CN117004262A - Method for manufacturing anti-stick substrate and method for manufacturing anti-stick touch electronic device - Google Patents

Abstract

The invention provides a method for manufacturing an anti-stick substrate and a method for manufacturing an anti-stick touch electronic device. The manufacturing method of the anti-stick substrate includes the following steps: providing an anti-stick composition, which is mainly composed of a molar ratio of 4:1 to 5:1 of [3‑(methacrylamido)propyl]dimethyl(3‑thiopropyl)ammonium hydroxide inner salt and 2‑(3,4‑dihydroxyphenyl) composed of ethylamine; and contacting the anti-adhesion composition with the substrate to form an anti-adhesion substrate.

Description

Method for manufacturing anti-stick substrate and method for manufacturing anti-stick touch electronic device

Technical field

The present invention relates to a manufacturing method of a substrate and a manufacturing method of an electronic device, and in particular to a manufacturing method of an anti-stick substrate and a manufacturing method of an anti-stick touch electronic device.

Background technique

In recent years, due to the impact of disease epidemics, people have realized the importance of how to reduce the attachment and/or growth of pathogens (such as mold, fungi or viruses) conveniently, quickly and effectively.

Contents of the invention

The invention is directed to a manufacturing method of an anti-stick substrate and a manufacturing method of an anti-stick touch electronic device.

According to an embodiment of the present invention, a method for manufacturing an anti-adhesive substrate includes the following steps: providing an anti-adhesive composition, which mainly consists of [3-(methacrylamido)propane in a molar ratio of 4:1 to 5:1. base] dimethyl (3-thiopropyl) ammonium hydroxide inner salt and 2-(3,4-dihydroxyphenyl) ethylamine; and the anti-adhesive composition is contacted with the substrate to form an anti-adhesion composition Glue the substrate.

According to an embodiment of the present invention, the step of contacting the anti-adhesive composition to the substrate includes: immersing the substrate into an aqueous solution containing the anti-adhesive composition.

According to an embodiment of the present invention, the step of contacting the anti-adhesive composition with the substrate includes: immersing the substrate in an aqueous solution containing the anti-adhesive composition for 8-12 hours.

According to an embodiment of the present invention, the step of contacting the anti-adhesion composition with the substrate includes: immersing the substrate into an aqueous solution containing the anti-adhesion composition with a temperature of 60°C to 100°C.

According to an embodiment of the present invention, the step of contacting the anti-adhesive composition with the substrate includes: immersing the substrate in an aqueous solution containing the anti-adhesive composition at a temperature of 60° C. to 100° C. for 8 hours to 12 hours.

According to an embodiment of the present invention, the concentration of the anti-adhesive composition in the aqueous solution is 5 mg/mL to 10 mg/mL.

According to an embodiment of the invention, the substrate includes glass.

According to an embodiment of the present invention, a method for manufacturing an anti-stick touch electronic device includes the following steps: providing a substrate having a component surface and a touch surface relative to the component surface; forming an electronic component on the component surface of the substrate; and making the anti-adhesion composition contact the touch surface of the substrate. The anti-adhesion composition mainly consists of [3-(methacrylamido)propyl]dimethyl ( It is composed of 3-thiopropyl) ammonium hydroxide inner salt and 2-(3,4-dihydroxyphenyl)ethylamine.

According to an embodiment of the present invention, the manufacturing method of an anti-stick touch electronic device further includes the following steps: after forming electronic components on the component surface of the base material, forming a protective film covering the electronic components on the component surface of the base material; The substrate with the protective film on it is immersed in an aqueous solution containing the anti-adhesive composition, so that the anti-adhesive composition contacts the contact surface of the substrate.

According to an embodiment of the present invention, the method for manufacturing an anti-stick touch electronic device further includes the following steps: removing the protective film after the anti-stick composition contacts the touch surface of the substrate.

