CN117012737A - Remote phase change heat exchange device for high-power chip - Google Patents
Remote phase change heat exchange device for high-power chip Download PDFInfo
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- CN117012737A CN117012737A CN202310846148.6A CN202310846148A CN117012737A CN 117012737 A CN117012737 A CN 117012737A CN 202310846148 A CN202310846148 A CN 202310846148A CN 117012737 A CN117012737 A CN 117012737A
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- 230000008859 change Effects 0.000 title claims abstract description 23
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
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- MSSNHSVIGIHOJA-UHFFFAOYSA-N pentafluoropropane Chemical compound FC(F)CC(F)(F)F MSSNHSVIGIHOJA-UHFFFAOYSA-N 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 19
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a remote phase change heat exchange device of a high-power chip, relates to the technical field of environmental protection, and mainly aims to solve the problems of insufficient air cooling heat dissipation space and liquid cooling heat dissipation redundancy design in equipment. The technical scheme mainly adopted is that the evaporator comprises a substrate, a cover plate welded with the substrate to form a closed cavity, a module fixing hole site arranged on the substrate and positioned in the closed cavity and used for being attached and fixed with the high-power chip, and micro-teeth arranged in the evaporator on the inner wall of the cover plate, wherein the closed cavity is filled with a phase change working medium; the condenser comprises a condenser upper end socket, a plurality of heat dissipation flat pipes which are communicated with the condenser upper end socket and are arranged in parallel, a condenser lower end socket which is communicated with the plurality of heat dissipation flat pipes, and fins which are arranged between two adjacent heat dissipation flat pipes, wherein the condenser upper end socket is connected with the cover plate through an air pipe, and the condenser lower end socket is connected with the cover plate through a liquid return pipe.
Description
Technical Field
The invention relates to the technical field of environmental protection, in particular to a remote phase change heat exchange device of a high-power chip.
Background
At present, the requirements of people on real-time and synchronization of information are higher and higher, and the computing capacity of corresponding chips is improved, so that the problem of heat dissipation of high-power devices is also a problem to be solved. In order to reduce the running cost, outdoor high altitude application generally adopts natural convection heat dissipation, but natural convection fins have low efficiency and poor heat dissipation performance, and the performance after improvement by increasing the size is not proportional to the product size although the product size is larger.
With the large-scale development and expansion of the industrialization of society, the equipment integration level of each industry is larger and larger, the functions are more and more, the application of power devices is exponentially increased like the spring bamboo shoots after rain, the heat loss is accompanied by energy consumption, if a reasonable and effective method cannot be found to process part of heat, the service life of electric elements is greatly reduced, even the electric elements cannot work normally, the operation of the whole equipment is affected, the current information technology progress of big data, cloud computing, the Internet of things, AI and the like and the information society are rapidly developed, and the network data traffic is also rapidly increased. As data grows in geometric magnification, data centers as carriers will develop more dramatically. The traditional heat dissipation scheme is characterized in that natural convection and forced air cooling can not meet the requirements of high-power consumption devices, and for high-power density application occasions such as lasers, servers, photovoltaic energy sources, medical equipment and military equipment, due to the severe requirements on temperature, many chip areas are free of heat dissipation areas, even if the heat dissipation areas exist, the heat dissipation problems are not enough to be solved, so that the water cooling scheme is rapidly raised, but the water cooling scheme can involve the existence of cooling working media in system equipment, and the problems of later leakage, maintenance, safety and the like are worth considering.
The existing heat dissipation technology is very rapid in development, liquid cooling efficiency is higher than that of air cooling, but if a liquid cooling technology is adopted to cool a chip, a whole set of liquid cooling system is required to be designed to be matched with the liquid cooling technology, system noise is increased by a moving part pump and the like, and additional maintenance and overhaul are required, so that the whole equipment structure becomes more complex due to the common heat dissipation problem, and the cost is higher.
