CN117330048B - A modular integrated optical chip for fiber optic gyroscope - Google Patents
A modular integrated optical chip for fiber optic gyroscope Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/58—Turn-sensitive devices without moving masses
- G01C19/64—Gyrometers using the Sagnac effect, i.e. rotation-induced shifts between counter-rotating electromagnetic beams
- G01C19/72—Gyrometers using the Sagnac effect, i.e. rotation-induced shifts between counter-rotating electromagnetic beams with counter-rotating light beams in a passive ring, e.g. fibre laser gyrometers
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Abstract
本发明提供了一种光纤陀螺用模块化集成光学芯片，该集成光学芯片包括发光模块、探测模块、多功能集成模块和调制模块；发光模块包括隔离器、第一耦合器和光源芯片，探测模块包括探测芯片、第二耦合器和跨阻放大电路，多功能集成模块包括发光探测端耦合波导、调制端耦合波导、发光探测端分束/合束波导、转向波导、模式滤除波导、起偏/偏振波导和调制端分束/合束波导，调制模块包括传输波导和调制电极，传输波导为双直直通波导。与现有技术相比，本发明的技术方案能够解决现有技术中光纤陀螺光路为分立器件、体积过大、不能满足惯导系统小型化的技术问题。
The present invention provides a modular integrated optical chip for fiber optic gyroscope, the integrated optical chip includes a light emitting module, a detection module, a multifunctional integrated module and a modulation module; the light emitting module includes an isolator, a first coupler and a light source chip, the detection module includes a detection chip, a second coupler and a transimpedance amplifier circuit, the multifunctional integrated module includes a light emitting detection end coupling waveguide, a modulation end coupling waveguide, a light emitting detection end beam splitting/combining waveguide, a steering waveguide, a mode filtering waveguide, a polarizing/polarization waveguide and a modulation end beam splitting/combining waveguide, the modulation module includes a transmission waveguide and a modulation electrode, and the transmission waveguide is a double straight through waveguide. Compared with the prior art, the technical solution of the present invention can solve the technical problems in the prior art that the optical path of the fiber optic gyroscope is a discrete device, the volume is too large, and the inability to meet the miniaturization of the inertial navigation system.
Description
Technical Field
The invention relates to the technical field of fiber-optic gyroscopes, in particular to a modularized integrated optical chip for a fiber-optic gyroscope.
Background
The fiber optic gyroscope is a sensor of the angular velocity of a sensitive carrier based on the Sagnac (Sagnac) effect, has the advantages of no moving parts, quick starting time, wide precision coverage range and the like, and is widely focused and applied in the fields of aviation, aerospace, navigation, land precision navigation, weapon precision guidance, automatic control and the like. In order to better meet the development requirements of miniaturization and low cost of the inertial navigation system, the next generation of fiber optic gyroscopes are urgently required to be miniaturized. The light path volume occupies more than 70% of the volume of the fiber-optic gyroscope, which is a primary challenge for realizing miniaturization, and a technical scheme for exploring miniaturization of the light path is urgently needed.
The angular rate information of a certain dimension in the sensitive space of the single-axis fiber optic gyroscope is a typical architecture form of the fiber optic gyroscope. The traditional single-axis fiber-optic gyroscope light consists of 1 light source, 1 detector, 1 coupler, 1 multifunctional modulator and 1 fiber-optic loop. Each optical device is provided with an independent package, so that the volume and cost of the gyroscope are difficult to reduce. The optical fiber ring is a core sensitive component of the optical fiber gyro, and the volume is highly relevant to the precision. Therefore, light sources, detectors, couplers, and multifunctional modulators are the primary objectives for miniaturization of optical paths. On the premise of ensuring the functional and performance integrity of each device, the miniaturization of four discrete devices, which are further packaged in the same structure, is a primary challenge for the miniaturization of the optical path of the current optical fiber gyroscope.
Disclosure of Invention
The invention provides a modularized integrated optical chip for an optical fiber gyro, which can solve the technical problems that an optical path of the optical fiber gyro in the prior art is a discrete device, the volume is overlarge, and the miniaturization of an inertial navigation system cannot be satisfied.
According to one aspect of the invention, a modularized integrated optical chip for an optical fiber gyro is provided, wherein the integrated optical chip comprises a light emitting module A, a detection module B, a multifunctional integrated module C and a modulation module D, and the light emitting module A, the detection module B and the modulation module D are connected with the multifunctional integrated module C in a direct coupling mode;
The light-emitting module A comprises an isolator A1, a first coupler A2 and a light source chip A3, the detection module B comprises a detection chip B1, a second coupler B2 and a transimpedance amplifying circuit B3, the multifunctional integrated module C comprises a light-emitting detection end coupling waveguide C1, a modulation end coupling waveguide C2, a light-emitting detection end beam splitting/combining waveguide C3, a turning waveguide C4, a mode filtering waveguide C5, a polarization/polarization waveguide C6 and a modulation end beam splitting/combining waveguide C7, the modulation module D comprises a transmission waveguide D1 and a modulation electrode D2, and the transmission waveguide D1 is a double straight-through waveguide;
The light beam emitted by the light source chip A3 is shaped by a first coupler A2, the isolator A1 prevents the shaped light beam from counter-propagating, the counter-propagating light beam is received by a light emitting detection end coupling waveguide C1 and is split and turned by a turning waveguide C4 and a light emitting detection end splitting/splitting waveguide C3, then the light beam is split by a modulation end splitting/splitting waveguide C7 after passing through a mode filtering waveguide C5 and a polarizing/polarizing waveguide C6, then the split light beam is output to a transmission waveguide D1 through a turning waveguide C4 and a modulation end coupling waveguide C2, the split light beam enters an optical fiber ring for transmission after receiving phase modulation information of a modulation electrode D2 in the transmission process, the light beam returned by the optical fiber ring sequentially enters a multifunctional integrated module C through the modulation end coupling waveguide C2 and the transmission waveguide D1, and enters a detection module B after passing through the modulation end coupling waveguide C2, the turning waveguide C4, the modulation end splitting/splitting waveguide C5, the polarizing waveguide C6 and the light emitting detection end splitting/splitting waveguide C3, and further enters a demodulation module B2 in the transmission process, and the optical current signal is amplified by a second chip B1 to form a photo current signal after passing through a photo current signal amplifying circuit B3.
