CN117209205A - A kind of preparation method of pouring mica board - Google Patents
A kind of preparation method of pouring mica board Download PDFInfo
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- CN117209205A CN117209205A CN202311186508.0A CN202311186508A CN117209205A CN 117209205 A CN117209205 A CN 117209205A CN 202311186508 A CN202311186508 A CN 202311186508A CN 117209205 A CN117209205 A CN 117209205A
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Abstract
The application relates to a preparation method of a pouring mica plate, which belongs to the technical field of mica plate preparation and comprises the following steps: adding organic silica gel, a high-temperature resistant material, calcined kaolin and an organic solvent into the slurried cloud master batch, and stirring to obtain mica mixed slurry; pouring the prepared mica mixed slurry into a mold; and (5) placing the irrigated mould into a drying area for drying to obtain the mica plate. The application can reduce the possibility of the performance degradation of the mica plate caused by the layering phenomenon of the mica plate.
Description
Technical Field
The application relates to the technical field of mica plate preparation, in particular to a preparation method of a pouring mica plate.
Background
Since mica has a typical high resistance property, it is preferable as an insulating material and widely used in a wide range of fields such as electric appliances and electromechanics, and finished products of mica materials include mica paper, mica plate, mica powder and the like.
At present, the traditional mica plate is produced in the following way: the mica sheet is crushed and dissociated into a certain fine scale, the mica scale is processed into mica paper through a sizing and papermaking mode after the sizing agent is diluted, then the mica paper is coated with an organic adhesive, the solvent is removed through a tunnel dryer to obtain single Zhang Tujiao mica paper, the mica paper is cut into a certain size and then stacked into different thicknesses, and the mica paper is sent into a press for compression molding to obtain the mica sheet.
However, due to the manufacturing process, the mica paper layers in the mica plate are easy to be layered due to the fact that the glue coating and the adhesion of the mica paper are not firm or ageing, the environment humidity is too high, and the performance of the mica plate is seriously affected.
Disclosure of Invention
In order to reduce the possibility of the mica plate from layering and resulting in reduced performance of the mica plate, the application provides a method for preparing a poured mica plate.
The preparation method of the pouring mica plate provided by the application adopts the following technical scheme:
a method of making a poured mica sheet comprising the steps of:
adding organic silica gel, a high-temperature resistant material, calcined kaolin and an organic solvent into the slurried cloud master batch, and stirring to obtain mica mixed slurry; pouring the prepared mica mixed slurry into a mold; and (5) placing the irrigated mould into a drying area for drying to obtain the mica plate.
By adopting the technical scheme, the mica and the organic silica gel, the high-temperature resistant material, the calcined kaolin and other components are pulped to obtain mica mixed pulp, and then the mica mixed pulp is irrigated, dried and solidified to enable the mica plate to be integrally formed. Compared with the method that mica paper and mica paper are glued and laminated, the mica plate is integrally formed through baking oven curing, so that the possibility of performance degradation of the mica plate caused by layering of the mica plate is reduced.
The calcined kaolin has excellent high temperature resistance, dispersibility and plasticity, and can thicken the mica mixed slurry, so that the mica slurry is easier to form and is not easy to crack after being formed; and calcined kaolin has a high whiteness so that the formation of mica boards can maintain the white-colored characteristics. The high-temperature resistant material can improve the high-temperature insulation performance of the mica plate, and gaps among mica particles are filled by high-temperature resistant material particles so as to improve the strength of the mica plate. The silicon dioxide obtained by decomposing the organic silica gel can form a eutectic mixture with mica at the edge of the filler so as to play a bridging role between the silicon dioxide particles and the filler particles, so that a ceramic product is formed on the surface of the mica, and the ceramic body has self-supporting property, so that the mechanical property of the surface of the mica plate can be improved, and the surface of the mica plate is not easy to crack; and aluminum silicate in the calcined kaolin is decomposed at high temperature to obtain silicon dioxide, so that the degree of forming a ceramic product on the surface of the mica plate can be further improved, and the mechanical property of the mica plate is further improved.
Optionally, the weight parts of each component in the mica mixed slurry are as follows:
80-90 parts of mica, 10-20 parts of high temperature resistant material, 15-25 parts of calcined kaolin, 28-32 parts of organic silica gel, 18-22 parts of organic solvent, and 1-3 parts of moisture-proof agent and 1-3 parts of curing agent.
