CN117238800A - CIM-based semiconductor measurement process control method and device - Google Patents

Abstract

The application is suitable for the technical field of semiconductor manufacturing, and provides a semiconductor measurement process control method, device, equipment and medium based on CIM. One of the methods, applied to the first end, comprises the following steps: determining a target component, a measurement path and measurement parameters according to the measurement formula information, and generating a first instruction; transmitting the first instruction to one or more designated second ends; the first instructions are executable based on any one of at least two sets of execution devices to cause the target component to obtain the metrology parameters via the metrology path. The method solves the problem that the existing process control software cannot be commonly used due to different equipment configurations by generating the first instruction which can be executed based on any one of at least two groups of execution equipment according to the formula information.

Description

CIM-based semiconductor measurement process control method and device

Technical field

The present application belongs to the field of semiconductor manufacturing technology, and in particular relates to a CIM-based semiconductor measurement process control method, device, equipment and medium.

Background technique

Computer integrated manufacturing (CIM) is a manufacturing method that uses computers to control the entire manufacturing process. Computers are used to organically integrate various automation subsystems scattered in the product design process to achieve integrated and intelligent overall benefits.

However, for some manufacturing fields, especially the semiconductor manufacturing field, the process technology is very complex, with numerous processes, up to thousands of steps. The equipment involved in each link also varies widely, and the equipment in the same link also has differentiated models for different process specifications. In the existing computer integrated manufacturing method, in the process of controlling equipment, a set of control codes is often written for one equipment, which is highly customized. When the controlled equipment is replaced, the original code will appear. Or the problem that the software is not compatible with the replaced equipment has become a hindrance to the mass production and operation of equipment.

Therefore, there is an urgent need to propose a CIM-based semiconductor measurement process control method that is compatible with equipment of different configurations.

Contents of the invention

Embodiments of the present application provide a CIM-based semiconductor measurement process control method, device, equipment and medium, which can solve the problem that existing process control software cannot be used universally due to different configurations of equipment.

In the first aspect, embodiments of the present application provide a CIM-based semiconductor measurement process control method, applied to the first end, including:

Determine the target component, measurement path and measurement parameters according to the measurement recipe information, and generate the first instruction;

Send the first instruction to one or more designated second ends;

The first instruction can be executed based on any one of at least two sets of execution devices, so that the target component obtains the measurement parameter through the measurement path.

The above method determines the target component, the measurement path and the measurement parameters according to the measurement recipe information, and generates the first instruction, so that when the generated first instruction is executed, the execution device can determine the target component, Measurement path and measurement parameters to achieve the measurement path.

Wherein, since the generated first instruction can be executed based on at least two groups of devices, the generated first instruction is common among at least two groups of devices. By generating at least a first instruction that can be used universally among two groups of devices, and then controlling the local device to complete the above measurement path, the existing control method of "controlling the local device to execute based on the measurement recipe information" is completed. Decoupling generates an indirect, measurement path-related and universal instruction, eliminating the need to write a complete set of codes for a set of devices, reducing the degree of customization of software code. And for the same type of measurement recipe information, you only need to edit the code once for the process from the measurement parameters to the first command. Subsequently, no matter what execution device is used to complete the measurement parameters of this type, you can directly call the edited first command. The instructions are parsed to control execution to complete the above measurement parameters. This solves the problem in the existing technology that the entire code needs to be re-edited when the specific equipment is replaced to achieve the same measurement parameters.

At the same time, the first command is sent to the second end, and the second end control device controls the local equipment for processing and manufacturing. The second end realizes compatibility with different devices, which can improve the versatility of this method in the implementation process.

In a possible implementation of the first aspect, the measurement recipe information includes a target component and measurement parameters, and the step of determining the target component, measurement path, and measurement parameters according to the measurement recipe information includes:

Based on preset rules, the measurement path is determined according to the target component and the measurement parameter, and the measurement path includes a plurality of processes determined in a preset process set and in a certain order.

The above method determines multiple processes in the preset process set through preset rules and determines the order of the multiple processes to obtain the measurement path, so that when the obtained measurement recipe information only includes the target component and measurement parameters, The measurement path can be determined based on preset rules and the first instruction can be generated. In addition, since the measurement path is determined by multiple processes in sequence, the measurement path can be split into multiple processes according to the recipe information, rather than determining the measurement path based on the specific execution device, so that the execution device can execute the first With one command, it can be executed based on the process, maximizing compatibility with different hardware devices.

In a possible implementation of the first aspect, the measurement recipe information includes a selection instruction; the selection instruction includes a target component, a plurality of selected processes, and a selection order of the multiple selected processes;

The steps of determining the target component, measurement path and measurement parameters based on the measurement recipe information include:

Determine the measurement path according to the plurality of selected processes and the selected sequence;

The measurement parameters are determined according to one or more selected processes, or the measurement parameters are determined according to the measurement path.

In the above method, selection instructions based on user operations are introduced, thereby providing a method for generating target components, measurement paths, and measurement parameters by selecting target components and measurement information (i.e., process or measurement parameters), starting from the user's perspective. , which can simplify the operation difficulty while providing a more compatible semiconductor measurement process control method.

In the second aspect, embodiments of the present application provide a CIM-based semiconductor measurement process control method, applied to the second end, including:

Obtain the configuration information and first command of the local device;

According to the configuration information, the first instruction is parsed into a second instruction; wherein the first instruction can be executed based on any one of at least two sets of execution devices, so that the target component passes through the preset measurement path Obtain preset measurement parameters; the second instruction can be executed based on the local device;

The local device is controlled according to the second instruction, so that the target component obtains the measurement parameter through the measurement path.

The above method parses the first instruction according to the configuration information, and parses the first instruction that can be common in at least two groups of devices into a second instruction that can be executed by the local device according to the difference in local configuration, so as to achieve the goal of handling different situations. Device compatibility. At the same time, this method obtains the first instruction that can be used universally in at least two groups of execution devices and parses the first instruction, rather than directly controlling the local device to execute according to the measurement recipe information, so that the first instruction is processed When parsing into the second instruction, the parsing logic is the same, making this method applicable to at least two groups of devices.

In a possible implementation of the second aspect, the step of parsing the first instruction into the second instruction according to the configuration information includes:

Determine rules that apply to the local device in a preset rule set according to the configuration information; wherein the preset rule set includes preset rules that apply to any one of at least two groups of execution devices;

The first instruction is parsed according to the rules applied to the local device to obtain the second instruction.

The above method determines the rules applied to the local device in the preset rule set according to the configuration information, so that when generating the second instruction, the first instruction can be parsed according to the different configurations of the local device, so that the obtained second instruction can be parsed according to the configuration of the local device. Commands are compatible with different local devices. At the same time, since the above parsing rules are selected from the preset rule set, multiple parsing rules corresponding to the execution device are pre-configured, so that when the specific hardware components change and the execution parameters of the device change, you can pass Select from multiple preset rule sets to obtain corresponding parsing rules to achieve compatibility with execution devices with different execution methods.

