CN117082794A - Protective structure, preparation method thereof and optical communication module - Google Patents
Protective structure, preparation method thereof and optical communication module Download PDFInfo
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- CN117082794A CN117082794A CN202311323430.2A CN202311323430A CN117082794A CN 117082794 A CN117082794 A CN 117082794A CN 202311323430 A CN202311323430 A CN 202311323430A CN 117082794 A CN117082794 A CN 117082794A
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- protective cover
- pcb
- optical communication
- glue
- communication device
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- 230000001681 protective effect Effects 0.000 title claims abstract description 211
- 230000003287 optical effect Effects 0.000 title claims abstract description 103
- 238000004891 communication Methods 0.000 title claims abstract description 89
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 239000003292 glue Substances 0.000 claims abstract description 110
- 238000007789 sealing Methods 0.000 claims abstract description 57
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 53
- 239000000853 adhesive Substances 0.000 claims abstract description 33
- 230000001070 adhesive effect Effects 0.000 claims abstract description 33
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 239000013307 optical fiber Substances 0.000 claims description 9
- 238000010521 absorption reaction Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 3
- 239000000428 dust Substances 0.000 abstract description 7
- 230000002265 prevention Effects 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 5
- 238000001723 curing Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000007755 gap coating Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- IYRDVAUFQZOLSB-UHFFFAOYSA-N copper iron Chemical compound [Fe].[Cu] IYRDVAUFQZOLSB-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000033001 locomotion Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a protection structure, a preparation method thereof and an optical communication module, wherein the protection structure is used for protecting an optical communication device; the preparation method of the protective structure comprises the following steps: providing an optical communication device and a protective cover; wherein, the optical communication device is fixed on the PCB; positioning glue is dotted on the PCB board, so that the positioning glue surrounds the optical communication device; transferring the protective cover to enable the protective cover to cover the optical communication device; the protective cover is adhered to the PCB through positioning glue; solidifying the positioning glue to fix the protective cover on the PCB; coating the sealing reinforcing glue on the junction of the protective cover and the PCB so as to form a sealing structure between the protective cover and the PC board; and (5) curing the sealing reinforcing adhesive. By adopting the technical scheme, the protective cover and the PCB form a sealing structure, and the formed protective structure has a simple structure, can realize multiple protection functions of dust prevention, vapor prevention and mechanical protection, and is beneficial to improving the stability of an optical path and the service life of an optical communication device.
Description
Technical Field
The present invention relates to the field of optical communications technologies, and in particular, to a protection structure, a preparation method thereof, and an optical communication module.
Background
With the development of technology, the optical communication device has put higher demands on transmission rate, transmission loss, anti-interference capability and the like, and the optical communication device has been developed towards high integration and miniaturization. The optical communication device is very fragile and is easy to suffer from invasion of moisture in the environment, so that the optical communication device is adhered to moisture absorption of glue to generate light path deflection or displacement, even condensed water vapor exists on the surface of the device, and finally the loss of the light path of the optical communication device is caused, so that the light emitting efficiency is influenced. In addition, when the optical communication device works for a long time, dust in the air can be adsorbed on elements such as a laser, and the like, so that the optical communication device is abnormal in function.
The existing protection structure is complex in design, difficult to realize in technology, and single in function does not play a role in multiple protection.
Therefore, designing a structure with multiple protection functions for an optical communication device is a technical problem to be solved currently.
Disclosure of Invention
The invention provides a protection structure, a preparation method thereof and an optical communication module, so as to realize multiple protection functions of an optical communication device.
According to an aspect of the present invention, there is provided a method for manufacturing a protective structure for protecting an optical communication device, the protective structure including a protective cover, a positioning adhesive, and a seal reinforcing adhesive;
the preparation method comprises the following steps:
providing the optical communication device and the protective cover; wherein the optical communication device is fixed on the PCB;
dispensing a positioning adhesive on the PCB to enable the positioning adhesive to surround the optical communication device;
transferring the protective cover to enable the protective cover to cover the optical communication device; the protective cover is adhered to the PCB through the positioning adhesive;
solidifying the positioning glue to fix the protective cover on the PCB;
after the positioning glue is cured, coating the sealing reinforcing glue on the junction of the protective cover and the PCB so as to enable the protective cover and the PCB to form a sealing structure;
and curing the sealing reinforcing glue.
