CN117492263A - Backlight modules and display devices - Google Patents
Backlight modules and display devices Download PDFInfo
- Publication number
- CN117492263A CN117492263A CN202310208711.7A CN202310208711A CN117492263A CN 117492263 A CN117492263 A CN 117492263A CN 202310208711 A CN202310208711 A CN 202310208711A CN 117492263 A CN117492263 A CN 117492263A
- Authority
- CN
- China
- Prior art keywords
- groove
- sub
- backlight module
- unit
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 75
- 238000005538 encapsulation Methods 0.000 abstract 9
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 15
- 238000004806 packaging method and process Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 10
- 230000001965 increasing effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000008393 encapsulating agent Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Planar Illumination Modules (AREA)
Abstract
Description
技术领域Technical field
本申请涉及显示技术领域,尤其涉及一种背光模组及显示装置。The present application relates to the field of display technology, and in particular, to a backlight module and a display device.
背景技术Background technique
微型发光二极管(Mini-Light-Emitting Diode,Mini-LED)显示中,通常采用大量密布的方式实现更小区域范围内的调光,因此在小混光距离的前提下依然可以实现良好的亮度均匀性,画面色彩鲜艳具有更高的对比度,搭配高色域配置效果可以媲美有机发光二极管(Organic Light-Emitting Diode,OLED),同时,因为大量密布的光源的存在相较于常规LED显示更容易达到更高的亮度要求。In Mini-Light-Emitting Diode (Mini-LED) displays, a large number of densely distributed devices are usually used to achieve dimming in a smaller area. Therefore, good brightness uniformity can still be achieved under the premise of a small light mixing distance. The screen is brightly colored and has higher contrast. When paired with a high color gamut configuration, the effect is comparable to that of Organic Light-Emitting Diode (OLED). At the same time, because of the existence of a large number of dense light sources, it is easier to achieve than conventional LED displays. Higher brightness requirements.
目前,鉴于Mini-LED显示存在诸多优点,使其在超薄、高显色性和省电等方面的应用具有明显的优势,已经受到了各大厂商广泛的关注;在现有的Mini-LED背光模组的应用中,通常采用点胶工艺将封装胶封装在LED灯上,大量密布的LED灯可以提高光效,但是也带来了成本高昂、散热困难等问题,其中,由于封装胶贴合于背光模组上,封装胶、LED灯以及灯板之间的热膨胀系数差异,使得封装胶两边产生很大的剪应力,在做高低温循环可靠性测试时,可能出现脱胶现象,进而造成灯板显示不均等异常。At present, in view of the many advantages of Mini-LED display, it has obvious advantages in ultra-thin, high color rendering and power saving applications, and has attracted widespread attention from major manufacturers; in the existing Mini-LED In the application of backlight modules, the dispensing process is usually used to encapsulate the packaging glue on the LED lights. A large number of densely packed LED lights can improve the light efficiency, but it also brings problems such as high cost and difficulty in heat dissipation. Among them, due to the packaging glue For backlight modules, the difference in thermal expansion coefficients between the packaging glue, LED lights and light panels causes great shear stress on both sides of the packaging glue. During high and low temperature cycle reliability testing, degumming may occur, resulting in The light panel shows uneven abnormality.
发明内容Contents of the invention
本申请实施例提供一种背光模组及显示装置,用以缓解相关技术中的不足。Embodiments of the present application provide a backlight module and a display device to alleviate deficiencies in related technologies.
为实现上述功能,本申请实施例提供的技术方案如下:In order to realize the above functions, the technical solutions provided by the embodiments of this application are as follows:
本申请实施例提供一种背光模组,包括:An embodiment of the present application provides a backlight module, including:
背板,包括间隔设置的多个凹槽;The back plate includes a plurality of grooves arranged at intervals;
多个发光单元,设置于所述背板上;A plurality of light-emitting units arranged on the backplane;
多个封胶单元,设置于所述发光单元远离所述背板的一侧,一所述封胶单元对应一所述发光单元设置,所述封胶单元包括封胶部和卡接部,所述封胶部位于所述卡接部远离所述背板的一侧;A plurality of sealing units are disposed on the side of the light-emitting unit away from the backplane. One sealing unit is provided corresponding to one light-emitting unit. The sealing unit includes a sealing part and a clamping part. The sealing part is located on the side of the clamping part away from the back plate;
其中,一所述凹槽环绕一所述发光单元设置,所述凹槽包括倒钩结构,一所述封胶单元与其对应的所述发光单元中,所述封胶部覆盖所述发光单元,所卡接部与所述倒钩结构相互卡接。Wherein, a groove is arranged around a light-emitting unit, the groove includes a barb structure, and in a sealing unit and its corresponding light-emitting unit, the sealing part covers the light-emitting unit, The engaging portion and the barb structure are engaged with each other.
