CN117452045B - Open U-shaped coupling inductor, coupling voltage induction measuring device and method - Google Patents
Open U-shaped coupling inductor, coupling voltage induction measuring device and method Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/18—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using inductive devices, e.g. transformers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/25—Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques
- G01R19/2503—Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques for measuring voltage only, e.g. digital volt meters (DVM's)
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/25—Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques
- G01R19/2506—Arrangements for conditioning or analysing measured signals, e.g. for indicating peak values ; Details concerning sampling, digitizing or waveform capturing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/32—Compensating for temperature change
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Abstract
The invention provides an opening U-shaped coupling inductor, a coupling voltage induction measuring device and a coupling voltage induction measuring method, and belongs to the technical field of voltage measurement. The open U-shaped coupling inductor comprises alternately arranged metal layers and dielectric layers. The metal layer and the dielectric layer form a flat plate tiling structure. The flat plate tiling structure is directly bent in an integral U-shaped mode, or the flat plate tiling structure is formed into a lap-wound flat plate structure firstly, then the integral U-shaped structure is bent, or the flat plate tiling structure is formed into a wrapping flat plate structure firstly, and then the integral U-shaped structure is bent. When the U-shaped open coupling inductor is positioned in an electric field around a tested cable, a coupling electric signal is induced between any two metal layers; one or more coupled electrical signal outputs are selected. The coupling voltage induction measuring device comprises an opening U-shaped coupling sensor. The measuring method is implemented based on a coupled voltage sensing measuring device. The invention has the characteristics of convenient installation and high detection reliability.
Description
Technical Field
The invention relates to the technical field of voltage measurement, in particular to an opening U-shaped coupling inductor, a coupling voltage induction measuring device and a coupling voltage induction measuring method.
Background
The sensing and measuring technology is a basic support for the development of power grids and the like, and the digital development of the power grids requires the advanced development of the sensing technology. Voltage and current are two fundamental parameters of an electrical power system. Among them, non-contact measurement of voltage sensors belongs to the current research hotspots.
For example, a non-contact arbitrary waveform alternating voltage measuring device is disclosed in the prior art. The measuring device comprises an induction electrode, a signal processing circuit and a transmission line. The sensing electrodes are used for respectively coupling with the tested cables to form two different parasitic capacitances, and sensing signals generated by the input voltage of the tested cables. When the cable is used, metal copper particles need to be sprayed on the tested cable in advance to form the sensing electrode. The signal processing circuit is used for sequentially carrying out high-impedance transformation, amplitude proportional transformation and differential output on the current signals induced by the induction electrodes. The transmission line is used for connecting the induction electrode and the signal processing circuit and transmitting the signal induced by the induction electrode to the signal processing circuit.
However, in the prior art, the induction electrode is a metal film formed outside the insulation skin of the tested cable by adopting a metal copper particle spraying technology, so that spraying operation is required before voltage measurement, and the detection process is complicated.
Disclosure of Invention
The invention aims to solve the problems in the prior art described in the background art, and provides an opening U-shaped coupling inductor, a coupling voltage induction measuring device and a coupling voltage induction measuring method.
The technical scheme adopted by the invention is as follows:
An opening U-shaped coupling inductor is integrally in a U-shaped groove structure; the inner side area of the U-shaped groove-shaped structure is a fixed area, and the fixed area can be used for a cable to pass through; the open U-shaped coupling inductor comprises an M metal layer and an N dielectric layer; the metal layers and the dielectric layers are alternately arranged; wherein M and N are integers; the sum of M and N is an odd number greater than or equal to 3; m is greater than N and the difference between M and N is equal to 1;
The metal layers and the dielectric layers which are alternately arranged form a flat plate structure firstly, and then the flat plate structure is bent in an integral U shape to form the U-shaped groove-shaped structure;
Or alternatively arranging the metal layers and the dielectric layers to form a flat plate structure, then carrying out one or more times of plane up-down lap winding on the flat plate structure, adding an additional dielectric layer between each lap winding bending plane to form a lap winding flat plate structure, and finally forming the U-shaped groove-shaped structure after the lap winding flat plate structure is bent in a U-shaped way;
Or alternatively, the metal layers and the dielectric layers are firstly formed into a flat plate structure, then the flat plate structure is wrapped and an additional dielectric layer is added between each wrapping bending plane to form a wrapping flat plate structure, and finally the wrapping flat plate structure is integrally bent in a U-shaped manner to form the U-shaped groove-shaped structure;
when the opening U-shaped coupling inductor is positioned in an electric field around a tested cable, coupling electric signals are generated between any two metal layers in an induction mode; one or more of the coupled electrical signals are selected for output.
