasitic metal pattern 40 may be arranged on a second main surface of the dielectric substrate 22. Thereby, the parasitic metal pattern 40 may be arranged behind or in front of the radiator 30, e.g. substantially parallel to the radiator 30, so as to form a desired electromagnetic effect between the dipole arms 31, 32, 33, 34 and the respective pattern portions 42, thereby forming a desired resonant circuit 50.

It should be appreciated that the dielectric structure of the radiating element 20 may have a variety of configurations. In some embodiments, the dielectric structure of the radiating element 20 may be a support structure made of a dielectric material (e.g., plastic, resin, ceramic, etc.). In some embodiments, the dielectric structure of the radiating element 20 may be a dielectric substrate of a printed circuit board.

In the illustrated embodiment, the radiator 30 may be a printed metal radiator 30 that may be printed as a printed pattern onto the first major surface of the dielectric substrate 22. The parasitic metal pattern 40 may be printed as a printed metal pattern onto the second major surface of the dielectric substrate 22. In other embodiments, the radiator 30 may be a sheet metal radiator 30 that may be fastened (e.g., glued, snapped, and/or screwed) to the first major surface of the dielectric substrate 22. In other embodiments, the parasitic metal pattern 40 may be a planar metal structure that may be fastened (e.g., glued, snapped, and/or screwed) to the second major surface of the dielectric substrate 22.

Next, referring to fig. 4-6 and fig. 12, a resonant circuit 50 formed on the radiating element 20 is described.

As shown in fig. 12, the resonant circuit 50 may include an LC series circuit and a capacitor connected in parallel with the LC series circuit.

The capacitance in the LC series circuit (hereinafter referred to as first capacitance C1) may be formed by coupling between the dipole arms 31, 32, 33, 34 and the corresponding pattern portions 42. As shown in fig. 5-6, the respective dipole arms 31, 32, 33, 34 may include a first coupling section 36 (shown in phantom). The parasitic metal pattern 40 may include a second coupling section 46 (shown in phantom) that at least partially overlaps the first coupling section 36 in the forward direction F. Thus, the first coupling section 36, the second coupling section 46, and the dielectric substrate 22 therebetween may form a plate capacitor. An inductance in the LC series circuit (hereinafter referred to as a first inductance L1) may be formed by the inductive section 48 in the pattern portion 42. These inductive segments 48 may be inductive stubs or meander inductive traces. In the present disclosure, the inductive section 48 may be understood as a section whose frequency characteristics are approximately equivalent to one inductance. For example, a segment 48 may be considered to be an inductive segment when the S-parameter frequency characteristic of the segment 48, e.g., the S11 and/or S12 parameter frequency characteristic, may be approximately equivalent to an "inductive" S-parameter frequency characteristic.

The capacitance (hereinafter referred to as second capacitance C2) in parallel with the LC series circuit may be formed by a capacitive arm section 39 of a predetermined length of the dipole arms 31, 32, 33, 34 themselves. In this disclosure, capacitive arm segment 39 may be understood as a segment whose frequency characteristics are approximately equivalent to a "capacitance". For example, an arm segment 39 may be considered a capacitive arm segment when the S-parameter frequency characteristic of the arm segment 39, e.g., the frequency characteristic of the S11 and/or S12 parameters, may be approximately equivalent to the S-parameter frequency characteristic of a capacitor.

It will be appreciated that the equivalent circuit diagram of the resonant circuit shown in fig. 12 is a simplified process in which parasitic capacitances and/or parasitic inductances that are negligible in value are omitted. For example, parasitic capacitances may also be formed between two adjacent sense sections 48 of the parasitic metal pattern 40, but these parasitic capacitances are negligible. It should be appreciated that the resonant frequency of the resonant circuit 50 may be related to the area of overlap between the first coupling section 36 and the second coupling section 46, the thickness and dielectric constant of the dielectric substrate 22, the design parameters of the inductive stub 48, and/or the design parameters of the capacitive arm sections 39 of the dipole arms 31, 32, 33, 34. In some embodiments, the resonant circuit 50 may be a bandpass resonant circuit. In some embodiments, the resonant circuit 50 may be a low-pass resonant circuit or a band-reject resonant circuit. The resonant circuit 50 may be configured such that the first operating frequency band is within the passband (e.g., 3dB passband) of the resonant circuit 50 and the second operating frequency band is outside the passband of the resonant circuit 50.