In a possible implementation of the second aspect, the measurement path includes multiple processes, and the step of controlling the local device according to the second instruction includes:

Based on the second instruction, the driver of the designated local device is called to control the designated local device to complete the designated process.

In the above method, the driver encapsulation setting of the specific hardware component at the bottom of the local device is set, and the corresponding driver is called to enable the hardware component to complete the specified process. When controlling the local device through the second instruction, only the calling information of the corresponding hardware component needs to be determined, which reduces the difficulty of rule setting and simplifies the code complexity.

In a possible implementation of the second aspect, the step of calling a driver of a designated local device based on the second instruction to control the designated local device to perform a designated process includes:

If it is determined that the designated process is a combined action process, then the combined action layer is run based on the second instruction to call the drivers of multiple designated local devices and control the multiple designated local devices to complete the combined action process; the combination The action process is completed by the cooperation of multiple hardware components in the local device.

After the above method determines a process as a combined action process, it only needs to determine the corresponding combined action layer without paying attention to the cooperation relationship between multiple hardware components. The corresponding driver of the local device is called through the combined action layer, and the combined action is split through the combined action layer. The combined action layer is equivalent to an encapsulated module that can call multiple local device drivers. Some combined actions are common to different execution devices. Therefore, by calling multiple hardware components for execution through the combined action module, you can further Improve the versatility of this method.

In a possible implementation of the second aspect, the step of controlling the local device according to the second instruction further includes:

A preset algorithm is called based on the second instruction to calculate a specified result based on the output result of the first preset process.

In the above method, the preset algorithm is called to meet the algorithm calculation requirements of different devices.

In the process of achieving the measurement parameters, it may be necessary to calculate the results of the previous process to achieve the measurement parameters. However, for specific execution devices, the software algorithms may be different due to different device configurations. Therefore, the above method improves the execution efficiency of the local device by encapsulating the algorithm module of a specific device for calling by a specific task.

In a third aspect, embodiments of the present application provide a CIM-based semiconductor measurement process control method, including:

Determine the target component, measurement path and measurement parameters according to the measurement recipe information, and generate a first instruction; the first instruction can be executed based on any one of at least two sets of execution devices, so that the target component is processed The measurement path obtains the measurement parameters;

Obtain the configuration information of the local device;

According to the configuration information, parse the first instruction into a second instruction, and the second instruction can be executed based on the local device;

The local device is controlled according to the second instruction, so that the target component obtains the measurement parameter through the measurement path.

In the above method, the first instruction that can be executed based on at least two sets of equipment is generated according to the recipe information, so that when generating the first instruction, only the target component measurement path and measurement parameters need to be determined, without the need to determine the hardware components and Implementation details of the logic. At the same time, the first instruction is parsed into the second instruction according to the local configuration information to achieve compatibility with different software. After the business logic is extracted, further execution is performed based on the configuration information to achieve compatibility with hardware.

In the fourth aspect, embodiments of the present application provide a CIM-based semiconductor measurement process control device, including:

A generation module, used to determine the target component, measurement path and measurement parameters based on the measurement recipe information, and generate the first instruction;

A sending module, configured to send the first instruction to one or more designated second terminals;

The first instruction can be executed based on any one of at least two sets of execution devices, so that the target component obtains the measurement parameter through the measurement path.

In a fifth aspect, embodiments of the present application provide a CIM-based semiconductor measurement process control device, including:

The acquisition module is used to obtain the configuration information and first instruction of the local device;

A parsing module, configured to parse the first instruction into a second instruction according to the configuration information; wherein the first instruction can be executed based on any one of at least two sets of execution devices, so that the target component is The preset measurement path obtains preset measurement parameters; the second instruction can be executed based on the local device;

A control module configured to control the local device according to the second instruction, so that the target component obtains the measurement parameters through the measurement path.

In a sixth aspect, embodiments of the present application provide a CIM-based semiconductor measurement process control device, including:

An instruction generation module, configured to determine the target component, measurement path and measurement parameters according to the measurement recipe information, and generate a first instruction; the first instruction can be executed based on any one of at least two sets of execution devices, to causing the target component to obtain the measurement parameters through the measurement path;

The configuration information acquisition module is used to obtain the configuration information of the local device;

An instruction parsing module, configured to parse the first instruction into a second instruction according to the configuration information, and the second instruction can be executed based on the local device;

A device control module, configured to control the local device according to the second instruction, so that the target component obtains the measurement parameters through the measurement path.

In a seventh aspect, embodiments of the present application provide a terminal device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program Implement the CIM-based semiconductor measurement process control method described in any one of the above first to third aspects.

In an eighth aspect, embodiments of the present application provide a computer-readable storage medium. The computer-readable storage medium stores a computer program. When the computer program is executed by a processor, any one of the above-mentioned first to third aspects is implemented. The CIM-based semiconductor measurement process control method described in one item.

In a ninth aspect, embodiments of the present application provide a computer program product. When the computer program product is run on a terminal device, the terminal device executes the CIM-based semiconductor process described in any one of the above first to third aspects. Measurement process control methods.

It can be understood that the beneficial effects of the above fourth to ninth aspects can be referred to the relevant descriptions in the above first to third aspects, and will not be described again here.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only for the purpose of the present application. For some embodiments, for those of ordinary skill in the art, other drawings can be obtained based on these drawings without exerting creative efforts.

Figure 1 is a schematic flowchart of a CIM-based semiconductor measurement process control method provided by a corresponding embodiment of the first aspect of the present application;

Figure 2 is a schematic diagram of the software architecture provided by the embodiment of this application;

Figure 3 is a schematic flowchart of a CIM-based semiconductor measurement process control method provided by a corresponding embodiment of the second aspect of the present application;

Figure 4 is a schematic flowchart of a CIM-based semiconductor measurement process control method provided by a corresponding embodiment of the second aspect of the present application;

Figure 5 is a schematic structural diagram of a CIM-based semiconductor measurement process control device provided by a corresponding embodiment of the first aspect of the present application;

Figure 6 is a schematic structural diagram of a CIM-based semiconductor measurement process control device provided by a corresponding embodiment of the second aspect of the present application;

Figure 7 is a schematic structural diagram of a CIM-based semiconductor measurement process control device provided by a corresponding embodiment of the third aspect of the present application;

Figure 8 is a schematic structural diagram of a terminal device provided by an embodiment of the present application.

Reference signs:

Generating module 501, sending module 502;

Acquisition module 601, analysis module 602, control module 603;

Instruction generation module 701, configuration information acquisition module 702, instruction analysis module 703, device control module 704;

Terminal device 80, processor 801, memory 802, computer program 803.

Detailed ways

In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures and technologies are provided to provide a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.

It will be understood that, when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, integers, steps, operations, elements and/or components but does not exclude one or more other The presence or addition of features, integers, steps, operations, elements, components and/or collections thereof.

It will also be understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

As used in this specification and the appended claims, the term "if" may be interpreted as "when" or "once" or "in response to determining" or "in response to detecting" depending on the context. ". Similarly, the phrase "if determined" or "if [the described condition or event] is detected" may be interpreted, depending on the context, to mean "once determined" or "in response to a determination" or "once the [described condition or event] is detected ]" or "in response to detection of [the described condition or event]".

