CN117276151A - A method and equipment for arranging bulk materials - Google Patents

Abstract

The invention discloses a bulk material arrangement method and equipment. The equipment includes a feeding device, a lifting device, a material transferring device, a material plate assembly, a first rotation transfer device, a second rotation transfer device and a camera assembly. The method includes the following steps: placing the diaphragm containing the wafer on the feeding device, the camera component takes pictures of the wafer and positions it, and the feeding device drives the diaphragm to move; the lifting device lifts up the wafer at the material picking position. The rotation transfer device grabs the wafer at the pickup position and rotates it to the first transfer position; the transfer device receives the wafer and rotates the wafer to the second transfer position. The transfer device can also drive the wafer to rotate; the second rotation transfer The device receives the wafer at the second transfer position, then rotates to the discharge position and places it on the material plate assembly. The invention can quickly arrange the scattered wafers when the wafers on the diaphragm are transferred to the material plate, and the directions of the wafers after the arrangement point to the same direction.

Description

A method and equipment for arranging bulk materials

Technical field

The invention relates to the technical field of wafer production, and specifically relates to a bulk material arrangement method and equipment.

Background technique

The chip is one of the most important raw materials of LED. It is the light-emitting component of LED and the core part of LED. The quality of the chip will directly determine the performance of LED. Since wafers are produced in large quantities, in order to improve production efficiency, the produced wafers are placed randomly on the diaphragm. However, before being used for LED packaging, the incoming wafers need to be neatly arranged on the material board.

There are also some alignment equipment on the market. For example, the patent document with the publication number CN209658148U discloses a fully automatic wafer alignment machine. The alignment machine automatically outputs the wafers by vibrating the vibration plate of the discharging component, the direct vibration component, and the material distribution component, and then , the vacuum suction cup assembly, Z-axis manipulator assembly, and Y-axis manipulator assembly of the transfer part operate jointly to transfer the wafers automatically output by the vibrating discharging part to the wafer arrangement plate of the output part. However, such an arrangement equipment can only arrange the wafers in rows. However, the arrangement of the wafers also requires the wafers to be arranged in the same direction. The existing arrangement equipment cannot achieve such a function. The most important thing is that the discharging method of the vibrating plate is subject to the consistency and tolerance of the material. When processing smaller and smaller materials, it often runs unsmoothly, causing material jams. The passage of the material is very poor and cannot be continuous. The production efficiency is low, and because the smaller the material, the higher the accuracy requirements of the vibration plate, the more expensive the cost.

Contents of the invention

In order to overcome the shortcomings of the existing technology, the present invention provides a bulk material arrangement method and equipment that can quickly arrange scattered wafers to avoid using a vibrating plate loading method to achieve bulk material rearrangement, and can achieve high speed and stability. , low cost and three advantages.

The present invention provides the following technical solutions:

A bulk material arrangement method includes the following steps:

S1, place the diaphragm containing the wafer on the feeding device, use the camera component to take pictures and position the wafer on the diaphragm, and send the positioning information of the wafer to the feeding device. The feeding device drives the diaphragm according to the positioning information of the wafer. The piece moves to the material picking position;

S2, use a lifting device to absorb the diaphragm around the wafer in the material picking position, and lift the wafer in the material picking position, then use the first rotation transfer device to grab the wafer in the material picking position, and then rotate to the first transfer bit;

S3, use a transfer device to receive the wafer that has been rotated to the first transfer position on the rotary transfer device, and then the transfer device rotates the wafer to the second transfer position, in which a camera assembly is used to take pictures and position the direction of the wafer, and The positioning information of the wafer direction is sent to the rotation component provided in the transfer device. The rotation component drives the wafer to rotate according to the positioning information of the wafer direction. When the wafer is placed and rotated to the second transfer position, the direction of the wafer always points in a certain direction;

S4, use the second rotation transfer device to receive the wafer at the second transfer position, then rotate it to the discharge position, and then use the material plate assembly to receive the wafer at the discharge position;

S5, repeat the above steps, transfer several wafers on the diaphragm to the material plate assembly in sequence, and obtain a wafer material plate that is neatly arranged and the wafer directions point in the same direction.

