CN117049179B - Semiconductor automation device and automation control method - Google Patents
Semiconductor automation device and automation control method Download PDFInfo
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- CN117049179B CN117049179B CN202310844873.XA CN202310844873A CN117049179B CN 117049179 B CN117049179 B CN 117049179B CN 202310844873 A CN202310844873 A CN 202310844873A CN 117049179 B CN117049179 B CN 117049179B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a semiconductor automation device and an automation control method, wherein the device comprises a rotary wafer box frame device, a rotary wafer box frame device and a control device, wherein the rotary wafer box frame device is used for bearing and rotating a wafer box and comprises a plurality of layers of wafer box carrier tables, and a rotating shaft is rotatably arranged on a bottom plate; the rotary driving assembly is used for driving the rotating shaft to rotate and is arranged on the bottom plate, and the output end of the rotary driving assembly is connected with the rotating shaft through a transmission piece; the sensing piece and the rotating in-place detection sensor form a matching state to detect whether the wafer box carrying platform rotates in place or not, and the rotating in-place detection sensor is provided with a sensing groove; when the induction groove on one station is embedded on the induction sheet, the induction sheet triggers the rotation in-place detection sensor to form a matching state; the wafer box carrier comprises a plurality of in-place detection sensors which are respectively used for detecting whether the wafer box contacted with the in-place detection sensors is in place, and each layer of wafer box carrier is provided with a in-place detection sensor. The invention can solve the problem of buffer memory of wafer box transportation when the equipment is operated, and improve the productivity of the equipment.
Description
Technical Field
The invention belongs to wafer manufacturing process equipment in the field of semiconductors, and particularly relates to semiconductor automation equipment and an automation control method.
Background
The reactor apparatus is an important process treatment apparatus in the semiconductor manufacturing process, and it is required to transfer wafers to be processed from a wafer cassette into a wafer boat and transfer wafers processed by the process from the wafer boat into the wafer cassette, and the wafer cassette is used as a carrier of the wafers, so that the transfer process involves a problem of buffering the wafer cassette.
In the prior art, a wafer box is arranged for caching, the wafer boxes are distributed in a plane grid shape according to a multi-layer and multi-column mode, and caching stations are arranged; meanwhile, the wafer box grabbing manipulator needs to simultaneously meet grabbing of all stations, namely all cache stations are grabbing stations, accumulated errors are easy to cause, and stability is poor.
At the same time, the wafer box is communicated with the wafer transmission area in the wafer transmission stage, and most of the wafer boxes are filled with air, and contain non-process gases such as oxygen, water vapor and the like, and the non-process gases in the wafer boxes are diffused to the wafer transmission area every time the wafer boxes are opened. These non-process gases will have an effect on the wafer, which is still in a high temperature state. Therefore, before the wafer is transferred from the wafer cassette to the wafer boat by the external transfer equipment, the N2 gas needs to be injected into the wafer cassette to replace the non-process gas therein.
In the prior art, the gas in the wafer transmission area is detected, when the concentration of non-process gas reaches a threshold value, the gas in the whole wafer transmission area is replaced, and the method consumes a large amount of time and a large amount of N2, is expensive in operation cost and seriously affects the productivity of equipment.
