CN117199061A - Light-emitting module and preparation method thereof - Google Patents
Light-emitting module and preparation method thereof Download PDFInfo
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- CN117199061A CN117199061A CN202311284732.3A CN202311284732A CN117199061A CN 117199061 A CN117199061 A CN 117199061A CN 202311284732 A CN202311284732 A CN 202311284732A CN 117199061 A CN117199061 A CN 117199061A
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Abstract
The invention discloses a light-emitting module and a preparation method thereof, wherein the light-emitting module comprises a driving substrate and a plurality of light-emitting elements arranged on the surface of the driving substrate, and the light-emitting elements are electrically connected with the driving substrate; a hydrophilic layer arranged on one side surface of the driving substrate facing the light-emitting element; the light absorption layer is arranged on one side of the hydrophilic layer away from the driving substrate and surrounds the light-emitting element; the packaging layer is arranged on one side of the light absorption layer and the light-emitting element, which is far away from the driving substrate; the light ray adjusting layer is arranged on one side of the packaging layer far away from the driving substrate, and the light ray adjusting layer comprises a plurality of ink drops which are arrayed. According to the embodiment of the invention, the hydrophilic layer is arranged to ensure uniform spraying of the light absorption layer, so that the side surface of the light-emitting element is absorbed by the light absorption layer to emit light, and the crosstalk of emitted light among different light-emitting elements is avoided; the light adjusting layer can control the external environment light to scatter on the light emitting surface of the light emitting film group, reduce the interference of the external environment light on the light emitting of the light emitting module, and improve the light emitting contrast of the light emitting module.
Description
Technical Field
The present disclosure relates to light emitting modules, and particularly to a light emitting module and a method for manufacturing the same.
Background
Along with the continuous improvement of display application technology and the increasing demand of terminal markets, high contrast and high display become the main direction of improving the competitiveness of products in small-space screen factories and packaging factories. The COB integrated module product in the prior art has poor display contrast, and has the problems of light crosstalk, mutual interference and the like among pixel points, thereby influencing the light emitting effect.
Disclosure of Invention
The embodiment of the invention provides a light-emitting module and a preparation method thereof, which are used for reducing the crosstalk problem among different light-emitting elements and reducing the surface reflection of the light-emitting module.
In a first aspect, an embodiment of the present invention provides a light emitting module, including:
a driving substrate and a plurality of light emitting elements arranged on the surface of the driving substrate, wherein the light emitting elements are electrically connected with the driving substrate;
a hydrophilic layer arranged on one side surface of the driving substrate facing the light-emitting element;
a light absorbing layer disposed on a side of the hydrophilic layer away from the driving substrate and surrounding the light emitting element;
the packaging layer is arranged on one side of the light absorption layer and the light-emitting element, which is far away from the driving substrate;
the light ray adjusting layer is arranged on one side, far away from the driving substrate, of the packaging layer, and the light ray adjusting layer comprises a plurality of ink drops which are arrayed.
Optionally, the light absorbing layer has a height lower than an upper surface of the light emitting element;
alternatively, the light absorbing layer is flush with the upper surface of the light emitting element.
Optionally, the light ray adjustment layer includes a first adjustment region including a plurality of first ink droplets and a second adjustment region including a plurality of second ink droplets; the first adjusting area is overlapped with the light-emitting element along the light emitting direction of the light-emitting module, and the second adjusting area is not overlapped with the light-emitting element;
the distribution density of the first ink drops is smaller than the distribution density of the second ink drops; and/or the area of the first ink drop is smaller than the area of the second ink drop.
Optionally, the light emitting module includes a display module or a backlight module.
In a second aspect, an embodiment of the present invention provides a method for manufacturing a light emitting module, including:
providing a driving substrate, and arranging a plurality of light emitting elements on one side of the driving substrate, wherein the light emitting elements are electrically connected with the driving substrate;
preparing a hydrophilic layer on the surface of one side of the driving substrate facing the light-emitting element;
preparing a light absorbing layer on a side of the hydrophilic layer away from the driving substrate, the light absorbing layer surrounding the light emitting element;
preparing an encapsulation layer on one side of the light absorption layer and the light emitting element away from the driving substrate;
and preparing a light ray adjusting layer on one side of the packaging layer far away from the driving substrate, wherein the light ray adjusting layer comprises a plurality of ink drops which are arrayed.