在本申请实施例所提供的背光模组中,所述倒钩结构包括相互连通的第一子凹槽和第二子凹槽,所述第二子凹槽位于所述第一子凹槽远离所述封胶单元的一侧;In the backlight module provided by the embodiment of the present application, the barb structure includes a first sub-groove and a second sub-groove that are connected to each other, and the second sub-groove is located away from the first sub-groove. One side of the sealing unit;
其中,所述第一子凹槽沿第一方向延伸,所述第二子凹槽沿第二方向延伸,所述第一方向和所述第二方向呈一预设角度。Wherein, the first sub-groove extends along a first direction, the second sub-groove extends along a second direction, and the first direction and the second direction form a preset angle.
在本申请实施例所提供的背光模组中,所述预设角度大于或等于90度,且小于或等于150度,其中,所述第二方向与所述背板的延伸方向平行In the backlight module provided by the embodiment of the present application, the preset angle is greater than or equal to 90 degrees and less than or equal to 150 degrees, wherein the second direction is parallel to the extension direction of the back plate.
在本申请实施例所提供的背光模组中,所述第一子凹槽具有倾斜侧壁,且所述第一子凹槽靠近所述封胶单元的水平截面面积大于所述第一子凹槽远离所述封胶单元的水平截面面积。In the backlight module provided by the embodiment of the present application, the first sub-groove has an inclined side wall, and the horizontal cross-sectional area of the first sub-groove close to the sealing unit is larger than the first sub-groove. The groove is away from the horizontal cross-sectional area of the sealing unit.
在本申请实施例所提供的背光模组中,所述第一子凹槽的侧壁在垂直于所述背板方向上的截面呈直线或弧线。In the backlight module provided by the embodiment of the present application, the cross-section of the side wall of the first sub-groove in a direction perpendicular to the back plate is a straight line or an arc.
在本申请实施例所提供的背光模组中,所述第一子凹槽在所述背板上的正投影位于所述第二子凹槽在所述背板上的正投影内;In the backlight module provided by the embodiment of the present application, the orthographic projection of the first sub-groove on the back plate is located within the orthographic projection of the second sub-groove on the back plate;
所述第二子凹槽包括相连通的第一凹槽部和第二凹槽部,所述第一凹槽部的延伸方向与所述第二凹槽部的延伸方向相反。The second sub-groove includes a first groove part and a second groove part that are connected, and the extending direction of the first groove part is opposite to the extending direction of the second groove part.
在本申请实施例所提供的背光模组中,在垂直于所述背板的方向上,所述第二子凹槽的宽度大于所述第一子凹槽的宽度。In the backlight module provided by the embodiment of the present application, the width of the second sub-groove is greater than the width of the first sub-groove in a direction perpendicular to the back plate.
在本申请实施例所提供的背光模组中,所述第一子凹槽的深度大于所述第二子凹槽的深度。In the backlight module provided by the embodiment of the present application, the depth of the first sub-groove is greater than the depth of the second sub-groove.
在本申请实施例所提供的背光模组中,所述凹槽的形状为楔形。In the backlight module provided by the embodiment of the present application, the shape of the groove is wedge-shaped.
本申请实施例提供一种显示装置,所述显示装置包括显示面板和上述任一所述的背光模组。An embodiment of the present application provides a display device, which includes a display panel and any of the above-mentioned backlight modules.
本申请实施例的有益效果:本申请实施例提供一种背光模组及显示装置,所述背光模组包括背板、多个发光单元以及多个封胶单元,背板包括间隔设置的多个凹槽,所述发光单元设置于所述背板上,所述封胶单元设置于所述发光单元远离所述背板的一侧,一所述封胶单元对应一所述发光单元设置,所述封胶单元包括封胶部和卡接部,所述封胶部位于所述卡接部远离所述背板的一侧,本申请实施例通过设置一所述凹槽环绕一所述发光单元设置,所述凹槽包括倒钩结构,一所述封胶单元与其对应的所述发光单元中,所述封胶部覆盖所述发光单元,所卡接部与所述倒钩结构相互卡接,从而增加了所述封胶单元与所述背板之间的结合力,解决现有背光模组在做高低温循环可靠性测试时,可能出现的脱胶现象,延长了所述背光模组的使用寿命,保证所述显示装置的亮度均匀性。Beneficial effects of the embodiments of the present application: The embodiments of the present application provide a backlight module and a display device. The backlight module includes a backplane, a plurality of light-emitting units and a plurality of sealing units. The backplane includes a plurality of spaced apart Groove, the light-emitting unit is provided on the back plate, the sealing unit is provided on the side of the light-emitting unit away from the back plate, one sealing unit is provided corresponding to one light-emitting unit, so The sealing unit includes a sealing part and a clamping part. The sealing part is located on a side of the clamping part away from the back plate. In this embodiment, a groove is provided to surround a light-emitting unit. It is provided that the groove includes a barb structure, in one of the sealing units and the corresponding light-emitting unit, the sealing part covers the light-emitting unit, and the engaging part and the barb structure engage with each other. , thereby increasing the bonding force between the sealing unit and the backplane, solving the possible degumming phenomenon of the existing backlight module during high and low temperature cycle reliability testing, and extending the life of the backlight module. service life to ensure the brightness uniformity of the display device.
