CN117472126B

CN117472126B - Chuck cleaning method and related device

Info

Publication number: CN117472126B
Application number: CN202311811162.9A
Authority: CN
Inventors: 马娇龙
Original assignee: Shenzhen Senmei Xieer Technology Co ltd
Current assignee: Shenzhen Senmei Xieer Technology Co ltd
Priority date: 2023-12-27
Filing date: 2023-12-27
Publication date: 2024-03-19
Anticipated expiration: 2043-12-27
Also published as: CN117472126A

Abstract

The application provides a chuck cleaning method and related device, the method comprising: acquiring the position, the size and the number of the foreign matters on the chuck; determining target blowing parameters of the blowing device according to the size and the quantity of the foreign matters; determining a target blowing path according to the foreign object position and the target blowing parameters; acquiring a test temperature, a test humidity and an environment temperature outside the test bin in the test bin, and acquiring a target distance between the chuck and the gas temperature adjusting device; determining a target gas temperature of the gas blown out by the blowing device according to the test temperature, the ambient temperature and the target distance; determining target gas humidity according to the target blowing amount and the test humidity; determining target attribute parameters of the target gas according to the target gas temperature, the target gas humidity and the target blowing parameters; and configuring target gas according to the target attribute parameters, blowing the target gas into the radial chuck according to the target blowing path, and exhausting the foreign matters through the exhaust fan.

Description

Chuck cleaning method and related device

Technical Field

The present invention relates to the field of testing applications in semiconductor devices, and more particularly, to a chuck cleaning method and related apparatus.

Background

With the continuous progress of semiconductor technology and the development of integrated circuits, wafer testing is an important link for ensuring the quality and reliability of chips, in which a wafer is placed on a chuck, and then the chuck with the wafer is pushed into a test chamber to perform wafer testing. However, if there is a foreign matter on the chuck, the accuracy and reliability of the test will be reduced to some extent during the wafer test, so the problem of how to effectively clean the chuck needs to be solved.

Disclosure of Invention

The embodiment of the application provides a chuck cleaning method and a related device, which can effectively clean foreign matters on a chuck.

In a first aspect, embodiments of the present application provide a chuck cleaning method applied to a test cartridge, where the test cartridge includes a chuck, an air blowing device, a gas temperature adjusting device, and an exhaust fan, the method including:

acquiring the position, the size and the number of the foreign matters on the chuck;

determining target blowing parameters of the blowing device according to the size and the quantity of the foreign matters, wherein the target blowing parameters comprise target blowing wind speed and target blowing quantity of blowing target gas;

Determining a target blowing path according to the foreign object position and the target blowing parameter, wherein the target blowing path is a moving path of the blowing device;

acquiring a test temperature, a test humidity and an environment temperature outside the test bin in the test bin, and acquiring a target distance between the chuck and the gas temperature adjusting device;

determining a target gas temperature of the gas blown out by the blowing device according to the test temperature, the ambient temperature and the target distance;

determining target gas humidity of the gas blown out by the blowing device according to the target blowing amount and the test humidity;

determining target attribute parameters of the target gas according to the target gas temperature, the target gas humidity and the target blowing parameters, wherein the target attribute parameters comprise gas temperature, gas humidity and blowing parameters;

and configuring the target gas according to the target attribute parameters, blowing the target gas into the chuck according to the target blowing path, and exhausting the foreign matters through the exhaust fan.

In a second aspect, embodiments of the present application provide a chuck cleaning device, which is applied to a test bin, the test bin includes a chuck, an air blowing device, a gas temperature adjusting device and an exhaust fan, the chuck cleaning device includes a foreign matter identification module, a data processing module, a data acquisition module, a gas configuration module and an air blowing control module, wherein:

The foreign matter identification module is used for acquiring the position, the size and the number of the foreign matters on the chuck;

the data processing module is used for determining target blowing parameters of the blowing device according to the size and the quantity of the foreign matters, wherein the target blowing parameters comprise target blowing wind speed and target blowing quantity of blowing target gas; determining a target blowing path according to the foreign object position and the target blowing parameter, wherein the target blowing path is a moving path of the blowing device;

the data acquisition module is used for acquiring the test temperature and the test humidity in the test bin, the environment temperature outside the test bin and the target distance between the chuck and the gas temperature regulating device;

the gas configuration module is used for determining a target gas temperature of the gas blown out by the blowing device according to the test temperature, the ambient temperature and the target distance; determining target gas humidity of the gas blown out by the blowing device according to the target blowing amount and the test humidity; determining target attribute parameters of the target gas according to the target gas temperature, the target gas humidity and the target blowing parameters, wherein the target attribute parameters comprise gas temperature, gas humidity and blowing parameters;

And the blowing control module is used for configuring the target gas according to the target attribute parameters, blowing the target gas into the chuck according to the target blowing path, and exhausting the foreign matters through the exhaust fan.