In addition, in the description of this application and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

Reference in this specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Therefore, the phrases "in one embodiment", "in some embodiments", "in other embodiments", "in other embodiments", etc. appearing in different places in this specification are not necessarily References are made to the same embodiment, but rather to "one or more but not all embodiments" unless specifically stated otherwise. The terms “including,” “includes,” “having,” and variations thereof all mean “including but not limited to,” unless otherwise specifically emphasized.

In the current field of semiconductor manufacturing, the semiconductor manufacturing process is very complex, with numerous procedures and different equipment involved in each link. Especially for wafers (it is worth noting that in this application and some common understandings in the industry, wafers should be considered as uncut wafers, but on which samples of specific materials or material combinations may be grown). In the first step, wafer measurement needs to be completed with the help of measurement equipment, and different measurement equipment corresponds to different hardware platforms and the execution methods of the hardware platforms are different. This is common for CIM (Computer Integrated Manufacturing) software. Sex, compatibility, scalability, standardization and other aspects have brought great challenges. The process module in the current domestic CIM software is usually a whole. If equipment with different configurations is replaced or parts with different parameters are replaced, the code in the business process needs to be changed, which can easily lead to a situation where one equipment has one set of codes. Limits the versatility and compatibility of CIM software.

In order to solve the problem that due to the replacement of equipment, the existing control software is not compatible with the replaced equipment. One technical idea is to decouple the workflow and hardware components in the software development process to effectively separate the upper-layer business logic and the differentiation of the underlying components, thereby improving the versatility of the developed process control software.

According to the above technical ideas, with reference to Figure 1 of the specification, in the first aspect, the embodiment of the present application proposes a CIM-based semiconductor measurement process control method, which is applied to the first end and includes:

Step S102: Determine the target component, measurement path and measurement parameters according to the measurement recipe information, and generate a first instruction;

Step S104: Send the first instruction to one or more designated second terminals;

The first instruction can be executed based on any one of at least two sets of execution devices, so that the target component obtains the measurement parameter through the measurement path.

The process control method proposed in the embodiment of the present application can be applied to semiconductor manufacturing fields such as integrated circuit manufacturing, semiconductor chip manufacturing industry, and wafer process technology. It can especially be applied to the process link of wafer measurement to achieve control through a set of codes. Different measurement equipment completes wafer measurement. The first end can be understood as an independent process control device, such as a process control processor, or as a software module in a certain device, such as a computer program stored in a memory, which can be executed by the processor to implement step 102. , step 104.

Specifically, the CIM-based semiconductor measurement process control method proposed in this embodiment can be implemented by a software architecture including an application layer. You can consider using a rule engine, job task scheduler, or timing and process control engine, such as Drools or Quartz, to build the application layer, and write and implement it in C# language (of course, in some optional implementations, you can also Implemented using other architectures and other languages).

Among them, the measurement recipe information can be the measurement recipe of photolithography, etching, etc., or it can be the execution steps of the wafer measurement process, such as "Lay the wafer, find the area number to be measured, find it through the vision system The coordinates of the area to be measured, scan in the Z direction, height compensation in the Z direction, spectrum collection, calculation results, and ejection are the recipe information.

The measurement recipe information can be in the form of natural language. For example, in the process link of wafer measurement, the statement "X-ray measurement of film layer lattice parameters" input by the user can be used as the measurement recipe information. After obtaining the measurement recipe information in the form of natural language, the target component, measurement parameters and measurement path are determined by decoding the measurement recipe information in the form of natural language.

Alternatively, the measurement recipe information may be in the form of instructions. For example, when the first end includes a user interface, the user can edit the recipe information through the user interface, or select the corresponding selection module in the user interface. The first end determines the target components and quantities according to the user's selection instructions or editing instructions. measurement path and measurement parameters.

For the generation of the first instruction in step S102, after obtaining the measurement recipe information, the first end determines the measurement path and measurement parameters of the target component, and compares the measurement path, target component, and measurement parameters based on the preset rules. The parameters are parsed, the business logic of the measurement recipe information is extracted, and a first result is obtained based on any one of at least two sets of execution devices being executed so that the target component obtains the measurement parameters through the measurement path. instruction.

Among them, the preset rules can be formulated based on the business logic in the field, or based on the execution logic shared by multiple groups of different execution devices when completing the corresponding processes. Specifically, in the wafer measurement process, the second instruction can be obtained based on the execution logic of various measurement equipment. For example, there are many types of measurement equipment, such as optical thin film measurement, optical critical dimension measurement, and X-ray measurement. Thin film measurement, X-ray film layer component doping rate measurement, X-ray film stress and lattice parameter measurement, etc. When generating the first instruction and extracting the first pair of business logic or execution logic, it only focuses on the abstract expression of the business logic and does not focus on the implementation details of specific hardware components and logic. By extracting the execution logic of multiple measurement devices, these devices can be jointly controlled through the first end.

After the first instruction is generated, the first end sends the first instruction to the second end. After receiving the first instruction, the second end controls the local device according to the first instruction so that the target component passes the measurement. Path to obtain the measurement parameters.

It should be noted that regarding the interaction between the first end and the second end, the first end and the second end may be the same device or different devices. The computer program or software that can implement the method mentioned in the above embodiment and the program that controls the execution device can be two different programs or software on the same device, or they can be the same program or software.

Refer to Figure 2 of the description, where the first end can be implemented based on such a software architecture, including:

Presentation layer and application layer. The presentation layer can be a user interface that provides users with operation views for operations such as recipe editing and task management, or displays relevant data in process production to users. The measurement recipe statement input by the user is obtained through the application layer, or the user selects the selection instruction through the editing module, and then obtains the measurement recipe information.

After determining the target component, measurement path and measurement parameters based on the measurement recipe information obtained from the presentation layer, the application layer determines the business logic to execute the recipe, generates a first instruction, and sends the first instruction to Second end. The extracted business logic is business logic shared by at least two groups of devices.

The above method can be implemented by computer software and program code. By using the above technical ideas to develop or write computer software, the computer can execute the CIM-based semiconductor measurement process control method proposed in this embodiment, so that the written software It is compatible with a variety of different devices and improves the compatibility and versatility of the above computer software.

The beneficial effects of this embodiment are:

In this embodiment, the target component, the measurement path and the measurement parameters are determined based on the measurement recipe information, and the first instruction is generated, so that when the generated first instruction is executed, the execution device can determine the target component according to the determined first instruction. , measurement path and measurement parameters to achieve the measurement path.

Wherein, since the generated first instruction can be executed based on at least two groups of devices, the generated first instruction is common among at least two groups of devices. By generating at least a first instruction that can be used universally in both sets of devices, and then controlling the local device to complete the above measurement path, the original control method is decoupled from controlling the local device to execute based on the measurement recipe information. , generate an indirect, measurement path-related and universal instruction, eliminating the need to write a complete set of codes for a set of devices, reducing the degree of customization of the software code. And for the same type of measurement recipe information, you only need to edit the code once for the process from the measurement parameters to the first command. No matter what execution device is used to complete the measurement parameters, you can directly call the edited first command. The instructions are parsed to control execution to complete the above measurement parameters. This solves the problem in the existing technology that the entire code needs to be re-edited when the specific equipment is replaced to achieve the same measurement parameters.