Optionally, preparing a hydrophilic layer on a side surface of the driving substrate facing the light emitting element, including:
placing the driving substrate in a vacuum chamber;
injecting a liquid hydrophilic coating into the vacuum chamber, and vacuum atomizing the liquid hydrophilic coating to form a gaseous hydrophilic coating, so that the gaseous hydrophilic coating covers the driving substrate;
the gaseous hydrophilic coating is cooled to form a hydrophilic layer on a side surface of the driving substrate facing the light emitting element.
Optionally, preparing a light absorbing layer on a side of the hydrophilic layer remote from the drive substrate, including:
printing a liquid light absorbing material in an ink-jet printing mode on a region of the driving substrate which is not covered by the light emitting element;
standing for preset time, and controlling the leveling of the liquid light absorbing material;
and starting a curing device to control the curing of the liquid light absorbing material so as to form a light absorbing layer on one side of the hydrophilic layer away from the driving substrate.
Optionally, preparing an encapsulation layer on a side of the light absorbing layer and the light emitting element away from the driving substrate, including:
printing a liquid packaging material on one side of the light absorption layer and the light emitting element, which is far away from the driving substrate, in an ink-jet printing mode;
standing for preset time, and controlling the leveling of the liquid packaging material;
and starting a curing device to control the curing of the liquid packaging material, and forming a packaging layer on one side of the light absorption layer and the light emitting element, which is far away from the driving substrate.
Optionally, preparing a light adjustment layer on a side of the encapsulation layer away from the driving substrate, including:
and printing ink drops on one side of the packaging layer far away from the driving substrate in an ink jet printing mode, starting a curing device to control the ink drops to be cured, and forming a light ray adjusting layer on one side of the packaging layer far away from the driving substrate.
Optionally, the ink droplet size ejected by the ink jet printing device that prints the ink droplet is adjustable;
and/or the movement speed of the ink jet printing device printing the ink drops and the curing device is adjustable.
According to the light-emitting module provided by the embodiment of the invention, the hydrophilic layer, the light-absorbing layer, the packaging layer and the light adjusting layer are sequentially arranged on the surface of the driving substrate, and the light-absorbing material can be leveled to form a flat light-absorbing layer under the action of the hydrophilic layer, so that the absorption effect on the side light-emitting of the light-emitting element is improved, the crosstalk caused by the side light-emitting of different light-emitting elements is reduced, and the light-emitting effect of the light-emitting module is improved; further, the light adjustment layer comprises a plurality of ink drops distributed in an array, external environment light is scattered on the surface of the light adjustment layer, light entering the light-emitting module can be reduced, reflection of the light-emitting module to the external environment light is further reduced, interference of the external environment light to light emitted by the light-emitting module can be reduced, light-emitting contrast of the light-emitting module is improved, and light-emitting effect of the light-emitting module is further improved.
It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the invention or to delineate the scope of the invention. Other features of the present invention will become apparent from the description that follows.
Drawings
Fig. 1 is a schematic structural diagram of a first light emitting module according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a second light emitting module according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a third light emitting module according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a fourth light emitting module according to an embodiment of the present invention;
FIG. 5 is a flowchart of a method for manufacturing a light emitting module according to an embodiment of the present invention;
FIG. 6 is a flowchart illustrating a refinement step of step S120 in FIG. 5 according to the present invention;
FIG. 7 is a flowchart illustrating a refinement step of step S130 in FIG. 5 according to the present invention;
FIG. 8 is a flowchart illustrating a refinement step of step S140 in FIG. 5 according to the present invention;
fig. 9 is a flowchart of a refinement step of step S150 in fig. 5 provided in the present invention.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
Fig. 1 is a schematic structural diagram of a first light emitting module according to an embodiment of the present invention, where the light emitting module includes a driving substrate 10, a light emitting element 11, a hydrophilic layer 12, a light absorbing layer 13, a packaging layer 14, and a light adjusting layer 15. The light emitting element 11 is provided on the surface of the driving substrate 10 and electrically connected to the driving substrate 10. The hydrophilic layer 12 is disposed on a side surface of the driving substrate 10 facing the light emitting element 11; the light absorbing layer 13 is disposed on a side of the hydrophilic layer 12 away from the driving substrate 10 and surrounds the light emitting element 11; the encapsulation layer 14 is disposed on the light absorption layer 13 and the light emitting element 11 on the side away from the drive substrate 10; the light adjusting layer 15 is disposed on a side of the encapsulation layer 14 away from the driving substrate 10, and the light adjusting layer 15 includes a plurality of ink droplets 16 arranged in an array.
