CN117111227A - Optical module - Google Patents

Abstract

The optical module provided by the present disclosure includes: a circuit board with a light emitting chip and a light receiving chip disposed on the surface; a lens assembly that covers the light emitting chip and the light receiving chip; the lens assembly includes a lens assembly body, a first optical fiber adapter and a second Optical fiber adapter; the first optical fiber adapter and the second optical fiber adapter are arranged at the first end of the lens assembly body, and the first optical fiber adapter and the second optical fiber adapter are used to transmit optical signals; the center of the light emitting chip is located on the optical axis of the first optical fiber adapter Between the projection of the circuit board and the projection of the optical axis of the second optical fiber adapter on the circuit board; a first optical surface and a second optical surface are formed on the lens assembly body; the first optical surface faces the first optical fiber adapter, and the second optical surface faces the first optical fiber adapter. The optical surface faces the first optical surface and the light emitting chip, and the second optical surface is located between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter. This application provides a new type of optical module with COB packaging structure.

Description

An optical module

Technical field

The present disclosure relates to the technical field of optical fiber communication, and in particular, to an optical module.

Background technique

With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for realizing mutual conversion of optical and electrical signals. They are one of the key components in optical communication equipment and are at the core of optical communication. The current packaging forms of optical modules include coaxial (Transistor-Outline, TO) packaging and chip on board (COB) packaging.

In an optical module with a COB package structure, the light-emitting chip and the light-receiving chip are directly mounted on the circuit board. A lens assembly is provided above the light-emitting chip and the light-receiving chip to change the transmission direction of the optical signal emitted by the light-emitting chip through the lens assembly. As well as the transmission direction of the optical signal to be received by the optical receiving chip, the optical module can transmit and receive optical signals.

Contents of the invention

An embodiment of the present disclosure provides an optical module, which is used to provide an optical module with a new COB packaging structure.

In a first aspect, the present disclosure provides an optical module, including: a circuit board with a light emitting chip and a light receiving chip provided on the surface;

The lens assembly is connected to the circuit board at the bottom and covers the light emitting chip and the light receiving chip; wherein:

The lens assembly includes a lens assembly body, a first fiber optic adapter and a second fiber optic adapter; the first fiber optic adapter and the second fiber optic adapter are provided at the first end of the lens assembly body, the first fiber optic adapter Used to transmit and transmit optical signals, the second optical fiber adapter is used to transmit and receive optical signals;

The center of the light emitting chip is located between the projection of the optical axis of the first fiber optic adapter on the circuit board and the projection of the optical axis of the second fiber optic adapter on the circuit board;

A first optical surface and a second optical surface are formed on the lens assembly body; the first optical surface faces the first optical fiber adapter, and the second optical surface faces the first optical surface and the light emission chip, and the second optical surface is located above the light-emitting chip and between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter.

In the optical module provided by the present disclosure, the lens assembly includes a lens assembly body, a first optical fiber adapter and a second optical fiber adapter. A light emitting chip and a light receiving chip are provided on the circuit board, and the light emitting chip is located on the optical axis of the first optical fiber adapter in the circuit. The projection of the board and the optical axis of the second fiber optic adapter are between the projection on the circuit board. A first optical surface and a second optical surface are formed on the lens assembly body. The first optical surface and the second optical surface are used for multiple deflections of the emitted light signal generated by the light emitting chip, even if the center of the light emitting chip is not located at the third optical surface. The optical axis of a fiber optic adapter is on the projection of the circuit board, and the emitted light signal generated by the light emitting chip can also be transmitted through the first fiber optic adapter.

In a second aspect, the present disclosure provides an optical module, including: a circuit board with a light emitting chip and a light receiving chip provided on the surface;

The lens assembly is connected to the circuit board at the bottom and covers the light emitting chip and the light receiving chip; wherein:

The lens assembly includes a lens assembly body, a first fiber optic adapter and a second fiber optic adapter; the first fiber optic adapter and the second fiber optic adapter are provided at the first end of the lens assembly body, the first fiber optic adapter Used to transmit and transmit optical signals, the second optical fiber adapter is used to transmit and receive optical signals;

The center of the light receiving chip is located between the projection of the optical axis of the first optical fiber adapter on the circuit board and the projection of the optical axis of the second optical fiber adapter on the circuit board;

A third optical surface and a fourth optical surface are formed on the lens assembly body. The third optical surface faces the second optical fiber adapter. The fourth optical surface faces the third optical surface and the light receiving surface. chip, and the light receiving chip is located below the fourth optical surface and between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter.

In the optical module provided by the present disclosure, the lens assembly includes a lens assembly body, a first optical fiber adapter and a second optical fiber adapter. A light emitting chip and a light receiving chip are provided on the circuit board, and the light receiving chip is located on the optical axis of the first optical fiber adapter in the circuit. The projection of the board and the optical axis of the second fiber optic adapter are between the projection on the circuit board. A third optical surface and a fourth optical surface are formed on the lens assembly body. The third optical surface and the fourth optical surface are used to receive multiple deflections of the optical signal, even if the center of the light receiving chip is not located in the light beam of the second optical fiber adapter. The axis is on the projection of the circuit board, and the light receiving chip can also receive the receiving light signal input through the second optical fiber adapter.

Description of drawings

In order to explain the technical solutions in the present disclosure more clearly, the drawings required to be used in some embodiments of the present disclosure will be briefly introduced below. Obviously, the drawings in the following description are only appendices of some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of the present disclosure.

Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure;

Figure 2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure;

Figure 5 is a schematic assembly diagram of a lens assembly and a circuit board according to some embodiments of the present disclosure;

Figure 6 is a partial structural schematic diagram of a circuit board provided according to some embodiments of the present disclosure;

Figure 7 is an exploded schematic diagram of a lens assembly and a circuit board provided according to some embodiments of the present disclosure;

Figure 8 is a schematic structural diagram of a lens assembly according to some embodiments of the present disclosure;

Figure 9 is a schematic structural diagram 2 of a lens assembly provided according to some embodiments of the present disclosure;

Figure 10 is a schematic structural diagram three of a lens assembly provided according to some embodiments of the present disclosure;

Figure 11 is a schematic structural diagram 4 of a lens assembly according to some embodiments of the present disclosure;

Figure 12 is a cross-sectional view of a lens assembly provided according to some embodiments of the present disclosure;

Figure 13 is a second cross-sectional view of a lens assembly provided according to some embodiments of the present disclosure;

Figure 14 is a partial structural schematic diagram of a lens assembly body provided according to some embodiments of the present disclosure;

Figure 15 is a cross-sectional view of a lens assembly in use according to some embodiments of the present disclosure;

Figure 16 is a second cross-sectional view of a lens assembly in use according to some embodiments of the present disclosure;

Figure 17 is a cross-sectional view of another lens assembly in use according to some embodiments of the present disclosure;

Figure 18 is a second cross-sectional view of another lens assembly in use according to some embodiments of the present disclosure;

Figure 19 is a cross-sectional view of a lens assembly provided according to some embodiments of the present disclosure;

