CN117381819A - Edge clamping type wafer taking and placing mechanical arm for operation in ultra-vacuum environment - Google Patents
Edge clamping type wafer taking and placing mechanical arm for operation in ultra-vacuum environment Download PDFInfo
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- CN117381819A CN117381819A CN202311702356.5A CN202311702356A CN117381819A CN 117381819 A CN117381819 A CN 117381819A CN 202311702356 A CN202311702356 A CN 202311702356A CN 117381819 A CN117381819 A CN 117381819A
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- 238000005452 bending Methods 0.000 claims description 23
- 238000005192 partition Methods 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 5
- 230000008602 contraction Effects 0.000 claims description 4
- 238000009826 distribution Methods 0.000 abstract description 10
- 235000012431 wafers Nutrition 0.000 description 51
- 238000010586 diagram Methods 0.000 description 8
- 210000000245 forearm Anatomy 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 210000001145 finger joint Anatomy 0.000 description 3
- 238000012935 Averaging Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
The invention discloses an edge clamping type wafer taking and placing mechanical arm for operation in an ultra-vacuum environment, and relates to the field of wafer carrying. The following scheme is proposed now, and it includes the base, the output of base rotates and is connected with the arm, the output of arm rotates and is connected with the mechanism of taking, the mechanism of taking includes: the connecting seat is rotationally connected to the arm; the finger arm is fixed on the connecting seat; the clamping finger is fixed on the finger arm and used for clamping and fixing the wafer; the driving assembly is fixed on the finger arm and is used for driving the clamping finger; the end parts of the split-flow tube bundles are respectively fixed with the clamping fingers and the driving assembly, and the split-flow tube bundles are used for providing pressure for the distribution of the clamping fingers; and the throttling assembly is fixed on the split-flow tube bundle and is used for throttling the split-flow tube bundle. The wafer edge is clamped by the clamping fingers to be taken, and the front side and the back side of the wafer are not directly contacted, so that the surface of the wafer is prevented from being polluted.
Description
Technical Field
The invention relates to the field of wafer carrying, in particular to an edge clamping type wafer taking and placing mechanical arm for operation in an ultra-vacuum environment.
Background
Wafer handling is a critical step in the semiconductor manufacturing process that involves taking wafers from carriers and placing them into processing equipment or storage media;
at present, a wafer is taken and placed mainly through a mechanical arm, the mechanical arm for taking and placing the wafer at present is generally referred to as a finger-rest type mechanical arm, for example, a novel direct-drive motor-driven wafer mechanical arm with the application publication number of CN116460829A has some problems when the finger-rest type mechanical arm takes the wafer;
firstly, the finger-support type mechanical arm can contact the surface of a wafer in a large area when the wafer is taken, so that the surface of the wafer is easy to pollute and scratch, secondly, the finger-support type mechanical arm mainly adopts an adsorption fixing mode to ensure the stability of the wafer, but under the ultra-vacuum environment, the pressure difference is not changed, and the stability of the wafer is difficult to ensure.
Disclosure of Invention
Therefore, the invention aims to provide an edge clamping type wafer taking and placing mechanical arm for operation in an ultra-vacuum environment, so that a wafer is taken in an edge clamping mode, the stability of taking the wafer in the ultra-vacuum environment is ensured, the contact area with the surface of the wafer is reduced, and pollution and scratch on the surface of the wafer are avoided.
In order to achieve the technical purpose, the invention provides an edge clamping type wafer taking and placing mechanical arm for super vacuum environment operation, which comprises the following steps:
the device comprises a base, an arm is connected with the output end of the base in a rotating mode, a picking mechanism is connected with the output end of the arm in a rotating mode, and the picking mechanism comprises:
the connecting seat is rotationally connected to the arm;
the finger arm is fixed on the connecting seat;
the clamping finger is fixed on the finger arm and used for clamping and fixing the wafer;
the driving assembly is fixed on the finger arm and is used for driving the clamping finger;
the end parts of the split-flow tube bundles are respectively fixed with the clamping fingers and the driving assembly, and the split-flow tube bundles are used for providing pressure for the distribution of the clamping fingers;
the throttling assembly is fixed on the split-flow tube bundle and is used for throttling the split-flow tube bundle;
the wafer edge is clamped by the clamping fingers to be taken, and the front side and the back side of the wafer are not directly contacted, so that the surface of the wafer is prevented from being polluted.
