CN117553861A

CN117553861A - Ultrasonic transducer

Info

Publication number: CN117553861A
Application number: CN202311719830.5A
Authority: CN
Inventors: 周尚超; 蓝秋明; 刘泯炼; 覃东; 颜志进
Original assignee: Audiowell Electronics Guangdong Co ltd
Current assignee: Audiowell Electronics Guangdong Co ltd
Priority date: 2023-12-13
Filing date: 2023-12-13
Publication date: 2024-02-13

Abstract

The application relates to an ultrasonic transduction device, which comprises an installation cavity arranged in an installation seat, wherein a communication port is further formed in the side wall of the installation seat and is communicated with the installation cavity; the piezoelectric transduction piece is arranged in the mounting cavity and is aligned with the communication port; and the circuit board is arranged in the mounting cavity and is electrically connected with the piezoelectric transduction piece. The liquid flowing in the pipeline flows into the communication port and applies impact pressure to the piezoelectric transduction piece, so that the piezoelectric transduction piece can generate corresponding deformation according to the born liquid flow pressure, and the deformation is converted into an electric signal to be transmitted to the circuit board, and the real-time monitoring operation of the liquid pressure and flow can be realized. The ultrasonic transducer of this scheme has integrated the dual function of pressure transmitter and flow transducer, on the basis that satisfies monitoring liquid pressure and flow, has realized the high integration of function and structure, and ultrasonic transducer's is small, and occupied installation space is few to can effectively reduce cost, convenient centralized management and control.

Description

Ultrasonic transducer

Technical Field

The application relates to the technical field of liquid pressure and flow detection, in particular to an ultrasonic transduction device.

Background

In the production manufacturing operation of industries such as food, chemical industry, agriculture, new energy automobile, can relate to using the pipeline to carry the link of liquid, and in order to accurately detect the stability of carrying liquid, generally can install the pressure transmitter that is used for monitoring liquid pressure in the pipeline respectively, and be used for monitoring liquid flow's flow transducer, pressure transmitter and flow transducer all can occupy great intraductal space this moment, not only need adopt the pipeline of pipe diameter bigger, cause cost and area increase, also cause the influence to liquid normal transport simultaneously easily, and pressure transmitter and flow transducer are the components of a whole that can function independently, the degree of integration is low, be inconvenient for centralized control.

Disclosure of Invention

Based on the above, it is necessary to provide an ultrasonic transducer for solving the problems of high cost, large occupied installation space and low integration degree.

The application proposes an ultrasonic transduction device, it includes:

the mounting seat is internally provided with a mounting cavity, the side wall of the mounting seat is also provided with a communication port, and the communication port is communicated with the mounting cavity;

the piezoelectric transduction piece is arranged in the mounting cavity and is aligned with the communication port; the method comprises the steps of,

the circuit board is arranged in the mounting cavity and is electrically connected with the piezoelectric transduction piece.

In the ultrasonic transducer of this scheme, through installing piezoelectricity transduction piece and circuit board respectively in the installation cavity of mount pad to make piezoelectricity transduction piece and circuit board electric connection, set up the intercommunication mouth simultaneously on the mount pad, and make the setting position of intercommunication mouth counterpoint with the setting position of piezoelectricity transduction piece, consequently when this ultrasonic transducer installs in the pipeline, the liquid that flows in the pipeline can flow into in the intercommunication mouth and applys impact pressure to piezoelectricity transduction piece, make piezoelectricity transduction piece can produce the deformation of corresponding range according to the liquid flow pressure that bears, and convert deformation into electric signal transmission to circuit board, can realize the real-time supervision operation to liquid pressure and flow. Compared with the prior art, the ultrasonic transducer of this scheme has integrated the dual function of pressure transmitter and flow transducer, on the basis that satisfies monitoring liquid pressure and flow, has realized the high integration of function and structure, and ultrasonic transducer's is small, and the installation space that occupies is few to can effectively reduce cost, convenient centralized management and control.