Figure 20 is a cross-sectional view of another lens assembly according to some embodiments of the present disclosure;

Figure 21 is a second cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure;

Figure 22 is a perspective view of yet another lens assembly according to some embodiments of the present disclosure;

Figure 23 is a second perspective view of yet another lens assembly provided according to some embodiments of the present disclosure;

Figure 24 is a cross-sectional view of yet another lens assembly provided according to some examples of the present disclosure;

Figure 25 is a third perspective view of yet another lens assembly provided according to some embodiments of the present disclosure;

Figure 26 is a partial enlarged view of position O in Figure 25;

Figure 27 is a second cross-sectional view of yet another lens assembly provided according to some embodiments of the present disclosure;

Figure 28 is a partial enlarged view of position P in Figure 27;

Figure 29 is a cross-sectional view three of yet another lens assembly provided according to some embodiments of the present disclosure;

Figure 30 is a cross-sectional view 4 of yet another lens assembly provided according to some embodiments of the present disclosure;

Figure 31 is a cross-sectional view 5 of yet another lens assembly provided according to some embodiments of the present disclosure;

Figure 32 is a bottom view of yet another lens assembly in use according to some embodiments of the present disclosure;

Figure 33 is a second bottom view of another lens assembly in use according to some embodiments of the present disclosure.

Detailed ways

The technical solutions in some embodiments of the present disclosure will be described clearly and in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by this disclosure, all other embodiments obtained by those of ordinary skill in the art fall within the scope of protection of this disclosure.

In optical communication technology, in order to establish information transfer between information processing devices, information needs to be loaded onto light and the propagation of light is used to achieve information transfer. Here, light loaded with information is an optical signal. Optical signals can reduce the loss of optical power when transmitted in information transmission equipment, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can identify and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, TVs, etc. Information transmission equipment usually includes optical fibers and optical waveguides.

Optical modules can realize the mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first light from the optical fiber The signal is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module Convert the second electrical signal into a second optical signal, and transmit the second optical signal to the optical fiber. Since information can be transmitted between multiple information processing devices through electrical signals, at least one information processing device among the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing equipment directly connected to the optical module is called the host computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module may be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module may be called an electrical port.

Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system mainly includes remote information processing equipment 1000, local information processing equipment 2000, host computer 100, optical module 200, optical fiber 101 and network cable 103.

One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes total reflection multiple times in the optical fiber 101 to transmit the information from the remote information processing device 1000. The optical signal is transmitted to the optical module 200, or the optical signal from the optical module 200 is transmitted to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

The optical communication system may include one or more optical fibers 101, and the optical fibers 101 and the optical module 200 may be detachably connected or fixedly connected. The host computer 100 is configured to provide data signals to the optical module 200 , or to receive data signals from the optical module 200 , or to monitor or control the working status of the optical module 200 .

The host computer 100 includes a housing that is substantially rectangular parallelepiped, and an optical module interface 102 provided on the housing. The optical module interface 102 is configured to access the optical module 200 so that the host computer 100 and the optical module 200 establish a one-way or two-way electrical signal connection.

The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a universal serial bus interface (Universal Serial Bus, USB) or a network cable interface 104. The network cable interface 104 is configured to connect to the network cable 103, so that the host computer 100 and the network cable 103 can establish a one-way or two-way electrical connection. signal connection. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal according to the third electrical signal, and the second electrical signal from the host computer 100 is transmitted to the optical system. Module 200. The optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is propagated through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The module 200 transmits the first electrical signal to the host computer 100 , the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000 . It should be noted that the optical module is a tool to realize the mutual conversion of optical signals and electrical signals. During the above-mentioned conversion process of optical signals and electrical signals, the information does not change, and the encoding and decoding methods of the information can change.

In addition to optical network terminals, the host computer 100 also includes optical line terminals (Optical Line Terminal, OLT), optical network equipment (Optical Network Terminal, ONT), or data center servers, etc.

Figure 2 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, FIG. 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, the host computer 100 also includes a PCB circuit board 105 provided in the housing, a cage 106 provided on the surface of the PCB circuit board 105, a radiator 107 provided on the cage 106, and a heat sink 107 provided inside the cage 106. electrical connector. The electrical connector is configured to be connected to the electrical port of the optical module 200; the heat sink 107 has fins and other protruding structures that increase the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional optical signal connection.

FIG. 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and FIG. 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in FIGS. 3 and 4 , the optical module 200 includes a shell, a circuit board 300 and a lens assembly 400 disposed in the shell.

The housing includes an upper housing 201 and a lower housing 202. The upper housing 201 is covered on the lower housing 202 to form the above-mentioned housing with two openings 203 and 204; the outer contour of the housing generally presents a square body.

In some embodiments, the lower case 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper case 201 includes a cover plate 2011, and the cover plate 2011 covers the lower case. on the two lower side plates 2022 of 202 to form the above-mentioned housing.

In some embodiments, the lower case 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper case 201 includes a cover plate 2011, and two lower side plates 2022 located on both sides of the cover plate 2011. The two upper side plates arranged perpendicularly to the cover plate 2011 are combined with the two lower side plates 2022 to realize that the upper housing 201 is covered on the lower housing 202 .

The direction of the connection between the two openings 203 and 204 may be consistent with the length direction of the optical module 200 , or may be inconsistent with the length direction of the optical module 200 . For example, the opening 203 is located at the end of the optical module 200 (the left end of FIG. 3 ), and the opening 204 is also located at the end of the optical module 200 (the right end of FIG. 3 ). Alternatively, the opening 203 is located at an end of the optical module 200 , and the opening 204 is located at a side of the optical module 200 . The opening 203 is an electrical port, and the golden finger of the circuit board 300 extends from the electrical port and is inserted into the host computer (for example, the optical network terminal 100); the opening 204 is an optical port, configured to access the optical fiber 101, so that the optical fiber 101 is connected in the optical module 200.

The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of components such as the circuit board 300 and the lens assembly 400 into the housing. The upper housing 201 and the lower housing 202 form packaging protection for these components. In addition, when assembling components such as the circuit board 300 and the lens assembly 400, it is convenient to deploy the positioning components, heat dissipation components and electromagnetic shielding components of these devices, which is conducive to automated production.

In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the connection between the optical module 200 and the host computer. fixed connection.

For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower housing 202 and includes an engaging component that matches the cage 106 of the host computer 100 . When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging parts of the unlocking part 600; when the unlocking part 600 is pulled, the engaging parts of the unlocking part 600 move accordingly, thereby changing the engaging parts. The connection relationship with the host computer is to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be extracted from the cage 106 .

The circuit board 300 includes circuit wiring, electronic components and chips. The electronic components and chips are connected together according to the circuit design through the circuit wiring to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips include, for example, lasers, photodetectors, microcontroller units (MCU), laser driver chips, limiting amplifiers (Limiting Amplifier, LA), clock and data recovery (Clock and Data Recovery, CDR) chips, power management chips, digital signals Processing (Digital SignalProcessing, DSP) chip.