Further, the light emission detection end beam splitting/combining waveguide C3 is selected from one of a Y-branch waveguide, a multimode interference waveguide, an adiabatic coupling waveguide, and a directional coupling waveguide.
Further, the mode filtering waveguide C5 is selected from one of a straight-through waveguide, an S-bend waveguide, and a spiral curve waveguide.
Further, the polarizing/polarizing waveguide C6 is a straight waveguide or an S-bend waveguide.
Further, the substrate of the multifunctional integrated module C is selected from one of Si, LNOI, si xNy and SiO 2, and the substrate of the modulation module D is selected from LNOI or LN.
Further, the light source chip A3 adopts a super-radiation light-emitting diode, and the central wavelength of the super-radiation light-emitting diode is 850nm, 1310nm or 1550nm.
Further, the probe chip B1 and the transimpedance amplifier circuit B3 both adopt a PIN-FET component or a PIN-TIA component.
Further, the integrated optical chip further comprises a packaging structure, the packaging structure comprises a device substrate E1, a semiconductor bidirectional refrigerator E2, a heat sink E3, a transitional heat sink E4, a height cushion E5 and a thermistor E6, the semiconductor bidirectional refrigerator E2, the heat sink E3, the transitional heat sink E4 and the thermistor E6 are sequentially stacked on one side of the device substrate E1, the height cushion E5 is arranged on the other side of the device substrate E1, a light-emitting module A is arranged on the transitional heat sink E4, a detection module B, a multifunctional integrated module C and a modulation module D are arranged on the height cushion E5 to keep high consistency with the light-emitting module A, and the thermistor E6 is respectively connected with the semiconductor bidirectional refrigerator E2 and the light source chip A3 for current closed loop feedback.
Further, the light source chip A3 and the thermistor E6 are welded together through adding solder and the transition heat sink E4, the detection chip B1 is welded together through adding solder and the height pad E5, fixing seats are arranged on the transition heat sink E4 and the height pad E5, and the second coupler B2, the transimpedance amplifier circuit B3, the isolator A1 and the first coupler A2 are fixed on the fixing seats in a spot-gluing mode.
Further, the output tail fiber of the integrated optical chip is output through the nozzle so as to avoid breakage of the output tail fiber.
By means of the technical scheme, the modularized integrated optical chip for the optical fiber gyro is provided, the integrated optical chip is provided with four module chips of the light emitting module, the detection module, the mode regulation module and the phase modulation module, and the internal optical chips of the four modules are reasonably designed and laid out, so that the volume of a device can be greatly reduced on the premise of realizing the functions required by the single-axis optical fiber gyro, meanwhile, the modules do not need to be connected through optical fibers, the structure can be further simplified, the volume is reduced, the reliability is improved, in addition, the four modules on the chip are realized based on a photoetching technology, and the modules and the internal realization forms of the modules can be flexibly designed and laid out according to the requirements of the gyro and the modules, so that the modularized integrated optical chip has the advantages of being good in consistency, low in cost, flexible in layout and suitable for mass production.
Drawings
The accompanying drawings, which are included to provide a further understanding of embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. It is evident that the drawings in the following description are only some embodiments of the present invention and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 shows a schematic diagram (on the same side) of a modular integrated optical chip for a fiber-optic gyroscope according to an embodiment of the present invention;
FIG. 2 is a schematic diagram (on the opposite side) showing the composition and layout of a modular integrated optical chip for a fiber-optic gyroscope according to an embodiment of the present invention;
FIG. 3 illustrates a schematic package diagram of a modular integrated optical chip for a fiber-optic gyroscope provided in accordance with a specific embodiment of the present invention;
fig. 4 shows a schematic structural diagram of a modular integrated optical chip for a fiber-optic gyroscope according to a first embodiment of the present invention (the light-emitting detection end beam splitting/combining waveguide C3 is vertical, and the input and output sides are on the same side);
fig. 5 shows a schematic structural diagram of a modular integrated optical chip for a fiber-optic gyroscope according to a first embodiment of the present invention (the light-emitting detection end beam splitting/combining waveguide C3 is vertical, and the input and output sides are different);
fig. 6 shows a schematic structural diagram of a modular integrated optical chip for a fiber-optic gyroscope (the light-emitting detection end beam splitting/combining waveguide C3 is in a horizontal direction, and the input and output sides are on the same side) according to a second embodiment of the present invention;
Fig. 7 shows a schematic structural diagram of a modular integrated optical chip for a fiber-optic gyroscope (the light-emitting detection end beam splitting/combining waveguide C3 is in a horizontal direction, and the input and output sides are different) according to the second embodiment of the present invention;
fig. 8 shows a schematic structural diagram of a modular integrated optical chip for a fiber-optic gyroscope (the light-emitting detection end beam splitting/combining waveguide C3 is vertical, and the input and output are on the same side) according to the third embodiment of the present invention;
fig. 9 shows a schematic structural diagram of a modular integrated optical chip for a fiber-optic gyroscope (the light-emitting detection end beam splitting/combining waveguide C3 is vertical, and the input and output sides are different) according to the third embodiment of the present invention;
fig. 10 shows a schematic structural diagram of a modular integrated optical chip for a fiber-optic gyroscope (the light-emitting detection end beam splitting/combining waveguide C3 is in a horizontal direction, and the input and output sides are on the same side) according to a fourth embodiment of the present invention;
fig. 11 shows a schematic structural diagram of a modular integrated optical chip for a fiber-optic gyroscope (the light-emitting detection end beam splitting/combining waveguide C3 is in a horizontal direction, and the input and output sides are different) according to a fourth embodiment of the present invention;
Fig. 12 shows a schematic structural diagram of a modular integrated optical chip for a fiber-optic gyroscope (the light-emitting detection end beam splitting/combining waveguide C3 is vertical, and the input and output sides are on the same side) according to a fifth embodiment of the present invention;
fig. 13 shows a schematic structural diagram of a modular integrated optical chip for a fiber-optic gyroscope (the light-emitting detection end beam splitting/combining waveguide C3 is vertical, and the input and output sides are different) according to a fifth embodiment of the present invention;
Fig. 14 shows a schematic structural diagram of a modular integrated optical chip for a fiber-optic gyroscope (the light-emitting detection end beam splitting/combining waveguide C3 is in a horizontal direction, and the input and output sides are on the same side) according to a sixth embodiment of the present invention;
fig. 15 shows a schematic structural diagram of a modular integrated optical chip for a fiber-optic gyroscope (the light-emitting detection end beam splitting/combining waveguide C3 is in a horizontal direction, and the input and output sides are different) according to the sixth embodiment of the present invention.