The invention also provides the following technical solution: a bulk material arrangement equipment, including:

The feeding device includes a diaphragm carrying component, a first X-axis translation component and a first Y-axis translation component. The diaphragm carrying component is used to fix the diaphragm. The first X-axis translation component, the first Y-axis translation component The components are respectively used to drive the diaphragm carrying component to move along the X-axis and Y-axis directions;

The lifting device includes an adsorption assembly and an ejection pin assembly. The ejection pin assembly is used to lift the wafer on the diaphragm. The adsorption assembly is used to adsorb part of the diaphragm around the wafer to be lifted by the ejection pin assembly;

The material transfer device includes a revolution component and a rotation component. The revolution component rotates the wafer from the first transfer position to the second transfer position. The rotation component is used to adjust the direction of the wafer;

The material plate component includes a material plate and a second X-axis translation component and a second Y-axis translation component that drive the material plate to move along the X-axis and Y-axis directions;

The first rotary transfer device is used to receive the wafer at the material pickup position on the diaphragm and transfer it to the first transfer position;

a second rotary transfer device, used to transfer the wafers in the second transfer position on the transfer device to the discharge position;

The camera component is used to take pictures and position the direction and position information of the chip.

As a further improvement of the above technical solution, the revolving assembly includes a revolving main shaft and a revolving driving assembly that drives the revolving main shaft to rotate.

As a further improvement of the above technical solution, the rotation assembly includes a fixed base. A plurality of jigs for sucking wafers and a rotation driving assembly for driving the rotation of the jigs are installed on the fixed base. The fixed base is connected to the fixed base. The above-mentioned revolving spindle is fixedly connected.

As a further improvement of the above technical solution, a plurality of the jigs are arranged in an annular array with the revolution spindle as the center line.

As a further improvement of the above technical solution, the material transfer device further includes a lifting component, which is used to drive the revolution component to lift.

As a further improvement of the above technical solution, the diaphragm carrying assembly includes a diaphragm installation frame, a support frame and a locking assembly. The support frame is provided with an end surface for placing the diaphragm installation frame, and one side of the end surface is provided with Fixed rib, the locking component can controllably drive the diaphragm mounting frame against the fixed rib.

As a further improvement of the above technical solution, the adsorption assembly includes an adsorption head and an adsorption head lifting mechanism. The ejection pin assembly includes an ejection pin and an ejection pin lifting mechanism. The adsorption head is provided with an ejection pin perforation, and the ejection pin is located in the ejection pin perforation. middle.

As a further improvement of the above technical solution, the first rotation transfer device and the second rotation transfer device each include a workpiece and a rotation drive assembly. The workpiece is connected to the output shaft of the rotation drive assembly. The rotation drive assembly The assembly is used to drive the workpiece to rotate.

As a further improvement of the above technical solution, the camera assembly includes a first camera, which is used to take pictures of the position of the wafer on the positioning diaphragm and the arrangement direction of the wafer.

The beneficial effects of the present invention are: during the process of transferring the wafer from the diaphragm to the material plate, based on the information obtained by the camera component taking pictures and positioning the wafer, the rotation component in the material transfer device drives the wafer to rotate at a certain angle, so that each After the wafer is transferred, the wafer directions all point in the same direction, so that neatly arranged wafers can be obtained. Moreover, the wafer transfer speed of the present invention is fast, the work efficiency is high, the operation is automated, and the labor cost is reduced.

Description of the drawings

The present invention will be further described below in conjunction with the accompanying drawings and examples.