The technical scheme of the application is further described below:

in one embodiment, the piezoelectric transduction piece comprises a piezoelectric ceramic plate, a silver-coated layer and an electric bridge, wherein the silver-coated layer and the electric bridge are both arranged on the side surface of the piezoelectric ceramic plate facing the communication port, the mounting seat is made of metal, the silver-coated layer is clung to the mounting seat, the silver-coated layer is in an annular structure, the electric bridge is arranged in an inner annular cavity of the silver-coated layer, and the electric bridge is opposite to the communication port.

In one embodiment, the ultrasonic transduction device further comprises a first adhesive, and the silver-coated layer is bonded with the side wall of the mounting cavity in a sealing mode through the first adhesive.

In one embodiment, the mounting base comprises a housing and a base, the base is arranged in the housing, the mounting cavity comprises a first cavity and a second cavity, the base and the housing enclose the first cavity, the piezoelectric transduction piece is arranged in the first cavity, the piezoelectric transduction piece is fixedly connected with the housing and the base in a crimping manner, the base is provided with the second cavity, and the circuit board is arranged in the second cavity.

In one embodiment, the side wall of the housing is provided with a first step portion, the base is provided with a second step portion, and the second step portion is clamped and fixed with the first step portion.

In one embodiment, the ultrasonic transducer further comprises a second adhesive bonded between the inner side wall of the housing and the outer side wall of the base.

In one embodiment, the base is further provided with a positioning step, and the positioning step is clamped with the outer periphery of the piezoelectric transduction piece.

In one embodiment, the ultrasonic transduction device further comprises a package filled in the second chamber to package the circuit board in the second chamber.

In one embodiment, an annular groove is concavely formed on the outer peripheral wall of one end of the shell for forming the communication port, and an annular sealing ring is arranged in the annular groove.

In one embodiment, the ultrasonic transduction device further comprises an electronic wire and a connecting wire, the base is provided with a through hole which is communicated with the first cavity and the second cavity, one end of the electronic wire is welded with a contact on the piezoelectric transduction piece, the other end of the electronic wire is welded with a contact on the circuit board, one end of the connecting wire is connected to the circuit board, and the other end of the connecting wire extends to the outside of the mounting seat.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application, illustrate and explain the application and are not to be construed as limiting the application.

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an ultrasonic transducer according to an embodiment of the present application.

Fig. 2 is a schematic cross-sectional structure of an ultrasonic transducer.

Fig. 3 is a schematic structural diagram of a piezoelectric transducer according to an embodiment.

Fig. 4 is a partial structural view of a piezoelectric transduction piece.

Reference numerals illustrate:

100. an ultrasonic transducer; 10. a mounting base; 11. a communication port; 12. a housing; 121. a first step portion; 122. an annular groove; 13. a base; 131. a second step portion; 132. positioning the step; 14. a first chamber; 15. a second chamber; 20. a piezoelectric transduction piece; 21. a piezoelectric ceramic plate; 22. a silver coating layer; 23. an electric bridge; 30. a circuit board; 40. a first adhesive; 50. a second adhesive; 60. a package; 70. an electronic wire; 80. and (5) connecting wires.

Detailed Description

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.

In the description of the present application, it should be understood that, if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., these terms refer to the orientation or positional relationship based on the drawings, which are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In this application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

Referring to fig. 1 and 2, an ultrasonic transducer 100 according to an embodiment of the present application includes a mounting base 10, a piezoelectric transducer 20, and a circuit board 30. The inside of the mounting seat 10 is provided with a mounting cavity, the side wall of the mounting seat 10 is also provided with a communication port 11, and the communication port 11 is communicated with the mounting cavity; the piezoelectric transduction piece 20 is arranged in the mounting cavity and is aligned with the communication port 11; the circuit board 30 is disposed in the mounting cavity, and the circuit board 30 is electrically connected to the piezoelectric transducer 20.