Optionally, before the positioning glue is dispensed on the PCB, before the positioning glue surrounds the optical communication device, the method further includes:
acquiring position coordinates of a positioning hole on the PCB;
and determining the position coordinates of the positioning glue and the position coordinates of the protective cover according to the position coordinates of the positioning holes.
Optionally, the protective cover includes a plurality of support feet; the supporting legs are of sheet-shaped structures; the supporting feet are connected with the edges of the protective cover, and when the protective cover is fixed on the PCB, the plane of the supporting feet is parallel to the plane of the PCB;
transferring the protective cover to enable the protective cover to cover the optical communication device; the protective cover is adhered to the PCB board through the positioning glue, and comprises:
and transferring the protective cover, and bonding the supporting legs of the protective cover with the PCB through the positioning glue.
Optionally, curing the positioning glue to fix the protective cover on the PCB board includes:
solidifying the positioning glue at a first temperature to fix the protective cover on the PCB;
curing the seal reinforcing adhesive, comprising:
irradiating the sealing reinforcing glue with ultraviolet light, and then curing the sealing reinforcing glue at a second temperature;
wherein the first temperature is greater than the second temperature, and the first temperature and the second temperature are both less than 100 ℃.
According to another aspect of the present invention, there is provided a protective structure for protecting an optical communication device; the protective structure is prepared by adopting the preparation method of the protective structure;
the protective structure comprises: a protective cover, positioning glue and sealing reinforcing glue;
the protective cover is fixed on the PCB where the optical communication device is located through positioning glue; the sealing reinforcing glue is positioned at the edge of the protective cover and fills up a gap between the edge of the protective cover and the PCB;
the protective cover covers the optical communication device; the protective cover, the sealing reinforcing glue and the PCB form a sealing structure;
wherein the water absorption rate of the positioning adhesive is less than 1%; the water absorption rate of the sealing reinforcing adhesive is less than 0.5%.
Optionally, the viscosity of the positioning adhesive is greater than or equal to 50000cps and less than or equal to 200000cps; the viscosity of the sealing reinforcing glue is more than or equal to 10000cps and less than 50000cps.
Optionally, the protective cover includes a plurality of support feet; the supporting legs are of sheet-shaped structures; the supporting feet are connected with the edges of the protective cover, and when the protective cover is fixed on the PCB, the plane of the supporting feet is parallel to the plane of the PCB;
the protective cover and the supporting legs comprise metal materials; the thickness of the protective cover and the supporting feet is smaller than 0.1mm.
Optionally, the supporting leg is rectangular;
the first side length of the rectangle is larger than or equal to 1mm and smaller than or equal to 2mm; the second side of the rectangle is greater than or equal to 2mm and less than or equal to 3mm;
the first side length or the second side length of the rectangle is connected with the edge of the protective cover.
Optionally, the protective cover includes a first opening;
the optical fiber connected with the optical communication device extends to the outside of the protective cover through the first opening.
According to still another aspect of the present invention, there is provided an optical communication module, comprising: optical communication device, PCB board and above-mentioned protective structure.
According to the technical scheme, before the protective cover is transferred to the PCB and the sealing reinforcing glue is coated on the gap between the protective cover and the PCB, the protective cover can be fixed on the PCB by dispensing the positioning glue, so that the displacement of the protective cover caused by the subsequent steps is avoided; through the gap coating seal reinforcement glue of protective cover and PCB board, can make protective cover and PCB board form seal structure, the protective structure who forms, simple structure can realize dustproof, waterproof vapour and mechanical protection multiple protect function as an organic whole, is favorable to improving the stability of light path and the life of optical communication device.