Figure 1 is a schematic assembly diagram of the bulk material arrangement equipment of the present invention;

Figure 2 is a schematic structural diagram of the feeding device in the bulk material arrangement equipment of the present invention;

Figure 3 is a schematic structural diagram of the lifting device in the bulk material arrangement equipment of the present invention;

Figure 4 is an exploded view of the lifting device in the bulk material arrangement equipment of the present invention;

Figure 5 is a schematic diagram of the assembly of the ejector pin and the adsorption head in the bulk material arrangement equipment of the present invention;

Figure 6 is a schematic structural diagram of the first rotation transfer device in the bulk material arrangement equipment of the present invention;

Figure 7 is a schematic structural diagram of the material transfer device of the bulk material arrangement equipment of the present invention from a first perspective;

Figure 8 is a schematic structural diagram of the material transfer device of the bulk material arrangement equipment of the present invention from a second perspective;

Figure 9 is a schematic structural diagram of the material transfer device of the bulk material arrangement equipment of the present invention from a third perspective.

Reference signs: 1. Frame; 2. Feeding device; 3. Lifting device; 4. First camera; 5. First rotating transfer device; 6. Third camera; 7. Transfer device; 8. Two rotation transfer devices; 9. Second camera; 10. Fourth camera; 11. Material plate mounting position; 21. First Y-axis translation component; 22. First X-axis translation component; 23. Support frame; 24. Support Frame; 25. Fixed rib; 26. Diaphragm installation frame; 27. Locking component; 31. Support base; 32. Adsorption component; 321. Adsorption head; 322. Adsorption head lifting connection plate; 323. Suction head lifting drive assembly ;324. Ejector perforation; 33. Ejector assembly; 331. Ejector; 332. Ejector holder; 333. Ejector lifting connecting plate; 334. Ejector lifting drive assembly; 51. Swing arm; 52. First adsorption fixture; 53. Rotary drive component; 54. Lift drive component; 71. Base; 72. Revolution component; 721. Revolution drive motor; 722. Revolution spindle; 723. Fixed base; 73. Rotation component; 731. Rotation drive motor; 732. Second Adsorption fixture; 74. Material transfer lifting component; 741. Lifting motor; 742. Cam mechanism.

Detailed ways

The concept, specific structure and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments and drawings to fully understand the purpose, features and effects of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without exerting creative efforts are all protection scope of the present invention. In addition, all the connections/connection relationships involved in the patent do not only refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection auxiliary parts according to the specific implementation conditions. Various technical features in the invention can be combined interactively without conflicting with each other.

The embodiment of the present invention includes a bulk material arrangement equipment. Referring to Figure 1, the bulk material arrangement equipment includes a frame 1, a feeding device 2, a lifting device 3, a material transfer device 7, a material plate assembly, a first rotating Transfer device 5, second rotation transfer device 8 and camera assembly. The wafer is placed on the feeding device 2, and then the wafer is transferred to the transfer device 7 through the first transfer device. After the transfer device 7 adjusts the direction of the wafer, the second transfer device transfers the wafer to the material plate assembly, and repeats the above operation, a neatly arranged wafer blank can be obtained.

In a specific embodiment, referring to Figure 2, the feeding device 2 includes a diaphragm carrying component, a first X-axis translation component 22 and a first Y-axis translation component 21. The diaphragm carrying component includes a support frame 23, a support Frame 24, diaphragm installation frame 26 and locking assembly 27. The diaphragm installation frame 26 can be a circular, rectangular or other shaped annular frame. A circular annular frame is preferred here. The diaphragm installation frame 26 is used to fix the diaphragm. piece, the first Y-axis translation component 21 is fixedly installed on the frame 1, the fixed end of the first X-axis translation component 22 is fixedly connected to the movable end of the first Y-axis translation component 21, and the support frame 23 is connected to the first X-axis translation component 21. The movable end of the shaft translation assembly 22 is connected. In addition, the support frame 24 is fixedly connected to the support frame 23, and the support frame 24 is provided with an end face for placing the diaphragm mounting frame 26. One side of the end face is provided with There is a fixed rib 25, and the locking assembly 27 can controllably drive the diaphragm mounting frame 26 against the fixed rib 25.

