CN117146469B - Method for manufacturing semiconductor refrigerator, electronic device and readable storage medium - Google Patents
Method for manufacturing semiconductor refrigerator, electronic device and readable storage medium Download PDFInfo
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- CN117146469B CN117146469B CN202311239212.0A CN202311239212A CN117146469B CN 117146469 B CN117146469 B CN 117146469B CN 202311239212 A CN202311239212 A CN 202311239212A CN 117146469 B CN117146469 B CN 117146469B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 231
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000003860 storage Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 238000005520 cutting process Methods 0.000 claims abstract description 43
- 238000004590 computer program Methods 0.000 claims description 13
- 238000002360 preparation method Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 7
- 230000000712 assembly Effects 0.000 description 10
- 238000000429 assembly Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The application relates to a preparation method of a semiconductor refrigerator, electronic equipment and a readable storage medium, wherein at least two first electrode modules are arranged on a first whole plate; disposing a semiconductor array on a first full board; at least two second electrode modules are arranged on the second whole plate; attaching the first mother board and the second mother board, and connecting each semiconductor module with each second electrode module so as to enable the first electrode module, the semiconductor module and the second electrode module of each semiconductor refrigerator to form a complete current path; and cutting the first whole plate and the second whole plate to obtain at least two semiconductor refrigerators. A first master having a plurality of first semiconductor modules and a second master having a plurality of second semiconductor modules can be prepared at a time, even a semiconductor refrigerator of smaller specification can be easily operated by designing the first substrate and the second substrate; greatly improves the production efficiency of the semiconductor refrigerator and reduces the process difficulty in the production process.
Description
Technical Field
The present application relates to the field of semiconductor refrigerator manufacturing, and in particular, to a semiconductor refrigerator manufacturing method, an electronic device, and a readable storage medium, that is, a semiconductor refrigerator manufacturing method, an electronic device, and a computer readable storage medium.
Background
The semiconductor refrigerator (Thermoelectric cooler, TEC) is made using the peltier effect of semiconductor materials and absorbs and releases heat at one end when a direct current is passed through a couple of two semiconductor materials. Typically, the P-type semiconductor and the N-type semiconductor are connected by a metal electrode and disposed between two ceramic substrates; when current flows from the TEC, heat will be transferred from one side of the TEC to the other.
The traditional TEC product design and production are that one product corresponds to one module, and some TEC products are small in size, for example, the specification is smaller than 0.5cm multiplied by 0.4cm. TEC products with very small specifications are difficult to operate in a process, for example, the TEC products are difficult to take and place, and when one TEC product is produced, the TEC product needs to be switched to the next one, and frequent replacement actions are needed, so that the TEC product has low production efficiency and high manufacturing difficulty.
Disclosure of Invention
Based on this, it is necessary to provide a method of manufacturing a semiconductor refrigerator, an electronic apparatus, and a readable storage medium.
In one embodiment, a method of manufacturing a semiconductor refrigerator includes the steps of:
S100, at least two first electrode modules are arranged on a first whole plate and serve as a first mother plate;
s200, arranging a semiconductor array on the first whole plate to form a semiconductor module on each first electrode module, wherein each first electrode module and the semiconductor module on the first electrode module correspond to a semiconductor refrigerator together;
s300, at least two second electrode modules are arranged on a second whole plate and serve as a second master plate; wherein each second electrode module corresponds to each first electrode module one by one;
s400, aligning the first mother plate and the second mother plate so as to align each second electrode module with each semiconductor module;
S500, attaching the first mother board and the second mother board, and connecting each semiconductor module with each second electrode module so as to enable the first electrode module, the semiconductor module and the second electrode module of each semiconductor refrigerator to form a complete current path;
S600, cutting the first whole plate and the second whole plate to obtain at least two semiconductor refrigerators, wherein each semiconductor refrigerator comprises a first substrate from the first whole plate, a first electrode module, a semiconductor module, a second electrode module and a second substrate from the second whole plate.
According to the preparation method of the semiconductor refrigerator, the first mother board with a plurality of first semiconductor modules and the second mother board with a plurality of second semiconductor modules can be prepared at one time, and because the first semiconductor modules and the second semiconductor modules are respectively arranged on the first substrate and the second substrate, even the semiconductor refrigerator with smaller specification can be conveniently operated by designing the first substrate and the second substrate, the semiconductor refrigerator is favorable for taking and placing the small semiconductor refrigerator in the production stage; and because the first semiconductor array and the second semiconductor array are respectively arranged on the first whole plate and the second whole plate, compared with the single preparation mode of the traditional semiconductor refrigerator, the operation action is reduced, the production efficiency of the semiconductor refrigerator is greatly improved through the production mode of master plate imposition, and the process difficulty in the production process is reduced.