Further, one coupling electric signal generated by induction of two adjacent metal layers is output;
or a plurality of the coupling electric signals in the two or more coupling electric signals induced by two or more adjacent two metal layers are output.
Further, m=2, n=1.
Further, the width D of the fixed area is larger than or equal to the diameter of the cable to be tested; when the width D of the fixed area is larger than the diameter of the tested cable, a filling pad is arranged between the inner wall of the U-shaped groove of the fixed area and the tested cable;
And/or the bending part of the opening U-shaped coupling inductor is in a semicircular arc shape.
A coupled voltage induction measurement apparatus comprising:
the two U-shaped coupling inductors are used for respectively generating coupling electric signals in the electric fields of the two tested cables in an induction way and outputting the coupling electric signals;
and the differential signal processing unit is used for receiving the coupling electric signals, collecting fluctuation difference values of the coupling electric signals, performing differential processing and outputting.
Further, the system also comprises two signal enhancement processing units; the two signal enhancement processing units are respectively arranged between the two U-shaped open coupling inductors and the differential signal processing unit;
When one coupling electric signal is selected to be input into the signal enhancement processing unit in each opening U-shaped coupling sensor, the signal enhancement processing unit carries out enhancement processing on the coupling electric signal and then sends the coupling electric signal to the differential signal processing unit for differential processing;
when two or more coupling electric signals are selected to be input into the signal enhancement processing unit, the signal enhancement processing unit firstly superimposes all the coupling electric signals to be integrated into one path, and then sends the superimposed coupling electric signals to the differential signal processing unit for differential processing;
Or when two or more coupling electric signals are selected to be input into the signal enhancement processing unit, the signal enhancement processing unit carries out enhancement processing on each coupling electric signal, then all the coupling electric signals after enhancement processing are overlapped and integrated into one path, and then the coupling electric signals are sent to the differential signal processing unit for differential processing;
Or when two or more coupling electric signals are selected to be input into the signal enhancement processing unit, the signal enhancement processing unit firstly superimposes and integrates all the coupling electric signals into one path, then enhances the processing, and then sends the processed signals to the differential signal processing unit for differential processing.
Further, the system also comprises a temperature acquisition unit and an MCU processing unit; the MCU processing unit is connected with the temperature acquisition unit and the differential signal processing unit;
the temperature acquisition unit is used for detecting the temperature of the tested cable and/or the surrounding environment of the tested cable;
and after ADC analog-to-digital conversion is carried out on the signals in the differential signal processing unit, the actual voltage data of the tested cable is obtained through processing of an effective value conversion algorithm and an amplitude coefficient correction algorithm, meanwhile, the actual voltage data of the tested cable is sent into temperature data acquired by the temperature acquisition unit in real time, temperature coefficient algorithm correction is further carried out on the actual voltage data of the tested cable by the MCU processing unit, and a final measurement result is optimized.
The coupling voltage induction measurement method is implemented based on the coupling voltage induction measurement device and comprises the following steps:
two U-shaped coupling inductors with openings are respectively arranged on two tested cables;
The U-shaped coupling sensor with the opening generates coupling electric signals in the electric fields of two tested cables in an induction way and outputs the coupling electric signals;
And the differential signal processing unit receives the coupling electric signals, collects fluctuation difference values of the coupling electric signals, performs differential processing and outputs the coupling electric signals.
Further, in each open U-shaped coupling inductor, when one of the coupling electric signals is selected to be input into the signal enhancement processing unit, the signal enhancement processing unit performs enhancement processing on the coupling electric signal, and then sends the coupling electric signal to the differential signal processing unit for differential processing;
when two or more coupling electric signals are selected to be input into the signal enhancement processing unit, the signal enhancement processing unit firstly superimposes all the coupling electric signals to be integrated into one path, and then sends the superimposed coupling electric signals to the differential signal processing unit for differential processing;
Or when two or more coupling electric signals are selected to be input into the signal enhancement processing unit, the signal enhancement processing unit carries out enhancement processing on each coupling electric signal, then all the coupling electric signals after enhancement processing are overlapped and integrated into one path, and then the coupling electric signals are sent to the differential signal processing unit for differential processing;
Or when two or more coupling electric signals are selected to be input into the signal enhancement processing unit, the signal enhancement processing unit firstly superimposes and integrates all the coupling electric signals into one path, then enhances the processing, and then sends the processed signals to the differential signal processing unit for differential processing.
Further, the temperature acquisition unit synchronously detects the temperature of the two tested cables and/or the surrounding environment of each of the two tested cables;
and after ADC analog-to-digital conversion is carried out on the signals in the differential signal processing unit, the actual voltage data of the tested cable is obtained through processing of an effective value conversion algorithm and an amplitude coefficient correction algorithm, meanwhile, the actual voltage data of the tested cable is sent into temperature data acquired by the temperature acquisition unit in real time, temperature coefficient algorithm correction is further carried out on the actual voltage data of the tested cable by the MCU processing unit, and a final measurement result is optimized.