It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the invention or to delineate the scope of the invention. Other features of the present invention will become apparent from the description that follows.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an optical communication device and a protection structure thereof according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a protective cover according to an embodiment of the present invention;
FIG. 3 is a block flow diagram of a method for manufacturing a protection structure according to an embodiment of the present invention;
fig. 4 is a flow chart of a method for manufacturing a protection structure according to an embodiment of the present invention.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Fig. 1 is a schematic structural diagram of an optical communication device and a protection structure thereof according to an embodiment of the present invention. Referring to fig. 1, the guard structure includes: a protective cover 10, a positioning adhesive 20 and a sealing reinforcing adhesive 30; the protective cover 10 is fixed on the PCB 02 where the optical communication device 01 is positioned through the positioning adhesive 20; the sealing reinforcing glue 30 is positioned at the edge of the protective cover 10 and fills up the gap between the edge of the protective cover 10 and the PCB 02; the protective cover 10 covers the optical communication device 01; the protective cover 10, the sealing reinforcing glue 30 and the PCB 02 where the optical communication device 01 is positioned form a sealing structure; wherein the water absorption of the positioning glue 20 is less than 1%; the water absorption of the seal reinforcing glue 30 is less than 0.5%.
The protective cover 10 includes a case, a spherical structure, a cylinder, a pyramid, etc., and can cover the optical communication device 01 with a certain space margin. The positioning glue 20 includes, but is not limited to, epoxy, acrylic, etc. materials, has high adhesive strength, is not easy to flow before curing, and can fix the protective cover 10 on the PCB 02. The seal reinforcing glue 30 includes, but is not limited to, epoxy resin, acrylic acid, silicone resin, and other materials, and has certain fluidity and certain bonding strength before curing, so that gaps between the edge of the protective cover 10 and the PCB 02 can be filled. The sealing reinforcing glue 30 has a water absorption of less than 0.5% and excellent waterproof effect.
Specifically, the protection cover 10 can protect the optical communication device 01, and realize mechanical protection, dust prevention and vapor prevention. The positioning adhesive 20 can firmly fix the protective cover 10 on the PCB 02, so that the protective cover 10 is not easy to fall off under the action of external force. The seal reinforcing glue 30 can further stabilize the protective cover 10 on one hand, prevent the protective cover 10 from falling off, and can form a sealed environment in the protective cover 10 on the other hand, so as to prevent external dust and vapor from entering the interior of the protective cover 10 and affecting the performance of the optical communication device 01.
The optical communication device 01 includes an optical modulation chip 5, a lens unit 6, a laser 7 and an optical fiber array unit 8, wherein the laser 7 generates an optical signal, the optical signal can be transmitted to the optical modulation chip 5 through the lens unit 6, the optical modulation chip 5 can modulate and filter the optical signal, and the modulated and filtered optical signal is transmitted to the optical fiber array unit 8 and is transmitted to the optical fiber 9 through the optical fiber array unit 8. The protection structure can protect the optical modulation chip 5, the lens unit 6, the laser 7 and the optical fiber array unit 8 of the optical communication device 01 from mechanical damage, water vapor and dust, protect the optical path of the optical communication device 01, and improve the stability of the optical path and the service life of the optical communication device 01.
According to the protective structure provided by the embodiment of the invention, the protective cover is arranged to cover the optical communication device, the protective cover is fixed on the PCB where the optical communication device is located through the positioning glue, and the gap between the edge of the protective cover and the PCB is filled through the sealing reinforcing glue, so that the protective structure is simple in structure, can realize multiple protection functions of dust prevention, water vapor prevention and mechanical protection, and is beneficial to improving the stability of an optical path and prolonging the service life of the optical communication device.
In an alternative embodiment, the viscosity of the positioning glue 20 is greater than or equal to 50000cps and less than or equal to 200000cps; the viscosity of the seal stiffener 30 is greater than or equal to 10000cps and less than 50000cps.
The viscosity of the glue reflects the interaction strength of liquid molecules in the movement process, and is used for measuring the viscosity and also used for reflecting the viscosity or flowability of the glue. The higher the viscosity, the higher the viscosity and the lower the flowability; the smaller the viscosity, the smaller the viscosity and the greater the flowability.
For example, the viscosity of the positioning adhesive 20 may be set to about 100000cps, and the thermosetting is adopted, so that the positioning adhesive 20 has a larger viscous force, and the fluidity of the positioning adhesive 20 is reduced; the viscosity of the sealing reinforcing glue 30 can be set to be about 20000cps, and photo-curing and thermal curing are adopted, so that the sealing reinforcing glue 30 has certain fluidity before curing, can fill the gap between the edge of the protective cover 10 and the PCB 02, and simultaneously has certain viscous force, so that the edge of the protective cover 10 and the PCB 02 can be bonded.
