CN117222101A

CN117222101A - Printed circuit board and electronic equipment

Info

Publication number: CN117222101A
Application number: CN202311317659.5A
Authority: CN
Inventors: 徐永杜
Original assignee: Xian Yep Telecommunication Technology Co Ltd
Current assignee: Xian Yep Telecommunication Technology Co Ltd
Priority date: 2023-10-11
Filing date: 2023-10-11
Publication date: 2023-12-12

Abstract

The application provides a printed circuit board and electronic equipment, wherein the printed circuit board comprises a first wiring layer, a second wiring layer and a reference layer which are arranged in a stacked manner; the first wiring layer is provided with two first transmission lines, the second wiring layer is provided with two second transmission lines, the reference layer is provided with an anti-bonding pad, two via holes are arranged in the anti-bonding pad, the two first transmission lines are respectively connected with the two via holes through the bonding pad, and the two second transmission lines are respectively connected with the two via holes through the bonding pad; the first transmission line and the second transmission line are positioned on the same side of the two through holes; in the thickness direction of the printed circuit board, a first included angle is formed between the projection of a first transmission line and the projection of a second transmission line connected with the same via. The impedance of the printed circuit board at the via hole is increased, the impedance requirement is met, the impedance discontinuity point is reduced, and the signal transmission quality is improved.

Description

Printed circuit board and electronic equipment

Technical Field

The present application relates to the field of printed circuit boards, and in particular, to a printed circuit board and an electronic device.

Background

In storage and server products, as the product is upgraded, signal rate increases, signal quality requirements are also increasing, and board routing densities are also increasing. As the wiring density and the signal transmission rate are continuously improved, the requirements on signal integrity are higher and higher, and for high-speed transmission lines, the wiring is performed in a differential signal transmission mode so as to reduce common mode interference.

In the related art, a printed circuit board comprises two wiring layers, a plurality of reference layers and a pair of via holes, wherein an anti-bonding pad is arranged on the reference layers, the via holes are arranged in the anti-bonding pad, and each via hole is connected with a first transmission line of one wiring layer and a second transmission line of the other wiring layer through the bonding pad. In order to reduce wiring space, some printed circuit boards adopt a mode of wire outgoing in the same direction, namely, two first transmission lines and two second transmission lines are positioned on the same side of a connecting wire between two through holes.

However, the impedance of the via hole is low, and there is an impedance discontinuity point, which affects the signal transmission quality.

Disclosure of Invention

Based on the above, the application provides a printed circuit board and electronic equipment, which are used for solving the problems that the impedance of a via hole is low, impedance discontinuity points exist and the signal transmission quality is affected in the related technology.

In one aspect, the application provides a printed circuit board, comprising a first wiring layer, a second wiring layer and a reference layer which are arranged in a stacked manner;

the first wiring layer is provided with two first transmission lines, the second wiring layer is provided with two second transmission lines, the reference layer is provided with an anti-bonding pad, two via holes are arranged in the anti-bonding pad, the two first transmission lines are respectively connected with the two via holes through the bonding pad, and the two second transmission lines are respectively connected with the two via holes through the bonding pad;

the first transmission line and the second transmission line are positioned on the same side of the two through holes;

in the thickness direction of the printed circuit board, a first included angle is formed between the projection of a first transmission line and the projection of a second transmission line connected with the same via.

In one possible implementation, the first transmission line includes a first connection segment connected to the via, and the second transmission line includes a second connection segment connected to the via; in the thickness direction of the printed circuit board, a first included angle is formed between the projection of the first connecting section and the projection of the second connecting section, and the first included angle is larger than or equal to 10 degrees.

In one possible implementation, the distance between two vias is greater than or equal to 35 mils, and the first included angle α1 satisfies: alpha 1 is more than or equal to 10 degrees and less than or equal to 45 degrees; a second included angle is formed between the connecting line between the two through holes and the first connecting section, and the second included angle alpha 2 meets the following conditions: alpha 2 is more than or equal to 45 degrees and less than or equal to 90 degrees; a third included angle is formed between the connecting line between the two through holes and the second connecting section, and the third included angle alpha 3 meets the following conditions: alpha 3 is more than or equal to 0 degree and less than or equal to 45 degrees.