The beneficial effects of the invention are as follows:
1. Compared with the mode that spraying and other operations are required to be performed on the tested cable in the prior art, the open U-shaped coupling inductor is more convenient to install, and the risks of electric leakage, electric shock and the like caused by metal particles left on the tested cable are avoided.
2. Compared with the prior art that the detection points are relatively fixed after spraying and other operations are performed on the tested cable, the opening U-shaped coupling sensor is directly and rapidly arranged on the tested cable in a hanging, clamping and other modes, and the installation position is adjustable, namely, the positions of the detection points are relatively movable, so that the detection of a plurality of different positions on the tested cable can be rapidly realized, and the accuracy of voltage detection is improved.
3. In the prior art, in the process of non-contact measurement of the voltage of a tested cable, a positive electrode signal and a negative electrode signal are subjected to differential processing. The coupling voltage induction measuring device and the coupling voltage induction measuring method are characterized in that two groups of positive signals and negative signals are taken as input sources, fluctuation difference values are collected, and the reliability of a detection result is relatively higher.
4. The prior art does not relate to the change of the ambient temperature and cannot adapt to the continuous change process of the ambient day and night temperature in the actual engineering. The invention can introduce error correction of the measurement result caused by the ambient temperature, greatly improve the application prospect in the actual engineering and improve the measurement precision of the technology in the actual engineering process.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of an open U-shaped coupled inductor with a three-layer structure in embodiment 1.
Fig. 2 is a schematic diagram showing the installation of an open U-shaped coupled inductor of a three-layer structure in example 1.
Fig. 3 is a schematic diagram of an open U-shaped coupled inductor with a three-layer structure in embodiment 1.
Fig. 4 is a cross-sectional view taken along A-A in fig. 3.
Fig. 5 is a cross-sectional view of an open U-shaped coupled inductor of a seven-layer structure in example 1.
Fig. 6 is a schematic diagram of the open U-shaped coupled inductor of embodiment 1 when the open U-shaped coupled inductor is mounted with a filling pad.
Fig. 7 is a schematic diagram of the forming process of the open U-shaped coupled inductor in embodiment 1.
Fig. 8 is a schematic diagram showing a forming process of an open U-shaped coupling inductor of the first form in embodiment 2.
Fig. 9 is a schematic diagram showing a forming process of an open U-shaped coupling inductor in the second form in embodiment 2.
Fig. 10 is a schematic diagram of a coupled voltage sensing measurement device in embodiment 2.
Fig. 11 is a schematic diagram of a coupled voltage sensing measurement device in embodiment 2.
The reference numerals are:
100-opening U-shaped coupling sensor, 200-tested cable, 300-differential signal processing unit, 400-signal enhancement processing unit, 500-filling pad, 600-temperature acquisition unit and 700-MCU processing unit;
101-fixed region, 102-bent portion, 103-first metal layer, 104-second metal layer, 105-first dielectric layer, 106-third metal layer, 107-fourth metal layer, 108-second dielectric layer, 109-third dielectric layer, 110-sidewall portion, 111-additional dielectric layer.
Detailed Description
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention.
Embodiments of the invention are described in detail below with reference to the accompanying drawings.
Embodiment 1, an open U-shaped coupled inductor 100 is provided in this embodiment, and the structure is shown in fig. 1 and 3. The open U-shaped coupling inductor 100 has a U-shaped groove structure as a whole, and the inner region of the U-shaped groove is a fixed region 101, and the cable 200 is inserted into the fixed region 101 and is located near the bottom of the U-shaped groove. That is, the open U-shaped coupled inductor 100 can be directly and quickly disposed on the cable 200 by hanging, clamping, etc., as shown in fig. 2.
Compared with the mode that operation such as spraying is needed to be carried out on the cable to be tested in the prior art, the installation of the U-shaped open coupling inductor is more convenient, and the risk of electric leakage, electric shock and the like caused by leaving metal particles on the cable to be tested is avoided. Meanwhile, compared with the prior art that the detection points are relatively fixed after spraying and other operations are carried out on the detected cable, the opening U-shaped coupling sensor is directly and rapidly arranged on the detected cable in a hanging, clamping and other modes, and the installation position is adjustable, namely, the positions of the detection points are relatively movable, so that the detection of a plurality of different positions on the detected cable can be rapidly realized, and the accuracy of voltage detection is improved.