A multi-order resonant circuit 50 may be formed between the dipole arms 31, 32, 33, 34 and the corresponding pattern portions 42, thereby further improving the frequency characteristics of the resonant circuit 50. As shown in fig. 5, each pattern portion 42 may include a plurality of sub-patterns 49, for example, separated from each other. Each sub-pattern 49 may comprise the above mentioned second coupling section 46 and inductive section 48, each sub-pattern 49 and forming at least one resonant circuit 50 with the arm sections of the corresponding dipole arms 31, 32, 33, 34, respectively. Thus, the multi-order resonant circuit 50 between the dipole arms 31, 32, 33, 34 and the corresponding pattern portions 42 may be formed of a plurality of resonant circuits 50 connected in series.

Additionally or alternatively, the first radiating element 20 may have multiband stealth or broadband stealth. Referring to fig. 8A, the pattern portion 42 of the parasitic metal pattern 40 may include a first sub-pattern 49-1 and a second sub-pattern 49-2 different from the first sub-pattern 49-1, thereby forming a first resonant circuit having a first frequency characteristic between the dipole arms 31, 32, 33, 34 and the first sub-pattern 49-1, and a second resonant circuit having a second frequency characteristic between the radiating arm of the radiator 30 and the second sub-pattern 49-2. For example, the first resonant circuit may be configured to allow an operating current on the dipole arm that is within the first operating frequency band to pass, while preventing an induced current on the dipole arm that is within the third operating frequency band from forming. The second resonant circuit may be configured to allow an operating current on the dipole arm in the first operating frequency band to pass, while blocking an induced current on the radiating arm in the fourth operating frequency band. Thus, the first radiating element 20 may be stealth not only for electromagnetic radiation in the third operating frequency band but also for electromagnetic radiation in the fourth operating frequency band.

It should be appreciated that the differences between the first sub-pattern 49-1 and the second sub-pattern 49-2 may include, but are not limited to: the area of overlap between the first coupling section 36 and the second coupling section 46, the thickness and dielectric constant of the dielectric substrate 22, the design parameters of the inductive stub 48, and/or the design parameters of the capacitive arm section 39 of the dipole arm.

In some embodiments, referring to fig. 8A, the area of the second coupling section 46 of the first sub-pattern 49-1 may be larger than the area of the second coupling section 46 of the second sub-pattern 49-2, such that the overlapping area between the first coupling section 36 and the second coupling section 46 of the first sub-pattern 49-1 increases, thereby increasing the coupling capacitance.

In some embodiments, the dielectric constant of the dielectric structure between the second coupling section 46 of the first sub-pattern 49-1 and the first coupling section 36 of the corresponding dipole arm may be different from the dielectric constant of the dielectric structure between the second coupling section 46 of the second sub-pattern 49-2 and the first coupling section 36 of the corresponding dipole arm. This may be achieved, for example, by using different types of dielectric structures or applying additional dielectric layers. In some embodiments, the length and/or shape of the inductive stub 48 of the first sub-pattern 49-1 may be different from the length and/or shape of the inductive stub 48 of the second sub-pattern 49-2.

In some embodiments, the stealth of the first radiating element 20 may result from only the resonant circuit 50 formed between the parasitic metal pattern 40 and the dipole arms 31, 32, 33, 34. In other words, dipole arms 31, 32, 33, 34 of first radiating element 20 may act as non-stealth dipole arms without having chokes, such that negative effects of the chokes may be substantially eliminated. As shown in fig. 4, dipole arms 31, 32, 33, 34 of first radiating element 20 are configured as continuous radiating arms without any chokes.

In some embodiments, the stealth of the first radiating element 20 may result from not only the choke but also the resonant circuit 50 formed between the parasitic metal pattern 40 and the dipole arms 31, 32, 33, 34. In this case the dipole arms of the first radiating element 20 may have a smaller number of chokes. For example, each dipole arm may have fewer than three or two chokes, so that the negative effects of the chokes may be reduced. As shown in fig. 7A and 7B, a choke 37 is introduced in each dipole arm 31, 32, 33, 34, which choke may be arranged, for example, at the distal end of the dipole arm 31, 32, 33, 34.

The radiating element of the present disclosure may effectively reduce unwanted scattered electromagnetic radiation based on the resonant circuit 50 formed between the parasitic metal pattern 40 and the radiator 30. In some embodiments, the power of the scattered electromagnetic radiation generated by the radiating element in the second operating frequency band without the parasitic metal pattern 40 is P1 (first power). The power of the scattered electromagnetic radiation generated by the radiating element in the second operating band is P2 (second power) with the same radiating element with the parasitic metal pattern 40. The second power is attenuated by at least 3dB, 4dB, 5dB, or 6dB relative to the first power based on the resonant circuit 50 formed between the parasitic metal pattern 40 and the radiator 30.

Next, referring to fig. 9 to 11, schematic perspective views of a radiation element 20' according to further embodiments of the present disclosure are described. It should be understood that the descriptions of the radiating element 20 can be directly transferred to the embodiment, and are not repeated herein unless contradicted.