In one possible implementation, the distance D between two vias satisfies: d is less than or equal to 28mil and less than 35mil;

the first connecting section is inclined to the connecting line between the two through holes, a second included angle is formed between the connecting line between the two through holes and the first connecting section, and the second included angle is larger than or equal to 90 degrees.

In one possible implementation, the first connection section extends in a width direction of the anti-pad, and an end of the first connection section remote from the via extends to an edge of the anti-pad.

In one possible implementation, the distance D between two vias satisfies: d < 28mil;

the first connecting sections extend along the length direction of the anti-bonding pad, and the two first connecting sections are respectively positioned at one side of the two via holes opposite to each other;

the first included angle α1 satisfies: alpha 1 is more than or equal to 90 degrees and less than or equal to 180 degrees.

In one possible implementation manner, the first transmission line further includes a third connection section and a fourth connection section, one end of the third connection section is connected with one end of the first connection section away from the via hole, the other end of the third connection section is connected with one end of the fourth connection section, the third connection section extends along the width direction of the anti-pad, and an included angle is formed between the fourth connection section and the third connection section.

In one possible embodiment, the projection of the third connection section in the direction of the thickness of the printed circuit board and the projection of the fourth connection section in the direction of the thickness of the printed circuit board are both located outside the anti-pad.

In one possible implementation, the distance between the projection of the fourth connection segment and the anti-pad is greater than or equal to 3 mils in the thickness direction of the printed circuit board.

On the other hand, the application also provides electronic equipment, which comprises the printed circuit board.

According to the printed circuit board and the electronic equipment provided by the application, the two through holes of the printed circuit board are positioned in the anti-bonding pad of the reference layer, the reference layer is not arranged between the two through holes, the reference surface between the two through holes is reduced, and the parasitic capacitance between the two through holes is reduced. The first transmission line and the second transmission line are positioned on the same side of the two through holes, so that the wiring space of the printed circuit board is reduced, and wiring of the printed circuit board is facilitated. The differential signal may be transmitted through two first transmission lines and two second transmission lines. In the thickness direction of the printed circuit board, a first included angle is formed between the projection of the first transmission line and the projection of the second transmission line, which are connected with the same via hole, and the arrangement avoids the partial overlapping of the first transmission line and the second transmission line in the anti-bonding pad, reduces mutual capacitance and crosstalk between the first transmission line and the second transmission line, which are connected with the same via hole, and improves the impedance of the via hole. Therefore, the impedance of the printed circuit board at the via hole is increased, the impedance requirement is met, the impedance discontinuity point is reduced, and the signal transmission quality is improved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural view of a related art printed circuit board;

FIG. 2 is a schematic diagram of the impedance simulation results of the printed circuit board shown in FIG. 1;

fig. 3 is a schematic structural diagram of a printed circuit board according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of another printed circuit board according to an embodiment of the present application;

FIG. 5 is a schematic diagram of the impedance simulation results of the printed circuit board shown in FIG. 4;

fig. 6 is a schematic structural diagram of another printed circuit board according to an embodiment of the present application;

fig. 7 is a schematic diagram of an impedance simulation result of the printed circuit board shown in fig. 6.

Reference numerals illustrate:

10-a first reference layer; 11-a first anti-pad;

20-a second reference layer; 21-a second anti-pad;

100-a first transmission line; 110-a first connection section; 120-a third connecting section; 130-a fourth connection section; 140-line segments; 150-a second coupling section;

200-a second transmission line; 210-a second connection section; 220-a first coupling section;

300-reference layer; 310-anti-pad;

400-via holes; 410-pads.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions in the preferred embodiments of the present application will be described in more detail with reference to the accompanying drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals refer to the same or similar components or components having the same or similar functions throughout. The described embodiments are some, but not all, embodiments of the application. The embodiments described below by referring to the drawings are illustrative and intended to explain the present application and should not be construed as limiting the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application. Embodiments of the present application will be described in detail below with reference to the accompanying drawings.