Meanwhile, the length L and the width D of the fixing area 101 in the open U-shaped coupling inductor 100, that is, the groove depth and the groove width of the inner area of the U-shaped groove of the open U-shaped coupling inductor 100, can be configured according to the diameter of the tested cable 200, that is, the open U-shaped coupling inductor 100 with various lengths L and widths D can be designed and produced to meet the installation requirements of hanging, clamping and the like of the tested cable 200 with different diameters. For example, if the diameter of the cable 200 to be tested is 5cm, the open U-shaped coupling sensor 100 with the length L of the fixed area 101 being 8cm and the width D being 5cm may be selected to be directly clamped on the cable 200 to be tested. If the width D of the fixing area 101 in the open U-shaped coupling inductor 100 is larger than the diameter of the cable 200 to be tested, a filling pad 500 made of flexible materials such as rubber pad and silica gel pad can be used for semi-packing and filling between the inner wall of the U-shaped groove of the open U-shaped coupling inductor 100 and the surface of the cable 200 to be tested, so that the open U-shaped coupling inductor 100 and the cable 200 to be tested are tightly clamped. While the cable 200 is positioned at an intermediate position near the bottom of the U-shaped slot in the open U-shaped coupled inductor 100, as shown in fig. 6.
Furthermore, the open U-shaped coupled inductor 100 is one of the key parts for detecting the voltage of the cable 200, and has a multi-structure along its thickness direction.
As shown in fig. 4, the open U-shaped coupled inductor 100 includes a first metal layer 103, a second metal layer 104, and a first dielectric layer 105 along the thickness direction of the open U-shaped coupled inductor 100 itself. Namely, the open U-shaped coupled inductor 100 has a three-layer structure in its thickness direction. The first dielectric layer 105 is located between the first metal layer 103 and the second metal layer 104, and may be an insulating medium such as air, insulating paper, or insulating resin. When alternating current passes through the cable 200, the electric field strength around the cable 200 varies with the voltage and current in the cable 200. When the open U-shaped coupling inductor 100 is located in the electric field around the cable 200, a coupling electric signal is induced between the first metal layer 103 and the second metal layer 104. The amplitude of the coupling electric signal has positive correlation with the amplitude of the voltage after being electrified in the cable to be tested, so that the detection of the coupling electric signal generated between the first metal layer 103 and the second metal layer 104 can be completed, and the voltage detection in the cable to be tested can be completed. Meanwhile, the first metal layer 103 and the second metal layer 104 serve as a positive electrode and a negative electrode, respectively, for coupling electric signals to be output. The second metal layer 104 adjacent to the tested cable 200 is a positive electrode, and the first metal layer 103 is a negative electrode.
As shown in fig. 5, the open U-shaped coupled inductor 100 includes a first metal layer 103, a second metal layer 104, a third metal layer 106, a fourth metal layer 107, a first dielectric layer 105, a second dielectric layer 108, and a third dielectric layer 109 along the thickness direction of the open U-shaped coupled inductor 100 itself. Namely, the open U-shaped coupled inductor 100 has a seven-layer structure in its own thickness direction. From the outside to the inside of the open U-shaped coupled inductor 100, a first metal layer 103, a first dielectric layer 105, a second metal layer 104, a second dielectric layer 108, a third metal layer 106, a third dielectric layer 109, and a fourth metal layer 107 are sequentially formed. The first dielectric layer 105, the second dielectric layer 108, and the third dielectric layer 109 may be insulating media such as air, insulating paper, insulating resin, and the like. When alternating current passes through the cable 200, the electric field strength around the cable 200 varies with the voltage and current in the cable 200. The open U-shaped coupled inductor 100 is located in an electric field around the cable 200 to be tested, and induces a coupling electric signal between the first metal layer 103 and the second metal layer 104, between the second metal layer 104 and the third metal layer 106, between the third metal layer 106 and the fourth metal layer 107, and between the first metal layer 103 and the third metal layer 106, between the first metal layer 103 and the fourth metal layer 107, and between the second metal layer 104 and the fourth metal layer 107. The amplitude of the coupling electric signal has positive correlation with the amplitude of the voltage after being electrified in the cable to be tested, so that the voltage in the cable to be tested can be tested by testing the generated coupling electric signal.
In this embodiment, a coupled electrical signal output may be selected. For example, as shown in fig. 5, the coupling signal output between the first metal layer 103 and the fourth metal layer 107 may be selected, wherein the first metal layer 103 serves as a negative electrode for coupling the electrical signal output, and the fourth metal layer 107 serves as a positive electrode for coupling the electrical signal output. Alternatively, the coupling signal output between the third metal layer 106 and the fourth metal layer 107 may be selected, wherein the third metal layer 106 is used as a negative electrode for coupling the electrical signal output, and the fourth metal layer 107 is used as a positive electrode for coupling the electrical signal output. Because the metal layers exist between the non-adjacent two metal layers, signal interference can be generated, and adverse effect is generated on the detection result, the coupling electric signals which are induced between the adjacent two metal layers are preferentially selected to be output.