In one embodiment, in step S100, each of the first electrode modules is arranged to form a first electrode array; in step S200, each of the second electrode modules is arranged to form a second electrode array corresponding to the first electrode array; or alternatively
Each first electrode module has the same specification, and each second electrode module also has the same specification.
In one embodiment, in step S100, a first cutting area and a first edge area surrounding the first cutting area are disposed on the first whole plate, and each first electrode module is disposed on the first cutting area;
In step S200, a second cutting area and a second edge area surrounding the second cutting area are disposed on the second whole plate, and each second electrode module is disposed on the second cutting area.
In one embodiment, in step S100, a first positioning hole and a first identification bit are further disposed in the first edge area, or a first cutting indication line is further disposed in the first edge area;
in step S200, a second positioning hole and a second identification bit are further disposed in the second edge area, or a second cutting indication line is further disposed in the second edge area.
In one embodiment, in step S500, the first substrate of the semiconductor refrigerator forms a hot side and the second substrate of the semiconductor refrigerator forms a cold side.
In one embodiment, the first electrode of the first electrode module including the first connection portion includes the first connection portion and a first connection potential;
The second electrode of the second electrode module is used as a second connecting part;
The first connection potential is used for accessing current, the first connection part, the semiconductor module and the second connection part correspond to each other, and the first connection part, the semiconductor module, the second connection part and the first connection potential form a complete current path together.
In one embodiment, each of the first connection portions is integrally connected in series with each of the second connection portions, and forms only one current path together with the two first connection potentials.
In one embodiment, part of the first connection portions and part of the second connection portions are arranged in series to form one current path together with the two first connection potentials; and
Each first connecting part and each second connecting part integrally form at least two parallel current paths.
In one embodiment, an electronic device includes a memory storing a computer program and a processor that, when executing the computer program, performs the steps of the method for manufacturing a semiconductor refrigerator of any of the embodiments.
In one embodiment, a computer readable storage medium stores a computer program which, when executed by a processor, implements the steps of the method of manufacturing a semiconductor refrigerator of any of the embodiments.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments or the conventional techniques of the present application, the drawings required for the descriptions of the embodiments or the conventional techniques will be briefly described below, and it is apparent that the drawings in the following descriptions are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.
Fig. 1 is a schematic flow chart of an embodiment of a method for manufacturing a semiconductor refrigerator according to the present application.
Fig. 2 is a schematic flow chart of another embodiment of a method for manufacturing a semiconductor refrigerator according to the present application.
Fig. 3 is a schematic structural diagram of a first master related to a method for manufacturing a semiconductor refrigerator according to the present application.
FIG. 4 is another schematic view of the embodiment of FIG. 3.
Fig. 5 is an enlarged schematic view at a of the embodiment shown in fig. 4.
Fig. 6 is a schematic view of the structure of a first assembly of the embodiment shown in fig. 5.
Fig. 7 is a schematic structural diagram of a second master related to the method for manufacturing a semiconductor refrigerator according to the present application.
FIG. 8 is another schematic view of the embodiment of FIG. 7.
Fig. 9 is an enlarged schematic view of the embodiment of fig. 8 at B.
Fig. 10 is a schematic view of the construction of a second assembly of the embodiment of fig. 9.
Fig. 11 is a schematic diagram of the embodiment of fig. 6 connected to the embodiment of fig. 10 to provide a semiconductor refrigerator (300).
Fig. 12 is a schematic diagram showing the positions of the first electrode module and the second electrode module according to the embodiment shown in fig. 11.
Fig. 13 is a schematic diagram of the current path of the semiconductor refrigerator of the embodiment shown in fig. 12.
Fig. 14 is a schematic diagram showing the positions of the first electrode module and the semiconductor module according to the embodiment shown in fig. 11.
Reference numerals: the first master 100, the first full plate 110, the first substrate 111, the first dicing area 112, the first edge area 113, the first electrode module 120, the first electrode 121, the first connection portion 122, the first connection potential 123, the first positioning hole 130, the first identification bit 140, the first dicing indicator line 150, the first assembly 160, the second master 200, the second full plate 210, the second substrate 211, the second dicing area 212, the second edge area 213, the second electrode module 220, the second electrode 221, the second connection portion 222, the second positioning hole 230, the second identification bit 240, the second dicing indicator line 250, the second assembly 260, the second contact surface 270, the semiconductor refrigerator 300, the semiconductor array 310, the semiconductor module 311, the P-type semiconductor 312, the N-type semiconductor 313, the current path 320.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and the like are used in the description of the present application for the purpose of illustration only and do not represent the only embodiment.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" on a second feature may be that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through intermedial media. Moreover, a first feature "above," "over" and "on" a second feature may be a first feature directly above or obliquely above the second feature, or simply indicate that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely under the second feature, or simply indicating that the first feature is less level than the second feature.