附图说明Description of drawings
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without exerting creative efforts.
图1为现有背光模组的结构示意图;Figure 1 is a schematic structural diagram of an existing backlight module;
图2为图1中A处的放大图;Figure 2 is an enlarged view of point A in Figure 1;
图3为本申请实施例所提供的背光模组的第一种俯视图Figure 3 is a first top view of the backlight module provided by the embodiment of the present application.
图4为本申请实施例所提供的背光模组的第二种俯视图;Figure 4 is a second top view of the backlight module provided by the embodiment of the present application;
图5为本申请实施例所提供的背光模组的第一种结构示意图;Figure 5 is a first structural schematic diagram of a backlight module provided by an embodiment of the present application;
图6为图5中B处的放大图;Figure 6 is an enlarged view of B in Figure 5;
图7为本申请实施例所提供的封胶单元的结构示意图;Figure 7 is a schematic structural diagram of a sealing unit provided by an embodiment of the present application;
图8为本申请实施例所提供的背光模组的第二种结构示意图;Figure 8 is a second structural schematic diagram of the backlight module provided by the embodiment of the present application;
图9为图8中C处的放大图;Figure 9 is an enlarged view of C in Figure 8;
图10为本申请实施例所提供的背光模组的第三种结构示意图。FIG. 10 is a third structural schematic diagram of a backlight module provided by an embodiment of the present application.
具体实施方式Detailed ways
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。此外,应当理解的是,此处所描述的具体实施方式仅用于说明和解释本申请,并不用于限制本申请。在本申请中,在未作相反说明的情况下,使用的方位词如“上”和“下”通常是指装置实际使用或工作状态下的上和下,具体为附图中的图面方向;而“内”和“外”则是针对装置的轮廓而言的。The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts fall within the scope of protection of this application. In addition, it should be understood that the specific embodiments described here are only used to illustrate and explain the application, and are not used to limit the application. In this application, unless otherwise specified, the directional words used such as "upper" and "lower" usually refer to the upper and lower positions of the device in actual use or working conditions, specifically the direction of the drawing in the drawings. ; while “inside” and “outside” refer to the outline of the device.
本申请实施例提供一种背光模组及显示装置。以下分别进行详细说明。需说明的是,以下实施例的描述顺序不作为对实施例优选顺序的限定。Embodiments of the present application provide a backlight module and a display device. Each is explained in detail below. It should be noted that the order of description of the following embodiments does not limit the preferred order of the embodiments.
请参阅图3~图10,本实施例提供一种背光模组及显示装置,所述背光模组2包括背板10、多个发光单元20以及多个封胶单元30,所述背板10包括间隔设置的多个凹槽11,所述发光单元20设置于所述背板10上,所述封胶单元30设置于所述发光单元20远离所述背板10的一侧,一所述封胶单元30对应一所述发光单元20设置,所述封胶单元30包括封胶部30A和卡接部30B,所述封胶部30A位于所述卡接部30B远离所述背板10的一侧;其中,一所述凹槽11环绕一所述发光单元20设置,所述凹槽11包括倒钩结构110,一所述封胶单元30与其对应的所述发光单元20中,所述封胶部30A覆盖所述发光单元20,所卡接部30B与所述倒钩结构110相互卡接。Please refer to FIGS. 3 to 10 . This embodiment provides a backlight module and a display device. The backlight module 2 includes a backplane 10 , a plurality of light-emitting units 20 and a plurality of sealing units 30 . The backplane 10 It includes a plurality of grooves 11 arranged at intervals, the light-emitting unit 20 is arranged on the back plate 10, and the sealing unit 30 is arranged on the side of the light-emitting unit 20 away from the back plate 10. The sealing unit 30 is provided corresponding to one of the light-emitting units 20 . The sealing unit 30 includes a sealing part 30A and a clamping part 30B. The sealing part 30A is located away from the clamping part 30B and away from the back plate 10 . One side; wherein, a groove 11 is arranged around a light-emitting unit 20, the groove 11 includes a barb structure 110, a sealing unit 30 and its corresponding light-emitting unit 20, the The sealing part 30A covers the light-emitting unit 20 , and the engaging part 30B and the barb structure 110 are engaged with each other.
需要说明的是,所述凹槽11的一个侧壁向靠近所述发光单元20的一侧弯曲以形成所述倒钩结构110,所述倒钩结构110远离所述发光单元20的一侧呈弧形或斜坡;可以理解的是,所述凹槽11包括倒钩结构110,以使所述封胶单元30位于所述凹槽11内的部分形成勾面,所述勾面增加了所述封胶单元与所述背板之间的结合力。It should be noted that one side wall of the groove 11 is bent toward the side close to the light-emitting unit 20 to form the barb structure 110 , and the barb structure 110 is bent toward the side away from the light-emitting unit 20 . arc or slope; it can be understood that the groove 11 includes a barb structure 110, so that the part of the sealing unit 30 located in the groove 11 forms a hook surface, and the hook surface increases the The bonding force between the sealing unit and the back plate.
