CN117222123B - Super roughening process of circuit board - Google Patents
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- CN117222123B CN117222123B CN202311128563.4A CN202311128563A CN117222123B CN 117222123 B CN117222123 B CN 117222123B CN 202311128563 A CN202311128563 A CN 202311128563A CN 117222123 B CN117222123 B CN 117222123B
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Abstract
The invention relates to the technical field of circuit board processing, in particular to a super-roughening process of a circuit board. The invention discloses an organic acid super-roughening aqueous solution, wherein tannic acid is adopted to replace sulfuric acid, and chitosan, cupric chloride, sodium acetate, guanidine hydrochloride, hydrogen peroxide, aminotriazole, triethanolamine, sodium silicate, diethylenetriamine penta-methylene phosphonic acid and polymethacrylic acid are added simultaneously; the copper sheet is subjected to super-roughening process treatment by using the organic acid super-roughening aqueous solution, and tannic acid has a corrosion inhibition effect, so that the roughening appearance effect on the copper surface is more uniform.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a super-roughening process of a circuit board.
Background
The basic process of the printed circuit board circuit manufacturing technology sequentially comprises copper surface pretreatment, hot pressing of dry films, exposure development, etching or electroplating and dry film removal. The design circuit pattern is transferred onto the printed circuit board through a photochemical transfer process, and the bonding force between the dry film serving as a plating resistance or a corrosion resistance layer and the copper surface directly influences the quality of the printed circuit board. In recent years, with the high-speed development of electronic equipment, circuit designs are becoming more and more dense, and line widths and line distances are becoming smaller gradually, so that the conventional pretreatment process has reached the limit of the conventional pretreatment process, and is difficult to meet the requirements of new technologies.
The super-roughening process needs to add different additives into the super-roughening liquid to enable the copper surface to generate selective punctiform different etching rates, so that the surface area of the copper surface is increased, and the binding force between the copper surface and the dry film is improved. After super roughening, the copper surface is light red to dark red. Because the lattice defects of the copper surface or the lattice distribution of the electroplated layer are uneven, uneven color or larger color difference of the copper surface can be caused in the super roughening process, the problem of false detection can be caused, the copper surface is scrapped due to the problem of color difference, and the quality yield and subsequent shipment of the printed circuit board are seriously affected.
Disclosure of Invention
The present invention is directed to a circuit board super-roughening process, so as to solve the problems set forth in the background art.
In order to solve the technical problems, the invention provides the following technical scheme: a super roughening process of a circuit board comprises the following steps:
step 1: cleaning the board surface of the circuit board, and washing for later use;
Step 2: preparing an organic acid super-roughening aqueous solution:
s1: mixing tannic acid, deionized water and chitosan, and stirring for dissolving to obtain a mixed solution A;
S2: adding copper chloride, sodium silicate, diethylenetriamine penta-methylene phosphonic acid and polymethacrylic acid into the mixed solution A, and uniformly stirring to obtain a mixed solution B;
s3: adding sodium acetate, guanidine hydrochloride, aminotriazole and triethanolamine into the mixed solution B and mixing to obtain a mixed solution C;
s4: adding hydrogen peroxide into the mixed solution C, and stirring to obtain an organic acid super-roughening aqueous solution;
Step 3: and (3) soaking the circuit board in an organic acid super-roughening aqueous solution, taking out, baking until the circuit board is dried, putting the circuit board into glutaraldehyde solution for crosslinking, and drying the circuit board again for later use.
Further, in the step 2, the organic acid super-roughening aqueous solution comprises the following components in percentage by weight: 10-40 g/L copper chloride, 80-120 g/L tannic acid, 30-50 g/L sodium acetate, 10-20 g/L guanidine hydrochloride, 15-35 g/L hydrogen peroxide, 5-10 g/L aminotriazole, 10-15 g/L triethanolamine, 1-2 g/L sodium silicate, 1-2 g/L diethylenetriamine pentamethylene phosphonic acid, 2-3 g/L polymethacrylic acid and the balance of water.
Further, the pH of the organic acid super-roughening aqueous solution is 2.0-3.0.