In the illustrated implementation, the radiating element 20' may include a radiator 30' and a parasitic metal pattern 40'. Each dipole arm 31', 32', 33', 34' of the radiator 30' may be a petal-shaped dipole arm, and each dipole arm 31', 32', 33', 34' may be a choke-free continuous dipole arm. The pattern portion 42 'corresponding to each dipole arm 31', 32', 33', 34 'may also have a substantially petal-shaped profile in order to form a desired resonant circuit between the dipole arm and the corresponding pattern portion 42'.

As shown in fig. 9-10, the radiating arms 31', 32', 33', 34' may include a first coupling section 36'. The parasitic metal pattern 40' may include a second coupling section 46' that at least partially overlaps the first coupling section 36' in the forward direction F. Thus, the first coupling section 36', the second coupling section 46', and the dielectric substrate 22' therebetween may form a plate capacitance. The inductance in the LC series circuit (hereinafter referred to as the first inductance) may be formed by the inductive section 48 'in the pattern portion 42'. These inductive segments 48' may be inductive stubs, or meander inductive traces. The capacitance in parallel with the LC series circuit may be formed by a predetermined length of arm section of the dipole arm itself.

It should be appreciated that the frequency characteristics of the resonant circuit 50 'may be related to the area of overlap between the first coupling section 36' and the second coupling section 46', the thickness and dielectric constant of the dielectric substrate 22', the design parameters of the inductive stub, and/or the design parameters of the capacitive arm section of the dipole arm. In some embodiments, the resonant circuit may be a bandpass resonant circuit such that the first operating frequency band is within the passband (e.g., 3dB passband) of the resonant circuit and the second operating frequency band is outside the passband of the resonant circuit. For example, to increase the "plate capacitance", the area of overlap between the first coupling section 36 'and the second coupling section 46' may be widened. For this purpose, the first coupling section 36' of the radiating arm and/or the second coupling section 46' of the parasitic metal pattern 40' may be enlarged.

Although exemplary embodiments of the present disclosure have been described, it will be understood by those skilled in the art that various changes and modifications can be made to the exemplary embodiments of the present disclosure without departing from the spirit and scope of the disclosure. Accordingly, all changes and modifications are intended to be included within the scope of the present disclosure as defined by the appended claims. The disclosure is defined by the following claims, with equivalents of the claims to be included therein.

Claims (10)