By adopting the technical scheme, the mica plate prepared by the components has relatively better insulating property, high temperature resistance and mechanical property. Mica contents below the range values may cause deterioration of the mica board insulation properties, and mica boards above the range values may cause deterioration of the strength of the mica boards; the organic silica gel is lower than the range value, so that the mica plate is cracked, and the surface of the mica plate is reversely stuck when the organic silica gel is higher than the range value; a high temperature resistant material lower than the range value may cause deterioration of the high temperature insulation property of the mica board, and a high temperature resistant material higher than the range value may cause deterioration of the strength of the mica board; calcined kaolin below the range values may cause cracking of the mica board and above the range values may cause roughness of the mica board surface.
Optionally, the high temperature resistant material is selected from one of silicon nitride, aluminum nitride, boron nitride, molybdenum disilicide, and aluminum oxide.
Through adopting above-mentioned technical scheme, above-mentioned material all has good high temperature resistance, electrical insulation property to have better dispersibility and homogeneity, can evenly disperse in mica mixed slurry, make after the mica board shaping to the clearance between the mica granule carry out more comprehensively filling, with the high temperature insulation and the intensity to the mica board that promote better.
Optionally, the high temperature resistant material has a particle size in the range 1240-1260 mesh.
Through adopting above-mentioned technical scheme, the particle diameter scope of above-mentioned high temperature resistant material can make the high temperature resistant material granule more abundant to the packing of clearance between the mica board granule to can promote the intensity of mica board better.
Optionally, the calcined kaolin has a particle size in the range of 1900-2100 mesh.
By adopting the technical scheme, the particle size range of the calcined kaolin can enable the calcined kaolin to be more uniformly distributed in the mica mixed slurry after being stirred, so that cracks are not easy to occur on the surfaces of all parts of the formed mica plate; and the particle size range of the calcined kaolin can lead the surface of the mica plate to be finer and smoother.
Optionally, the stirring speed in the step of preparing the mica mixed slurry is more than or equal to 500 revolutions per minute, and the stirring time is more than or equal to 60 minutes.
By adopting the technical scheme, when the stirring speed is lower than 500 revolutions and the stirring time is lower than 60 minutes, the stirring treatment uniformity of each component is poor, so that the high temperature resistance, the insulation and the mechanical properties of the finally prepared mica plate are unstable.
Optionally, the drying area is divided into a solvent drying area, a curing area and a surface curing area, and the drying time of each area is 4-6min.
By adopting the technical scheme, the solvent drying area is used for drying the organic solvent in the mica mixed slurry, the curing area is used for drying and curing all components in the mica mixed slurry, and the surface curing area is used for further curing the initially cured mica plate and enabling the surface of the mica plate to be completely film-formed.
Optionally, the temperature of the solvent drying area is 80-100 ℃.
By adopting the technical scheme, the temperature of the solvent drying area is lower than the range value, the organic solvent can be difficult to dry, and the temperature of the solvent drying area is higher than the range value, so that the surface of mica mixed slurry in the die can form ceramic products prematurely to cause the surface to start film formation, and evaporated organic solvent gas cannot volatilize, so that bubbles can be formed on the surface of a finally formed mica plate, and the quality of the mica plate is affected.
Optionally, the temperature of the curing zone is 120 ℃ to 140 ℃.
By adopting the technical scheme, the temperature of the curing zone is lower than the range value, so that each component is difficult to cure; the temperature in the area is higher than the range value, so that the film forming degree of the surface of the mica which is solidified in the mould is too high, and the functional water agent and trace water in the mica mixed slurry are evaporated at the moment, and although the evaporation gas of the curing agent and the moisture-proof agent is little, if the film forming degree of the surface of the mica is too high, bubbles are formed on the surface of the mica plate which is formed finally.
Optionally, the temperature of the surface curing zone is 120 ℃ to 140 ℃.
By adopting the technical scheme, when the temperature of the surface curing area is lower than a range value, the film forming on the surface of the mica plate is incomplete, so that the surface of the mica plate is wrinkled; when the temperature of the area is higher than the range value, the film forming speed of the surface of the mica plate is too high, and at the moment, the evaporated gas possibly containing trace curing agent and moisture-proof agent is volatilized before the surface of the mica plate is completely formed into a film, so that bubbles still appear on the surface of the mica plate.