Preferably, the clamping finger comprises:
the fixed block is fixed on the finger arm;
the side bending soft knuckle is fixedly connected with the fixed block and is used for adjusting the clamping angle;
the soft finger joint is clamped and fixed on the side bending soft finger joint and used for clamping a wafer.
Preferably, the clamping finger further comprises:
the contraction cavity is arranged in the side bending soft knuckle and provides a deformation contraction space for the side bending soft knuckle;
the inner support piece is embedded and fixed in the lateral bending soft knuckle and is used for supporting in the lateral bending soft knuckle;
the air guide groove sequentially penetrates through the fixing block and the side bending soft knuckle and is communicated with the inner cavity of the clamping soft knuckle.
Preferably, the driving assembly comprises a hydraulic cylinder, an electric push rod and a connecting block, a groove is formed in the finger arm, the hydraulic cylinder and the electric push rod are fixed in the groove, and the output end of the electric push rod is fixedly connected with the input end of the hydraulic cylinder through the connecting block.
Preferably, the diverting tube bundle comprises:
the two ends of the main flow pipe are respectively connected and fixed with the output end of the hydraulic cylinder and the throttling component;
the two ends of the first shunt tube are respectively connected and fixed with the throttling component and the clamping finger, the inner cavity of the throttling component is communicated with the inner cavity of the air guide groove through the first shunt tube, and the clamping finger connected through the first shunt tube is positioned at the tail end of the finger arm;
the two ends of the second shunt pipe are fixedly connected with the throttling component and the clamping finger respectively, and the clamping finger connected through the second shunt pipe is positioned at the head end of the finger arm;
the first shunt tube, the second shunt tube and the main flow tube are all fixed on the finger arm.
Preferably, the throttle assembly comprises:
the flow distribution box is fixed on the finger arm, the end parts of the main flow guide pipe, the first flow distribution pipe and the second flow distribution pipe are fixed on the flow distribution box, the hydraulic cylinder is communicated with the inner cavity of the flow distribution box through the main flow guide pipe, and the inner cavity of the flow distribution box is communicated with the finger clamp through the first flow distribution pipe and the second flow distribution pipe respectively;
the stepping motor is embedded and fixed on the shunt box;
the driving gear is fixed on the output end of the stepping motor;
the driven gear is rotationally connected with the shunt box and meshed with the driving gear;
the valve block is in sliding connection with the shunt box, the valve block is used for throttling a channel communicated with the second shunt pipe by the shunt box, an arc-shaped rack is fixed on the valve block, and the arc-shaped rack is meshed with the driven gear.
Preferably, a pressure sensor is fixed in the clamping soft knuckle and is used for acquiring a pressure value and marked as，/>Is a value of 0 or more.
Preferably, a throttle adjusting unit is fixed on the connecting seat, and the throttle adjusting unit includes:
the boost rate processing module is used for analyzing and acquiring the boost rate according to the pressure value;
the throttle instruction generation module is used for judging whether to generate a throttle instruction according to the boosting rate;
and the throttling control module controls the throttling assembly to adjust the split flow according to the throttling instruction.
Preferably, the boosting rate includes a partition boosting rate and a partition boosting rate, and the method for obtaining the partition boosting rate and the partition boosting rate includes:
s1, recording the pressure value of each pressure sensor, and respectively marking as、/>、/>.../>；
S2, acquiring time required by the pressure value from 0 to a preset pressure threshold value, and marking the time as t;
s3, according to the formulaObtain a boost rate, wherein->Is the boost rate;
and S4, partitioning all the boosting rates, wherein the boosting rate obtained by averaging the pressure values obtained by the finger-clamping pressure sensor connected with the second shunt tube is a partitioned boosting rate, the partitioned boosting rate is marked as a, the boosting rate obtained by averaging the pressure values obtained by the finger-clamping pressure sensor connected with the first shunt tube is a partitioned boosting rate, and the marked values of b, a and b are all values which are larger than or equal to 0.