Disclosure of Invention
The invention aims to provide a semiconductor automation device and an automation control method, which can solve the problem of buffering wafer transportation during operation of a reaction furnace device and improve the productivity of the device. In order to achieve the above purpose, the invention adopts the following technical scheme:
a semiconductor automation device, comprising:
A bottom plate;
The rotary wafer box frame device is used for bearing and rotating the wafer box and comprises a plurality of layers of wafer box carrying platforms, and all the wafer box carrying platforms are axially distributed and are all rotationally arranged on a hollow rotating shaft; the rotating shaft is rotatably arranged on the bottom plate; a space for installing a rotary driving assembly and a plurality of rotary in-place detection sensors is formed between the last layer of wafer box carrier and the bottom plate;
the rotary driving assembly is used for driving the rotating shaft to rotate and is arranged on the bottom plate, and the output end of the rotary driving assembly is connected with the rotating shaft through a transmission piece;
the sensing piece and the rotating in-place detection sensor form a matching state to detect whether the wafer box carrying platform rotates in place or not, and the rotating in-place detection sensor is arranged on one side surface of the bottom plate facing the wafer box carrying platform and is correspondingly arranged with a station on the bottom plate; the sensing piece is fixed on the last layer of wafer carrier and is arranged towards the direction of the rotating in-place detection sensor; an induction groove is formed in the rotation in-place detection sensor; when the induction groove on one station is embedded on the induction sheet, the induction sheet triggers the rotation in-place detection sensor to form the matching state;
The wafer box carrier comprises a plurality of in-place detection sensors which are respectively used for detecting whether a wafer box contacted with the wafer box is in place or not, and each layer of the wafer box carrier is provided with the in-place detection sensors.
Preferably, the wafer box carrier comprises a plurality of gas displacement devices, wherein the gas displacement devices are correspondingly arranged on the wafer box carrier and are fixed on the corresponding wafer box carrier, the gas inlet pipeline penetrates through the gas path line passing hole on the rotating shaft and is connected with the gas inlet end of the gas displacement device, the gas outlet end of the gas displacement device is communicated with the corresponding wafer box, and purge gas enters the wafer box from the bottom of the wafer box.
Preferably, the rotary driving assembly is a motor, the motor is fixed on the bottom plate, and the output shaft of the motor extends to the lower section of the bottom plate.
Preferably, a plurality of positioning grooves are formed in the bottom of the wafer box, and the positioning grooves are matched with wafer box positioning pieces on the wafer box carrier to limit the wafer box on the corresponding wafer box carrier.
Preferably, the positioning groove is formed at the top of a protrusion.
Preferably, each layer of the wafer cassette carrier includes a 4-quarter mounting area.
Preferably, the transmission member is a timing belt.
A semiconductor automation control method comprising the steps of:
Step1, an upper computer transmits a target position for placing a wafer box to a PLC;
Step 2, the PLC receives the instruction, acts according to the set position and transmits the instruction to the rotary driving assembly;
step 3, the rotary driving assembly drives the rotary wafer box frame device, and after the wafer box carrier reaches the position, the sensing piece triggers one of the rotary in-place detection sensors;
step 4, after receiving the instruction of the rotation in-place detection sensor, the PLC places a wafer box, and the wafer box triggers the in-place detection sensor;
And 5, after receiving the instruction of the in-place detection sensor, the PLC starts the gas replacement device.
Preferably, the specific step of setting the position by the PLC in step2 includes:
step 2A, manually rotating the rotary driving assembly, wherein the rotary driving assembly drives a wafer box carrying platform of the rotary wafer box frame device to rotate to a first station on a bottom plate, and the sensing piece triggers the rotary in-place detection sensor L1 and presets an origin through a PLC;
Step 2B, continuing to manually rotate the rotary driving assembly, rotating the rotary wafer box frame device to a second station on the bottom plate, triggering the rotary in-place detection sensor L2 by the sensing piece, and acquiring the number of turns rotated by the rotary driving assembly and calculating a rotation angle beta 1 by the PLC;
step 2C, continuing to manually rotate the rotary driving assembly, rotating the rotary wafer box frame device to a third station on the bottom plate, triggering the rotary in-place detection sensor L3 by the sensing piece, and acquiring the number of turns rotated by the rotary driving assembly and calculating a rotation angle beta 2 by the PLC;
step 2D, continuing to manually rotate the rotary driving assembly, rotating the rotary wafer box frame device to a fourth station on the bottom plate, triggering the rotary in-place detection sensor L4 by the sensing piece, and acquiring the number of turns rotated by the rotary driving assembly and calculating a rotation angle beta 3 by the PLC;
step 2E, inputting the rotation angle beta 1, the rotation angle beta 2 and the rotation angle beta 3 into the upper computer to be used as the target position of the action.
