CN116997094A - PCBA packaging device and PCBA offset adjustment method - Google Patents
PCBA packaging device and PCBA offset adjustment method Download PDFInfo
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- CN116997094A CN116997094A CN202311160341.0A CN202311160341A CN116997094A CN 116997094 A CN116997094 A CN 116997094A CN 202311160341 A CN202311160341 A CN 202311160341A CN 116997094 A CN116997094 A CN 116997094A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
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Abstract
Description
技术领域Technical field
本说明书涉及电路板封装技术领域,尤其涉及一种PCBA封装装置及PCBA偏移调整方法。This specification relates to the technical field of circuit board packaging, and in particular to a PCBA packaging device and a PCBA offset adjustment method.
背景技术Background technique
PCBA(Printed Circuit Board+ Assembly)的封装方法很多,如在电路板表层涂三防漆、灌封和低压注塑等封装方法。上述每种方法都有各自的优缺点:直接喷涂三防漆,虽然操作简单、方便、易实现,但不能对电路板进行真正的防护,不能实现防水、防震,时间久了,封装可能失效;灌封,操作繁琐、效率低、成本高且可靠性差;低压注塑,利用低压注塑设备,通过专用的模具、调整相应的注胶压力和时间完成对电路板封装,该方法模具设计和制作成本较高,胶本身的特性对封装影响较大。There are many packaging methods for PCBA (Printed Circuit Board+ Assembly), such as applying conformal paint on the surface of the circuit board, potting, and low-pressure injection molding. Each of the above methods has its own advantages and disadvantages: direct spraying of conformal protective paint, although the operation is simple, convenient and easy to implement, cannot truly protect the circuit board, cannot achieve waterproofing and shockproof, and the packaging may fail after a long time; Potting is a cumbersome operation with low efficiency, high cost and poor reliability; low-pressure injection molding uses low-pressure injection molding equipment to complete circuit board packaging through a dedicated mold and adjusts the corresponding injection pressure and time. This method has relatively high mold design and production costs. High, the characteristics of the glue itself have a greater impact on packaging.
在申请号为PCT/CN2021/131465、名称为“PCBA板的封装方法及其封装设备”的专利中,采用的方案适用于低高度的PCBA(PCBA板)的可靠封装,但是作为来料的PCBA常常发生偏移,若不及时将PCBA的角度调整正确,会导致后续封装产品的不良率增大。现有技术中采用旋转工作台的方式调整PCBA的角度,精确度不高且调整时间长、效率低。In the patent application number PCT/CN2021/131465, titled "PCBA board packaging method and packaging equipment", the solution adopted is suitable for reliable packaging of low-height PCBA (PCBA board), but the PCBA as incoming material Offsets often occur. If the angle of the PCBA is not adjusted correctly in time, the defective rate of subsequent packaged products will increase. In the prior art, a rotating workbench is used to adjust the angle of the PCBA, but the accuracy is not high, the adjustment time is long, and the efficiency is low.
发明内容Contents of the invention
鉴于现有技术的不足,本说明书的一个目的是提供一种PCBA封装装置及PCBA偏移调整方法,在封装前能快速可靠地调整PCBA的角度,避免PCBA偏移。In view of the shortcomings of the existing technology, one purpose of this specification is to provide a PCBA packaging device and a PCBA offset adjustment method that can quickly and reliably adjust the angle of the PCBA before packaging to avoid PCBA offset.
为达到上述目的,本说明书实施方式提供一种PCBA封装装置,包括:In order to achieve the above purpose, the embodiment of this specification provides a PCBA packaging device, including:
用于向PCBA喷射胶液的喷胶组件;Glue spray assembly for spraying glue onto PCBA;
位于所述喷胶组件下方的工作台;A workbench located under the glue spray assembly;
设置在所述工作台上用于承载所述PCBA的抬升组件;所述抬升组件具有纠偏位置和高于所述纠偏位置的工作位置;A lifting component provided on the workbench for carrying the PCBA; the lifting component has a correction position and a working position higher than the correction position;
设置于所述工作台上的纠偏机构,所述纠偏机构能可操纵地水平夹紧释放所述PCBA;在所述抬升组件将所述PCBA抬升至纠偏位置时,所述纠偏机构水平夹紧所述PCBA进行纠偏,并在纠偏后将PCBA释放;所述抬升组件在所述PCBA被纠偏机构释放的状态下抬升所述PCBA至工作位置。A correction mechanism is provided on the workbench. The correction mechanism can controllably clamp and release the PCBA horizontally; when the lifting assembly lifts the PCBA to the correction position, the correction mechanism horizontally clamps the PCBA. The PCBA corrects the deviation and releases the PCBA after the deviation is corrected; the lifting component lifts the PCBA to the working position in the state where the PCBA is released by the deviation correction mechanism.
作为一种优选的实施方式,所述工作台上设有移送机构;所述移送机构用于将PCBA传送至工作工位;所述纠偏机构和所述抬升组件将位于所述工作工位的PCBA进行纠偏抬升。As a preferred embodiment, the workbench is provided with a transfer mechanism; the transfer mechanism is used to transfer the PCBA to the work station; the deviation correction mechanism and the lifting assembly move the PCBA located at the work station Carry out correction and lifting.
作为一种优选的实施方式,所述移送机构包括两条沿第一方向延伸的传送带、以及相对承载所述传送带的两个承载架;其中一个承载架固定设置于所述工作台上,另一个承载架可移动地设置于所述工作台上且能沿第二方向移动;所述第二方向垂直于所述第一方向;所述抬升组件设置在两个所述承载架之间,所述纠偏机构设置在所述承载架上。As a preferred embodiment, the transfer mechanism includes two conveyor belts extending along the first direction, and two carriers that carry the conveyor belts oppositely; one of the carriers is fixedly installed on the workbench, and the other The bearing frame is movably arranged on the workbench and can move along the second direction; the second direction is perpendicular to the first direction; the lifting component is arranged between the two bearing frames, and the The deviation correction mechanism is arranged on the bearing frame.
作为一种优选的实施方式,在所述工作工位的上游设有检测工位,所述检测工位设有第一光电检测组件;在所述工作工位还设有用于在PCBA移送方向上形成阻挡的阻挡机构;在所述第一光电检测组件检测到PCBA时,阻挡机构由不对PCBA移送阻挡的避让位置移动至将其阻挡在工作工位的阻挡位置;所述抬升组件位于所述阻挡机构的上游。As a preferred embodiment, a detection station is provided upstream of the work station, and the detection station is provided with a first photoelectric detection component; the work station is also provided with a device for detecting the movement of the PCBA in the PCBA transfer direction. A blocking mechanism that forms a block; when the first photoelectric detection component detects the PCBA, the blocking mechanism moves from an avoidance position where the PCBA is not moved and blocked to a blocking position where it blocks the PCBA at the work station; the lifting component is located on the blocking upstream of the institution.