Preferably, the throttle command generation module compares a subarea boosting rate with a subarea boosting rate;
generating a throttling instruction when the comparison result is a > b or a < b;
if the comparison result is a=b, no throttle command is generated.
Preferably, the throttle instruction includes a first throttle instruction and a second throttle instruction;
when the comparison result is a > b, a first throttling instruction is generated, and the first throttling instruction controls the throttling assembly to reduce the caliber of a channel leading to the second shunt tube once through the throttling control module;
and when the comparison result is a < b, generating a second throttling instruction, wherein the second throttling instruction controls the throttling assembly to increase the caliber of a channel leading to the second shunt pipe for a single time through the throttling control module.
From the above technical scheme, the application has the following beneficial effects:
1. the clamping fingers are fixed on the finger arms and provide hydraulic power for the clamping fingers through the driving assembly, so that the clamping fingers can clamp the edge of the wafer to take the wafer, the wafer surface is not directly contacted, pollution and scratch of the wafer surface are avoided, and the stability of taking the wafer is not affected under the ultra-vacuum environment.
2. Through pressure sensor throttle control, let the boost speed of a plurality of clamp fingers tend to be close, avoid producing unilateral boost speed too fast problem that leads to the wafer slope when centre gripping, further promote the stability of taking the wafer.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of an edge gripping type wafer pick-and-place robot for operation in an ultra-vacuum environment;
FIG. 2 is a schematic diagram of an exploded view of the pick-up mechanism of FIG. 1 for an edge gripping wafer pick-up robot operating in an ultra-vacuum environment according to the present invention;
FIG. 3 is a schematic cross-sectional view of the clamping finger of FIG. 2 of an edge gripping wafer handling robot operating in an ultra-vacuum environment according to the present invention;
FIG. 4 is a schematic diagram of the overall structure of the driving assembly of FIG. 2 of an edge gripping type wafer pick-and-place robot operating in an ultra-vacuum environment according to the present invention;
FIG. 5 is a schematic top view of the picking mechanism of FIG. 1 of an edge gripping wafer pick-and-place robot operating in an ultra-vacuum environment according to the present invention;
FIG. 6 is a schematic cross-sectional view of the clamping finger of FIG. 2 of an edge gripping wafer handling robot operating in an ultra-vacuum environment according to the present invention;
FIG. 7 is a schematic diagram of an exploded view of the throttle assembly of FIG. 2 in an edge gripping wafer handling robot operating in an ultra-vacuum environment according to the present invention;
FIG. 8 is a schematic diagram of a partial cross-sectional structure of the throttling assembly of FIG. 2 of an edge gripping wafer pick-and-place robot operating in an ultra-vacuum environment according to the present invention;
FIG. 9 is a block diagram of a process flow of an edge gripping wafer handling robot for ultra-vacuum environment operation according to the present invention;
FIG. 10 is a schematic diagram illustrating a change in the direction of the clamping force of the clamping fingers in FIG. 1 of an edge clamping wafer handling robot operating in an ultra-vacuum environment according to the present invention;
FIG. 11 is a schematic diagram illustrating a change in the direction of the clamping force of the clamping fingers in FIG. 1 of an edge clamping wafer handling robot operating in an ultra-vacuum environment.
Description of the drawings: 1. a base; 2. an arm; 3. a picking mechanism; 31. a connecting seat; 32. a finger arm; 33. a clamping finger; 331. a fixed block; 332. soft finger joints of lateral bending; 333. clamping the soft knuckle; 334. a shrink chamber; 335. an inner support sheet; 336. an air guide groove; 34. a drive assembly; 341. a hydraulic cylinder; 342. an electric push rod; 343. a connecting block; 35. a shunt tube bundle; 351. a dominant flow tube; 352. a first shunt; 353. a second shunt tube; 36. a throttle assembly; 361. a shunt box; 362. a stepping motor; 363. a drive gear; 364. a driven gear; 365. a valve plate; 3651. an arc-shaped rack; 4. a pressure sensor; 5. a throttle adjusting unit; 51. a boost rate processing module; 52. a throttle instruction generation module; 53. and a throttle control module.