The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can smoothly carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the cage of the host computer 100 106 in the electrical connector.

The circuit board 300 also includes gold fingers formed on its end surface, and the gold fingers are composed of a plurality of mutually independent pins. The circuit board 300 is inserted into the cage 106, and the golden finger is connected to the electrical connector in the cage 106. The gold fingers can be provided only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or can be provided on the surfaces of the upper and lower sides of the circuit board 300 to provide a larger number of pins to accommodate the pins. Occasions with large quantity demand. The golden finger is configured to establish an electrical connection with the host computer to realize power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.

In some embodiments, the lens assembly 500 is connected to the circuit board 300 and covers the light emitting chip and/or the light receiving chip; the lens assembly 500 has a transmissive surface and a reflective surface to adjust the emitted light through the combination of the transmissive surface and the reflective surface. The transmission direction of the signal and/or the received optical signal enables the emitted optical signal generated by the light emitting chip to be output from the optical module, and the optical signal input to the optical module can be transmitted to the light receiving chip. The light-emitting chip is like a laser, and the light-receiving chip is like a photodetector. The lower part of the lens assembly 500 is not limited to being provided with light emitting chips and/or light receiving chips, but may also be provided with photoelectric monitoring components, driver chips, etc.

In some embodiments, the optical module 200 includes a lens assembly 400. The lens assembly 400 covers the light emitting chip and the light receiving chip and is used to adjust the transmission direction of the emitted optical signal and the received optical signal. Of course, in some embodiments, the number of lens components 400 in the optical module 200 is not limited to one, and may also include two lens components 400 , with a light emitting chip and/or a light receiving chip disposed below each lens component 400 .

In some embodiments, the lens assembly 400 is disposed at the end of the circuit board 300, such as near the optical port; however, some embodiments of the present disclosure are not limited to disposing the lens assembly 400 at the end of the circuit board 300, and may also be disposed at the end of the circuit board 300. The lens assembly 400 is disposed in the middle of the circuit board 300 .

Figure 5 is a schematic assembly diagram of a lens assembly and a circuit board according to some embodiments of the present disclosure. In some embodiments, as shown in FIG. 5 , the lens assembly 400 includes a first fiber optic adapter 410 , a second fiber optic adapter 420 and a lens assembly body 430 . The first fiber optic adapter 410 is connected to one side of the first end of the lens assembly body 430 , and the second fiber optic adapter 420 is connected to the other side of the first end of the lens assembly body 430 , that is, the first fiber optic adapter 410 and the second fiber optic adapter 420 are side by side. Disposed at the first end of the lens assembly body 430. The first fiber optic adapter 410 and the second fiber optic adapter 420 are respectively configured to connect the optical fiber 101 to transmit a transmitting optical signal to the optical fiber 101 or to transmit a receiving optical signal to the lens assembly body 430 . Exemplarily, the first optical fiber adapter 410 is configured to transmit and transmit optical signals to the optical fiber 101, and the second optical fiber adapter 420 is configured to transmit and receive optical signals to the optical fiber 101. Of course, in some embodiments, a fiber optic adapter is provided on the lens assembly 400, and two lens assemblies 400 are provided in the optical module 200.

In some embodiments, the distance between the optical axis of the first optical fiber adapter 410 and the optical axis of the second optical fiber adapter 420 is a preset value, such as the optical axis of the first optical fiber adapter 410 and the optical axis of the second optical fiber adapter 420 The distance L between them is 6.25mm. Even if two lens assemblies 400 are provided in the optical module 200, the distance between the optical axes of the optical fiber adapters on the two lens assemblies 400 should be a fixed value.

Figure 6 is a partial structural diagram of a circuit board provided according to some embodiments of the present disclosure. In some embodiments, as shown in FIG. 6 , a light emitting chip 310 and a light receiving chip 320 are disposed on the top surface of the circuit board 300 . The center of the light emitting chip 310 is located on the top of the circuit board 300 , and the optical axis of the first optical fiber adapter 410 is located on the top surface of the circuit board 300 . On the projection straight line of the surface, the center of the light receiving chip 320 is located on the projection straight line of the optical axis of the second optical fiber adapter 420 on the top surface of the circuit board 300, so that the distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 is the default value. It should be noted that the center of the light-emitting chip 310 mainly refers to the center of the effective light-emitting surface, and the center of the light-receiving chip 320 mainly refers to the center of the effective detection surface.

In some embodiments, the light-emitting chip 310 and the light-receiving chip 320 need to share a driver chip, and the length of the driver chip is less than the distance L. In order to ensure the performance of signal transmission, the light-emitting chip 310 and the driver chip need to be wired and light-receiving. The wiring between the driver chips of the chip 320 should not be too long. If it needs to be controlled within 0.1 mm, the distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 needs to be less than the distance L. In some embodiments, even if the light-emitting chip 310 and the light-receiving chip 320 do not share a driver chip, in order to facilitate the layout setting of other devices, it is necessary to reduce the distance between the center of the light-emitting chip 310 and the center of the light-receiving chip 320 to less than the distance L. . In order to satisfy the requirement that the distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 is less than the distance L, a lens assembly is provided in an embodiment of the present application.

Figure 7 is an exploded schematic diagram of a lens assembly and a circuit board provided according to some embodiments of the present disclosure. As shown in Figure 7, a light emitting chip 310 and a light receiving chip 320 are disposed on the circuit board 300. The distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 is less than the distance L. The lens assembly 400 is disposed between the light emitting chip 310 and the light receiving chip 320. above. For example, the bottom of the lens assembly 400 is connected to the circuit board 300, and the bottom of the lens assembly 400 and the surface of the circuit board 300 form a receiving cavity, in which the light emitting chip 310 and the light receiving chip 320 are located. The lens assembly 400 can not only adjust the transmission direction of the light signal emitted by the light emitting chip 310 and the light signal received by the light receiving chip 320, but also protect the light emitting chip 310 and the light receiving chip 320. In some embodiments, the optical axis of the first optical fiber adapter 410 is projected as a straight line M on the circuit board 300, and the optical axis of the second optical fiber adapter 420 is projected on the circuit board 300 as a straight line N. The distance between the straight line M and the straight line N is For L, the light emitting chip 310 and the light receiving chip 320 are located between the straight line M and the straight line N. Of course, in some cases, the center of the light emitting chip 310 is located on the straight line M or the center of the light receiving chip 320 is located on the straight line N.

In some embodiments, a driver chip 330 is also provided on the circuit board 300. The driver chip 330 is provided in the receiving cavity formed by the bottom of the lens assembly 400 and the circuit board 300, and the driver chip 330 is located away from the light emitting chip 310 and the light receiving chip 320. One side of the optical port of module 200. Exemplarily, the driving chip 330 is disposed on the side of the light emitting chip 310 and the light receiving chip 320 away from the optical port; the driving chip 330 is electrically connected to the light emitting chip 310 and the light receiving chip 320 respectively, that is, the light emitting chip 310 and the light receiving chip 320 share a driver. Chip 330. Of course, in some embodiments, two driver chips are provided on the circuit board, one driver chip is wired to connect to the light emitting chip 310, and the other driver chip is wired to connect to the light receiving chip 320.