作为一种优选的实施方式,所述第一光电检测组件包括第一光电传感器和第一光电感应片,所述第一光电传感器固定设于承载架下方,所述检测工位设有可转动的第一光电感应片;所述PCBA不位于所述第一光电感应片上方时,所述第一光电感应片的顶端高于所述传送带的上表面,底端不与所述第一光电传感器形成配合;所述PCBA位于所述第一光电感应片上方时,所述第一光电感应片的顶端与所述传送带的上表面齐平,底端与所述第一光电传感器形成配合。As a preferred embodiment, the first photoelectric detection component includes a first photoelectric sensor and a first photoelectric induction piece. The first photoelectric sensor is fixedly installed under the carrier frame, and the detection station is provided with a rotatable The first photoelectric sensor sheet; when the PCBA is not located above the first photoelectric sensor sheet, the top of the first photoelectric sensor sheet is higher than the upper surface of the conveyor belt, and the bottom end is not formed with the first photoelectric sensor. Cooperation; when the PCBA is located above the first photoelectric sensor sheet, the top end of the first photoelectric sensor sheet is flush with the upper surface of the conveyor belt, and the bottom end cooperates with the first photoelectric sensor.
作为一种优选的实施方式,所述纠偏机构包括:分别设置在所述抬升组件两侧的两个夹紧件,两个所述夹紧件相对的侧边用于夹紧并调整所述PCBA的角度;所述抬升组件位于所述纠偏位置时,两个夹紧件能向内夹紧所述抬升组件上的PCBA,两个夹紧件之间的距离等于所述PCBA的宽度;所述抬升组件位于所述工作位置时,两个夹紧件之间的距离大于所述PCBA的宽度,所述喷胶组件能向所述PCBA喷射胶液。As a preferred embodiment, the deviation correction mechanism includes: two clamping parts respectively provided on both sides of the lifting assembly, and the opposite sides of the two clamping parts are used to clamp and adjust the PCBA angle; when the lifting component is in the correction position, the two clamping parts can clamp the PCBA on the lifting component inwardly, and the distance between the two clamping parts is equal to the width of the PCBA; When the lifting assembly is in the working position, the distance between the two clamping parts is greater than the width of the PCBA, and the glue spraying assembly can spray glue to the PCBA.
作为一种优选的实施方式,所述抬升组件包括两个分别位于所述承载架内侧的抬升件;所述抬升组件还具有低于所述纠偏位置的待机位置;所述抬升组件位于所述待机位置时,抬升件的顶面低于或平于所述传送带的顶面,两个夹紧件之间的距离大于所述PCBA的宽度;所述抬升组件位于所述纠偏位置时,抬升件的顶面高于所述传送带的顶面;所述抬升组件从所述待机位置切换至所述纠偏位置的速度大于从所述纠偏位置切换至所述工作位置的速度。As a preferred embodiment, the lifting component includes two lifting parts located inside the carrier; the lifting component also has a standby position lower than the correction position; the lifting component is located in the standby position. When the lifting component is in the correction position, the top surface of the lifting component is lower than or parallel to the top surface of the conveyor belt, and the distance between the two clamping components is greater than the width of the PCBA; when the lifting component is in the correction position, the lifting component The top surface is higher than the top surface of the conveyor belt; the speed of the lifting component switching from the standby position to the correction position is greater than the speed of switching from the correction position to the working position.
作为一种优选的实施方式,所述工作工位设有第二光电检测组件,所述第二光电检测组件包括第二光电传感器和第二光电感应片,所述第二光电传感器固定设于承载架下方,所述工作工位设有可转动的第二光电感应片;所述PCBA不位于所述第二光电感应片上方时,所述第二光电感应片的顶端高于所述传送带的上表面,底端不与所述第二光电传感器形成配合;所述PCBA位于所述第二光电感应片上方时,所述第二光电感应片的顶端与所述传送带的上表面齐平,底端与所述第二光电传感器形成配合。As a preferred embodiment, the work station is provided with a second photoelectric detection component. The second photoelectric detection component includes a second photoelectric sensor and a second photoelectric sensor sheet. The second photoelectric sensor is fixedly installed on the carrier. Below the frame, the work station is provided with a rotatable second photoelectric sensor sheet; when the PCBA is not located above the second photoelectric sensor sheet, the top of the second photoelectric sensor sheet is higher than the top of the conveyor belt The surface and the bottom end do not cooperate with the second photoelectric sensor; when the PCBA is located above the second photoelectric sensor sheet, the top end of the second photoelectric sensor sheet is flush with the upper surface of the conveyor belt, and the bottom end Cooperate with the second photoelectric sensor.
作为一种优选的实施方式,所述夹紧件在第二方向上远离所述承载架的一端设有顶柱,所述PCBA封装装置还包括持续与所述顶柱的侧面接触的凸轮,所述凸轮绕固定轴线转动使两个所述夹紧件互相靠近或远离;所述凸轮连接有用于驱动凸轮转动的第三驱动件;所述承载架上设有用于感应所述夹紧件位置的第三光电传感器,所述凸轮上设有与所述第三光电传感器相配合的第三光电感应片,所述第三光电感应片随所述凸轮一同绕固定轴线转动。As a preferred embodiment, the clamping member is provided with a top post at one end away from the carrier in the second direction, and the PCBA packaging device further includes a cam that is continuously in contact with the side of the top post, so The cam rotates around the fixed axis to move the two clamping parts closer to or away from each other; the cam is connected to a third driving part for driving the cam to rotate; the carrier is provided with a sensor for sensing the position of the clamping part. A third photoelectric sensor, the cam is provided with a third photoelectric induction piece that matches the third photoelectric sensor, and the third photoelectric induction piece rotates around the fixed axis together with the cam.