Optionally, the silicone is selected from one of silicone oil, silicone rubber and silicone resin.
Optionally, the organic solvent is selected from one of benzene, toluene and xylene.
In summary, the present application includes at least one of the following beneficial technical effects:
1. compared with the method that mica paper and mica paper are glued and laminated, and are solidified through an oven, the mica plate is integrally formed, so that the possibility of performance reduction of the mica plate caused by layering of the mica plate is reduced, the mica paste is easier to form and is not easy to crack after being formed due to the fact that kaolin is calcined, and the high-temperature insulation performance and strength of the mica plate can be improved by the high-temperature resistant material;
2.1240-1260 mesh refractory material can make refractory material granule more abundant to the packing of clearance between the mica board granule to can promote the intensity of mica board better. The method comprises the steps of carrying out a first treatment on the surface of the
3. The solvent drying area is used for drying the organic solvent in the mica mixed slurry, the curing area is used for drying and curing all components in the mica mixed slurry, and the surface curing area is used for further curing the initially cured mica plate and enabling the surface of the mica plate to be completely film-formed. .
Detailed Description
Example 1:
and (3) mica pulping, namely separating and taking out impurities from mica crushed aggregates to obtain 80g of mica powder, washing the mica crushed aggregates with water, carrying out hydraulic pulping, grading by hydraulic cyclone, and finally dehydrating to obtain the cloud master batch. The mica material prepared as described above, 10kg of aluminum nitride powder and 15g of calcined kaolin powder were put into a stirred tank. Then 28g of silicone resin is dissolved in 18g of toluene to form slurry, and then 1g of moisture-proof agent and 1g of curing agent are added into the slurry, and the mixture is put into a stirring kettle for stirring after being uniformly mixed. The stirring rotation speed of the stirring kettle is 500 revolutions per minute, and the stirring time is 60 minutes.
And (3) after stirring is completed, obtaining mica mixed slurry, pouring the mica mixed slurry into a mold, and sequentially placing the poured mold into a solvent drying area, a curing area and a surface curing area, wherein each area stays for 5min. Wherein the temperature of the solvent drying area is 90 ℃, the temperature of the curing area is 130 ℃, and the temperature of the surface curing area is 130 ℃. And after the drying and curing are finished, the mica plate is manufactured.
Wherein the particle size of the aluminum nitride powder is 1250 meshes, and the particle size of the calcined kaolin powder is 2000 meshes; wherein the moisture-proof agent is purchased from OPE moisture-proof agent of new material technology Co., ltd. In the North of the Rushan mountain, and the curing agent is purchased from LP-712 curing agent of new material technology Co., ltd. In the Shanghai.
Performance test
1) The mica plates prepared in example 1 were respectively tested for compressive strength by a constant-speed loading tester, and the test results are shown in table 2;
2) The mica plates prepared in example 1 were respectively tested by a withstand voltage tester to detect dielectric strength (i.e., insulation) thereof, and the test results are shown in table 2;
3) Placing the mica plate prepared in the example 1 into a muffle furnace, clamping the mica plate up and down by using two metal plates, connecting the two metal plates to a voltage resistance tester, continuously heating the muffle furnace until the mica plate is broken down, and recording the temperature of the muffle furnace when the mica plate is broken down, wherein the temperature is shown in table 2;
4) The surface hardness of the mica plate prepared in example 1 was measured by a hardness tester, and the test results are shown in table 2;
4) The mica plate prepared in example 1 was observed for appearance, and the observation results are shown in table 2.
First group of examples/comparative examples
Examples 2-3:
a method of preparing a casting mica plate is different from example 1 in the following Table 1.
Table 1:
comparative example 1:
a method for preparing a casting mica plate, which is different from example 2 in that: the mica content was 70g.
Comparative example 2:
a method for preparing a casting mica plate, which is different from example 2 in that: the mica content was 100g.
Comparative example 3:
a method for preparing a casting mica plate, which is different from example 2 in that: the content of silicone gum was 25g.
Comparative example 4:
a method for preparing a casting mica plate, which is different from example 2 in that: the content of the organic silica gel was 60g.
Comparative example 5:
a method for preparing a casting mica plate, which is different from example 2 in that: the content of aluminum nitride was 6g.