请参阅图1和图2;其中,图1为现有背光模组的结构示意图;图2为图1中A处的放大图;现有背光模组1包括背板10、位于所述背板10上的多个发光单元20以及位于所述发光单元20远离所述背板10一侧的封装胶40,所述封装胶40覆盖所述发光单元20;可以理解的是,在所述现有背光模组1中,通常采用点胶工艺将所述封装胶40封装在所述发光单元20上,其中,由于所述封装胶40贴合于所述背板10上,所述封装胶40、所述发光单元20以及所述背板10之间的热膨胀系数差异,使得所述封装胶40两边产生很大的剪应力,在做高低温循环可靠性测试时,可能出现脱胶现象。Please refer to Figures 1 and 2; Figure 1 is a schematic structural diagram of an existing backlight module; Figure 2 is an enlarged view of A in Figure 1; the existing backlight module 1 includes a backplane 10, A plurality of light-emitting units 20 on the backplane 10 and an encapsulant 40 located on the side of the light-emitting unit 20 away from the backplane 10. The encapsulant 40 covers the light-emitting unit 20; it can be understood that in the existing In the backlight module 1, the packaging glue 40 is usually packaged on the light-emitting unit 20 using a glue dispensing process. Since the packaging glue 40 is attached to the backplane 10, the packaging glue 40, The difference in thermal expansion coefficient between the light-emitting unit 20 and the backplane 10 causes a large shear stress on both sides of the encapsulant 40 , and debonding may occur during high and low temperature cycle reliability testing.
可以理解的是,本实施例通过设置一所述凹槽环绕一所述发光单元设置,所述凹槽包括倒钩结构,一所述封胶单元与其对应的所述发光单元中,所述封胶部覆盖所述发光单元,所卡接部与所述倒钩结构相互卡接,从而增加了所述封胶单元与所述背板之间的结合力,解决现有背光模组在做高低温循环可靠性测试时,可能出现的脱胶现象,延长了所述背光模组的使用寿命,保证所述显示装置的亮度均匀性。It can be understood that in this embodiment, a groove is arranged around a light-emitting unit, and the groove includes a barb structure. In a sealing unit and its corresponding light-emitting unit, the sealing unit is The glue part covers the light-emitting unit, and the engaging part and the barb structure are engaged with each other, thereby increasing the bonding force between the sealing unit and the backplane and solving the problem of high performance of existing backlight modules. The degumming phenomenon that may occur during low-temperature cycle reliability testing extends the service life of the backlight module and ensures the brightness uniformity of the display device.
在一实施例中,请参阅图3、图4、图5、图6和图7;其中,图3为本申请实施例所提供的背光模组的第一种俯视图;图4为本申请实施例所提供的背光模组的第二种俯视图;图5为本申请实施例所提供的背光模组的第一种结构示意图;图6为图5中B处的放大图,图7为本申请实施例所提供的封胶单元的结构示意图。In one embodiment, please refer to Figures 3, 4, 5, 6 and 7; Figure 3 is a first top view of the backlight module provided by the embodiment of the present application; Figure 4 is an implementation of the present application. The second top view of the backlight module provided by the example; Figure 5 is the first structural schematic diagram of the backlight module provided by the embodiment of the present application; Figure 6 is an enlarged view of B in Figure 5; Figure 7 is the enlarged view of the backlight module of the present application A schematic structural diagram of the sealing unit provided in the embodiment.
在本实施例中,所述发光单元20包括但不限于微型发光二极管(Mini-Light-Emitting Diode,Mini-LED);所述封胶单元30包括但不限于封装胶,所述封装胶可以采用具有流动性的透明材料;所述封胶单元30远离所述发光单元20的一侧可以呈任意形状;优选地,所述封胶单元30远离所述发光单元20的一侧呈圆弧形;可以理解的是,本实施例通过设置所述封胶单元30远离所述发光单元20的一侧呈圆弧形,因为圆弧形的曲线特性,从而将所述发光单元20发出的光通过折射汇聚,使得出光集中,进而增强所述背光模组2的发光强度。In this embodiment, the light-emitting unit 20 includes but is not limited to a Mini-Light-Emitting Diode (Mini-LED); the sealing unit 30 includes but is not limited to packaging glue, and the packaging glue may be A transparent material with fluidity; the side of the sealing unit 30 away from the light-emitting unit 20 can be in any shape; preferably, the side of the sealing unit 30 away from the light-emitting unit 20 is in an arc shape; It can be understood that in this embodiment, the side of the sealing unit 30 away from the light-emitting unit 20 is arranged in an arc shape. Due to the curve characteristics of the arc shape, the light emitted by the light-emitting unit 20 is refracted. Convergence causes the light to be concentrated, thereby enhancing the luminous intensity of the backlight module 2 .