Further, the density of the organic acid super-roughening aqueous solution is 1.1-1.5 g/cm 3.
Further, in the step 3, the soaking temperature is 25-35 ℃.
Further, in the step 3, the soaking time is 3-5 min.
Further, in the step 3, the baking temperature is 70-80 ℃.
In the step 3, the mass concentration of glutaraldehyde solution is 2-3%.
In step 3, the crosslinking time is 1 to 2 minutes.
Compared with the prior art, the invention has the following beneficial effects: the invention provides a super-roughening process of a circuit board, which aims to increase the roughening precision of the surface of the circuit board and provide better welding effect and stronger coating adhesive force for the circuit board. Chitosan and tannic acid also have good cleaning performance, and dirt and oxide on the surface of the circuit board can be removed. In the super roughening process, the application of chitosan and tannic acid can remove grease, dust and other pollutants on the surface of the circuit board, ensure that the copper surface is sufficiently purified, and further improve the roughening effect and the adhesive force. In addition, the chitosan and the tannic acid have oxidation resistance, so that a circuit board treated by the super-roughening process can be protected to a certain extent, the oxidation degree is reduced, and the service life of the circuit board is prolonged.
Detailed Description
The following description of the technical solutions in the embodiments of the present invention will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The materials used in the embodiment of the invention and the sources thereof: chitosan is from a glossy organism, an industrial grade; polymethacrylic acid is from maclin, cat No. P875949-100g.
Example 1: a super roughening process of a circuit board comprises the following steps:
step 1: cleaning the board surface of the circuit board, and washing for later use;
Step 2: preparing an organic acid super-roughening aqueous solution:
s1: mixing tannic acid, deionized water and chitosan, and stirring for dissolving to obtain a mixed solution A;
S2: adding copper chloride, sodium silicate, diethylenetriamine penta-methylene phosphonic acid and polymethacrylic acid into the mixed solution A, and uniformly stirring to obtain a mixed solution B;
s3: adding sodium acetate, guanidine hydrochloride, aminotriazole and triethanolamine into the mixed solution B and mixing to obtain a mixed solution C;
s4: adding hydrogen peroxide into the mixed solution C, and stirring to obtain an organic acid super-roughening aqueous solution;
Wherein, 10g/L of copper chloride, 80g/L of tannic acid, 30g/L of sodium acetate, 10g/L of guanidine hydrochloride, 15g/L of hydrogen peroxide, 5g/L of aminotriazole, 10g/L of triethanolamine, 1g/L of sodium silicate, 1g/L of diethylenetriamine penta-methylene phosphonic acid and 2g/L of polymethacrylic acid; the pH value of the organic acid super-roughening aqueous solution is 3.0, and the density is 1.14g/cm 3;
Step 3: soaking the circuit board in organic acid super-roughening aqueous solution at 25deg.C for 3min, taking out, baking at 70deg.C to dryness, crosslinking in 2% glutaraldehyde solution for 1min, and oven drying again for use.
Example 2: a super roughening process of a circuit board comprises the following steps:
step 1: cleaning the board surface of the circuit board, and washing for later use;
Step 2: preparing an organic acid super-roughening aqueous solution:
s1: mixing tannic acid, deionized water and chitosan, and stirring for dissolving to obtain a mixed solution A;
S2: adding copper chloride, sodium silicate, diethylenetriamine penta-methylene phosphonic acid and polymethacrylic acid into the mixed solution A, and uniformly stirring to obtain a mixed solution B;
s3: adding sodium acetate, guanidine hydrochloride, aminotriazole and triethanolamine into the mixed solution B and mixing to obtain a mixed solution C;
s4: adding hydrogen peroxide into the mixed solution C, and stirring to obtain an organic acid super-roughening aqueous solution;
Wherein, 12g/L of copper chloride, 85g/L of tannic acid, 33g/L of sodium acetate, 11g/L of guanidine hydrochloride, 17g/L of hydrogen peroxide, 5g/L of aminotriazole, 11g/L of triethanolamine, 1.5g/L of sodium silicate, 1.4g/L of diethylenetriamine penta-methylene phosphonic acid and 2.2g/L of polymethacrylic acid; the pH of the organic acid super-roughening aqueous solution is 2.89, and the density is 1.14g/cm 3;
Step 3: soaking the circuit board in organic acid super-roughening aqueous solution at 25deg.C for 3.5min, taking out, baking at 70deg.C to dryness, crosslinking in 2.2% glutaraldehyde solution for 1min, and oven drying again for use.