In this embodiment, the diaphragm holding the wafer is installed on the diaphragm mounting frame 26, and then the diaphragm mounting frame 26 is placed on the end face of the support frame 24. At this time, the movable end of the locking component 27 extends The movement forces the diaphragm mounting frame 26 to resist against the fixed rib 25, thereby achieving the fixation of the diaphragm mounting frame 26. Then, the operation of the first Y-axis translation component 21 drives the first X-axis translation component 22 and the diaphragm mounting frame 26 to move along the Y-axis direction, and the operation of the first X-axis translation component 22 drives the diaphragm mounting frame 26 along the X-axis. direction, thereby adjusting the position of the diaphragm mounting frame 26 so that the wafer to be picked up moves to the picking position.

In a specific embodiment, referring to Figures 3, 4 and 5, the lifting device 3 includes a support base 31, an adsorption assembly 32 and an ejector pin assembly 33. Further, the ejector pin assembly 33 includes an ejector pin 331, an ejector pin fixing seat. 332 and an ejection pin lifting mechanism. The ejection pin lifting mechanism includes an ejection pin lifting connection plate 333 and an ejection pin lifting driving assembly 334. The ejection pin lifting driving assembly 334 is installed on the support base 31. The ejection pin lifting connection plate 333 is slidingly connected to the support base 31. The ejection pin The bottom end of the lifting connecting plate 333 is connected to the movable end of the ejection pin lifting driving assembly 334, and the top end of the ejecting pin lifting connecting plate 333 is connected to the ejecting pin fixing base 332. When the ejecting pin lifting driving assembly 334 is running, it drives the ejecting pin fixing base 332 and the ejecting pin fixing base 332 to move upward. The ejector pin 331 rises and falls, and the ejector pin 331 is located directly below the material picking position. When the ejector pin 331 moves upward, it pierces the diaphragm and pushes up the wafer on the diaphragm at the material picking position, so as to facilitate the material picking of the first rotary transfer device 5 . Furthermore, the adsorption assembly 32 includes an adsorption head 321 and an adsorption head lifting mechanism. The adsorption head lifting mechanism includes an adsorption head lifting connecting plate 322 and an adsorption head lifting drive assembly 323. The adsorption head lifting drive assembly 323 is installed on the support base. 31, the adsorption head lifting connection plate 322 is slidingly connected to the support base 31, the bottom end of the adsorption head lifting connection plate 322 is connected to the movable end of the adsorption head lifting drive assembly 323, and the top end of the adsorption head lifting connection plate 322 is connected to the adsorption head 321 connection, the adsorption head lifting drive assembly 323 drives the adsorption head 321 to rise and fall during operation. The adsorption head 321 is provided with an ejection pin perforation 324, and the ejection pin 331 is located in the ejection pin perforation 324 to facilitate the lifting and lowering of the ejection pin 331; the adsorption head 321 is provided with adsorption holes around the ejection pin perforation 324. Before the ejection pin 331 moves upward, the adsorption head lifting mechanism drives the adsorption head 321 to move upward. Part of the diaphragm around the wafer at the material pickup position can be adsorbed through the adsorption holes of the adsorption head 321. Therefore, the process of the ejector pin 331 piercing the diaphragm and lifting up the wafer is more stable.

In a specific embodiment, the first rotation transfer device 5 and the second rotation transfer device 8 have the same structure. In this embodiment, the first rotation transfer device 5 is taken as an example. Referring to Figure 6, the first rotation transfer device 5 work piece, rotation drive assembly 53 and lifting drive assembly 54. The work piece includes a swing arm 51 and a first adsorption fixture 52. The swing arm 51 is in the shape of a four-pointed star. The first adsorption fixture 52 has four and They are respectively installed at the four corner ends of the swing arm 51. The output shaft of the rotary drive assembly 53 is connected to the center point of the swing arm 51, so that the rotary drive assembly 53 can drive the swing arm 51 to rotate, and one of the first adsorption fixtures 52 absorbs the wafer from the material pickup position, the rotation drive assembly 53 operates to drive the swing arm 51 to rotate 180° to transfer the wafer to the first transfer position. At this time, another first adsorption fixture 52 is located in front of the wafer at the material pickup position. Above, it is convenient to pick up the next wafer. Further, the movable end of the lifting drive assembly 54 is connected to the swing arm 51. The lifting drive assembly 54 can drive the swing arm 51 to move up and down. When the swing arm 51 moves downward, it is convenient for the first adsorption fixture 52 to pick up or discharge materials. The swing arm 51 moves upward and then rotates to avoid obstacles in the transfer process of the wafer.