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the application, its application, or uses. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
According to the modularized integrated optical chip for the fiber-optic gyroscope, the integrated optical chip comprises a light emitting module A, a detection module B, a multifunctional integrated module C and a modulation module D, wherein the light emitting module A, the detection module B and the modulation module D are connected with the multifunctional integrated module C in a direct coupling mode;
The light-emitting module A comprises an isolator A1, a first coupler A2 and a light source chip A3, the detection module B comprises a detection chip B1, a second coupler B2 and a transimpedance amplifying circuit B3, the multifunctional integrated module C comprises a light-emitting detection end coupling waveguide C1, a modulation end coupling waveguide C2, a light-emitting detection end beam splitting/combining waveguide C3, a turning waveguide C4, a mode filtering waveguide C5, a polarization/polarization waveguide C6 and a modulation end beam splitting/combining waveguide C7, the modulation module D comprises a transmission waveguide D1 and a modulation electrode D2, and the transmission waveguide D1 is a double straight-through waveguide;
The light beam emitted by the light source chip A3 is shaped by a first coupler A2, the isolator A1 prevents the shaped light beam from counter-propagating, the counter-propagating light beam is received by a light emitting detection end coupling waveguide C1 and is split and turned by a turning waveguide C4 and a light emitting detection end splitting/splitting waveguide C3, then the light beam is split by a modulation end splitting/splitting waveguide C7 after passing through a mode filtering waveguide C5 and a polarizing/polarizing waveguide C6, then the split light beam is output to a transmission waveguide D1 through a turning waveguide C4 and a modulation end coupling waveguide C2, the split light beam enters an optical fiber ring for transmission after receiving phase modulation information of a modulation electrode D2 in the transmission process, the light beam returned by the optical fiber ring sequentially enters a multifunctional integrated module C through the modulation end coupling waveguide C2 and the transmission waveguide D1, and enters a detection module B after passing through the modulation end coupling waveguide C2, the turning waveguide C4, the modulation end splitting/splitting waveguide C5, the polarizing waveguide C6 and the light emitting detection end splitting/splitting waveguide C3, and further enters a demodulation module B2 in the transmission process, and the optical current signal is amplified by a second chip B1 to form a photo current signal after passing through a photo current signal amplifying circuit B3.
The light beam emitted by the light source chip A3 is a low-bias incoherent light beam, the mode filtering waveguide C5 and the polarizing/polarizing waveguide C6 are used for filtering a non-transmission mode, two paths of light waves formed by beam splitting are carried with interference information after passing through the optical fiber ring and return to the modulation module D, and the light waves enter the multifunctional integration module C and the detection module B in sequence after being modulated, are received by the detection chip B1, and are amplified and recorded.
Through the configuration mode, the modularized integrated optical chip for the fiber-optic gyroscope is provided, the integrated optical chip is provided with four module chips of a light emitting module, a detection module, a mode regulation module and a phase modulation module, internal optical devices of the four modules are reasonably designed and laid out, the volume of the devices can be greatly reduced on the premise of realizing the required functions of the single-axis fiber-optic gyroscope, meanwhile, the modules do not need to be connected through optical fibers, the fiber-free formation can be realized, the structure is further simplified, the volume is reduced, the reliability is improved, in addition, the four modules on the chip are realized based on a photoetching technology, and the modules and the internal realization forms of the modules can be flexibly designed and laid out according to the requirements of the gyroscope and the modules, so that the modularized integrated optical chip has the advantages of being good in consistency, low in cost, flexible in layout and suitable for mass production. Compared with the prior art, the technical scheme of the invention can solve the technical problems that the optical path of the fiber-optic gyroscope in the prior art is a discrete device, the volume is overlarge, and the miniaturization of an inertial navigation system cannot be satisfied.