Comparative example 6:
a method for preparing a casting mica plate, which is different from example 2 in that: the content of aluminum nitride was 24g.
Comparative example 7:
a method for preparing a casting mica plate, which is different from example 2 in that: the calcined kaolin content was 10g.
Comparative example 8:
a method for preparing a casting mica plate, which is different from example 2 in that: the calcined kaolin content was 28g.
Comparative example 9:
a method for preparing a casting mica plate, which is different from example 2 in that: the stirring speed was 450 rpm and the stirring time was 50min.
Performance test
The compressive strength, dielectric strength, breakdown temperature, surface hardness, and appearance of examples 2 to 3 and comparative examples 1 to 9, respectively, were also measured according to the above-mentioned performance test methods, and the measurement results are shown in Table 2.
Table 2: performance test results of examples 1-3 and comparative examples 1-9
Summary and analysis of results
The dielectric strength of the mica plate can represent the insulation performance of the mica plate, and the higher the dielectric strength is, the higher the insulation performance is; when the mica plate is broken down, the higher the temperature of the muffle furnace is, the better the high-temperature resistance of the mica plate is represented; the surface hardness of the mica plate can represent the degree of surface sintering, and further represents the height of the ceramic property of the mica plate, and the higher the surface hardness is, the better the ceramic property is.
As can be seen from the combination of examples 1-3 and table 2, the mica boards produced in examples 1-3 were all smooth in appearance, but the compressive strength, insulation, high temperature resistance and hardness of example 2 were all higher than those of examples 1 and 3, so that the mechanical properties, insulation, high temperature resistance and porcelain-like properties and appearance of the mica boards produced from the components and the amounts thereof in example 2 were relatively better, and the quality of the mica boards was better.
As can be seen from the combination of example 2, comparative examples 1 to 2 and Table 2, when the mica content is less than 80 parts, the insulation properties of the mica plate are greatly reduced compared with those of example 2, and the high temperature resistance is slightly reduced; and when the mica content is higher than 100 parts, the compressive strength, the surface hardness and the high temperature resistance of the mica plate are obviously reduced, and the ceramifiability is deteriorated.
As can be seen from the combination of example 2, comparative examples 3 to 4 and table 2, when the content of the silicone rubber is less than 28 parts, the strength of the prepared mica plate is obviously reduced compared with that of example 2, and the mica plate has the conditions of delamination and surface cracking, so that the high temperature resistance is obviously reduced; on the other hand, when the content of the organic silica gel is higher than 32 parts, the strength of the mica plate is slightly reduced compared with that of the embodiment 2, and the surface adhesion of the mica plate and the anti-adhesion of other mica plates occur.
As can be seen from the combination of example 2, comparative examples 5 to 6 and table 2, when the aluminum nitride content is less than 10 parts, the strength and high temperature resistance are greatly reduced, and the insulation and surface hardness are also significantly reduced; when the aluminum nitride content is more than 20 parts, the strength, insulation and surface hardness are also remarkably reduced.
As can be seen from the combination of example 2, comparative examples 7 to 8 and table 2, when the calcined kaolin content is less than 15 parts, the surface hardness of the obtained mica plate is greatly reduced, the ceramifiability is poor, cracks can appear on the surface, and the high temperature resistance of the mica plate is reduced; when the calcined kaolin content is higher than 15 parts, the mica plate may have a rough surface.
As can be seen from the combination of example 2, comparative example 9 and table 2, when the stirring speed is lower than 500 rpm and the stirring time is lower than 60min, the strength, insulation, high temperature resistance and surface hardness of the prepared mica plate are all obviously reduced, the porcelain-forming performance is poor, and the mica plate is layered and cracked on the surface, so that the quality of the mica plate is obviously affected.
Second group of examples/comparative examples
Example 4:
a method for preparing a casting mica plate, which is different from example 2 in that: the temperature in the solvent drying zone was 80 ℃.
Example 5:
a method for preparing a casting mica plate, which is different from example 2 in that: the temperature in the solvent drying zone was 100 ℃.
Example 6:
a method for preparing a casting mica plate, which is different from example 2 in that: the temperature of the curing zone was 120 ℃.
Example 7:
a method for preparing a casting mica plate, which is different from example 2 in that: the temperature of the curing zone was 140 ℃.
Example 8:
a method for preparing a casting mica plate, which is different from example 2 in that: the temperature of the surface cure zone was 120 ℃.