In a specific embodiment, referring to FIGS. 7-9 , the material transferring device 7 includes a base 71 , a rotation component 73 , a revolution component 72 and a material transferring lifting component 74 . The material transferring lifting component 74 includes a rotating material installed on the base 71 The lifting motor 741 drives the revolution component 72 to rise and fall through the cam mechanism 742, thereby driving the rotation component 73 to rise and fall synchronously. Specifically, the rotation assembly 73 has four sets of rotation drive motors 731 and a second adsorption fixture 732. The second adsorption fixture 732 is connected to the spindle of the rotation drive motor 731; the revolution assembly 72 includes a fixed seat 723 and a revolution spindle. 722 and the revolution drive motor 721 that drives the revolution spindle 722 to rotate. Four sets of rotation drive motors 731 and the second adsorption fixture 732 are arranged in an annular array on the fixed seat 723. The fixed seat 723 is connected to the revolution spindle 722. When the revolution main shaft 722 rotates, the fixed base 723 is driven to rotate synchronously, thereby driving the second adsorption fixture 732 on the fixed base 723 to revolve.

When the first rotation transfer device 5 transfers the wafer to the first transfer position, the lift drive assembly 54 drives the swing arm 51 to move downward, and then the transfer lift assembly 74 drives the second adsorption fixture 732 to move upward (fine adjustment) , the second adsorption jig 732 absorbs the wafer on the first adsorption jig 52 and moves downward, and then the revolution drive motor 721 drives the fixed base 723 to rotate 180°, so that the wafer is located in the second transfer position. During this process, the rotation The drive motor 731 drives the second adsorption fixture 732 to rotate. The angle of rotation is determined based on the information of the camera component taking pictures and positioning the wafer. In this way, when each wafer is transferred to the second transfer position, the direction of each wafer always points in the same direction. Then the second rotation transfer device 8 transfers the wafers to the material plate and arranges them in a rectangular array. The direction of each wafer also points to the same direction, so that the wafers are transferred from the diaphragm to the material plate and arranged neatly, which is convenient for LEDs. packaging work.

In a specific embodiment, the material plate assembly (not shown) is installed at the material plate installation position 11 on the frame 1. Specifically, the material plate assembly includes a material plate, a second X-axis translation component and a second Y-axis translation assembly, the material plate is connected to the movable end of the second X-axis translation assembly, and the fixed end of the second X-axis translation assembly is connected to the movable end of the second Y-axis translation assembly. Through the second Y-axis translation The operation of the component drives the second X-axis translation component and the material plate to move along the Y-axis direction. The operation of the second X-axis translation component drives the material plate to move along the X-axis direction, thereby adjusting the position of the chip placement position on the material plate.

In a specific embodiment, referring to Figure 1, the camera assembly includes a first camera 4 and a second camera 9. The first camera 4 is located directly above the material pickup position and is used to take pictures and position the wafer on the diaphragm. , obtain the position of the wafer, so that the first X-axis translation component 22 and the first Y-axis translation component 21 can drive the diaphragm mounting frame 26 to move, thereby driving the wafer to move to the material picking position; in addition, the first camera 4 can also capture the material The wafer in the second transfer position is photographed and positioned to obtain the direction of the wafer, so that the rotation component 73 in the transfer device drives the wafer to rotate at a certain angle, so that the direction of the wafer in the second transfer position always points in the same direction. The second camera 9 is used to take pictures and position the wafers in the discharge position on the second rotation transfer device 8 above the material plate to obtain the position information of the wafers, and at the same time take pictures and position the material tray to obtain the position information of the wafer placement position. , so that the second X-axis translation component and the second Y-axis translation component can drive the material plate to move, so that the wafer placement position on the material plate moves to directly below the material discharge position, and the lift drive component 54 in the second rotation transfer device 8 drives The wafer descends, and the second rotation transfer device 8 places the wafer in the wafer placement position on the material plate.