In a third aspect, an embodiment of the present application provides an electronic device, including a processor, a memory, a communication interface, and one or more programs, where the one or more programs are stored in the memory and configured to be executed by the processor, the programs including instructions for performing steps in any of the methods of the first aspect of the embodiments of the present application.

In a fourth aspect, embodiments of the present application provide a computer-readable storage medium, where the computer-readable storage medium stores a computer program for electronic data exchange, where the computer program causes a computer to perform some or all of the steps as described in any of the methods of the first aspect of the embodiments of the present application.

In a fifth aspect, embodiments of the present application provide a computer program product, wherein the computer program product comprises a non-transitory computer readable storage medium storing a computer program operable to cause a computer to perform some or all of the steps described in any of the methods of the first aspect of embodiments of the present application. The computer program product may be a software installation package.

By implementing the embodiment of the invention, the foreign matters on the chuck are effectively cleaned, and the accuracy and reliability of wafer testing are improved to a certain extent.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a component architecture diagram of a test cartridge provided in an embodiment of the present application;

fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

FIG. 3 is a flow chart of a method for cleaning a chuck according to an embodiment of the present application;

fig. 4 is a functional block diagram of a chuck cleaning apparatus according to an embodiment of the present application.

Detailed Description

In order to make the present application solution better understood by those skilled in the art, the following description will clearly and completely describe the technical solution in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

The terms first, second and the like in the description and in the claims of the present application and in the above-described figures, are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.

It should be understood that the term "and/or" is merely an association relationship describing the associated object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. In this context, the character "/" indicates that the front and rear associated objects are an "or" relationship. The term "plurality" as used in the embodiments herein refers to two or more.

In the embodiments of the present application, "at least one item(s)" or the like means any combination of these items, including any combination of single item(s) or plural item(s), meaning one or more, and plural means two or more. For example, at least one (one) of a, b or c may represent the following seven cases: a, b, c, a and b, a and c, b and c, a, b and c. Wherein each of a, b, c may be an element or a set comprising one or more elements.

The "connection" in the embodiments of the present application refers to various connection manners such as direct connection or indirect connection, so as to implement communication between devices, which is not limited in any way in the embodiments of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

The following describes related content, concepts, meanings, technical problems, technical solutions, advantageous effects and the like related to the embodiments of the present application.

When testing the wafer, the test probe is put into the test bin, then the chuck with the wafer is pushed into the test bin, and the wafer is tested by bundling, but if foreign matters exist on the chuck, the wafer can be damaged during the wafer test, and the accuracy and reliability of the test can be reduced to a certain extent.

In order to solve the above problems, embodiments of the present application provide a method for cleaning a chuck and a related device, firstly, obtaining a position, a size and a number of foreign objects on the chuck; determining target blowing parameters of the blowing device according to the size and the quantity of the foreign matters, wherein the target blowing parameters comprise target blowing wind speed and target blowing quantity of blowing target gas; determining a target blowing path according to the foreign object position and the target blowing parameter, wherein the target blowing path is a moving path of the blowing device; then, acquiring a test temperature, a test humidity and an environment temperature outside the test bin in the test bin, and acquiring a target distance between the chuck and the gas temperature adjusting device; determining a target gas temperature of the gas blown out by the blowing device according to the test temperature, the ambient temperature and the target distance; determining target gas humidity of the gas blown out by the blowing device according to the target blowing amount and the test humidity; determining target attribute parameters of target gas according to the target gas temperature, the target gas humidity and the target blowing parameters, wherein the target attribute parameters comprise the gas temperature, the gas humidity and the blowing parameters; and configuring target gas according to the target attribute parameters, blowing the target gas into the radial chuck according to the target blowing gas path, exhausting the foreign matters through the exhaust fan, effectively removing the foreign matters from the chuck, keeping the chuck in a certain cleaning state, and improving the accuracy of wafer testing.

Next, a component architecture of a test cartridge for performing a chuck cleaning method according to an embodiment of the present application will be described with reference to fig. 1, and fig. 1 is a component architecture diagram of a test cartridge provided according to an embodiment of the present application, where the test cartridge 110 includes four components of a chuck 111, an air blowing device 112, a gas temperature adjusting device 113, and an exhaust fan 114.

Wherein the chuck 111 is used for loading and fixing a wafer.