The air cooling scheme does not need liquid, so the air cooling scheme is the safest and reliable heat dissipation scheme, the mode for solving the problem of heat diffusion in the current market is more, the heat pipe is buried in a case (radiator), and the heat pipe or the temperature equalizing plate is buried in the case (radiator), but because the heat pipe and the temperature equalizing plate have the following defects, the air cooling scheme still has a plurality of limitations for practical application: (1) The heat conduction efficiency of the heat pipe or the temperature equalizing plate is relatively high, and the heat conduction efficiency is limited by the heat conduction limit, so that a plurality of heat pipes are required to be arranged for heat conduction of the high-power chip; however, due to the limitation of the size and the shape, the design is inflexible, and the long-distance transmission of high heat cannot be completed; (2) The heat pipe or the temperature equalizing plate is embedded into the die casting and needs to be grooved, and the poor groove type matching leads to air heat resistance inside, so that the heat conducting performance is reduced; (3) The combination of the heat pipe or the temperature equalizing plate and the air-cooled radiator is limited by the processing technology, the welding strength of the epoxy resin is insufficient, the heat pipe can be burnt due to the excessively high brazing temperature, and meanwhile, the nickel plating is needed to be carried out on the welding part to meet the soldering requirements of strength and temperature, so that the cost is increased; (4) The heat pipe or the temperature equalizing plate is made of copper, and is different from the aluminum base plate and other materials, and the combination of dissimilar metals is easy to generate interface stripping and deformation under the working condition of cold and hot impact due to different thermal expansion coefficients of the metals.
Disclosure of Invention
In view of this, the present invention provides a remote phase-change heat device for a high-power chip, which is mainly aimed at solving the problems of insufficient air-cooling heat dissipation space and redundant design of liquid-cooling heat dissipation in the device and the problem that a heat pipe or other uniform-temperature products cannot flexibly and remotely transmit high-power heat.
In order to achieve the above purpose, the present invention mainly provides the following technical solutions:
the embodiment of the invention provides a remote phase change heat exchange device of a high-power chip. It comprises the following steps:
the evaporator comprises a substrate, a cover plate welded with the substrate to form a closed cavity, a module fixing hole site arranged on the substrate and positioned in the closed cavity and used for being attached and fixed with the high-power chip, and micro-teeth arranged in the evaporator on the inner wall of the cover plate, wherein the closed cavity is filled with a phase change working medium;
the condenser comprises a condenser upper end socket, a plurality of heat dissipation flat pipes which are communicated with the condenser upper end socket and are arranged in parallel, a condenser lower end socket which is communicated with the plurality of heat dissipation flat pipes, and fins which are arranged between two adjacent heat dissipation flat pipes, wherein the condenser upper end socket is connected with the cover plate through an air pipe, and the condenser lower end socket is connected with the cover plate through a liquid return pipe.
As mentioned above, the cover plate is provided with an air pipe fixing port, one end of the air pipe is connected with the air pipe fixing port, and the other end of the air pipe is connected with the upper end socket of the condenser;
the cover plate is provided with a liquid return pipe fixing port, one end of the liquid return pipe is connected with the liquid return pipe fixing port, and the other end of the liquid return pipe is connected with the lower end socket of the condenser.
As mentioned above, the diameter of the liquid return pipe is smaller than that of the air pipe.
As mentioned above, the micro teeth in the evaporator adopt a relieved tooth process.
As mentioned above, the evaporator, the condenser, the air pipe and the liquid return pipe are all made of aluminum or copper materials.
As described above, R134a, R1233zd or R245fa can be used as the phase change working medium.
As described above, the heat dissipation flat tube adopts an inner rib tooth heat dissipation flat tube or a reinforced heat exchange flat tube.
As previously mentioned, the fins may be windowed fins or folded fins or stamped fins or corrugated fins.
As previously mentioned, the fin surfaces are coated with a corrosion-resistant coating or with a hydrophilic coating or with a hydrophobic coating.
As mentioned before, a gap of 1.5mm-2mm is reserved between the micro-teeth in the evaporator and the cover plate.
By means of the technical scheme, the remote phase change heat exchange device of the high-power chip has at least the following advantages:
according to the high-power chip remote phase change heat exchange device, the evaporator and the condenser are arranged, the phase change working medium is filled in the evaporator, the phase change technology is adopted to transfer heat out, the condenser is used for being similar to a communication pipeline design of an air conditioner, and the heat is remotely transferred into an available space outside the device, so that the problems of heat dissipation and heat performance of the chip are solved, and the original system structure is not required to be changed greatly.