In an alternative embodiment, fig. 2 is a schematic structural diagram of a protective cover according to an embodiment of the present invention. Referring to fig. 2, the protective cover 10 includes a plurality of support legs 11; the supporting feet 11 are of a sheet-shaped structure; the supporting feet 11 are connected with the edge of the protective cover 10, and when the protective cover 10 is fixed on the PCB 02, the plane of the supporting feet 11 is parallel to the plane of the PCB 02; the protective cover 10 and the supporting feet 11 are made of metal materials; the thickness of the protective cover 10 and the supporting feet 11 is less than 0.1mm.
The protecting cover 10 and the supporting legs 11 are made of iron, copper, iron-copper alloy and other materials, have high rigidity, and can protect the optical communication device 01 from being damaged easily. The thickness of the protective cover 10 and the supporting legs 11 is smaller than 0.1mm, which is beneficial to reducing the weight of the protective structure and the preparation cost. The supporting legs 11 are connected with the edges of the protective cover 10, so that the protective cover 10 is prevented from being too thin and difficult to fix, and the protective cover 10 can be contacted with the positioning glue 20 through the supporting legs 11 and is adhered and fixed on the PCB 02. In an embodiment, the number of the supporting legs 11 of the protective cover 10 is the same as the number of the positioning glue 20.
In an alternative embodiment, with continued reference to FIG. 2, the support feet 11 are rectangular; the first side length d1 of the rectangle is larger than or equal to 1mm and smaller than or equal to 2mm; the second side length d2 of the rectangle is more than or equal to 2mm and less than or equal to 3mm; the first side d1 or the second side d2 of the rectangle is connected to the edge of the protective cover 10. Illustratively, when the protective cover 10 is fixed on the PCB 02, the positioning glue 20 is adhered to the supporting leg 11, and the sealing reinforcing glue 30 covers the supporting leg 11 and fills the gap between the supporting leg 11 and the PCB 02.
In an alternative embodiment, the protective cover 10 includes a first opening 12; the optical fiber 9 to which the optical communication device 01 is connected extends to the outside of the protective cover 10 through the first opening 12. Illustratively, the seal reinforcement glue 30 may fill the gap between the optical fiber 9 and the first opening 12 to achieve tightness of the interior of the protective cover 10.
Based on the same inventive concept, fig. 3 is a flow chart of a preparation method of a protection structure according to an embodiment of the present invention. Referring to fig. 3, the preparation method includes:
s1001, providing an optical communication device and a protective cover; wherein, the optical communication device is fixed on the PCB board.
The protective cover comprises a box body, a spherical structure, a cylinder, a pyramid and other structures.
S1002, positioning glue is dispensed on the PCB, so that the positioning glue surrounds the optical communication device.
The positioning glue comprises materials such as epoxy resin, acrylic acid and the like, has high bonding strength and is not easy to flow before being cured.
S1003, transferring the protective cover to enable the protective cover to cover the optical communication device, and bonding the protective cover on the PCB through positioning glue.
S1004, curing the positioning adhesive to fix the protective cover on the PCB.
S1005, after the positioning glue is cured, coating the sealing reinforcing glue on the junction of the protective cover and the PCB so as to enable the protective cover and the PCB to form a sealing structure.
The sealing reinforcing glue comprises materials such as epoxy resin, acrylic acid, silicone resin and the like, has certain fluidity and certain bonding strength before solidification, and can fill gaps between the edge of the protective cover and the PCB.
S1006, curing the sealing reinforcing glue.
For example, the preparation method can be automated by mechanical equipment. The mechanical equipment comprises a conveying belt and a mechanical arm, the conveying belt can convey a PCB, an optical communication device is arranged on the PCB, and a vacuum suction nozzle is arranged on the mechanical arm and can suck and move the protective cover. The mechanical equipment further comprises a dispensing system, and the positioning glue can be dispensed around the optical communication device on the PCB according to preset coordinates. After dispensing, the vacuum nozzle moves the protective cover to a preset position to completely cover the optical communication device without contacting the optical communication device. And then the positioning glue is cured through high temperature and/or ultraviolet light irradiation, the cured positioning glue can firmly fix the protective cover on the PCB, and the protective cover cannot displace when the sealing reinforcing glue is coated at the junction of the protective cover and the PCB. Finally, the sealing reinforcing glue is cured by high temperature and/or ultraviolet light irradiation, and a sealing environment is formed in the protective cover, so that moisture and dust can be isolated.