In summary, implementing the technical scheme of the embodiment has the following beneficial effects: in the ultrasonic transducer 100 of this scheme, through installing piezoelectric transduction piece 20 and circuit board 30 respectively in the installation cavity of mount pad 10 to make piezoelectric transduction piece 20 and circuit board 30 electric connection, set up intercommunication mouth 11 simultaneously on mount pad 10, and make the setting position of intercommunication mouth 11 counterpoint with the setting position of piezoelectric transduction piece 20, therefore when this ultrasonic transducer 100 installs in the pipeline, the liquid that flows in the pipeline can flow into in intercommunication mouth 11 and exert impact pressure to piezoelectric transduction piece 20, make piezoelectric transduction piece 20 can produce the deformation of corresponding range according to the liquid flow pressure that bears, and convert deformation into electric signal transmission to circuit board 30, can realize the real-time supervision operation to liquid pressure and flow.

Compared with the prior art, the ultrasonic transduction device 100 of the scheme integrates the dual functions of the pressure transmitter and the flow transducer, realizes the high integration of functions and structures on the basis of meeting the requirement of monitoring the pressure and the flow of liquid, has small volume and small occupied installation space of the ultrasonic transduction device 100, and can effectively reduce the cost and facilitate centralized management and control.

With continued reference to fig. 3 and 4, in some alternative embodiments, the piezoelectric transduction piece 20 includes a piezoelectric ceramic plate 21, a silver-coated layer 22 and an electric bridge 23, the silver-coated layer 22 and the electric bridge 23 are both disposed on a side surface of the piezoelectric ceramic plate 21 facing the communication port 11, the mounting base 10 is made of metal, the silver-coated layer 22 is closely attached to the mounting base 10, the silver-coated layer 22 is disposed in a ring-shaped structure, the electric bridge 23 is disposed in an inner ring cavity of the silver-coated layer 22, and the electric bridge 23 is opposite to the communication port 11.

In this application, mount pad 10 wholly is cylinder appearance structure, and looks adaptation ground, piezoceramics plate 21 is circular too, and the appearance is regular, easy to assemble and dismantlement. During installation, the inner side wall at the bottom of the installation seat 10 is attached to the plate surface of the piezoelectric ceramic plate 21, and the silver-coated layer 22 is in contact with the installation seat 10 made of metal at this time, so that ultrasonic signals can be coupled and sent. The communication port 11 is opposite to the bridge 23, the bridge 23 is specifically a wheatstone bridge 23, and after flowing into the communication port 11, the liquid can directly impact the wheatstone bridge 23 to generate liquid flow pressure on the piezoelectric ceramic plate 21, so that deformation generated by the piezoelectric ceramic plate 21 is converted into an electric signal and transmitted to the circuit board 30.

Since the ultrasonic transducer 100 is immersed in the liquid in the use state, in order to avoid the liquid in the pipeline from penetrating into the ultrasonic transducer 100 from the communication port 11 to cause short-circuit damage to electrical components such as the circuit board 30, in some alternative embodiments, the ultrasonic transducer 100 further includes a first adhesive 40, and the silver-coated layer 22 is sealed and adhered to the side wall of the mounting cavity by the first adhesive 40. The first adhesive 40 can increase the connection tightness between the silver-coated layer 22 and the side wall of the mounting cavity, and can further improve the stability and firmness of the piezoelectric transduction piece 20 mounted in the mounting seat 10.

Alternatively, the first adhesive 40 may be any one of a double-sided tape, glue, etc., and specifically may be selected according to actual needs.

With continued reference to fig. 1 and 2, in yet another alternative embodiment, the mounting base 10 includes a housing 12 and a base 13, and the size of the interior cavity of the mounting base 10 is larger than the size of the base 13, so that the base 13 can be disposed within the housing 12. The nested mounting structure ensures that the volumes of the shell 12 and the base 13 are overlapped, and the size of the assembled mounting seat 10 is small and the occupied mounting space is small.