The foregoing description is only an overview of the present invention, and is intended to provide a better understanding of the present invention, as it is embodied in the following description, with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
FIG. 1 is a general assembly diagram of a remote phase change thermal device for a high power chip according to the present invention;
FIG. 2 is an exploded view of a remote phase change thermal device for a high power chip according to the present invention;
FIG. 3 is a cut-away view of an evaporator in a high power chip remote phase change thermal device according to the present invention;
FIG. 4 is a schematic view of a section of an evaporator in a remote phase-change thermal device for a high-power chip according to the invention
FIG. 5 is a schematic view of a substrate structure in a remote phase change thermal device for a high power chip according to the present invention;
fig. 6 is a schematic diagram of a cover plate structure in a remote phase-change thermal device of a high-power chip according to the present invention.
Detailed Description
In order to further describe the technical means and effects adopted for achieving the preset aim of the invention, the following detailed description refers to the specific implementation, structure, characteristics and effects according to the application of the invention with reference to the accompanying drawings and preferred embodiments.
As shown in fig. 1, one embodiment of the present invention provides a high-power chip remote phase change heat exchanger, which includes: an evaporator 1, a condenser 2, an air pipe 3 and a liquid return pipe 4.
The evaporator 1 as shown in fig. 1 to 6 comprises a base plate 11, a cover plate 12 welded with the base plate 11 to form a closed cavity, a module fixing hole site 13 arranged on the base plate 11 and positioned in the closed cavity and used for being attached and fixed with the high-power chip, and micro-teeth 14 arranged on the inner wall of the cover plate 12, wherein the closed cavity is filled with a phase change working medium. Specifically, the internal micro-teeth 14 of the evaporator adopt a relieved tooth process, and the process can select laser or chemical etching or internal welding of independent fins to construct an internal evaporation micro-surface; the thickness of the micro-teeth in the evaporator can be 0.1-0.3 mm, the distance is 0.3-0.8 mm, the boiling heat exchange area is increased, the gasification core is reduced, the micro-tooth surface in the evaporator is conducive to forming small bubbles instead of large bubbles, the bubbles rise along the micro-teeth in the evaporator, the micro-teeth in the evaporator are broken in the distance, the superheat degree is reduced, and then the chip temperature is reduced. The broken bubbles enter the evaporator closed cavity, enter a pipeline to participate in evaporation and condensation circulation after being separated in the closed cavity, and a gap of 1.5-2 mm is reserved between the micro-teeth and the cover plate in the evaporator, so that a gas-liquid mixture after the working medium is heated and boiled is prevented from directly flowing upwards into a gas pipe and a liquid return pipe. The micro-tooth structure in the evaporator reduces the evaporation and gasification core, is favorable for the formation and falling of boiling bubbles, increases the heat exchange area of a boiling region, reduces the superheat degree of the chip and the evaporation working medium, and prevents the chip from overtemperature. Furthermore, the phase-change working medium can perform phase-change heat transfer, and suitable phase-change working medium such as R134a, R1233zd, R245fa and the like can be selected according to the practical environment temperature and pressure-bearing capacity during specific application.
As shown in fig. 1 and 2, the condenser 2 includes a condenser upper end enclosure 21, a plurality of heat dissipation flat tubes 22 arranged in parallel and communicated with the condenser upper end enclosure 21, a condenser lower end enclosure 23 communicated with the plurality of heat dissipation flat tubes 22, and fins 24 arranged between two adjacent heat dissipation flat tubes 22, wherein the condenser upper end enclosure 21 is connected with the cover plate 12 through an air pipe 3, and the condenser lower end enclosure 23 is connected with the cover plate 12 through a liquid return pipe 4. Specifically, the steam formed by the evaporator enters the condenser 2 at the upper end enclosure 21 of the condenser to exchange heat; the heat dissipation flat tube 22 is used for connecting the upper end socket 21 of the condenser and the lower end socket of the condenser to form a working medium communication cavity, gas flows in the working medium communication cavity, heat is transferred to the fins 24 and is finally taken away by external cold air, and the cooling is further carried out by the cold air; the working medium is condensed into liquid and then concentrated in the lower end enclosure 23 of the condenser, and the liquid flows back to the evaporator through the liquid return pipe, so that the evaporator is ensured to have enough liquid phase working medium for evaporation.