Description of the drawings

1 to 5 are schematic diagrams of a partial manufacturing method of an anti-stick substrate or an anti-stick touch electronic device according to an embodiment of the present invention;

Figure 6A is a fluorescence photo of an example of the present invention;

Figure 6B is a fluorescence photograph of a comparative example of the present invention.

Explanation of reference signs

101: Anti-stick substrate;

102: Anti-stick touch electronic devices;

110: Base material;

111: First surface;

112: Second surface;

120: Electronic component layer;

130: protective layer;

149: Aqueous solution containing anti-adhesive composition;

140: Anti-adhesion layer;

150: Finger.

Detailed ways

Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same component numbers are used in the drawings and descriptions to refer to the same or similar parts.

Referring to Figure 1, a substrate 110 is provided. The base material 110 has a first surface 111 and a second surface 112 opposite to the first surface 111 .

The material of the substrate 110 may include glass, quartz, organic polymer or other suitable materials. Preferably, the base material 110 is made of inorganic material. Taking a display device as an example (such as a display screen, a touch screen or a touch display screen), the base material 110 can be made of a transparent or light-transmitting material.

Referring to FIG. 2 , a suitable process can be performed on a surface of the substrate 110 . For example, an electronic component manufacturing process (such as plating, photolithography or etching, but not limited to) can be performed on the second surface 112 of the substrate 110 (the bottom in the drawings) to form corresponding electronic components. Component layer 120. That is to say, the electronic component layer 120 may be a single film layer or a stack of multiple film layers (such as an insulating layer, a conductive layer or a semiconductor layer). The aforementioned electronic components may include, but are not limited to, active components (such as transistors), passive components (such as capacitors, inductors or resistors) or corresponding wires.

In one embodiment, the surface with the electronic component layer 120 located thereon (eg, the second surface 112 ) may be referred to as a component surface, but the present invention is not limited thereto.

Referring to FIG. 3 , if appropriate processes have been performed on a surface of the substrate 110 , a corresponding protective layer 130 can be formed on the aforementioned surface. In subsequent processes, the protective layer 130 can be used to protect components formed on the aforementioned surface. For example, the protective layer 130 may be used to protect the electronic component layer 120 formed on the second surface 112 .

In one embodiment, the protective layer 130 may include a release film, but the invention is not limited thereto.

Referring to FIG. 4 , the substrate 110 is immersed in an aqueous solution 149 containing an anti-adhesive composition. The anti-adhesion composition in the aqueous solution 149 containing the anti-adhesion composition mainly consists of [3-(methacrylamido)propyl]dimethyl (molar ratio) of 4:1 to 5:1. 3-Thiopropyl)ammonium hydroxide inner salt ([2-(methacryloyloxy)ethyl]dimethyl-(3-sulfopropyl)ammonium hydroxide; CAS: 3637-26-1) and 2-(3,4-dihydroxybenzene It is composed of 2-(3,4-dihydroxyphenyl)ethylamine; CAS code: 56-61-6; can be called: dopamine. 3-(methacrylamido)propyl]dimethyl(3-thiopropyl)ammonium hydroxide inner salt can make the formed material (such as a polymer or corresponding film or layer) anti-adhesive nature. 2-(3,4-dihydroxyphenyl)ethylamine can make the formed substance (such as a polymer or a corresponding film or layer) easily adhere to a surface of the substrate 110 .

In one embodiment, the anti-adhesive composition consists of [3-(methacrylamido)propyl]dimethyl(3-thiopropyl)ammonium hydroxide in a molar ratio of 4:1 to 5:1 It is composed of inner salt and 2-(3,4-dihydroxyphenyl)ethylamine.

Under appropriate conditions (such as: appropriate concentration, reaction time and/or reaction temperature; may be as described in subsequent examples), an appropriate proportion of [3-(methacrylamino)propyl]dimethyl(3 -Thiopropyl) ammonium hydroxide internal salt and 2-(3,4-dihydroxyphenyl)ethylamine can form corresponding anti-stick polymers.