In one possible embodiment, the chuck 111 provides stable support for the wafer so that it does not loosen or deform during testing, which helps to maintain test accuracy and reliability.

In one possible embodiment, the chuck 111 typically has electrodes and contacts mounted thereon for delivering test signals and power to the wafer, so that various tests, such as electrical performance tests, functional tests, reliability tests, etc., may be performed.

Wherein the blowing device 112 is used for removing foreign matters on the chuck 111.

In one possible embodiment, the surface of the chuck 111 may be attached with tiny particles, such as dust, fiber, debris, etc., which may interfere with the testing process or affect the accuracy of the test results, and the blowing device 112 blows the particles away from the surface of the chuck 111 by spraying an air stream, keeping the surface of the chuck 111 clean.

In one possible embodiment, the surface of chuck 111 may be covered with dirt, such as oil, liquid residue, scale, etc., which may affect subsequent testing of the wafer, and air blowing device 112 may use air flow and compressed air to remove the dirt from the surface of chuck 111, maintaining the cleanliness and reliability of chuck 111.

It can be seen that during wafer testing, impurities and dirt on the surface of the chuck 111 may interfere with the transmission of the test signal, affecting the accuracy of the test result, and the use of the air blowing device 112 may reduce these interference, improving the accuracy and reliability of the test.

In one possible embodiment, during wafer testing, multiple wafers may be tested in succession, and the blowing device 112 may clean the surface of the chuck 111 at each test interval, preventing the residue of the previous wafer from contaminating the next wafer, ensuring test accuracy and consistency.

Wherein the gas temperature regulating device 113 is used for controlling the temperature of the blowing gas.

In one possible embodiment, the gas temperature adjusting device 113 can precisely control the temperature of the gas according to the test requirement, that is, the gas temperature adjusting device 113 can adjust the temperature of the gas to a set value by heating or cooling to meet the requirements of different tests, for example, when a series of tests sensitive to temperature are performed, in order to ensure that the temperature in the test process is kept within a predetermined range, the gas temperature adjusting device 113 adjusts the temperature of the gas within a certain range, so that the temperature of the chuck in the test chamber 110 is kept stable, the reliability of test data is improved, and the influence of temperature variation factors on the test result is reduced.

Wherein, the exhaust fan 114 is used for removing foreign matters.

In one possible embodiment, during testing, a large amount of hot air may be generated in the test chamber 110, the exhaust fan 114 may exhaust the hot air out of the test chamber 110 by generating an air flow, reducing the temperature in the test chamber 110, maintaining the stability of the chuck 111 and the wafer, the operation of the exhaust fan 114 may bring fresh air into the test chamber 110, maintaining the flow and update of the air, which may help to reduce the accumulation of odors and contaminants, provide a more stable and suitable testing environment, and the operation of the exhaust fan 114 may also help to remove moisture in the test chamber 110, reduce humidity, which may be important for some humidity sensitive tests, such as humidity characteristics tests, humidity environment tests, etc.

Therefore, through the system architecture, the chuck 111 can be cleaned in the wafer testing process, the interference of other factors on the test is reduced, and the accuracy and reliability of the test are improved.

In the following, an electronic device according to an embodiment of the present application will be described with reference to fig. 2, fig. 2 is a schematic structural diagram of an electronic device provided in an embodiment of the present application, and as shown in fig. 2, the electronic device 20 includes one or more application processors 220, a memory 230, a communication module 240, and one or more programs 231, where the application processors 220 are communicatively connected to the memory 230 and the communication module 240 through an internal communication bus.

Among them, the application processor 220 is mainly used for:

determining target attribute parameters of target gas according to the target gas temperature, the target gas humidity and the target blowing parameters, wherein the target attribute parameters comprise the gas temperature, the gas humidity and the blowing parameters;

and configuring target gas according to the target attribute parameters, blowing the target gas into the radial chuck according to the target blowing path, and exhausting the foreign matters through the exhaust fan.

Wherein the one or more programs 231 are stored in the memory 230 and configured to be executed by the application processor 220, the one or more programs 231 comprising instructions for performing any of the steps of the method embodiments described above.

The Application processor 220 may be, for example, a central processing unit (Central Processing Unit, CPU), a general purpose processor, a digital signal processor (Digital Signal Processor, DSP), an Application-specific integrated circuit (ASIC), a field programmable gate array (Field Programmable Gate Array, FPGA) or other programmable logic device, a transistor logic device, a hardware component, or any combination thereof. Which may implement or perform the various exemplary logic blocks, units and circuits described in connection with this disclosure. The application processor 220 may also be a combination that implements computing functionality, such as a combination comprising one or more microprocessors, a combination of a DSP and a microprocessor, or the like. The communication unit may be a communication module 240, a transceiver, a transceiving circuit, etc., and the storage unit may be a memory 230.

