CN117406072B - Device for testing semiconductor shot chip - Google Patents
Device for testing semiconductor shot chip Download PDFInfo
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- CN117406072B CN117406072B CN202311720856.1A CN202311720856A CN117406072B CN 117406072 B CN117406072 B CN 117406072B CN 202311720856 A CN202311720856 A CN 202311720856A CN 117406072 B CN117406072 B CN 117406072B
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- 238000012360 testing method Methods 0.000 title claims abstract description 113
- 239000004065 semiconductor Substances 0.000 title claims abstract description 44
- 239000000463 material Substances 0.000 claims abstract description 13
- 244000309464 bull Species 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 230000005389 magnetism Effects 0.000 claims description 4
- 238000001514 detection method Methods 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract description 4
- 238000002360 preparation method Methods 0.000 abstract description 3
- 239000013078 crystal Substances 0.000 description 15
- 230000008602 contraction Effects 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to the technical field of bulk grain testing, and discloses a testing device for a semiconductor bulk grain chip. This a be used for semiconductor to shot chip testing arrangement, including the test box, the front surface swing joint of test box has the chamber door, the last fixed surface of test box is connected with the cylinder, the output fixedly connected with push rod of cylinder, the one end fixedly connected with connecting plate of cylinder is kept away from to the push rod, the last fixed surface of connecting plate is connected with the electrode line, the lower surface evenly distributed of connecting plate has the test head, and test head and electrode line electric connection, the right flank fixedly connected with electric telescopic handle one of test box, the output fixedly connected with fixed frame of electric telescopic handle one, the inside fixedly connected with spring two of frame, through the electromagnetic shaker of installation, place board and splint, treat the scattered grain of semiconductor of detection and carry out quick material loading, reduce the preparation time before the detection, promote holistic detection efficiency.
Description
Technical Field
The invention relates to the technical field of bulk grain testing, in particular to a testing device for a semiconductor bulk grain chip.
Background
Polycrystalline semiconductors are thin films or bulk semiconductor materials composed of a large number of small monocrystalline semiconductor particles of different orientations, and most semiconductor devices are made of monocrystalline semiconductor materials, and when testing discrete dies cut from a wafer, special test equipment is required, which typically includes a conductive test plate and probes, and the probes, the discrete dies, and the test plate are connected in order to test conductivity by pressing the probes against the discrete dies.
When the existing test device for the semiconductor shot chips is used, the cut scattered grains are scattered on the upper surface of the placing plate by manpower before testing, the scattered grains to be detected are placed in the opposite grooves by flipping the device, the time is long, and the overall test time is increased.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a device for testing semiconductor shot chips, which is provided with the functions of rapidly feeding semiconductor shot grains to be detected, and reducing the preparation time before detection; the automatic conveying device has the advantages of conveying the placing plate, improving the automation degree of the device and the like, and solving the problem that manual turning conveying is required before the test of the semiconductor scattered grains.
In order to solve the technical problems, the invention provides the following technical scheme: be used for semiconductor shot chip testing arrangement, including the test box, its characterized in that: the front surface of the test box is movably connected with a box door, the upper surface of the test box is fixedly connected with a cylinder, the output end of the cylinder is fixedly connected with a push rod, one end of the push rod, which is far away from the cylinder, is fixedly connected with a connecting plate, the upper surface of the connecting plate is fixedly connected with electrode wires, the lower surface of the connecting plate is uniformly provided with test heads, and the test heads are electrically connected with the electrode wires;
the right side surface of the test box is fixedly connected with a first electric telescopic rod, the output end of the first electric telescopic rod is fixedly connected with a fixed frame, the inside of the fixed frame is fixedly connected with a second spring, and one end, far away from the fixed frame, of the second spring is fixedly connected with a clamping plate;
the lower fixed surface of test box is connected with the bottom plate, the upper surface of bottom plate is located the left side fixedly connected with bracing piece of test box, the one end fixedly connected with material loading case of bottom plate is kept away from to the bracing piece, the inside fixedly connected with fixed plate of material loading case, the last fixed surface of fixed plate is connected with the riser, the back fixed surface of riser is connected with the electromagnetic shaker, the last fixed surface of riser is connected with the diaphragm, the upper surface laminating of diaphragm is connected with places the board, place the surface evenly distributed of board and have the conical groove.