Example 3: a super roughening process of a circuit board comprises the following steps:
step 1: cleaning the board surface of the circuit board, and washing for later use;
Step 2: preparing an organic acid super-roughening aqueous solution:
s1: mixing tannic acid, deionized water and chitosan, and stirring for dissolving to obtain a mixed solution A;
S2: adding copper chloride, sodium silicate, diethylenetriamine penta-methylene phosphonic acid and polymethacrylic acid into the mixed solution A, and uniformly stirring to obtain a mixed solution B;
s3: adding sodium acetate, guanidine hydrochloride, aminotriazole and triethanolamine into the mixed solution B and mixing to obtain a mixed solution C;
s4: adding hydrogen peroxide into the mixed solution C, and stirring to obtain an organic acid super-roughening aqueous solution;
Wherein, 18g/L of copper chloride, 96g/L of tannic acid, 34g/L of sodium acetate, 13g/L of guanidine hydrochloride, 20g/L of hydrogen peroxide, 6.4g/L of aminotriazole, 13g/L of triethanolamine, 1.4g/L of sodium silicate, 1.6g/L of diethylenetriamine penta-methylene phosphonic acid and 2.1g/L of polymethacrylic acid; the pH value of the organic acid super-roughening aqueous solution is 2.76, and the density is 1.32g/cm 3;
step 3: soaking the circuit board in organic acid super-roughening aqueous solution at 26 ℃ for 3.4min, taking out, baking at 72 ℃ until the circuit board is dried, putting into 2.4% glutaraldehyde solution for crosslinking for 1.6min, and drying again for later use.
Example 4: a super roughening process of a circuit board comprises the following steps:
step 1: cleaning the board surface of the circuit board, and washing for later use;
Step 2: preparing an organic acid super-roughening aqueous solution:
s1: mixing tannic acid, deionized water and chitosan, and stirring for dissolving to obtain a mixed solution A;
S2: adding copper chloride, sodium silicate, diethylenetriamine penta-methylene phosphonic acid and polymethacrylic acid into the mixed solution A, and uniformly stirring to obtain a mixed solution B;
s3: adding sodium acetate, guanidine hydrochloride, aminotriazole and triethanolamine into the mixed solution B and mixing to obtain a mixed solution C;
s4: adding hydrogen peroxide into the mixed solution C, and stirring to obtain an organic acid super-roughening aqueous solution;
Wherein, 22g/L of copper chloride, 99g/L of tannic acid, 37g/L of sodium acetate, 16g/L of guanidine hydrochloride, 21g/L of hydrogen peroxide, 7.3g/L of aminotriazole, 13g/L of triethanolamine, 1.4g/L of sodium silicate, 1.7g/L of diethylenetriamine penta-methylene phosphonic acid and 2.34g/L of polymethacrylic acid; the pH value of the organic acid super-roughening aqueous solution is 2.64, and the density is 1.32g/cm 3;
step 3: soaking the circuit board in organic acid super-roughening aqueous solution at 27 ℃ for 4min, taking out, baking at 73 ℃ until the circuit board is dried, putting into 2.5% glutaraldehyde solution for crosslinking for 1.5min, and drying again for later use.