In this embodiment, two or more coupled electric signals may be selected and output. As shown in fig. 5, for example, the coupling electric signal between the first metal layer 103 and the second metal layer 104 is output together with the coupling electric signal between the third metal layer 106 and the fourth metal layer 107. In one of the coupled electrical signals, the second metal layer 104 is a positive electrode, and the first metal layer 103 is a negative electrode. In another coupling signal, the fourth metal layer 107 is a positive electrode, and the third metal layer 106 is a negative electrode.
Thus, the open U-shaped coupled inductor 100 in this embodiment includes M metal layers and N dielectric layers. Wherein M and N are integers. The sum of M and N is an odd number of 3 or more. M is greater than N and the difference between M and N is equal to 1. The metal layers and the dielectric layers are alternately arranged, namely, one dielectric layer is arranged between two adjacent metal layers. When alternating current passes through the cable 200, the electric field strength around the cable 200 varies with the voltage and current in the cable 200. When the open U-shaped coupling inductor 100 is located in the electric field around the cable 200, a coupling electric signal is induced between the metal layers. The amplitude of the coupling electric signal has positive correlation with the amplitude of the voltage after being electrified in the cable to be tested, so that the voltage in the cable to be tested can be tested by testing the generated coupling electric signal. When the U-shaped open coupling inductor is positioned in an electric field around the tested cable, coupling electric signals are generated between any two metal layers in an induction way; one or more coupled electrical signal outputs are selected for voltage detection. Preferably, one or more of the sets of coupled electrical signals induced by any two adjacent metal layers are output, namely one coupled electrical signal induced by one two adjacent metal layers is output; or a plurality of coupling electric signals in two or more coupling electric signals induced by two or more adjacent two metal layers are output.
Further, the bending portion 102 of the open U-shaped coupling inductor 100, i.e. the bottom portion of the U-shaped groove of the open U-shaped coupling inductor 100, may be designed into a semicircular arc shape, so that the tested cable 200 can be installed into the bottom region of the U-shaped groove of the open U-shaped coupling inductor 100 as much as possible, so as to reduce the gap between the two and even to avoid gaps, and improve the coupling effect. In addition, when the tested cable is placed in the fixing area 101 of the open U-shaped coupling sensor 100, the side wall portion 110 of the open U-shaped coupling sensor 100 extends in a larger proportion to the package of the tested cable 200 in the opening direction, so that the coupled electric signal leaking from the opening can be further reduced, and meanwhile, the proportion of the external interference signal fed into the sensor from the opening is obviously reduced. And, the opening U-shaped coupling inductor 100 formed by the metal layer and the dielectric layer has certain flexibility, and after the cable passes through the fixing area, the opening can be further closed, so that the signal leaked from the opening and the external interference signal fed in the induction from the opening are reduced. Furthermore, the open U-shaped coupling inductor 100 formed by the metal layer and the dielectric layer has certain rigidity at the same time, so that the open U-shaped coupling inductor is not easy to deform in the use process.
Embodiment 2 provides an open U-shaped coupled inductor 100, which is different from the open U-shaped coupled inductor 100 in embodiment 1 in that:
in embodiment 1, the M metal layers and the N dielectric layers are alternately tiled to form a tiled flat plate structure. Then, the flat plate structure is bent in a U-shape to form a U-shaped groove structure, i.e. an open U-shaped coupling sensor 100.
Taking 2 metal layers and 1 dielectric layer as an example, the open U-shaped coupled inductor 100 includes a first metal layer 103, a second metal layer 104 and a first dielectric layer 105, and the process of forming the open U-shaped coupled inductor 100 is shown in fig. 7.
The first form of example 2: the whole formed by the alternately arranged M metal layers and N dielectric layers is firstly subjected to one or more times of plane up-down lap winding, namely, the planes are bent back and forth left and right and are arranged in an up-down lap mode, an additional dielectric layer 111 is added between each lap winding and bending plane, and a lap winding flat plate structure is formed. Then, the folded flat structure is bent in an overall U-shape to form a U-shaped groove structure, namely an opening U-shaped coupling sensor 100. The first form in this embodiment is equivalent to that M metal layers and N dielectric layers that are alternately arranged form a flat plate structure, then the flat plate structure is lapped up and down on one or more planes, and an additional dielectric layer is added between each lapped bending plane, so as to form a lapped plate structure, and finally the lapped plate structure is integrally bent in a U-shape to form a U-shape groove structure.