At the same time, the first command is sent to the second end, and the second end control device controls the local equipment for processing and manufacturing. The second end realizes compatibility with different devices, which can improve the versatility of this method in the implementation process.

According to the above embodiment, in yet another embodiment:

The measurement recipe information includes target components and measurement parameters. The step of determining the target component, measurement path and measurement parameters based on the measurement recipe information includes:

Based on preset rules, the measurement path is determined according to the target component and the measurement parameter, and the measurement path includes a plurality of processes determined in a preset process set and in a certain order.

For example, for the measurement recipe information of "optical measurement film thickness", it can be determined that the target component is a wafer and the measurement parameter is the measured film thickness. At this time, according to the business logic of the optical film thickness measurement equipment, the following quantities can be determined: Measurement path: Load the film, number the area to be measured, find the coordinates of the area to be measured through the vision system, perform Z-direction scanning, perform Z-direction height compensation, spectrum collection, calculation results, and eject the film.

The preset rules can be extracted from the logic of performing services on multiple devices based on experience. Optionally, when determining the measurement path, corresponding adjustments can be made based on different measurement parameters. For example, when the measurement parameters are measured using X-rays to measure the lattice parameters of the film layer, the determined process is X-ray energy spectrum collection, not spectrum collection.

Among them, when determining the process set, it can be based on the many different types of machines that have been put into use during actual production, or equipment that is not currently in use but may be introduced can also be considered. According to the process flow of the above-mentioned equipment during process production or manufacturing, the processes in the process set are determined.

By adopting the above method, the determined measurement path can be made universal, and the generated first instruction can be compatible with as many sets of execution devices as possible, and the application layer software program can be consistent during specific implementation to achieve the greatest degree of security. compatible.

In an optional implementation, when determining the measurement path, it can be obtained by matching the measurement parameters and the target component in a preset process set, or by selecting the measurement parameter and the target component. By selecting or matching the measurement path according to the measurement parameters, the resulting measurement path is universal and can be executed by multiple groups of devices capable of completing the measurement parameters.

The beneficial effects of this embodiment are:

This embodiment uses preset rules to determine multiple processes in the preset process set and determine the order of the multiple processes to obtain the measurement path, so that the obtained measurement recipe information only includes the target component and measurement parameters. , capable of determining the measurement path based on preset rules and generating the first instruction. In addition, since the measurement path is determined by multiple processes in sequence, the measurement path can be split into multiple processes based on the measurement recipe information instead of determining the measurement path based on specific execution equipment, so that the execution equipment can When executing the first instruction, it can be executed based on the process, maximizing compatibility with different hardware devices.

According to the above embodiment, in yet another embodiment:

The measurement recipe information includes a selection instruction; the selection instruction includes a target component, a plurality of selected processes, and a selection order of the multiple selected processes;

The steps of determining the target component, measurement path and measurement parameters based on the measurement recipe information include:

Determine the measurement path according to the plurality of selected processes and the selected sequence;

The measurement parameters are determined according to one or more selected processes, or the measurement parameters are determined according to the measurement path.

For example, the measurement recipe information can be "load the film, find the coordinates of the area to be measured, find the coordinates of the area to be measured through the vision system, perform Z-direction scanning, perform Z-direction height compensation, spectrum collection, calculation results, eject the film ” form, in which the processes such as “loading the film” and “finding the coordinates of the area to be measured” are obtained according to the selection instructions.

The user can select the corresponding process in a certain order through the user interface in the presentation layer, or when the sequence corresponding to the process has been determined, the user can directly select the process, and the presentation layer will select the process according to the process selected by the user and the sequence corresponding to the process. , generate selection instructions. The application layer determines the measurement path based on the process selected in the selection command and the order in which the processes are selected.

When determining the measurement parameters, the measurement parameters can be determined based on the measurement path, or based on one or more processes. For example, the measurement parameters can be determined based on the "spectrum acquisition" process. Film thickness.

In a possible implementation manner, the method provided in this embodiment can be implemented based on a user interface. The user interface can be obtained by developers based on business logic settings that complete corresponding measurement parameters, and the user can generate selection instructions through pairing and matching.

After obtaining the measurement recipe information in the form of a selection instruction, the first end can parse the selection instruction according to the process and selection order in the selection instruction, determine the measurement parameters, and generate the first instruction.

The beneficial effects of this embodiment are:

By determining the measurement path based on the selected process and selection sequence in the selection instruction, the rules for analyzing the measurement formula information formed by the selection and determining the measurement path and measurement parameters are determined when the measurement recipe information is a selection instruction. , and the rules for generating the first instruction based on the recipe information in the form of selected instructions. This enables the first end to support users in selecting and editing users to form measurement recipe information when executing the above method, and can also analyze different measurement recipes, thereby improving the versatility of this method.

At the same time, this embodiment introduces selection instructions based on user operations, thereby providing a method for generating target components, measurement paths, and measurement parameters by selecting target components and measurement information (ie, process or measurement parameters). From the user's perspective Starting from this, it can simplify the operation difficulty while providing a more compatible semiconductor measurement process control method.

In the second aspect, with reference to Figure 3 of the specification, embodiments of the present application provide a CIM-based semiconductor measurement process control method, which is applied to the second end and includes:

Step S302: Obtain the configuration information and first instruction of the local device;

Step S304: Parse the first instruction into a second instruction according to the configuration information; wherein the first instruction can be executed based on any one of at least two sets of execution devices, so that the target component is preset The measurement path obtains preset measurement parameters; the second instruction can be executed based on the local device;

Step S306: Control the local device according to the second instruction, so that the target component obtains the measurement parameter through the measurement path.

In this embodiment, the second end is mainly used in the device control end, which can be an industrial control system, or a computer network device or computer cluster that communicates with the device, but is not limited to this.

When the second end obtains the configuration information of the local device, it can obtain the configuration information of the local device by reading the configuration file of the local device, or after accessing the corresponding device, it can add it to the configuration file of the first end. Get the configuration information of the local device. At the same time, this method obtains the first instruction that can be used universally in at least two groups of execution devices and parses the first instruction, rather than directly controlling the local device to execute according to the measurement recipe information, so that the first instruction is processed When parsing into the second instruction, the parsing logic is the same, making this method applicable to at least two groups of devices.

The configuration information may include the model information of the local device and the included hardware component information. For example, when the local device is an optical film measurement device, the configuration information may include the type, model, and corresponding parameter type of the motion platform, ranging sensor type, etc. After obtaining the configuration information, the second end can generate a second instruction according to the configuration information and the first instruction, and use the second instruction to control the local device to reach the measurement path through the preset measurement path.