In the preferred embodiment, referring to Figure 1, the camera assembly further includes a third camera 6, which is located directly above the first transfer position and is used to take pictures and position the wafer in the first transfer position. Compared with the direction in which the wafer is positioned by taking pictures with the first camera 4, using the third camera 6 can save the parameter calculation of rotating the wafer by 180° driven by the first rotation transfer device 5.

In the preferred embodiment, referring to Figure 1, the camera assembly also includes a fourth camera 10, which is located directly below the position after the first rotation transfer device 5 drives the wafer to rotate 90°, relative to the first camera 4 and the third camera 6, the third camera 6 can be used to take pictures and position the wafer from the bottom of the wafer. When the direction of the wafer cannot be observed from above, the fourth camera 10 can be used to solve this problem.

Embodiments of the present invention also include a bulk material arrangement method, which includes the following steps:

S1, place the diaphragm containing the wafer on the diaphragm installation frame 26 of the feeding device 2, fix it through the locking assembly 27, and then use the first camera 4 to take pictures and position the wafer on the diaphragm, and position the wafer. The positioning information is sent to the processor, and the processor drives the first X-axis translation component 22 and the first Y-axis translation component 21 to operate according to the positioning information of the wafer to drive the diaphragm to move the wafer to the material pickup position;

S2, use the adsorption head 321 of the lifting device 3 to suck part of the diaphragm around the wafer at the picking position, and then move the ejector pin 331 in the lifting device 3 upward to lift the wafer at the picking position, and then use the first rotation The first adsorption jig 52 in the transfer device 5 absorbs the wafer at the material pickup position, and then the first rotation transfer device 5 rotates the wafer 180° to the first transfer position;

S3, use the second adsorption fixture 732 in the transfer device 7 to receive the wafer rotated to the first transfer position on the first rotation transfer device 5, and then the revolution component 72 of the transfer device 7 rotates the wafer to the second transfer position. When the revolution assembly 72 drives the wafer to rotate from the first transfer position to the second transfer position, the first camera 4, the third camera 6 or the fourth camera 10 is used to take pictures and position the direction of the wafer, and The positioning information of the wafer direction is sent to the processor, and the processor drives the rotation drive motor 731 in the rotation assembly 73 to run, driving the wafer to rotate at a certain angle, so that when the wafer rotates to the second transfer position, the direction of the wafer always points in the same direction;

S4, use the second rotation transfer device 8 to receive the wafer at the second transfer position, then rotate 180° to the discharge position, use the second camera 9 to take pictures and position the wafer and material plate at the discharge position, and store the positioning information Sent to the processor, the processor drives the second X-axis translation component and the second Y-axis translation component in the material plate assembly to move, so that the chip placement position on the material plate moves to below the material placement position to receive the chip;

S5, repeat the above steps, transfer several wafers on the diaphragm to the material board in sequence, and obtain a wafer material board that is neatly arranged and the wafer directions point in the same direction.

The above is a detailed description of the preferred implementation of the present invention, but the present invention is not limited to the embodiments. Those skilled in the art can also make various equivalent modifications or substitutions without violating the spirit of the present invention. , these equivalent modifications or substitutions are included in the scope defined by the claims of this application.

