CN117316899B - A cooling plate - Google Patents
A cooling plate Download PDFInfo
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- CN117316899B CN117316899B CN202311377917.9A CN202311377917A CN117316899B CN 117316899 B CN117316899 B CN 117316899B CN 202311377917 A CN202311377917 A CN 202311377917A CN 117316899 B CN117316899 B CN 117316899B
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- substrate
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- liquid outlet
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- 238000001816 cooling Methods 0.000 title claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 154
- 239000007788 liquid Substances 0.000 claims abstract description 140
- 239000000110 cooling liquid Substances 0.000 claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 239000002826 coolant Substances 0.000 claims description 3
- 238000011109 contamination Methods 0.000 abstract 1
- 238000005219 brazing Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000003344 environmental pollutant Substances 0.000 description 4
- 231100000719 pollutant Toxicity 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明提供一种冷却板，所述冷却板包括：第一基板，所述第一基板的侧面形成有进液孔和出液孔，冷却液从所述进液孔流进所述第一基板，且从所述出液孔流出所述第一基板；挡块，所述挡块设置在第一基板的上表面，位于所述进液孔和所述出液孔的上方，所述挡块与所述第一基板一体成型；第二基板，所述第二基板在与所述挡块对应处形成镂空，且覆盖所述第一基板，所述第二基板的上表面用于连接待冷却物件。本发明的冷却板能够增加进液孔/出液孔的强度，避免漏液，且降低进液孔/出液孔的污染。
The present invention provides a cooling plate, the cooling plate comprising: a first substrate, a liquid inlet hole and a liquid outlet hole are formed on the side of the first substrate, the cooling liquid flows into the first substrate from the liquid inlet hole, and flows out of the first substrate from the liquid outlet hole; a block, the block is arranged on the upper surface of the first substrate, located above the liquid inlet hole and the liquid outlet hole, the block is integrally formed with the first substrate; a second substrate, the second substrate is hollowed out at a position corresponding to the block, and covers the first substrate, and the upper surface of the second substrate is used to connect an object to be cooled. The cooling plate of the present invention can increase the strength of the liquid inlet hole/liquid outlet hole, avoid leakage, and reduce the contamination of the liquid inlet hole/liquid outlet hole.
Description
Technical Field
The invention relates to the field of heat dissipation, in particular to a cooling plate.
Background
Existing cooling of the object to be cooled (chip or power device) is usually performed by a cooling plate.
The existing cooling plate is generally provided with a liquid outlet hole and a liquid outlet hole at the side edge, so that the area of the liquid outlet hole and the area of the liquid outlet hole are enlarged for increasing the cooling effect, but after the cooling plate with the enlarged hole is connected with a cooling liquid joint, the condition of liquid leakage can easily occur, the bad effect of products is caused, and the customer satisfaction is influenced.
Disclosure of Invention
The present invention aims to provide a cooling plate, which can increase the strength of a liquid inlet/outlet, avoid liquid leakage and reduce pollution of the liquid inlet/outlet.
In order to solve the above-described problems, the present invention provides a cooling plate comprising:
The liquid cooling device comprises a first substrate, a second substrate and a liquid outlet, wherein a liquid inlet hole and a liquid outlet hole are formed in the side face of the first substrate, and cooling liquid flows into the first substrate from the liquid inlet hole and flows out of the first substrate from the liquid outlet hole;
The stop block is arranged on the upper surface of the first substrate and is positioned above the liquid outlet hole and the liquid outlet hole, and the stop block and the first substrate are integrally formed;
the second substrate is hollowed out at the position corresponding to the stop block and covers the first substrate, and the upper surface of the second substrate is used for connecting an object to be cooled.
Further, the height of the stop block is consistent with the thickness of the second substrate, and the liquid inlet hole and the liquid outlet hole are formed through the following steps:
Step S1, forming a through hole before the second substrate covers the first substrate;
And S2, reaming the through hole and forming threads after the second substrate covers the first substrate.
Further, the second substrate is welded to the upper surface of the first substrate and/or the side edge of the stop block.
Further, a solder layer is arranged between the first substrate and the second substrate, and/or a solder layer is arranged between the second substrate and the stop block.
Further, a predetermined gap exists between the stop block and the second substrate.
Further, the sides of the stop block and the second substrate facing each other are each formed with a step.