Example 5: a super roughening process of a circuit board comprises the following steps:
step 1: cleaning the board surface of the circuit board, and washing for later use;
Step 2: preparing an organic acid super-roughening aqueous solution:
s1: mixing tannic acid, deionized water and chitosan, and stirring for dissolving to obtain a mixed solution A;
S2: adding copper chloride, sodium silicate, diethylenetriamine penta-methylene phosphonic acid and polymethacrylic acid into the mixed solution A, and uniformly stirring to obtain a mixed solution B;
s3: adding sodium acetate, guanidine hydrochloride, aminotriazole and triethanolamine into the mixed solution B and mixing to obtain a mixed solution C;
s4: adding hydrogen peroxide into the mixed solution C, and stirring to obtain an organic acid super-roughening aqueous solution;
wherein, 28g/L of copper chloride, 105g/L of tannic acid, 42g/L of sodium acetate, 15g/L of guanidine hydrochloride, 26g/L of hydrogen peroxide, 6.4g/L of aminotriazole, 13g/L of triethanolamine, 1.8g/L of sodium silicate, 1.7g/L of diethylenetriamine penta-methylene phosphonic acid and 2.4g/L of polymethacrylic acid; the pH value of the organic acid super-roughening aqueous solution is 2.74, and the density is 1.34g/cm 3;
Step 3: soaking the circuit board in organic acid super-roughening aqueous solution at 28deg.C for 4.2min, taking out, baking at 71 deg.C to dryness, crosslinking in 2.5% glutaraldehyde solution for 1.75min, and oven drying again for use.
Example 6: a super roughening process of a circuit board comprises the following steps:
step 1: cleaning the board surface of the circuit board, and washing for later use;
Step 2: preparing an organic acid super-roughening aqueous solution:
s1: mixing tannic acid, deionized water and chitosan, and stirring for dissolving to obtain a mixed solution A;
S2: adding copper chloride, sodium silicate, diethylenetriamine penta-methylene phosphonic acid and polymethacrylic acid into the mixed solution A, and uniformly stirring to obtain a mixed solution B;
s3: adding sodium acetate, guanidine hydrochloride, aminotriazole and triethanolamine into the mixed solution B and mixing to obtain a mixed solution C;
s4: adding hydrogen peroxide into the mixed solution C, and stirring to obtain an organic acid super-roughening aqueous solution;
Wherein, 31g/L copper chloride, 105g/L tannic acid, 42g/L sodium acetate, 17.5g/L guanidine hydrochloride, 28.6g/L hydrogen peroxide, 7.5g/L aminotriazole, 13.5g/L triethanolamine, 1.48g/L sodium silicate, 2g/L diethylenetriamine penta-methylene phosphonic acid and 2.7g/L polymethacrylic acid; the pH value of the organic acid super-roughening aqueous solution is 2.84, and the density is 1.37g/cm 3;
step 3: soaking the circuit board in organic acid super-roughening aqueous solution at 28deg.C for 4.4min, taking out, baking at 75deg.C to dryness, crosslinking in 2.6% glutaraldehyde solution for 1.78min, and oven drying again for use.
Example 7: a super roughening process of a circuit board comprises the following steps:
step 1: cleaning the board surface of the circuit board, and washing for later use;
Step 2: preparing an organic acid super-roughening aqueous solution:
s1: mixing tannic acid, deionized water and chitosan, and stirring for dissolving to obtain a mixed solution A;
S2: adding copper chloride, sodium silicate, diethylenetriamine penta-methylene phosphonic acid and polymethacrylic acid into the mixed solution A, and uniformly stirring to obtain a mixed solution B;
s3: adding sodium acetate, guanidine hydrochloride, aminotriazole and triethanolamine into the mixed solution B and mixing to obtain a mixed solution C;
s4: adding hydrogen peroxide into the mixed solution C, and stirring to obtain an organic acid super-roughening aqueous solution;
wherein, 30g/L of copper chloride, 104g/L of tannic acid, 43g/L of sodium acetate, 18g/L of guanidine hydrochloride, 28g/L of hydrogen peroxide, 8.4g/L of aminotriazole, 12.4g/L of triethanolamine, 1.1g/L of sodium silicate, 1.4g/L of diethylenetriamine penta-methylene phosphonic acid and 2.8g/L of polymethacrylic acid; the pH value of the organic acid super-roughening aqueous solution is 2.5, and the density is 1.38g/cm 3;
step 3: soaking the circuit board in organic acid super-roughening aqueous solution at 30deg.C for 4.5min, taking out, baking at 78deg.C to dryness, crosslinking in 2.8% glutaraldehyde solution for 1.75min, and oven drying again for use.