In the description of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, indirectly connected through an intermediary, or may be in communication with each other between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present application, it should be understood that the terms "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship of the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.

The terms first, second, third and the like in the description and in the claims and in the above-described figures, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or display that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or display.

In the prior art, as shown in fig. 1, a printed circuit board includes two trace layers, two vias 400, a first reference layer 10 and a second reference layer 20. One of the wiring layers is provided with two first transmission lines 100, the other wiring layer is provided with two second transmission lines 200, the first reference layer 10 is provided with a first anti-bonding pad 11, the second reference layer 20 is provided with two second anti-bonding pads 21, the two second anti-bonding pads 21 are positioned in the first anti-bonding pad 11, and each second anti-bonding pad 21 is provided with a through hole 400. The two first transmission lines 100 are connected to the two vias 400, respectively, and the two second transmission lines 200 are also connected to the two vias 400, respectively. Although the crosstalk between the two wiring layers is reduced by providing the first anti-pad 11 and the second anti-pad 21, the portion of the second reference layer 20 located between the two second anti-pads 21 makes the parasitic capacitance of the via 400 larger, and the portions of the first transmission line 100 and the second transmission line 200 connected to the same via 400 located within the first anti-pad 11 overlap, which results in a lower impedance at the via 400, deviating from the actual target value. Fig. 2 shows that the impedance at via 400 is 72.74 ohms, whereas the target value of the impedance at via 400 is 85 ohms, with a deviation of 12.26 ohms. The requirements of the printed circuit board at the via 400 are 85ohm + -10%, i.e., the impedance requirements at the via 400 are in the range of 76.5ohm-93.5ohm, and the impedance of the printed circuit board at the via 400 shown in fig. 1 is below the lower limit of the impedance requirements.

Through repeated thinking and verification, the inventor finds that if an anti-bonding pad is arranged on the reference layer, two through holes are positioned in the anti-bonding pad, the reference layer is prevented from being arranged between the two through holes, the reference surface between the two through holes is reduced, and parasitic capacitance between the two through holes is further reduced. Meanwhile, the parts of the first transmission line and the second transmission line which are connected with the same via hole and positioned in the anti-bonding pad are staggered, so that mutual capacitance and crosstalk between the first transmission line and the second transmission line are reduced. The arrangement can improve the impedance of the printed circuit board at the position of the through hole, reduce impedance discontinuity points and improve the signal transmission quality.

In view of this, the inventor has devised a printed circuit board and electronic equipment, this printed circuit board sets up an antipad on the reference layer, and two via holes all set up in this antipad, and the first transmission line that links to each other with same via hole and second transmission line set up the contained angle between the part in antipad, reduce mutual appearance and crosstalk between two via holes and between first transmission line and the second transmission line, improve the impedance of printed circuit board in the via hole department.

The following describes in detail the technical solution of the printed circuit board and the electronic device provided by the embodiment of the application with reference to the accompanying drawings.

Referring to fig. 3 to 7, a printed circuit board according to an embodiment of the present application includes a first trace layer, a second trace layer, and a reference layer 300 that are stacked. The first routing layer is provided with two first transmission lines 100 and the second routing layer is provided with two second transmission lines 200. The reference layer 300 is provided with an Anti-pad 310 (Anti-pad), two vias 400 are provided in the Anti-pad 310, two first transmission lines 100 are connected to the two vias 400 through pads 410 (pad), respectively, and two second transmission lines 200 are connected to the two vias 400 through pads 410, respectively. The first transmission line 100 and the second transmission line 200 are located on the same side of the two vias 400. In the thickness direction of the printed circuit board, a first angle is formed between the projection of the first transmission line 100 and the projection of the second transmission line 200 connected to the same via 400.

The two vias 400 are differential vias, and each via 400 is provided with two pads 410, wherein one pad 410 is connected with the first transmission line 100, and the other pad 410 is connected with the second transmission line 200.