Preferably, the upper surface of test box is located the rear fixedly connected with motor one of cylinder, the output fixedly connected with lead screw of motor one, and the lead screw is located the inner wall inside the test box, the side surface threaded connection of lead screw has the movable block, the front surface fixedly connected with connecting rod one of movable block.
Preferably, one end fixedly connected with connecting seat of movable block is kept away from to connecting rod one, and the place ahead of movable block is kept away from to the connecting seat, the inside fixedly connected with motor two of connecting seat, the output fixedly connected with bull stick of motor two, the one end fixedly connected with test board of motor two is kept away from to the bull stick, and the test board is located the below of connecting plate.
Preferably, the two side surfaces of the test board are fixedly connected with limiting boards, and clamping grooves are formed in the upper surface and the lower surface of the limiting boards.
Preferably, the inside fixedly connected with fixing base of test box, and the fixing base is located the below of test board, the inside fixedly connected with spring of fixing base.
Preferably, one end of the spring away from the fixing seat is fixedly connected with a connecting block, the upper surface of the connecting block is provided with a sponge block, and the sponge block is in penetrating connection with the fixing seat.
Preferably, the right side fixedly connected with oil tank of test box, and the oil tank is located the below of electric telescopic handle one, the upper surface of oil tank is equipped with the oil inlet, the lower surface fixedly connected with pipe of oil tank, and the one end that the oil tank was kept away from to the pipe extends into the inside of fixing base.
Preferably, the right side of material loading case is connected with the bevel connection frame in a penetrating way, and the bevel connection frame is linked together with the test box, the lower surface threaded connection of material loading case has the collecting vessel, and the collecting vessel is located the right side of bracing piece.
Preferably, the upper surface fixedly connected with electric telescopic handle II of material loading case, electric telescopic handle II's output fixedly connected with concave arc seat, the laminating of the lower surface of concave arc seat is connected with the gasbag ball, the side surface of gasbag ball and the lower surface of concave arc seat are provided with the magnetism respectively and inhale the piece, the rear surface fixedly connected with connecting rod II of gasbag ball, and the one end that the gasbag ball was kept away from to connecting rod II is with placing board fixed connection.
Preferably, the upper surface of going up the workbin passes through bracing piece fixedly connected with unloading case, and the unloading case is located the top of electric telescopic handle two, the upper surface of unloading case is equipped with the feed inlet, the lower surface fixedly connected with unloading pipe of unloading case, and the one end that the unloading was kept away from to unloading case extends into the inside of going up the workbin.
Compared with the prior art, the invention provides the testing device for the semiconductor shot chip, which has the following beneficial effects:
1. through the electromagnetic shaker of installation, place board and splint, make riser and diaphragm produce vibrations through the operation of electromagnetic shaker, thereby make place the inside block that board conduction vibrations will wait to detect the scattered crystal grain of semiconductor to rise into the awl groove, avoid manual stirring scattered crystal grain, reduce the preparation time before detecting, extend through the operation of electric telescopic handle one and make fixed frame right movement, with place board gomphosis, extrude spring two, make splint carry out the centre gripping to placing the board, will place the board and remove to the upper surface of test board, treat the scattered crystal grain of semiconductor that detects fast and carry out the material loading, promote holistic detection efficiency.
2. Through the gasbag ball of installation, magnetism inhale piece and bevel connection frame, after the scattered grain of semiconductor that waits to detect is with place the board gomphosis, make through electric telescopic handle to place the board and offset with the inner wall laminating of bevel connection frame, thereby make magnetism inhale the piece separation, make gasbag ball and concave arc seat separation, convey placing the board, improve the degree of automation of device.