需要说明的是,在本实施例中,一所述凹槽11环绕一所述发光单元20设置,其中,“一所述凹槽11环绕”包含“多个子凹槽11A环绕所述发光单元20”的情况,例如图3所示,一所述凹槽11环绕一所述发光单元20设置,所述凹槽11为一个连续的环形结构;例如图4所示,所述凹槽11包括多个子凹槽11A,多个所述子凹槽11A环绕一所述发光单元20,本实施例对所述子凹槽11A的数量不做具体限制。It should be noted that in this embodiment, a groove 11 is arranged around a light-emitting unit 20, where "a groove 11 surrounds" includes "a plurality of sub-grooves 11A surround the light-emitting unit 20" ” situation, for example, as shown in Figure 3, a groove 11 is arranged around a light-emitting unit 20, and the groove 11 is a continuous annular structure; for example, as shown in Figure 4, the groove 11 includes multiple Sub-groove 11A. A plurality of sub-grooves 11A surround one of the light-emitting units 20. This embodiment does not impose a specific limit on the number of sub-grooves 11A.
在本实施例中,所述倒钩结构110包括相互连通的第一子凹槽11A和第二子凹槽11B,所述第二子凹槽11B位于所述第一子凹槽11A远离所述封胶单元30的一侧,所述第二子凹槽11B的宽度d2大于所述第一子凹槽11A的宽度d1;其中,所述封胶单元30填充所述第一子凹槽11A和所述第二子凹槽11B。In this embodiment, the barb structure 110 includes a first sub-groove 11A and a second sub-groove 11B that communicate with each other. The second sub-groove 11B is located away from the first sub-groove 11A. On one side of the sealing unit 30, the width d2 of the second sub-groove 11B is greater than the width d1 of the first sub-groove 11A; wherein, the sealing unit 30 fills the first sub-groove 11A and The second sub-groove 11B.
可以理解的是,本实施例通过设置所述凹槽11包括相互连通的第一子凹槽11A和第二子凹槽11B,所述第二子凹槽11B位于所述第一子凹槽11A远离所述封胶单元30的一侧,所述第二子凹槽11B的宽度d2大于所述第一子凹槽11A的宽度d1,由于所述封胶单元30采用具有流动性的透明材料,因此所述封胶单元30可以流入所述第一子凹槽11A和所述第二子凹槽11B,从而实现所述卡接部30B与所述倒钩结构110相互卡接,增大了所述封胶单元30与所述背板10的接触面积,提高了所述封胶单元30与所述背板10之间的结合力,进而避免了所述封胶单元30与所述背板10之间发生脱胶现象的问题。It can be understood that in this embodiment, the groove 11 includes a first sub-groove 11A and a second sub-groove 11B that communicate with each other, and the second sub-groove 11B is located in the first sub-groove 11A. On the side away from the sealing unit 30 , the width d2 of the second sub-groove 11B is greater than the width d1 of the first sub-groove 11A. Since the sealing unit 30 is made of a transparent material with fluidity, Therefore, the sealing unit 30 can flow into the first sub-groove 11A and the second sub-groove 11B, so that the engaging portion 30B and the barb structure 110 are engaged with each other, thereby increasing the The contact area between the sealing unit 30 and the back plate 10 improves the bonding force between the sealing unit 30 and the back plate 10 , thereby preventing the sealing unit 30 and the back plate 10 from interfering with each other. The problem of degumming occurs between them.
进一步地,在本实施例中,所述第一子凹槽11A沿第一方向X延伸,所述第二子凹槽11B沿第二方向Y延伸;其中,所述第一子凹槽11A具有倾斜侧壁,且所述第一子凹槽11A靠近所述封胶单元30的水平截面面积大于所述第一子凹槽11A远离所述封胶单元30的水平截面面积,所述第一方向X和所述第二方向Y呈一预设角度,其中,所述预设角度大于或等于90度,且小于或等于150度,其中,所述第二方向与所述背板的延伸方向平行。Further, in this embodiment, the first sub-groove 11A extends along the first direction X, and the second sub-groove 11B extends along the second direction Y; wherein, the first sub-groove 11A has The side walls are inclined, and the horizontal cross-sectional area of the first sub-groove 11A close to the sealing unit 30 is larger than the horizontal cross-sectional area of the first sub-groove 11A away from the sealing unit 30. The first direction X and the second direction Y form a preset angle, wherein the preset angle is greater than or equal to 90 degrees and less than or equal to 150 degrees, wherein the second direction is parallel to the extension direction of the back plate .