FIG. 8 is a schematic structural diagram 1 of a lens assembly according to some embodiments of the present disclosure. FIG. 9 is a schematic structural diagram 2 of a lens assembly provided according to some embodiments of the present disclosure. As shown in FIGS. 8 and 9 , in some embodiments, the lens assembly 400 includes a first fiber optic adapter 410 , a second fiber optic adapter 420 and a lens assembly body 430 . A plurality of optical surfaces are formed on the lens assembly body 430, and the optical surfaces are used for transmitting light signals or reflecting light signals. The first end of the lens assembly body 430 is close to the optical port of the optical module 200 , and the second end of the lens assembly body 430 is close to the electrical port of the optical module 200 .

In some embodiments, the lens assembly 400 is a transparent plastic part that is integrally injection molded.

The first fiber optic adapter 410 is connected to one side of the first end of the lens assembly body 430 , and the second fiber optic adapter 420 is connected to the other side of the first end of the lens assembly body 430 , that is, the first fiber optic adapter 410 and the second fiber optic adapter 420 are side by side. Disposed at the first end of the lens assembly body 430. The first optical fiber adapter 410 and the second optical fiber adapter 420 are hollow structures, and the first optical fiber adapter 410 and the second optical fiber adapter 420 are configured to connect the optical fiber 101 to transmit optical signals.

In some embodiments, the first optical fiber adapter 410 and the second optical fiber adapter 420 are respectively provided with optical fiber ferrules internally, and the optical fiber ferrules are used to improve the coupling efficiency of optical signals between the optical fiber 101 and the lens assembly body 430 .

In some embodiments, a first recess 440 is formed on the top of the lens assembly body 430, and a plurality of optical surfaces are formed on the bottom of the first recess 440. Exemplarily, the first recess 440 is formed by being recessed from the top of the lens assembly body 430 toward the bottom of the lens assembly body 430 . A first recess 440 is formed on the lens assembly body 430, and the bottom of the first recess 440 forms an optical surface, so that the thickness of the lens assembly body 430 where the optical surface is provided can be adjusted through the first recess 440, so that the optical surface can be easily processed.

In some embodiments, a second recess 450 is formed at the bottom of the lens assembly body 430. The second recess 450 and the surface of the circuit board 300 form a receiving cavity, making it convenient to place the light emitting chip 310 and the light receiving chip 320 under the lens assembly 400. . Exemplarily, the second recess 450 is formed by a bottom surface of the lens assembly body 430 being recessed toward a top direction of the lens assembly body 430 . In some embodiments, an optical surface is also formed on the top surface of the second recess 450. The optical surface is mainly used to transmit optical signals, such as condensing optical signals.

Figure 10 is a schematic diagram three of the structure of a lens assembly provided according to some embodiments of the present disclosure. Figure 11 is a schematic diagram four of the structure of a lens assembly provided according to some embodiments of the present disclosure. As shown in FIGS. 10 and 11 , a first groove 431 is formed on the top of the lens assembly body 430 , and a first optical surface 4311 is formed on the side wall of the first groove 431 . The first optical surface 4311 is located in the extending direction of the first optical fiber adapter 410 . The first optical surface 4311 is used to reflect the emitted optical signal and change the transmission direction of the emitted optical signal. In some embodiments, the projection of the first optical surface 4311 in the extension direction of the first optical fiber adapter 410 covers the end surface of the optical fiber ferrule in the first optical fiber adapter 410 . For example, the first optical surface 4311 changes the transmission direction of the emitted optical signal from the A-B direction to the C-D direction. In some embodiments, a reflective film is provided on the first optical surface 4311 to improve the reflection efficiency of the first optical surface 4311 for emitting optical signals.

In some embodiments, the A-B direction of the lens assembly 400 is the width direction of the lens assembly 400, the C-D direction of the lens assembly 400 is the length direction of the lens assembly 400, and the E-F direction of the lens assembly 400 is the height direction of the lens assembly 400. For example, the width direction of the lens assembly 400 is parallel to the width direction of the circuit board 300, the length direction of the lens assembly 400 is parallel to the length direction of the circuit board 300, and the height direction of the lens assembly 400 is perpendicular to the top surface of the circuit board 300, and thus The first optical surface 4311 changes the transmission direction of the emitted optical signal in the width and length directions of the circuit board 300 .

As shown in Figures 10 and 11, a second groove 432 is formed on the top of the lens assembly body 430, and the second groove 432 is located between the optical axis of the first fiber optic adapter 410 and the optical axis of the second fiber optic adapter 420; A second optical surface 4321 is formed at the bottom of the two grooves 432. The second optical surface 4321 is used to reflect the emitted optical signal to change the transmission direction of the emitted optical signal. The second optical surface 4321 is located above the light emitting chip 310, and the second optical surface 4321 changes the direction in which the light emitting chip 310 generates optical signals. In some embodiments, the projection of the second optical surface 4321 in the direction of the circuit board 300 covers the light-emitting chip 310 . In some embodiments, a reflective film is provided on the second optical surface 4321 to improve the reflection efficiency of the second optical surface 4321.

In some embodiments of the present disclosure, the first optical surface 4311 and the second optical surface 4321 are combined so that the light emitting chip 310 is disposed so that the projection of the optical axis of the first fiber optic adapter 410 on the circuit board 300 is consistent with the light of the second fiber optic adapter 420 . The axis is between the projections of the circuit board 300, and even if the center of the light-emitting chip 310 is not on the straight line M, the emitted light signal generated by the light-emitting chip 310 can be transmitted through the first optical fiber adapter 410.

As shown in FIGS. 10 and 11 , a third groove 433 is formed on the top of the lens assembly body 430 , and a third optical surface 4331 is formed on the side wall of the third groove 433 . The third optical surface 4331 is located in the extending direction of the second optical fiber adapter 420 . The third optical surface 4331 is used to reflect the received optical signal and change the transmission direction of the received optical signal. In some embodiments, the projection of the third optical surface 4331 in the extension direction of the second optical fiber adapter 420 covers the end surface of the optical fiber ferrule in the second optical fiber adapter 420 . For example, the third optical surface 4331 changes the transmission direction of the received optical signal from the C-D direction to the A-B direction, that is, the third optical surface 4331 changes the transmission direction of the emitted optical signal in the length and width directions of the circuit board 300 . In some embodiments, a reflective film is provided on the third optical surface 4331 to improve the reflection efficiency of the third optical surface 4331 for receiving optical signals.