Unless defined otherwise, all technical and scientific terms used in the specification of the present application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used in the description of the present application includes any and all combinations of one or more of the associated listed items.
A method of manufacturing the semiconductor refrigerator, an electronic device, and a readable storage medium will be described in detail with reference to fig. 1 to 14. The application discloses a preparation method of a semiconductor refrigerator, electronic equipment and a readable storage medium, which comprise part of technical features or all technical features of the following embodiments; that is, the manufacturing method of the semiconductor refrigerator includes part or all of the following steps. In one embodiment of the present application, a method for manufacturing a semiconductor refrigerator is shown in fig. 1, which includes the steps of: s100, at least two first electrode modules are arranged on a first whole plate and serve as a first mother plate; s200, arranging a semiconductor array on the first whole plate to form a semiconductor module on each first electrode module, wherein each first electrode module and the semiconductor module on the first electrode module correspond to a semiconductor refrigerator together; s300, at least two second electrode modules are arranged on a second whole plate and serve as a second master plate; wherein each second electrode module corresponds to each first electrode module one by one; s400, aligning the first mother plate and the second mother plate so as to align each second electrode module with each semiconductor module; s500, attaching the first mother board and the second mother board, and connecting each semiconductor module with each second electrode module so as to enable the first electrode module, the semiconductor module and the second electrode module of each semiconductor refrigerator to form a complete current path; s600, cutting the first whole plate and the second whole plate to obtain at least two semiconductor refrigerators, wherein each semiconductor refrigerator comprises a first substrate from the first whole plate, a first electrode module, a semiconductor module, a second electrode module and a second substrate from the second whole plate. According to the preparation method of the semiconductor refrigerator, the first mother board with a plurality of first semiconductor modules and the second mother board with a plurality of second semiconductor modules can be prepared at one time, and because the first semiconductor modules and the second semiconductor modules are respectively arranged on the first substrate and the second substrate, even the semiconductor refrigerator with smaller specification can be conveniently operated by designing the first substrate and the second substrate, the semiconductor refrigerator is favorable for taking and placing the small semiconductor refrigerator in the production stage; and because the first semiconductor array and the second semiconductor array are respectively arranged on the first whole plate and the second whole plate, compared with the single preparation mode of the traditional semiconductor refrigerator, the operation action is reduced, the production efficiency of the semiconductor refrigerator is greatly improved through the production mode of master plate imposition, and the process difficulty in the production process is reduced.
In order to facilitate process control, in one embodiment, the first whole plate and the second whole plate are cut separately to obtain at least two, for example, a plurality of, semiconductor refrigerators, which, as described above, include a first substrate derived from the first whole plate, the first electrode module, the semiconductor module, the second electrode module, and a second substrate derived from the second whole plate; and the first substrate of the semiconductor refrigerator forms a hot face and the second substrate of the semiconductor refrigerator forms a cold face. Namely, the preparation method of the semiconductor refrigerator is shown in fig. 2, and comprises the following steps: s100, at least two first electrode modules are arranged on a first whole plate and serve as a first mother plate; s200, arranging a semiconductor array on the first whole plate to form a semiconductor module on each first electrode module, wherein each first electrode module and the semiconductor module on the first electrode module correspond to a semiconductor refrigerator together; s300, at least two second electrode modules are arranged on a second whole plate and serve as a second master plate; wherein each second electrode module corresponds to each first electrode module one by one; s400, aligning the first mother plate and the second mother plate so as to align each second electrode module with each semiconductor module; s500, attaching the first mother board and the second mother board, and connecting each semiconductor module with each second electrode module so as to enable the first electrode module, the semiconductor module and the second electrode module of each semiconductor refrigerator to form a complete current path; s600, respectively cutting the first whole plate and the second whole plate to obtain at least two semiconductor refrigerators, wherein each semiconductor refrigerator comprises a first substrate from the first whole plate, the first electrode module, the semiconductor module, the second electrode module and a second substrate from the second whole plate; and the first substrate of the semiconductor refrigerator forms a hot face and the second substrate of the semiconductor refrigerator forms a cold face. The rest of the embodiments are analogized and will not be described in detail.