Claims (10)

1. A method of bulk material alignment, comprising the steps of:

s1, placing a membrane for containing a wafer on a feeding device, photographing and positioning the wafer on the membrane by adopting a camera assembly, sending positioning information of the wafer to the feeding device, and driving the membrane to move to a material taking position by the feeding device according to the positioning information of the wafer;

s2, adsorbing a membrane around the wafer at the material taking position by adopting a jacking device, jacking the wafer at the material taking position, grabbing the wafer at the material taking position by adopting a first rotary transfer device, and rotating to a first transfer position;

s3, a transfer device is adopted to receive the wafer which rotates to a first transfer position on the rotary transfer device, then the transfer device rotates the wafer to a second transfer position, wherein a camera component is adopted to take a picture to position the direction of the wafer, positioning information of the direction of the wafer is sent to a rotation component arranged in the transfer device, the rotation component drives the wafer to rotate according to the positioning information of the direction of the wafer, and when the wafer is placed to rotate to the second transfer position, the direction of the wafer always points to a certain direction;

s4, a second rotary transfer device is adopted to receive the wafer at a second transfer position, then the wafer is rotated to a material placing position, and then a material plate assembly is adopted to receive the wafer at the material placing position;

s5, repeating the steps, and sequentially transferring a plurality of wafers on the membrane to the material plate assembly to obtain the wafer material plates which are orderly arranged and have the wafer directions pointing to the same direction.

2. A bulk material arranging apparatus, comprising:

the feeding device comprises a diaphragm bearing assembly, a first X-axis translation assembly and a first Y-axis translation assembly, wherein the diaphragm bearing assembly is used for fixing a diaphragm, and the first X-axis translation assembly and the first Y-axis translation assembly are respectively used for driving the diaphragm bearing assembly to move along the X-axis direction and the Y-axis direction;

the jacking device comprises an adsorption assembly and a thimble assembly, wherein the thimble assembly is used for jacking up a wafer on the membrane, and the adsorption assembly is used for adsorbing part of the membrane around the wafer to be jacked up by the thimble assembly;

the material transferring device comprises a revolution assembly and a rotation assembly, wherein the revolution assembly rotates the wafer from a first transferring position to a second transferring position, and the rotation assembly is used for adjusting the direction of the wafer;

the material plate assembly comprises a material plate, a second X-axis translation assembly and a second Y-axis translation assembly, wherein the second X-axis translation assembly and the second Y-axis translation assembly drive the material plate to move along the X-axis and Y-axis directions;

the first rotary transfer device is used for receiving the wafer at the receiving position on the membrane and transferring the wafer to the first transfer position;

the second rotary transfer device is used for transferring the wafer at the second transfer position on the transfer device to the discharge position;

and the camera component is used for photographing and positioning the direction and position information of the wafer.

3. The bulk cargo arraying device according to claim 2, characterised in that said revolution assembly comprises a revolution main shaft and a revolution driving assembly driving the revolution main shaft to rotate.

4. The bulk cargo arranging apparatus according to claim 3, wherein the rotation assembly comprises a fixing base, a plurality of jigs for sucking wafers and a rotation driving assembly for driving the jigs to rotate are mounted on the fixing base, and the fixing base is fixedly connected with the revolution main shaft.

5. The bulk cargo arranging apparatus according to claim 4, wherein a plurality of the jigs are arranged in a circular array with the revolution main shaft as a center line.

6. The bulk material alignment apparatus of claim 5, wherein the transfer device further comprises a lifting assembly for driving the revolution assembly to lift.

7. The bulk material alignment apparatus of claim 2, wherein the film carrier assembly comprises a film mounting frame, a support frame, and a locking assembly, the support frame being provided with an end surface for receiving the film mounting frame, one side of the end surface being provided with a fixed flange, the locking assembly being controllable to urge the film mounting frame against the fixed flange.

8. The bulk cargo arranging apparatus according to claim 2, wherein the suction assembly comprises a suction head and a suction head lifting mechanism, the ejector pin assembly comprises ejector pins and an ejector pin lifting mechanism, ejector pin perforations are provided on the suction head, and the ejector pins are located in the ejector pin perforations.

9. The bulk material alignment apparatus of claim 2, wherein the first and second rotary transfer devices each comprise a work piece and a rotary drive assembly, the work piece being coupled to an output shaft of the rotary drive assembly, the rotary drive assembly being configured to drive the work piece in rotation.

10. The bulk material alignment apparatus of claim 2, wherein the camera assembly includes a first camera for photographing a position of the wafer on the positioning film and an alignment direction of the wafer.