In order to reduce accumulated errors and improve equipment stability, each layer of wafer box carrying platform only has one position for taking and placing the wafer box, and in fig. 10, the sensing piece 7 triggers the rotation in-place detection sensor L1, and at the moment, the first station is a taking and placing station; the rotary wafer box frame device rotates to the next position, the sensing piece triggers the rotation in-place detection sensor L2, and at the moment, the second station is a taking and placing station; the rotary wafer box frame device rotates to the next position, the sensing piece triggers the rotation in-place detection sensor L3, and at the moment, the third station is a picking and placing station; the rotary wafer box frame device rotates to the next position, the sensing piece triggers the rotation in-place detection sensor L4, at the moment, the fourth station is a picking and placing station, and the wafer box carrying robot carries the wafer box only at the picking and placing station, so that accumulated errors of multi-position movement are reduced.
Compared with the prior art, the invention has the advantages that:
(1) The problem of caching of wafer carrying during operation of the equipment can be solved, the caching capacity and stability are improved, and the productivity of the equipment is improved. Specifically, the rotary wafer box frame device is used for bearing and rotating wafers and comprises a plurality of layers of wafer box carriers, and all the wafer box carriers are axially distributed and are all rotationally arranged on a hollow rotating shaft; the rotating shaft is rotatably arranged on the bottom plate; the wafer box is driven by the rotary driving device to rotate the rotary shaft and turn to a required designated angle position, so that external conveying equipment can conveniently convey the wafer box. Further, the upper computer transmits a target position for placing the wafer cassette to the PLC; the PLC receives the instruction and then acts according to the set position, and transmits the instruction to the rotary driving assembly; the rotary driving assembly drives the rotary wafer box frame device, and after the wafer box carrier reaches the position, the sensing piece triggers one of the rotary in-place detection sensors; after receiving the instruction of the rotation in-place detection sensor, the PLC places a wafer box, and the wafer box triggers the in-place detection sensor; after the PLC receives the instruction of the wafer box in-place detection sensor, the gas replacement device is started.
(2) The non-process gas in the wafer box can be prevented from entering the wafer transmission area and can be replaced, so that the corrosion of the non-process gas in the wafer box to the wafer is avoided. Specifically, the wafer box is placed on the wafer box carrier, the gas replacement device is in butt joint with the gas inlet of the wafer box, the gas replacement device injects N2 gas into the gas inlet of the wafer box, and non-process gas in the wafer box is discharged through the gas outlet.
(3) In order to reduce accumulated errors and improve equipment stability, each layer of wafer box carrying platform only has one position for taking and placing the wafer box, and the sensing piece triggers the rotation in-place detection sensor L1, at the moment, the first station is a taking and placing station; the rotary wafer box frame device rotates to the next position, the sensing piece triggers the rotation in-place detection sensor L2, and at the moment, the second station is a taking and placing station; the rotary wafer box frame device rotates to the next position, the sensing piece triggers the rotation in-place detection sensor L3, and at the moment, the third station is a picking and placing station; the rotary wafer box frame device rotates to the next position, the sensing piece triggers the rotation in-place detection sensor L4, at the moment, the fourth station is a picking and placing station, and the wafer box carrying robot carries the wafer box only at the picking and placing station, so that accumulated errors of multi-position movement are reduced.