In this embodiment, the first whole plate and the second whole plate may be cut simultaneously, that is, the first whole plate and the second whole plate may be cut by one cutting operation, for example, the first whole plate and the second whole plate may be welded together, so that the cutting is performed together. In other embodiments, the first whole plate and the second whole plate may be cut sequentially, for example, the first whole plate is cut first and then the second whole plate is cut; or cutting the second whole plate first and then cutting the first whole plate.
In order to improve the production efficiency of the semiconductor refrigerator and adapt to the smaller semiconductor refrigerator, further, a master batch production mode is adopted to realize a semiconductor array; and arranging a semiconductor array on the first whole plate, wherein the semiconductor array corresponds to the semiconductor modules in at least two identical or different semiconductor refrigerators. In one embodiment, as shown in fig. 3 and 4, at least two first electrode modules 120 are disposed on the first whole plate 110 as the first master 100; further, a first cutting area 112 and a first edge area 113 surrounding the first cutting area 112 are disposed on the first whole plate 110, and each first electrode module 120 is disposed on the first cutting area 112; further, the semiconductor array is disposed on each of the first electrode modules 120 based on each of the first electrode modules 120, that is, the semiconductor array is indirectly disposed on the first full board 110 through each of the first electrode modules 120; referring to fig. 5, a first electrode array composed of the first electrode modules 120 is disposed on the first whole plate 110. Fig. 4 shows 7 rows and 10 columns of the first electrode modules 120, and fig. 5 shows 9 of the first electrode modules 120.
In this embodiment, a first positioning hole 130 and a first identification position 140 are further provided in the first edge area 113, where the first positioning hole 130 is used for positioning the first master 100 or the first whole board 110 thereof, the number of the first positioning holes 130 is typically three or more, and the accurate positioning of the first whole board 110 in the subsequent cutting process is ensured in a three-point surface mode. The first identification bit 140 is used to mark the surface of the first master 100 or the first whole board 110 thereof, and in the embodiment shown in fig. 4, the first identification bit 140 is disposed on the surface of the first whole board 110 provided with the first electrode module 120, so as to ensure that the manual identification or the machine identification is correct, for example, an industrial camera is used to identify the first identification bit 140 for positioning each process flow.
In this embodiment, a first cutting indication line 150 is further disposed in the first edge area 113, that is, the first whole board 110 is disposed in the first edge area 113, where the first cutting indication line 150 is used for indicating a cutting position, so as to ensure that the semiconductor refrigerator 300 or the first assembly 160 thereof obtained by cutting the first whole board 110 meets design requirements.
Since the semiconductor array 310 is composed of the semiconductor modules 311, at least two first assemblies 160 are obtained after the first whole board 110 is cut, the first assemblies 160 are part of a semiconductor refrigerator, the first assemblies 160 comprise a first substrate 111, a first electrode module 120 and the semiconductor modules 311, and similarly, the second assemblies 260 comprise a second substrate 211 and a second electrode module 220; the semiconductor refrigerator 300 of the present application is formed by connecting a first assembly and a second assembly, for example, the first whole board 110 and the second whole board 210 are attached, and then the semiconductor module 311 and the second electrode module 220 are connected, for example, by bonding with conductive adhesive or wire bonding, while the conventional method is to produce the semiconductor refrigerator one by one, so that there are problems of efficiency and difficult handling of the miniaturized semiconductor refrigerator. As shown in fig. 5 and 6, each first assembly 160 includes a first substrate 111 and a first electrode module 120, and in combination with fig. 11, each first assembly 160 further includes a semiconductor module 311; the first electrode 121 of the first electrode module 120 includes a first connection portion 122 and a first connection potential 123, and the second electrode 221 of the second electrode module 220 serves as a second connection portion 222. That is, the first electrode module 120 includes first connection portions 122 and first connection portions 123, each of the first connection portions 122 is used for connecting one semiconductor of the semiconductor module 311 and connecting the second connection portion 222 of the second electrode module 220 through one semiconductor of the semiconductor module 311, and the first connection portions 123 are used for connecting a current source so that current flows in and out of the semiconductor refrigerator 300 to realize cooling or heating.
In this embodiment, the number of the first connection portions 122 is multiple and uniformly distributed, so as to make the refrigeration or heating more uniform; the number of the first connecting potentials 123 is two, and the first connecting potentials are respectively connected with two ends of a current source, one end of the current source is led in, and the other end of the current source is led out, so that the refrigerating effect of the semiconductor refrigerator is realized; the reverse connection of the current source can realize the heating effect.