作为一种优选的实施方式,所述PCBA封装装置还包括:As a preferred implementation, the PCBA packaging device further includes:
用于驱动所述阻挡机构在所述阻挡位置和所述避让位置之间切换的第一驱动件;所述第一光电传感器和所述第一驱动件电连接;A first driving member for driving the blocking mechanism to switch between the blocking position and the avoidance position; the first photoelectric sensor and the first driving member are electrically connected;
用于驱动所述抬升组件在待机位置、纠偏位置和工作位置之间切换的第二驱动件;所述第二光电传感器和所述第二驱动件电连接;A second driving member used to drive the lifting component to switch between the standby position, the correction position and the working position; the second photoelectric sensor and the second driving member are electrically connected;
用于驱动所述凸轮转动的第三驱动件;所述第三驱动件与所述第二光电传感器电连接;A third driving member used to drive the cam to rotate; the third driving member is electrically connected to the second photoelectric sensor;
用于感应所述抬升组件的纠偏位置的第四光电传感器和用于感应所述抬升组件的工作位置的第五光电传感器,所述第四光电传感器和所述第五光电传感器固定设置于所述承载架上,所述第五光电传感器位于所述第四光电传感器的正上方;所述第四光电传感器和所述第五光电传感器分别和所述第二驱动件电连接;所述抬升组件上设有与所述第四光电传感器或第五光电传感器相配合的第四光电感应片,所述第四光电感应片随所述抬升组件一同沿竖直方向移动。A fourth photoelectric sensor for sensing the correction position of the lifting component and a fifth photoelectric sensor for sensing the working position of the lifting component, the fourth photoelectric sensor and the fifth photoelectric sensor are fixedly arranged on the On the carrier, the fifth photoelectric sensor is located directly above the fourth photoelectric sensor; the fourth photoelectric sensor and the fifth photoelectric sensor are electrically connected to the second driving member respectively; on the lifting component A fourth photoelectric sensing piece is provided that cooperates with the fourth photoelectric sensor or the fifth photoelectric sensor, and the fourth photoelectric sensing piece moves in the vertical direction together with the lifting component.
作为一种优选的实施方式,所述PCBA封装装置还包括:分别与所述第一光电传感器、第二光电传感器、第三光电传感器、第四光电传感器、第五光电传感器、第一驱动件、第二驱动件、第三驱动件电连接的控制器,用于接收所述第一光电传感器、第二光电传感器、第三光电传感器、第四光电传感器、第五光电传感器的感应信号并控制所述第一驱动件、第二驱动件、第三驱动件的启停。As a preferred embodiment, the PCBA packaging device further includes: the first photoelectric sensor, the second photoelectric sensor, the third photoelectric sensor, the fourth photoelectric sensor, the fifth photoelectric sensor, the first driver, A controller electrically connected to the second driving member and the third driving member is used to receive the sensing signals of the first, second, third, fourth and fifth photoelectric sensors and control them. The starting and stopping of the first driving part, the second driving part and the third driving part.
作为一种优选的实施方式,两条所述传送带分别设置于两个所述承载架相对的侧面;所述传送带包括沿所述第一方向依次设置的上游传送带、中游传送带和下游传送带;所述上游传送带、中游传送带和下游传送带的上表面在同一水平面上;所述上游传送带、中游传送带和下游传送带的数量均为两个,且在第二方向上相对设置;As a preferred embodiment, two conveyor belts are respectively provided on opposite sides of the two carriers; the conveyor belts include an upstream conveyor belt, a midstream conveyor belt and a downstream conveyor belt that are sequentially arranged along the first direction; The upper surfaces of the upstream conveyor belt, the midstream conveyor belt and the downstream conveyor belt are on the same horizontal plane; the number of the upstream conveyor belt, the midstream conveyor belt and the downstream conveyor belt is two, and they are arranged oppositely in the second direction;
所述检测工位位于所述上游传送带和中游传送带之间,所述工作工位设置在所述中游传送带处;所述抬升件沿垂直于第二方向的竖直平面延伸且位于两个中游传送带之间;所述夹紧件沿水平面延伸且位于所述承载架的顶面上;两个所述夹紧件相对的侧边均沿所述第一方向延伸;The detection station is located between the upstream conveyor belt and the midstream conveyor belt, and the working station is provided at the midstream conveyor belt; the lifting member extends along a vertical plane perpendicular to the second direction and is located on the two midstream conveyor belts. between; the clamping member extends along the horizontal plane and is located on the top surface of the carrier; the opposite sides of the two clamping members extend along the first direction;
所述阻挡机构位于所述抬升件远离所述上游传送带的一侧,所述阻挡机构在所述第一方向上的投影位于所述下游传送带靠近中游传送带的一端,被所述阻挡机构阻挡的PCBA具有位于所述中游传送带和下游传送带之间的部分。The blocking mechanism is located on the side of the lifting member away from the upstream conveyor belt. The projection of the blocking mechanism in the first direction is located on one end of the downstream conveyor belt close to the midstream conveyor belt. The PCBA blocked by the blocking mechanism There is a portion located between the midstream conveyor belt and the downstream conveyor belt.
本说明书实施方式还提供一种PCBA偏移调整方法,包括以下步骤:The embodiment of this specification also provides a PCBA offset adjustment method, which includes the following steps:
将PCBA移送至工作工位;Move the PCBA to the work station;
将移送至工作工位的PCBA抬升至纠偏位置;Lift the PCBA transferred to the work station to the correction position;
控制纠偏机构水平夹紧PCBA进行纠偏,在纠偏后将PCBA释放;Control the correction mechanism to clamp the PCBA horizontally for correction, and release the PCBA after correction;
再次抬升所述PCBA至工作位置执行喷涂封装。Lift the PCBA to the working position again to perform spray encapsulation.
有益效果:Beneficial effects:
本实施方式所提供的PCBA封装装置,通过在工作台上设置抬升组件和纠偏机构,抬升组件位于纠偏位置时,纠偏机构水平夹紧PCBA进行纠偏,以调整PCBA的角度,并在纠偏后将PCBA释放,从而本PCBA封装装置能快速可靠地在封装前调整PCBA的角度,避免PCBA偏移。通过在工作台上方设置喷胶组件,可以在抬升组件进一步抬升至工作位置时对PCBA喷射胶液,完成封装。工作位置高于纠偏位置,且抬升组件在PCBA被纠偏机构释放的状态下抬升PCBA至工作位置,可以避免封装PCBA时纠偏机构造成阻碍。The PCBA packaging device provided in this embodiment is provided with a lifting component and a correction mechanism on the workbench. When the lifting component is located at the correction position, the correction mechanism clamps the PCBA horizontally for correction to adjust the angle of the PCBA, and after correction, the PCBA is Release, so that the PCBA packaging device can quickly and reliably adjust the angle of the PCBA before packaging to avoid PCBA deviation. By setting the glue spray assembly above the workbench, glue can be sprayed on the PCBA when the lifting assembly is further raised to the working position to complete the packaging. The working position is higher than the correction position, and the lifting component lifts the PCBA to the working position when the PCBA is released by the correction mechanism, which can avoid obstruction by the correction mechanism when packaging the PCBA.