According to the preparation method of the protective structure, the protective cover can be fixed on the PCB by dispensing the positioning glue before the protective cover is transferred to the PCB and the sealing reinforcing glue is coated on the gap between the protective cover and the PCB, so that the displacement of the protective cover caused by the subsequent steps is avoided; through the gap coating seal reinforcement glue of protective cover and PCB board, can make protective cover and PCB board form seal structure, the protective structure who forms, simple structure can realize dustproof, waterproof vapour and mechanical protection multiple protect function as an organic whole, is favorable to improving the stability of light path and the life of optical communication device.
In an alternative embodiment, fig. 4 is a flowchart of a method for manufacturing a protective structure according to an embodiment of the present invention. Referring to fig. 4, the preparation method includes:
s2001, providing an optical communication device and a protective cover; wherein, the optical communication device is fixed on the PCB board.
S2002, acquiring position coordinates of a positioning hole on the PCB;
and S2003, determining the position coordinates of the positioning glue and the position coordinates of the protective cover according to the position coordinates of the positioning holes.
S2004, the positioning glue is dispensed on the PCB board, so that the positioning glue surrounds the optical communication device.
S2005, transferring the protective cover to enable the protective cover to cover the optical communication device, and bonding the protective cover on the PCB through positioning glue.
S2006, curing the positioning adhesive to fix the protective cover on the PCB.
S2007, after the positioning glue is cured, the sealing reinforcing glue is coated on the junction of the protective cover and the PCB so that the protective cover and the PCB form a sealing structure.
S2008, curing the sealing reinforcing adhesive.
Illustratively, the manipulator has a photographing and positioning function, and an optical recognition system is arranged on the manipulator. Referring to fig. 1, a positioning hole 03 is provided on a pcb 02. The optical recognition system can take a photo of the PCB 02, establish a coordinate system, determine the position coordinates of the positioning hole 03, calculate the position coordinates of the positioning glue 20 and the position coordinates of the protective cover 10 according to the position coordinates of the positioning hole 03, and further determine the dispensing position of the positioning glue 20 and the predetermined position of the protective cover 10. Then, the dispensing of the positioning glue 20 is performed at the dispensing position, so that the protective cover 10 can be contacted with the positioning glue 20 when the protective cover 10 is transferred to the PCB, and the protective cover 10 is not contacted with the optical communication device 01. In an embodiment, before dispensing, the protective cover 10 is moved to a position right above the optical communication device 01 through the vacuum suction nozzle, the position coordinate of the protective cover 10 is recorded, then the protective cover 10 is removed, and the dispensing system is used for dispensing, and then the protective cover 10 is moved to the position coordinate of the protective cover 10 recorded before, so that the protective cover 10 can be accurately fixed on the PCB 02.
According to the preparation method of the protective structure, the positioning glue is dotted on the PCB, the position coordinates of the positioning holes on the PCB are obtained before the positioning glue surrounds the optical communication device, and the position coordinates of the positioning glue and the position coordinates of the protective cover are determined according to the position coordinates of the positioning holes, so that the position accuracy of the glue is improved, and the transfer accuracy of the protective cover is improved.
In an alternative embodiment, the protective cover includes a plurality of support feet; the supporting legs are of sheet-shaped structures; the supporting legs are connected with the edges of the protective cover, and when the protective cover is fixed on the PCB, the plane of the supporting legs is parallel to the plane of the PCB; transferring the protective cover to enable the protective cover to cover the optical communication device, and bonding the protective cover on the PCB board through positioning glue, comprising: and transferring the protective cover, and bonding the supporting legs of the protective cover with the PCB through positioning glue. Therefore, the protective cover can be prevented from being too thin and difficult to fix, and the protective cover can be contacted with the positioning adhesive through the supporting legs and is adhered and fixed on the PCB. In one embodiment, the number of support feet of the protective cover is the same as the number of positioning glue.