Drawings
FIG. 1 is a schematic diagram of a wafer cassette cache apparatus (without a wafer cassette);
FIG. 2 is a side view of a rotary wafer cassette rack apparatus (without wafer cassette);
FIG. 3 is a perspective view of a rotary wafer cassette rack apparatus (without wafer cassettes);
FIG. 4 is a schematic view of the bottom structure of the wafer cassette;
FIG. 5 is a top view of the wafer cassette carrier;
FIG. 6 is a top view of a wafer cassette carrier (including a wafer cassette);
FIG. 7 is a perspective view of a wafer cassette carrier (including a wafer cassette);
FIG. 8 is a schematic diagram of the operation principle of the gas displacement device;
FIG. 9 is a schematic diagram of an electrical control device;
FIG. 10 is a schematic diagram of the distribution of the rotational in-place detection sensors of the rotary wafer cassette rack apparatus;
FIG. 11 is an automatic mode schematic diagram of an electrical control device;
Fig. 12 is a schematic diagram of a manual mode of the electrical control device.
The device comprises a 1-bottom plate, a 2-rotary wafer box frame device, a 21-wafer box carrying platform, a 211-wafer box positioning piece, a 22-rotating shaft, a 221-gas path line passing hole, a 3-gas replacement device, a 4-wafer box, a 41-positioning groove, a 42-gas inlet, a 43-gas outlet, a 5-in-place detection sensor, a 6-rotary in-place detection sensor, a 7-sensing piece, an 8-air inlet pipeline, a 9-electrical control device, a 91-HMI operation screen, a 92-operation button, a 93-box body and a 10-rotary driving component.
Detailed Description
The semiconductor automation device and the automation control method of the present invention will be described in more detail below with reference to the schematic drawings, in which preferred embodiments of the present invention are shown, it being understood that the invention described herein may be modified by those skilled in the art, while still achieving the advantageous effects of the invention. Accordingly, the following description is to be construed as broadly known to those skilled in the art and not as limiting the invention.
As shown in fig. 1 to 10, a semiconductor automation apparatus (wafer cassette buffer apparatus) includes: a base plate 1, a rotary wafer cassette rack device 2, an electrical control device 9 and a gas replacement device 3.
The rotary wafer box frame device 2 is used for bearing and rotating the wafer box and comprises a plurality of layers of wafer box carrying platforms 21, and all the wafer box carrying platforms 21 are axially distributed and are all rotationally arranged on a hollow rotating shaft 22; the rotating shaft 22 is rotatably arranged on the bottom plate 1; a space for installing a rotary driving component 10 and a plurality of rotary in-place detection sensors 6 is formed between the last layer of wafer box carrier and the bottom plate 1.
Each layer of wafer cassette carrier 21 includes a 4-quarter mounting area. Each mounting area corresponds to a station on the base plate 1. The wafer box is driven by the rotary driving device to rotate the rotary shaft and turn to a required designated angle position, so that external conveying equipment can conveniently convey the wafer box.
The angle of each wafer cassette stage 21 can be set independently and arbitrarily with respect to the rotation axis. The rotating shaft 22 is hollow with two open ends, and is provided with a plurality of air passage holes in the height direction, so that air passages and circuits are conveniently arranged on each layer of wafer box carrier.
The rotation driving assembly 10 is configured to drive the rotation shaft 22 to rotate, and is disposed on the base plate 1, and an output end of the rotation driving assembly 10 is connected with the rotation shaft 22 through a transmission member. Specifically, the rotary driving assembly 10 is a motor, which is fixed on the base plate 1, and the output shaft thereof extends to the lower section of the base plate 1. The output end of the rotary driving assembly 10 is connected with the rotating shaft 22 through a synchronous belt. Specifically, a gear is installed on the motor output end and the rotating shaft 22, and the two gears are driven by a synchronous belt.
The sensing piece 7 and the rotation in-place detecting sensor 6 are engaged to detect whether the wafer cassette stage 21 is rotated in place. The rotation in-place detection sensor 6 can detect actual positional information of the pod carrier 21. Specifically, the sensing piece 7 is made of an opaque metal material.