That is, the optical fiber gyro of the invention is realized based on the modular idea by combining the advantages of different devices and integrating a plurality of devices and modules into a whole in a hybrid integration mode. The fiber optic gyroscope has the functions of light emission, detection, polarization, beam splitting/combining and phase modulation, so that the full integration of all optical devices except the fiber optic ring of the fiber optic gyroscope is realized. The light-emitting module A comprises a light source chip, an isolator, a coupler and the like, and has the functions of light emission, isolation and the like; the detection module B comprises a detection chip, a coupler, a transimpedance amplifying circuit and the like, and has the functions of light detection receiving, amplifying, current conversion and the like; the multifunctional integrated module C comprises a coupling waveguide, a beam splitting/combining waveguide, a turning waveguide, a mode filtering waveguide, a polarization/polarization waveguide and the like, and has the functions of coupling input/output, beam splitting/combining, mode filtering and polarization/polarization; the modulation module D comprises a double-direct-current waveguide with polarization/polarization functions, a modulation electrode and the like, and has the functions of polarization/polarization, phase modulation and the like.
In the embodiment of the invention, the light-emitting detection end beam splitting/combining waveguide C3 is realized based on a beam splitting waveguide and is selected from one of a Y-branch waveguide, a multimode interference waveguide, an adiabatic coupling waveguide and a directional coupling waveguide. The mode filtering waveguide and the polarization/polarization waveguide can be respectively arranged in the multifunctional integrated module C, and the mode filtering function and the polarization/polarization function can be simultaneously realized by using one waveguide, for example, the mode filtering waveguide with the polarization/polarization function can be selected, so that a special polarization/polarization waveguide can be omitted. As a specific embodiment of the present invention, the mode filtering waveguide C5 is selected from one of a straight-through waveguide, an S-bend waveguide, and a spiral curve waveguide, and the polarizing/polarizing waveguide C6 is a straight-through waveguide or an S-bend waveguide. In addition, in the embodiment of the present invention, the light source chip A3 adopts a super-luminescent diode (SLD) with a center wavelength of 850nm, 1310nm or 1550nm. The detection chip B1 and the transimpedance amplifier circuit B3 both adopt a PIN-FET component or a PIN-TIA component. The modulation module D can be realized by selecting a mature multifunctional integrated phase Modulator (MIOC) in the traditional optical path scheme of the fiber-optic gyroscope, and can greatly improve the maturity, reliability and realizability of an integrated optical chip.
Further, as shown in fig. 3, in the embodiment of the present invention, the integrated optical chip further includes a package structure, where the package structure includes a device substrate E1, a semiconductor bidirectional refrigerator E2, a heat sink E3, a transition heat sink E4, a height pad E5, and a thermistor E6, where the semiconductor bidirectional refrigerator E2, the heat sink E3, the transition heat sink E4, and the thermistor E6 are sequentially stacked on one side of the device substrate E1, the height pad E5 is disposed on the other side of the device substrate E1, the light emitting module a is disposed on the transition heat sink E4, and the detection module B, the multifunctional integrated module C, and the modulation module D are respectively connected to the semiconductor bidirectional refrigerator E2 and the light source chip A3 by being disposed on the height pad E5 so as to maintain a high consistency with the light emitting module a, for current closed loop feedback. The semiconductor bidirectional refrigerator E2 is a structural part for connecting the heat sink E3 and the substrate E1, and can realize temperature control on the light source chip A3 by adjusting the voltage of the bidirectional refrigerator according to the information fed back by the thermistor E6, and the structure can be omitted according to different wavelengths of the light source chip A3. As a specific embodiment of the present invention, the transitional heat sink E4 is made of a ceramic material, which is directly in contact with the light emitting module a, and carries the functions of fixing the light source chip A3 and directionally conducting the heat of the light source, and the structure can be omitted according to the wavelength of the light source chip. In addition, as a specific embodiment of the present invention, the detection chip B1 and the second coupler B2 in the detection module B are directly disposed on the height pad E5, and the transimpedance amplifier circuit B3 is disposed on the detection chip B1 and the second coupler B2.
Based on the above embodiment, the modularized integrated optical chip for the fiber-optic gyroscope has flexible layout characteristics, and can flexibly layout the module position, the waveguide structure inside the module and the output form according to the gyroscope requirement and the requirement of a single module. For example, as shown in fig. 1, the light emitting module a, the detecting module B and the modulating module D are all located on the same side of the multifunctional integrated module C; as shown in fig. 2, the light emitting module a and the detecting module B are located at one side of the mode adjusting module D, and the modulating module D is located at the other side of the multifunctional integrated module C.
Further, in the embodiment of the present invention, the substrate of the multifunctional integrated module C is selected from one of Si, LNOI, si xNy and SiO 2, and the substrate of the modulation module D is selected from LNOI or LN. In addition, during packaging, the light source chip A3 and the thermistor E6 are welded together through the addition of solder and the transition heat sink E4, the detection chip B1 is welded together through the addition of solder and the height pad E5, fixing seats are arranged on the transition heat sink E4 and the height pad E5, and the second coupler B2, the transimpedance amplifier circuit B3, the isolator A1 and the first coupler A2 are fixed on the fixing seats in a spot-gluing mode. The whole modularized integrated optical chip, namely the whole chip is realized based on a photoetching process, and has the advantages of large batch, good consistency and low cost.
In addition, in order to protect the output tail fiber of the chip, in the embodiment of the invention, the output tail fiber of the integrated optical chip is output through the nozzle so as to avoid breakage of the output tail fiber.