需要说明的是,在本实施例中,对所述预定角度的范围、及所述第一方向X和所述第二方向Y的方向均不做限制,但为了方便描述,本实施例以所述预设夹角为90°、所述第一方向为X方向、所述第二方向为Y方向为例对本申请的技术方案进行举例说明。It should be noted that in this embodiment, there are no restrictions on the range of the predetermined angle and the directions of the first direction X and the second direction Y. However, for convenience of description, this embodiment uses the following Taking the preset angle as 90°, the first direction as the X direction, and the second direction as the Y direction as an example to illustrate the technical solution of the present application.
具体地,所述第一方向X为所述发光单元20指向所述背板10的方向,所述第二方向Y与所述背板10的水平方向平行,所述第一子凹槽11A的宽度d1沿所述第一方向X逐渐减小,即,所述第一子凹槽11A的侧壁为倾斜侧壁。Specifically, the first direction The width d1 gradually decreases along the first direction X, that is, the side walls of the first sub-groove 11A are inclined side walls.
可以理解的是,本实施例通过设置所述第一子凹槽11A沿第一方向X延伸,所述第二子凹槽11B沿第二方向Y延伸,所述第一方向X和所述第二方向Y呈一预设角度,使得在所述凹槽11内形成有倒钩结构110,所述卡接部30B与所述倒钩结构110相互卡接,从而避免了现有技术中,当所述背光模组2进行高低温循环可靠性测试时,由于所述封装胶、所述发光单元20以及所述背板10之间的热膨胀系数差异,因此在所述封装胶和所述背板10的接触面可能出现脱胶现象的风险;同时,通过设置所述第一子凹槽11A的宽度d1沿所述第一方向X逐渐减小,即,所述第一子凹槽11A的侧壁为倾斜侧壁,从而进一步增大所述封胶单元30与所述背板10的接触面积,提高了所述封胶单元30与所述背板10之间的结合力。It can be understood that in this embodiment, by arranging the first sub-groove 11A to extend along the first direction X, the second sub-groove 11B to extend along the second direction Y, the first direction The two directions Y form a preset angle, so that a barb structure 110 is formed in the groove 11, and the engaging portion 30B and the barb structure 110 engage with each other, thereby avoiding the problem in the prior art that when When the backlight module 2 is subjected to high and low temperature cycle reliability testing, due to the difference in thermal expansion coefficient between the packaging glue, the light-emitting unit 20 and the backplane 10, there is a gap between the packaging glue and the backplane. The risk of degumming may occur on the contact surface of 10; at the same time, by setting the width d1 of the first sub-groove 11A to gradually decrease along the first direction X, that is, the side wall of the first sub-groove 11A In order to tilt the side walls, the contact area between the sealing unit 30 and the back plate 10 is further increased, and the bonding force between the sealing unit 30 and the back plate 10 is improved.
请结合图8和图9;其中,图8为本申请实施例所提供的背光模组的第二种结构示意图;图9为图8中C处的放大图。Please combine FIG. 8 and FIG. 9 ; FIG. 8 is a second structural schematic diagram of the backlight module provided by the embodiment of the present application; FIG. 9 is an enlarged view of C in FIG. 8 .
在本实施例中,所述背光模组的结构与上述实施例所提供的背光模组的第一种结构相似/相同,具体请参照上述实施例中的背光模组的描述,此处不再赘述,两者的区别仅在于:In this embodiment, the structure of the backlight module is similar/identical to the first structure of the backlight module provided in the above embodiment. For details, please refer to the description of the backlight module in the above embodiment, which will not be repeated here. To go into details, the only difference between the two is:
在本实施例中,所述第一子凹槽11A在所述背板10上的正投影位于所述第二子凹槽11B在所述背板10上的正投影内,所述第二子凹槽11B包括相连通的第一凹槽部111B和第二凹槽部112B,所述第一凹槽部111B的延伸方向与所述第二凹槽部112B的延伸方向相反。In this embodiment, the orthographic projection of the first sub-groove 11A on the back plate 10 is located within the orthographic projection of the second sub-groove 11B on the back plate 10 . The groove 11B includes a first groove part 111B and a second groove part 112B that are connected, and the extending direction of the first groove part 111B is opposite to the extending direction of the second groove part 112B.
具体地,在本实施例中,所述第一凹槽部111B沿所述第二方向Y延伸,所述第二凹槽部112B沿与所述第二方向Y相反的方向延伸,所述封胶单元30填充所述第一子凹槽11A、所述第一凹槽部111B以及所述第二凹槽部112B。Specifically, in this embodiment, the first groove portion 111B extends along the second direction Y, the second groove portion 112B extends along the opposite direction to the second direction Y, and the sealing The glue unit 30 fills the first sub-groove 11A, the first groove portion 111B and the second groove portion 112B.