Taking 2 metal layers and 1 dielectric layer as an example, the method comprises the steps of performing one-time and two-time planar upper and lower lap winding on a first metal layer 103, a second metal layer 104 and a first dielectric layer 105 respectively, and forming an open U-shaped coupling inductor 100 as shown in fig. 8.
The second intermediate form in example 2: the whole formed by the alternately arranged M metal layers and N dielectric layers is firstly subjected to plane wrapping, and an additional dielectric layer 111 is additionally arranged between each wrapping bending plane to form a wrapping flat plate structure. Then, the wrapping flat plate structure is bent in an overall U shape to form a U-shaped groove structure, namely an opening U-shaped coupling sensor 100. The second form in this embodiment is equivalent to that M metal layers and N dielectric layers that are alternately arranged form a flat plate structure, then the flat plate structure is flat-wrapped, an additional dielectric layer is added between each wrapping bending plane, a wrapping flat plate structure is formed, and finally the wrapping flat plate structure is U-shaped bent integrally, and then a U-shaped groove structure is formed.
Taking 2 metal layers and 1 dielectric layer as an example, the open U-shaped coupled inductor 100 includes a first metal layer 103, a second metal layer 104 and a first dielectric layer 105, and the forming process is shown in fig. 9.
The open U-shaped coupling inductor provided in the embodiment is improved in self-forming mode and structure, and further has an inductive coupling effect.
Embodiment 3 provides a coupling voltage induction measurement device, and the structure of the coupling voltage induction measurement device is shown in fig. 10. The coupling voltage induction measuring apparatus includes two open U-shaped coupling inductors 100 and a differential signal processing unit 300. The open U-shaped coupled inductor 100 is connected to the differential signal processing unit 300 by means of wires. The structure of the open U-shaped coupled inductor 100 is the same as that described in embodiment 1 or embodiment 2.
Further, the coupling electric signal coupled by the electric field is usually very small. If the differential signal is led out to the far-end differential signal processing unit through the lead, interference signals such as distributed capacitance of the lead can be led in, so that detection errors are brought. Thus, each open U-shaped coupled inductor 100 in the present embodiment is provided with a corresponding signal enhancement processing unit 400.
In each open U-shaped coupling inductor 100, when one coupling electric signal is selected and input into the signal enhancement processing unit 400, the signal enhancement processing unit 400 performs enhancement processing on the coupling electric signal, and then sends the coupling electric signal to the differential signal processing unit 300 for differential processing; when two or more coupled electric signals are selected to be input into the signal enhancement processing unit 400, the signal enhancement processing unit 400 firstly superimposes all the coupled electric signals, integrates the coupled electric signals into one path, and then sends the integrated signal to the differential signal processing unit 300 for differential processing; or when two or more coupling electric signals are selected to be input into the signal enhancement processing unit 400, the signal enhancement processing unit 400 carries out enhancement processing on each coupling electric signal, then all the coupling electric signals after enhancement processing are overlapped and integrated into one path, and then the coupling electric signals are sent to the differential signal processing unit 300 for differential processing; or when two or more coupled electric signals are selected to be input into the signal enhancement processing unit 400, the signal enhancement processing unit 400 firstly superimposes all the coupled electric signals to be integrated into one path, then enhances the processing, and then sends the enhanced processed electric signals to the differential signal processing unit 300 for differential processing.
Further, the coupling voltage induction measuring apparatus further includes a temperature acquisition unit 600 and an MCU processing unit 700, as shown in fig. 11. The MCU processing unit 700 is connected with the temperature acquisition unit 600 and the differential signal processing unit 300. The temperature acquisition unit 600 is used for detecting the self temperature and the ambient temperature of the cable 200. After the signals in the differential signal processing unit 300 are subjected to ADC (analog-to-digital conversion), the actual voltage data of the tested cable is obtained through processing by an effective value conversion algorithm and an amplitude coefficient correction algorithm, meanwhile, the actual voltage data of the tested cable is sent into temperature data acquired by the temperature acquisition unit 600 in real time, the MCU processing unit 700 further carries out temperature coefficient algorithm correction on the actual voltage data of the tested cable, and the final measurement result is optimized. Considering that the current in the cable 200 is not large, the ambient temperature around the cable can be equivalently used, so that the cost is lower and the implementation is more convenient. In this embodiment, after the detection result is trimmed by the temperature change data, the accuracy of the detection result can be further improved.
The measurement method based on the coupling voltage induction measurement device in the embodiment comprises the following steps:
(1) Two open U-shaped coupled inductors 100 are respectively disposed on two tested cables 200.
(2) The open U-shaped coupling inductor 100 is coupled in the electric field of the two tested cables 200 to generate coupling electric signals, and outputs the coupling electric signals.
(3) The differential signal processing unit 300 receives the coupled electric signal or the coupled electric signal enhanced by the signal enhancement processing unit, collects a fluctuation difference value of the coupled electric signal, and then performs differential processing and outputs.