Example 9:
a method for preparing a casting mica plate, which is different from example 2 in that: the temperature of the surface cure zone was 140 ℃.
Comparative example 10:
a method for preparing a casting mica plate, which is different from example 2 in that: the temperature in the solvent drying zone was 70 ℃.
Comparative example 11:
a method for preparing a casting mica plate, which is different from example 2 in that: the temperature in the solvent drying zone was 110 ℃.
Comparative example 12:
a method for preparing a casting mica plate, which is different from example 2 in that: the temperature of the curing zone was 110 ℃.
Comparative example 13:
a method for preparing a casting mica plate, which is different from example 2 in that: the temperature of the curing zone was 150 ℃.
Comparative example 14:
a method for preparing a casting mica plate, which is different from example 2 in that: the temperature of the surface cure zone was 110 ℃.
Comparative example 15:
a method for preparing a casting mica plate, which is different from example 2 in that: the temperature of the surface cure zone was 150 ℃.
Performance test
The compressive strength, dielectric strength, breakdown temperature and appearance of examples 4 to 9 and comparative examples 10 to 15 were also measured according to the above-mentioned performance test methods, respectively, and the measurement results are shown in Table 3.
Table 3: the results of the tests of example 2, examples 4-9 and comparative examples 10-15
Summary and analysis of results
As can be seen in combination with example 2, examples 4-5 and table 3, the solvent drying zone temperature of example 4 is lower than example 2, the solvent drying zone temperature of example 5 is higher than example 2, and the compressive strength, dielectric strength, breakdown temperature and surface hardness of the mica plate of example 4 are all significantly lower than that of example 2, and the compressive strength, insulation, breakdown temperature and surface hardness of the mica plate of example 5 are all comparable to those of example 2. Therefore, when the temperature of the solvent drying area is 100 ℃, the compressive strength, dielectric strength, high temperature resistance and ceramic property of the prepared mica plate are relatively better under the condition of saving energy consumption.
And as can be seen from the combination of comparative examples 10 to 11 and table 3, when the temperature of the solvent drying zone is lower than 80 degrees celsius, the strength, high temperature resistance and surface hardness of the mica plate further deteriorate, and the insulation property also slightly declines; when the temperature of the solvent drying area is higher than 100 ℃, the strength, the high temperature resistance and the surface hardness of the mica plate are slightly reduced compared with those of the embodiment 2, but the surface of the mica plate still has bubbles, and the quality of the mica plate is obviously affected.
As can be seen from a combination of examples 2, examples 6-7 and table 3, the cure zone temperature of example 6 was lower than that of example 2, the cure zone temperature of example 7 was higher than that of example 2, and the strength, high temperature resistance of the mica plate of example 6 was significantly lower than that of example 2, and the strength, insulation and high temperature resistance of the mica plate of example 7 were not much different from that of example 2. Therefore, when the temperature of the solvent drying area is 130 ℃, the strength and the high temperature resistance of the prepared mica plate are relatively better under the condition of saving energy consumption.
And as can be seen from the combination of comparative examples 12 to 13, when the temperature of the cured region is lower than 120 degrees celsius, the strength and high temperature resistance of the mica plate further deteriorate, and the insulation and surface strength also slightly decrease; when the temperature of the curing area is higher than 140 ℃, the strength and the high temperature resistance of the mica plate are slightly reduced compared with those of the embodiment 2, but bubbles still appear on the surface of the mica plate, and the quality of the mica plate is obviously affected.
As can be seen from a combination of examples 2, examples 8-9 and table 3, the surface cure zone temperature of example 8 was lower than that of example 2, the surface cure zone temperature of example 9 was higher than that of example 2, and the strength, high temperature resistance and surface hardness of the mica plate of example 8 were significantly reduced from those of example 2, and the strength, insulation, high temperature resistance and surface hardness of the mica plate of example 9 were not much different from those of example 2. Therefore, when the temperature of the surface curing area is 130 ℃, the strength, the high temperature resistance and the surface hardness of the prepared mica plate are relatively better under the condition of saving energy consumption.