Example 8: a super roughening process of a circuit board comprises the following steps:
step 1: cleaning the board surface of the circuit board, and washing for later use;
Step 2: preparing an organic acid super-roughening aqueous solution:
s1: mixing tannic acid, deionized water and chitosan, and stirring for dissolving to obtain a mixed solution A;
S2: adding copper chloride, sodium silicate, diethylenetriamine penta-methylene phosphonic acid and polymethacrylic acid into the mixed solution A, and uniformly stirring to obtain a mixed solution B;
s3: adding sodium acetate, guanidine hydrochloride, aminotriazole and triethanolamine into the mixed solution B and mixing to obtain a mixed solution C;
s4: adding hydrogen peroxide into the mixed solution C, and stirring to obtain an organic acid super-roughening aqueous solution;
Wherein, 33g/L of copper chloride, 110g/L of tannic acid, 46g/L of sodium acetate, 18.4g/L of guanidine hydrochloride, 24g/L of hydrogen peroxide, 8.5g/L of aminotriazole, 13.4g/L of triethanolamine, 1.85g/L of sodium silicate, 1.76g/L of diethylenetriamine penta-methylene phosphonic acid and 2.84g/L of polymethacrylic acid; the pH value of the organic acid super-roughening aqueous solution is 2.2, and the density is 1.45g/cm 3;
step 3: soaking the circuit board in organic acid super-roughening aqueous solution at 32deg.C for 4.5min, taking out, baking at 77 deg.C to dryness, crosslinking in 3% glutaraldehyde solution for 1.95min, and oven drying again for use.
Example 9: a super roughening process of a circuit board comprises the following steps:
step 1: cleaning the board surface of the circuit board, and washing for later use;
Step 2: preparing an organic acid super-roughening aqueous solution:
s1: mixing tannic acid, deionized water and chitosan, and stirring for dissolving to obtain a mixed solution A;
S2: adding copper chloride, sodium silicate, diethylenetriamine penta-methylene phosphonic acid and polymethacrylic acid into the mixed solution A, and uniformly stirring to obtain a mixed solution B;
s3: adding sodium acetate, guanidine hydrochloride, aminotriazole and triethanolamine into the mixed solution B and mixing to obtain a mixed solution C;
s4: adding hydrogen peroxide into the mixed solution C, and stirring to obtain an organic acid super-roughening aqueous solution;
Wherein, 40g/L of copper chloride, 120g/L of tannic acid, 50g/L of sodium acetate, 20g/L of guanidine hydrochloride, 35g/L of hydrogen peroxide, 10g/L of aminotriazole, 15g/L of triethanolamine, 2g/L of sodium silicate, 2g/L of diethylenetriamine penta-methylene phosphonic acid and 3g/L of polymethacrylic acid; the pH value of the organic acid super-roughening aqueous solution is 2.0, and the density is 1.5g/cm 3;
step 3: soaking the circuit board in organic acid super-roughening aqueous solution at 35 ℃ for 5min, taking out, baking at 80 ℃ until the circuit board is dried, putting into 2% glutaraldehyde solution for crosslinking for 2min, and drying again for later use.
Comparative example 1: the other parameters were the same as in example 1 without chitosan addition.
Step 1: cleaning the board surface of the circuit board, and washing for later use;
Step 2: preparing an organic acid super-roughening aqueous solution:
s1: stirring and dissolving tannic acid and deionized water to obtain a mixed solution A;
S2: adding copper chloride, sodium silicate, diethylenetriamine penta-methylene phosphonic acid and polymethacrylic acid into the mixed solution A, and uniformly stirring to obtain a mixed solution B;
s3: adding sodium acetate, guanidine hydrochloride, aminotriazole and triethanolamine into the mixed solution B and mixing to obtain a mixed solution C;
s4: adding hydrogen peroxide into the mixed solution C, and stirring to obtain an organic acid super-roughening aqueous solution;
Wherein, 10g/L of copper chloride, 80g/L of tannic acid, 30g/L of sodium acetate, 10g/L of guanidine hydrochloride, 15g/L of hydrogen peroxide, 5g/L of aminotriazole, 10g/L of triethanolamine, 1g/L of sodium silicate, 1g/L of diethylenetriamine penta-methylene phosphonic acid and 2g/L of polymethacrylic acid; the pH value of the organic acid super-roughening aqueous solution is 3.0, and the density is 1.14g/cm 3;
Step 3: soaking the circuit board in organic acid super-roughening aqueous solution at 25deg.C for 3min, taking out, baking at 70deg.C to dryness, crosslinking in 2% glutaraldehyde solution for 1min, and oven drying again for use.