Detailed Description
The following description is merely exemplary in nature and is not intended to limit the present disclosure, application, or uses. It should be understood that throughout the drawings, the same or similar reference numerals indicate the same or similar parts and features. The drawings merely schematically illustrate the concepts and principles of embodiments of the disclosure and do not necessarily illustrate the specific dimensions and proportions of the various embodiments of the disclosure. Specific details or structures may be shown in exaggerated form in particular figures to illustrate related details or structures of embodiments of the present disclosure.
Referring to fig. 1-11:
the utility model provides an edge clamping type wafer gets and puts robotic arm of super vacuum environment operation, including base 1, base 1's output rotates and is connected with arm 2, arm 2 includes big arm and forearm that head and the tail rotated and is connected, base 1's output links to each other with big arm, be equipped with the mechanism 3 of taking on the forearm, the forearm is as the output of arm 2, the accessible is installed in its inside motor control rotation between big arm and the forearm, also be equipped with the motor that drives the mechanism 3 of taking in the forearm, guarantee arm 2 and the flexibility of mechanism 3 of taking, then be equipped with the rotatory motor of drive big arm and the structure that drives big arm and go up and down in the base 1, for example straight line slip table, realize that arm 2 carries the mechanism 3 of taking back and forth motion, this is known disclosed technology, not too much here.
Further, as shown in fig. 1, 2 and 5, the taking mechanism 3 includes a connecting seat 31, a finger arm 32, clamping fingers 33, a driving assembly 34 and a shunt tube bundle 35, the connecting seat 31 is rotationally connected with the small arm, the finger arm 32 is fixedly connected with the connecting seat 31, the clamping fingers 33 are fixed on the finger arm 32, the clamping fingers 33 are used for clamping and fixing a wafer, at least two clamping fingers 33 are provided, in this embodiment, three clamping fingers 33 are provided, and the three clamping fingers 33 are distributed in a triangle shape, so that the stability of clamping the wafer is ensured;
further, the clamping fingers 33 are powered by hydraulic pressure, the hydraulic power is provided by the driving assembly 34, the hydraulic power is distributed from the shunt tube bundles 35 into the plurality of clamping fingers 33, and the shunt tube bundles 35 and the driving assembly 34 are fixed on the finger arms 32;
specifically, as shown in fig. 3 and 6, the clamping finger 33 includes a fixing block 331, a side curved soft knuckle 332 and a clamping soft knuckle 333 that are fixedly connected in sequence, in this embodiment, the side curved soft knuckle 332 and the clamping soft knuckle 333 are made of rubber, and the clamping needs to utilize the deformable property of the rubber, and the fixing block 331 is made of metal or plastic, and is responsible for stable connection, and the fixing block 331 is fixed on the finger arm 32, and the side curved soft knuckle 332 is in a wave shape, and can deform to the side of the side curved soft knuckle 332, and when the contact point of the clamping soft knuckle 333 contacting the edge of the wafer is not in the middle of the clamping soft knuckle 333, the clamping soft knuckle 333 can incline to the side due to the continuous output of the clamping pressure, and the side of the side curved soft knuckle 332 can be deformed by extrusion at this moment, so as to realize automatic adjustment of the clamping angle, referring to fig. 10 and 11 of the description;
more specifically, the clamping finger 33 further includes a shrinkage cavity 334, an inner support sheet 335 and an air guide groove 336, the inner portion of the clamping soft knuckle 333 is hollow and is communicated with the air guide groove 336, when hydraulic pressure is applied to the clamping soft knuckle 333 through the air guide groove 336, the clamping soft knuckle 333 expands and deforms towards the center of the wafer, the clamping of the wafer is realized, the hydraulic pressure is lost, the resilience force of the rubber can enable the clamping soft knuckle 333 to recover, the inner support sheet 335 is embedded and fixed in the side bending soft knuckle 332, the inner support sheet 335 is used for supporting the side bending soft knuckle 332, and the shrinkage cavity 334 is formed in the side bending soft knuckle 332 to provide deformation shrinkage space for the side bending soft knuckle 332.