As shown in Figures 10 and 11, a fourth groove 434 is formed on the top of the lens assembly body 430, and the fourth groove 434 is located between the optical axis of the first optical fiber adapter 410 and the optical axis of the second optical fiber adapter 420; A fourth optical surface 4341 is formed on the side wall of the four grooves 434. The fourth optical surface 4341 is used to reflect the received optical signal to change the transmission direction of the received optical signal. The fourth optical surface 4341 is located above the light receiving chip 320 , and the fourth optical surface 4341 reflects and transmits the received light signal to the light receiving chip 320 . In some embodiments, the projection of the fourth optical surface 4341 in the direction of the circuit board 300 covers the light receiving chip 320 . In some embodiments, a reflective film is provided on the fourth optical surface 4341 to improve the reflection efficiency of the fourth optical surface 4341 for receiving optical signals.

In some embodiments of the present disclosure, the third optical surface 4331 and the fourth optical surface 4341 are combined so that the light receiving chip 320 is disposed so that the projection of the optical axis of the first fiber optic adapter 410 on the circuit board 300 is consistent with the light of the second fiber optic adapter 420 . The axis is between the projections of the circuit board 300 , and even if the center of the light receiving chip 320 is not on the straight line N, the received light signal input through the second optical fiber adapter 420 can be transmitted to the light receiving chip 320 .

In some embodiments, a fifth optical surface 4322 is also formed at the bottom of the second groove 432. The fifth optical surface 4322 can both transmit and reflect the emitted optical signal. The emitted optical signal transmitted through the fifth optical surface 4322 is transmitted in the direction of the first optical surface 4311, and the optical signal reflected through the fifth optical surface 4322 is used for optical module emitted optical power monitoring. In some embodiments, the second optical surface 4321 and the fifth optical surface 4322 intersect within the second groove 432 . Exemplarily, a backlight detection chip is provided on the circuit board 300, the lens assembly 400 is located above the backlight detection chip, and the backlight detection chip receives the optical signal reflected by the fifth optical surface 4322 to monitor the optical module emitted optical power.

In some embodiments, a sixth optical surface 4323 is also formed on the side wall of the second groove 432. The sixth optical surface 4323 is used to transmit the emitted light signal transmitted through the fifth optical surface 4322 to the first optical surface. Transmission in the direction of 4311.

In some embodiments of the present disclosure, by opening the first groove 431, the second groove 432, the third groove 433 and the fourth groove 434 on the lens assembly body 430, it is convenient to control the thickness of each position of the lens assembly body 430. , in order to facilitate the shaping of the corresponding optical surface and make the optical surface easy to process.

Figure 12 is a cross-sectional view of a lens assembly according to some embodiments of the present disclosure. As shown in FIG. 12 , the first optical fiber adapter 410 is provided with a first through hole 411 , and a first optical fiber ferrule 460 is provided in the first through hole 411 . The first optical fiber ferrule 460 is used to couple the optical signal from the lens assembly body 430 into the optical fiber 101 to improve the coupling efficiency of the emitted optical signal to the optical fiber 101 .

In some embodiments, a first blind hole 435 is also provided on the lens assembly body 430. One end of the first blind hole 435 is connected to the first through hole 411. The other end of the first blind hole 435 is provided with a first lens 4351. The first lens 4351 is used to converge the emitted optical signal reflected by the first optical surface 4311 to the end face of the first optical fiber ferrule 460 .

In some embodiments, the end surface of the first optical fiber ferrule 460 is an inclined surface, and the inclination angle of the end surface of the first optical fiber ferrule 460 is 4-7°, which reduces the optical signal reflected by the end surface of the first optical fiber ferrule 460 along the The transmission optical path that transmits the optical signal returns.

Figure 13 is a second cross-sectional view of a lens assembly provided according to some embodiments of the present disclosure. As shown in FIG. 13 , the second optical fiber adapter 420 is provided with a second through hole 421 , and a second optical fiber ferrule 470 is provided in the second through hole 421 . The second optical fiber ferrule 470 is used to couple the optical signal from the optical fiber 101 into the lens assembly body 430 to improve the coupling efficiency of the received optical signal to the lens assembly body 430 .

In some embodiments, the lens assembly body 430 is also provided with a second blind hole 436. One end of the second blind hole 436 is connected to the second through hole 421, and the other end of the second blind hole 436 is provided with a second lens 4361. The second lens 4361 is used to collimate the received optical signal output through the end face of the second optical fiber ferrule 470 to the third optical surface 4331.

In some embodiments, the end surface of the second optical fiber ferrule 470 is an inclined surface, and the inclination angle of the end surface of the second optical fiber ferrule 470 is 4-7°, which reduces the received optical signal reflected by the third optical surface 4331 from being reflected by the third optical surface 4331 again. The end faces of the two optical fiber ferrules 470 are reflected back into the transmission optical path of the received optical signal.

FIG. 14 is a partial structural schematic diagram of a lens assembly body according to some embodiments of the present disclosure. FIG. 15 is a cross-sectional view of a lens assembly in use according to some embodiments of the present disclosure. The light emitting chip 310 and the light receiving chip 320 are disposed between the projection of the optical axis of the first optical fiber adapter 410 on the circuit board 300 and the projection of the optical axis of the second optical fiber adapter 420 on the circuit board 300 .

As shown in FIGS. 14 and 15 , a seventh optical surface 451 and an eighth optical surface 452 are provided on the top surface of the second recess 450 . The seventh optical surface 451 is located above the light emitting chip 310, and is used to transmit the emitted light signal generated by the light emitting chip 310; the eighth optical surface 452 is located above the light receiving chip 320, and the eighth optical surface 452 is used for transmitting the emitted light signal generated by the light emitting chip 310. The received light signal is transmitted through transmission to the light receiving chip 320 .

In some embodiments, a third lens 4511 is disposed on the seventh optical surface 451, and the third lens 4511 is used to collimate the emitted light signal generated by the light emitting chip 310.

In some embodiments, a fourth lens 4521 is disposed on the eighth optical surface 452 , and the fourth lens 4521 is used to collect and receive optical signals toward the light receiving chip 320 .

In some embodiments, a fifth groove 453 is provided on the top surface of the second recess 450 , and a seventh optical surface 451 and an eighth optical surface 452 are formed on the bottom surface of the fifth groove 453 . The relative height of the seventh optical surface 451 and the eighth optical surface 452 is adjusted through the fifth groove 453, that is, the distance between the seventh optical surface 451 and the light emitting surface of the light emitting chip 310, and the distance between the eighth optical surface 452 and the light emitting chip 310. The distance between the light receiving surfaces of the receiving chip 320.

In some embodiments, the relative positions of the backlight detection chip, the light emitting chip 310 and the light receiving chip 320 are adjusted by adjusting the positions of the first optical surface 4311, the second optical surface 4321, the fifth optical surface 4322, etc., such as The backlight detection chip is located on the connection line between the light emitting chip 310 and the light receiving chip 320 , the backlight detection chip is located between the light emitting chip 310 and the light receiving chip 320 , or the backlight detection chip is located away from the light emitting chip 310 and the light receiving chip 320 one side.

In some embodiments, a first backlight detection chip 340 is also provided below the lens assembly body 430, and a ninth optical surface 454 is also formed in the fifth groove 453. The ninth optical surface 454 transmits the optical signal and transmits the optical signal. The light signal is transmitted to the first backlight detection chip 340 , and the first backlight detection chip 340 receives the optical signal for detecting the emitted light power of the light emitting chip 310 . In some examples, the first backlight detection chip 340 is located between the light emitting chip 310 and the light receiving chip 320 , and the ninth optical surface 454 is located between the seventh optical surface 451 and the eighth optical surface 452 .