The rotation in-place detection sensor 6 is arranged on one side surface of the bottom plate 1 facing the wafer box carrying platform 21 and is arranged corresponding to a station on the bottom plate 1; the sensing piece 7 is fixed on the last layer of wafer carrier and is arranged towards the direction of the rotating in-place detection sensor 6; an induction groove is formed in the rotary in-place detection sensor 6; when the sensing groove on one station is embedded on the sensing piece 7, the sensing piece 7 triggers the rotation of the in-place detection sensor 6 to form a matching state; further, the rotation-in-place detection sensor 6 is a micro-photosensor EE series.
The plurality of in-place detection sensors 5 are respectively used for detecting whether the wafer box 4 contacted with the in-place detection sensors is in place, and each layer of wafer box carrier 21 is provided with an in-place detection sensor. Specifically, the in-place detecting sensor 5 is a pressure sensor to detect whether the wafer cassette 4 is placed in place by an external handling apparatus, and at the same time, whether the wafer cassette 4 is in a state or not can be detected.
The gas replacing devices 3 are correspondingly arranged on the wafer box carriers 21 and fixed on the corresponding wafer box carriers 21, the gas inlet pipeline 8 passes through the gas passage line holes 221 on the rotating shaft 22 and is connected with the gas inlet ends of the gas replacing devices 3, the gas outlet ends of the gas inlet pipeline are communicated with the corresponding wafer boxes, and purge gas (such as inert gas N2) enters the wafer boxes from the bottoms of the wafer boxes. Specifically, the gas replacement device is disposed on the wafer cassette carrier, and injects N2 gas into the gas inlet 42 of the wafer cassette, and the non-process gas in the wafer cassette is exhausted through the gas outlet 43. As shown in fig. 6 to 8, the wafer cassette 41 is placed on the wafer cassette stage 21, the gas inlet of the wafer cassette 4 is abutted with the gas replacement device 3, the gas replacement device 3 injects N2 gas into the gas inlet 42 of the wafer cassette 4, and the non-process gas in the wafer cassette 4 is discharged through the gas outlet 43.
The bottom of the wafer cassette 4 is provided with a plurality of positioning grooves 41, and the positioning grooves 41 are matched with wafer cassette positioning pieces 211 on the wafer cassette carrier 21 so as to limit the wafer cassette on the corresponding wafer cassette carrier 21. The positioning groove 41 is formed on the top of a protrusion, as shown in fig. 8. As shown in fig. 3, 3 positioning grooves 41 are provided in each of the 4-aliquotted mounting regions. As shown in fig. 5, the wafer cassette carrier 21 is provided with a plurality of sets of wafer cassette locators 211, illustrated as 4 sets of wafer cassette locators 211 equally divided in circumference, each set of wafer cassette locators 211 being provided with a plurality of locators, illustrated as 3 wafer cassette locators. Specifically, the wafer box positioning piece is a cylinder, and the positioning of the wafer box 4 is completed after the wafer box positioning piece is embedded into the positioning groove.
Fig. 9 shows an electric control device including a casing 93, an HMI operation panel 91, operation buttons 92, and internal electric components (not shown) and the like, which controls the operation of the process equipment. Whether in manual mode or automatic mode, the HMI operation screen 91 displays the status of the wafer cassette cache apparatus, for example: whether the wafer box is arranged on the wafer box carrying platform or not, and which station is in a picking and placing state. In the automatic mode, the operation buttons 92 include 4 buttons for switching between automatic and manual, manual clockwise rotation, manual counterclockwise rotation, and scram, respectively.
The control mode of the electric control device is divided into an automatic mode and a debugging mode, and the control principle is as follows:
Automatic mode, as shown in fig. 11:
and step 1, the upper computer transmits a target position for placing the wafer to the PLC.
Step 2, the PLC receives the instruction, acts according to the set position, and transmits the instruction to the rotary driving assembly 10.