参照后文的说明和附图,详细公开了本发明的特定实施方式,指明了本发明的原理可以被采用的方式。应该理解,本发明的实施方式在范围上并不因而受到限制。Referring to the following description and drawings, specific embodiments of the invention are disclosed in detail and the manner in which the principles of the invention may be employed is indicated. It should be understood that embodiments of the invention are not thereby limited in scope.
针对一种实施方式描述和/或示出的特征可以以相同或类似的方式在一个或更多个其它实施方式中使用,与其它实施方式中的特征相组合,或替代其它实施方式中的特征。Features described and/or illustrated with respect to one embodiment may be used in the same or similar manner in one or more other embodiments, in combination with features in other embodiments, or in place of features in other embodiments .
应该强调,术语“包括/包含”在本文使用时指特征、整件、步骤或组件的存在,但并不排除一个或更多个其它特征、整件、步骤或组件的存在或附加。It should be emphasized that the term "comprising" when used herein refers to the presence of features, integers, steps or components but does not exclude the presence or addition of one or more other features, integers, steps or components.
附图说明Description of the drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only These are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without exerting any creative effort.
图1为本实施方式中所提供的一种PCBA封装装置的立体结构示意图;Figure 1 is a schematic three-dimensional structural diagram of a PCBA packaging device provided in this embodiment;
图2为图1中的一个承载架上相关结构的示意图;Figure 2 is a schematic diagram of the relevant structure on a bearing frame in Figure 1;
图3为图1中部分结构的放大示意图;Figure 3 is an enlarged schematic diagram of part of the structure in Figure 1;
图4为本实施方式中所提供的一种PCBA偏移调整方法的步骤流程图。FIG. 4 is a step flow chart of a PCBA offset adjustment method provided in this embodiment.
附图标记说明:Explanation of reference symbols:
100、PCBA;1、承载架;2、传送带;21、上游传送带;22、中游传送带;23、下游传送带;3、阻挡机构;4、抬升组件;5、纠偏机构;6、顶柱;7、凸轮;81、第一光电感应片;82、第一光电传感器;91、第二光电感应片;92、第二光电传感器;10、第一驱动件;11、第二驱动件;12、第三驱动件;13、第四光电传感器;14、第五光电传感器;15、第三光电传感器;16、第三光电感应片;17、第四光电感应片;18、工作台;19、支撑架;20、第四驱动件;X、第一方向;Y、第二方向。100. PCBA; 1. Bearing frame; 2. Conveyor belt; 21. Upstream conveyor belt; 22. Midstream conveyor belt; 23. Downstream conveyor belt; 3. Blocking mechanism; 4. Lifting component; 5. Correction mechanism; 6. Top column; 7. Cam; 81, first photoelectric sensor piece; 82, first photoelectric sensor; 91, second photoelectric sensor piece; 92, second photoelectric sensor; 10, first driving member; 11, second driving member; 12, third Driving part; 13. The fourth photoelectric sensor; 14. The fifth photoelectric sensor; 15. The third photoelectric sensor; 16. The third photoelectric sensor sheet; 17. The fourth photoelectric sensor sheet; 18. Workbench; 19. Support frame; 20. The fourth driving member; X, first direction; Y, second direction.
具体实施方式Detailed ways
为了使本技术领域的人员更好地理解本发明中的技术方案,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例,都应当属于本发明保护的范围。In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts should fall within the scope of protection of the present invention.
需要说明的是,当元件被称为“设置于”另一个元件,它可以直接在另一个元件上或者也可以存在居中的另一个元件。当一个元件被认为是“连接”另一个元件,它可以是直接连接到另一个元件或者可能同时存在居中另一个元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的,并不表示是唯一的实施方式。It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or the other element may be interveningly present. When an element is said to be "connected" to another element, it can be directly connected to the other element or it may be present between the other element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation manner.
除非另有定义,本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施方式的目的,不是旨在于限制本发明。本文所使用的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which the invention belongs. The terminology used herein in the description of the invention is for the purpose of describing specific embodiments only and is not intended to limit the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
请参阅图1至图3。本申请实施方式提供一种PCBA封装装置,包括喷胶组件(图未示)、工作台18、抬升组件4和纠偏机构5。See Figure 1 to Figure 3. The embodiment of the present application provides a PCBA packaging device, which includes a glue spray component (not shown), a workbench 18 , a lifting component 4 and a correction mechanism 5 .
其中,喷胶组件用于向PCBA喷射胶液。工作台18位于喷胶组件下方。抬升组件4设置在工作台18上,用于承载所述PCBA100。抬升组件4具有纠偏位置和高于纠偏位置的工作位置。纠偏机构5设置于工作台18上,纠偏机构5能可操纵地水平夹紧释放PCBA100。在抬升组件4将PCBA100抬升至纠偏位置时,纠偏机构5水平夹紧PCBA100进行纠偏,并在纠偏后将PCBA100释放。抬升组件4在PCBA100被纠偏机构5释放的状态下抬升PCBA100至工作位置。Among them, the glue spray component is used to spray glue liquid to the PCBA. The workbench 18 is located below the glue spray assembly. The lifting assembly 4 is disposed on the workbench 18 for carrying the PCBA 100 . The lifting component 4 has a correction position and a working position higher than the correction position. The correction mechanism 5 is arranged on the workbench 18, and the correction mechanism 5 can controllably clamp and release the PCBA 100 horizontally. When the lifting assembly 4 lifts the PCBA100 to the correction position, the correction mechanism 5 horizontally clamps the PCBA100 for correction, and releases the PCBA100 after correction. The lifting component 4 lifts the PCBA 100 to the working position when the PCBA 100 is released by the correction mechanism 5 .