The first instruction may be sent by the first terminal in the above embodiment, or may be generated locally by the second terminal. For step S304, when the first instruction is parsed into a second instruction, the hardware component of the local device corresponding to the measurement path can be determined based on the first instruction and the configuration information, as well as the action information to be executed by the local device, to generate Second instruction. Or determine the hardware drivers corresponding to different components in the local settings according to the configuration information of the local device, determine the calling information of the hardware driver, and generate the second instruction. For example, for the "wafer loading" process in the first instruction, the second end can determine based on the configuration information that the hardware components that need to be called for "wafer loading" include motion platforms, vacuum switches, etc., and parse the "wafer loading" process into multiple cooperation information of the hardware components, and generates the second instruction.

The beneficial effects of this embodiment are:

This embodiment parses the first instruction according to the configuration information, and parses the first instruction that can be common in at least two groups of devices into a second instruction that can be executed by the local device according to the difference in local configuration, so as to realize Compatibility of different devices.

According to the above embodiment, in yet another embodiment:

The step of parsing the first instruction into the second instruction according to the configuration information includes:

Determine rules that apply to the local device in a preset rule set according to the configuration information; wherein the preset rule set includes preset rules that apply to any one of at least two groups of execution devices;

The first instruction is parsed according to the rules applied to the local device to obtain the second instruction.

The following is an exemplary description of the parsing rules for determining the first instruction based on configuration information:

Different equipment has different hardware components. The parameter types corresponding to the hardware components of optical measurement equipment equipped with ellipsometer (SE) cantilevers are also different. Therefore, the model replacement of the hardware components of the execution equipment may occur. The software corresponding to the local device needs to be rewritten. For example, for an optical measurement equipment equipped with an ellipsometer (SE) cantilever, the stroke of the motion platform is [X_se_min, X_se_max], [Y_se_min, Y_se_max]. If it is an IM machine, the parameter type of the corresponding motion stroke is polar coordinates. Due to the difference in spatial design of the mechanical structure, the stroke range changes and the corresponding motion mode also changes. different. Therefore, when parsing the first instruction, it is necessary to determine the parsing rule for parsing the first instruction into the second instruction according to the different configuration information.

In this embodiment, the preset rule set is a set of multiple parsing rules related to device configuration. For example, the preset rule set includes parsing rules for parsing motion strokes into polar coordinates, and parsing motion formation into rectangular coordinates. parsing rules. Depending on the configuration information, the corresponding parsing rules are determined in the preset rule set. For example, when it is read that the motion platform mounted in the configuration information is an IM machine, then when the first command is parsed into the second command, the motion stroke of the motion platform is analyzed in the form of polar coordinates.

Optionally, after determining the rules applied to the local device, when parsing the first instruction, if it is determined that the local device performs a certain process, parameters need to be used as input to control the hardware component to complete the above measurement path, and If the parameter is not a preset value, the action parameter is calculated according to the configuration information, and the second instruction is generated. For example, in the semiconductor measurement process, for the "wafer loading" process, the X, Y, Z, and T axes of the motion platform need to be moved to the splicing position. At this time, the position of the splicing position is fixed, and the motion platform's The movement stroke is determined, and its corresponding movement distance can be a preset value. After determining the coordinates of the area to be measured, the motion platform needs to be called when performing height scanning in the Z direction. At this time, the movement distance during the cloud movement of the motion platform needs to be determined based on the coordinates of the area to be measured. It is not a preset value and needs to be calculated based on the configuration information and the coordinates of the area to be measured.

The beneficial effects of this embodiment are:

The above method determines the rules applied to the local device in the preset rule set according to the configuration information, so that when generating the second instruction, the first instruction can be parsed according to the difference in the local device configuration, so that the obtained third instruction can be parsed according to the configuration of the local device. The second command can be compatible with different local devices. At the same time, since the above parsing rules are selected from the preset rule set, multiple parsing rules corresponding to the execution device are pre-configured, so that when the specific hardware components change and the execution parameters of the device change, you can pass Select from multiple preset rule sets to obtain corresponding parsing rules to achieve compatibility with execution devices with different execution methods.

According to the above embodiment, in yet another embodiment:

The measurement path includes multiple processes, and the step of controlling the local device according to the second instruction includes:

Based on the second instruction, the driver of the designated local device is called to control the designated local device to complete the designated process.

Among them, the driver of the local device is the hardware driver corresponding to a single hardware component. The driver encapsulation setting of the local device can enable the corresponding hardware component to complete one or more basic actions by calling the corresponding hardware driver. The drivers of multiple local devices independent of each other. The designated process can be understood as any designated process in the measurement path. The driver of the local device can be installed on the second end, and compatibility with different device interfaces is achieved through the local driver installed on the second end.

For example, when executing the "spectrum collection" process, you only need to determine the driver corresponding to the spectrometer according to the second instruction, and collect it through the spectrometer; and for the "Z-direction height scan" process, determine the driver for performing the process according to the second instruction. After the platform includes: a motion platform and a ranging sensor, by calling the driver corresponding to the motion platform, the point to be measured is moved to directly under the ranging sensor in sequence, and then the driver corresponding to the ranging sensor is called to collect readings to complete the process. process.

In this embodiment, since the second instruction is obtained based on the configuration information, the hardware component that needs to be called can be determined according to the second instruction, and then the driver of the local device that needs to be called can be determined.

Refer to Figure 2 of the manual. In the specific software architecture, it can be implemented through the driver layer. The driver layer includes driver libraries for multi-model, multi-vendor devices, as well as multi-model, multi-vendor hardware components. After receiving the calling instruction from the local execution device, the driver layer calls the corresponding hardware driver and calls the hardware component to complete the specified process according to the calling instruction, where the calling instruction is generated based on the second instruction.

This embodiment can solve the following two situations:

1. When the equipment in production is replaced, the interface of the equipment is incompatible with the existing domestic software. By calling the local device driver to call the local device for execution, the compatibility of different devices is delegated to this layer for implementation, instead of a complete process that requires a complete set of codes to be controlled and written.

2. For the same device, when one or more hardware components are replaced and the interface is incompatible, only more comprehensive hardware drivers and basic actions need to be supplemented to achieve full-scenario compatibility.

The beneficial effects of this embodiment are:

In the above method, the driver encapsulation setting of the specific hardware component at the bottom of the local device is set, and the corresponding driver is called to enable the hardware component to complete the specified process. When controlling the local device through the second instruction, only the calling information of the corresponding hardware component needs to be determined, which reduces the difficulty of rule setting and simplifies the code complexity.

According to the above embodiment, in yet another embodiment:

The step of calling the driver of the designated local device based on the second instruction to control the designated local device to perform the designated process includes:

If it is determined that the designated process is a combined action process, then the combined action layer is run based on the second instruction to call the drivers of multiple designated local devices and control the multiple designated local devices to complete the combined action process; the combination The action process is completed by the cooperation of multiple hardware components in the local device.