An air pipe fixing opening 121 is formed in the cover plate 12, one end of the air pipe 3 is connected with the air pipe fixing opening 121, and the other end of the air pipe is connected with the upper end socket 21 of the condenser; the cover plate 12 is provided with a liquid return pipe fixing port 122, one end of the liquid return pipe 4 is connected with the liquid return pipe fixing port 122, and the other end is connected with the condenser lower seal head 23. The evaporator 1, the condenser 2, the air pipe 3 and the liquid return pipe 4 are all made of copper or aluminum materials, and the whole pipeline and the general assembly planning are flexible.
The heat dissipation flat tube 22 may take many forms, may take an inner rib tooth heat dissipation flat tube or take a reinforced heat exchange flat tube, which is not limited in the specific embodiment of the present invention, and may be set according to actual needs. The fins 24 may take various forms, for example, windowed fins, folded fins, stamped fins, or corrugated fins, and may be specifically configured for comprehensive evaluation according to heat dissipation composition and fan performance. Further, the fin with the surface coated with the anti-corrosion coating can be customized according to the requirements of customers, and the fin with the surface coated with the hydrophilic coating or the hydrophobic coating can be customized according to the requirements of customers.
According to the design of the condenser, hot steam enters from the upper part, the steam flows downwards under the pushing of pressure and is condensed into liquid by external air, the liquid is converged to the lower end socket of the condenser below under the action of gravity and flows back to the evaporator through the communicated liquid return pipe, the circulation is sequentially and reciprocally carried out, the circulating power is sufficient, and otherwise, the working conditions of unsmooth liquid backflow and liquid drying in an evaporation area can be generated.
Further, the pipe diameter of the liquid return pipe 4 is smaller than the pipe diameter of the air pipe 3, the pipe diameters of the air pipe 3 and the liquid return pipe 4 are different, so that the air pressure is instantaneously increased after the phase-change working medium is gasified, the density is reduced, the flow speed is increased, the boiled steam automatically flows to a large pipe diameter pipeline (namely the air pipe) with smaller resistance, and the condensed liquid flows back to the evaporator end again in a small pipe diameter pipeline (namely the liquid return pipe) under the action of gravity.
Furthermore, the high-power chip remote phase change heat exchange device can arrange the positions of the evaporator and the condenser according to the placement position of an actual heat source of a client and the available effective space, the size of the condenser can be freely adjusted, the flexibility is high, and the circulation pipeline can be bent at will to transfer heat through the phase change of the gas phase and the liquid phase.
When the chip is in operation, heat is generated and absorbed by the evaporator 1, the heat is transferred to the micro teeth 14 in the evaporator through the evaporator substrate 11, working medium in the evaporator is heated to form bubbles on the micro teeth wall and falls off, namely, in a boiling state, after gas-liquid separation is carried out in a closed cavity of the evaporator, liquid drops fall back into an evaporation tank, gas enters a gas pipe 3 connected with the gas drops and is converged into the upper end enclosure 21 of the condenser, the working medium is continuously evaporated, the evaporation pressure pushes the gas to further transfer the heat into the outer fins 24 through the heat dissipation flat pipe 22, the vapor working medium is cooled into liquid by cold air in the descending process, the liquid flows back to the evaporator through the liquid return pipe 4, the liquid phase working medium is ensured not to burn dry, the design is flexible, the bending path of the pipeline can be rearranged according to the actual heat source position and the condenser position, and the maximum cooling can be realized when no effective space is utilized in the heat source region.
Further, the application of the conventional remote radiator is basically realized by using a heat pipe, but the heat pipe is influenced by the limit of the heat pipe, the heat transfer cannot be too large, the distance cannot be too far, the bending cannot be too sharp, the heat pipe is influenced by the processing technology of the heat pipe, and the temperature equalizing capability is greatly reduced after long-distance transmission. The design can flexibly transfer heat into the available space, and the maximum temperature equalization can be achieved only by reasonably paving the flow pipeline, so that the design is not limited by various limits.