As shown in fig. 4 and fig. 5, the driving assembly 34 includes a hydraulic cylinder 341, an electric push rod 342 and a connecting block 343, the finger arm 32 is provided with a groove, the hydraulic cylinder 341 and the electric push rod 342 are both fixed in the groove, the output end of the hydraulic cylinder 341 is a piston, the output end of the electric push rod 342 is fixedly connected with the input end of the hydraulic cylinder 341 through the connecting block 343, and the connecting block 343 is driven by the electric push rod 342 to drive the piston to move in the hydraulic cylinder 341, so that hydraulic pressure can be provided for the shunt tube bundle 35;
as shown in fig. 5 and 2, the shunt tube bundle 35 includes a main flow tube 351, a first shunt tube 352 and a second shunt tube 353, where the first shunt tube 352, the second shunt tube 353 and the main flow tube 351 are all fixed on the finger arm 32, and the finger arm 32 is correspondingly provided with a through groove for placing the first shunt tube 352, the second shunt tube 353 and the main flow tube 351, so as to avoid increasing the thickness of the finger arm 32, two ends of the main flow tube 351 are respectively connected and fixed with an output end of the hydraulic cylinder 341 and the throttling assembly 36, two ends of the first shunt tube 352 are respectively connected and fixed with the throttling assembly 36 and the finger 33, and an inner cavity of the throttling assembly 36 is communicated with an inner cavity of the air guide groove 336 through the first shunt tube 352, the finger 33 connected through the first shunt tube 352 is located at an end of the finger arm 32, two ends of the second shunt tube 353 are respectively fixedly connected with the throttling assembly 36 and the finger 33, and the finger 33 connected through the second shunt tube 353 is located at a head end of the finger arm 32, referring to fig. 5;
it is noted that, when the hydraulic cylinder 341 applies pressure, the first shunt tube 352 and the second shunt tube 353 are filled with liquid, and the tube diameters and the inner diameters of the first shunt tube 352 and the second shunt tube 353 are the same, so as to reduce the influence of the length difference and the bending difference of the first shunt tube 352 and the second shunt tube 353 on the boosting rate of the clamping finger 33 at different positions.
As shown in fig. 5, 7 and 8, in order to better eliminate the influence of the pipe bending and the length on the boosting rate, the taking mechanism 3 further comprises a throttling component 36, wherein the throttling component 36 comprises a diversion box 361, a stepping motor 362, a driving gear 363, a driven gear 364 and a valve plate 365, the diversion box 361 is fixed on the finger 32, the ends of the main diversion pipe 351, the first diversion pipe 352 and the second diversion pipe 353 are all fixed on the diversion box 361, the hydraulic cylinder 341 is communicated with the inner cavity of the diversion box 361 through the main diversion pipe 351, the inner cavity of the diversion box 361 is respectively communicated with the finger 33 through the first diversion pipe 352 and the second diversion pipe 353, the hydraulic cylinder 341 provides hydraulic force into the diversion box 361 through the main diversion pipe 351, and then is diverted into the first diversion pipe 352 and the second diversion pipe 353;
the valve plate 365 is slidably connected with the diversion box 361, the valve plate 365 throttles a channel where the diversion box 361 is communicated with the second diversion pipe 353, the valve plate 365 is fixedly provided with an arc-shaped rack 3651, the arc-shaped rack 3651 is meshed with a driven gear 364, a stepping motor 362 is embedded and fixed on the diversion box 361, a driving gear 363 is fixed on the output end of the stepping motor 362, the driven gear 364 is rotationally connected with the diversion box 361, the driven gear 364 is meshed with the driving gear 363, the diameter of the driven gear 364 is larger than that of the driving gear 363, the arc-shaped rack 3651 is driven by the driven gear 364 instead of being directly driven, so that driving torque is larger, a spring (not shown) is arranged between the driven gear 364 and the diversion box 361 and used for providing elasticity for the driven gear 364 to increase rotation damping of the driven gear 364 and ensure stability when the driven gear 364 stops, and the center of the arc-shaped rack 3651 is concentric with the diversion box 361, so that the valve plate 365 can always cling to the diversion box 361.