In this embodiment, when calling the corresponding hardware driver in the local device according to the second instruction, the drivers of multiple specified local devices can be indirectly called through the combined action layer to complete the specified process. Optionally, the combined action layer is equivalent to an encapsulated module that can call multiple local device drivers. The calling information of the drivers of multiple local devices required to complete the specified process and the calling sequence of the multiple local information can be stored in the combined action layer in advance. Optionally, after receiving the second instruction, the combined action layer determines the execution actions of multiple hardware components and the execution order between them according to the second instruction, and then calls the driver of the corresponding local device in a certain order.

Optionally, when calling the hardware driver corresponding to the local execution device according to the second instruction, the hardware driver corresponding to the hardware component may be called through the basic action layer. When it is determined that a process is completed by a single piece of hardware, the process is a basic action process, and the hardware driver corresponding to the single component can be called through the basic action layer to complete the specified process.

In an optional implementation, the step of controlling the local device according to the second instruction further includes:

A preset algorithm is called based on the second instruction to calculate a specified result based on the output result of the first preset process. For example, the preset algorithms include analysis algorithms and matching algorithms. In the process of "finding the coordinates of the area to be measured", the image information obtained by the fine alignment camera is calculated by calling the matching algorithm to determine the coordinates of the area to be measured.

In the process of achieving the measurement parameters, it may be necessary to calculate the results of the previous process to achieve the measurement parameters. However, for specific execution devices, the software algorithms may be different due to different device configurations. For example, when optical film thickness equipment measures semiconductors, the acquisition instrument used is a spectrometer, so when analyzing the results, the corresponding acquisition instrument is a spectral analysis algorithm; while the acquisition instrument corresponding to XRD measurement equipment is an area array detection The device corresponds to the energy spectrum analysis algorithm, and the algorithms corresponding to the two are different. At this time, by encapsulating the algorithm module of a specific device and calling it for specific tasks, the execution efficiency of the local device is improved.

The beneficial effects of this embodiment are:

In this embodiment, after determining a process as a combined action process, it is only necessary to determine the corresponding combined action layer without paying attention to the cooperation relationship between multiple hardware components. The corresponding driver of the local device is called through the combined action layer, and the combined action is split through the combined action layer. The combined action layer is equivalent to an encapsulated module that can call multiple local device drivers. Some combined actions are common to different execution devices. Therefore, by calling multiple hardware components for execution through the combined action module, you can further Improve the versatility of this method.

Referring to Figure 4 of the description, in the third aspect, embodiments of the present application provide a CIM-based semiconductor measurement process control method, including:

Step S402: Determine the target component, measurement path and measurement parameters according to the measurement recipe information, and generate a first instruction; the first instruction can be executed based on any one of at least two sets of execution devices, so that the The target component obtains the measurement parameters through the measurement path;

Step S404: Obtain the configuration information of the local device;

Step S406: Parse the first instruction into a second instruction according to the configuration information, and the second instruction can be executed based on the local device;

Step S408: Control the local device according to the second instruction, so that the target component obtains the measurement parameter through the measurement path.

Referring to Figure 2 of the description, the above method can be implemented with the help of the following software architecture, including:

Presentation layer: It can be a user interface that provides users with operation views for operations such as recipe editing and task management, or displays relevant data in process production to users. The measurement recipe statement input by the user is obtained through the application layer, or the selection instruction selected by the user through the editing module is obtained, and then the measurement recipe information is obtained.

Application layer: Based on the measurement recipe information obtained from the presentation layer, after determining the target component, measurement path and measurement parameters, determine the business logic to execute the recipe, generate the first instruction, and send the first instruction control layer. The extracted business logic is business logic shared by at least two groups of devices.

Control layer: including combined action layer and basic action layer. The control layer determines whether the specified process is a combined action process or a basic action process according to the first instruction. If it is determined to be a basic action process, it directly calls the corresponding local device driver through the basic action layer according to the second instruction. If it is confirmed to be a combined action process, the corresponding combined action layer is determined according to the second instruction, the corresponding basic action layer is called through the combined action layer, and the corresponding local device driver is indirectly called.

Driver layer: The driver layer includes driver libraries for multi-model, multi-vendor devices, as well as multi-model, multi-vendor hardware components. After receiving the calling instruction from the local execution device, the driver layer calls the corresponding hardware driver according to the calling instruction to call the component to complete the specified process, where the calling instruction is generated based on the second instruction. The driver layer is called by the control layer to complete basic actions.

The above embodiments will be described in detail below with examples.

When the measurement parameter is optical measurement film thickness:

1. The user edits the measurement recipe information through the presentation layer and issues job tasks to the equipment. Among them, the measurement recipe information includes: loading the film, finding the area number to be measured, finding the coordinates of the area to be measured through the vision system, performing Z-direction scanning, performing Z-direction height compensation, spectrum collection, calculation results, and ejecting the film.

2. The application layer converts the measurement path and measurement parameters in the measurement recipe information obtained from the presentation layer into first instructions and sends them to the control layer.

3. The control layer has loaded the configuration file of the local device (ie, the optical film thickness device) when the software is started, and parses the first instruction into the second instruction according to the configuration file. And by calling the driver of the local device in the driver layer, various hardware components of the device are called to perform actions according to the second instruction.

Specifically, after determining that the "film loading" process is a combined action process, through the combined action layer corresponding to the "film loading" process, the X, Y, Z, and T axes of the motion platform corresponding to the equipment are called to move to the film connecting position. Control the vacuum switch, and then call the EFEM (Equipment Front-End Module) driver to load the film.

"Find the coordinates of the area to be measured" is also a combined action process. Through the combined action layer corresponding to the process of "finding the coordinates of the area to be measured", call the motion platform, move to the rough adjustment position preset when making the measurement recipe information, and then call A fine alignment camera equipped with a high-power lens takes pictures, calls the matching algorithm, and performs calculations based on the image information obtained by the fine alignment camera to determine the coordinates of the area to be measured (accurate to the micron level).

Determine "Z-direction height scanning" as the combined action process, call the motion platform through the combined action layer corresponding to the "Z-direction height scanning" process, move the point to be measured in order to directly below the ranging sensor, and then call the ranging The sensor collects readings.

The "Z direction compensation" process is also a combined action process. Through the combined action layer corresponding to the "Z direction compensation" process, the motion platform is called to move the point to be measured to the measurement spot position, and then based on the relationship between the point and the first point Height difference, move the Z-axis of the motion platform for height compensation.

After the "Z-direction compensation" process, the "spectrum collection" process is a basic action process. You only need to call the spectrometer through the basic action layer to collect. After collection, the corresponding interface of the analysis software is called for calculation according to the second instruction.

The final "ejection" is also a combination action process. Through the combination action layer corresponding to the "ejection" process, the motion platform moves to the splicing position, the vacuum is turned off, and EFEM is called to take out the piece and put it back, that is, a "wafer (wafer)" is completed. Circle)" complete measurement process.

When the measurement parameters are X-ray measurement film layer lattice parameters:

1. The user edits the measurement recipe information through the presentation layer and issues job tasks to the equipment. Among them, the measurement recipe information includes: loading the film, finding the area number to be measured, finding the coordinates of the area to be measured through the vision system, performing Z-direction scanning, performing Z-direction height compensation, X-ray energy spectrum collection, calculation results, and ejecting the film .