可以理解的是,本实施例通过设置所述第一子凹槽11A在所述背板10上的正投影位于所述第二子凹槽11B在所述背板10上的正投影内,所述第二子凹槽11B包括相连通的第一凹槽部111B第二凹槽部112B,所述第一子凹槽11A沿第一方向X延伸,所述第一凹槽部111B沿所述第二方向Y延伸,所述第二凹槽部112B沿与所述第二方向Y相反的方向延伸,使得所述封胶单元30在所述第一子凹槽11A和所述第二子凹槽11B内具有两倒钩结构,相对于上述实施例,本设计进一步增大了所述封胶单元30与所述背板10的接触面积,提高了所述封胶单元30与所述背板10之间的结合力,从而避免了现有技术中,当所述背光模组2进行高低温循环可靠性测试时,由于所述封装胶、所述发光单元20以及所述背板10之间的热膨胀系数差异,因此在所述封装胶和所述背板10的接触面可能出现脱胶现象的风险。It can be understood that in this embodiment, by arranging the orthographic projection of the first sub-groove 11A on the back plate 10 to be within the orthographic projection of the second sub-groove 11B on the back plate 10, The second sub-groove 11B includes a connected first groove part 111B and a second groove part 112B. The first sub-groove 11A extends along the first direction X, and the first groove part 111B extends along the Extending in the second direction Y, the second groove portion 112B extends in the opposite direction to the second direction Y, so that the sealing unit 30 is between the first sub-groove 11A and the second sub-groove. There are two barb structures in the groove 11B. Compared with the above embodiment, this design further increases the contact area between the sealing unit 30 and the back plate 10, and improves the contact area between the sealing unit 30 and the back plate. 10, thereby avoiding the existing technology, when the backlight module 2 is subjected to high and low temperature cycle reliability testing, due to the between the packaging glue, the light-emitting unit 20 and the backplane 10 Due to the difference in thermal expansion coefficient, there may be a risk of debonding at the contact surface between the encapsulant and the backplane 10 .
请参阅图10,本申请实施例所提供的背光模组的第三种结构示意图。Please refer to FIG. 10 , which is a third structural schematic diagram of a backlight module provided by an embodiment of the present application.
在本实施例中,所述背光模组的结构与上述实施例所提供的背光模组的第一种结构相似/相同,具体请参照上述实施例中的背光模组的描述,此处不再赘述,两者的区别仅在于:In this embodiment, the structure of the backlight module is similar/identical to the first structure of the backlight module provided in the above embodiment. For details, please refer to the description of the backlight module in the above embodiment, which will not be repeated here. To go into details, the only difference between the two is:
在本实施例中,所述凹槽11的形状为楔形;可以理解的是,本实施例通过设置所述凹槽11的形状为楔形,所述卡接部30B与所述倒钩结构110相互卡接,从而使所述封胶单元30与所述背板10紧密黏合在一起,增加了所述封胶单元30与所述背板10的黏合强度,解决现有背光模组2在做高低温循环可靠性测试时,可能出现的脱胶现象;同时,通过采用所述凹槽11的形状为楔形,其结构简单,能够简化制程并降低生产成本。In this embodiment, the shape of the groove 11 is a wedge shape; it can be understood that in this embodiment, by setting the shape of the groove 11 to be a wedge shape, the engaging portion 30B and the barb structure 110 interact with each other. The sealing unit 30 and the back plate 10 are tightly bonded together by snapping, thereby increasing the bonding strength of the sealing unit 30 and the back plate 10 and solving the problem of high performance of the existing backlight module 2. During low-temperature cycle reliability testing, degumming may occur; at the same time, by adopting the shape of the groove 11 as a wedge, its structure is simple, which can simplify the manufacturing process and reduce production costs.
本实施例提供一种显示装置,所述显示装置包括显示面板和上述任一实施例中所述的背光模组。This embodiment provides a display device, which includes a display panel and the backlight module described in any of the above embodiments.
在本实施例中,所述显示面板包括显示区和与所述显示区相邻的非显示区,所述背光模组位于所述显示面板的背光侧且对应所述显示区设置。In this embodiment, the display panel includes a display area and a non-display area adjacent to the display area, and the backlight module is located on the backlight side of the display panel and is arranged corresponding to the display area.
需要说明的是,在本实施例中,所述显示面板包括但不限于液晶显示器(LiquidCrystal Display,LCD),本实施例以所述显示面板为液晶显示器为例对本申请的技术方案进行举例说明。It should be noted that in this embodiment, the display panel includes but is not limited to a liquid crystal display (LCD). This embodiment uses the display panel as a liquid crystal display as an example to illustrate the technical solution of the present application.
可以理解的是,所述背光模组已经在上述实施例中进行了详细的说明,在此不在重复说明。It can be understood that the backlight module has been described in detail in the above embodiments, and the description will not be repeated here.
在具体应用时,所述显示装置可以为智能手机、平板电脑、笔记本电脑、智能手环、智能手表、智能眼镜、智能头盔、台式机电脑、智能电视或者数码相机等设备的显示屏,甚至可以应用在具有柔性显示屏的电子设备上。In specific applications, the display device can be a display screen of a smart phone, tablet computer, notebook computer, smart bracelet, smart watch, smart glasses, smart helmet, desktop computer, smart TV or digital camera, or even Applied to electronic devices with flexible displays.