Memory 230 may be volatile memory or nonvolatile memory, or may include both volatile and nonvolatile memory. The nonvolatile memory may be a read-only memory (ROM), a Programmable ROM (PROM), an Erasable PROM (EPROM), an electrically Erasable EPROM (EEPROM), or a flash memory. The volatile memory may be random access memory (random access memory, RAM) which acts as an external cache. By way of example but not limitation, many forms of random access memory (random access memory, RAM) are available, such as Static RAM (SRAM), dynamic Random Access Memory (DRAM), synchronous Dynamic Random Access Memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced Synchronous Dynamic Random Access Memory (ESDRAM), synchronous Link DRAM (SLDRAM), and direct memory bus RAM (DR RAM).

It will be appreciated that the electronic device 20 may include more or fewer structural elements than those described in the above-described block diagrams, including, for example, a power module, physical key, wi-Fi module, speaker, bluetooth module, sensor, display module, etc., without limitation. It is understood that the electronic device 20 may be configured with the component architecture described in fig. 1.

After understanding the software and hardware architecture of the present application, a method for cleaning a chuck in an embodiment of the present application is described below with reference to fig. 3, and fig. 3 is a schematic flow chart of a method for cleaning a chuck provided in an embodiment of the present application, which specifically includes the following steps:

step S301, obtaining the position, the size and the number of the foreign matters on the chuck.

Specifically, the surface of the chuck is scanned and detected by a specific detecting device, and the position, the size and the number of the foreign matters are determined according to the detected data, wherein the detecting device may be a scanner or the like, and is not particularly limited herein.

Step S302, determining target blowing parameters of the blowing device according to the size of the foreign matters and the quantity of the foreign matters.

The target blowing parameters comprise target blowing wind speed and target blowing amount of blowing target gas, and the target wind speed corresponding to the size of the foreign matter is determined according to the preset mapping relation between the size of the foreign matter and the wind speed; determining a target blowing amount corresponding to the number of the foreign matters according to a mapping relation between the number of the pre-set foreign matters and the blowing amount; and finally, determining the target blowing parameters according to the target wind speed and the target blowing amount.

Specifically, the larger the foreign matter size, the larger the wind force required for blowing the foreign matter, wherein the wind force size corresponds to a certain range of wind speed size, the larger the foreign matter amount, the larger the air blowing amount required for removing the foreign matter, namely the foreign matter amount corresponds to a certain range of air blowing amount, and finally, the air blowing parameters of the air blowing device are determined according to the obtained wind speed size and air blowing amount.

Step S303, determining a target blowing path according to the foreign object position and the target blowing parameter.

The target blowing path is a moving path of the blowing device, and the outlet position of the chuck, in which foreign matters are blown out, is firstly obtained; determining a foreign body walking path according to the outlet position and the foreign body position; and finally, determining the target blowing path according to the target blowing parameter and the foreign object walking path.

Specifically, the outlet position of the blown foreign matter is obtained according to the distance between the foreign matter and the edge of the chuck, wherein in order to improve the speed and efficiency of blowing the foreign matter, the position with the shortest distance between the foreign matter and the chuck is obtained as the outlet position, a walking path of the blown foreign matter is planned according to the outlet position and the position of the foreign matter, and a target blowing path of the blowing device is obtained according to the target blowing parameters and the walking path of the foreign matter.

In one possible embodiment, if the foreign objects are positioned on the same straight line, the blowing device can blow along the straight line path, and the air flow is directly aligned with the foreign objects to push or blow away the foreign objects.

In one possible embodiment, if the foreign objects are intensively distributed in any part of the area of the chuck, the air blowing device can blow air in a fan-shaped manner along a specific path, and the air flow is diffused to a certain range to cover the area where the foreign objects are located, wherein the coverage area of the air blowing can be increased by fan-shaped air blowing, and the effect of blowing away the foreign objects is improved.

Step S304, obtaining the test temperature, the test humidity and the environment temperature outside the test bin in the test bin, and obtaining the target distance between the chuck and the gas temperature adjusting device.

And step S305, determining the target gas temperature of the gas blown out by the blowing device according to the test temperature, the ambient temperature and the target distance.