That is, the modularized integrated optical chip for the fiber-optic gyroscope has a packaging form of two-dimensional and three-dimensional combined multilayer packaging form, the outside of the device is a metal packaging, and the inside of the device is composed of three layers. The first layer is an optical device in four modules; the second layer comprises a transitional heat sink, a refrigerator, a fixed seat, a fixed structure and the like; the third layer is a substrate layer, i.e., a base. The device surrounds the metal tube shell and is provided with pins, nozzles (tail tubes), tail fibers and the like. The first layer is a main body layer for realizing the function of the device; the second layer is a structural layer for ensuring the normal operation of the device; the third layer is a structure layer which outputs and fixes the outside. The components in the second layer may be omitted depending on the wavelength at which the light emitting chip is operated.
For a better understanding of the modular integrated optical chip for fiber optic gyroscopes according to the present invention, the structure thereof will be further described with reference to the specific embodiments of fig. 4 to 15.
Embodiment one:
According to one embodiment of the invention, the integrated optical chip comprises a light emitting module a, a detection module B, a multifunctional integrated module C and a modulation module D. The light emitting module a includes an isolator A1, a first coupler A2, and a light source chip A3. The detection module B comprises a detection chip B1, a second coupler B2 and a transimpedance amplifier circuit B3. The multifunctional integrated module C comprises a light emitting detection end coupling waveguide C1, a modulation end coupling waveguide C2, a light emitting detection end beam splitting/combining waveguide C3, a turning waveguide C4, a mode filtering waveguide C5, a polarization/polarization waveguide C6 and a modulation end beam splitting/combining waveguide C7, wherein the turning waveguide C4 is a bending waveguide, and the mode filtering waveguide C5 and the polarization/polarization waveguide C6 are both realized by straight-through waveguides. The modulation module D includes a transmission waveguide D1 and a modulation electrode D2. The light emitting detection end beam splitting/combining waveguide C3 is realized based on a beam splitting waveguide, and forms include, but are not limited to, a Y-branch waveguide, a multimode interference (MMI) waveguide, an adiabatic coupling waveguide and a directional coupling waveguide, wherein the transmission waveguide D1 is a double-straight-through waveguide, and the modulation electrode D2 is a push-pull electrode. The detection module B is a PIN-FET component or a PIN-TIA component. The straight-through waveguide has two realization modes, the first is a common mode, and the first is composed of straight-through waveguides only and has a transmission effect; the second is a polarization mode, which is formed by a specific waveguide and has polarization effect. The direction of the light-emitting detection end beam splitting/combining waveguide C3 is the vertical direction. On the chip layout, the output directions of the light emitting detection end beam splitting/combining waveguide C3 near one end of the light emitting detection end coupling waveguide C1 may be two horizontal directions, namely, a CR side and a CL side. Accordingly, the placement positions and the internal arrangements of the light emitting module a and the detecting module B are changed, that is, two layouts as shown in fig. 4 and 5 are generated.
The light-emitting module A, the detection module B and the modulation module D are connected with the multifunctional integrated module C by adopting a direct coupling technology. The transimpedance amplifying circuit B3 (namely, a rectangular dotted line in the figure) in the detection module B is arranged above the multifunctional integrated module C, is preferentially arranged at a position close to the detection module B, and is connected in a gluing and curing mode. B3 and B1 are connected by a pin gold wire lead.
Embodiment two:
This embodiment has the same constituent structure and function as embodiment one, and only the layout is different. Specifically, the integrated optical chip comprises a light emitting module A, a detection module B, a multifunctional integrated module C and a modulation module D. The light emitting module a includes an isolator A1, a coupler A2, and a light source chip A3. The detection module B comprises a detection chip B1, a first coupler B2 and a transimpedance amplifier circuit B3. The multifunctional integrated module C comprises a light emitting detection end coupling waveguide C1, a modulation end coupling waveguide C2, a light emitting detection end beam splitting/combining waveguide C3, a turning waveguide C4, a mode filtering waveguide C5, a polarization/polarization waveguide C6 and a modulation end beam splitting/combining waveguide C7, wherein the turning waveguide C4 is a bending waveguide, and the mode filtering waveguide C5 and the polarization/polarization waveguide C6 are both realized by straight-through waveguides. The modulation module D includes a transmission waveguide D1 and a modulation electrode D2. The light emitting detection end beam splitting/combining waveguide C3 is realized based on a beam splitting waveguide, and forms include, but are not limited to, a Y-branch waveguide, a multimode interference (MMI) waveguide, an adiabatic coupling waveguide and a directional coupling waveguide, wherein the transmission waveguide D1 is a double-straight-through waveguide, and the modulation electrode D2 is a push-pull electrode. The detection module B is a PIN-FET component or a PIN-TIA component.
The light emission detection end beam splitting/combining waveguide C3 is different from the C3 layout in the first embodiment, the beam splitting waveguide appears in the horizontal direction, and the bending wave is derived between the two beam splitting waveguides. The straight-through waveguide has two realization modes, the first is a common mode, and the first is composed of straight-through waveguides only and has a transmission effect; the second is a polarization mode, which is formed by a specific waveguide and has polarization effect. The output direction of the beam splitting/combining waveguide C3 near one end of the light emitting detection end coupling waveguide C1 may be two directions horizontally, i.e., CR side and CL side. Accordingly, the placement positions and the internal arrangements of the light emitting module a and the detecting module B are changed, that is, two layouts as shown in fig. 6 and 7 are generated.
The light-emitting module A, the detection module B and the modulation module D are connected with the multifunctional integrated module C by adopting a direct coupling technology. The transimpedance amplifying circuit B3 (namely, a rectangular dotted line in the figure) in the detection module B is arranged above the multifunctional integrated module C, is preferentially arranged at a position close to the detection module B, and is connected in a gluing and curing mode. B3 and B1 are connected by a pin gold wire lead.