Further, the first substrate includes:
the first groove extends along the transverse direction, the cooling liquid can flow into the first end of the first groove from the liquid inlet hole, and the second end of the first groove is closed;
A second groove extending in the longitudinal direction, the first end of the second groove being connected to the first groove, the second end of the second groove being closed;
the plurality of groups of gap channels are longitudinally arranged, and the liquid inlet end of each group of gap channels is connected with the second groove;
a third groove extending longitudinally and spaced apart from the first groove, the third groove being connected to the liquid outlet end of each set of slit channels;
And the fourth groove extends transversely, the cooling liquid can flow into the liquid outlet hole from the fourth groove, the fourth groove is connected with the first end of the third groove, and the second end of the third groove is closed.
Further, each group of the slit passages is formed in an S-shape, which includes:
the first slit extends along the transverse direction, and the first end of the first slit is the liquid inlet end of the slit channel;
a second slit extending in a lateral direction, a first end of the second slit being connected to a second end of the first slit;
and the third slit extends along the transverse direction, the first end of the third slit is connected with the second end of the second slit, and the second end of the third slit is the liquid outlet end of the slit channel.
Further, the side walls of the first slit, the second slit and the third slit are wavy.
Further, a plurality of mounting areas for mounting chips are formed on the upper surface of the second substrate, and each mounting area at least corresponds to two groups of gap channels.
Due to the technical scheme, the invention has the following beneficial effects:
According to the cooling plate disclosed by the invention, the cooling channel, the liquid inlet hole and the liquid outlet hole are formed on the first substrate, and the integrally formed stop block is arranged at the corresponding position above the liquid inlet hole/the liquid outlet hole of the first substrate, so that the liquid inlet hole/the liquid outlet hole has higher strength, the condition that leakage occurs when the liquid inlet hole/the liquid outlet hole is connected with the cooling liquid joint is avoided, the second substrate covers the first substrate, so that the closed cooling channel is formed, the first substrate forms a hollowed-out structure to avoid the interference area between the first substrate and the stop block, the edge of the stop block is only required to be connected with the second substrate in the subsequent connection, the connection position is relatively far away from the liquid inlet hole/the liquid outlet hole, and the condition that the strength of the liquid inlet hole 211/the liquid outlet hole is poor and pollution is easy to occur due to the connection near the liquid inlet hole/the liquid outlet hole is avoided.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the following description will make a brief introduction to the drawings used in the description of the embodiments or the prior art. It is evident that the drawings in the following description are only some embodiments of the present invention and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a block diagram of a cooling plate according to one embodiment of the invention;
Fig. 2 is an enlarged view of region a in fig. 1;
FIG. 3 is an exploded view of the cooling plate of FIG. 1;
Fig. 4 is a structural view of a first substrate according to an embodiment of the present invention;
FIG. 5 is a top view of FIG. 4;
Fig. 6 is an enlarged view of region B in fig. 5;
fig. 7 is a structural diagram of a second substrate according to an embodiment of the present invention.
100. The second substrate, 110, the mounting area, 120, the second step, 200, the first substrate, 211, the liquid inlet, 221, the first stop block, 222, the second stop block, 223, the first step, 231, the first groove, 232, the second groove, 233, the gap channel, 233a, the first slit, 233b, the second slit, 233c, the third slit, 234, the third groove, 235 and the fourth groove.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
According to the analysis of the present inventors, the second substrate 100 of the conventional cooling plate completely covers the first substrate 200, and a liquid inlet 211/liquid outlet is formed on the side surface of the second substrate 100, so that the liquid inlet 211/liquid outlet is relatively large, in order to increase the cooling effect, the top area and the bottom area of the hole wall are thinner, the strength is lower, the liquid inlet 211/liquid outlet is easily damaged to cause liquid leakage due to the threaded connection with the cooling liquid connector, and the connection (such as welding) between the first substrate 200 and the second substrate 100, if the connection strength is lower, the liquid leakage occurs after the cooling liquid connector is connected with the liquid inlet 211/liquid outlet, and in addition, in the process of connecting the first substrate 200 and the second substrate 100 near the liquid inlet 211/liquid outlet, the pollutant easily falls into the liquid inlet 211/liquid outlet, and the pollutant easily contaminates or shields the liquid inlet 211/liquid outlet.
Based on this, the application sets an integrally formed stop block above the liquid inlet hole 211/liquid outlet hole in advance, which increases the strength of the liquid inlet hole 211/liquid outlet hole in the first substrate 200, and the joint of the first substrate 200 and the second substrate 100 is relatively far away from the liquid inlet hole 211/liquid outlet hole, thereby avoiding the above-mentioned leakage and pollution.
Next, a cooling plate according to an embodiment of the present invention is described.
As shown in fig. 1 to 7, the cooling plate according to the embodiment of the invention includes a first substrate 200, a stopper, and a second substrate 100.