If the target distance is smaller than a preset distance threshold value, determining that the target gas temperature is the test temperature; if the target distance is greater than or equal to the preset distance threshold, acquiring a target thermal convection coefficient corresponding to the ambient temperature, wherein the target thermal convection coefficient represents a convection coefficient between the target gas and air; adjusting the test temperature according to the target thermal convection coefficient to obtain a reference gas temperature; determining a temperature adjustment factor according to the target blowing wind speed and the target distance; and regulating the temperature of the reference gas according to the temperature regulating factor to obtain the target gas temperature.

Specifically, a preset distance threshold is preset according to the influence of the blowing distance on the gas temperature, under the condition that the target distance is ensured to be smaller than the preset distance threshold, the influence of the target distance factor on the gas temperature can be ignored, the target gas temperature is determined to be the test temperature, the gas temperature is ensured to be consistent with the test temperature, if the target distance is greater than or equal to the preset distance threshold, the target distance factor can influence the gas temperature to a certain extent, a target thermal convection coefficient corresponding to the environment temperature at the moment is obtained, the test temperature is adjusted according to the target thermal convection coefficient, the reference gas temperature is obtained, a temperature adjustment factor is determined according to the target blowing wind speed and the target distance, the reference gas temperature is adjusted according to the temperature adjustment factor, the adjusted target gas temperature is obtained, and after the target gas passes through the target distance, the target gas temperature is consistent with the test temperature.

Further, the determining a temperature adjustment factor according to the target blowing wind speed and the target distance may specifically be: determining a reference adjustment factor corresponding to the target distance according to a mapping relation between a preset distance and the adjustment factor; determining a target fine tuning parameter corresponding to the target blowing wind speed; and fine tuning the reference regulating factor through the target fine tuning parameter to obtain the temperature regulating factor.

And step S306, determining the target gas humidity of the gas blown out by the blowing device according to the target blowing amount and the test humidity.

Determining a target blowing duration according to the target blowing amount and the target blowing wind speed; determining a corresponding humidity variation according to the target blowing duration; if the test temperature is higher than a preset first temperature threshold value, determining a first humidity adjusting parameter according to the test temperature; adjusting the test humidity according to the humidity variation and the first humidity adjustment parameter to obtain the target gas humidity; if the test temperature is lower than a preset second temperature threshold, determining a second humidity adjustment parameter according to the test temperature, wherein the preset second temperature threshold is smaller than the preset first temperature threshold; adjusting the test humidity according to the humidity variation and the second humidity adjustment parameter to obtain the target gas humidity; and if the test temperature is not higher than the preset first temperature threshold and is not lower than the preset second temperature threshold, determining that the target gas humidity is the test humidity.

In one possible embodiment, when the test temperature is higher than the preset first temperature threshold, the capability of the gas to contain water vapor is increased, that is, the gas can contain more water vapor, if the target gas is blown in at this time, the blown target gas takes away redundant water vapor, so that the test humidity is reduced, in order to balance the influence of the factor on the test humidity, the corresponding first humidity adjustment parameter is determined according to the test temperature at this time, and the test humidity is adjusted according to the acquired humidity variation and the first humidity adjustment parameter, so that the corresponding target gas humidity is obtained, and the test humidity of the test chamber is kept stable after the target gas is blown in the test chamber.

In one possible embodiment, when the test temperature is lower than the preset second temperature threshold, the capability of the gas to contain water vapor is reduced, that is, the amount of water vapor that the gas can contain is reduced, if the target gas is blown in at this time, the blown target gas leaves water vapor in part of the air, so that the test humidity is increased, in order to balance the influence of the factor on the test humidity, a corresponding second humidity adjustment parameter is determined according to the test temperature at this time, and the test humidity is adjusted according to the acquired humidity variation and the second humidity adjustment parameter, so that the corresponding target gas humidity is obtained, and the test humidity of the test chamber is kept stable after the target gas is blown in the test chamber.

In one possible embodiment, when the test temperature is not higher than the preset first temperature threshold and not lower than the preset second temperature threshold, the influence of the temperature factor on the test humidity is ignored, the target gas humidity is determined to be the test humidity at the moment, and the test humidity in the test bin is kept stable after the foreign matters are blown and cleaned.

Step S307, determining a target attribute parameter of the target gas according to the target gas temperature, the target gas humidity and the target blowing parameter.

Wherein the target attribute parameters comprise gas temperature, gas humidity and blowing parameters.

Specifically, the target gas may be air, nitrogen or inert gas, which is not limited herein, and the type of the gas may be determined according to the corresponding requirement, and then the gas temperature, the gas humidity and the blowing parameter corresponding to the target gas may be determined according to the target gas temperature, the target gas humidity and the target blowing parameter.

And step 308, configuring the target gas according to the target attribute parameters, blowing the target gas into the chuck according to the target blowing path, and exhausting the foreign matters through the exhaust fan.