The specific steps (manual mode, as shown in fig. 12) of the PLC setting position include:
Step 2A, manually rotating the rotation driving assembly 10, wherein the rotation driving assembly 10 drives the wafer cassette carrier 21 of the rotary wafer cassette rack device 2 to rotate to a first station on the bottom plate 1, and the sensing piece 7 triggers the rotation in-place detection sensor L1 and presets an origin through a PLC.
And 2B, continuing to manually rotate the rotary driving assembly 10, rotating the rotary wafer cassette rack device 2 to a second station on the bottom plate 1, triggering the rotation in-place detection sensor L2 by the sensing piece 7, and acquiring the number of turns rotated by the rotary driving assembly 10 and calculating the rotation angle beta 1 by the PLC.
And 2C, continuing to manually rotate the rotary driving assembly 10, rotating the rotary wafer cassette rack device 2 to a third station on the bottom plate 1, triggering the rotation in-place detection sensor L3 by the sensing piece 7, and acquiring the number of turns rotated by the rotary driving assembly 10 and calculating the rotation angle beta 2 by the PLC.
Step 2D, continuing to manually rotate the rotation driving assembly 10, rotating the rotary wafer cassette rack device 2 to the fourth station on the bottom plate 1, triggering the rotation in-place detection sensor L4 by the sensing piece 7, and obtaining the number of turns rotated by the rotation driving assembly 10 and calculating the rotation angle β3 by the PLC.
Step 2E, inputting the rotation angle beta 1, the rotation angle beta 2 and the rotation angle beta 3 into the upper computer to be used as the target position of the action.
And 3, the rotary driving assembly 10 drives the rotary wafer box frame device 2, and after the wafer box carrier 21 reaches the position, the sensing piece 7 triggers one of the rotary in-place detection sensors 6.
And 4, after receiving the instruction of the rotation in-place detection sensor 6, the PLC places the wafer box 4, and the wafer box 4 triggers the placement in-place detection sensor 5.
And step 5, after receiving the instruction of the in-place detection sensor 5, the PLC starts the gas replacement device 3.
The foregoing is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Any person skilled in the art will make any equivalent substitution or modification to the technical solution and technical content disclosed in the invention without departing from the scope of the technical solution of the invention, and the technical solution of the invention is not departing from the scope of the invention.
Claims (7)
1. A semiconductor automation device, comprising:
A bottom plate;
the rotary wafer box frame device is used for bearing and rotating the wafer box and comprises a plurality of layers of wafer box carrying platforms, and all the wafer box carrying platforms are axially distributed and are all rotationally arranged on a hollow rotating shaft; the rotating shaft is rotatably arranged on the bottom plate; a space for installing a rotary driving assembly and a plurality of rotary in-place detection sensors is formed between the last layer of wafer carrier and the bottom plate;
the rotary driving assembly is used for driving the rotating shaft to rotate and is arranged on the bottom plate, and the output end of the rotary driving assembly is connected with the rotating shaft through a transmission piece;
the sensing piece and the rotating in-place detection sensor form a matching state to detect whether the wafer box carrying platform rotates in place or not, and the rotating in-place detection sensor is arranged on one side surface of the bottom plate facing the wafer box carrying platform and is correspondingly arranged with a station on the bottom plate; the sensing piece is fixed on the last layer of wafer carrier and is arranged towards the direction of the rotating in-place detection sensor; an induction groove is formed in the rotation in-place detection sensor; when the induction groove on one station is embedded on the induction sheet, the induction sheet triggers the rotation in-place detection sensor to form the matching state;
Each layer of wafer box carrying platform comprises a 4-equal-division mounting area;
The wafer box carrier comprises a plurality of in-place detection sensors which are respectively used for detecting whether a wafer box contacted with the wafer box is in place or not, and each layer of wafer box carrier is provided with the in-place detection sensors;
After triggering the wafer box and placing the wafer box in-place detection sensor, starting a gas replacement device to replace gas;
the gas replacement devices are correspondingly arranged on the wafer box carrier and fixed on the corresponding wafer box carrier, the gas inlet pipeline penetrates through the gas path line passing hole on the rotating shaft and is connected with the gas inlet end of the gas replacement device, the gas outlet end of the gas replacement device is communicated with the corresponding wafer box, and purge gas enters the wafer box from the bottom of the wafer box.