Embodiment III:
On the basis of the first embodiment and the second embodiment, in order to further improve the performance of the integrated optical chip, the multifunctional integrated module C is optimized and upgraded. According to one embodiment of the invention, the integrated optical chip comprises a light emitting module a, a detection module B, a multifunctional integrated module C and a modulation module D. The light emitting module a includes an isolator A1, a first coupler A2, and a light source chip A3. The detection module B comprises a detection chip B1, a second coupler B2 and a transimpedance amplifier circuit B3. The multifunctional integrated module C comprises a light emitting detection end coupling waveguide C1, a modulation end coupling waveguide C2, a light emitting detection end beam splitting/combining waveguide C3, a turning waveguide C4, a mode filtering waveguide C5, a polarizing/polarizing waveguide C6 and a modulation end beam splitting/combining waveguide C7, wherein the turning waveguide C4 is a bending waveguide. The modulation module D includes a transmission waveguide D1 and a modulation electrode D2.
The light emitting detection end beam splitting/combining waveguide C3 is implemented based on a beam splitting waveguide, and forms include, but are not limited to, a Y-branch waveguide, a multimode interference (MMI) waveguide, an adiabatic coupling waveguide, and a directional coupling waveguide, the transmission waveguide D1 is a dual-direct-through waveguide, in this embodiment, the light emitting detection end beam splitting/combining waveguide C3 is implemented by a beam splitting waveguide in a vertical direction, the transmission waveguide D1 is a dual-direct-through waveguide, and the modulation electrode D2 is a push-pull electrode. The detection module B is a PIN-FET component or a PIN-TIA component.
The mode filtering waveguide C5 is implemented by an S-bend waveguide, and can implement an attenuation function for a specific mode. The polarization/polarization waveguide C6 may be implemented by the S-bend waveguide described above, or may be implemented by S-bends of different parameters or other waveguides having polarization/polarization functions, i.e., C5/C6 may be implemented by the same type of waveguide, or may be implemented by different types of waveguides. The output direction of the luminescence detection end beam splitting/combining waveguide C3 near one end of the luminescence detection end coupling waveguide C1 may be two horizontal directions, i.e., CR side and CL side. Accordingly, the placement positions and the internal arrangement of the light emitting module a and the detecting module B are changed, that is, two layouts as shown in fig. 8 and 9 are generated.
The light-emitting module A, the detection module B and the modulation module D are connected with the multifunctional integrated module C by adopting a direct coupling technology. The transimpedance amplifying circuit B3 (namely, a rectangular dotted line in the figure) in the detection module B is arranged above the multifunctional integrated module C, is preferentially arranged at a position close to the detection module B, and is connected in a gluing and curing mode. B3 and B1 are connected by a pin gold wire lead.
It should be noted that the number of S bends and specific parameters cannot be used as a criterion audit item in distinction from the present invention. The specific implementation of the polarizing/polarizing waveguide cannot be used as a matter of audit of criteria different from the present invention.
Embodiment four:
This embodiment has the same structure and function as the third embodiment, and only the layout is different.
According to one embodiment of the invention, the integrated optical chip comprises a light emitting module a, a detection module B, a multifunctional integrated module C and a modulation module D. The light emitting module a includes an isolator A1, a first coupler A2, and a light source chip A3. The detection module B comprises a detection chip B1, a second coupler B2 and a transimpedance amplifier circuit B3. The multifunctional integrated module C comprises a light emitting detection end coupling waveguide C1, a modulation end coupling waveguide C2, a light emitting detection end beam splitting/combining waveguide C3, a turning waveguide C4, a mode filtering waveguide C5, a polarizing/polarizing waveguide C6 and a modulation end beam splitting/combining waveguide C7, wherein the turning waveguide C4 is a bending waveguide. The modulation module D includes a transmission waveguide D1 and a modulation electrode D2.
The light emitting detection end beam splitting/combining waveguide C3 is realized based on a beam splitting waveguide, and forms include, but are not limited to, a Y-branch waveguide, a multimode interference (MMI) waveguide, an adiabatic coupling waveguide and a directional coupling waveguide, wherein the transmission waveguide D1 is a double-straight-through waveguide, and the modulation electrode D2 is a push-pull electrode. The detection module B is a PIN-FET component or a PIN-TIA component.
The mode filtering waveguide C5 is implemented by an S-bend waveguide, and can implement an attenuation function for a specific mode. The polarization/polarization waveguide C6 may be implemented by the S-bend waveguide described above, or may be implemented by S-bends of different parameters or other waveguides having polarization/polarization functions, i.e., C5/C6 may be implemented by the same type of waveguide, or may be implemented by different types of waveguides. The light emission detection end beam splitting/combining waveguide C3 is different from the C3 layout in the third embodiment in that the beam splitting waveguide appears in the horizontal direction. The output direction of the luminescence detection end beam splitting/combining waveguide C3 near one end of the luminescence detection end coupling waveguide C1 may be two horizontal directions, i.e., CR side and CL side. Accordingly, the placement positions and the internal arrangement of the light emitting module a and the detecting module B are changed, that is, two layouts as shown in fig. 10 and 11 are generated.
The light-emitting module A, the detection module B and the modulation module D are connected with the multifunctional integrated module C by adopting a direct coupling technology. The transimpedance amplifying circuit B3 (namely, a rectangular dotted line in the figure) in the detection module B is arranged above the multifunctional integrated module C, is preferentially arranged at a position close to the detection module B, and is connected in a gluing and curing mode. B3 and B1 are connected by a pin gold wire lead.
It should be noted that the number of S bends and specific parameters cannot be used as a criterion audit item in distinction from the present invention. The specific implementation of the polarizing/polarizing waveguide cannot be used as a matter of audit of criteria different from the present invention.