Specifically, a corresponding target gas is configured according to the determined target attribute parameters, the target gas is moved according to a target blowing path, the target gas is blown into the chuck, and the target gas acts together with the exhaust fan to exhaust the foreign matters from the chuck.

In one possible embodiment, after said configuring said target gas according to said target property parameters, determining a first blow frequency according to a frequency of test probes replaced by a test cartridge; adjusting the first blowing frequency according to the preset test times to obtain a second blowing frequency; determining a reference blowing frequency corresponding to the target blowing parameter according to a corresponding relation between the preset blowing parameter and the blowing frequency; acquiring a first weight corresponding to the second blowing frequency and a second weight corresponding to the reference blowing frequency; determining a target blowing frequency according to the first weight, the second blowing frequency and the reference blowing frequency; wherein, blow into the target gas according to the radial chuck of target gas circuit of blowing, include: and blowing target gas into the radial chuck according to the target blowing gas path according to the target blowing frequency.

In one possible embodiment, after the test probe is replaced, the blowing parameter of the first blowing can be higher than the blowing parameter in the wafer test process, so that the foreign matters on the chuck are blown off to the greatest extent, the cleaning of the chuck is ensured, the time cost for cleaning the residual foreign matters in the subsequent test process is saved, and the overall progress of the test is accelerated.

The foregoing description of the embodiments of the present application has been presented primarily in terms of a method-side implementation. It will be appreciated that the electronic device, in order to achieve the above-described functions, includes corresponding hardware structures and/or software modules that perform the respective functions. Those of skill in the art will readily appreciate that the elements and algorithm steps described in connection with the embodiments disclosed herein may be embodied as hardware or a combination of hardware and computer software. Whether a function is implemented as hardware or computer software driven hardware depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

The embodiment of the application may divide the functional units of the electronic device according to the above method example, for example, each functional unit may be divided corresponding to each function, or two or more functions may be integrated in one processing unit. The integrated units may be implemented in hardware or in software functional units. It should be noted that, in the embodiment of the present application, the division of the units is schematic, which is merely a logic function division, and other division manners may be implemented in actual practice.

In the case of dividing each functional module by adopting a function corresponding to each function, fig. 4 is a functional module composition block diagram of a chuck cleaning device provided in an embodiment of the present application, where the chuck cleaning device 400 is applied to a test cabin, the test cabin includes a chuck, an air blowing device, a gas temperature adjusting device, and an exhaust fan, and the chuck cleaning device 400 includes a foreign matter identification module 410, a data processing module 420, a data collection module 430, a gas configuration module 440, and an air blowing control module 450, where:

the foreign matter identification module 410 is configured to obtain a position, a size and a number of foreign matters on the chuck;

The data processing module 420 is configured to determine a target blowing parameter of the blowing device according to the size of the foreign object and the number of the foreign objects, where the target blowing parameter includes a target blowing wind speed and a target blowing amount of a target gas to be blown; determining a target blowing path according to the foreign object position and the target blowing parameter, wherein the target blowing path is a moving path of the blowing device;

the data acquisition module 430 is configured to acquire a test temperature, a test humidity, and an ambient temperature outside the test chamber in the test chamber, and acquire a target distance between the chuck and the gas temperature adjusting device;

the gas configuration module 440 is configured to determine a target gas temperature of the gas blown out by the blowing device according to the test temperature, the ambient temperature, and the target distance; determining target gas humidity of the gas blown out by the blowing device according to the target blowing amount and the test humidity; determining target attribute parameters of the target gas according to the target gas temperature, the target gas humidity and the target blowing parameters, wherein the target attribute parameters comprise gas temperature, gas humidity and blowing parameters;

The blowing control module 450 is configured to configure the target gas according to the target attribute parameter, blow the target gas into the chuck according to the target blowing path, and exhaust the foreign matters through the exhaust fan.

As can be seen, the chuck cleaning apparatus 400 effectively cleans foreign materials on the chuck, improving accuracy and reliability of wafer testing to some extent.

It should be noted that, the specific implementation of each operation may be described in the above-illustrated method embodiment, and the chuck cleaning apparatus 400 may be used to perform the method embodiment of the present application, which is not described herein.

The embodiment of the application also provides a computer storage medium, wherein the computer storage medium stores a computer program for electronic data exchange, and the computer program makes a computer execute part or all of the steps of any one of the above method embodiments, and the computer includes an electronic device.