本实施方式所提供的PCBA封装装置,通过在工作台18上设置抬升组件4和纠偏机构5,抬升组件4位于纠偏位置时,纠偏机构5水平夹紧PCBA100进行纠偏,以调整PCBA100的角度,并在纠偏后将PCBA100释放,从而本PCBA封装装置能快速可靠地在封装前调整PCBA100的角度,避免PCBA100偏移。通过在工作台18上方设置喷胶组件,可以在抬升组件4进一步抬升至工作位置时对PCBA100喷射胶液,完成封装。工作位置高于纠偏位置,且抬升组件4在PCBA100被纠偏机构5释放的状态下抬升PCBA100至工作位置,可以避免封装PCBA100时纠偏机构5造成阻碍。The PCBA packaging device provided in this embodiment is provided with a lifting component 4 and a correction mechanism 5 on the workbench 18. When the lifting component 4 is located at the correction position, the correction mechanism 5 horizontally clamps the PCBA 100 for correction to adjust the angle of the PCBA 100, and After the deviation is corrected, the PCBA100 is released, so that the PCBA packaging device can quickly and reliably adjust the angle of the PCBA100 before packaging to avoid PCBA100 deviation. By arranging the glue spray assembly above the workbench 18, glue can be sprayed on the PCBA 100 when the lifting assembly 4 is further raised to the working position to complete the packaging. The working position is higher than the correction position, and the lifting component 4 lifts the PCBA 100 to the working position when the PCBA 100 is released by the correction mechanism 5, which can avoid obstruction caused by the correction mechanism 5 when the PCBA 100 is packaged.
在本实施方式中,工作台18上设有移送机构,移送机构用于将PCBA100传送至工作工位。纠偏机构5和抬升组件4可以将位于工作工位的PCBA100进行纠偏抬升,也即纠偏机构5和抬升组件4均设置于工作工位处。In this embodiment, a transfer mechanism is provided on the workbench 18, and the transfer mechanism is used to transfer the PCBA 100 to the work station. The correction mechanism 5 and the lifting component 4 can correct and lift the PCBA 100 located at the work station, that is, the correction mechanism 5 and the lifting component 4 are both arranged at the work station.
具体的,移送机构包括两条沿第一方向X延伸的传送带2、以及相对承载传送带2的两个承载架1。其中一个承载架1位置固定于工作台18上,另一个承载架1可移动地设置于工作台18上且能沿第二方向Y移动,以改变与固定承载架1之间的距离,从而可以使本PCBA封装装置应用于不同宽度的PCBA100。抬升组件4设置在两个承载架1之间,两个纠偏机构5分别设置在两个承载架1上。Specifically, the transfer mechanism includes two conveyor belts 2 extending along the first direction X, and two carrier frames 1 opposite to each other. One of the carriers 1 is fixed on the workbench 18, and the other carrier 1 is movably disposed on the workbench 18 and can move along the second direction Y to change the distance from the fixed carrier 1, so that This PCBA packaging device is applied to PCBA100 of different widths. The lifting assembly 4 is arranged between the two bearing frames 1, and the two correction mechanisms 5 are respectively arranged on the two bearing frames 1.
其中,第一方向X和第二方向Y垂直,且均平行于水平面。本申请实施方式中所述的PCBA100的宽度,是指PCBA100沿第二方向Y的尺寸。Wherein, the first direction X and the second direction Y are vertical and parallel to the horizontal plane. The width of the PCBA 100 described in the embodiment of the present application refers to the size of the PCBA 100 along the second direction Y.
在本实施方式中,在工作工位的上游设有检测工位,检测工位设有第一光电检测组件。如图1所示,在工作工位还设有用于在PCBA100移送方向(即第一方向X)上形成阻挡的阻挡机构3。阻挡机构3设置在承载架1上。阻挡机构3具有能使PCBA100通过的避让位置和阻挡PCBA100的阻挡位置。位于避让位置时,阻挡机构3不对PCBA100的移送造成阻挡;位于阻挡位置时,阻挡机构3将PCBA100阻挡在工作工位。在第一光电检测组件检测到PCBA100时,阻挡机构3由避让位置移动至阻挡位置。抬升组件4位于阻挡机构3的上游。通过设置阻挡机构3可以将传送带2上的PCBA100进行阻挡,然后抬升组件4将PCBA100进行抬升。In this embodiment, a detection station is provided upstream of the work station, and the detection station is provided with a first photoelectric detection component. As shown in Figure 1, the work station is also provided with a blocking mechanism 3 for forming a block in the transfer direction of the PCBA 100 (ie, the first direction X). The blocking mechanism 3 is arranged on the carrying frame 1 . The blocking mechanism 3 has an escape position that allows the PCBA 100 to pass and a blocking position that blocks the PCBA 100 . When it is in the avoidance position, the blocking mechanism 3 does not block the transfer of the PCBA 100; when it is in the blocking position, the blocking mechanism 3 blocks the PCBA 100 at the work station. When the first photoelectric detection component detects the PCBA 100, the blocking mechanism 3 moves from the avoidance position to the blocking position. The lifting assembly 4 is located upstream of the blocking mechanism 3 . By setting the blocking mechanism 3, the PCBA 100 on the conveyor belt 2 can be blocked, and then the lifting assembly 4 can lift the PCBA 100.
在本实施方式中,纠偏机构5包括分别设置在抬升组件4两侧的两个夹紧件。两个夹紧件相对的侧边用于夹紧并调整PCBA100的角度。抬升组件4位于纠偏位置时,两个夹紧件能向内夹紧抬升组件4上的PCBA100,两个夹紧件之间的距离等于PCBA100的宽度。抬升组件4位于工作位置时,两个夹紧件之间的距离大于PCBA100的宽度,可以避免封装PCBA100时夹紧件造成阻碍,此时喷胶组件能向PCBA100喷射胶液。In this embodiment, the deflection correction mechanism 5 includes two clamping members respectively provided on both sides of the lifting assembly 4 . The opposite sides of the two clamping parts are used to clamp and adjust the angle of PCBA100. When the lifting assembly 4 is in the correction position, the two clamping parts can clamp the PCBA100 on the lifting assembly 4 inward, and the distance between the two clamping parts is equal to the width of the PCBA100. When the lifting component 4 is in the working position, the distance between the two clamping parts is greater than the width of the PCBA100, which can avoid obstruction caused by the clamping parts when packaging the PCBA100. At this time, the glue spraying component can spray glue to the PCBA100.
具体的,抬升组件4包括两个分别位于承载架1内侧的抬升件。抬升组件4还具有低于所述纠偏位置的待机位置。抬升组件4位于待机位置时,抬升件的顶面低于或平于传送带2的顶面,两个夹紧件之间的距离大于PCBA100的宽度。抬升组件4位于纠偏位置时,顶面高于传送带2的顶面。Specifically, the lifting assembly 4 includes two lifting parts located inside the carrier frame 1 respectively. The lifting assembly 4 also has a standby position lower than the correction position. When the lifting component 4 is in the standby position, the top surface of the lifting component is lower than or flat to the top surface of the conveyor belt 2, and the distance between the two clamping components is greater than the width of the PCBA100. When the lifting component 4 is in the correction position, the top surface is higher than the top surface of the conveyor belt 2 .