1. Radiating components, including: a radiator with a radiating arm configured to emit first electromagnetic radiation within a predetermined first operating frequency band, a parasitic metal pattern, forming a resonant circuit between the radiating arm of the radiator and the parasitic metal pattern, the resonant circuit being configured to allow an operating current in the first operating frequency band to pass on the radiating arm while blocking the operating current on the radiating arm The induced current in the second operating frequency band. 2. The radiating element according to claim 1, characterized in that the resonant circuit includes: An LC series circuit including a first inductor and a first capacitor; and A second capacitor is connected in parallel with the LC series circuit. 3. The radiating element of claim 2, wherein the radiating arm includes a first coupling section, and the parasitic metal pattern includes a second coupling section, the first coupling section and the second coupling section. The coupling sections overlap each other forming a first capacitance. 4. The radiating element according to claim 3, wherein the radiating arm comprises a capacitive section functioning as a second capacitance, and the parasitic metal pattern comprises an inductive section functioning as a first inductance. 5. The radiating element according to claim 1, wherein a multi-order resonance circuit is formed between each radiating arm of the radiator and the parasitic metal pattern. 6. The radiation element according to claim 5, characterized in that the multi-stage resonant circuit includes a plurality of resonant circuits connected in series with each other. 7. The radiating element according to claim 4, characterized in that the inductive sections of the parasitic metal pattern are formed as inductive stubs. 8. The radiation element according to claim 1, characterized in that the resonant circuit is configured as a bandpass resonant circuit; and/or The frequency characteristics of the resonant circuit are related to the overlap area between the first coupling section and the second coupling section, the thickness and/or dielectric constant of the dielectric substrate, the design parameters of the inductive section, and/or the capacity of the radiating arm. related to the design parameters of the sexual section; and/or The parasitic metal pattern is arranged behind or in front of the radiator; and/or The parasitic metal pattern is arranged behind or in front of the radiator substantially parallel to the radiator; and/or The radiating element includes a dielectric substrate, the radiator is disposed on a first major surface of the dielectric substrate, and the parasitic metal pattern is disposed on a second major surface of the dielectric substrate; and/or The radiator is printed on a first major surface of the dielectric substrate, and the parasitic metal pattern is printed on a second major surface of the dielectric substrate; and/or The radiating arm is configured as an annular radiating arm; and/or The radiating arms are configured as square ring radiating arms or petal-shaped radiating arms; and/or The radiating elements include: a first dipole radiator including a first dipole arm and a second dipole arm; a second dipole radiator including a third dipole arm and a fourth dipole arm; The parasitic metal pattern includes a first pattern portion for the first dipole arm, a second pattern portion for the second dipole arm, a third pattern portion for the third dipole arm and a fourth dipole arm. the fourth pattern portion of the pole arm; and/or Each pattern portion has a profile that substantially corresponds to a dipole arm; and/or The radiating arm has less than two chokes configured to suppress induced currents induced in the radiating arm within the second operating frequency band; and/or The radiating arm does not have a choke; and/or The radiating arm is configured as a continuous radiating arm; and/or Relative to the radiating element without the parasitic metal pattern, the radiating element relies on the electromagnetic interaction between the parasitic metal pattern and the radiator, so that the scattered electromagnetic radiation generated by the radiating element and in the second operating frequency band is further attenuated by at least 3dB; and/ or Relative to the radiating element without the parasitic metal pattern, the radiating element relies on the electromagnetic interaction between the parasitic metal pattern and the radiator, so that the scattered electromagnetic radiation generated by the radiating element in the second operating frequency band is further attenuated by at least 6dB; and/ or The first operating frequency band includes at least a portion of the 617-960 MHz frequency band, the second operating frequency band includes at least a portion of the 1427-2690 MHz frequency band; and/or A first resonant circuit is formed between the dipole arm of the radiator and the first sub-pattern of the corresponding pattern portion, and a second resonant circuit is formed between the dipole arm of the radiator and the second sub-pattern of the corresponding pattern portion. , the frequency characteristics of the second resonant circuit are different from the frequency characteristics of the first resonant circuit; and/or The first resonant circuit is configured to allow the passage of an operating current in the first operating frequency band on the dipole arm and to block the induced current in the third operating frequency band induced on the dipole arm; The second resonant circuit is configured to allow the operating current in the first operating frequency band to pass through on the dipole arm, and to block the first induced current in the fourth operating frequency band induced on the dipole arm, said The fourth operating band is different from the third operating band; and/or The first sub-pattern and the second sub-pattern are designed to be different from each other. 9. Radiating components, including: dielectric substrate; a radiator arranged on a first major surface of the dielectric structure, the radiator configured to emit first electromagnetic radiation within a predetermined first operating frequency band; and A parasitic metal pattern arranged on the second major surface of the dielectric structure, said parasitic metal pattern being configured to interact electromagnetically with the radiator for suppressing an induced current induced on the radiator within a second operating frequency band ;and / or The dielectric structure is configured as a dielectric substrate, and the radiator is printed on a first major surface of the dielectric substrate, and the parasitic metal pattern is printed on a second major surface of the dielectric substrate; and/or The radiating arm of the radiator is configured as an annular radiating arm; and/or The radiating arm does not have a choke; and/or The radiating arm of the radiator is configured as a continuous annular radiating arm; and/or At least one resonant circuit is formed between each radiating arm of the radiator and the parasitic metal pattern, the resonant circuit being configured to allow an operating current in the first operating frequency band to pass on the radiating arm while blocking the operating current on the radiating arm. Induced current within the second operating frequency band; and/or Multiple resonant circuits are formed between each radiating arm of the radiator and the parasitic metal pattern; and/or The resonant circuit includes: LC series circuit, the LC series circuit includes a first inductor and a first capacitor; and/or a second capacitor, the second capacitor is connected in parallel with the LC series circuit; and/or the radiating arm includes a first coupling section, and the parasitic metal pattern includes a second coupling section, the first coupling section and the second coupling section overlap each other, thereby forming a first capacitance, The radiating arm includes a capacitive segment functioning as a second capacitance, and the parasitic metal pattern includes an inductive segment functioning as a first inductance; and/or The radiating elements include: a first dipole radiator including a first dipole arm and a second dipole arm; a second dipole radiator including a third dipole arm and a fourth dipole arm; The parasitic metal pattern includes a first pattern portion for the first dipole arm, a second pattern portion for the second dipole arm, a third pattern portion for the third dipole arm and a fourth dipole arm. the fourth pattern portion of the pole arm; and/or Individual pattern parts are separated from each other; and/or Each pattern portion includes a plurality of sub-patterns that are separate from each other; and/or Each pattern part including each sub-pattern is designed to be the same, or the first sub-pattern and the second sub-pattern in each pattern part are designed to be different. 10. Base station antenna, including: A first radiating element array configured to emit first electromagnetic radiation within a predetermined first operating frequency band, wherein at least a portion of the first radiating elements in the first radiating element array is configured according to one of claims 1 to 9 the radiating element described above; and A second array of radiating elements configured to emit second electromagnetic radiation within a predetermined second operating frequency band.