2. The semiconductor automation device of claim 1, wherein the rotary drive assembly is a motor, the motor being secured to the base plate with its output shaft extending to a lower section of the base plate.
3. The semiconductor automation device of claim 1, wherein the bottom of the pod is provided with a plurality of positioning slots that cooperate with pod positioning members on the pod carrier to position the pod on the respective pod carrier.
4. The semiconductor automation device of claim 3, wherein the detent is open at the top of a protrusion.
5. The semiconductor automation device of claim 1, the transmission member is a timing belt.
6. A semiconductor automation control method based on the semiconductor automation device according to any one of claims 1 to 5, characterized by comprising the steps of:
Step1, an upper computer transmits a target position for placing a wafer box to a PLC;
Step 2, the PLC receives the instruction, acts according to the set position and transmits the instruction to the rotary driving assembly;
step 3, the rotary driving assembly drives the rotary wafer box frame device, and after the wafer box carrier reaches the position, the sensing piece triggers one of the rotary in-place detection sensors;
step 4, after receiving the instruction of the rotation in-place detection sensor, the PLC places a wafer box, and the wafer box triggers the in-place detection sensor;
And 5, after receiving the instruction of the in-place detection sensor, the PLC starts the gas replacement device.
7. The method according to claim 6, wherein the specific step of setting the position by the PLC in step 2 includes:
step 2A, manually rotating the rotary driving assembly, wherein the rotary driving assembly drives a wafer box carrying platform of the rotary wafer box frame device to rotate to a first station on a bottom plate, and the sensing piece triggers the rotary in-place detection sensor L1 and presets an origin through a PLC;
Step 2B, continuing to manually rotate the rotary driving assembly, rotating the rotary wafer box frame device to a second station on the bottom plate, triggering the rotary in-place detection sensor L2 by the sensing piece, and acquiring the number of turns rotated by the rotary driving assembly and calculating a rotation angle beta 1 by the PLC;
step 2C, continuing to manually rotate the rotary driving assembly, rotating the rotary wafer box frame device to a third station on the bottom plate, triggering the rotary in-place detection sensor L3 by the sensing piece, and acquiring the number of turns rotated by the rotary driving assembly and calculating a rotation angle beta 2 by the PLC;
step 2D, continuing to manually rotate the rotary driving assembly, rotating the rotary wafer box frame device to a fourth station on the bottom plate, triggering the rotary in-place detection sensor L4 by the sensing piece, and acquiring the number of turns rotated by the rotary driving assembly and calculating a rotation angle beta 3 by the PLC;
step 2E, inputting the rotation angle beta 1, the rotation angle beta 2 and the rotation angle beta 3 into the upper computer to be used as the target position of the action.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310844873.XA CN117049179B (en) | 2023-07-11 | 2023-07-11 | Semiconductor automation device and automation control method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310844873.XA CN117049179B (en) | 2023-07-11 | 2023-07-11 | Semiconductor automation device and automation control method |
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| Publication Number | Publication Date |
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| CN117049179A CN117049179A (en) | 2023-11-14 |
| CN117049179B true CN117049179B (en) | 2024-08-09 |
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| CN202310844873.XA Active CN117049179B (en) | 2023-07-11 | 2023-07-11 | Semiconductor automation device and automation control method |
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| CN110517980A (en) * | 2019-09-25 | 2019-11-29 | 沈阳芯达半导体设备有限公司 | A kind of semicon industry wafer automatic transmission mechanism |
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| JP7018370B2 (en) * | 2017-09-26 | 2022-02-10 | 株式会社Kokusai Electric | Manufacturing methods and programs for substrate processing equipment and semiconductor equipment |
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