In an alternative embodiment, curing the positioning glue to secure the protective cover to the PCB board includes: curing the positioning adhesive at a first temperature to fix the protective cover on the PCB; curing the sealing reinforcing adhesive, comprising: irradiating the sealing reinforcing glue with ultraviolet light, and then curing the sealing reinforcing glue at a second temperature; wherein the first temperature is greater than the second temperature, and both the first temperature and the second temperature are less than 100 ℃.
Illustratively, the PCB and the optical communication device, protective shell and positioning adhesive on the PCB can be placed in an oven and baked at 90 ℃ for 1h. And irradiating the sealing reinforcing glue by using an ultraviolet lamp with the wavelength of 365nm, and then placing the PCB and the optical communication device, the protective shell, the positioning glue and the sealing reinforcing glue on the PCB in an oven, and baking for 1h at 80 ℃. By setting the first temperature to be higher than the second temperature, the protective cover displacement caused by melting the positioning adhesive when the sealing reinforcing adhesive is thermally cured can be avoided; by setting the first temperature and the second temperature to be less than 100 ℃, the damage to the optical communication device caused by overhigh curing temperature can be avoided; before the heat-curing sealing reinforcing glue, ultraviolet curing is performed, so that the sealing reinforcing glue can be quickly cured, and the situation that gaps appear between the protective cover and the PCB due to flowing of the sealing reinforcing glue is avoided.
The preparation method of the protection structure provided by the embodiment of the invention is used for preparing the protection structure provided by any embodiment of the invention, has corresponding technical characteristics and beneficial effects of the protection structure, and is not described in detail in the embodiment of the preparation method of the protection structure, and reference can be made to the description of the protection structure, so that the description is not repeated here; similarly, the protection structure provided by the embodiment of the present invention also has functional devices and beneficial effects that can execute the preparation method of the protection structure provided by the embodiment of the present invention, and details that are not described in detail in the embodiment of the protection structure may refer to the description of the preparation method of the protection structure above, which is not repeated herein.
Based on the same inventive concept, the embodiment of the present invention further provides an optical communication module, as shown in fig. 1, where the optical communication module includes an optical communication device 01, a PCB 02, and a protection structure provided by any embodiment of the present invention. The optical communication module provided by the embodiment of the invention has higher light path stability and longer service life.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (10)
1. The preparation method of the protective structure is characterized in that the protective structure is used for protecting an optical communication device; the protective structure comprises a protective cover, positioning glue and sealing reinforcing glue;
the preparation method comprises the following steps:
providing the optical communication device and the protective cover; wherein the optical communication device is fixed on the PCB;
dispensing a positioning adhesive on the PCB to enable the positioning adhesive to surround the optical communication device;
transferring the protective cover to enable the protective cover to cover the optical communication device; the protective cover is adhered to the PCB through the positioning adhesive;
solidifying the positioning glue to fix the protective cover on the PCB;
after the positioning glue is cured, coating the sealing reinforcing glue on the junction of the protective cover and the PCB so as to enable the protective cover and the PCB to form a sealing structure;
and curing the sealing reinforcing glue.
2. The method for manufacturing a protective structure according to claim 1, further comprising, before dispensing a positioning paste on the PCB, surrounding the optical communication device:
acquiring position coordinates of a positioning hole on the PCB;
and determining the position coordinates of the positioning glue and the position coordinates of the protective cover according to the position coordinates of the positioning holes.
3. The method of manufacturing a protective structure according to claim 1, wherein the protective cover comprises a plurality of support feet; the supporting legs are of sheet-shaped structures; the supporting feet are connected with the edges of the protective cover, and when the protective cover is fixed on the PCB, the plane of the supporting feet is parallel to the plane of the PCB;
transferring the protective cover to enable the protective cover to cover the optical communication device; the protective cover is adhered to the PCB board through the positioning glue, and comprises:
and transferring the protective cover, and bonding the supporting legs of the protective cover with the PCB through the positioning glue.