First, the first substrate 200 is explained. The first substrate 200 is formed with a liquid inlet hole 211 and a liquid outlet hole (not shown) at a side surface thereof, and the cooling liquid flows into the first substrate 200 from the liquid inlet hole 211 and flows out of the first substrate 200 from the liquid outlet hole.
The cooling liquid flows into the first substrate 200 from the liquid inlet 211 and flows out from the liquid outlet, thereby cooling the first substrate 200.
Next, the stopper is described. The stopper is disposed on the upper surface of the first substrate 200 and above the liquid outlet hole and the liquid outlet hole.
As shown in fig. 4, a first stop block 221 is disposed above the liquid inlet 211, and a second stop block 222 is disposed above the liquid outlet. The number of the stoppers is not limited, and when the liquid outlet hole is adjacent to the liquid inlet hole 211, one stopper may be provided to cover the liquid inlet hole 211/the liquid outlet hole simultaneously.
The block and the first substrate 200 are integrally formed, that is, the block protruding upwards is formed above the liquid inlet and the liquid outlet in the processing process of the first substrate 200, so as to form the block. The strength of the structure is higher, the strength of the liquid inlet hole 211/the liquid outlet hole can be better enhanced, and the condition that liquid leakage occurs after the liquid inlet hole 211/the liquid outlet hole is connected with a cooling liquid joint is avoided.
Finally, the second substrate 100 is explained. The second substrate 100 is hollowed out at a position corresponding to the stop block and covers the first substrate 200. The upper surface of the second substrate 100 is used for mounting an object to be cooled (chip, power module IGBT, etc.).
As shown in fig. 1 to 3, the second substrate 100 covers the first substrate 200, the hollowed-out area of the second substrate 100 can avoid interference with the stopper, and the edge of the second substrate 100 can abut against the stopper or have a predetermined gap.
In the above cooling plate, a cooling channel (a channel through which a cooling liquid flows, for example, a channel formed by a first groove, a second groove, a plurality of groups of slit channels, a third groove and a fourth groove) is formed on the first substrate 200, the liquid inlet 211 and the liquid outlet are integrally formed at corresponding positions above the liquid inlet 211/the liquid outlet of the first substrate 200, so that the liquid inlet 211/the liquid outlet have higher strength, the condition that leakage occurs when the liquid inlet 211/the liquid outlet is connected with a cooling liquid joint is avoided, the second substrate 100 covers the first substrate 200, so that a closed cooling channel is formed, the first substrate 200 forms a hollowed-out portion to avoid an interference area with the stopper, the subsequent connection only needs to connect the edge of the stopper with the second substrate 100, the connection position is relatively far away from the liquid inlet 211/the liquid outlet, the condition that the strength of the liquid inlet 211/the liquid outlet is poor due to connection near the liquid inlet 211/the liquid outlet is avoided, and pollution is easy.
In some embodiments of the present invention, the height of the stopper corresponds to the thickness of the second substrate 100.
The height of the stopper is consistent with the thickness of the second substrate 100, and the upper surface of the cooling plate is ensured to be flat, so that the object to be cooled (chip, power module, etc.) can be conveniently mounted.
Optionally, the liquid inlet hole 211 and the liquid outlet hole are formed by:
Step S1, forming a through hole before the first substrate 200 of the second substrate 100;
In step S2, after the second substrate 100 is covered with the first substrate 200, the through hole is reamed and the screw is formed.
Compared with the mode that a larger threaded hole (a threaded liquid inlet hole 211/a threaded liquid outlet hole) is formed before the first substrate 200 and the second substrate are assembled, the mode of the application can reduce the blockage of the threaded hole caused by pollutants in the assembly process, avoid the deformation of the threaded hole caused by the processing process (such as high temperature in the vacuum brazing process), and further avoid the condition of liquid leakage.
Compared with the way that the through holes are formed and the threads are reamed after the first substrate 200 and the second substrate 100 are assembled, the way of the application forms the through holes before the first substrate 200 and the second substrate 100 are assembled, so that the cooling channels can be clearly seen, the liquid inlet holes 211/liquid outlet holes can better align the cooling channels, and a great amount of scraps generated in the process of forming the through holes after the first substrate 200 and the second substrate 100 are assembled can be avoided, and the cooling channels are easy to be blocked and polluted.
Therefore, the deformation of the liquid inlet holes 211/the liquid outlet holes can be reduced, the pollution of the threaded holes is reduced, the alignment with the cooling channel is increased, and the liquid leakage is avoided.
In some embodiments of the present invention, the second substrate 100 is solder-connected to the upper surface of the first substrate 200 and/or the sides of the stopper.