具体的,抬升组件4从待机位置切换至纠偏位置的速度大于从纠偏位置切换至工作位置的速度。这是因为抬升组件4从纠偏位置切换至工作位置时,PCBA100已经完成偏移调整,且PCBA100周侧没有约束,若此时抬升组件4的速度过大,可能导致PCBA100在上升过程中产生晃动,从而发生角度偏移。抬升组件4从纠偏位置切换至工作位置时的速度应尽量较小,以使PCBA100平稳上升,保证完成偏移调整的PCBA100不再产生角度偏移。Specifically, the speed at which the lifting component 4 switches from the standby position to the correction position is greater than the speed at which it switches from the correction position to the working position. This is because when the lifting component 4 switches from the correction position to the working position, the PCBA100 has completed the offset adjustment, and there are no constraints on the circumference of the PCBA100. If the speed of the lifting component 4 is too high at this time, it may cause the PCBA100 to shake during the rising process. This causes an angular shift. The speed of the lifting component 4 when switching from the correction position to the working position should be as small as possible to allow the PCBA 100 to rise smoothly and ensure that the PCBA 100 that has completed the offset adjustment will no longer produce angular offset.
在本实施方式中,为了使阻挡机构3能在避让位置和阻挡位置之间适时地切换,PCBA封装装置包括用于驱动阻挡机构3在阻挡位置和避让位置之间切换的第一驱动件10。第一光电检测组件包括第一光电传感器82和第一光电感应片81。其中,在检测工位设有可转动的第一光电感应片81,承载架1下方固定有与第一光电感应片81相配合感应的第一光电传感器82。PCBA100不位于第一光电感应片81上方时,第一光电感应片81的顶端高于传送带2的上表面,底端不与第一光电传感器82形成配合;PCBA100位于第一光电感应片81上方时,第一光电感应片81的顶端与传送带2的上表面齐平,底端与第一光电传感器82形成配合。In this embodiment, in order to enable the blocking mechanism 3 to switch between the avoidance position and the blocking position in a timely manner, the PCBA packaging device includes a first driving member 10 for driving the blocking mechanism 3 to switch between the blocking position and the avoiding position. The first photoelectric detection component includes a first photoelectric sensor 82 and a first photoelectric sensing sheet 81 . Among them, a rotatable first photoelectric sensor piece 81 is provided at the detection station, and a first photoelectric sensor 82 that cooperates with the first photoelectric sensor piece 81 and senses is fixed below the carrier 1 . When the PCBA 100 is not located above the first photoelectric sensor sheet 81 , the top of the first photoelectric sensor sheet 81 is higher than the upper surface of the conveyor belt 2 , and the bottom end does not cooperate with the first photoelectric sensor 82 ; when the PCBA 100 is located above the first photoelectric sensor sheet 81 , the top end of the first photoelectric sensor sheet 81 is flush with the upper surface of the conveyor belt 2 , and the bottom end cooperates with the first photoelectric sensor 82 .
第一光电传感器82和第一驱动件10电连接。阻挡机构3首先处于避让位置,当有PCBA100传送经过检测工位时,将第一光电感应片81的顶端下压,使第一光电感应片81的底端与第一光电传感器82形成配合,触发第一光电传感器82,第一光电传感器82将信号传递给第一驱动件10,第一驱动件10在PCBA100到达阻挡机构3之前驱动阻挡机构3从避让位置切换至阻挡位置。The first photoelectric sensor 82 is electrically connected to the first driving member 10 . The blocking mechanism 3 is first in the avoidance position. When the PCBA 100 passes through the detection station, the top of the first photoelectric sensor sheet 81 is pressed down, so that the bottom end of the first photoelectric sensor sheet 81 cooperates with the first photoelectric sensor 82 to trigger The first photoelectric sensor 82 transmits the signal to the first driving component 10 , and the first driving component 10 drives the blocking mechanism 3 to switch from the avoidance position to the blocking position before the PCBA 100 reaches the blocking mechanism 3 .
其中,第一光电感应片81的顶面优选为圆弧面,从而不会影响PCBA100在检测工位处的传动。第一光电感应片81的底端在第一方向X上位于顶端的一侧,即第一光电感应片81的底端和顶端在竖直方向上错开。第一光电感应片81的底端和顶端之间的一处固定于承载架1。第一光电传感器82设有用于感应第一光电感应片81底端的凹槽,第一光电感应片81的顶端未被下压时,第一光电感应片81的底端位于凹槽外,第一光电传感器82未能感应到第一光电感应片81;当有PCBA100传送经过检测工位时,第一光电感应片81的顶端被下压,第一光电感应片81的底端斜向移动至凹槽内,第一光电传感器82感应到第一光电感应片81,并将信号发送至第一驱动件10。Among them, the top surface of the first photoelectric sensor sheet 81 is preferably an arc surface, so as not to affect the transmission of the PCBA 100 at the detection station. The bottom end of the first photoelectric sensing sheet 81 is located on one side of the top end in the first direction X, that is, the bottom end and the top end of the first photoelectric sensing sheet 81 are staggered in the vertical direction. A point between the bottom end and the top end of the first photoelectric sensing sheet 81 is fixed to the carrying frame 1 . The first photoelectric sensor 82 is provided with a groove for sensing the bottom end of the first photoelectric induction piece 81. When the top end of the first photoelectric induction piece 81 is not pressed down, the bottom end of the first photoelectric induction piece 81 is located outside the groove, and the first The photoelectric sensor 82 fails to sense the first photoelectric sensor sheet 81; when the PCBA 100 is transmitted through the detection station, the top of the first photoelectric sensor sheet 81 is pressed down, and the bottom end of the first photoelectric sensor sheet 81 moves diagonally to the concave position. In the slot, the first photoelectric sensor 82 senses the first photoelectric sensing piece 81 and sends the signal to the first driving member 10 .