In some embodiments, a fifth lens 4541 is disposed on the ninth optical surface 454, and the fifth lens 4541 is used to converge optical signals.

In some embodiments, the ninth optical surface 454 is an inclined surface, and a step surface 4324 is formed on the side wall of the second groove 432. The step surface 4324 is located above the ninth optical surface 454, so that the ninth optical surface 454 can be adjusted through the step surface 4324. The thickness of the lens assembly body 430 above the optical surface 454 ensures the formability of the ninth optical surface 454, thereby facilitating the processing of the ninth optical surface 454.

Figure 16 is a second cross-sectional view of a lens assembly in use according to some embodiments of the present disclosure. Figure 16 shows the transmission optical path of a lens assembly 400. As shown in Figure 16, the emitted light signal generated by the light emitting chip 310 is transmitted to the third lens 4511, collimated by the third lens 4511 and transmitted to the second optical surface 4321, and reflected by the second optical surface 4321 and transmitted to the fifth optical surface. 4322; The emitted optical signal transmitted to the fifth optical surface 4322 is partially transmitted through the fifth optical surface 4322 and partially reflected by the fifth optical surface 4322; the emitted optical signal transmitted through the fifth optical surface 4322 is transmitted to the sixth optical surface 4323, After passing through the sixth optical surface 4323 and passing through the sixth optical surface 4323, the emitted light signal transmitted through the sixth optical surface 4323 is transmitted to the first optical surface 4311, and is finally reflected by the first optical surface 4311. The emitted light signal reflected by the fifth optical surface 4322 is transmitted to the ninth optical surface 454, condensed and transmitted to the first backlight detection chip 340 through the fifth lens 4541.

As shown in Figure 16, the received optical signal is transmitted to the third optical surface 4331, is reflected by the third optical surface 4331 and transmitted to the fourth optical surface 4341, is reflected by the fourth optical surface 4341 and transmitted to the eighth optical surface 452, and then passes through the fourth optical surface 4341. The lens 4521 converges and transmits the light to the light receiving chip 320 .

In some embodiments of the present disclosure, taking the light exit surface perpendicular to the light emitting chip 310 as a reference, the inclination angle of the second optical surface 4321 is α1, the inclination angle of the fifth optical surface 4322 is α2, and the inclination angle of the sixth optical surface 4323 is α2. The angle is α3, and the tilt angle of the ninth optical surface 454 is α4. The inclination angle α1 of the second optical surface 4321, the inclination angle α2 of the fifth optical surface 4322, the inclination angle α3 of the sixth optical surface 4323, and the inclination angle α4 of the ninth optical surface 454 cooperate with each other, and the distance L1 of the optical surfaces needs to be referenced. and 2, specific values are selected by mutual coordination. The distance between the first backlight detection chip 340 and the light emitting chip 310 is combined with the inclination angle α1 of the second optical surface 4321, the inclination angle α2 of the fifth optical surface 4322, and the inclination angle α4 of the ninth optical surface 454. Correspondingly, the selection of the inclination angle α1 of the second optical surface 4321, the inclination angle α2 of the fifth optical surface 4322, and the inclination angle α4 of the ninth optical surface 454 needs to consider the distance between the first backlight detection chip 340 and the light emitting chip 310. .

Figure 17 is a cross-sectional view of another lens assembly in use according to some embodiments of the present disclosure. As shown in Figure 17, in some examples, a second backlight detection chip 350 is provided on the side of the light emitting chip 310 away from the light receiving chip 320; a tenth optical surface 455 is formed on the top surface of the second recess 450. Surface 455 is located above the second backlight detection chip 350 . The tenth optical surface 455 is used to transmit the optical signal and transmit the optical signal to the second backlight detection chip 350; the second backlight detection chip 350 receives the optical signal to detect the emitted light power of the light emitting chip 310. For example, the optical signal transmitted to the tenth optical surface 455 is refracted at the tenth optical surface 455 , and the optical signal refracted by the tenth optical surface 455 is transmitted to the second backlight detection chip 350 .

Figure 18 is a second cross-sectional view of another lens assembly in use according to some embodiments of the present disclosure. Figure 18 shows the transmission optical path of another lens assembly 400. As shown in Figure 18, the emitted light signal generated by the light emitting chip 310 is transmitted to the third lens 4511, collimated by the third lens 4511 and transmitted to the second optical surface 4321, and reflected by the second optical surface 4321 and transmitted to the fifth optical surface. 4322, and transmitted to the sixth optical surface 4323 through the fifth optical surface 4322; transmitted to the sixth optical surface 4323, partially transmitted through the sixth optical surface 4323, and partially reflected by the sixth optical surface 4323; through the sixth optical surface 4323 The emitted optical signal is transmitted to the first optical surface 4311, and finally reflected by the first optical surface 4311; the optical signal reflected by the sixth optical surface 4323 is transmitted to the fifth optical surface 4322 and transmitted through the fifth optical surface 4322 to the second optical surface. The surface 4321 is reflected by the second optical surface 4321 and transmitted to the tenth optical surface 455, and transmitted to the second backlight detection chip 350 through the tenth optical surface 455.

In some embodiments of the present disclosure, taking the light exit surface perpendicular to the light emitting chip 310 as a reference, the inclination angle of the tenth optical surface 455 is α5. The inclination angle α5 of the tenth optical surface 455 needs to be selected in combination with the inclination angle α1 of the second optical surface 4321, the inclination angle α2 of the fifth optical surface 4322, and the inclination angle α3 of the sixth optical surface 4323. The distance between the second backlight detection chip 350 and the light emitting chip 310 is combined with the inclination angle α1 of the second optical surface 4321, the inclination angle α2 of the fifth optical surface 4322, and the inclination angle α5 of the tenth optical surface 455. Correspondingly, the selection of the inclination angle α1 of the second optical surface 4321, the inclination angle α2 of the fifth optical surface 4322, and the inclination angle α5 of the tenth optical surface 455 needs to consider the distance between the second backlight detection chip 350 and the light emitting chip 310. .

FIG. 19 is a cross-sectional view of a lens assembly according to some embodiments of the present disclosure. FIG. 19 shows a transmission optical path of a lens assembly 400. As shown in Figure 19, the emitted optical signal passes through the fifth optical surface 4322, is transmitted to the first optical surface 4311, is reflected by the first optical surface 4311 and transmitted to the first lens 4351, and is converged and transmitted to the first optical fiber through the first lens 4351. The ferrule 460 is transmitted along the extension direction of the first optical fiber ferrule 460 .

As shown in Figure 19, the received optical signal is transmitted to the second lens 4361 through the second optical fiber ferrule 470, collimated and transmitted to the third optical surface 4331 through the second lens 4361, and reflected and transmitted to the fourth optical surface 4331. Face 4341.