2. The application layer converts the measurement path and measurement parameters in the measurement recipe information obtained from the presentation layer into first instructions and sends them to the control layer.

3. The control layer has loaded the configuration file of the local device (i.e., XRD measurement equipment) when the software is started, and generates the second instruction based on the first instruction and the configuration file. And by calling the driver of the local device in the driver layer, various hardware components of the device are called to perform actions according to the second instruction.

Specifically, after determining that the "film loading" process is a combined action process, through the combined action layer corresponding to the "film loading" process, the X, Y, Z, and T axes of the motion platform corresponding to the equipment are called to move to the film connecting position. What differs from the optical device in the previous example is the addition of the action of widening the X-ray shielding window. Then control the vacuum switch, and then call the EFEM driver to load the film.

"Find the coordinates of the area to be measured", "Z-direction height scan" and "Z-direction compensation" are all combined action processes, and the specific execution is the same as the corresponding content in the previous example. "Energy spectrum acquisition" is a combined action process. Through the combined action layer corresponding to the "find the coordinates of the area to be measured" process, the corresponding basic action layer is called to complete the following actions: first open the Shutter of the X-ray tube, move The goniometer (angiometry cantilever) adjusts the X-ray incident angle and the reception angle of the area array detector; it controls the piezoelectric ceramic motor to adjust the distance between the laser knife and the sample (in the order of hundreds of microns). Control the rotation axis of the motion platform to the angle corresponding to the element of the sample being tested, and then call the area array detector to collect the X-ray diffraction energy spectrum. And for the relaxation strain specimen, it is necessary to change the angle of the angle measurement cantilever and the rotation axis of the motion platform, and then conduct secondary energy spectrum collection.

Then the analysis algorithm is called according to the second instruction to calculate the lattice parameters, and finally the unfilming action is performed.

The beneficial effects of this embodiment are:

By generating a first instruction that can be executed based on at least two sets of devices based on the recipe information, when generating the first instruction, only the target component measurement path and measurement parameters need to be determined, without the need to determine the implementation details of hardware components and logic. . At the same time, by parsing the first instruction into the second instruction according to the configuration information of the local device, compatibility with different execution devices is achieved.

It should be understood that the sequence number of each step in the above embodiment does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application.

Corresponding to the CIM-based semiconductor measurement process control method described in the above embodiment, Figure 4 shows a structural block diagram of the device provided by the embodiment of the present application. For convenience of explanation, only the components related to the embodiment of the present application are shown. part.

Referring to Figure 5, a CIM-based semiconductor measurement process control device provided in the fourth aspect of this application includes:

The generation module 501 is used to determine the target component, measurement path and measurement parameters according to the measurement recipe information, and generate the first instruction;

Sending module 502, configured to send the first instruction to one or more designated second terminals;

The first instruction can be executed based on any one of at least two sets of execution devices, so that the target component obtains the measurement parameter through the measurement path.

In an optional implementation, the measurement recipe information includes target components and measurement parameters, and the generation module 501 includes:

The first determination sub-module is used to determine the measurement path according to the target component and the measurement parameters based on preset rules, where the measurement path includes those determined in a preset process set and has a certain order. of multiple processes.

In an optional implementation, the measurement recipe information includes a selection instruction, and the selection instruction includes a target component, a plurality of selected processes, and a selected sequence of the multiple selected processes. The generation module 501 include:

a second determination sub-module, configured to determine the measurement path according to the plurality of selected processes and the selected sequence;

The third determination sub-module is used to determine the measurement parameters according to one or more selected processes, or determine the measurement parameters according to the measurement path.

Referring to Figure 6, a CIM-based semiconductor measurement process control device provided in the fifth aspect of this application includes:

Obtaining module 601 is used to obtain the configuration information and the first instruction of the local device;

Parsing module 602, configured to parse the first instruction into a second instruction according to the configuration information; wherein the first instruction can be executed based on any one of at least two sets of execution devices, so that the target component Obtain preset measurement parameters through a preset measurement path; the second instruction can be executed based on the local device;

The control module 603 is configured to control the local device according to the second instruction, so that the target component obtains the measurement parameters through the measurement path.

Further, the parsing module 602 includes:

a rule determination submodule, configured to determine rules that apply to the local device in a preset rule set according to the configuration information; wherein the preset rule set includes rules that apply to any one of at least two groups of execution devices preset rules;

The first parsing sub-module is used to parse the first instruction according to the rules applied to the local device to obtain the second instruction.

In an optional implementation, the measurement path includes multiple processes, and the control module 603 includes:

The driver submodule is configured to call the driver of the designated local device based on the second instruction to control the designated local device to complete the designated process.

Further, the driver sub-module includes:

The combination action unit is used to determine that the specified process is a combination action process, and then run the combination action layer based on the second instruction to call the drivers of multiple specified local devices and control the multiple specified local devices to complete the combination. Action process; the combined action process is completed by the cooperation of multiple hardware components in the local device.

In an optional implementation, the control module 603 includes:

The algorithm calling submodule is used to call a preset algorithm based on the second instruction to calculate a specified result based on the output result of the first preset process.

Referring to Figure 7, a CIM-based semiconductor measurement process control device provided in the sixth aspect of this application includes:

The instruction generation module 701 is used to determine the target component, the measurement path and the measurement parameters according to the measurement recipe information, and generate a first instruction; the first instruction can be executed based on any one of at least two sets of execution devices, So that the target component obtains the measurement parameter through the measurement path;

The configuration information acquisition module 702 is used to obtain the configuration information of the local device;

The instruction parsing module 703 is configured to parse the first instruction into a second instruction according to the configuration information, and the second instruction can be executed based on the local device;

The device control module 704 is configured to control the local device according to the second instruction, so that the target component obtains the measurement parameters through the measurement path.

It should be noted that the information interaction, execution process, etc. between the above-mentioned devices/units are based on the same concept as the method embodiments of the present application. For details of their specific functions and technical effects, please refer to the method embodiments section. No further details will be given.

Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above functional units and modules is used as an example. In actual applications, the above functions can be allocated to different functional units and modules according to needs. Module completion means dividing the internal structure of the device into different functional units or modules to complete all or part of the functions described above. Each functional unit and module in the embodiment can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be hardware-based. It can also be implemented in the form of software functional units. In addition, the specific names of each functional unit and module are only for the convenience of distinguishing each other and are not used to limit the scope of protection of the present application. For the specific working processes of the units and modules in the above system, please refer to the corresponding processes in the foregoing method embodiments, and will not be described again here.

This embodiment of the present application also provides a terminal device. As shown in Figure 8, the terminal device 80 includes: at least one processor 801, a memory 802, and a device stored in the memory and capable of running on the at least one processor. Computer program 803, when the processor executes the computer program, the steps in any of the above method embodiments are implemented.

Embodiments of the present application also provide a computer-readable storage medium. The computer-readable storage medium stores a computer program. When the computer program is executed by a processor, the steps in each of the above method embodiments can be implemented.

Embodiments of the present application provide a computer program product. When the computer program product is run on a mobile terminal, the steps in each of the above method embodiments can be implemented when the mobile terminal is executed.