The number of reference layers 300 is not limited in this embodiment, and the anti-pads 310 on each reference layer 300 overlap each other in the thickness direction of the printed circuit board. It can be appreciated that the anti-pad 310 is a hollowed-out area on the reference layer 300, and the two vias 400 are all disposed through the anti-pad 310, so that the reference layer 300 and the vias 400 are isolated by the anti-pad 310, and short circuits are avoided. The anti-pad 310 is oblong in shape, specifically, the anti-pad 310 is formed by mutually communicating two circular hole sites, and the radii of the two hole sites are both R. Illustratively, the portions of the two first transmission lines 100 located within the anti-pad 310 are symmetrically disposed, and the portions of the two second transmission lines 200 located within the anti-pad 310 are symmetrically disposed, so as to facilitate transmission of differential signals through the two first transmission lines 100 and the two second transmission lines 200.

It should be noted that, in the anti-pad 310, the two second transmission lines 200 are located between the two first transmission lines 100, so that the space between the portions of the two first transmission lines 100 located in the anti-pad 310 is increased, the mutual capacitance and crosstalk between the two first transmission lines 100 are reduced, and the impedance of the printed circuit board at the via 400 is improved.

It will be appreciated that the first included angle staggers the first transmission line 100 and the second transmission line 200 connected to the same via 400, reducing mutual capacitance and crosstalk between the first transmission line 100 and the second transmission line 200.

The connection line between the two vias 400 is defined as L1, and the two first transmission lines 100 and the two second transmission lines 200 are located on the same side of L1, that is, the printed circuit board adopts the mode of wire outgoing in the same direction at the via 400, which is beneficial to reducing the wiring space of the printed circuit board and reducing the area of the printed circuit board.

According to the printed circuit board provided by the application, the two through holes 400 are positioned in the anti-bonding pad 310 of the reference layer 300, the reference layer 300 does not exist between the two through holes 400, the reference surface between the two through holes 400 is reduced, and the parasitic capacitance between the two through holes 400 is reduced. The first transmission line 100 and the second transmission line 200 are located at the same side of the two vias 400, which is advantageous for reducing the wiring space of the printed circuit board and facilitating the wiring of the printed circuit board. The differential signal may be transmitted through the two first transmission lines 100 and the two second transmission lines 200. In the thickness direction of the printed circuit board, a first included angle is formed between the projection of the first transmission line 100 and the projection of the second transmission line 200 connected to the same via 400, so that the arrangement avoids the overlapping of the parts of the first transmission line 100 and the second transmission line 200 in the anti-pad 310, reduces mutual capacitance and crosstalk between the first transmission line 100 and the second transmission line 200 connected to the same via 400, and improves the impedance of the via 400. Thus, the impedance of the printed circuit board at the via 400 is increased and meets the impedance requirement, thereby reducing the impedance discontinuity point and improving the signal transmission quality.

In one embodiment, as shown in fig. 3, 4 and 6, the first transmission line 100 includes a first connection segment 110 connected to the via 400, and the second transmission line 200 includes a second connection segment 210 connected to the via 400. In the thickness direction of the printed circuit board, a first included angle is formed between the projection of the first connection section 110 and the projection of the second connection section 210, and the first included angle is greater than or equal to 10 °.

The first connection section 110 and the second connection section 210 are both inclined to the connection line L1 between the two vias 400, and the length of the first connection section 110 may be set according to the interval between the two vias 400. Illustratively, both second connection segments 210 are located inside the anti-pad 310, and each second transmission line 200 further includes a first coupling segment 220 connected to an end of the second connection segment 210 remote from the via 400, each first coupling segment 220 extending along a width direction of the anti-pad 310, and the two first coupling segments 220 are coupled to each other.

Illustratively, the projection of the first connecting segment 110 and the projection of the second connecting segment 210 have a first included angle α1, and α1 is greater than or equal to 10 °. The above arrangement can stably reduce mutual capacitance and crosstalk between the first transmission line 100 and the second transmission line 200, and improve impedance of the printed circuit board at the via 400.