As shown in fig. 6, in order to better control the pressure rising rate of the plurality of clamping fingers 33 to be average, a pressure sensor 4 is fixed in each clamping soft knuckle 333, and the pressure sensor 4 is used for acquiring the pressure value in the clamping soft knuckle 333, which is marked as，/>A value of 0 or more;
as shown in fig. 1 and 2, a throttle adjusting unit 5 is fixed to the connection base 31, and the throttle adjusting unit 5 includes:
the step-up rate processing module 51 obtains a step-up rate from the pressure value analysis;
a throttle command generation module 52 that determines whether to generate a throttle command based on the boost rate;
the throttle control module 53 controls the throttle assembly 36 to adjust and split according to the throttle command, the throttle control module 53 is a stepper motor driver, the stepper motor driver is an actuating mechanism for converting electric pulse into angular displacement, and the output end of the throttle control module 53 is electrically connected with the stepper motor 362 through a wire and is used for controlling the throttle control module 53 to work.
The boosting rate comprises a subarea boosting rate and a subarea boosting rate, and the subarea boosting rate are obtained by the following steps:
s1, recording the pressure value of each pressure sensor 4, and marking the pressure value as respectively、/>、/>.../>；
S2, obtaining time required for the pressure value to reach a preset pressure threshold value from 0, wherein the time is marked as t, and the preset pressure threshold value is determined by a person skilled in the art according to a large number of experiments, namely, the time is greater than or equal to the force required for clamping the wafer;
s3, according to the formulaObtain a boost rate, wherein->For the boost rate, the shorter the time required from 0 to the preset pressure threshold, the +.>The faster the corresponding finger 33 is boosted;
s4, dividing all the boosting rates, wherein the boosting rate obtained by taking the average value of the pressure values obtained by the pressure sensor 4 in the clamping finger 33 connected with the second shunt tube 353 is a divided boosting rate, the dividing boosting rate is marked as a, the boosting rate obtained by taking the average value of the pressure values obtained by the pressure sensor 4 in the clamping finger 33 connected with the first shunt tube 352 is a divided boosting rate, and the marks of b, a and b are all values which are larger than or equal to 0.
The throttle command generating module 52 compares the partition boosting rate with the partition boosting rate, and generates a throttle command when the comparison result is a > b or a < b, wherein the throttle command comprises a first throttle command and a second throttle command;
when the comparison result is a > b, a first throttling instruction is generated, the first throttling instruction controls the stepping motor 362 to rotate for one time through the throttling control module 53, the stepping motor 362 drives the driven gear 364 to rotate through the driving gear 363, and the driven gear 364 slides in the diversion box 361 through the arc-shaped rack 3651 with the valve plate 365, so that the caliber of a channel leading to the second diversion pipe 353 is reduced for one time;
generating a second throttling command when the comparison result is a < b, wherein the second throttling command controls the throttling assembly 36 to work reversely and singly through the throttling control module 53, namely, the caliber of a channel leading to the second shunt tube 353 is increased singly;
if the comparison result is a=b, no throttle command is generated.
It should be noted that, the smaller the number of single rotation cycles of the stepper motor 362 is, the smaller the effect on the aperture of the channel leading to the second shunt 353 is, whereas the larger the effect is, the adjusting operation of the throttle adjusting unit 5 may be performed when the wafer is not taken, the taking operation is not affected, in order to avoid the effect of small error on the comparison of a and b, the a and b may further take out the fuzzy threshold, the small error is determined as being within the fuzzy threshold, and no adjustment instruction is required to be generated, for example, when the adjustment instruction generated by the throttle instruction generating module 52 repeatedly jumps between the first throttle instruction and the second throttle instruction, the single rotation cycle of the stepper motor 362 cannot meet the adjustment precision, and if the single rotation cycle of the stepper motor 362 is already the single minimum rotation cycle of the stepper motor 362, the difference value corresponding to a and b can be used as the fuzzy threshold ± on a and b, and then be compared.
The exemplary implementation of the solution proposed by the present disclosure has been described in detail hereinabove with reference to the preferred embodiments, however, it will be understood by those skilled in the art that various modifications and adaptations can be made to the specific embodiments described above and that various combinations of the technical features, structures proposed by the present disclosure can be made without departing from the scope of the present disclosure, which is defined by the appended claims.