如图3所示,PCBA封装装置还包括用于驱动抬升组件4在待机位置、纠偏位置和工作位置之间切换的第二驱动件11。为了使第二驱动件11及时驱动抬升组件4抬升,在工作工位设有第二光电检测组件。第二光电检测组件包括第二光电传感器92和第二光电感应片91。As shown in Figure 3, the PCBA packaging device also includes a second driving member 11 for driving the lifting assembly 4 to switch between the standby position, the correction position and the working position. In order to enable the second driving member 11 to drive the lifting assembly 4 to lift in time, a second photoelectric detection assembly is provided at the work station. The second photoelectric detection component includes a second photoelectric sensor 92 and a second photoelectric sensing sheet 91 .
具体的,工作工位设有可转动的第二光电感应片91,承载架1下方固定有与第二光电感应片91相配合感应的第二光电传感器92。PCBA100不位于第二光电感应片91上方时,第二光电感应片91的顶端高于传送带2的上表面,底端不与第二光电传感器92形成配合;PCBA100位于第二光电感应片91上方时,第二光电感应片91的顶端与传送带2的上表面齐平,底端与第二光电传感器92形成配合。Specifically, the work station is provided with a rotatable second photoelectric induction piece 91 , and a second photoelectric sensor 92 that cooperates with the second photoelectric induction piece 91 and senses is fixed below the carrier 1 . When the PCBA 100 is not located above the second photoelectric sensor sheet 91 , the top of the second photoelectric sensor sheet 91 is higher than the upper surface of the conveyor belt 2 , and the bottom end does not cooperate with the second photoelectric sensor 92 ; when the PCBA 100 is located above the second photoelectric sensor sheet 91 , the top end of the second photoelectric sensor sheet 91 is flush with the upper surface of the conveyor belt 2 , and the bottom end cooperates with the second photoelectric sensor 92 .
第二光电传感器92和第二驱动件11电连接。抬升组件4首先处于待机位置,当有PCBA100被阻挡机构3阻挡在工作工位时,将第二光电感应片91的顶端下压,使第二光电感应片91的底端与第二光电传感器92形成配合,触发第二光电传感器92,第二光电传感器92将信号传递给第二驱动件11,第二驱动件11在PCBA100被阻挡机构3阻挡之后驱动抬升组件4从待机位置切换至纠偏位置,以将PCBA100抬起,便于进行后续的角度偏移调整工作。The second photoelectric sensor 92 is electrically connected to the second driving member 11 . The lifting assembly 4 is first in the standby position. When the PCBA 100 is blocked by the blocking mechanism 3 at the working station, the top of the second photoelectric sensor sheet 91 is pressed down, so that the bottom end of the second photoelectric sensor sheet 91 is in contact with the second photoelectric sensor 92 Cooperation is formed to trigger the second photoelectric sensor 92. The second photoelectric sensor 92 transmits the signal to the second driving component 11. After the PCBA 100 is blocked by the blocking mechanism 3, the second driving component 11 drives the lifting component 4 to switch from the standby position to the correction position. to lift PCBA100 to facilitate subsequent angle offset adjustment.
具体的,第二光电感应片91和第二光电传感器92的具体结构可以分别参考上述第一光电感应片81和第一光电传感器82的结构,其结构相似,本申请在此不再赘述。Specifically, the specific structures of the second photoelectric sensor sheet 91 and the second photoelectric sensor 92 may refer to the structures of the above-mentioned first photoelectric sensor sheet 81 and the first photoelectric sensor 82 respectively. Their structures are similar and will not be described again in this application.
优选地,第二光电传感器92和第一驱动件10电连接。第二驱动件11驱动抬升组件4离开待机位置后,第二光电感应片91的顶端恢复至略高于传送带2顶面的位置,此时第二光电传感器92无法感应到第二光电感应片91,第二光电传感器92将该信号传递至第一驱动件10,第一驱动件驱动阻挡机构3回到避让位置,从而在抬升组件4将PCBA100放下后,阻挡机构3不会对PCBA100在传送带2移动造成阻挡。Preferably, the second photoelectric sensor 92 and the first driving member 10 are electrically connected. After the second driving member 11 drives the lifting assembly 4 to leave the standby position, the top of the second photoelectric sensor sheet 91 returns to a position slightly higher than the top surface of the conveyor belt 2. At this time, the second photoelectric sensor 92 cannot sense the second photoelectric sensor sheet 91. , the second photoelectric sensor 92 transmits the signal to the first driving member 10, and the first driving member drives the blocking mechanism 3 to return to the avoidance position, so that after the lifting assembly 4 puts down the PCBA 100, the blocking mechanism 3 will not cause damage to the PCBA 100 on the conveyor belt 2 Movement creates obstruction.
如图1所示,夹紧件在第二方向Y上远离承载架1的一端设有顶柱6,PCBA封装装置还包括持续与顶柱6的侧面接触的凸轮7,凸轮7绕固定轴线转动使两个夹紧件互相靠近或远离。以固定轴线到凸轮7的侧边的距离作为该侧边处的半径,则凸轮7具有半径最小的第一处侧边和半径最大的第二处侧边。凸轮7的固定轴线相对于承载架1保持静止,夹紧件和承载架1之间设有沿第二方向Y延伸的弹性件。当凸轮7的第一处侧边与顶柱6接触时,弹性件处于自然状态,两个夹紧件之间的距离最大;当凸轮7旋转至第二处侧边与顶柱6接触时,弹性件被压缩,两个夹紧件向内移动,可以夹紧PCBA100。As shown in Figure 1, the clamping member is provided with a top post 6 at one end away from the carrier 1 in the second direction Y. The PCBA packaging device also includes a cam 7 that is continuously in contact with the side of the top post 6. The cam 7 rotates around a fixed axis. Move the two clamping pieces closer or further away from each other. Taking the distance from the fixed axis to the side of the cam 7 as the radius at the side, the cam 7 has a first side with the smallest radius and a second side with the largest radius. The fixed axis of the cam 7 remains stationary relative to the carrier 1 , and an elastic member extending along the second direction Y is provided between the clamping member and the carrier 1 . When the first side of the cam 7 is in contact with the top post 6, the elastic member is in a natural state, and the distance between the two clamping parts is the largest; when the second side of the cam 7 is in contact with the top post 6, The elastic part is compressed, and the two clamping parts move inward to clamp the PCBA100.