That is, the second substrate 100 is solder-connected to the upper surface of the first substrate 200, or the second substrate 100 is solder-connected to the side of the stopper, or the second substrate 100 is solder-connected to the upper surface of the first substrate 200 and the side of the stopper.
The welding mode is firm in connection, and the sealing performance of the cooling plate is improved.
Further, a solder layer is provided between the first substrate 200 and the second substrate 100, and/or a solder layer is provided between the second substrate 100 and the stopper.
The second substrate 100 may be connected to the first substrate 200 by means of vacuum brazing, and/or the second substrate 100 may be connected to the stopper by means of vacuum brazing. The vacuum brazing connection mode can enable the cooling plate to be manufactured simply and conveniently, and the cleanliness of the cooling plate is improved and the overall strength of the cooling plate is improved.
As shown in fig. 3, a solder plate is covered over the first substrate 200, and the second substrate 100 is covered over the solder plate, so that the first substrate 200 and the second substrate 100 are stably connected by vacuum brazing. After vacuum brazing, the brazing sheet forms a brazing layer.
In some embodiments of the present invention, the stopper has a predetermined gap with the second substrate 100.
As shown in fig. 1 and 2, the dimensions of the second substrate 100 and the dimensions of the stopper have tolerances, and a predetermined gap is left between the dimensions of the second substrate 100 and the dimensions of the stopper, so that the second substrate 100 and the first substrate 200 are aligned, and interference between the second substrate 100 and the stopper due to the tolerances is avoided when the second substrate 100 is covered on the first substrate 200.
Further, the stopper and the second substrate 100 are each formed with a step on the opposite sides thereof.
As shown in fig. 2, the second step 120 is formed at a side of the second substrate 100 facing the first stopper 221, and the first step 223 is formed at a side of the first stopper 221 facing the second substrate 100.
In the processing process of the cooling plate, impurities, welding flux and other pollutants exist at the preset gap, and the preset gap can be polished by a cutter, so that the cleanliness of the preset gap is improved. If there is no step, the cutter directly polishes the upper surface of the first substrate 200, causing abrasion of the first substrate 200.
In some embodiments of the present invention, the first substrate 200 includes a first groove 231, a second groove 232, a plurality of sets of slit channels 233, a third groove 234, and a fourth groove 235. The first groove 231 extends in a lateral direction, and the cooling liquid can flow into a first end of the first groove 231 from the liquid inlet hole, and a second end of the first groove 231 is closed. The second groove 232 extends in the longitudinal direction and has a first end connected to the first groove 231 and a second end closed. The plurality of sets of slit passages 233 are arranged in a longitudinal direction, the liquid inlet end of each set of slit passages 233 is connected to the second groove 232, the third groove 234 extends in the longitudinal direction and is spaced apart from the first groove 231, and the third groove 234 is connected to the liquid outlet end of each set of slit passages 233. The fourth groove 235 extends in a lateral direction, and the cooling liquid can flow from the fourth groove 235 into the liquid outlet hole, the fourth groove 235 is connected to the first end of the third groove 234, and the second end of the third groove 234 is closed.
As shown in fig. 4 and 5, the cooling liquid flows from the liquid inlet hole 211 to the first groove 231, flows from the first groove 231 to each of the second grooves 232, flows from the second grooves 232 to the plurality of sets of slit passages 233 simultaneously, flows from the plurality of sets of slit passages 233 to the third groove 234, flows from the third groove 234 to the fourth groove 235, and finally flows from the fourth groove 235 to the liquid outlet hole, thereby allowing the cooling liquid to uniformly and efficiently dissipate heat from each region of the first substrate 200.
The cooling liquid flows into the plurality of groups of slit passages 233 simultaneously, so that the cooling efficiency can be increased.
Further, each group of slit passages 233 is formed in an S-shape, which includes a first slit 233a, a second slit 233b, and a third slit 233c. The first slit 233a extends along the transverse direction, and the first end thereof is the liquid inlet end of the slit channel 233. The second slit 233b extends in the lateral direction, and a first end of the second slit 233b is connected to a second end of the first slit 233 a. The third slit 233c extends along the transverse direction, a first end of the third slit 233c is connected to a second end of the second slit 233b, and the second end of the third slit 233c is a liquid outlet end of the slit channel 233.
As shown in fig. 6, taking one set of slit passages 233 as an example, the cooling liquid flows into the first slit 233a from the second groove 232, flows into the second slit 233b from the first slit 233a, flows into the third slit 233c from the second slit 233b, and flows into the third groove 234 from the third slit 233 c. I.e., each group of slit passages 233 is formed in an "S-shape".