Claims (11)
1. The utility model provides a manipulator is got to edge grip formula wafer of super vacuum environment operation, includes base (1), the output of base (1) rotates and is connected with arm (2), its characterized in that, the output of arm (2) rotates and is connected with mechanism (3) of taking, mechanism (3) of taking include:
the connecting seat (31) is rotationally connected to the arm (2);
a finger arm (32) fixed on the connecting seat (31);
the clamping finger (33) is fixed on the finger arm (32), and the clamping finger (33) is used for clamping and fixing the wafer;
a driving assembly (34) fixed on the finger arm (32), wherein the driving assembly (34) is used for driving the clamping finger (33);
a shunt tube bundle (35), wherein the end parts of the shunt tube bundle (35) are respectively fixed with the clamping fingers (33) and the driving assembly (34), and the shunt tube bundle (35) is used for distributing and providing pressure to the clamping fingers (33);
a throttling assembly (36) fixed on the diverting tube bundle (35), the throttling assembly (36) being used for throttling the diverting tube bundle (35);
the edge of the wafer is clamped by the clamping fingers (33) to be taken, and the front and back surfaces of the wafer are not directly contacted.
2. The edge gripping wafer handling robot of claim 1, wherein the gripping fingers (33) comprise:
a fixed block (331), the fixed block (331) being fixed to the finger arm (32);
the side bending soft knuckle (332), the side bending soft knuckle (332) is fixedly connected with the fixed block (331), and the side bending soft knuckle (332) is used for adjusting the clamping angle;
and the clamping soft knuckle (333) is fixed on the side bending soft knuckle (332), and the clamping soft knuckle (333) is used for clamping a wafer.
3. The edge gripping wafer handling robot of claim 2, wherein the gripping fingers (33) further comprise:
the contraction cavity (334) is arranged in the side bending soft knuckle (332) and provides a deformation contraction space for the side bending soft knuckle (332);
the inner support piece (335), the inner support piece (335) is embedded and fixed in the side bending soft knuckle (332), and the inner support piece (335) is used for supporting in the side bending soft knuckle (332);
the air guide groove (336), the air guide groove (336) sequentially penetrates through the fixed block (331) to be communicated with the side bending soft knuckle (332) and the inner cavity for clamping the soft knuckle (333).
4. The edge-clamped wafer taking and placing mechanical arm for operation in the ultra-vacuum environment according to claim 3, wherein the driving assembly (34) comprises a hydraulic cylinder (341), an electric push rod (342) and a connecting block (343), the finger arm (32) is provided with a groove, the hydraulic cylinder (341) and the electric push rod (342) are both fixed in the groove, and the output end of the electric push rod (342) is fixedly connected with the input end of the hydraulic cylinder (341) through the connecting block (343).
5. An edge gripping wafer handling robot for ultra vacuum environment operation according to claim 4, wherein said shunt tube bundle (35) comprises:
the two ends of the main flow pipe (351) are respectively connected and fixed with the output end of the hydraulic cylinder (341) and the throttling component (36);
the two ends of the first shunt tube (352) are respectively connected and fixed with the throttling component (36) and the clamping finger (33), the inner cavity of the throttling component (36) is communicated with the inner cavity of the air guide groove (336) through the first shunt tube (352), and the clamping finger (33) connected through the first shunt tube (352) is positioned at the tail end of the finger arm (32);
the two ends of the second shunt tube (353) are fixedly connected with the throttling component (36) and the clamping finger (33) respectively, and the clamping finger (33) connected through the second shunt tube (353) is positioned at the head end of the finger arm (32);
the first shunt tube (352), the second shunt tube (353) and the main shunt tube (351) are all fixed on the finger arm (32).