The installation cavity includes first cavity 14 and second cavity 15, and base 13 encloses first cavity 14 with shell 12, and piezoelectric transduction piece 20 sets up in first cavity 14, and piezoelectric transduction piece 20 and shell 12 and base 13 crimping are fixed, and base 13 is equipped with second cavity 15, and circuit board 30 sets up in second cavity 15.

The piezoelectric transduction piece 20 and the circuit board 30 are respectively arranged in the first chamber 14 and the second chamber 15 which are relatively independent, and do not interfere with each other, so that stable and reliable operation is ensured. In addition, the piezoelectric transduction piece 20 is directly abutted with the communication port 11, so that the pressure and the flow of liquid can be conveniently sensed, and the circuit board 30 is far away from the communication port 11, so that the safety of the circuit board 30 can be improved. The piezoelectric transduction piece 20 is fixedly pressed by the shell 12 and the base 13, so that the piezoelectric transduction piece 20 is firmly installed and is not easy to shift due to liquid impact, and the safety problem caused by liquid leakage into the device is avoided.

With continued reference to fig. 2, in order to improve the assembly quality of the housing 12 and the base 13 and to improve the connection strength, the side wall of the housing 12 is provided with a first step portion 121, the base 13 is provided with a second step portion 131, and the second step portion 131 is engaged with and fixed to the first step portion 121. In addition, the first step portion 121 and the second step portion 131 are engaged, so that the mounting and positioning of the base 13 and the housing 12 are also realized, and the clamping force applied to the piezoelectric transduction piece 20 by the base 13 and the housing 12 is prevented from being excessively large, so that the piezoelectric transduction piece 20 is prevented from being damaged.

Further, the ultrasonic transducer 100 further includes a second adhesive 50, and the second adhesive 50 is adhered between the inner sidewall of the housing 12 and the outer sidewall of the base 13. The second adhesive 50 adheres and fixes the housing 12 and the base 13, improves the connection strength of the housing 12 and the base 13, and can improve the sealing capability, thereby ensuring the pressure resistance of the ultrasonic transducer 100 immersed in the liquid for a long time.

With continued reference to fig. 2, in yet another alternative embodiment, the base 13 is further provided with a positioning step 132, and the positioning step 132 is engaged with the outer periphery of the piezoelectric transducer sheet 20. The design location step 132 and the outer periphery block of piezoelectricity transduction piece 20 help to hold the location to piezoelectricity transduction piece 20 on the one hand, improve piezoelectricity transduction piece 20 installation stability, on the other hand has also restricted piezoelectricity transduction piece 20 and has taken place the lateral displacement, causes to take place the dislocation with communication port 11 and opens communication port 11, influences piezoelectricity transduction piece 20 and communication port 11 and assembles the leakproofness.

In addition, the ultrasonic transducer 100 further includes a package 60, and the package 60 is filled in the second chamber 15 to package the circuit board 30 in the second chamber 15. Thereby avoiding the circuit board 30 from being directly exposed to the environment, preventing the circuit board 30 from being short-circuited and corroded and damaged due to the fact that liquid in the pipeline directly contacts the circuit board 30, and improving the overall waterproof performance of the ultrasonic transduction device 100.

Optionally, the encapsulation member 60 is specifically a pouring sealant, after the circuit board 30 is mounted in the second chamber 15, the pouring sealant in a hot-melt state is injected into the second chamber 15, and because the pouring sealant has good fluidity, the second chamber 15 can be completely filled and well adhered to the surface of the circuit board 30, and after the pouring sealant is cooled and solidified, a sealant layer with higher strength is formed, so that excellent sealing waterproof performance is obtained. In addition, the pouring sealant also has good heat transfer capability, and heat generated by the operation of the circuit board 30 can be quickly transferred into liquid in the pipeline through the pouring sealant, so that the purpose of enhancing cooling of the circuit board 30 is achieved, and the circuit board 30 can work reliably continuously for a long time.