3. Through connecting seat, fixing base and the sponge piece of installation, the operation through motor one makes the movable block drive the connecting seat and moves downwards, makes the test board extrude the sponge piece and covers the test board surface and go up fire-proof oil, makes the bull stick drive the test board through motor two's operation and overturns, makes the another side of test board cover and goes up fire-proof oil, improves the security of test board when the test.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram of the front internal structure of the present invention;
FIG. 3 is a schematic view of a cylinder surface connection structure according to the present invention;
FIG. 4 is a schematic view of a surface connection structure of the motor according to the present invention;
FIG. 5 is a schematic view of a detachable structure of a fixing base of the present invention;
FIG. 6 is a schematic view of a surface connection structure of the electric telescopic rod according to the present invention;
FIG. 7 is a schematic view of a split structure of a placement plate according to the present invention;
fig. 8 is a schematic view of a surface connection structure of a fixing plate according to the present invention.
Wherein: 1. a test box; 101. a door; 102. a cylinder; 103. a push rod; 104. a connecting plate; 105. an electrode wire; 106. a test head; 107. a bottom plate; 2. a first motor; 201. a screw rod; 202. a moving block; 203. a first connecting rod; 3. a connecting seat; 301. a second motor; 302. a rotating rod; 303. a test board; 304. a limiting plate; 305. a clamping groove; 4. a fixing seat; 401. a first spring; 402. a connecting block; 403. a sponge block; 5. an oil tank; 501. an oil inlet; 502. a conduit; 6. an electric telescopic rod I; 601. a fixed frame; 602. a second spring; 603. a clamping plate; 7. feeding a material box; 701. a support rod; 702. a bezel; 703. a collection tank; 8. an electric telescopic rod II; 801. a concave arc seat; 802. an air bag ball; 803. a magnetic suction block; 804. a second connecting rod; 805. placing a plate; 806. a conical groove; 9. a fixing plate; 901. a riser; 902. a vibrator; 903. a cross plate; 10. discharging boxes; 1001. a feed inlet; 1002. and (5) blanking pipes.
Description of the embodiments
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-8, a semiconductor shot chip testing device comprises a testing box 1, a box door 101 is movably connected to the front surface of the testing box 1, a cylinder 102 is fixedly connected to the upper surface of the testing box 1, a push rod 103 is fixedly connected to the output end of the cylinder 102, a connecting plate 104 is fixedly connected to one end of the push rod 103 away from the cylinder 102, an electrode wire 105 is fixedly connected to the upper surface of the connecting plate 104, a testing head 106 is uniformly distributed on the lower surface of the connecting plate 104, the testing head 106 is electrically connected with the electrode wire 105, a motor 1 is fixedly connected to the upper surface of the testing box 1 at the rear of the cylinder 102, a screw 201 is fixedly connected to the output end of the motor 1, the screw 201 is positioned in the inner wall of the testing box 1, a moving block 202 is in threaded connection with the side surface of the screw 201, a connecting rod 203 is fixedly connected to the front surface of the moving block 202, one end of the connecting rod 203 away from the moving block 202 is fixedly connected with a connecting seat 3, the connecting seat 3 is positioned in front of the moving block 202, the motor II 301 is fixedly connected in the connecting seat 3, the rotating rod 302 is fixedly connected at the output end of the motor II 301, the testing plate 303 is fixedly connected at one end of the rotating rod 302 far away from the motor II 301, the testing plate 303 is positioned below the connecting plate 104, the limiting plates 304 are fixedly connected on the two side surfaces of the testing plate 303, the clamping grooves 305 are arranged on the upper surface and the lower surface of the limiting plates 304, before the semiconductor bulk crystal grain is tested, the screw 201 is rotated by the operation of the motor I2, so that the moving block 202 drives the connecting rod I203 to move downwards, the connecting seat 3 drives the testing plate 303 to move downwards, the sponge block 403 is extruded to cover the surface of the testing plate 303 with fireproof oil, the rotating rod 302 drives the testing plate 303 to overturn by the operation of the motor II 301, the other surface of the test board 303 is covered with fireproof oil, so that the safety of the test board 303 during testing is improved, the movable block 202 drives the test board 303 to move upwards through the operation of the motor I2, the placing board 805 is supported, the push rod 103 pushes the connecting plate 104 through the operation of the air cylinder 102, the test head 106 is contacted with the surface of the semiconductor bulk crystal grain to be tested, and the semiconductor bulk crystal grain is tested through the connected electrode wire 105.