6. The edge gripping wafer handling robot of claim 5, wherein the throttle assembly (36) comprises:
the shunt box (361), the shunt box (361) is fixed on the finger arm (32), the ends of the main shunt pipe (351), the first shunt pipe (352) and the second shunt pipe (353) are all fixed on the shunt box (361), the hydraulic cylinder (341) is communicated with the inner cavity of the shunt box (361) through the main shunt pipe (351), and the inner cavity of the shunt box (361) is communicated with the finger (33) through the first shunt pipe (352) and the second shunt pipe (353) respectively;
a stepping motor (362), wherein the stepping motor (362) is embedded and fixed on the shunt box (361);
a drive gear (363), the drive gear (363) being fixed to the output of the stepper motor (362);
a driven gear (364), wherein the driven gear (364) is rotationally connected with the diversion box (361), and the driven gear (364) is meshed with the driving gear (363);
valve block (365), valve block (365) and reposition of redundant personnel box (361) sliding connection, valve block (365) are used for restricting the passageway of reposition of redundant personnel box (361) and second reposition of redundant personnel pipe (353) intercommunication, be fixed with arc rack (3651) on valve block (365), just arc rack (3651) and driven gear (364) meshing.
7. The edge gripping type wafer picking and placing mechanical arm for ultra-vacuum environment operation according to claim 2, wherein a pressure sensor (4) is fixed in the gripping soft knuckle (333), the pressure sensor (4) is used for acquiring a pressure value, and is marked as，/>Is a value of 0 or more.
8. The edge gripping type wafer picking and placing mechanical arm for ultra-vacuum environment operation according to claim 7, wherein a throttle adjusting unit (5) is fixed on the connection base (31), and the throttle adjusting unit (5) comprises:
the boost rate processing module (51) is used for analyzing and acquiring the boost rate according to the pressure value;
a throttle instruction generation module (52) that determines whether to generate a throttle instruction according to the boost rate;
a throttle control module (53) controls the throttle assembly (36) to regulate the split according to the throttle command.
9. The edge gripping type wafer pick-and-place mechanical arm for operation in a super vacuum environment according to claim 8, wherein the step-up rate comprises a partition step-up rate and a partition step-up rate, and the step-up rate and the partition step-up rate are obtained by:
s1, recording the pressure value of each pressure sensor (4), and marking the pressure value as respectively、/>、/>.../>；
S2, acquiring time required by the pressure value from 0 to a preset pressure threshold value, and marking the time as t;
s3, according to the formulaObtain a boost rate, wherein->Is the boost rate;
s4, dividing all the boosting rates, wherein the boosting rate obtained by taking the average value of the pressure values obtained by the pressure sensor (4) in the clamping finger (33) connected with the second shunt tube (353) is a dividing boosting rate, the dividing boosting rate is marked as a, the boosting rate obtained by taking the average value of the pressure values obtained by the pressure sensor (4) in the clamping finger (33) connected with the first shunt tube (352) is a dividing boosting rate, and the marks of a and b are all values larger than or equal to 0.
10. The edge gripping type wafer pick-and-place robot arm for ultra-vacuum environment operation according to claim 9, wherein said throttle command generating module (52) compares a zone boost rate with a zone boost rate;
generating a throttling instruction when the comparison result is a > b or a < b;
if the comparison result is a=b, no throttle command is generated.
11. The edge gripping wafer handling robot of claim 10, wherein the throttle command comprises a first throttle command and a second throttle command;
when the comparison result is a > b, a first throttling instruction is generated, and the first throttling instruction controls the throttling assembly (36) to reduce the caliber of a channel leading to the second shunt pipe (353) through the throttling control module (53) for a single time;
and when the comparison result is a < b, generating a second throttling instruction, wherein the second throttling instruction controls the throttling assembly (36) to increase the caliber of a channel leading to the second shunt pipe (353) through the throttling control module (53) for a single time.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311702356.5A CN117381819B (en) | 2023-12-12 | 2023-12-12 | Edge clamping type wafer taking and placing mechanical arm for operation in ultra-vacuum environment |
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| CN202311702356.5A CN117381819B (en) | 2023-12-12 | 2023-12-12 | Edge clamping type wafer taking and placing mechanical arm for operation in ultra-vacuum environment |
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| US20020079714A1 (en) * | 2000-10-02 | 2002-06-27 | Soucy Alan J. | Apparatus and methods for handling semiconductor wafers |
| US20120141235A1 (en) * | 2010-11-10 | 2012-06-07 | Brooks Automation, Inc. | Dual arm robot |
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| CN117381819B (en) | 2024-02-23 |
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