In one embodiment, in step S100, each of the first electrode modules 120 is arranged to form a first electrode array; in step S200, each of the second electrode modules 220 is arranged to form a second electrode array corresponding to the first electrode array. In one embodiment, as shown in fig. 7 and 8, at least two second electrode modules 220 are disposed on the second whole plate 210 as the second master 200; wherein each of the second electrode modules 220 corresponds to each of the first electrode modules 120 one by one; that is, the second electrode module 220 is disposed on the second whole plate 210 as the second master 200, and further, the second dicing area 212 and the second edge area 213 are disposed on the second whole plate 210, and the second semiconductor array 220 is disposed on the second dicing area 212. Referring to fig. 9, a second electrode array composed of the second electrode modules 220 is disposed on the second whole plate 210. In step S200, a second electrode array composed of a second electrode module 220 is disposed on the second whole plate 210; wherein each second electrode module 220 corresponds to each first electrode module 120 one by one, that is, each second electrode module 220, each semiconductor module 311 corresponds to each first electrode module 120 one by one, and each second electrode module 220 corresponds to one of the first electrode modules 120 and the semiconductor module 311 thereon. Corresponding to fig. 4, fig. 8 shows 7 rows and 10 columns of the second electrode modules 220, and fig. 9 shows 9 of the second electrode modules 220.
Similarly, since the second electrode array is formed by the second electrode module 220, at least four second assemblies 260 having the same number as the first assemblies 160 are obtained after cutting the second whole plate 210, the second assemblies 260 are also part of the semiconductor refrigerator 300, and the first assemblies 160 and the second assemblies 260 are described for convenience of description. As shown in fig. 8 and 9, each of the second assemblies 260 includes a second substrate 211 and one of the second electrode modules 220; the second electrode module 220 includes a plurality of second electrodes 221; referring to fig. 10 and 11, the second electrode 221 is used as a second connection portion 222, and the second connection portion 222 is used to contact one semiconductor in the semiconductor module 311 and is connected to the first connection portion 122 through the semiconductor, and indirectly connected to a current source through the first connection potential 123.
In this embodiment, a second positioning hole 230 and a second identification position 240 are further disposed in the second edge area 213, and similarly, the second positioning hole 230 is used to position the second master 200 or the second whole board 210 thereof, the number of the second positioning holes 230 is typically three or more, and the position stability of the second whole board 210 in the subsequent cutting process is ensured in a three-point surface manner. The second identification bit 240 is used to mark the surface of the second master 200 or the second whole board 210 thereof, and in the embodiment shown in fig. 8, the second identification bit 240 is disposed on the surface of the second whole board 210 provided with the second electrode module 220, so as to ensure that the manual identification or the machine identification is correct.
In this embodiment, a second cutting indication line 250 is further disposed in the second edge area 213, that is, the second whole board 210 is disposed in the second edge area 213, where the second cutting indication line 250 is used to indicate a cutting position, so as to ensure that the semiconductor refrigerator 300 or the second assembly 260 thereof obtained by cutting the second whole board 210 meets design requirements.
In step S400, the first master 100 and the second master 200 are aligned so that each of the second electrode modules 220 is aligned with each of the semiconductor modules 311; that is, the first master 100 and the second master 200 are aligned, so that each semiconductor module 311 and each second electrode module 220 are connected in a one-to-one correspondence for a subsequent step, that is, each semiconductor module 311 corresponds to one second electrode module 220, and each second electrode module 220 also corresponds to one semiconductor module 311; in one embodiment, each of the first electrode modules 120 has the same specification, and each of the second electrode modules 220 also has the same specification. Further, in one embodiment, the first electrode array and the second electrode array are regular arrays, and the semiconductor array 310 is also a regular array, that is, the semiconductor modules 311 of the semiconductor array 310 have the same specification and are regularly arranged in a regular array, such as a matrix; or the first electrode array and the second electrode array are irregular arrays, the semiconductor array 310 is also a corresponding irregular array, and each semiconductor module 311 of the semiconductor array 310 has different specifications, so that each semiconductor module 311 corresponds to each first electrode module 120 and each second electrode module 220 one by one; further, the semiconductor modules 311 are uniformly arranged, for example, uniformly arranged at equal density, in the first cutting area 112 of the first whole board 110, so as to fully utilize the first whole board 110 to avoid waste; by the design, one master plate can produce semiconductor refrigerators with the same specification and semiconductor refrigerators with different specifications, and only needs to be typeset in advance before production.
To avoid waste, in one embodiment, the area ratio of each first electrode module 120 on the first cutting region 112 is greater than 72%, that is, the area ratio of each semiconductor module 311 on the first cutting region 112 is greater than 72%, and the area ratio of each second electrode module 220 on the second cutting region 212 is also greater than 72%, so as to fully utilize the first whole plate 110 and the second whole plate 210. The design is beneficial to preparing a plurality of semiconductor refrigerators with the same specification or different specifications at one time, greatly improves the production efficiency of the semiconductor refrigerator by the way of splicing and butting the first master plate 100 and the second master plate 200, reduces the process difficulty in the production process, and is particularly suitable for the efficient production of small-specification semiconductor refrigerators; on the other hand, the utilization of the ceramic substrate material as the first plate 110 and the second plate 210 is also facilitated.