FIG. 20 is a first cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure, and FIG. 21 is a second cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure. In some embodiments, as shown in FIGS. 20 and 21 , the center of the light receiving chip 320 is located on the projection of the optical axis of the second optical fiber adapter 420 in the direction of the circuit board 300 , and a sixth groove is provided above the light receiving chip 320 437, an eleventh optical surface 4371 is formed in the sixth groove 437, and the eleventh optical surface 4371 is inclined toward the direction of the second optical fiber adapter 420. The received optical signal is transmitted to the eleventh optical surface 4371 through the second optical fiber adapter 420; the eleventh optical surface 4371 reflects the received optical signal, changing the transmission direction of the received optical signal from parallel to the circuit board 300 to perpendicular to the circuit board 300.

In some embodiments, the eleventh optical surface 4371 is located above the eighth optical surface 452, the light receiving chip 320 is located below the fourth lens 4521, and the received light signal reflected by the eleventh optical surface 4371 is transmitted to the fourth lens 4521. It is then concentrated and transmitted to the light receiving chip 320 through the fourth lens 4521.

In order to adapt to the distance requirement between the light emitting chip 310 and the light receiving chip 320, the optical axis of the light emitting chip 310 to the second optical fiber adapter 420 is closer to the position where it is projected on the circuit board 300, that is, compared to the light emitting chip 310 and the light receiving chip. The chip 320 is located between the projection of the optical axis of the first optical fiber adapter 410 and the projection of the optical axis of the second optical fiber adapter 420 on the circuit board 300. The light emitting chip 310 moves in the direction of the second optical fiber adapter 420, and then the second optical surface 4321 are all moving in the same direction.

Of course, in the embodiment of the present disclosure, the center of the light-emitting chip 310 can also be projected on the circuit board 300 by making the center of the light-emitting chip 310 close to or located at the optical axis of the first optical fiber adapter 410, and the position and position of the optical surface on the lens assembly 400 can be adjusted adaptively. combination.

In some embodiments, the distance between the center of the light emitting chip 310 and the optical axis of the first fiber optic adapter 410 projected on the circuit board 300 is the same as the distance between the center of the light receiving chip 320 and the optical axis of the second fiber optic adapter 420 on the circuit board 300 The projection distance is equal, so that the optical path length of the emitted optical signal inside the optical module 200 and the process length of the received optical signal are approximated, so as to balance the optical path length of the emitted optical signal and the process length of the received optical signal inside the optical module 200, and thus can Coordinate the tolerances of the transmitting optical signal transmission optical path and the receiving optical signal transmission optical path.

In some embodiments, by adjusting the positions of the first optical surface 4311, the second optical surface 4321, the fifth optical surface 4322, etc., the backlight detection chip is not located on the connection line between the light emitting chip 310 and the light receiving chip 320, so as to have Facilitates the setting of backlight detection chips, such as reducing assembly space restrictions on the selection of backlight detection chips.

Figure 22 is a first perspective view of yet another lens assembly provided according to some embodiments of the present disclosure. Figure 23 is a second perspective view of yet another lens assembly provided according to some embodiments of the present disclosure. Figure 24 is a first perspective view of another lens assembly provided according to some embodiments of the present disclosure. Cross-sectional view of yet another lens assembly. In some embodiments, as shown in FIGS. 22 and 23 , the bottom of the second groove 432 forms a second optical surface 4321 , a fifth optical surface 4322 and a sixth optical surface 4323 . The second optical surface 4321 and the fifth optical surface 4323 are connected to each other. The surfaces 4322 do not intersect in the second groove 432 , that is, the intersection of the second optical surface 4321 and the fifth optical surface 4322 is not within the second groove 432 .

Exemplarily, a first plane 4325 is formed in the second groove 432, the first plane 4325 is perpendicular to the optical axis of the light emitting chip 310, the second optical surface 4321 is located on one side of the first plane 4325, and the fifth optical surface 4322 Located on the other side of the first plane 4325, the second optical surface 4321 and the fifth optical surface 4322 are not symmetrical about the central axis of the first plane 4325.

Figure 25 is a third perspective view of yet another lens assembly provided according to some embodiments of the present disclosure. Figure 26 is a partial enlarged view of O in Figure 25. Figure 27 is a third perspective view of yet another lens assembly provided according to some embodiments of the present disclosure. Cross-sectional view two, Figure 28 is a partial enlarged view of position P in Figure 27. As shown in Figures 25 to 28, a twelfth optical surface 456 is formed on the side of the seventh optical surface 451 close to the front end of the lens assembly 400. The twelfth optical surface 456 is located below the second optical surface 4321. Surface 456 is used to refract the transmitted light signal. For example, the twelfth optical surface 456 refracts the optical signal used for monitoring the optical power emitted by the light emitting chip, so that the optical axis of the optical signal used for monitoring the optical power emitted by the light emitting chip deviates from the optical axis of the light emitting chip 310 . In some embodiments, the twelfth optical surface 456 is formed on the bottom surface of the twelfth optical surface 456 .

Figure 29 is a cross-sectional view three of yet another lens assembly provided according to some embodiments of the present disclosure. Figure 30 is a cross-sectional view four of another lens assembly provided according to some embodiments of the present disclosure. Figure 31 is a cross-sectional view four provided according to some embodiments of the present disclosure. Cross-sectional view 5 of yet another lens assembly, Figures 29-31 show the transmission optical path of yet another lens assembly 400. As shown in Figures 29 and 30, the emitted light signal generated by the light emitting chip 310 is transmitted to the third lens 4511, collimated by the third lens 4511 and transmitted to the second optical surface 4321, and then reflected and transmitted to the second optical surface 4321. Five optical surfaces 4322; the emitted optical signal transmitted to the fifth optical surface 4322 is partially transmitted through the fifth optical surface 4322 and partially reflected by the fifth optical surface 4322; the emitted optical signal transmitted through the fifth optical surface 4322 is transmitted to the sixth optical surface The surface 4323 passes through the sixth optical surface 4323 and is transmitted through the sixth optical surface 4323. The emitted light signal transmitted through the sixth optical surface 4323 is transmitted to the first optical surface 4311, and is finally reflected by the first optical surface 4311. The optical signal reflected by the fifth optical surface 4322 is transmitted to the second optical surface 4321, reflected by the second optical surface 4321, transmitted to the twelfth optical surface 456, and transmitted to the backlight detection chip through the twelfth optical surface 456.

As shown in Figures 29 and 31, the received optical signal is transmitted to the third optical surface 4331, is reflected by the third optical surface 4331 and transmitted to the fourth optical surface 4341, and is reflected by the fourth optical surface 4341 and transmitted to the eighth optical surface 452. The light is collected and transmitted to the light receiving chip 320 through the fourth lens 4521.