Embodiments of the present application also provide a computer program product comprising a non-transitory computer readable storage medium storing a computer program operable to cause a computer to perform part or all of the steps of any one of the methods described in the method embodiments above. The computer program product may be a software installation package, said computer comprising an electronic device.

For the above embodiments, for simplicity of description, the same is denoted as a series of combinations of actions. It will be appreciated by those skilled in the art that the present application is not limited by the illustrated ordering of acts, as some steps may be performed in other order or concurrently in embodiments of the present application. In addition, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred embodiments, and that the acts, steps, modules, units, etc. that are referred to are not necessarily required in the embodiments of the application.

In the foregoing embodiments, the descriptions of the embodiments of the present application are focused on each embodiment, and for a portion of one embodiment that is not described in detail, reference may be made to the related descriptions of other embodiments.

To sum up, through implementing this application embodiment, can guarantee to a certain extent that the wafer is not polluted and damaged in the test process through clean chuck, get rid of the foreign matter, reduce the influence of foreign matter to the test, improve the degree of accuracy and the reliability of test, reduce the wearing and tearing of chuck, be of value to prolonging the life of chuck, reduce the frequency of maintenance and change, reduce cost.

Those of ordinary skill in the art will appreciate that implementing all or part of the above-described method embodiments may be accomplished by a computer program to instruct related hardware, the program may be stored in a computer readable storage medium, and the program may include the above-described method embodiments when executed. And the aforementioned storage medium includes: ROM or random access memory RAM, magnetic or optical disk, etc.

The steps of a method or algorithm described in the embodiments of the present application may be implemented in hardware, or may be implemented by executing software instructions by a processor. The software instructions may be comprised of corresponding software modules that may be stored in RAM, flash memory, ROM, EPROM, electrically Erasable EPROM (EEPROM), registers, hard disk, a removable disk, a compact disk read-only (CD-ROM), or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium may be integral to the processor. The processor and the storage medium may reside in an ASIC. In addition, the ASIC may be located in a terminal device or a management device. The processor and the storage medium may reside as discrete components in a terminal device or management device.

Those of skill in the art will appreciate that in one or more of the above examples, the functions described in the embodiments of the present application may be implemented, in whole or in part, in software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loaded and executed on a computer, produces a flow or function in accordance with embodiments of the present application, in whole or in part. The computer may be a general purpose computer, a special purpose computer, a computer network, or other programmable apparatus. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions may be transmitted from one website, computer, server, or data center to another website, computer, server, or data center by a wired (e.g., coaxial cable, fiber optic, digital subscriber line (digital subscriber line, DSL)), or wireless (e.g., infrared, wireless, microwave, etc.). The computer readable storage medium may be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. that contains an integration of one or more available media. The usable medium may be a magnetic medium (e.g., a floppy disk, a hard disk, a magnetic tape), an optical medium (e.g., a digital video disc (digital video disc, DVD)), or a semiconductor medium (e.g., a Solid State Disk (SSD)), or the like.

The respective apparatuses and the respective modules/units included in the products described in the above embodiments may be software modules/units, may be hardware modules/units, or may be partly software modules/units, and partly hardware modules/units. For example, for each device or product applied to or integrated on a chip, each module/unit included in the device or product may be implemented in hardware such as a circuit, or at least part of the modules/units may be implemented in software program, where the software program runs on a processor integrated inside the chip, and the rest (if any) of the modules/units may be implemented in hardware such as a circuit; for each device and product applied to or integrated in the chip module, each module/unit contained in the device and product can be realized in a hardware manner such as a circuit, different modules/units can be located in the same component (such as a chip, a circuit module and the like) or different components of the chip module, or at least part of the modules/units can be realized in a software program, the software program runs on a processor integrated in the chip module, and the rest (if any) of the modules/units can be realized in a hardware manner such as a circuit; for each device, product, or application to or integrated with the terminal device, each module/unit included in the device may be implemented in hardware such as a circuit, and different modules/units may be located in the same component (e.g., a chip, a circuit module, etc.) or different components in the terminal device, or at least some modules/units may be implemented in a software program, where the software program runs on a processor integrated within the terminal device, and the remaining (if any) part of the modules/units may be implemented in hardware such as a circuit.

The foregoing embodiments have been provided for the purpose of illustrating the embodiments of the present application in further detail, and it should be understood that the foregoing embodiments are merely illustrative of the embodiments of the present application and are not intended to limit the scope of the embodiments of the present application, and any modifications, equivalents, improvements, etc. made on the basis of the technical solutions of the embodiments of the present application are included in the scope of the embodiments of the present application.