4. The method of manufacturing a protective structure according to claim 1, wherein curing the positioning glue to fix the protective cover on the PCB board comprises:
solidifying the positioning glue at a first temperature to fix the protective cover on the PCB;
curing the seal reinforcing adhesive, comprising:
irradiating the sealing reinforcing glue with ultraviolet light, and then curing the sealing reinforcing glue at a second temperature;
wherein the first temperature is greater than the second temperature, and the first temperature and the second temperature are both less than 100 ℃.
5. A protective structure, characterized in that the protective structure is used for protecting an optical communication device; the protective structure is prepared by the preparation method of the protective structure of any one of claims 1-4;
the protective structure comprises: a protective cover, positioning glue and sealing reinforcing glue;
the protective cover is fixed on the PCB where the optical communication device is located through positioning glue; the sealing reinforcing glue is positioned at the edge of the protective cover and fills up a gap between the edge of the protective cover and the PCB;
the protective cover covers the optical communication device; the protective cover, the sealing reinforcing glue and the PCB form a sealing structure;
wherein the water absorption rate of the positioning adhesive is less than 1%; the water absorption rate of the sealing reinforcing adhesive is less than 0.5%.
6. The protective structure of claim 5, wherein the positioning glue has a viscosity greater than or equal to 50000cps and less than or equal to 200000cps; the viscosity of the sealing reinforcing glue is more than or equal to 10000cps and less than 50000cps.
7. The protective structure of claim 5, wherein said protective cover comprises a plurality of support feet; the supporting legs are of sheet-shaped structures; the supporting feet are connected with the edges of the protective cover, and when the protective cover is fixed on the PCB, the plane of the supporting feet is parallel to the plane of the PCB;
the protective cover and the supporting legs comprise metal materials; the thickness of the protective cover and the supporting feet is smaller than 0.1mm.
8. The protective structure of claim 7 wherein said support feet are rectangular;
the first side length of the rectangle is larger than or equal to 1mm and smaller than or equal to 2mm; the second side of the rectangle is greater than or equal to 2mm and less than or equal to 3mm;
the first side length or the second side length of the rectangle is connected with the edge of the protective cover.
9. The protective structure of claim 5, wherein the protective cover comprises a first opening;
the optical fiber connected with the optical communication device extends to the outside of the protective cover through the first opening.
10. An optical communication module, comprising: optical communication device, PCB board and protective structure according to any of claims 5-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311323430.2A CN117082794A (en) | 2023-10-13 | 2023-10-13 | Protective structure, preparation method thereof and optical communication module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311323430.2A CN117082794A (en) | 2023-10-13 | 2023-10-13 | Protective structure, preparation method thereof and optical communication module |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110031513A1 (en) * | 2009-08-04 | 2011-02-10 | Advanced Optoelectronic Technology, Inc. | Waterproof smd led module and method of manufacturing the same |
| CN106711353A (en) * | 2015-07-20 | 2017-05-24 | 上海和辉光电有限公司 | AMOLED structure and packaging method of AMOLED display device |
| CN107219596A (en) * | 2017-08-04 | 2017-09-29 | 青岛海信宽带多媒体技术有限公司 | A kind of optical secondary module and optical module |
| CN210443559U (en) * | 2019-07-30 | 2020-05-01 | 九江维信诺科技有限公司 | Display device |
| CN218524919U (en) * | 2022-09-14 | 2023-02-24 | 苏州旭创科技有限公司 | Optical module |
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2023
- 2023-10-13 CN CN202311323430.2A patent/CN117082794A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110031513A1 (en) * | 2009-08-04 | 2011-02-10 | Advanced Optoelectronic Technology, Inc. | Waterproof smd led module and method of manufacturing the same |
| CN106711353A (en) * | 2015-07-20 | 2017-05-24 | 上海和辉光电有限公司 | AMOLED structure and packaging method of AMOLED display device |
| CN107219596A (en) * | 2017-08-04 | 2017-09-29 | 青岛海信宽带多媒体技术有限公司 | A kind of optical secondary module and optical module |
| CN210443559U (en) * | 2019-07-30 | 2020-05-01 | 九江维信诺科技有限公司 | Display device |
| CN218524919U (en) * | 2022-09-14 | 2023-02-24 | 苏州旭创科技有限公司 | Optical module |
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