The invention has the technical key points that the evaporation end of the internally filled working medium can be attached to the heating chip, after the chip works, the working medium absorbs heat and evaporates, gas-liquid two phases fully flow, heat can be transferred into the far-end heat exchanger, and gaseous steam is condensed and flows back to the evaporator through cooling the heat exchanger.
The above description is only of the preferred embodiments of the present invention, and is not intended to limit the present invention in any way, but any simple modification, equivalent variation and modification made to the above embodiments according to the technical substance of the present invention still fall within the scope of the technical solution of the present invention.
Claims (10)
1. The utility model provides a high power chip remote phase change heat transfer device which characterized in that: it comprises the following steps:
the evaporator comprises a substrate, a cover plate welded with the substrate to form a closed cavity, a module fixing hole site arranged on the substrate and positioned in the closed cavity and used for being attached and fixed with the high-power chip, and micro-teeth arranged in the evaporator on the inner wall of the cover plate, wherein the closed cavity is filled with a phase change working medium;
the condenser comprises a condenser upper end socket, a plurality of heat dissipation flat pipes which are communicated with the condenser upper end socket and are arranged in parallel, a condenser lower end socket which is communicated with the plurality of heat dissipation flat pipes, and fins which are arranged between two adjacent heat dissipation flat pipes, wherein the condenser upper end socket is connected with the cover plate through an air pipe, and the condenser lower end socket is connected with the cover plate through a liquid return pipe.
2. The remote phase-change thermal device for high-power chips as defined in claim 1, wherein,
the cover plate is provided with an air pipe fixing port, one end of the air pipe is connected with the air pipe fixing port, and the other end of the air pipe is connected with the upper end socket of the condenser;
the cover plate is provided with a liquid return pipe fixing port, one end of the liquid return pipe is connected with the liquid return pipe fixing port, and the other end of the liquid return pipe is connected with the lower end socket of the condenser.
3. The remote phase-change thermal device for high-power chips as defined in claim 1, wherein,
the pipe diameter of the liquid return pipe is smaller than that of the air pipe.
4. The remote phase-change thermal device for high-power chips as defined in claim 1, wherein,
and the internal micro teeth of the evaporator adopt a relieved tooth process.
5. The remote phase-change thermal device for high-power chips as defined in claim 1, wherein,
the evaporator, the condenser, the air pipe and the liquid return pipe are all made of aluminum or copper materials.
6. The remote phase-change thermal device for high-power chips as defined in claim 1, wherein,
the phase change working medium can adopt R134a, R1233zd or R245fa.
7. The remote phase-change thermal device for high-power chips as defined in claim 1, wherein,
the heat dissipation flat tube adopts an inner rib tooth heat dissipation flat tube or adopts an enhanced heat exchange flat tube.
8. The remote phase-change thermal device for high-power chips as defined in claim 1, wherein,
the fins are windowed fins, folded fins, stamped fins or corrugated fins.
9. The remote phase-change thermal device for high-power chips as defined in claim 1, wherein,
the surface of the fin is coated with an anti-corrosion coating, a hydrophilic coating or a hydrophobic coating.
10. The remote phase-change thermal device for high-power chips as defined in claim 1, wherein,
gaps of 1.5mm-2mm are reserved between the micro-teeth in the evaporator and the cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310846148.6A CN117012737A (en) | 2023-07-11 | 2023-07-11 | Remote phase change heat exchange device for high-power chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310846148.6A CN117012737A (en) | 2023-07-11 | 2023-07-11 | Remote phase change heat exchange device for high-power chip |
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| Publication Number | Publication Date |
|---|---|
| CN117012737A true CN117012737A (en) | 2023-11-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310846148.6A Pending CN117012737A (en) | 2023-07-11 | 2023-07-11 | Remote phase change heat exchange device for high-power chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118776372A (en) * | 2024-08-13 | 2024-10-15 | 浙江台信应用科技有限公司 | Application of Nano-superconducting Alloy Mesh in One-way Circulation Refrigerant Two-phase Change Siphon Radiator |
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2023
- 2023-07-11 CN CN202310846148.6A patent/CN117012737A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118776372A (en) * | 2024-08-13 | 2024-10-15 | 浙江台信应用科技有限公司 | Application of Nano-superconducting Alloy Mesh in One-way Circulation Refrigerant Two-phase Change Siphon Radiator |
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