Fifth embodiment:
On the basis of the first embodiment and the second embodiment, in order to further improve the performance of the integrated optical chip, the multifunctional integrated module C is optimized and upgraded. According to one embodiment of the invention, the integrated optical chip comprises a light emitting module a, a detection module B, a multifunctional integrated module C and a modulation module D. The light emitting module a includes an isolator A1, a first coupler A2, and a light source chip A3. The detection module B comprises a detection chip B1, a second coupler B2 and a transimpedance amplifier circuit B3. The multifunctional integrated module C comprises a light emitting detection end coupling waveguide C1, a modulation end coupling waveguide C2, a light emitting detection end beam splitting/combining waveguide C3, a turning waveguide C4, a mode filtering waveguide C5, a polarizing/polarizing waveguide C6 and a modulation end beam splitting/combining waveguide C7, wherein the turning waveguide C4 is a bending waveguide. The modulation module D includes a transmission waveguide D1 and a modulation electrode D2.
The light emitting detection end beam splitting/combining waveguide C3 is realized based on a beam splitting waveguide, and forms include, but are not limited to, a Y-branch waveguide, a multimode interference (MMI) waveguide, an adiabatic coupling waveguide and a directional coupling waveguide, wherein the transmission waveguide D1 is a double-straight-through waveguide, and the modulation electrode D2 is a push-pull electrode. The detection module B is a PIN-FET component or a PIN-TIA component.
The mode filtering waveguide C5 is realized by a spiral curve waveguide, and can realize the attenuation function of a specific mode. The polarization/polarization waveguide C6 may be implemented by S-bend with different parameters or other waveguides with polarization/polarization functions, and in this embodiment, C6 may be increased or decreased according to actual requirements. The output direction of the luminescence detection end beam splitting/combining waveguide C3 near one end of the luminescence detection end coupling waveguide C1 may be two horizontal directions, i.e., CR side and CL side. Accordingly, the placement positions and the internal arrangement of the light emitting module a and the detecting module B are changed, that is, two layouts as shown in fig. 12 and 13 are generated.
The light-emitting module A, the detection module B and the modulation module D are connected with the multifunctional integrated module C by adopting a direct coupling technology. The transimpedance amplifying circuit B3 (namely, a rectangular dotted line in the figure) in the detection module B is arranged above the multifunctional integrated module C, is preferentially arranged at a position close to the detection module B, and is connected in a gluing and curing mode. B3 and B1 are connected by a pin gold wire lead.
It should be noted that the number of turns and length of the spiral curve cannot be used as a criterion audit item different from the present application. The specific implementation of the polarizing/polarizing waveguide cannot be used as a matter of audit of criteria different from the present application.
Example six:
This embodiment has the same structure and function as embodiment five, with only the layout differences. According to one embodiment of the invention, the integrated optical chip comprises a light emitting module a, a detection module B, a multifunctional integrated module C and a modulation module D. The light emitting module a includes an isolator A1, a first coupler A2, and a light source chip A3. The detection module B comprises a detection chip B1, a second coupler B2 and a transimpedance amplifier circuit B3. The multifunctional integrated module C comprises a light emitting detection end coupling waveguide C1, a modulation end coupling waveguide C2, a light emitting detection end beam splitting/combining waveguide C3, a turning waveguide C4, a mode filtering waveguide C5, a polarizing/polarizing waveguide C6 and a modulation end beam splitting/combining waveguide C7, wherein the turning waveguide C4 is a bending waveguide. The modulation module D includes a transmission waveguide D1 and a modulation electrode D2.
The light emitting detection end beam splitting/combining waveguide C3 is realized based on a beam splitting waveguide, and forms include, but are not limited to, a Y-branch waveguide, a multimode interference (MMI) waveguide, an adiabatic coupling waveguide and a directional coupling waveguide, wherein the transmission waveguide D1 is a double-straight-through waveguide, and the modulation electrode D2 is a push-pull electrode. The detection module B is a PIN-FET component or a PIN-TIA component.
The mode filtering waveguide C5 is realized by a spiral curve waveguide, and can realize the attenuation function of a specific mode. The polarization/polarization waveguide C6 may be implemented by S-bend with different parameters or other waveguides with polarization/polarization functions, and in this embodiment, C6 may be increased or decreased according to actual requirements. The light-emitting detection end beam splitting/combining waveguide C3 is different from the C3 layout in the fifth embodiment, the beam splitting waveguide appears in the horizontal direction, and the bending wave is derived between the two beam splitting waveguides. The output direction of the luminescence detection end beam splitting/combining waveguide C3 near one end of the luminescence detection end coupling waveguide C1 may be two horizontal directions, i.e., CR side and CL side. Accordingly, the placement positions and the internal arrangement of the light emitting module a and the detecting module B are changed, that is, two layouts as shown in fig. 14 and 15 are generated.
The light-emitting module A, the detection module B and the modulation module D are connected with the multifunctional integrated module C by adopting a direct coupling technology. The transimpedance amplifying circuit B3 (namely, a rectangular dotted line in the figure) in the detection module B is arranged above the multifunctional integrated module C, is preferentially arranged at a position close to the detection module B, and is connected in a gluing and curing mode.
It should be noted that the number of turns and length of the spiral curve cannot be used as a criterion audit item different from the present application. The specific implementation of the polarizing/polarizing waveguide cannot be used as a matter of audit of criteria different from the present application.