In one embodiment, the substrate 110 can be immersed in an aqueous solution 149 with a temperature of 60° C. to 100° C. and containing an anti-adhesive composition.

In one embodiment, the substrate 110 can be immersed in the aqueous solution 149 containing the anti-adhesive composition for 8 to 12 hours. If the time is too short (for example: less than 8 hours), the reaction may not be good.

In one embodiment, the substrate 110 may be immersed in an aqueous solution 149 with a temperature of 60° C. to 100° C. and containing an anti-adhesive composition for 8 hours to 12 hours.

In one embodiment, in the aqueous solution 149 containing the anti-adhesion composition, the concentration of the anti-adhesion composition is 5 mg/mL (mg/ml) to 10 mg/mL. In this way, within the aforementioned concentration range, it is ensured that the polymer can adhere to the substrate 110 . If the concentration of the anti-adhesive composition is too low (e.g., less than 5 mg/mL), the reaction may not be good, and the formed film may have low anti-adhesive quality. If the concentration of the anti-adhesive composition is too high (for example, greater than 10 mg/mL), the film layer formed may be too thick, which is not good for use (for example, the touch quality will be reduced instead).

Please refer to Figure 5, in which [3-(methacrylamido)propyl]dimethyl(3-thiopropyl)ammonium hydroxide inner salt and 2-(3,4-dihydroxyphenyl) After the anti-adhesion composition polymer formed of ethylamine is attached to the substrate 110, the substrate 110 with the aforementioned anti-adhesion composition polymer attached thereto can be taken out of the aqueous solution. And, process it appropriately. For example, the second surface 112 attached to the substrate 110 can be removed by grinding, scraping or other suitable methods (such as indirectly removing the corresponding polymer attached thereto by removing the protective layer 130 ). The anti-adhesion composition polymer on the upper side (lower side in the drawing) and/or on the sidewalls (left side and/or right side in the drawing) of the substrate 110 is removed. That is to say, at least the anti-adhesive composition polymer located on the first surface 111 of the substrate 110 (the upper part in the drawing) can be retained, and the anti-adhesive layer 140 can be formed accordingly.

Referring to FIG. 5 , the side of the substrate 110 with the anti-adhesion layer 140 may be suitable for touching. For example, the finger 150 may be adapted to touch (substantially, indirectly touch via the anti-adhesion layer 140 ) the first surface 111 of the substrate 110 .

Please refer to at least FIG. 1 , FIG. 4 and FIG. 5 . Through the above process, the anti-adhesion substrate 101 of the present invention can be formed. The anti-adhesion substrate 101 may include a base material 110 and an anti-adhesion layer 140 located on at least one surface of the base material 110 .

Referring to FIGS. 1 to 5 , through the above process, the anti-stick touch electronic device 102 of the present invention can be formed. The anti-stick touch electronic device 102 may include a substrate 110, an electronic component layer 120 located on a surface of the substrate 110 (such as the second surface 112), and at least one other surface of the substrate 110 (such as the first surface). Anti-adhesion layer 140 on surface 111). Anti-Stiction Touch Where the electronic device 102 has the anti-stick layer 140, it may be suitable for touch. That is, at least a portion of the surface (eg, the first surface 111 ) with the anti-adhesion layer 140 disposed thereon may be called a touch surface.

[Examples and Comparative Examples]

Examples and comparative examples are shown below to specifically explain the present invention, but the present invention is not limited at all by the following examples.

An example is to form a corresponding anti-adhesive layer (eg, the same or similar anti-adhesive layer 140 ) on a substrate (eg, the same or similar to the above-mentioned substrate 110 ) through the above method. Moreover, after the simulated touch is performed in an appropriate manner, the result of the simulated touch is measured in an appropriate manner after an appropriate time. For example, an object stained with Escherichia coli (E.coli) can be used to simulate the natural touch of a finger, and after an appropriate period of time, the enzyme color fluorescence reaction detection method can be used to determine the E. coli group or E. coli remaining amount. The aforementioned methods may refer to, be the same as or similar to part or all of the national standard GB/T 4789.38-2008 issued by the China National Standardization Administration Committee.