And as can be seen from the combination of comparative examples 14 to 15, when the surface curing zone temperature is lower than 120 degrees celsius, the strength and high temperature resistance of the mica plate further deteriorate, and the insulation property also slightly decreases, and the surface strength greatly decreases; when the temperature of the surface curing area is higher than 140 ℃, the strength and the high temperature resistance of the mica plate are slightly reduced compared with those of the embodiment 2, but bubbles still appear on the surface of the mica plate, so that the surface hardness of the mica plate is reduced, and the quality of the mica plate is obviously affected.
Third group of examples/comparative examples
Comparative example 16:
the difference from example 2 is that: crushing 85g mica sheets, dissociating the mica sheets to a certain fine scale, diluting the slurry, processing the mica scale into mica paper by a sizing and papermaking mode, coating the mica paper with an organic adhesive, removing a solvent by a tunnel dryer to obtain single Zhang Tujiao mica paper, cutting the glued mica paper into a certain size, overlapping the mica paper into different thicknesses, and sending the mica paper into a press for compression molding to obtain the mica sheet.
Performance test
1) The mica plate prepared in comparative example 16 was tested for compressive strength, dielectric strength, high temperature resistance and appearance according to the above performance test method, and the test results are shown in table 4;
2) The mica plates prepared in example 2 and comparative example 16 were placed in test boxes at 35℃and 85% relative humidity, respectively, and were continuously left for 300 hours, and the layering condition of the mica plates was observed, and the observation results are shown in Table 4.
Table 4:
summary and analysis of results
As can be seen from the combination of example 2, comparative example 16 and table 2, the mica plate of comparative example 16 has much lower compressive strength, insulation, breakdown temperature and surface hardness than the mica plate of example 2, and the mica plate of example 2 is not layered in a high temperature and high humidity environment for the same time, while the mica plate of comparative example 16 is layered, that is, the mica plate prepared by the preparation method of the present application is not easily layered, and the compressive strength, insulation, high temperature resistance and surface hardness are relatively better.
Claims (10)
1. A method of making a poured mica sheet comprising the steps of:
adding organic silica gel, a high-temperature resistant material, calcined kaolin and an organic solvent into the slurried cloud master batch, and stirring to obtain mica mixed slurry; pouring the prepared mica mixed slurry into a mold; and (5) placing the irrigated mould into a drying area for drying to obtain the mica plate.
2. A method of making a casting mica plate as defined in claim 1 wherein: the weight parts of each component in the mica mixed slurry are as follows:
80-90 parts of mica, 10-20 parts of high temperature resistant material, 15-25 parts of calcined kaolin, 28-32 parts of organic silica gel, 18-22 parts of organic solvent, and 1-3 parts of moisture-proof agent and 1-3 parts of curing agent.
3. A method of manufacturing a casting mica plate according to claim 1 or 2, characterized in that: the high temperature resistant material is selected from one of silicon nitride, aluminum nitride, boron nitride, molybdenum disilicide and aluminum oxide.
4. A method of making a casting mica plate as described in claim 3 wherein: the grain diameter of the high temperature resistant material ranges from 1240 to 1260 meshes.
5. A method of making a casting mica plate as defined in claim 1 wherein: the particle size of the calcined kaolin ranges from 1900 to 2100 mesh.
6. A method of making a casting mica plate as defined in claim 1 wherein: the stirring speed in the step of preparing the mica mixed slurry is more than or equal to 500 revolutions per minute, and the stirring time is more than or equal to 60 minutes.
7. A method of making a casting mica plate as defined in claim 2 wherein: the drying zone is divided into a solvent drying zone, a curing zone and a surface curing zone, and the drying time of each zone is 4-6min.
8. A method of making a casting mica plate as described in claim 7 wherein: the temperature of the solvent drying area is 80-100 ℃.
9. A method of making a casting mica plate as described in claim 7 wherein: the temperature of the curing zone is 120-140 ℃.
10. A method of making a casting mica plate as described in claim 7 wherein: the temperature of the surface curing zone is 120-140 ℃.
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Country or region after: China Address after: 19B05, 19th Floor, No. 4 Fufeng Road, Science and Technology Park, Fengtai District, Beijing, 100071 (Park) Applicant after: Beijing Yitian Lingyun Mica Co.,Ltd. Address before: 19B05, 19th Floor, No. 4 Fufeng Road, Science and Technology Park, Fengtai District, Beijing, 100071 (Park) Applicant before: BEIJING YITIAN MICA TECHNOLOGY Co.,Ltd. Country or region before: China |