If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it may be stored in a computer-readable storage medium. Based on this understanding, this application can implement all or part of the processes in the methods of the above embodiments by instructing relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium. The computer program When executed by a processor, the steps of each of the above method embodiments may be implemented. Wherein, the computer program includes computer program code, which may be in the form of source code, object code, executable file or some intermediate form. The computer-readable medium may at least include: any entity or device capable of carrying computer program code to the camera device/terminal device, recording media, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, RandomAccess Memory), electrical carrier signals, telecommunications signals, and software distribution media. For example, U disk, mobile hard disk, magnetic disk or CD, etc. In some jurisdictions, subject to legislation and patent practice, computer-readable media may not be electrical carrier signals and telecommunications signals.

In the above embodiments, each embodiment is described with its own emphasis. For parts that are not detailed or documented in a certain embodiment, please refer to the relevant descriptions of other embodiments.

Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented with electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Skilled artisans may implement the described functionality using different methods for each specific application, but such implementations should not be considered beyond the scope of this application.

In the embodiments provided in this application, it should be understood that the disclosed devices/network devices and methods can be implemented in other ways. For example, the apparatus/network equipment embodiments described above are only illustrative. For example, the division of modules or units is only a logical function division. In actual implementation, there may be other division methods, such as multiple units. Or components can be combined or can be integrated into another system, or some features can be omitted, or not implemented. On the other hand, the coupling or direct coupling or communication connection between each other shown or discussed may be through some interfaces, indirect coupling or communication connection of devices or units, which may be in electrical, mechanical or other forms.

The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or they may be distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

The above-described embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still implement the above-mentioned implementations. The technical solutions described in the examples are modified, or some of the technical features are equivalently replaced; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions in the embodiments of this application, and should be included in within the protection scope of this application.

Claims (14)

1. A method for controlling a CIM-based semiconductor metrology process, applied to a first terminal, comprising:

determining a target component, a measurement path and measurement parameters according to the measurement formula information, and generating a first instruction;

Transmitting the first instruction to one or more designated second ends;

the first instructions are executable based on any one of at least two sets of execution devices to cause the target component to obtain the metrology parameters via the metrology path.

2. The CIM-based semiconductor metrology process control method of claim 1, wherein the metrology recipe information includes target devices and metrology parameters, and wherein determining target devices, metrology paths, and metrology parameters from the metrology recipe information comprises:

and determining the measurement path according to the target component and the measurement parameters based on a preset rule, wherein the measurement path comprises a plurality of procedures which are determined in a preset procedure set and have a certain sequence.

3. The CIM-based semiconductor metrology process control method of claim 1, wherein the metrology recipe information includes a selection instruction; the selection instruction comprises a target component, a plurality of selected procedures and a selected sequence of the selected procedures;

the step of determining the target component, the measurement path and the measurement parameters according to the measurement recipe information comprises the following steps:

determining the measurement path according to the selected procedures and the selected sequence;

The metrology parameters are determined according to one or more selected processes or the metrology parameters are determined according to the metrology path.

4. A method for controlling a CIM-based semiconductor metrology process, applied to a second terminal, comprising:

acquiring configuration information and a first instruction of local equipment;

according to the configuration information, the first instruction is analyzed to be a second instruction; the first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains preset measurement parameters through a preset measurement path; the second instructions are executable based on the local device;

and controlling the local equipment according to the second instruction so that the target component obtains the measurement parameters through the measurement path.

5. The CIM-based semiconductor metrology process control method of claim 4, wherein the parsing the first instruction into the second instruction according to the configuration information comprises:

determining rules applied to the local equipment in a preset rule set according to the configuration information; wherein the preset rule set comprises preset rules applied to any one of at least two groups of execution devices;

And analyzing the first instruction according to the rule applied to the local equipment to obtain the second instruction.

6. The CIM-based semiconductor metrology process control method of claim 4, wherein the metrology path includes a plurality of processes;

the step of controlling the local device according to the second instruction includes:

and calling a drive of the designated local equipment based on the second instruction so as to control the designated local equipment to execute a designated procedure.

7. The CIM-based semiconductor metrology process control method of claim 6, wherein invoking the drive of the designated local device based on the second instruction to control the designated local device to perform a designated process comprises:

if the designated procedure is determined to be a combined action procedure, a combined action layer is operated based on the second instruction so as to call the driving of a plurality of designated local devices, and the plurality of designated local devices are controlled to complete the combined action procedure; the combined action procedure is completed by matching a plurality of hardware components in the local equipment.

8. The CIM-based semiconductor metrology process control method of claim 5, wherein the step of controlling the local device in accordance with the second instructions further comprises:

And calling a preset algorithm based on the second instruction to calculate a specified result according to the output result of the first preset procedure.

9. A method for controlling a CIM-based semiconductor metrology process, comprising:

determining a target component, a measurement path and measurement parameters according to the measurement formula information, and generating a first instruction; the first instructions are executable based on any one of at least two sets of execution devices to cause the target component to obtain the metrology parameters via the metrology path;

acquiring configuration information of local equipment;

according to the configuration information, analyzing the first instruction into a second instruction, wherein the second instruction can be executed based on the local equipment;

and controlling the local equipment according to the second instruction so that the target component obtains the measurement parameters through the measurement path.

10. A CIM-based semiconductor metrology process control apparatus comprising:

the generating module is used for determining a target component, a measuring path and measuring parameters according to the measuring formula information and generating a first instruction;

the sending module is used for sending the first instruction to one or more appointed second ends;

The first instructions are executable based on any one of at least two sets of execution devices to cause the target component to obtain the metrology parameters via the metrology path.

11. A CIM-based semiconductor metrology process control apparatus comprising:

the acquisition module is used for acquiring configuration information and a first instruction of the local equipment;

the analysis module is used for analyzing the first instruction into a second instruction according to the configuration information; the first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains preset measurement parameters through a preset measurement path; the second instructions are executable based on the local device;

and the control module is used for controlling the local equipment according to the second instruction so as to enable the target component to obtain the measurement parameters through the measurement path.

12. A CIM-based semiconductor metrology process control apparatus comprising:

the instruction generation module is used for determining a target component, a measurement path and measurement parameters according to the measurement formula information and generating a first instruction; the first instructions are executable based on any one of at least two sets of execution devices to cause the target component to obtain the metrology parameters via the metrology path;

The configuration information acquisition module is used for acquiring the configuration information of the local equipment;

the instruction analysis module is used for analyzing the first instruction into a second instruction according to the configuration information, and the second instruction can be executed based on the local equipment;

and the equipment control module is used for controlling the local equipment according to the second instruction so as to enable the target component to obtain the measurement parameters through the measurement path.

13. A terminal device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, characterized in that the processor implements the method according to any one of claims 1 to 3 or any one of claims 4 to 8 or claim 9 when the computer program is executed.

14. A computer readable storage medium storing a computer program, characterized in that the computer program when executed by a processor implements the method of any one of claims 1 to 3 or any one of claims 4 to 8 or claim 9.