The comparative example is that the corresponding anti-adhesion layer is formed on the same or similar substrate without using the above method. Furthermore, after the simulated touch is performed in the same or similar manner as described above, the result after the simulated touch is measured in the same or similar manner after the same or similar time as described above.

Figure 6A is a fluorescence photograph of an example of the present invention. Figure 6B is a fluorescence photograph of a comparative example of the present invention.

As shown in Figures 6A and 6B, compared to the comparative example (eg Figure 6B), the example (eg Figure 6A) clearly has less (or almost no) coliforms or E. coli. That is to say, compared with the comparative example, the anti-adhesion layer in the example can make it more difficult for E. coli or E. coli to adhere to it; and/or, it is more difficult for E. coli or E. coli to adhere to it. Reproduce or survive.

As shown above, it has [3-(methacrylamido)propyl]dimethyl(3-thiopropyl)ammonium hydroxide internal salt and 2- The anti-stick substrate and/or anti-stick touch electronic device formed by the anti-stick layer formed by (3,4-dihydroxyphenyl)ethylamine can reduce the adhesion and/or resistance of pathogens (such as mold, fungi or viruses) or grow.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention, but not to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features can be equivalently replaced; and these modifications or substitutions do not deviate from the essence of the corresponding technical solutions from the technical solutions of the embodiments of the present invention. scope.

Claims (10)

1. A method of manufacturing an anti-stiction substrate, comprising:

providing an anti-sticking composition consisting essentially of an internal salt of [3- (methacrylamido) propyl ] dimethyl (3-thiopropyl) ammonium hydroxide and 2- (3, 4-dihydroxyphenyl) ethylamine in a molar ratio of from 4:1 to 5:1; and

and enabling the anti-sticking composition to contact with a substrate so as to form the anti-sticking substrate.

2. The method of claim 1, wherein the step of contacting the anti-stiction composition to the substrate comprises:

immersing the substrate in an aqueous solution containing the anti-sticking composition.

3. The method of claim 1, wherein the step of contacting the anti-stiction composition to the substrate comprises:

immersing the substrate in an aqueous solution containing the anti-sticking composition for 8-12 hours.

4. The method of claim 1, wherein the step of contacting the anti-stiction composition to the substrate comprises:

immersing the substrate in an aqueous solution containing the anti-sticking composition at a temperature of 60 ℃ to 100 ℃.

5. The method of claim 1, wherein the step of contacting the anti-stiction composition to the substrate comprises:

immersing the substrate in an aqueous solution containing the anti-sticking composition at a temperature of 60 ℃ to 100 ℃ for 8 hours to 12 hours.

6. The method according to any one of claims 2 to 5, wherein the concentration of the anti-sticking composition in the aqueous solution is 5mg/mL to 10mg/mL.

7. The method of claim 1, wherein the substrate comprises glass.

8. A manufacturing method of an anti-sticking touch electronic device is characterized by comprising the following steps:

providing a substrate having a component surface and a touch surface opposite to the component surface;

forming an electronic component on the component surface of the substrate; and

contacting the anti-sticking composition with the touch surface of the substrate, wherein the anti-sticking composition mainly comprises [3- (methacrylamido) propyl ] dimethyl (3-thiopropyl) ammonium hydroxide inner salt and 2- (3, 4-dihydroxyphenyl) ethylamine in a molar ratio of 4:1 to 5:1.

9. The method of claim 8, further comprising:

forming a protective film covering the electronic component on the component surface of the base material after forming the electronic component on the component surface of the base material; and

immersing the substrate with the protective film thereon in an aqueous solution containing the anti-sticking composition so that the anti-sticking composition contacts the touch surface of the substrate.

10. The method of manufacturing a touch-on-touch resistant electronic device of claim 9, further comprising:

the protective film is removed after the anti-stiction composition contacts the touch surface of the substrate.