Illustratively, the driving substrate 10 may include a PCB substrate 101 and a driving element 102 disposed on one side of the PCB substrate 101, where the driving element 102 and the light emitting element 11 are disposed on two layers opposite to each other on the PCB substrate 101, and the PCB substrate 101 is electrically connected to the driving element 102 and the light emitting element 11, and the driving element 102 provides a light emitting signal to the light emitting element 11 through the PCB substrate 101 to ensure that the light emitting element 11 emits light normally. Further, one driving element 102 drives the plurality of light emitting elements 11 to emit light, ensuring that the driving logic is simple. Alternatively, the light emitting element 11 and the driving substrate 10 may be fixedly connected through soldering pins, which is not limited in the embodiment of the present invention. Further, the light emitting element 11 in the embodiment of the present invention may be a Micro light emitting diode, such as Micro-led or Mini-led, and the type and size of the light emitting element in the embodiment of the present invention are not limited.
Further, the hydrophilic layer 12 has hydrophilicity, and the hydrophilic layer 12 is formed on the surface of the driving substrate 10 and the light absorbing layer 13 is further formed on the surface of the hydrophilic layer 12, so that the liquid light absorbing material contacting the hydrophilic layer 12 can more easily form the flat light absorbing layer 13, and the thickness uniformity of the light emitting module can be improved. The light absorbing layer 13 is arranged around the light emitting element 11, so that surface blackening treatment is realized on the driving substrate 10, the light absorbing layer 13 can fully absorb side light emitted by the light emitting element 11, the front light emitted by the light emitting element 11 is ensured, and the light emitted by the side surface of the light emitting element 11 is prevented from affecting the display consistency of the light emitting module. It should be noted that the material and color of the light absorbing layer 13 can be set up according to the requirement, which is not limited in the embodiment of the present invention. For example, the light absorbing layer 13 may be a black light absorbing film layer, such as a black ink cured to form the light absorbing layer, or carbon black particles doped in an optical cement to form the light absorbing layer 13.
Further, the encapsulation layer 14 covers the light absorption layer 13 and the light emitting element 11, protects the light emitting module surface and the connection leads, and prevents the light emitting module circuit from being corroded by impurities in the air to cause performance degradation.
Further, the light adjusting layer 15 includes a plurality of ink droplets 16 arranged in an array, when external light enters the light emitting module, the external light is firstly contacted with the surface of the ink droplets 16 to generate angle deflection, so that the external light is reduced to enter the light emitting module, the external light reflected by the reflecting layer in the light emitting module is further reduced, that is, the light emitted by the light emitting module is ensured to be more emitted by the light emitting module rather than emitted by external environment light, and therefore, the contrast of the light emitted by the light emitting module can be improved, and the light emitting effect of the light emitting module is improved.
According to the technical scheme provided by the embodiment of the invention, a hydrophilic layer 12, a light absorption layer 13, a packaging layer 14 and a light ray adjusting layer 15 are sequentially arranged on the surface of one side of a driving substrate 10 facing a light emitting element 11. The light absorbing layer 13 can realize surface blackening treatment of the driving substrate 10, improve contrast of the light emitting module, prevent light from being transmitted between pixel points, and improve display consistency of the light emitting module. The light adjusting layer 15 makes the external light enter the light emitting module to deflect angularly, reduces the reflection of the external light, and improves the contrast of the light emitting module.
Fig. 2 is a schematic structural diagram of a second light emitting module according to an embodiment of the present invention, and referring to fig. 1 and 2, a height of the light absorbing layer 13 is lower than an upper surface of the light emitting element 11; alternatively, the light absorbing layer 13 is flush with the upper surface of the light emitting element 11. The light absorption layer 13 absorbs the side light of the light emitting element 11, ensures that only the upper surface of the light emitting element 11 emits light, improves the collimation of the light emitting element 11, avoids crosstalk caused by the light emitted by different light emitting elements 11, and improves the light emitting effect.
Illustratively, the height of the light absorbing layer 13 may be 5-100 μm, and reasonable setting of the height of the light absorbing layer 13 may ensure that the light absorbing layer is matched with the size of the light emitting element 11, thereby meeting the light emitting requirement of the light emitting element 11 of the light emitting module.
Fig. 3 is a schematic structural diagram of a third light emitting module according to an embodiment of the present invention, fig. 4 is a schematic structural diagram of a fourth light emitting module according to an embodiment of the present invention, and referring to fig. 3 and 4, the light adjusting layer 15 includes a first adjusting area 151 and a second adjusting area 152, the first adjusting area 151 includes a plurality of first ink droplets 161, and the second adjusting area 152 includes a plurality of second ink droplets 162; along the light emitting direction of the light emitting module, the first adjustment region 151 overlaps the light emitting element 11, and the second adjustment region 152 does not overlap the light emitting element 11; the distribution density of the first ink droplets 161 is smaller than the distribution density of the second ink droplets 162; and/or the area of the first droplet 161 is smaller than the area of the second droplet 162.
Illustratively, the light adjusting layer 15 is configured to scatter external light, reduce the external light entering the light emitting module, and further reduce the external light reflected by the reflective layer in the light emitting module. The first adjustment area 151 overlaps the light emitting element 11, and the light emitted from the upper surface of the light emitting element 11 passes through the first adjustment area 151, and the first ink droplet 161 of the first adjustment area 151 deflects the light emitted from the upper surface of the light emitting element 11, so as to affect the display of the light emitting module. Therefore, the distribution density of the first ink droplets 161 is smaller than the distribution density of the second ink droplets 162, and/or the area of the first ink droplets 161 is smaller than the area of the second ink droplets 162, so that the light emitted from the upper surface of the light-emitting element 11 is not easy to generate angular deflection with the first ink droplets 161, the influence of the light adjusting layer 15 on the light emitted from the light-emitting element 11 is reduced, and the influence of external light on the display contrast of the light-emitting module is reduced on the basis of ensuring the light-emitting requirement of the light-emitting module.
Optionally, the light emitting module includes a display module or a backlight module.
Specifically, the light emitting module provided by the embodiment of the invention can be applied to direct display, namely, single-color display or color display can be realized by controlling the light emitting color of the light emitting element. Or, the light-emitting module provided by the embodiment of the invention can be also applied to the field of backlight, namely, can be used as a backlight module and can be matched with a liquid crystal display panel to realize the display light of the liquid crystal display panel.
Based on the same inventive concept, the embodiment of the present invention further provides a method for manufacturing a light emitting module, and specifically, fig. 5 is a flowchart of a method for manufacturing a light emitting module according to the embodiment of the present invention, and referring to fig. 5, the method for manufacturing a light emitting module includes:
s110, providing a driving substrate, and arranging a plurality of light emitting elements on one side of the driving substrate, wherein the light emitting elements are electrically connected with the driving substrate.
The driving substrate 10 is electrically connected to the light emitting element 11, and the driving substrate 10 provides a driving signal to the light emitting element 11 to make the light emitting element 11 emit light.
Referring to fig. 1 to 4, the driving substrate 10 may include a PCB substrate 101 and a driving element 102 disposed on one side of the PCB substrate 101, where the driving element 102 and the light emitting element 11 are disposed on two layers disposed opposite to each other on the PCB substrate 101, the PCB substrate 101 is electrically connected to the driving element 102 and the light emitting element 11, and the driving element 102 provides a light emitting signal to the light emitting element 11 through the PCB substrate 101 to ensure that the light emitting element 11 emits light normally. Further, one driving element 102 drives the plurality of light emitting elements 11 to emit light, ensuring that the driving logic is simple.
And S120, preparing a hydrophilic layer on the surface of one side of the driving substrate facing the light-emitting element.
With continued reference to fig. 1-4, the hydrophilic layer 12 is a coating having hydrophilic properties, which has good wettability and can attract or dissolve water molecules. The hydrophilic layer 12 covers a surface of the driving substrate 10 facing the light emitting element 11, so that the liquid light absorbing material forms a flat light absorbing layer 13.
Alternatively, the drive substrate 10 may be subjected to vacuum plasma cleaning prior to preparing the hydrophilic layer 12. When the driving substrate 10 is cleaned, the plasma can enter the micro holes and the concave inside of the driving substrate 10 to clean, thereby improving the cleaning efficiency and having good cleaning effect.
S130, preparing a light absorption layer on one side of the hydrophilic layer away from the driving substrate, wherein the light absorption layer surrounds the light-emitting element.
With continued reference to fig. 1-4, the light absorbing layer 13 is a coating having the ability to absorb light. The light absorption layer 13 is arranged on one side of the hydrophilic layer 12 far away from the driving substrate 10, the light absorption layer 13 surrounds the light emitting elements 11, the light emitting elements 11 are mutually isolated, crosstalk caused by light emission of different light emitting elements 11 is avoided, and the light emitting effect is improved. The light absorption layer 13 absorbs light emitted from the side surface of the light emitting element 11, so that only the upper surface of the light emitting element 11 emits light, and the display contrast of the light emitting module is improved.
And S140, preparing an encapsulation layer on the side of the light absorption layer and the light-emitting element away from the driving substrate.
With continued reference to fig. 1 to 4, the encapsulation layer 14 is a protective layer formed by electronic glue or adhesive for sealing the component, and has the functions of waterproof, dustproof, heat dissipation, etc. The packaging layer 14 covers the light absorbing layer 13 and the light emitting element 11, protects the light emitting module surface and the light emitting element 11, and prevents the light absorbing layer 13 and the light emitting element 11 from being corroded and worn to reduce the contrast ratio and display consistency of the light emitting module, thereby affecting the performance of the light emitting module.
S150, preparing a light ray adjusting layer on one side of the packaging layer far away from the driving substrate, wherein the light ray adjusting layer comprises a plurality of ink drops which are arrayed.
With continued reference to fig. 1 to 4, the light adjusting layer 15 is configured to scatter external light, reduce the external light entering the light emitting module, and further reduce the external light reflected by the reflective layer in the light emitting module. The light adjusting layer 15 comprises a plurality of ink drops 16 arranged in an array, when external light enters the light emitting module, the external light contacts with the surfaces of the ink drops 16 to generate angle deflection, so that the external light enters the light emitting module, the light reflected by the reflecting layer in the light emitting module is further reduced, the light emitted by the light emitting module is ensured to be more emitted by the light emitting module rather than emitted by external environment light, the contrast of the light emitted by the light emitting module can be improved, and the light emitting effect of the light emitting module is improved.
According to the technical scheme provided by the embodiment of the invention, a hydrophilic layer 12, a light absorption layer 13, a packaging layer 14 and a light ray adjusting layer 15 are sequentially prepared on the surface of one side of a driving substrate 10 facing a light emitting element 11. The light absorbing layer 13 is easier to be leveled under the action of the hydrophilic layer 12 to form a flat coating, so that the thickness consistency of the light emitting module is improved. The light absorbing layer 13 realizes the surface blackening treatment of the driving substrate 10, ensures that the light absorbing layer 13 can fully absorb the side light of the light emitting element 11, can prevent the light from being transmitted between the pixel points, and improves the display consistency of the light emitting module. The light adjusting layer 15 makes the external light enter the light emitting module to deflect angularly, reduces the reflection of the external light, and improves the contrast of the light emitting module.
Fig. 6 is a flowchart of a refinement step of step S120 in fig. 5, and referring to fig. 5 and fig. 6, the step S120 includes:
s121, placing the driving substrate in a vacuum chamber.
The vacuum chamber is a completely closed vacuum high-pressure environment chamber, and can be a closed chamber of a vacuum atomizer.
S122, injecting a liquid hydrophilic coating into the vacuum chamber, and vacuum atomizing the liquid hydrophilic coating to form a gaseous hydrophilic coating so that the gaseous hydrophilic coating covers the driving substrate.
The liquid hydrophilic coating is sublimated into a gaseous hydrophilic coating after being atomized in vacuum in the vacuum chamber, the gaseous hydrophilic coating is contacted with the surface of the driving substrate, and the gaseous hydrophilic coating covers the surface of the driving substrate through the vacuum atomization circulation of the vacuum chamber.
And S123, cooling the gaseous hydrophilic coating to form a hydrophilic layer on the surface of the side of the driving substrate facing the light-emitting element.
Wherein, the gaseous hydrophilic coating covered on the surface of the driving substrate forms a hydrophilic layer after cooling. The thickness of the hydrophilic layer is 10-1000nm, for example, 10nm, 15nm, 23nm, 35nm, 42nm, 55nm, 70nm, 83nm, 96nm or 100nm, and the specific thickness of the hydrophilic layer is not limited in the embodiment of the present invention and may be set according to actual process requirements. Through the thickness of reasonable setting hydrophilic layer, can avoid on the one hand because of the problem that the hydrophilic layer thickness is less causes unable even coverage, on the other hand can avoid causing the great problem of luminous module overall thickness because of the hydrophilic layer thickness is great. The hydrophilic layer is selected to have a proper thickness range, so that the hydrophilic characteristic and the thin design of the module can be considered.
According to the technical scheme provided by the embodiment of the invention, the liquid hydrophilic coating is atomized into the gaseous hydrophilic coating in the vacuum chamber in a vacuum way, and the gaseous hydrophilic coating is contacted with the surface of the driving substrate, so that the liquid hydrophilic coating can be uniformly covered on the surface of the driving substrate, and a hydrophilic layer is formed after cooling, so that the surface of the driving substrate has hydrophilicity.
Fig. 7 is a flowchart of a refinement step of step S130 in fig. 5, and referring to fig. 5 and fig. 7, the step S130 includes:
s131, printing liquid light absorbing materials on the area of the driving substrate which is not covered by the light emitting elements in an ink jet printing mode.
The area of the driving substrate, which is not covered by the light emitting element, can be preset in the ink jet printing device, so that the influence of the dripping of the liquid light absorbing material on the light emitting chip on the light emitting of the upper surface of the light emitting chip is avoided.
S132, standing for a preset time, and controlling the leveling of the liquid light absorbing material.
The preset time is preset time for enabling the liquid light absorbing material to be fully leveled on the driving substrate. Illustratively, the preset time is 30-180s. The hydrophilic layer covered on the surface of the driving substrate makes the surface of the driving substrate hydrophilic, and the liquid light absorbing material for ink-jet printing can flow around the driving substrate and the light emitting element easily to form a flat liquid light absorbing material layer.
S133, starting a curing device to control the curing of the liquid light absorbing material so as to form a light absorbing layer on one side of the hydrophilic layer away from the driving substrate.
Wherein the curing device is a device for controlling the solidification of the liquid light absorbing material into the light absorbing layer. The curing device may be, for example, an ultraviolet curing lamp or the like.
Further, the drive substrate may be baked in an oven to thoroughly cure the liquid light absorbing material. Illustratively, the baking conditions can be set by self-definition according to the type of the liquid light absorbing material, the baking temperature is 80-150 ℃, and the baking time is 30-150min.
According to the technical scheme provided by the embodiment of the invention, after the liquid light-absorbing material is printed on the surface of the driving substrate in an inkjet manner, the liquid light-absorbing material is firstly kept stand for a preset time, so that the liquid light-absorbing material can be leveled on the surface of the driving substrate under the action of the hydrophilic layer, a flat light-absorbing layer is formed, and the thickness consistency of the light-emitting module is improved.
Fig. 8 is a flowchart of a refinement step of step S140 in fig. 5, and referring to fig. 5 and fig. 8, the step S140 includes:
and S141, printing the liquid packaging material on the side of the light absorption layer and the light emitting element away from the driving substrate in an ink-jet printing mode.
Optionally, the liquid packaging material is an acrylic acid system or epoxy resin system ink, the hardness after film formation is more than 5H, the adhesive force is moderate, and the requirements of the packaging layer for covering and protecting the light absorption layer and the surface of the light-emitting element are met.
S142, standing for a preset time, and controlling the leveling of the liquid packaging material.
The preset time is preset time for enabling the liquid packaging material to be fully leveled on the light absorption layer. Illustratively, the preset time is 30-180s.
S143, starting a curing device to control the curing of the liquid packaging material, and forming a packaging layer on one side of the light absorption layer and the light emitting element away from the driving substrate.
Wherein the curing device is a device for controlling the curing of the liquid encapsulating material into the encapsulating layer. The thickness of the encapsulation layer is illustratively 0.2-1.0mm, for example 0.2nm, 0.3nm, 0.4nm, 0.5nm, 0.6nm, 0.7nm, 0.8nm, 0.9nm or 1.0nm, and the specific thickness of the encapsulation layer is not limited in the embodiment of the present invention and may be set according to practical process requirements. The packaging layer is in a proper thickness range, so that the packaging layer can cover and protect the surfaces of the light absorption layer and the light-emitting element, and meanwhile, the thinning design of the module can be ensured.
Further, the driving substrate may be baked in an oven to thoroughly cure the liquid encapsulation material. Illustratively, the baking conditions may be set by user according to the kind of the liquid encapsulation material, the baking temperature is 80-150 ℃, and the baking time is 30-150min.
According to the technical scheme provided by the embodiment of the invention, after the liquid packaging material is subjected to ink jet printing on the surfaces of the light absorption layer and the light emitting element, the liquid packaging material is firstly stood and then solidified to form the packaging layer, so that the liquid packaging material is fully leveled on the surfaces of the light absorption layer and the light emitting element, a flat packaging layer is formed, and the display consistency of the light emitting module is improved.
Fig. 9 is a flowchart of a refinement step of step S150 in fig. 5, and referring to fig. 5 and fig. 9, the step S150 includes:
and S151, printing ink drops on one side of the packaging layer far away from the driving substrate in an ink jet printing mode, starting a curing device to control ink drop curing, and forming a light ray adjusting layer on one side of the packaging layer far away from the driving substrate.
And the ink jet printing equipment is arranged at the adjacent position of the surface of the packaging layer, the ink jet printing equipment prints the ink drops, and the curing equipment immediately controls the ink drops to be cured and shaped after the ink drops are dropped on the driving substrate. The ink jet printing device and the curing device move along the extending direction of the driving substrate in a matching way to form a light ray adjusting layer.
Further, the drive substrate may be baked in an oven to thoroughly cure the ink droplets. Illustratively, the baking conditions may be set custom according to the kind of ink droplet, the baking temperature is 80-150 ℃ and the baking time is 30-150min.
Optionally, the ink drops are acrylic acid system or epoxy resin system ink, the hardness after film formation is more than 5H, the adhesive force is moderate, and the requirement of the light ray adjusting layer for covering the surface of the packaging layer is met.
According to the technical scheme provided by the embodiment of the invention, the ink jet printing equipment and the curing equipment are arranged at adjacent positions, after the ink drops are printed by the ink jet printing equipment, the curing equipment immediately controls the ink drops to be cured and shaped into the light adjustment layer, the light adjustment layer is ensured to be a plurality of ink drops distributed in an array, external light is reduced to enter the light emitting module, and the contrast of the light emitted by the light emitting module is improved.
Alternatively, the size of ink droplets ejected by an ink jet printing device that prints ink droplets may be adjusted; and/or the movement speed of the ink jet printing apparatus and the curing apparatus printing the ink droplets is adjustable. The ink droplet size ejected by the ink jet printing apparatus is adjusted so that the first ink droplet 161 is ejected when the ink jet printing apparatus moves to the first adjustment region 151 overlapping the light emitting element 11, and the second ink droplet 162 is ejected when the ink jet printing apparatus moves to the second adjustment region not overlapping the light emitting element 11, and the area of the first ink droplet 161 is smaller than the area of the second ink droplet 162. The distribution density of the first ink droplets 161 may be made smaller than the distribution density of the second ink droplets 162 by adjusting the moving speeds of the inkjet printing apparatus and the curing apparatus. The light emitted from the upper surface of the light-emitting element 11 is not easy to generate angle deflection with the first ink drop 161, so that the influence of the light adjusting layer 15 on the light emitted from the light-emitting element 11 is reduced, and the influence of external light on the display contrast of the light-emitting module is reduced on the basis of ensuring the light-emitting requirement of the light-emitting module.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, and that various obvious changes, rearrangements, combinations, and substitutions can be made by those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (10)
1. A light emitting module, comprising:
a driving substrate and a plurality of light emitting elements arranged on the surface of the driving substrate, wherein the light emitting elements are electrically connected with the driving substrate;
a hydrophilic layer arranged on one side surface of the driving substrate facing the light-emitting element;
a light absorbing layer disposed on a side of the hydrophilic layer away from the driving substrate and surrounding the light emitting element;
the packaging layer is arranged on one side of the light absorption layer and the light-emitting element, which is far away from the driving substrate;
the light ray adjusting layer is arranged on one side, far away from the driving substrate, of the packaging layer, and the light ray adjusting layer comprises a plurality of ink drops which are arrayed.