In one embodiment, referring to fig. 4, 8 and 11, the surface of the first master 100 provided with the first electrode module 120 is aligned with the surface of the second master 200 provided with the second electrode module 220, and for this embodiment provided with the first positioning hole 130, the first identification position 140, the second positioning hole 230 and the second identification position 240, only the surface of the first master 100 provided with the first electrode module 120 and the surface of the second master 200 provided with the second electrode module 220 need to be identified according to the first identification position 140 and the second identification position 240, so that the convenient automatic identification and fool-proofing design is provided; each of the first positioning holes 130 is then aligned with each of the second positioning holes 230, which is easy to be automatically or manually aligned. In such a design, since the first semiconductor array 120 and the second semiconductor array 220 are respectively disposed on the first whole plate 110 and the second whole plate 210, and are cut after being spliced, compared with the single preparation mode of the conventional semiconductor refrigerator 300, the operation actions are reduced, the production efficiency of the semiconductor refrigerator 300 is greatly improved through the production mode of master imposition, and the process difficulty in the production process is reduced.
In step S500, the first master 100 and the second master 200 are attached, and the semiconductor modules 311 and the second electrode modules 220 are connected, for example, by welding the semiconductor modules 311 and the second electrode modules 220 with metal electrodes in a one-to-one correspondence, or by bonding the semiconductor modules 311 and the second electrode modules 220 with conductive adhesive in a one-to-one correspondence, so that the first electrode modules 120, the semiconductor modules 311 and the second electrode modules 220 of each semiconductor refrigerator 300 form a complete current path 320. The first electrode 121 of the first electrode module 120 corresponds to the second electrode 221 of the second electrode module 220 in position as shown in fig. 12, and it can be understood that the second electrode module 220 and the second electrode 221 thereof shown in fig. 12 are in an inverted state for illustration.
The first electrode module 120, the semiconductor module 311 and the second electrode module 220 form a complete current path 320 as shown in fig. 12 and 13. In this embodiment, each of the first connection portions 122 and each of the second connection portions 222 are integrally connected in series, and form only one current path 320 together with the two first connection potentials 123, so that the currents of the connection portions, including the first connection portion 122 and the second connection portion 222, are identical. In other embodiments, a part of the first connection portions 122 and a part of the second connection portions 222 are arranged in series to form a current path 320 together with the two first connection potentials 123; and, each of the first connection parts and each of the second connection parts integrally form at least two current paths 320 in parallel, so that a plurality of current paths 320 can be formed in one semiconductor refrigerator 300 in cooperation with series and parallel. It will be appreciated that the current paths 320, i.e., circuits, within each semiconductor refrigerator may be connected in parallel or in series or a combination thereof, but that at least one circuit is connected in series between the positive and negative electrodes.
In one embodiment, as shown in fig. 14, the first electrode 121 of the first electrode module 120 corresponds to each semiconductor of the semiconductor module 311, each semiconductor of the semiconductor module 311 includes a P-type semiconductor 312 and an N-type semiconductor 313, each P-type semiconductor 312 and each N-type semiconductor 313 are disposed at intervals to form a pair of PN junctions, and the first connection portion 122 and the second connection portion 222 are matched to form a part of a circuit.
Referring to fig. 6 and 10, in one embodiment, the first electrode 121 of the first electrode module 120 includes a first connection portion 122 and a first connection potential 123; the second electrode 221 of the second electrode module 220 serves as a second connection portion 222, that is, the second electrode 221 of the second electrode module 220 serves as each second connection portion 222; the first connection potential 123 is used for connecting current, the first connection portion 122, the semiconductor module 311 and the second connection portion 222 correspond to each other, and the first connection portion 122, the semiconductor module 311, the second connection portion 222 and the first connection potential 123 together form a complete current path 320.