In each open U-shaped coupling inductor 100, when one coupling electric signal is selected and input into the signal enhancement processing unit 400, the signal enhancement processing unit 400 performs enhancement processing on the coupling electric signal, and then sends the coupling electric signal to the differential signal processing unit 300 for differential processing; when two or more coupled electric signals are selected to be input into the signal enhancement processing unit 400, the signal enhancement processing unit 400 firstly superimposes all the coupled electric signals, integrates the coupled electric signals into one path, and then sends the integrated signal to the differential signal processing unit 300 for differential processing; or when two or more coupling electric signals are selected to be input into the signal enhancement processing unit 400, the signal enhancement processing unit 400 carries out enhancement processing on each coupling electric signal, then all the coupling electric signals after enhancement processing are overlapped and integrated into one path, and then the coupling electric signals are sent to the differential signal processing unit 300 for differential processing; or when two or more coupled electric signals are selected to be input into the signal enhancement processing unit 400, the signal enhancement processing unit 400 firstly superimposes all the coupled electric signals to be integrated into one path, then enhances the processing, and then sends the enhanced processed electric signals to the differential signal processing unit 300 for differential processing.
If the temperature acquisition unit 600 detects the temperatures of the two cables and/or the surrounding environments of the two cables simultaneously. And after ADC analog-to-digital conversion is carried out on the signals in the differential signal processing unit 300, the actual voltage data of the tested cable is obtained through processing of an effective value conversion algorithm and an amplitude coefficient correction algorithm, meanwhile, the actual voltage data of the tested cable is sent into temperature data acquired by the temperature acquisition unit in real time, the MCU processing unit further carries out temperature coefficient algorithm correction on the actual voltage data of the tested cable, and a final measurement result is optimized.
The measurement method of the coupling voltage induction measurement device in the embodiment can be suitable for the scene of voltage detection on the live wire and the zero wire of alternating current, and also can be suitable for the scene that a load is connected in series between one live wire or one zero wire. Thus, the two cables to be tested can be live wire and zero wire, and can also be connecting wires at two ends of a load.
In the prior art, in the process of non-contact measurement of the voltage of a tested cable, a positive electrode signal and a negative electrode signal are subjected to differential processing. In this embodiment, two sets of positive signals and negative signals are used as input sources, respectively, and the fluctuation difference is collected, so that the reliability of the detection result is relatively higher.
Claims (10)
1. An open U-shaped coupling inductor is characterized in that the whole inductor is of a U-shaped groove structure; the inner side area of the U-shaped groove-shaped structure is a fixed area, and the fixed area can be used for a cable to pass through; the open U-shaped coupling inductor comprises an M metal layer and an N dielectric layer; the metal layers and the dielectric layers are alternately arranged; wherein M and N are integers; the sum of M and N is an odd number greater than or equal to 3; m is greater than N and the difference between M and N is equal to 1;
The metal layers and the dielectric layers which are alternately arranged form a flat plate structure firstly, and then the flat plate structure is bent in an integral U shape to form the U-shaped groove-shaped structure;
Or alternatively arranging the metal layers and the dielectric layers to form a flat plate structure, then carrying out one or more times of plane up-down lap winding on the flat plate structure, adding an additional dielectric layer between each lap winding bending plane to form a lap winding flat plate structure, and finally forming the U-shaped groove-shaped structure after the lap winding flat plate structure is bent in a U-shaped way;
Or alternatively, the metal layers and the dielectric layers are firstly formed into a flat plate structure, then the flat plate structure is wrapped and an additional dielectric layer is added between each wrapping bending plane to form a wrapping flat plate structure, and finally the wrapping flat plate structure is integrally bent in a U-shaped manner to form the U-shaped groove-shaped structure;
when the opening U-shaped coupling inductor is positioned in an electric field around a tested cable, coupling electric signals are generated between any two metal layers in an induction mode; one or more of the coupled electrical signals are selected for output.
2. The open U-shaped coupled inductor of claim 1 wherein one of said coupled electrical signals induced by an adjacent two of said metal layers is output;
or a plurality of the coupling electric signals in the two or more coupling electric signals induced by two or more adjacent two metal layers are output.
3. The open U-shaped coupled inductor of claim 1, wherein M = 2, n = 1.
4. The open U-shaped coupled inductor of any one of claims 1-3, wherein the width D of the fixed region is equal to or greater than the diameter of the cable being tested; when the width D of the fixed area is larger than the diameter of the tested cable, a filling pad is arranged between the inner wall of the U-shaped groove of the fixed area and the tested cable;
And/or the bending part of the opening U-shaped coupling inductor is in a semicircular arc shape.