In a particular embodiment, the distance D between two vias 400 is greater than or equal to 35 mils. The first included angle α1 satisfies: alpha 1 is more than or equal to 10 degrees and less than or equal to 45 degrees. The connection line between the two vias 400 and the first connection section 110 have a second included angle, and the second included angle α2 satisfies: alpha 2 is more than or equal to 45 degrees and less than or equal to 90 degrees. A third included angle is formed between the connection line between the two vias 400 and the second connection section 210, and the third included angle α3 satisfies: alpha 3 is more than or equal to 0 degree and less than or equal to 45 degrees.

The specific sizes of α1, α2, and α3 may be set according to the distance D between the two vias 400, which is not limited herein. Illustratively, the first transmission line 100 further includes a second coupling segment 150, an end of the second coupling segment 150 being connected to an end of the first connection segment 110 remote from the via 400. Wherein the second coupling segments 150 may extend in the width direction of the anti-pad 310, and the two second coupling segments 150 are coupled to each other. Fig. 1 shows that the end of the first connection segment 110 away from the via 400 extends beyond the anti-pad 310, which can reduce the length of the uncoupled portion of the two first transmission lines 100, which is beneficial for improving the anti-interference capability of the signal.

It should be noted that when D is greater than or equal to 35mil, the difference between the impedance of the printed circuit board at the via 400 and the target value is smaller, and the end of the first connection segment 110 away from the via 400 exceeds the anti-pad 310, which is more beneficial to make the impedance of the printed circuit board at the via 400 closer to the target value.

By performing impedance simulations on the printed circuit board shown in fig. 3, the impedance of the printed circuit board at the via 400 meets the 85ohm + -10% requirement.

Through the arrangement, when D is more than or equal to 35mil, the impedance of the printed circuit board at the via 400 is improved, so that the impedance of the printed circuit board at the via 400 meets 85ohm + -10%, and the impedance of the printed circuit board at the via 400 is closer to a target value, so that the signal transmission quality is ensured.

In a specific embodiment, as shown in fig. 4, the distance D between two vias 400 satisfies: d is more than or equal to 28mil and less than 35mil. The first connection section 110 is inclined to the connection line L1 between the two vias 400, and a second included angle is formed between the connection line L1 between the two vias 400 and the first connection section 110, and the second included angle is greater than or equal to 90 °.

It is understood that the first connection section 110 extends in the width direction of the anti-pad 310 when the second included angle α2 is equal to 90 °. When α2 is greater than 90 °, the distance between the two first connection sections 110 gradually increases from the via 400 toward the second coupling section 150.

In one possible implementation, as shown in fig. 4, the first transmission line 100 further includes a trace segment 140, where one end of the trace segment 140 is connected to an end of the first connection segment 110 remote from the via 400, and the other end of the trace segment 140 is connected to the second coupling segment 150. The third angle α3 may be, for example, 45 °.

It is worth mentioning that the difference between the impedance of the printed circuit board at the via 400 and the target value is greater when 28mil < D < 35mil than when D > 35mil. It will be appreciated that the first included angle in the printed circuit board shown in fig. 4 is greater than the first included angle in the printed circuit board shown in fig. 3, that is, the mutual capacitance and crosstalk between the first transmission line 100 and the second transmission line 200 connected to the same via 400 are further reduced.

With the structure, when D is less than or equal to 28mil and less than 35mil, the impedance of the printed circuit board at the position of the through hole 400 can meet the requirement of 85ohm + -10%, and the signal transmission quality is ensured.

In a more specific embodiment, as shown in fig. 4, the first connection section 110 extends in the width direction of the anti-pad 310, and an end of the first connection section 110 remote from the via 400 extends to an edge of the anti-pad 310.

Wherein the second angle α2 is equal to 90 °, optionally α1=α3=45°. Fig. 4 shows that the length d of the first connection section 110=the hole site radius R of the anti-pad 310—the outer diameter R of the pad 410, and the length of the first connection section 110 can avoid the abrupt impedance change caused by the increased wiring inductance, that is, the length of the first connection section 110 and the size of the second included angle α2 can avoid the increase of the impedance of the printed circuit board at the via 400 beyond the upper limit of the impedance requirement.