Claims

1. The chuck cleaning method is characterized by being applied to a test bin, wherein the test bin comprises a chuck, a blowing device, a gas temperature adjusting device and an exhaust fan; the method comprises the following steps:

configuring the target gas according to the target attribute parameters, blowing the target gas into the chuck according to the target blowing path, and exhausting the foreign matters through the exhaust fan;

wherein the determining the blowing parameters of the blowing device according to the foreign matter size and the foreign matter quantity includes:

determining a target wind speed corresponding to the size of the foreign matter according to a preset mapping relation between the size of the foreign matter and the wind speed;

determining a target blowing amount corresponding to the number of the foreign matters according to a mapping relation between the number of the pre-set foreign matters and the blowing amount;

determining the target blowing parameters according to the target wind speed and the target blowing amount;

Wherein the determining a target blowing path according to the foreign object position and the target blowing parameter includes:

acquiring an outlet position of the foreign matter blown out of the chuck;

determining a foreign body walking path according to the outlet position and the foreign body position;

determining the target blowing path according to the target blowing parameter and the foreign object walking path;

wherein the determining the target gas temperature of the gas blown out by the blowing device according to the test temperature, the ambient temperature and the target distance includes:

if the target distance is smaller than a preset distance threshold value, determining that the target gas temperature is the test temperature;

if the target distance is greater than or equal to the preset distance threshold, acquiring a target thermal convection coefficient corresponding to the ambient temperature, wherein the target thermal convection coefficient represents a convection coefficient between the target gas and air;

adjusting the test temperature according to the target thermal convection coefficient to obtain a reference gas temperature;

determining a temperature adjustment factor according to the target blowing wind speed and the target distance;

adjusting the temperature of the reference gas according to the temperature adjusting factor to obtain the target gas temperature;

Wherein the determining a temperature adjustment factor according to the target blowing wind speed and the target distance includes:

determining a reference adjustment factor corresponding to the target distance according to a mapping relation between a preset distance and the adjustment factor;

determining a target fine tuning parameter corresponding to the target blowing wind speed;

fine tuning the reference adjustment factor through the target fine tuning parameter to obtain the temperature adjustment factor;

wherein the determining the target gas humidity of the gas blown out by the blowing device according to the target blowing amount and the test humidity includes:

determining a target blowing duration according to the target blowing amount and the target blowing wind speed;

determining a corresponding humidity variation according to the target blowing duration;

if the test temperature is higher than a preset first temperature threshold value, determining a first humidity adjusting parameter according to the test temperature;

adjusting the test humidity according to the humidity variation and the first humidity adjustment parameter to obtain the target gas humidity;

if the test temperature is lower than a preset second temperature threshold, determining a second humidity adjustment parameter according to the test temperature, wherein the preset second temperature threshold is smaller than the preset first temperature threshold;

Adjusting the test humidity according to the humidity variation and the second humidity adjustment parameter to obtain the target gas humidity;

and if the test temperature is not higher than the preset first temperature threshold and is not lower than the preset second temperature threshold, determining that the target gas humidity is the test humidity.

2. The method of claim 1, wherein after said configuring said target gas according to said target property parameter, said method further comprises:

determining a first blowing frequency according to the frequency of replacing the test probe of the test bin;

adjusting the first blowing frequency according to the preset test times to obtain a second blowing frequency;

determining a reference blowing frequency corresponding to the target blowing parameter according to a preset corresponding relation between the blowing parameter and the blowing frequency;

acquiring a first weight corresponding to the second blowing frequency and a second weight corresponding to the reference blowing frequency;

determining a target blowing frequency according to the first weight, the second blowing frequency and the reference blowing frequency;

the blowing the target gas into the chuck according to the target blowing path comprises the following steps:

And blowing the target gas into the chuck according to the target blowing gas path according to the target blowing frequency.

3. The utility model provides a chuck cleaning device, its characterized in that is applied to the test storehouse, the test storehouse includes chuck, gas blowing device, gas temperature adjusting device and exhaust fan, chuck cleaning device includes foreign matter identification module, data processing module, data acquisition module, gas configuration module and gas blowing control module, wherein:

the blowing control module is used for configuring the target gas according to the target attribute parameters, blowing the target gas into the chuck according to the target blowing path, and exhausting the foreign matters through the exhaust fan;

acquiring an outlet position of the foreign matter blown out of the chuck;

4. An electronic device, comprising: a processor, a memory, and one or more programs; the one or more programs are stored in the memory and configured to be executed by the processor, the programs comprising instructions for performing the steps in the method of claim 1 or 2.

5. A computer storage medium storing a computer program comprising program instructions which, when executed by a processor, cause the processor to perform the method of claim 1 or 2.