Figure 32 is a bottom view of yet another lens assembly in use according to some embodiments of the present disclosure. As shown in FIG. 32 , a third backlight detection chip 360 is also disposed below the lens assembly 400 . The third backlight detection chip 360 is disposed on the right side of the light emitting chip 310 and is located below the twelfth optical surface 456 , the third backlight detection chip 360 is closer to the optical port of the optical module 200 than the light emitting chip 310 . The third backlight detection chip 360 is not located on the connection line between the light emitting chip 310 and the light receiving chip 320, so that the third backlight detection chip 360 is far away from the driving chip 330, effectively preventing the third backlight detection chip 360 from interfering with the layout of the driving chip 330, or This effectively prevents the driver chip 330 from interfering with the layout of the third backlight detection chip 360 . If the size of the third backlight detection chip 360 is relatively large, disposing the third backlight detection chip 360 on the light emitting chip 310 can avoid assembly interference between the third backlight detection chip 360 and the driving chip 330 .

Figure 33 is a second bottom view of another lens assembly in use according to some embodiments of the present disclosure. As shown in FIG. 33 , in some embodiments, a fourth backlight detection chip 370 is also disposed below the lens assembly 400 . The fourth backlight detection chip 370 is disposed on the diagonal side of the light emitting chip 310 , away from the light receiving chip 320 , and on the diagonal side of the light emitting chip 310 . The four backlight detection chips 370 are located below the twelfth optical surface 456 , and the fourth backlight detection chip 370 is closer to the optical port of the optical module 200 than the light emission chip 310 . The fourth backlight detection chip 370 is not located on the connection line between the light emitting chip 310 and the light receiving chip 320, so that the fourth backlight detection chip 370 is far away from the driving chip 330, effectively preventing the fourth backlight detection chip 370 from interfering with the layout of the driving chip 330, or This effectively prevents the driving chip 330 from interfering with the layout of the fourth backlight detection chip 370 .

In the optical module provided by some embodiments of the present disclosure, the light emitting chip 310 and the light receiving chip 320 are disposed between the optical axis of the first optical fiber adapter 410 and the optical axis of the second optical fiber adapter 420 through the lens assembly 400, so that light can be emitted. The chip 310 and the light receiving chip 320 can be close to each other, and the light emitting chip 310 and the light receiving chip 320 can share the driver chip 330.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present disclosure, but not to limit it; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that it can still be Modifications may be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions may be made to some of the technical features; however, these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims (10)

1. An optical module, comprising:

a circuit board, the surface of which is provided with a light emitting chip and a light receiving chip;

the bottom of the lens component is connected with the circuit board and covers the light emitting chip and the light receiving chip; wherein:

the lens assembly includes a lens assembly body, a first fiber optic adapter, and a second fiber optic adapter; the first optical fiber adapter and the second optical fiber adapter are arranged at the first end of the lens assembly body, the first optical fiber adapter is used for transmitting and transmitting optical signals, and the second optical fiber adapter is used for transmitting and receiving optical signals;

the center of the light emitting chip is positioned between the projection of the optical axis of the first optical fiber adapter on the circuit board and the projection of the optical axis of the second optical fiber adapter on the circuit board;

The lens assembly body is provided with a first optical surface and a second optical surface; the first optical surface faces the first optical fiber adapter, the second optical surface faces the first optical surface and the light emitting chip, and the second optical surface is located above the light emitting chip and between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter.

2. The light module of claim 1 wherein the top of the lens assembly body is formed with a first recess, the bottom of the first recess being formed with a first groove and a second groove;

the first optical surface is formed on the side wall of the first groove, and the second optical surface is formed at the bottom of the second groove.

3. The optical module of claim 2, wherein a bottom of the second groove is further formed with a fifth optical surface, and a sixth optical surface is formed on a sidewall of the second groove; the fifth optical surface and the sixth optical surface are positioned between the first optical surface and the second optical surface, and the light signals transmitted through the fifth optical surface are transmitted to the sixth optical surface, and the light signals transmitted through the sixth optical surface are transmitted to the first optical surface.

4. The light module of claim 2 wherein a bottom of the lens assembly body is formed with a second recess, a top surface of the second recess being formed with a seventh optical surface, the seventh optical surface being located above the light emitting chip and below the second optical surface;

and a third lens is arranged on the seventh optical surface and is used for collimating the emitted light signals generated by the light emitting chip.

5. A light module as recited in claim 3, wherein a first backlight detection chip is further provided on a surface of the circuit board, the first backlight detection chip being located between the light emitting chip and the light receiving chip;

a ninth optical surface is formed at the bottom of the lens assembly body, the ninth optical surface is located above the first backlight detection chip, the fifth optical surface is further used for reflecting part of the emitted light signals, and the emitted light signals reflected by the fifth optical surface are transmitted to the ninth optical surface;

and a fifth lens is arranged on the ninth optical surface and is used for converging and emitting optical signals to the first backlight detection chip.

6. A light module as recited in claim 3, wherein a second backlight detection chip is further provided on a surface of the circuit board, the second backlight detection chip being located on a side of the light emission chip remote from the light reception chip;

A tenth optical surface is formed at the bottom of the lens assembly body, and the tenth optical surface is positioned above the second backlight detection chip;

the sixth optical surface is further configured to reflect a portion of the emitted light signal, where the emitted light signal reflected by the sixth optical surface is transmitted to the fifth optical surface and transmitted through the fifth optical surface, and the light signal transmitted through the fifth optical surface is transmitted to the second optical surface and transmitted to the tenth optical surface by being reflected by the second optical surface and transmitted to the second backlight detection chip by being transmitted through the tenth optical surface.

7. The optical module of claim 1, wherein an eleventh optical surface is formed on the lens assembly body, the eleventh optical surface facing the second fiber optic adapter and the light receiving chip.

8. An optical module, comprising:

a circuit board, the surface of which is provided with a light emitting chip and a light receiving chip;

the bottom of the lens component is connected with the circuit board and covers the light emitting chip and the light receiving chip; wherein:

the lens assembly includes a lens assembly body, a first fiber optic adapter, and a second fiber optic adapter; the first optical fiber adapter and the second optical fiber adapter are arranged at the first end of the lens assembly body, the first optical fiber adapter is used for transmitting and transmitting optical signals, and the second optical fiber adapter is used for transmitting and receiving optical signals;

The center of the light receiving chip is positioned between the projection of the optical axis of the first optical fiber adapter on the circuit board and the projection of the optical axis of the second optical fiber adapter on the circuit board;

the lens assembly body is provided with a third optical surface and a fourth optical surface, the third optical surface faces the second optical fiber adapter, the fourth optical surface faces the third optical surface and the light receiving chip, and the light receiving chip is located below the fourth optical surface and between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter.

9. The light module of claim 8 wherein the top of the lens assembly body is formed with a first recess, the bottom of the first recess being formed with a third recess and a fourth recess;

forming the third optical surface on the side wall of the third groove; a fourth optical surface is formed on a wall of the fourth groove.

10. The light module of claim 9 wherein the bottom of the lens assembly body is provided with an eighth optical surface that is above the light receiving chip and below the fourth optical surface;

And a fourth lens is arranged on the eighth optical surface, and the fourth lens converges received light signals to the light receiving chip.