In step S600, the first whole plate 110 and the second whole plate 210 are cut to obtain at least two semiconductor refrigerators 300, i.e. a large number of semiconductor refrigerators 300 can be obtained after completing a single manufacturing process, wherein the number of semiconductor refrigerators 300 is related to the number of semiconductor modules 311, i.e. the number of the first electrode modules 120 and the second electrode modules 220. The first whole board 110 and the second whole board 210 are cut to obtain semiconductor refrigerators 300 as shown in fig. 11, wherein each semiconductor refrigerator 300 includes a first substrate 111 from the first whole board 110, the first electrode module 120, the semiconductor module 311, the second electrode module 220, and a second substrate 211 from the second whole board 210. In one embodiment, the first substrate 111 of the semiconductor refrigerator 300 forms a hot surface, and the second substrate 211 of the semiconductor refrigerator 300 forms a cold surface, i.e., a cooling surface. That is, in step S100, the first plate 110 forms a hot surface, and in step S300, the second plate 210 forms a cold surface. As shown in fig. 11, the cold face is used as a second contact face 270 for contacting a structure requiring heat dissipation; a surface of the second substrate 211, on which the second electrode module 220 is not disposed, is used as the cold surface; the side of the first substrate 111 facing away from the cold side, i.e. the side where the first electrode module 120 is not disposed, is used as a hot side, and may be used to contact a fan or a radiator, so as to radiate heat of the hot side, thereby protecting the semiconductor refrigerator 300 and guaranteeing the design life thereof. In addition, the first master 100 having a plurality of semiconductor modules 311 and the second master 200 having a plurality of second electrode modules 220 can be prepared at a time by such a design, and since the semiconductor modules 311 and the second electrode modules 220 are respectively disposed on the first substrate 111 and the second substrate 211, even the semiconductor refrigerator 300 having a smaller specification can be easily handled by designing the first substrate 111 and the second substrate 211, thereby facilitating the taking and placing of the small-sized semiconductor refrigerator 300, particularly the ultra-small-sized semiconductor refrigerator 300, in the production stage.
In one embodiment, taking a 27mm×27mm master as an example, the first master 100 uses a 27mm×27mm first whole board 110, the second master 200 also uses a 27mm×27mm second whole board 210, and the single products of the hot surface and the cold surface, that is, the first electrode module 120 and the semiconductor module 311 thereon, and the second electrode module 220 are respectively combined on the 27mm×27mm master, for example, as shown in fig. 4 and 8, 7 rows×10 columns of 70 first electrode modules 120 or second electrode modules 220 may be arranged on one master, corresponding to a total of 70 semiconductor refrigerator 300 products.
Thus, one master plate is produced at a time, and 70 products are produced. If the individual product sizes change, the arrangement can be modified so that it is adequately aligned over a 27mm x 27mm master. In this embodiment, the hot side of the master, e.g., the first plate 110, and the cold side, e.g., the second plate 210, each have three positioning holes with a diameter of 2.02mm, and the product deflector pattern positions are referenced to the positioning holes. And when the front surface of the hot surface is attached to the front surface of the cold surface, the pin holes are used for positioning, so that the hot surface and the cold surface of each product graph are ensured to correspond. After the die plate was bonded and welded, the master was cut using a dicing saw with reference to the dicing lines on the back of the cold face shown in fig. 7, and finally divided into 70 individual products. Thus, a plurality of TEC products are distributed on the mother plate with the thickness of 27mm multiplied by 27mm, the mother plate is cut after the production of the mother plate, the mother plate is divided into single TEC products, the TEC products with different sizes are produced through the mother plate, the size of the mother plate is unified, the jigs used in the production process can be unified in the production process, and the production efficiency is improved.
In one embodiment, an electronic device includes a memory and a processor, where the memory stores a computer program, and the processor implements the steps of the method for manufacturing a semiconductor refrigerator according to any of the embodiments, that is, implements the steps of the method for manufacturing a semiconductor refrigerator according to any of the embodiments, when executing the computer program. The electronic device may also be referred to as a device or an electronic control device.
In one embodiment, a computer readable storage medium stores a computer program which, when executed by a processor, implements the steps of the method of manufacturing a semiconductor refrigerator of any of the embodiments. Those skilled in the art will appreciate that all or part of the process steps in the method for manufacturing a semiconductor refrigerator according to the above embodiments may be implemented by a computer program for instructing relevant hardware, where the computer program may be stored in a non-volatile computer readable storage medium, and the computer program may include the process steps in the embodiments of the methods described above when executed. Any reference to memory, storage, database, or other medium used in embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, or the like. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory. By way of illustration, and not limitation, RAM can be in various forms such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), etc.
It should be noted that other embodiments of the present application also include a method for manufacturing a semiconductor refrigerator, an electronic device, and a readable storage medium, which are formed by combining the technical features of the above embodiments.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of the application should be determined from the following claims.