Comparative example 2: sulfuric acid was used instead of tannic acid.
Step 1: cleaning the board surface of the circuit board, and washing for later use;
Step 2: preparing a super-roughening aqueous solution:
S1: mixing sulfuric acid, deionized water and chitosan, and stirring and dissolving to obtain a mixed solution A;
S2: adding copper chloride, sodium silicate, diethylenetriamine penta-methylene phosphonic acid and polymethacrylic acid into the mixed solution A, and uniformly stirring to obtain a mixed solution B;
s3: adding sodium acetate, guanidine hydrochloride, aminotriazole and triethanolamine into the mixed solution B and mixing to obtain a mixed solution C;
S4: adding hydrogen peroxide into the mixed solution C, and stirring to obtain a super-coarsening aqueous solution;
Wherein, 12g/L of copper chloride, 85g/L of tannic acid, 33g/L of sodium acetate, 11g/L of guanidine hydrochloride, 17g/L of hydrogen peroxide, 5g/L of aminotriazole, 11g/L of triethanolamine, 1.5g/L of sodium silicate, 1.4g/L of diethylenetriamine pentamethylene phosphonic acid and 2.2g/L of polymethacrylic acid are used for obtaining super-roughening aqueous solution; the pH of the super-roughening aqueous solution is 2.89, and the density is 1.14g/cm 3;
step 3: soaking the circuit board in super-roughening aqueous solution at 25deg.C for 3.5min, taking out, baking at 70deg.C to dryness, crosslinking in 2.2% glutaraldehyde solution for 1min, and oven drying again for use.
Experiment:
① Copper surface roughness of the printed wiring boards was measured using a white light interferometer, 5 points were taken for each printed wiring board (front or back), and Δra value (Ra: contour arithmetic mean difference) and Δrz value (Rz: microscopic unevenness ten-point mean height), Δvalue= (maximum-minimum)/mean value were measured, respectively. The larger the delta value is, the more uneven the coarsening of the copper surface is, and the more uneven the coarsening of the copper surface is, the larger the color difference of the copper surface is;
② The solder resist ink with the thickness of 25 mu m is coated, pre-baked for 3 hours at 80 ℃ and baked for 1 hour at 155 ℃ to finish curing. The adhesion test method is carried out by referring to patent TW201806756A, cuts are cut on the surface of the solidified solder resist ink at intervals of 1cm, after washing and drying, 3M600 series is attached to the surface of a solder resist ink film, stripping is carried out, and specific evaluation standards are as follows:
4, the following steps: maintaining the adhesion state of the solder resist ink film and the copper surface;
3, the method comprises the following steps: resist is stripped from the copper along the kerf portions;
2, the method comprises the following steps: stripping the adhesive film of the solder resist ink from the copper at the notch portion and the peripheral portion;
1, the method comprises the following steps: even if the resist is peeled off from the copper except for the notch portion and the peripheral portion thereof.
Conclusion:
examples 1-9 show that after the super-roughening treatment is carried out on the copper surface by the super-roughening aqueous solution provided by the invention, the roughening uniformity of the copper surface is effectively improved, a uniform micro-honeycomb roughening morphology is formed, the roughness of the copper surface can completely meet the production requirement, and the color difference of the copper surface is obviously reduced.