With continued reference to fig. 2, in yet another alternative embodiment, an annular groove 122 is concavely formed in the outer peripheral wall of the housing 12 at one end for forming the communication port 11, and an annular seal ring is mounted in the annular groove 122. Therefore, the requirement of sealing installation of the ultrasonic transduction device 100 can be met, the annular sealing ring is sleeved in the annular groove 122, the installation stability of the annular sealing ring is improved, and the annular sealing ring is not easy to fall off.

Specifically, the annular sealing ring can be any one of a rubber ring, an oil seal and the like, and the annular sealing ring is specifically selected according to actual needs.

With continued reference to fig. 1 and 2, in addition, the ultrasonic transducer 100 further includes an electronic wire 70 and a connecting wire 80, the base 13 is provided with a through hole for communicating the first chamber 14 and the second chamber 15, one end of the electronic wire 70 is welded with a contact on the piezoelectric transducer sheet 20, the other end of the electronic wire 70 is welded with a contact on the circuit board 30, one end of the connecting wire 80 is connected to the circuit board 30, and the other end extends to the outside of the mounting seat 10. The electronic wire 70 is used for electrically connecting the circuit board 30 with the piezoelectric transduction piece 20, so that signals are conveniently transmitted from the piezoelectric transduction piece 20 to the circuit board 30. The connection lines 80 may further transmit signals from the circuit board 30 to the outside.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims

1. An ultrasonic transducer apparatus, comprising:

2. The ultrasonic transducer of claim 1, wherein the piezoelectric transduction piece comprises a piezoelectric ceramic plate, a silver-coated layer and an electric bridge, the silver-coated layer and the electric bridge are both arranged on the side surface of the piezoelectric ceramic plate facing the communication port, the mounting seat is made of metal, the silver-coated layer is clung to the mounting seat, the silver-coated layer is arranged in an annular structure, the electric bridge is arranged in an inner annular cavity of the silver-coated layer, and the electric bridge is opposite to the communication port.

3. The ultrasonic transducer of claim 2, further comprising a first adhesive, wherein the silver-coated layer is sealingly bonded to a sidewall of the mounting cavity by the first adhesive.

4. The ultrasonic transducer of claim 1, wherein the mount comprises a housing and a base, the base is disposed in the housing, the mounting cavity comprises a first cavity and a second cavity, the base and the housing enclose the first cavity, the piezoelectric transduction piece is disposed in the first cavity, the piezoelectric transduction piece is fixedly crimped with the housing and the base, the base is provided with the second cavity, and the circuit board is disposed in the second cavity.

5. The ultrasonic transducer of claim 4, wherein the side wall of the housing is provided with a first step portion, the base is provided with a second step portion, and the second step portion is engaged and fixed with the first step portion.

6. The ultrasonic transducer of claim 5, further comprising a second adhesive bonded between the inner side wall of the housing and the outer side wall of the base.

7. The ultrasonic transducer of claim 4, wherein the base is further provided with a positioning step that engages with an outer periphery of the piezoelectric transduction piece.

8. The ultrasonic transducer apparatus of claim 4, further comprising a package filled in the second chamber to encapsulate the circuit board in the second chamber.

9. The ultrasonic transducer apparatus according to claim 4, wherein an annular groove is concavely formed in an outer peripheral wall of the housing for forming one end of the communication port, and an annular seal ring is installed in the annular groove.

10. The ultrasonic transducer of claim 4, further comprising an electronic wire and a connecting wire, wherein the base is provided with a through hole for communicating the first chamber and the second chamber, one end of the electronic wire is welded with a contact on the piezoelectric transduction piece, the other end of the electronic wire is welded with a contact on the circuit board, one end of the connecting wire is connected to the circuit board, and the other end of the connecting wire extends to the outside of the mounting seat.