Claims (11)
1. A method of manufacturing a semiconductor refrigerator, comprising the steps of:
s100, at least two first electrode modules (120) are arranged on a first whole plate (110) and serve as a first master plate (100);
S200, arranging a semiconductor array (310) on the first whole plate (110) to form a semiconductor module (311) on each first electrode module (120), wherein each first electrode module (120) and the semiconductor module (311) on the first electrode module correspond to one semiconductor refrigerator (300) together; wherein the semiconductor array (310) corresponds to semiconductor modules (311) in at least two different semiconductor refrigerators (300);
s300, arranging at least two second electrode modules (220) on a second whole plate (210) as a second master plate (200); wherein each second electrode module (220) corresponds to each first electrode module (120) one by one;
s400, aligning the first master (100) and the second master (200) so that each second electrode module (220) is aligned with each semiconductor module (311);
S500, bonding the first mother board (100) and the second mother board (200), and connecting each semiconductor module (311) and each second electrode module (220) so as to enable the first electrode module (120), the semiconductor module (311) and the second electrode module (220) of each semiconductor refrigerator (300) to form a complete current path (320);
S600, cutting the first whole plate (110) and the second whole plate (210) to obtain at least two semiconductor refrigerators (300), wherein each semiconductor refrigerator (300) comprises a first substrate (111) from the first whole plate (110), the first electrode module (120), the semiconductor module (311), the second electrode module (220) and a second substrate (211) from the second whole plate (210);
Wherein, the first electrode (121) of the first electrode module (120) comprises a first connection part (122) and a first connection potential (123);
A second electrode (221) of the second electrode module (220) is used as a second connecting part (222);
the first connection potential (123) is used for accessing current, the first connection portion (122), the semiconductor module (311) and the second connection portion (222) correspond to each other, and the first connection portion (122), the semiconductor module (311), the second connection portion (222) and the first connection potential (123) form a complete current path (320) together.
2. The method of manufacturing a semiconductor refrigerator according to claim 1, wherein in step S100, each of the first electrode modules (120) is arranged to form a first electrode array; in step S200, each of the second electrode modules (220) is arranged to form a second electrode array corresponding to the first electrode array.
3. The method of manufacturing a semiconductor refrigerator according to claim 1, wherein each of the first electrode modules (120) has the same specification, and each of the second electrode modules (220) also has the same specification.
4. The method of manufacturing a semiconductor refrigerator according to claim 1, wherein in step S100, a first cutting area (112) and a first edge area (113) surrounding the first cutting area (112) are provided in the first whole plate (110), and each of the first electrode modules (120) is provided on the first cutting area (112);
In step S200, a second cutting area (212) and a second edge area (213) surrounding the second cutting area (212) are disposed on the second whole plate (210), and each second electrode module (220) is disposed on the second cutting area (212).
5. The method according to claim 4, wherein in step S100, a first positioning hole (130) and a first identification bit (140) are further provided in the first edge region (113);
In step S200, a second positioning hole (230) and a second identification bit (240) are further disposed in the second edge region (213).
6. The method of manufacturing a semiconductor refrigerator according to claim 4, wherein in step S100, a first cutting indication line (150) is further provided in the first edge region (113);
In step S200, a second cutting indication line (250) is also provided in the second edge region (213).
7. The method of manufacturing a semiconductor refrigerator according to any one of claims 1 to 6, wherein in step S500, the first substrate (111) of the semiconductor refrigerator (300) forms a hot face and the second substrate (211) of the semiconductor refrigerator (300) forms a cold face.
8. The method of manufacturing a semiconductor refrigerator according to claim 7, wherein each of the first connection portions (122) is integrally provided in series with each of the second connection portions (222), and forms only one current path (320) together with the two first connection potentials (123).
9. The method of manufacturing a semiconductor refrigerator according to claim 7, wherein a part of the first connection portions (122) and a part of the second connection portions (222) are arranged in series to form one current path (320) together with the two first connection potentials (123); and
Each of the first connection portions and each of the second connection portions integrally form at least two current paths (320) in parallel.
10. An electronic device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor, when executing the computer program, carries out the steps of the method for manufacturing a semiconductor refrigerator according to any one of claims 1 to 9.
11. A computer-readable storage medium storing a computer program, characterized in that the computer program, when executed by a processor, realizes the steps of the method for manufacturing a semiconductor refrigerator according to any one of claims 1 to 9.
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| CN115915888A (en) * | 2021-09-30 | 2023-04-04 | 比亚迪股份有限公司 | Preparation method of semiconductor refrigerating sheet and semiconductor refrigerating module |
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| US5350645A (en) * | 1993-06-21 | 1994-09-27 | Micron Semiconductor, Inc. | Polymer-lithium batteries and improved methods for manufacturing batteries |
| JP2004207428A (en) * | 2002-12-25 | 2004-07-22 | Yamaha Corp | Thermoelectric module |
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