5. A coupled voltage induction measurement apparatus, comprising:
two open U-shaped coupling inductors according to any one of claims 1-4, which are used for respectively inducing and generating coupling electric signals in electric fields of two tested cables and outputting the coupling electric signals;
and the differential signal processing unit is used for receiving the coupling electric signals, collecting fluctuation difference values of the coupling electric signals, and then carrying out differential processing and outputting.
6. The coupled voltage induction measurement apparatus of claim 5, further comprising two signal enhancement processing units; the two signal enhancement processing units are respectively arranged between the two U-shaped open coupling inductors and the differential signal processing unit;
When one coupling electric signal is selected to be input into the signal enhancement processing unit in each opening U-shaped coupling sensor, the signal enhancement processing unit carries out enhancement processing on the coupling electric signal and then sends the coupling electric signal to the differential signal processing unit for differential processing;
when two or more coupling electric signals are selected to be input into the signal enhancement processing unit, the signal enhancement processing unit firstly superimposes all the coupling electric signals to be integrated into one path, and then sends the superimposed coupling electric signals to the differential signal processing unit for differential processing;
Or when two or more coupling electric signals are selected to be input into the signal enhancement processing unit, the signal enhancement processing unit carries out enhancement processing on each coupling electric signal, then all the coupling electric signals after enhancement processing are overlapped and integrated into one path, and then the coupling electric signals are sent to the differential signal processing unit for differential processing;
Or when two or more coupling electric signals are selected to be input into the signal enhancement processing unit, the signal enhancement processing unit firstly superimposes and integrates all the coupling electric signals into one path, then enhances the processing, and then sends the processed signals to the differential signal processing unit for differential processing.
7. The coupled voltage induction measurement apparatus of claim 6, further comprising a temperature acquisition unit and an MCU processing unit; the MCU processing unit is connected with the temperature acquisition unit and the differential signal processing unit;
the temperature acquisition unit is used for detecting the temperature of the tested cable and/or the surrounding environment of the tested cable;
and after ADC analog-to-digital conversion is carried out on the signals in the differential signal processing unit, the actual voltage data of the tested cable is obtained through processing of an effective value conversion algorithm and an amplitude coefficient correction algorithm, meanwhile, the actual voltage data of the tested cable is sent into temperature data acquired by the temperature acquisition unit in real time, temperature coefficient algorithm correction is further carried out on the actual voltage data of the tested cable by the MCU processing unit, and a final measurement result is optimized.
8. A coupled voltage induction measurement method implemented based on the coupled voltage induction measurement apparatus according to claim 7, comprising the steps of:
two U-shaped coupling inductors with openings are respectively arranged on two tested cables;
The U-shaped coupling inductor with the opening is used for generating coupling electric signals in the electric fields of two tested cables in an induction mode and outputting the coupling electric signals;
and the differential signal processing unit receives the coupling electric signals, collects fluctuation difference values of the coupling electric signals, and then performs differential processing and outputs the obtained coupling electric signals.
9. The method according to claim 8, wherein, in each of the open U-shaped coupling inductors, when one of the coupling electric signals is selected to be input into the signal enhancement processing unit, the signal enhancement processing unit performs enhancement processing on the coupling electric signal, and then sends the coupling electric signal to the differential signal processing unit for differential processing;
when two or more coupling electric signals are selected to be input into the signal enhancement processing unit, the signal enhancement processing unit firstly superimposes all the coupling electric signals to be integrated into one path, and then sends the superimposed coupling electric signals to the differential signal processing unit for differential processing;
Or when two or more coupling electric signals are selected to be input into the signal enhancement processing unit, the signal enhancement processing unit carries out enhancement processing on each coupling electric signal, then all the coupling electric signals after enhancement processing are overlapped and integrated into one path, and then the coupling electric signals are sent to the differential signal processing unit for differential processing;
Or when two or more coupling electric signals are selected to be input into the signal enhancement processing unit, the signal enhancement processing unit firstly superimposes and integrates all the coupling electric signals into one path, then enhances the processing, and then sends the processed signals to the differential signal processing unit for differential processing.
10. The coupling voltage induction measurement method according to claim 8 or 9, wherein the temperature acquisition unit synchronously detects the temperature of the two tested cables and/or the surrounding environment of each of the two tested cables;
and after ADC analog-to-digital conversion is carried out on the signals in the differential signal processing unit, the actual voltage data of the tested cable is obtained through processing of an effective value conversion algorithm and an amplitude coefficient correction algorithm, meanwhile, the actual voltage data of the tested cable is sent into temperature data acquired by the temperature acquisition unit in real time, temperature coefficient algorithm correction is further carried out on the actual voltage data of the tested cable by the MCU processing unit, and a final measurement result is optimized.
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