The cooling liquid flows into the plurality of groups of slit channels 233, so that a plurality of objects to be cooled can be synchronously cooled, the contact area between the S-shaped slit channels 233 and the cooling liquid can be increased, the heat exchange area is increased, and even if one group of slit channels 233 is blocked, the slit channels 233 of other groups are not affected.
The slit passages 233 are formed in an "S-shape" as compared to a single transverse strip of the "straight shape", the number of slit passages 233 is reduced, the cross-sectional area of the cooling liquid flowing from the second groove 232 into the slit passages 233 can be reduced, thereby increasing the flow rate, and the cooling liquid can be made to flow into the last group of slit passages 233 more quickly.
Because the heat productivity of each area of the object to be cooled is different, the heat productivity of the center is high and the heat productivity of the edge is low. The cooling liquid flows through the S-shaped slit channels 233 at the positions corresponding to the regions of the objects to be cooled with large heat productivity, so that the regions of the objects to be cooled with large heat productivity can be intensively cooled, and if the cooling liquid flows through part of the linear slit channels 233 (the part of the linear slit channels 233 corresponds to the regions of the objects to be cooled with low heat productivity or no heat productivity), the part of the cooling liquid flows out of the slit channels 233 without heat dissipation of the objects to be cooled, thus causing waste. The S-shaped slit passage 233 can increase the cooling efficiency of the object to be cooled and avoid waste.
Further, the sidewalls of the first slit 233a, the second slit 233b, and the third slit 233c are wavy.
As shown in fig. 6, the wavy side walls can increase the contact area between the coolant and the slit channels 233, thereby increasing the heat exchange area and improving the heat exchange capacity.
Further, the upper surface of the second substrate 100 is formed with a plurality of mounting areas 110 for mounting chips, and each mounting area 110 corresponds to at least two sets of slit channels 233.
As shown in fig. 7, a plurality of mounting regions 110 are formed on the upper surface of the second substrate 100, corresponding to the dashed-line frame in fig. 6, in which three sets of slit passages 233 are included. That is, one object to be mounted corresponds to three groups of slit channels 233, even if one group of slit channels 233 is blocked, the other two groups of slit channels can cool the object to be mounted, so that the heat dissipation stability is improved.
The foregoing is only illustrative of the present invention and is not to be construed as limiting thereof, but rather as various modifications, equivalent arrangements, improvements, etc., within the spirit and principles of the present invention.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311377917.9A CN117316899B (en) | 2023-10-24 | 2023-10-24 | A cooling plate |
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| CN202311377917.9A CN117316899B (en) | 2023-10-24 | 2023-10-24 | A cooling plate |
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| CN117316899A CN117316899A (en) | 2023-12-29 |
| CN117316899B true CN117316899B (en) | 2025-02-25 |
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| CN118136513B (en) * | 2024-02-02 | 2025-02-11 | 毫厘机电(苏州)有限公司 | A method for manufacturing a cold plate and a cooling system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111970906A (en) * | 2020-08-24 | 2020-11-20 | 浙江集迈科微电子有限公司 | Phased array radar heat abstractor |
| CN116759394A (en) * | 2023-06-15 | 2023-09-15 | 苏州浪潮智能科技有限公司 | A lightweight liquid cooling plate structure |
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| CN207542238U (en) * | 2017-08-25 | 2018-06-26 | 特变电工新疆新能源股份有限公司 | A kind of compression joint type IGBT flexible direct current transmission converter valve water-filled radiators |
| CN111200920B (en) * | 2018-11-19 | 2021-02-26 | 中车永济电机有限公司 | Cooling device and system |
| CN112151910B (en) * | 2020-09-27 | 2022-02-18 | 中国第一汽车股份有限公司 | Liquid-cooled battery system and control method thereof |
| CN113865389B (en) * | 2021-11-08 | 2025-03-11 | 兰州理工大学 | A plate-type pulsating heat pipe radiator with integrated plate heat exchanger at the condensing end |
| WO2023142576A1 (en) * | 2022-01-26 | 2023-08-03 | 湖北亿纬动力有限公司 | Cooling plate assembly, liquid cooling module and battery pack |
| CN219457896U (en) * | 2023-04-13 | 2023-08-01 | 惠州亿纬锂能股份有限公司 | Cell module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111970906A (en) * | 2020-08-24 | 2020-11-20 | 浙江集迈科微电子有限公司 | Phased array radar heat abstractor |
| CN116759394A (en) * | 2023-06-15 | 2023-09-15 | 苏州浪潮智能科技有限公司 | A lightweight liquid cooling plate structure |
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