综上所述,本申请提供一种背光模组及显示装置,所述背光模组包括背板、多个发光单元以及多个封胶单元,背板包括间隔设置的多个凹槽,所述发光单元设置于所述背板上,所述封胶单元设置于所述发光单元远离所述背板的一侧,一所述封胶单元对应一所述发光单元设置,所述封胶单元包括封胶部和卡接部,所述封胶部位于所述卡接部远离所述背板的一侧,本申请实施例通过设置一所述凹槽环绕一所述发光单元设置,所述凹槽包括倒钩结构,一所述封胶单元与其对应的所述发光单元中,所述封胶部覆盖所述发光单元,所卡接部与所述倒钩结构相互卡接,从而增加了所述封胶单元与所述背板之间的结合力,解决现有背光模组在做高低温循环可靠性测试时,可能出现的脱胶现象,延长了所述背光模组的使用寿命,保证所述显示装置的亮度均匀性。To sum up, the present application provides a backlight module and a display device. The backlight module includes a backplane, a plurality of light-emitting units and a plurality of sealing units. The backplane includes a plurality of grooves arranged at intervals. The light-emitting unit is disposed on the back plate, and the sealing unit is disposed on a side of the light-emitting unit away from the back plate. One sealing unit is provided corresponding to one light-emitting unit. The sealing unit includes The sealing part and the clamping part, the sealing part is located on the side of the clamping part away from the back plate. In the embodiment of the present application, a groove is provided around a light-emitting unit, and the groove is The groove includes a barb structure. In one of the sealing units and the corresponding light-emitting unit, the sealing part covers the light-emitting unit, and the engaging part and the barb structure engage with each other, thereby increasing the The bonding force between the sealing unit and the backplane solves the degumming phenomenon that may occur in the existing backlight module during high and low temperature cycle reliability testing, prolongs the service life of the backlight module, and ensures that all The brightness uniformity of the display device.
在上述实施例中,对各个实施例的描述都各有侧重,某个实施例中没有详述的部分,可以参见其他实施例的相关描述。In the above embodiments, each embodiment is described with its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.
以上对本申请实施例所提供的一种背光模组及显示装置进行了详细介绍,本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请的方法及其核心思想;同时,对于本领域的技术人员,依据本申请的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本申请的限制。The above is a detailed introduction to a backlight module and a display device provided by embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the present application. The application method and its core idea; at the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the ideas of this application. In summary, the contents of this specification should not be understood as Limitations on this Application.
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310208711.7A CN117492263A (en) | 2023-03-06 | 2023-03-06 | Backlight modules and display devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310208711.7A CN117492263A (en) | 2023-03-06 | 2023-03-06 | Backlight modules and display devices |
Publications (1)
Publication Number | Publication Date |
---|---|
CN117492263A true CN117492263A (en) | 2024-02-02 |
Family
ID=89678789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202310208711.7A Pending CN117492263A (en) | 2023-03-06 | 2023-03-06 | Backlight modules and display devices |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN117492263A (en) |
-
2023
- 2023-03-06 CN CN202310208711.7A patent/CN117492263A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107093659B (en) | Flexible surface light source and its manufacturing method and electronic equipment | |
TWI667782B (en) | Organic light emitting diode display panel and organic light emitting diode display device containing the same | |
CN102889507B (en) | Back light unit and use its display unit | |
WO2019223202A1 (en) | Backlight module having surface light source, and liquid crystal display panel | |
CN108828841A (en) | LED-backlit device and LED display | |
US20190302529A1 (en) | Backlight module and display device | |
US20240429215A1 (en) | Splicing screen, manufacturing method thereof, and display device | |
JP2008130628A (en) | Liquid crystal display | |
WO2023216312A1 (en) | Tiled panel | |
CN108916689A (en) | Light-emitting diode component | |
CN114822290B (en) | Light-emitting module and display device | |
WO2024216800A1 (en) | Light-emitting device, display device, and preparation method for light-emitting device | |
WO2020177162A1 (en) | Led frame, led device, and side-emitting type backlight module | |
CN201129667Y (en) | Side light type back light module unit using LED light source | |
WO2023159686A1 (en) | Backlight module and display apparatus | |
JP2014041810A (en) | Display device | |
CN117492263A (en) | Backlight modules and display devices | |
CN117490028A (en) | Lamp panel, manufacturing method thereof, backlight module and liquid crystal display device | |
CN116413956A (en) | Lamp panel, manufacturing method thereof, backlight module and display device | |
CN104779246A (en) | Light-emitting component, backlight device and manufacturing method thereof | |
KR20110061421A (en) | LED package and liquid crystal display device having same | |
CN204100057U (en) | A kind of backlight module and display unit | |
CN110112277A (en) | A kind of light emitting diode, backlight module and display device | |
CN220553464U (en) | Backlight display module and display device | |
CN103398324B (en) | Packaging structure of light-emitting element and backlight module comprising same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |