CN117153714B - Method, system, equipment and medium for detecting welding bonding - Google Patents
Method, system, equipment and medium for detecting welding bonding Download PDFInfo
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- 238000003466 welding Methods 0.000 title claims abstract description 163
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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Abstract
The present disclosure provides a method, system, apparatus, and medium for detecting a solder bond. The detection method comprises the following steps: applying pulse signals to the welding spots to be detected; wherein, pulse signals with different frequencies are applied in each pulse period; acquiring sampling data of welding spots, and converting the sampling data into frequency spectrum data; selecting a target frequency interval from the frequency spectrum data, and processing the sampling data based on the target frequency interval to obtain welding spot detection data; and judging and obtaining a detection result of the welding spot based on the welding spot detection data. By applying pulses with different frequencies, an optimal target frequency interval is selected from the frequency spectrum data converted from the sampling data, detection is achieved based on the target frequency interval, compatibility with different welding spots and different electronic device conduction characteristics is achieved, amplification factor gears are automatically selected, amplification factor real-time adjustment is carried out on signal difference values acquired under different frequencies, acquisition accuracy is optimal under different frequencies, and accurate detection of micro capacitance change under ultra-high frequency is achieved.
Description
Technical Field
The disclosure relates to the technical field of welding detection, in particular to a detection method, a detection system, a detection device and a detection medium for welding bonding.
Background
The detection method in the existing semiconductor post-packaging wire bonding process comprises a detection method through an electric signal, a detection method through vision and a detection method through a wire feeding spool.
The detection method through the electric signal comprises a direct current mode and an alternating current mode. The direct current mode is a characteristic of current conduction by using the resistance or PN of the electronic device. And detecting the change of the conducting voltage on the bonding wire of the electronic device by applying direct-current voltage to the bonding point of the electronic device in the bonding process so as to judge whether the bonding result is successful. In the direct current mode, a certain direct current voltage needs to be applied to the tested electronic device, which can cause damage to some electronic devices with low voltage resistance in the testing process. The internal structure of a part of the electronic device may affect the test result in the dc mode, such as the capacitive device, and thus the disconnection detection cannot be performed using the dc voltage mode.
The alternating current mode is to judge whether the wire is broken or not through the parasitic capacitance of the bonding point of the electronic device in the bonding process. By adding an alternating current signal on the detected line and detecting the voltage change of the alternating current signal, whether the bonding result is successful or not is judged. However, the ac signal frequency used in the existing ac mode is low (< 100 KHZ). The high-speed electronic device is continuously popularized, the upper limit of the working speed of the high-speed electronic device is continuously increased, the parasitic capacitance of the high-speed electronic device is smaller and smaller, and the detection sensitivity of an alternating current mode is reduced due to the fact that the frequency of an alternating current signal is too low; however, too high ac signal frequency may introduce interference noise around the device, resulting in detection misjudgment.
Visual inspection belongs to a photographing mode after bonding, a region which is bonded is required to be identified through a CCD (Charge Coupled Device ) camera, the algorithm difficulty is high, the accuracy is low, the imaging is easy to be influenced by factors such as material pollution, light imaging and the like, and additional XY axis movement is required to be performed after bonding, so that the bonding time is prolonged by more than one time, and the production efficiency is reduced.
According to the detection method of the wire feeding spool, depending on the set time-out clock length, the method is delayed in reaction, and the shutdown can be identified after a plurality of bonding target errors, so that the bonding target materials are damaged after the reliability is reduced, and the waste of production materials is caused.
Disclosure of Invention
The technical problem to be solved by the present disclosure is to provide a method, a system, a device and a medium for detecting a welding bond, in order to overcome the defect that in the prior art, it is difficult to detect a high-speed electronic device, and the misjudgment of detection is large.
The technical problems are solved by the following technical scheme:
in a first aspect, a method for detecting a solder bond is provided, the method comprising:
applying pulse signals to the welding spots to be detected;
wherein the pulse signal of different frequency is applied at each pulse period;
acquiring sampling data of the welding spots, and converting the sampling data into frequency spectrum data;
selecting a target frequency interval from the frequency spectrum data, and processing the sampling data based on the target frequency interval to obtain welding spot detection data;
and obtaining a detection result of the welding spot based on the detection data of the welding spot.
Preferably, the detection circuit for detecting a solder bond includes a DDS (Direct Digital Synthesis, direct digital frequency synthesis) circuit, and the step of processing the sampled data based on the target frequency interval to obtain solder joint detection data includes:
inputting the sampling data into a DDS circuit to output synthesized data;
the target frequency interval is used as an output frequency interval of the DDS circuit;
acquiring reference data of the welding spot, wherein the reference data represents electrical parameters when the detection circuit does not contact the welding spot;
and calculating a difference value between the synthesized data and the reference data, and obtaining detection data of the welding spot based on the difference value.
Preferably, the sampled data includes a sampled voltage, and the step of obtaining the detection data of the welding spot based on the difference value includes:
selecting a target magnification for the difference based on the sampled voltage;
obtaining detection data of the welding spots based on the target magnification;
the step of obtaining the detection result of the welding spot based on the detection data of the welding spot comprises the following steps:
and comparing the detection data of the welding spots with a preset detection threshold value to obtain a corresponding detection result.
Preferably, the step of selecting the target magnification for the difference based on the sampling voltage includes:
acquiring a target saturated voltage of the sampling voltage;
wherein the amplification factor of the difference valueCorresponding to n saturated voltage intervals, wherein n is a natural number;
based on the target saturation voltage corresponds toiSelecting magnification in saturation regionAs the target magnification.
Preferably, the step of selecting a target frequency interval from the spectrum data includes:
obtaining basic parameters of the welding spots;
acquiring a corresponding reference frequency interval based on the basic parameters;
and acquiring a sampling frequency interval corresponding to the frequency spectrum data, and selecting an intersection of the reference frequency interval and the sampling frequency interval to obtain the target frequency interval.
Preferably, the step of converting the sampled data into spectral data comprises:
and obtaining the spectrum data based on the fast Fourier transform of the sampling data.
Preferably, the detection method further comprises:
acquiring the detection result of each welding spot of the welding rod;
responding to the detection result of any welding spot to represent abnormal bonding of the welding spot, and generating an error reporting signal as a detection result of the welding rod;
and responding to the detection results of all the welding spots to represent that the bonding of the welding spots is normal, and generating a signal for finishing the welding of the welding rod as the detection result of the welding rod.
In a second aspect, a detection system for welding bonding is provided, where the detection system includes a pulse module, a sampling module, a detection module, and a result output module;
the pulse module is used for applying pulse signals to the welding spots to be detected; wherein the pulse signal of different frequency is applied at each pulse period;
the sampling module is used for acquiring sampling data of the welding spots and converting the sampling data into frequency spectrum data;
the detection module is used for selecting a target frequency interval from the frequency spectrum data, and processing the sampling data based on the target frequency interval to obtain welding spot detection data;
and the result output module is used for obtaining the detection result of the welding spot based on the detection data of the welding spot.
In a third aspect, there is provided an electronic device comprising a memory, a processor and a computer program stored on the memory and adapted to run on the processor, the processor implementing the method for detecting a solder bond according to the first aspect when executing the computer program.
In a fourth aspect, a computer-readable storage medium is provided, on which a computer program is stored, which when executed implements the method for detecting a solder bond according to the first aspect.
On the basis of conforming to the common knowledge in the field, the above preferred conditions can be arbitrarily combined to obtain the preferred examples of the application.
The positive progress effect of the present disclosure is: by applying pulses with different frequencies, an optimal target frequency interval is selected from the frequency spectrum data converted from the sampling data, detection is achieved based on the target frequency interval, compatibility with different welding spots and different electronic device conduction characteristics is achieved, amplification factor gears are automatically selected, amplification factor real-time adjustment is carried out on signal difference values acquired under different frequencies, acquisition accuracy is optimal under different frequencies, and accurate detection of micro capacitance change under ultra-high frequency is achieved.
Drawings
FIG. 1 is a flow chart diagram of a method of detecting a weld bond of embodiment 1 of the present disclosure;
fig. 2 is a flowchart illustration of step S103 in the method for detecting a solder bond according to embodiment 1 of the present disclosure;
FIG. 3 is a schematic flow chart for detecting a welding rod in the method for detecting a welding bond in embodiment 1 of the disclosure;
fig. 4 is a schematic diagram of a detection circuit in a detection method of a solder bond according to embodiment 1 of the present disclosure;
FIG. 5 is a block diagram of a weld-bonded inspection system according to embodiment 2 of the present disclosure;
fig. 6 is a schematic hardware structure of an electronic device according to embodiment 3 of the present disclosure.
Detailed Description
The present disclosure is further illustrated by way of examples below, but is not thereby limited to the scope of the examples described.
In the description of the present disclosure, it should be understood that the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", or a third "may explicitly or implicitly include one or more such feature. In the description of the present disclosure, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Example 1
The embodiment provides a method for detecting welding bonding, as shown in fig. 1, the method includes:
s101, applying pulse signals to welding spots to be detected;
wherein the pulse signal of different frequency is applied at each pulse period;
s102, acquiring sampling data of the welding spots, and converting the sampling data into frequency spectrum data;
s103, selecting a target frequency interval from the frequency spectrum data, and processing the sampling data based on the target frequency interval to obtain detection data of welding spots;
s104, obtaining a detection result of the welding spot based on the detection data of the welding spot.
In the scheme, pulse signals are applied to welding spots to be detected, an optimal target frequency interval of each welding spot is selected from a frequency spectrum converted by sampling data, detection signals corresponding to the welding spots are output in the target frequency interval, signal acquisition, filtering and amplification are carried out in the whole bonding welding spot process and the subsequent wire arc pulling process to obtain detection data corresponding to the welding spots, and detection results of the welding spots are obtained based on the detection data. The detection data output by the target frequency interval of each welding spot realizes the accurate detection of the high-speed electronic device based on the conduction characteristics of different electronic devices.
As an implementation manner, as shown in fig. 2, the detection circuit for detecting the solder bond includes a DDS circuit, and the step of processing the sampled data based on the target frequency interval to obtain solder joint detection data in step S103 includes:
s1031, inputting the sampling data into a DDS circuit to synthesize detection data;
the target frequency interval is used as an output frequency interval of the DDS circuit;
s1032, acquiring reference data of the welding spot, wherein the reference data represents electric parameters when the detection circuit does not contact the welding spot;
s1033, calculating a difference value between the synthesized data and the reference data, and obtaining detection data of the welding spot based on the difference value.
In the scheme, the output frequency of the DDS circuit is set according to the target frequency interval, the situation that the range is too large and cannot verify all frequencies in a short time due to the fact that the normal range comprises tens of thousands of hertz to millions of hertz is avoided, the DDS fixedly outputs an electric signal according to the optimal target frequency interval, the detection circuit is sampled to obtain reference data when not contacted, the reference data comprises a level signal, the difference between the reference data and the detection data output by the DDS circuit is calculated, and the detection result is judged according to the calculated difference. The difference value is compared with a preset difference value interval, and a corresponding detection result is obtained based on the difference value interval in which the difference value falls; or comparing the difference value with a preset difference value threshold, and representing that the welding spot is normally bonded when the difference value is larger than the difference value threshold and representing that the welding spot is abnormally bonded when the difference value is smaller than or equal to the difference value threshold. The DDS circuit is used for outputting detection data based on the target frequency interval, so that the conduction characteristics based on different electronic devices are realized, and particularly, the high-speed electronic devices are accurately detected.
As an implementation manner, the step of obtaining the detection data of the welding spot based on the difference in step S1033 includes:
selecting a target magnification for the difference based on the sampled voltage;
obtaining detection data of the welding spots based on the target magnification;
the step of obtaining the detection result of the welding spot based on the detection data of the welding spot comprises the following steps:
and comparing the detection data of the welding spots with a preset detection threshold value to obtain a corresponding detection result.
In the scheme, the amplification factor is regulated by carrying out the difference value based on the sampling voltage, so that the detection result is based on the conduction characteristics of different electronic devices, the acquisition precision under different frequencies is improved, and especially the difference value is amplified and processed under the very weak signal change of a high-speed electronic device, so that the change of a tiny capacitor smaller than 1pf can be detected under the ultrahigh frequency larger than 600KHz, and the accurate detection of welding bonding is met.
As an achievable way, the step of selecting the target magnification for the difference based on the sampled voltage includes:
acquiring a target saturated voltage of the sampling voltage;
wherein the amplification factor of the difference valueCorresponding to n saturated voltage intervals, wherein n is a natural number;
based on the target saturation voltage corresponds toiSelecting magnification in saturation regionAs the target magnification.
In the scheme, the amplification factor of the difference value is selected according to the amplification factor corresponding to the previous gear when the sampling voltage of the difference value is saturated, so that the difference value is amplified by different times according to the magnitude of the numerical value, and the measurement precision is improved. Illustratively, the detection circuit includes operational amplifiers with different multiples and corresponding channel switching modules to realize amplification with different multiples. The difference value obtains corresponding saturated voltage through the operational amplifier circuit, corresponding amplification factors are obtained based on saturated voltage inquiry, the amplification factor of the last gear is selected to amplify the difference value, and a detection result of the welding spot is obtained based on the amplified difference value. The micro capacitor is realized under the ultra-high frequency, so that the accurate detection of welding bonding is satisfied.
As an implementation manner, the step of selecting the target frequency interval from the spectrum data in step S103 includes:
obtaining basic parameters of the welding spots;
acquiring a corresponding reference frequency interval based on the basic parameters;
and acquiring a sampling frequency interval corresponding to the frequency spectrum data, and selecting an intersection of the reference frequency interval and the sampling frequency interval to obtain the target frequency interval.
In this scheme, by acquiring basic parameters of a welding spot, the basic parameters include materials and/or conductive modes of the welding spot, so as to generate corresponding reference frequency intervals according to different welding spot materials and/or conductive modes, and the conductive modes include an alternating current module or a direct current mode, for example, and the detection circuit switches different detection modes based on the set basic parameters. The automatic detection of different welding materials is realized, and corresponding target frequency intervals are set to be compatible with different welding spots, so that the accurate detection of welding bonding is satisfied.
As an implementation manner, the step of converting the sampled data into spectrum data includes:
and obtaining the spectrum data based on the fast Fourier transform of the sampling data.
In the scheme, the sampling data is efficiently and quickly converted from a time domain signal to a frequency domain signal through FFT (Fast Fourier Transform ) so as to improve the detection efficiency of the whole detection process.
As an achievable manner, the detection method further includes:
acquiring the detection result of each welding spot of the welding rod;
responding to the detection result of any welding spot to represent abnormal bonding of the welding spot, and generating an error reporting signal as a detection result of the welding rod;
and responding to the detection results of all the welding spots to represent that the bonding of the welding spots is normal, and generating a signal for finishing the welding of the welding rod as the detection result of the welding rod.
In the scheme, for a welding rod comprising a plurality of welding spots, each welding spot of the welding rod is sequentially subjected to welding bonding detection, and a detection result of the corresponding welding rod is obtained based on a detection result of the welding spot. Illustratively, as shown in fig. 3, the electrode for the lead wire includes two bonding points, bonding initiation, sampling initialization, bonding of a first bonding point initiation, automatic identification of the electrical characteristics of a first bonding point pad Die (chip), acquisition of ADC data of the first bonding point, and judgment of whether the bonding of the first bonding point is successful; starting bonding a second welding spot, automatically identifying the electric characteristics of a second bonding point pin Lead, collecting ADC data of the second welding spot, and judging whether the bonding of the first welding spot is successful; generating error reporting signals when the first welding spot and/or the second welding spot represent bonding abnormality, generating stop signals of a chip assembly line, and generating detection results corresponding to normal welding rod bonding when the detection results of the first bonding point and the second bonding point represent bonding normality. And continues to detect the subsequent electrode. The automatic detection of the bonding condition of the welding bars is realized, and the accurate detection of the welding bonding is satisfied.
The working principle of the detection method for welding bonding of the present embodiment is specifically described below by way of examples:
as shown in fig. 4, the detection circuit includes an FPGA (Field Programmable Gate Array ) processor, a signal output and sampling circuit, a filter circuit, a waveform processing circuit, a gain circuit, an ADC (Analog-to-Digital Converter) circuit, a DAC (Digital-to-Analog Converter) circuit, a DDS circuit, a multiplier circuit, a mode selection circuit, a protection circuit, a short circuit detection circuit, an IO interface circuit, and a communication circuit;
the FPGA processor is used for calculating the detection data;
the short circuit detection circuit detects whether a short circuit occurs in the chip circuit;
when the chip circuit is not shorted:
the FPGA processor samples to obtain a reference level through the DAC circuit, the waveform processing circuit, the gain circuit and the ADC circuit when the bonding part is not contacted with the detection target.
The bonding sampling signal is acquired by applying a pulse square wave of 2ms when a bonding synchronous signal is received and contacts the surface of a first bonding point serving as a chip bonding pad through the signal output and sampling circuit;
the bonding component comprises a metal wire, a wire clamp, a chopper, a chip to be bonded, a pressing plate and a heat table; one end of the metal wire is connected with the signal output and sampling circuit, the other end of the metal wire is connected with the tail part of the chopper, and the periphery of the metal wire is provided with a wire clamp; the head of the chopper faces to the chip to be bonded and is used for bonding the chip to be bonded; the heat table is provided with a pressing plate, the chip to be bonded is fixed on the heat table through the pressing plate, and the heat table is connected with the signal output and sampling circuit and is grounded together.
Based on the signal output and sampling circuit, the filter circuit, the waveform processing circuit, the gain circuit and the ADC (Analog-to-Digital Converter) circuit are connected in sequence, the sampling signal is transmitted to the FPGA processor for processing. The filter circuit is used for carrying out filter processing on the sampled signals and removing noise, clutter and other interferences; the waveform processing circuit is used for processing and analyzing the filtered signals to obtain key parameters in the bonding process; the gain circuit is used for amplifying the input signal so as to facilitate subsequent processing and analysis; the ADC circuit is used for converting the analog signals into digital signals so as to facilitate the FPGA processor to process the data; the DAC circuit is used for converting the digital signal into an analog signal and is used for making reference voltages in different periods; and the signal output and sampling circuit is as follows: the detected signal is output and sampled.
The FPGA processor converts the sampling data into frequency spectrum data, obtains a target frequency interval, obtains amplification factor based on the difference value of the reference level and the sampling data, outputs the amplification factor to the signal output and sampling circuit for detection sequentially through the DDS circuit, the multiplier circuit, the mode selection circuit and the selection circuit, and directly converts the sampling signal through the ADC circuit into analog/digital conversion and then inputs the analog/digital conversion into the FPGA processor to obtain a detection result; the DDS circuit is used for providing a digital frequency synthesis function, generating signals with various different frequencies and outputting an electric signal based on a target frequency interval; the multiplier circuit is used for signal processing and multiplying the input amplification factor with the electric signal generated by the DDS circuit; the mode selection circuit is used for switching the detection mode according to the set direct current mode or alternating current mode so as to select a proper detection scheme; the protection circuit is used for ensuring that the whole circuit does not cause adverse effect on the chip to be bonded.
And sending the detection result to external equipment through an IO interface circuit or a communication circuit by the FPGA processor.
According to the detection method for welding bonding, the optimal target frequency interval is selected from the frequency spectrum data converted from the sampling data by applying pulses with different frequencies, detection is achieved based on the target frequency interval, compatibility with different welding spots and different electronic device conduction characteristics is achieved, the amplification factor gear is automatically selected, the amplification factor is adjusted in real time for the signal difference value collected at different frequencies, so that the collection precision at different frequencies is optimal, and the change of the tiny capacitance is accurately detected at ultrahigh frequency.
Example 2
The embodiment provides a detection system 200 for welding bonding, as shown in fig. 5, the detection system includes a pulse module 201, a sampling module 202, a detection module 203, and a result output module 204;
the pulse module 201 is configured to apply a pulse signal to a welding spot to be detected; wherein the pulse signal of different frequency is applied at each pulse period;
the sampling module 202 is configured to obtain sampling data of the welding spot, and convert the sampling data into spectrum data;
the detection module 203 is configured to select a target frequency interval from the spectrum data, and process the sampling data based on the target frequency interval to obtain welding spot detection data;
the result output module 204 is configured to determine, based on the detection data of the welding spot, to obtain a detection result of the welding spot.
As an implementation manner, the detection circuit for detecting the welding bond includes a DDS circuit, and the detection module 203 is further configured to input the sampling data into the DDS circuit and output the synthesized data; the target frequency interval is used as an output frequency interval of the DDS circuit;
the detection module 203 is further configured to obtain reference data of the solder joint, where the reference data characterizes an electrical parameter when the detection circuit does not contact the solder joint;
the detection module 203 is further configured to calculate a difference between the synthesized data and the reference data, and obtain detection data of the welding spot based on the difference.
As an achievable way, the sampled data comprise a sampled voltage, said detection module 203 being further adapted to select a target magnification for said difference based on said sampled voltage;
the detection module 203 is further configured to obtain detection data of the welding spot based on the target magnification;
the result output module 204 is further configured to compare the detection data of the welding spot with a preset detection threshold to obtain the corresponding detection result.
As an achievable way, the detection module 203 is further configured to obtain a target saturation voltage of the sampled voltage; wherein the amplification factor of the difference valueCorresponding to n saturated voltage intervals, wherein n is a natural number;
the detection module 203 is further configured to select a magnification factor based on an nth saturation interval corresponding to the target saturation voltageAs the target magnification.
As an achievable way, the sampling module 202 is further configured to obtain basic parameters of the welding spot, preferably, the basic parameters include a material and/or a conduction mode of the welding spot; acquiring a corresponding reference frequency interval based on the basic parameters;
the sampling module 202 is further configured to obtain a sampling frequency interval corresponding to the spectrum data, and select an intersection between the reference frequency interval and the sampling frequency interval to obtain the target frequency interval.
As an achievable way, the sampling module 202 is further configured to obtain the spectral data based on a fast fourier transform of the sampled data.
As one implementation, the detection system 200 further includes a result generation module;
the result generation module is used for obtaining the detection result of each welding point of the welding rod;
the result generation module is also used for responding to the detection result of any welding spot to represent the abnormal bonding of the welding spot, and generating an error report signal as the detection result of the welding rod;
and the result generation module is also used for responding to the detection results of all the welding spots to represent that the bonding of the welding spots is normal, and generating a signal for finishing the welding of the welding rod as the detection result of the welding rod.
It should be noted that, the implementation principle of the welding bond detection system in this embodiment is the same as that of the welding bond detection method in embodiment 1, so that the description thereof is omitted here.
According to the welding bonding detection system provided by the embodiment, through applying pulses with different frequencies, an optimal target frequency interval is selected from frequency spectrum data converted from sampling data, detection is obtained based on the target frequency interval, compatibility with different welding spots and different electronic device conduction characteristics are achieved, the amplification factor gear is automatically selected, the amplification factor is adjusted in real time on signal difference values collected at different frequencies, so that the collection precision is optimal at different frequencies, and the change of a tiny capacitor is accurately detected at ultrahigh frequency.
Example 3
Fig. 6 is a schematic structural diagram of an electronic device according to embodiment 3 of the present disclosure. Comprises a memory, a processor and a computer program stored on the memory and capable of running on the processor, wherein the processor executes the computer program to realize the welding bonding detection method of the embodiment 1. The electronic device 30 shown in fig. 6 is merely an example and should not be construed to limit the functionality and scope of use of the disclosed embodiments.
The electronic device 30 may be in the form of a general purpose computing device, which may be a server device, for example. Components of electronic device 30 may include, but are not limited to: the at least one processor 31, the at least one memory 32, a bus 33 connecting the different system components, including the memory 32 and the processor 31.
The bus 33 includes a data bus, an address bus, and a control bus.
Memory 32 may include volatile memory such as Random Access Memory (RAM) 321 and/or cache memory 322, and may further include Read Only Memory (ROM) 323.
Memory 32 may also include a program/utility 325 having a set (at least one) of program modules 324, such program modules 324 including, but not limited to: an operating system, one or more application programs, other program modules, and program data, each or some combination of which may include an implementation of a network environment.
The processor 31 executes various functional applications and data processing, such as the solder bond detection method of embodiment 1 of the present disclosure, by running a computer program stored in the memory 32.
The electronic device 30 may also communicate with one or more external devices 34 (e.g., keyboard, pointing device, etc.). Such communication may be through an input/output (I/O) interface 35. Also, model-generating device 30 may also communicate with one or more networks, such as a Local Area Network (LAN), a Wide Area Network (WAN), and/or a public network, such as the internet, via network adapter 36. As shown, network adapter 36 communicates with the other modules of model-generating device 30 via bus 33. It should be appreciated that although not shown in the figures, other hardware and/or software modules may be used in connection with the model-generating device 30, including, but not limited to: microcode, device drivers, redundant processors, external disk drive arrays, RAID (disk array) systems, tape drives, data backup storage systems, and the like.
It should be noted that although several units/modules or sub-units/modules of an electronic device are mentioned in the above detailed description, such a division is merely exemplary and not mandatory. Indeed, the features and functionality of two or more units/modules described above may be embodied in one unit/module in accordance with embodiments of the present disclosure. Conversely, the features and functions of one unit/module described above may be further divided into ones that are embodied by a plurality of units/modules.
Example 4
The present disclosure also provides a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, implements the solder bond detection method of embodiment 1.
More specifically, among others, readable storage media may be employed including, but not limited to: portable disk, hard disk, random access memory, read only memory, erasable programmable read only memory, optical storage device, magnetic storage device, or any suitable combination of the foregoing.
In a possible embodiment, the disclosure may also be implemented in the form of a program product comprising program code for causing a terminal device to carry out the detection method of the weld-bond of embodiment 1 when the program product is run on the terminal device.
Wherein the program code for carrying out the present disclosure may be written in any combination of one or more programming languages, and the program code may execute entirely on the user device, partly on the user device, as a stand-alone software package, partly on the user device, partly on a remote device or entirely on the remote device. While specific embodiments of the present disclosure have been described above, it will be appreciated by those skilled in the art that this is by way of example only, and the scope of the disclosure is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the principles and spirit of the disclosure, but such changes and modifications fall within the scope of the disclosure.
Claims (7)
1. A method of detecting a solder bond, wherein a detection circuit for detecting a solder bond includes a DDS circuit, the method comprising:
applying pulse signals to the welding spots to be detected;
wherein the pulse signal of different frequency is applied at each pulse period;
acquiring sampling data of the welding spots, and converting the sampling data into frequency spectrum data;
selecting a target frequency interval from the frequency spectrum data;
processing the sampling data based on the target frequency interval to obtain detection data of the welding spot, wherein the detection data comprises the following steps:
inputting the sampling data into a DDS circuit to output synthesized data;
the target frequency interval is used as an output frequency interval of the DDS circuit;
acquiring reference data of the welding spot, wherein the reference data represents electrical parameters when the detection circuit does not contact the welding spot;
calculating a difference between the synthesized data and the reference data;
the sampled data comprises a sampled voltage, and a target saturated voltage of the sampled voltage is obtained;
wherein the amplification factor of the difference valueWhereini=1, 2 … … n, corresponding to n saturation voltage intervals, n being a natural number;
based on the target saturation voltage corresponds toiSelecting magnification in saturation regionAs a target magnification;
obtaining detection data of the welding spots based on the target magnification;
obtaining a detection result of the welding spot based on the detection data of the welding spot comprises the following steps:
and comparing the detection data of the welding spots with a preset detection threshold value to obtain a corresponding detection result.
2. The method of claim 1, wherein the step of selecting a target frequency interval from the spectral data comprises:
obtaining basic parameters of the welding spots;
acquiring a corresponding reference frequency interval based on the basic parameters;
and acquiring a sampling frequency interval corresponding to the frequency spectrum data, and selecting an intersection of the reference frequency interval and the sampling frequency interval to obtain the target frequency interval.
3. The method of claim 1, wherein converting the sampled data into spectral data comprises:
and obtaining the spectrum data based on the fast Fourier transform of the sampling data.
4. The method of detecting a solder bond of claim 1, further comprising:
acquiring the detection result of each welding spot of the welding rod;
responding to the detection result of any welding spot to represent abnormal bonding of the welding spot, and generating an error reporting signal as a detection result of the welding rod;
and responding to the detection results of all the welding spots to represent that the bonding of the welding spots is normal, and generating a signal for finishing the welding of the welding rod as the detection result of the welding rod.
5. The detection system for welding bonding is characterized in that a detection circuit for detecting welding bonding comprises a DDS circuit, and the detection system comprises a pulse module, a sampling module, a detection module and a result output module;
the pulse module is used for applying pulse signals to the welding spots to be detected; wherein the pulse signal of different frequency is applied at each pulse period;
the sampling module is used for acquiring sampling data of the welding spots and converting the sampling data into frequency spectrum data;
the detection module is used for selecting a target frequency interval from the frequency spectrum data, and processing the sampling data based on the target frequency interval to obtain welding spot detection data; the DDS circuit is also used for inputting the sampling data into the DDS circuit to output synthesized data; the target frequency interval is used as an output frequency interval of the DDS circuit;
the detection module is also used for acquiring reference data of the welding spot, wherein the reference data represents electric parameters when the detection circuit does not contact the welding spot; calculating a difference between the synthesized data and the reference data; the sampled data comprises a sampled voltage, and a target saturated voltage of the sampled voltage is obtained; wherein the amplification factor of the difference valueWhereini=1, 2 … … n, corresponding to n saturation voltage intervals, n being a natural number; based on the target saturation voltage corresponds toiThe saturation interval is selected to be the amplification factor +.>As a target magnification; obtaining detection data of the welding spots based on the target magnification;
the result output module is used for obtaining the detection result of the welding spot based on the detection data of the welding spot; and the detection data of the welding spots are compared with a preset detection threshold value to obtain a corresponding detection result.
6. An electronic device comprising a memory, a processor and a computer program stored on the memory for execution on the processor, wherein the processor, when executing the computer program, implements the method of detecting a solder bond according to any one of claims 1-4.
7. A computer-readable storage medium, on which a computer program is stored, characterized in that the computer program, when executed, implements the method for detecting a solder bond according to any one of claims 1-4.
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