The right side fixedly connected with electric telescopic handle one 6 of test box 1, electric telescopic handle one 6's output fixedly connected with fixed frame 601, fixed frame 601's inside fixedly connected with spring two 602, the one end fixedly connected with splint 603 of fixed frame 601 is kept away from to spring two 602, test box 1's lower surface fixedly connected with bottom plate 107, the upper surface of bottom plate 107 is located test box 1's left side fixedly connected with bracing piece 701, one end fixedly connected with feed box 7 of bracing piece 701 is kept away from bottom plate 107, feed box 7's inside fixedly connected with fixed plate 9, fixed plate 9's upper surface fixedly connected with riser 901, riser 901's rear surface fixedly connected with vibrator 902, riser 901's upper surface fixedly connected with diaphragm 903's upper surface laminating is connected with placing plate 805, placing plate 805's surface evenly distributed has conical groove 806, after the scattered crystal grain that awaits measuring falls to upper surface of upper feed box 7, make riser 901 and diaphragm 903 produce vibrations through the function of vibrator 902, thereby make placing plate 805 with the semiconductor card that awaits measuring fall into conical groove 805, make the inside of going into the electronic clamp groove 805 that the measuring the semiconductor card that awaits measuring is carried out, the rapid movement of the side of flange plate 805, make the upper surface of flange 805 and moving to the flange is carried out the measuring, the flange is carried out the flange and the flange is moved, the upper surface of flange is moved to the electrical flat plate 805, the upper surface is evenly distributed, the surface of flange is evenly, the flange is used for measuring, after the scattered crystal grain, the inside is measured, and the scattered crystal grain is measured, and the inside is measured, and the surface is measured.
The right side surface of the upper feed box 7 is connected with a bevel port frame 702 in a penetrating way, the bevel port frame 702 is communicated with the test box 1, the lower surface of the upper feed box 7 is connected with a collecting tank 703 in a threaded way, the collecting tank 703 is positioned on the right side of a supporting rod 701, the upper surface of the upper feed box 7 is fixedly connected with a second electric telescopic rod 8, the output end of the second electric telescopic rod 8 is fixedly connected with a concave arc seat 801, the lower surface of the concave arc seat 801 is connected with an air bag ball 802 in a fitting way, the side surface of the air bag ball 802 and the lower surface of the concave arc seat 801 are respectively provided with a magnetic attraction block 803, the rear surface of the air bag ball 802 is fixedly connected with a second connecting rod 804, one end of the second connecting rod 804 far away from the air bag ball 802 is fixedly connected with a placing plate 805, the upper surface of the upper feed box 7 is fixedly connected with a blanking box 10 through a supporting rod 701, the blanking box 10 is positioned above the second electric telescopic rod 8, the upper surface of the blanking box 10 is provided with a feed inlet 1001, the lower surface of the blanking box 10 is fixedly connected with a blanking pipe 1002, and the end of the blanking pipe 1002 far away from the blanking box 10 extends into the upper material box 7, before the semiconductor bulk crystal grains to be detected are fed, the semiconductor bulk crystal grains in the blanking box 10 are guided into the upper material box 7 through the blanking pipe 1002 and fall onto the upper surface of the placement plate 805, the concave arc seat 801 is pushed to move downwards to be attached to the transverse plate 903 through the operation extension of the electric telescopic rod II 8, the semiconductor bulk crystal grains are embedded with the conical groove 806, the fallen semiconductor bulk crystal grains fall into the collecting tank 703 to be collected and then toppled into the inner part of the blanking box 10, the placement plate 805 is driven to move upwards through the operation contraction of the electric telescopic rod II 8 to be attached to the bevel frame 702, the magnetic blocks 803 are separated through the upward contraction of the electric telescopic rod II 8 after the placement plate 805 is clamped, the air bag ball 802 is separated from the concave arc seat 801, the placement plate 805 is transported to increase the degree of automation of the device.