Fig. 5 shows that the impedance of the printed circuit board at the via 400 is 83.66 ohms, with a target value of 85 ohms, meeting the 85ohm + 10% impedance requirement.

Through the arrangement, the impedance of the printed circuit board at the via 400 is ensured not to exceed the upper limit of the impedance requirement when D is less than or equal to 28mil and less than 35mil, and the impedance of the printed circuit board at the via 400 is ensured to meet the requirement of 85ohm +/-10%.

In a specific embodiment, as shown in fig. 6, the distance D between two vias 400 satisfies: d < 28mil. The first connection sections 110 extend along the length direction of the anti-pad 310, and the two first connection sections 110 are respectively located at opposite sides of the two vias 400. The first included angle α1 satisfies: alpha 1 is more than or equal to 90 degrees and less than or equal to 180 degrees.

It will be appreciated that in the length direction of the anti-pad 310, two vias 400 are located between two first connection segments 110. Wherein, the included angle between the connection line L1 between the two through holes 400 and the projection of the second connection section 210 is smaller than or equal to 90 degrees, and then alpha 1 satisfies 90 degrees more than or equal to alpha 1 degrees less than or equal to 180 degrees.

It is worth mentioning that the difference between the impedance of the printed circuit board at the via 400 and the target value is greater than the difference between the impedance of the printed circuit board at the via 400 and the target value when D < 28mil is greater than 28mil < D < 35mil. It will be appreciated that the first included angle in the printed circuit board shown in fig. 6 is greater than the first included angle in the printed circuit board shown in fig. 4, that is, the mutual capacitance and crosstalk between the first transmission line 100 and the second transmission line 200 connected to the same via 400 are further reduced.

With this structure, as shown in fig. 6 and 7, when D < 28mil, the above arrangement can make the impedance of the printed circuit board at the via 400 meet the requirement of 85ohm±10%, thereby ensuring the signal transmission quality.

In a more specific embodiment, as shown in fig. 6, the first transmission line 100 further includes a third connection section 120 and a fourth connection section 130. One end of the third connecting section 120 is connected to one end of the first connecting section 110 away from the via 400, and the other end of the third connecting section 120 is connected to one end of the fourth connecting section 130. The third connection section 120 extends in the width direction of the anti-pad 310, and an included angle is formed between the fourth connection section 130 and the third connection section 120.

The lengths of the third connecting section 120 and the fourth connecting section 130 may be set according to needs, which are not limited herein. It will be appreciated that the angle between the third connection section 120 and the fourth connection section 130 is greater than 90 °, and the end of the fourth connection section 130 remote from the third connection section 120 is connected to the second coupling section 150.

The above arrangement may enable the two first transmission lines 100 to be coupled as soon as possible after protruding from the anti-pad 310 and the two first transmission lines 100 and the two second transmission lines 200 to be located on the same side of the connection line L1 between the two vias 400.

In one possible implementation, as shown in fig. 6 and 7, the projection of the third connection section 120 in the printed circuit board thickness direction and the projection of the fourth connection section 130 in the printed circuit board thickness direction are both located outside the anti-pad 310.

In one possible implementation, as shown in fig. 6, an end of the first connection segment 110 distal from the via 400 extends to the edge of the anti-pad 310, that is, the length d of the first connection segment 110 = the hole site radius R of the anti-pad 310-the outer diameter R of the pad 410. It will be appreciated that the fourth connection section 130 is used to connect the third connection section 120 and the second coupling section 150, and that the length of the third connection section 120 is set such that the projection of the third connection section 120 and the projection of the fourth connection section 130 are both located outside the anti-pad 310. The length of the third connection section 120 may be set according to the size of the anti-pad 310, which is not limited herein.

Through the arrangement, the third connecting section 120 and the fourth connecting section 130 can both correspond to the anti-bonding pad 310, so that the impedance of the printed circuit board at the via 400 is prevented from increasing too much to exceed the upper limit of the impedance requirement, and the impedance of the printed circuit board at the via 400 can meet the impedance requirement of 85ohm +/-10%.