In summary, the invention provides a modularized integrated optical chip for an optical fiber gyro, which is provided with four module chips of a light emitting module, a detection module, a mode regulation module and a phase modulation module, and reasonably designs and lays out internal optical devices of the four modules, so that the volume of the device can be greatly reduced on the premise of realizing the required functions of a single-axis optical fiber gyro, meanwhile, the modules do not need to be connected through optical fibers, the structure can be further simplified, the volume is reduced, the reliability is improved, in addition, the four modules on the chip are realized based on a photoetching technology, and the modules and the internal realization forms of the modules can be flexibly designed and laid out according to the requirements of the gyro and the modules, so that the modularized integrated optical chip has the advantages of good consistency, low cost, flexible layout and suitability for mass production. Compared with the prior art, the technical scheme of the invention can solve the technical problems that the optical path of the fiber-optic gyroscope in the prior art is a discrete device, the volume is overlarge, and the miniaturization of an inertial navigation system cannot be satisfied.
In the description of the present invention, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present invention; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "upper surface on … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present invention.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The modularized integrated optical chip for the fiber-optic gyroscope is characterized by comprising a light emitting module (A), a detection module (B), a multifunctional integrated module (C) and a modulation module (D), wherein the light emitting module (A), the detection module (B) and the modulation module (D) are connected with the multifunctional integrated module (C) in a direct coupling mode;
The light emitting module (A) comprises an isolator (A1), a first coupler (A2) and a light source chip (A3), the detection module (B) comprises a detection chip (B1), a second coupler (B2) and a transimpedance amplifying circuit (B3), the multifunctional integrated module (C) comprises a light emitting detection end coupling waveguide (C1), a modulation end coupling waveguide (C2), a light emitting detection end beam splitting/combining waveguide (C3), a turning waveguide (C4), a mode filtering waveguide (C5), a polarization/polarization waveguide (C6) and a modulation end beam splitting/combining waveguide (C7), the modulation module (D) comprises a transmission waveguide (D1) and a modulation electrode (D2), and the transmission waveguide (D1) is a double-straight through waveguide;
The light beam emitted by the light source chip (A3) is shaped by the first coupler (A2), the isolator (A1) prevents the shaped light beam from back propagation, the back propagation light beam is received by the light emitting detection end coupling waveguide (C1) and is combined and turned by the turning waveguide (C4) and the light emitting detection end beam splitting/combining waveguide (C3), then the light beam is split by the modulation end beam splitting/combining waveguide (C7) after passing through the mode filtering waveguide (C5) and the polarizing/polarizing waveguide (C6), then the light beam is output to the transmission waveguide (D1) by the turning waveguide (C4) and the modulation end coupling waveguide (C2), the split light beam enters into an optical fiber for transmission after receiving phase modulation information of the modulation electrode (D2) in the transmission process, the light beam returned by an optical fiber loop enters into the multifunctional integrated module (C) after passing through the modulation electrode (D2) and the transmission waveguide (C1), the light beam enters into the multi-functional integrated module (C) after passing through the modulation end coupling waveguide (C4) and the polarization beam splitting/combining waveguide (C6), the light emitting detection end beam enters the polarization beam splitting/combining waveguide (C5) in turn after passing through the modulation end coupling waveguide (C2), and the photoelectric current signal is further received by the detection chip (B1) through the second coupler (B2) and is converted into a voltage signal through the transimpedance amplifying circuit (B3) to be subjected to gyro signal demodulation.
2. The integrated optical chip of claim 1, wherein the luminescence detection end beam splitting/combining waveguide (C3) is selected from one of a Y-branched waveguide, a multimode interference waveguide, an adiabatic coupling waveguide, and a directional coupling waveguide.
3. The integrated optical chip of claim 2, wherein the mode filtering waveguide (C5) is selected from one of a straight-through waveguide, an S-bend waveguide, and a spiral curve waveguide.
4. An integrated optical chip according to claim 2, characterized in that the polarizing/polarizing waveguide (C6) is a straight-through waveguide or an S-curved waveguide.
5. The integrated optical chip of claim 4, wherein the substrate of the multifunctional integrated module (C) is selected from one of Si, LNOI, si xNy and SiO 2 and the substrate of the modulation module (D) is selected from LNOI or LN.
6. The integrated optical chip according to claim 5, wherein the light source chip (A3) employs a super luminescent diode having a center wavelength of 850nm, 1310nm or 1550nm.
7. The integrated optical chip of claim 6, wherein the probe chip (B1) and the transimpedance amplifier circuit (B3) each employ a PIN-FET component or a PIN-TIA component.
8. The integrated optical chip of claim 6, further comprising a package structure including a device substrate (E1), a semiconductor bi-directional refrigerator (E2), a heat sink (E3), a transition heat sink (E4), a height pad (E5) and a thermistor (E6), wherein the semiconductor bi-directional refrigerator (E2), the heat sink (E3), the transition heat sink (E4) and the thermistor (E6) are stacked in sequence on one side of the device substrate (E1), the height pad (E5) is disposed on the other side of the device substrate (E1), the light emitting module (a) is disposed on the transition heat sink (E4), the detection module (B), the multi-functional integrated module (C) and the modulation module (D) are configured to maintain a high degree of agreement with the light emitting module (a) by being disposed on the height pad (E5), and the thermistor (E6) is connected with the semiconductor bi-directional refrigerator (E2) and the light source (a) for current feedback.
9. The integrated optical chip according to claim 8, wherein the light source chip (A3) and the thermistor (E6) are welded together with the transition heat sink (E4) by adding solder, the probe chip (B1) is welded together with the height pad (E5) by adding solder, fixing bases are provided on the transition heat sink (E4) and the height pad (E5), and the second coupler (B2), the transimpedance amplifier circuit (B3), the isolator (A1) and the first coupler (A2) are fixed on the fixing bases by spot-gluing.
10. The integrated optical chip of claim 9, wherein the output pigtail of the integrated optical chip is output through a nozzle to avoid breakage of the output pigtail.
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