The inside fixedly connected with fixing base 4 of test box 1, and fixing base 4 is located the below of test board 303, the inside fixedly connected with spring one 401 of fixing base 4, the one end fixedly connected with connecting block 402 of fixing base 4 is kept away from to spring one 401, the upper surface of connecting block 402 is provided with sponge piece 403, and sponge piece 403 and fixing base 4 through connection, the right flank fixedly connected with oil tank 5 of test box 1, and oil tank 5 is located the below of electric telescopic handle one 6, the upper surface of oil tank 5 is equipped with oil inlet 501, the lower fixed surface of oil tank 5 is connected with pipe 502, and pipe 502 is kept away from the inside of fixing base 4, the inside fire prevention oil of oil tank 5 is led into the inside of fixing base 4 through pipe 502, when test board 303 moves down, extrude sponge piece 403, make sponge piece 403 remove to fixing base 4's inside, extrude spring one 401, adsorb fire prevention oil, with the surface of fire prevention oil seal at test board 303.
When in use, the semiconductor scattered grains in the blanking box 10 are guided into the upper box 7 through the blanking pipe 1002 and fall to the upper surface of the placement plate 805, the concave arc seat 801 is pushed to move downwards to be attached to the transverse plate 903 through the operation extension of the electric telescopic rod II 8, the vertical plate 901 and the transverse plate 903 generate vibration through the operation of the vibrator 902, the placement plate 805 is enabled to conduct vibration to lift the semiconductor scattered grains to be detected into the conical groove 806 to be clamped, the fallen semiconductor scattered grains fall into the collecting tank 703 to be collected and then fall into the blanking box 10, the placement plate 805 is driven to move upwards through the operation contraction of the electric telescopic rod II 8 to be attached to the bevel frame 702, the fixed frame 601 moves rightwards to be embedded with the placement plate 805 through the operation extension of the electric telescopic rod I6, the spring II 602 is extruded, clamping plate 603 clamps placing plate 805, placing plate 805 moves to the upper surface of test plate 303, rapidly loads semiconductor bulk crystal to be tested, screw rod 201 rotates by operation of motor one 2, moving block 202 drives connecting rod one 203 to move downwards, connecting seat 3 drives test plate 303 to move downwards, sponge block 403 is extruded to cover the surface of test plate 303 with fire-proof oil, rotating rod 302 drives test plate 303 to overturn by operation of motor two 301, the other surface of test plate 303 is covered with fire-proof oil, moving block 202 drives test plate 303 to move upwards by operation of motor one 2, placing plate 805 is received, pushing rod 103 pushes connecting plate 104 by operation of cylinder 102 to contact test head 106 with the surface of semiconductor bulk crystal to be tested, semiconductor discrete die were tested by the connected electrode lines 105.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. Be used for semiconductor shot chip testing arrangement, including test box (1), its characterized in that: the front surface of the test box (1) is movably connected with a box door (101), the upper surface of the test box (1) is fixedly connected with an air cylinder (102), the output end of the air cylinder (102) is fixedly connected with a push rod (103), one end, far away from the air cylinder (102), of the push rod (103) is fixedly connected with a connecting plate (104), the upper surface of the connecting plate (104) is fixedly connected with an electrode wire (105), the lower surface of the connecting plate (104) is uniformly provided with test heads (106), and the test heads (106) are electrically connected with the electrode wire (105);
the right side face of the test box (1) is fixedly connected with a first electric telescopic rod (6), the output end of the first electric telescopic rod (6) is fixedly connected with a fixed frame (601), the inside of the fixed frame (601) is fixedly connected with a second spring (602), and one end, far away from the fixed frame (601), of the second spring (602) is fixedly connected with a clamping plate (603);
the automatic testing device is characterized in that a bottom plate (107) is fixedly connected to the lower surface of the testing box (1), a supporting rod (701) is fixedly connected to the upper surface of the bottom plate (107) and located on the left side of the testing box (1), a feeding box (7) is fixedly connected to one end, far away from the bottom plate (107), of the supporting rod (701), a fixing plate (9) is fixedly connected to the inside of the feeding box (7), a vertical plate (901) is fixedly connected to the upper surface of the fixing plate (9), a vibrator (902) is fixedly connected to the rear surface of the vertical plate (901), a transverse plate (903) is fixedly connected to the upper surface of the vertical plate (901), a placing plate (805) is connected to the upper surface of the transverse plate (903) in a fitting mode, clamping plates (603) are used for clamping the placing plate (805), conical grooves (806) are uniformly distributed on the surface of the placing plate (805), and shot chips to be detected fall into the inner clamping of the conical grooves (806).