With continued reference to fig. 6, in one embodiment, a distance d1 between the projection of the fourth connection segment 130 and the anti-pad 310 is greater than or equal to 3 mils in the thickness direction of the printed circuit board.

Through the arrangement, when the printed circuit board is assembled, the anti-bonding pad 310 can be prevented from covering the fourth connecting section 130 due to assembly tolerance, so that the projection of the fourth connecting section 130 can be ensured to be reliably positioned at the outer side of the anti-bonding pad 310, and the situation that the impedance of the printed circuit board at the through hole 400 is excessively increased to exceed the upper limit of the impedance requirement is avoided.

The application also provides electronic equipment comprising the printed circuit board.

According to the electronic equipment provided by the application, the printed circuit board is arranged at the position of the through hole 400 in the same direction, so that the area of the printed circuit board is smaller, and the size of the electronic equipment is reduced. The impedance of the printed circuit board at the via 400 is increased and meets the impedance requirement, the transmission quality of signals is high, and the reliability of the electronic equipment is high.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.

Claims

1. The printed circuit board is characterized by comprising a first wiring layer, a second wiring layer and a reference layer which are arranged in a stacked manner;

the first wiring layer is provided with two first transmission lines, the second wiring layer is provided with two second transmission lines, the reference layer is provided with an anti-bonding pad, two through holes are formed in the anti-bonding pad, the two first transmission lines are respectively connected with the two through holes through bonding pads, and the two second transmission lines are respectively connected with the two through holes through bonding pads;

and a first included angle is formed between the projection of the first transmission line and the projection of the second transmission line, which are connected with the same through hole, in the thickness direction of the printed circuit board.

2. The printed circuit board of claim 1, wherein the first transmission line comprises a first connection segment connected to the via and the second transmission line comprises a second connection segment connected to the via; and in the thickness direction of the printed circuit board, the first included angle is formed between the projection of the first connecting section and the projection of the second connecting section, and the first included angle is larger than or equal to 10 degrees.

3. The printed circuit board of claim 2, wherein a distance between two of the vias is greater than or equal to 35 mils, and wherein the first included angle α1 satisfies: alpha 1 is more than or equal to 10 degrees and less than or equal to 45 degrees; the connecting line between the two through holes and the first connecting section are provided with a second included angle, and the second included angle alpha 2 meets the following conditions: alpha 2 is more than or equal to 45 degrees and less than or equal to 90 degrees; a third included angle is formed between the connecting line between the two through holes and the second connecting section, and the third included angle alpha 3 meets the following conditions: alpha 3 is more than or equal to 0 degree and less than or equal to 45 degrees.

4. The printed circuit board of claim 2, wherein a distance D between two of the vias satisfies: d is less than or equal to 28mil and less than 35mil;

5. The printed circuit board of claim 4, wherein the first connection segment extends in a width direction of the anti-pad, and wherein an end of the first connection segment remote from the via extends to an edge of the anti-pad.

6. The printed circuit board of claim 2, wherein a distance D between two of the vias satisfies: d < 28mil;

the first connecting sections extend along the length direction of the anti-bonding pad, and the two first connecting sections are respectively positioned at one side of the two through holes opposite to each other;

7. The printed circuit board of claim 6, wherein the first transmission line further comprises a third connection section and a fourth connection section, one end of the third connection section is connected to one end of the first connection section away from the via hole, the other end of the third connection section is connected to one end of the fourth connection section, the third connection section extends in a width direction of the anti-pad, and an included angle is formed between the fourth connection section and the third connection section.

8. The printed circuit board of claim 7, wherein a projection of the third connection section in the printed circuit board thickness direction and a projection of the fourth connection section in the printed circuit board thickness direction are both located outside the anti-pad.

9. The printed circuit board of claim 8, wherein a distance between a projection of the fourth connection section and the anti-pad in a thickness direction of the printed circuit board is greater than or equal to 3 mils.

10. An electronic device comprising the printed circuit board of any one of claims 1-9.