The data of example 1 and comparative example 1 show that tannic acid has good corrosion inhibition effect compared with sulfuric acid, so that the roughening morphology effect on the copper surface is more uniform; the data of example 2 and comparative example 2 show that after chitosan is added, the chitosan can further form a film layer on the surface of copper, so that the density of the tannic acid conversion film layer is improved, and the roughening effect is better.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A super roughening process of a circuit board is characterized in that: the method comprises the following steps:
step 1: cleaning the board surface of the circuit board, and washing for later use;
Step 2: preparing an organic acid super-roughening aqueous solution; the preparation method of the organic acid super-roughening aqueous solution comprises the following steps:
s1: mixing tannic acid, deionized water and chitosan, and stirring for dissolving to obtain a mixed solution A;
S2: adding copper chloride, sodium silicate, diethylenetriamine penta-methylene phosphonic acid and polymethacrylic acid into the mixed solution A, and uniformly stirring to obtain a mixed solution B;
s3: adding sodium acetate, guanidine hydrochloride, aminotriazole and triethanolamine into the mixed solution B and mixing to obtain a mixed solution C;
s4: adding hydrogen peroxide into the mixed solution C, and stirring to obtain an organic acid super-roughening aqueous solution;
Step 3: and (3) soaking the circuit board in an organic acid super-roughening aqueous solution, taking out, baking until the circuit board is dried, putting the circuit board into glutaraldehyde solution for crosslinking, and drying the circuit board again for later use.
2. The process for super-roughening a circuit board according to claim 1, wherein: in the step 2, the pH value of the organic acid super-roughening aqueous solution is 2.0-3.0.
3. The process for super-roughening a circuit board according to claim 1, wherein: in the step 2, the density of the organic acid super-roughening aqueous solution in the organic acid super-roughening aqueous solution is 1.1-1.5 g/cm 3.
4. The process for super-roughening a circuit board according to claim 1, wherein: in the step 3, the soaking temperature is 25-35 ℃.
5. The process for super-roughening a circuit board according to claim 1, wherein: in the step 3, the soaking time is 3-5 min.
6. The process for super-roughening a circuit board according to claim 1, wherein: in the step 3, the baking temperature is 70-80 ℃.
7. The process for super-roughening a circuit board according to claim 1, wherein: in the step 3, the mass concentration of glutaraldehyde solution is 2-3%.
8. The process for super-roughening a circuit board according to claim 1, wherein: in the step 3, the crosslinking time is 1-2 min.
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| CN109548306A (en) * | 2018-11-30 | 2019-03-29 | 广东骏亚电子科技股份有限公司 | Welding resistance pre-treating technology |
| CN111235576A (en) * | 2020-01-15 | 2020-06-05 | 浙江大学 | Method and application of constructing micro-nano-porous organic acid pretreatment layer on metal surface |
| CN112962128A (en) * | 2021-01-29 | 2021-06-15 | 山东金宝电子股份有限公司 | Coarsening process method of high-peeling-resistance copper foil |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7156904B2 (en) * | 2003-04-30 | 2007-01-02 | Mec Company Ltd. | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby |
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| JP2000098630A (en) * | 1998-09-24 | 2000-04-07 | Fuji Yakuhin Kogyo Kk | Pattern forming method with water-soluble photoresist composition |
| WO2005086551A1 (en) * | 2004-03-03 | 2005-09-15 | Ibiden Co., Ltd. | Etching solution, method of etching and printed wiring board |
| CN107267986A (en) * | 2016-04-08 | 2017-10-20 | 东莞市斯坦得电子材料有限公司 | A kind of super roughening process of organic acid for printed wiring board welding resistance film layer pre-treatment |
| CN109548306A (en) * | 2018-11-30 | 2019-03-29 | 广东骏亚电子科技股份有限公司 | Welding resistance pre-treating technology |
| CN111235576A (en) * | 2020-01-15 | 2020-06-05 | 浙江大学 | Method and application of constructing micro-nano-porous organic acid pretreatment layer on metal surface |
| CN112962128A (en) * | 2021-01-29 | 2021-06-15 | 山东金宝电子股份有限公司 | Coarsening process method of high-peeling-resistance copper foil |
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