The upper surface of the test box (1) is positioned behind the air cylinder (102) and is fixedly connected with a first motor (2), the output end of the first motor (2) is fixedly connected with a screw rod (201), the screw rod (201) is positioned inside the inner wall of the test box (1), the side surface of the screw rod (201) is in threaded connection with a moving block (202), and the front surface of the moving block (202) is fixedly connected with a first connecting rod (203);
one end fixedly connected with connecting seat (3) of movable block (202) is kept away from to connecting rod one (203), and connecting seat (3) are located the place ahead of movable block (202), the inside fixedly connected with motor two (301) of connecting seat (3), the output fixedly connected with bull stick (302) of motor two (301), one end fixedly connected with test board (303) of motor two (301) is kept away from to bull stick (302), and test board (303) are located the below of connecting plate (104).
2. The apparatus for testing semiconductor bulk chips as defined in claim 1, wherein: limiting plates (304) are fixedly connected to the surfaces of the two sides of the test plate (303), and clamping grooves (305) are formed in the upper surface and the lower surface of the limiting plates (304).
3. The apparatus for testing semiconductor bulk chips as defined in claim 1, wherein: the inside fixedly connected with fixing base (4) of test box (1), and fixing base (4) are located the below of test board (303), the inside fixedly connected with spring (401) of fixing base (4).
4. A test apparatus for semiconductor dice according to claim 3, characterized in that: one end of the first spring (401) far away from the fixed seat (4) is fixedly connected with a connecting block (402), a sponge block (403) is arranged on the upper surface of the connecting block (402), and the sponge block (403) is connected with the fixed seat (4) in a penetrating mode.
5. The apparatus for testing semiconductor bulk chips as defined in claim 1, wherein: the right side fixedly connected with oil tank (5) of test box (1), and oil tank (5) are located the below of electric telescopic handle one (6), the upper surface of oil tank (5) is equipped with oil inlet (501), the lower fixed surface of oil tank (5) is connected with pipe (502), and the one end that oil tank (5) was kept away from to pipe (502) extends into the inside of fixing base (4).
6. The apparatus for testing semiconductor bulk chips as defined in claim 1, wherein: the right side of going up workbin (7) is connected with bevel connection frame (702) in a penetrating way, and bevel connection frame (702) are linked together with test box (1), the lower surface threaded connection of going up workbin (7) has collection jar (703), and collection jar (703) are located the right side of bracing piece (701).
7. The apparatus for testing semiconductor bulk chips as defined in claim 1, wherein: the utility model discloses a motor-driven telescopic handle, including material loading case (7), motor-driven telescopic handle (8) output fixedly connected with concave arc seat (801), the lower surface laminating of concave arc seat (801) is connected with gasbag ball (802), the side surface of gasbag ball (802) is provided with magnetism respectively with the lower surface of concave arc seat (801) and inhales piece (803), the rear surface fixedly connected with connecting rod two (804) of gasbag ball (802), and the one end that gasbag ball (802) were kept away from to connecting rod two (804) is with placing board (805) fixed connection.
8. The apparatus for testing semiconductor bulk chips as defined in claim 1, wherein: the upper surface of going up workbin (7) is through bracing piece (701) fixedly connected with unloading case (10), and unloading case (10) are located the top of electric telescopic handle two (8), the upper surface of unloading case (10) is equipped with feed inlet (1001), the lower surface fixedly connected with unloading pipe (1002) of unloading case (10), and the one end that unloading pipe (1002) kept away from unloading case (10) extends into the inside of going up workbin (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311720856.1A CN117406072B (en) | 2023-12-14 | 2023-12-14 | Device for testing semiconductor shot chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311720856.1A CN117406072B (en) | 2023-12-14 | 2023-12-14 | Device for testing semiconductor shot chip |
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| Publication Number | Publication Date |
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| CN117406072A CN117406072A (en) | 2024-01-16 |
| CN117406072B true CN117406072B (en) | 2024-02-13 |
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| CN202311720856.1A Active CN117406072B (en) | 2023-12-14 | 2023-12-14 | Device for testing semiconductor shot chip |
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