2. The light-emitting module according to claim 1, wherein a height of the light-absorbing layer is lower than an upper surface of the light-emitting element;
alternatively, the light absorbing layer is flush with the upper surface of the light emitting element.
3. The light emitting module of claim 1, wherein the light adjustment layer comprises a first adjustment region and a second adjustment region, the first adjustment region comprising a plurality of first ink drops and the second adjustment region comprising a plurality of second ink drops; the first adjusting area is overlapped with the light-emitting element along the light emitting direction of the light-emitting module, and the second adjusting area is not overlapped with the light-emitting element;
the distribution density of the first ink drops is smaller than the distribution density of the second ink drops; and/or the area of the first ink drop is smaller than the area of the second ink drop.
4. The lighting module of claim 1, wherein the lighting module comprises a display module or a backlight module.
5. The preparation method of the light-emitting module is characterized by comprising the following steps:
providing a driving substrate, and arranging a plurality of light emitting elements on one side of the driving substrate, wherein the light emitting elements are electrically connected with the driving substrate;
preparing a hydrophilic layer on the surface of one side of the driving substrate facing the light-emitting element;
preparing a light absorbing layer on a side of the hydrophilic layer away from the driving substrate, the light absorbing layer surrounding the light emitting element;
preparing an encapsulation layer on one side of the light absorption layer and the light emitting element away from the driving substrate;
and preparing a light ray adjusting layer on one side of the packaging layer far away from the driving substrate, wherein the light ray adjusting layer comprises a plurality of ink drops which are arrayed.
6. The method according to claim 5, wherein preparing a hydrophilic layer on a side surface of the driving substrate facing the light emitting element, comprises:
placing the driving substrate in a vacuum chamber;
injecting a liquid hydrophilic coating into the vacuum chamber, and vacuum atomizing the liquid hydrophilic coating to form a gaseous hydrophilic coating, so that the gaseous hydrophilic coating covers the driving substrate;
the gaseous hydrophilic coating is cooled to form a hydrophilic layer on a side surface of the driving substrate facing the light emitting element.
7. The method of manufacturing according to claim 5, wherein manufacturing a light absorbing layer on a side of the hydrophilic layer remote from the drive substrate, comprises:
printing a liquid light absorbing material in an ink-jet printing mode on a region of the driving substrate which is not covered by the light emitting element;
standing for preset time, and controlling the leveling of the liquid light absorbing material;
and starting a curing device to control the curing of the liquid light absorbing material so as to form a light absorbing layer on one side of the hydrophilic layer away from the driving substrate.
8. The method of manufacturing according to claim 5, wherein manufacturing an encapsulation layer on a side of the light absorbing layer and the light emitting element away from the driving substrate, comprises:
printing a liquid packaging material on one side of the light absorption layer and the light emitting element, which is far away from the driving substrate, in an ink-jet printing mode;
standing for preset time, and controlling the leveling of the liquid packaging material;
and starting a curing device to control the curing of the liquid packaging material, and forming a packaging layer on one side of the light absorption layer and the light emitting element, which is far away from the driving substrate.
9. The method of manufacturing according to claim 5, wherein manufacturing the light adjusting layer on a side of the encapsulation layer away from the driving substrate, comprises:
and printing ink drops on one side of the packaging layer far away from the driving substrate in an ink jet printing mode, starting a curing device to control the ink drops to be cured, and forming a light ray adjusting layer on one side of the packaging layer far away from the driving substrate.
10. The method according to claim 9, wherein a size of ink droplets ejected from the ink jet printing apparatus that prints the ink droplets is adjustable;
and/or the movement speed of the ink jet printing device printing the ink drops and the curing device is adjustable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311284732.3A CN117199061A (en) | 2023-10-07 | 2023-10-07 | Light-emitting module and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311284732.3A CN117199061A (en) | 2023-10-07 | 2023-10-07 | Light-emitting module and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117199061A true CN117199061A (en) | 2023-12-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311284732.3A Pending CN117199061A (en) | 2023-10-07 | 2023-10-07 | Light-emitting module and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117199061A (en) |
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2023
- 2023-10-07 CN CN202311284732.3A patent/CN117199061A/en active Pending
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