在本实施方式中,凸轮7连接有用于驱动凸轮7转动的第三驱动件12,第三驱动件12与第二光电传感器92电连接。凸轮7首先处于第一处侧边与顶柱6接触的位置,当有PCBA100被阻挡机构3阻挡在工作工位时,触发第二光电传感器92,第二光电传感器92将信号传递给第三驱动件12,第三驱动件12在PCBA100被阻挡机构3阻挡之后驱动凸轮7旋转,使第二处侧边与顶柱6接触,两个夹紧件靠近,以夹紧PCBA100,调整PCBA100的角度,避免其偏移。In this embodiment, the cam 7 is connected to a third driving member 12 for driving the cam 7 to rotate, and the third driving member 12 is electrically connected to the second photoelectric sensor 92 . The cam 7 is first in the first side contact position with the top post 6. When the PCBA 100 is blocked at the working station by the blocking mechanism 3, the second photoelectric sensor 92 is triggered, and the second photoelectric sensor 92 transmits the signal to the third driver. Part 12, the third driving part 12 drives the cam 7 to rotate after the PCBA100 is blocked by the blocking mechanism 3, so that the second side is in contact with the top post 6, and the two clamping parts are close to clamp the PCBA100 and adjust the angle of the PCBA100. Avoid deflection.
在本实施方式中,抬升组件4位于纠偏位置时,抬升组件4的顶面与夹紧件的底面齐平。优选地,夹紧件的厚度和PCBA100的厚度相等,则被抬升组件4抬升的PCBA100的顶面和夹紧件的顶面齐平。在其他实施例中,夹紧件的厚度可以略大于PCBA100的厚度,以保证较好的偏移调整效果。In this embodiment, when the lifting component 4 is in the correction position, the top surface of the lifting component 4 is flush with the bottom surface of the clamping member. Preferably, the thickness of the clamping member is equal to the thickness of the PCBA 100, so that the top surface of the PCBA 100 lifted by the lifting assembly 4 is flush with the top surface of the clamping member. In other embodiments, the thickness of the clamping member may be slightly larger than the thickness of the PCBA 100 to ensure better offset adjustment effect.
具体的,当第二驱动件11驱动抬升组件4从待机位置切换至纠偏位置时,第三驱动件12驱动凸轮7旋转,也即,在PCBA100被阻挡机构3阻挡在工作工位时,抬升组件4和夹紧件同时开始移动。凸轮7旋转的速度与抬升组件4从待机位置切换至纠偏位置的速度相关联,当抬升组件4处于纠偏位置时,使凸轮7的第二处侧边与顶柱6接触,保证有效地对PCBA100进行偏移调整。Specifically, when the second driving member 11 drives the lifting assembly 4 to switch from the standby position to the correction position, the third driving member 12 drives the cam 7 to rotate. That is, when the PCBA 100 is blocked by the blocking mechanism 3 at the working station, the lifting assembly 4 and the clamping piece start moving at the same time. The speed of the rotation of the cam 7 is related to the speed of the lifting component 4 switching from the standby position to the correction position. When the lifting component 4 is in the correction position, the second side of the cam 7 is in contact with the top post 6 to ensure that the PCBA100 is effectively Make offset adjustments.
需合理控制凸轮7的旋转速度,使凸轮7从第一处侧边与顶柱6接触的位置旋转至第二处侧边与顶柱6接触的位置所用的时间,大于抬升组件4从待机位置切换至纠偏位置的时间。抬升组件4处于纠偏位置时,PCBA100被夹紧件夹紧完成角度调整后,凸轮7继续转动,回到第一处侧边与顶柱6接触的位置,该过程中被压缩的弹性件逐渐复位,推动夹紧件向外移动,使两个夹紧件的距离大于PCBA100的宽度。抬升组件4从纠偏位置切换至工作位置,使PCBA100的顶面高于夹紧件的顶面,便于对PCBA100进行封装。The rotation speed of the cam 7 needs to be reasonably controlled so that the time it takes for the cam 7 to rotate from the first position where the side is in contact with the top post 6 to the second position where the side is in contact with the top post 6 is greater than the time it takes for the lifting component 4 to move from the standby position. The time to switch to the correction position. When the lifting component 4 is in the correction position, after the PCBA100 is clamped by the clamping member and the angle adjustment is completed, the cam 7 continues to rotate and returns to the first position where the side is in contact with the top column 6. The compressed elastic member gradually resets during the process. , push the clamping parts to move outward, so that the distance between the two clamping parts is greater than the width of PCBA100. The lifting component 4 is switched from the correction position to the working position so that the top surface of the PCBA100 is higher than the top surface of the clamping piece, making it easier to package the PCBA100.
如图3所示,承载架1上设有用于感应夹紧件位置的第三光电传感器15。凸轮7上设有与第三光电传感器15相配合的第三光电感应片16,第三光电感应片16随凸轮7一同绕固定轴线转动。第三光电传感器15设有凹槽,第三光电感应片16可以伸入凹槽以与第三光电传感器15配合感应。第三光电传感器15和第三驱动件12电连接。抬升组件4位于待机位置时,凸轮7的第一处侧边与顶柱6接触,此时第三光电感应片16位于第三光电传感器15的凹槽内;需要使夹紧件夹紧PCBA100时,第三驱动件12驱动凸轮7转动,凸轮7转动过程中,当第二处侧边与顶柱6接触时,夹紧件夹紧PCBA100(此时第三光电感应片16离开第三光电传感器15的凹槽),随后凸轮7继续转动至第一处侧边与顶柱6接触,第三光电感应片16再次回到第三光电传感器15的凹槽内,第三光电传感器15发送信号至第三驱动件12,第三驱动件12驱动凸轮7停止转动。As shown in Figure 3, the carrier 1 is provided with a third photoelectric sensor 15 for sensing the position of the clamping member. The cam 7 is provided with a third photoelectric sensing piece 16 that matches the third photoelectric sensor 15 . The third photoelectric sensing piece 16 rotates around the fixed axis together with the cam 7 . The third photoelectric sensor 15 is provided with a groove, and the third photoelectric sensing piece 16 can extend into the groove to cooperate with the third photoelectric sensor 15 for sensing. The third photoelectric sensor 15 and the third driving member 12 are electrically connected. When the lifting component 4 is in the standby position, the first side of the cam 7 is in contact with the top post 6. At this time, the third photoelectric sensor piece 16 is located in the groove of the third photoelectric sensor 15; when the clamping piece needs to be clamped on the PCBA 100 , the third driving member 12 drives the cam 7 to rotate. During the rotation of the cam 7, when the second side is in contact with the top post 6, the clamping member clamps the PCBA 100 (at this time, the third photoelectric sensor sheet 16 leaves the third photoelectric sensor 15), and then the cam 7 continues to rotate until the first side is in contact with the top post 6, the third photoelectric sensor piece 16 returns to the groove of the third photoelectric sensor 15, and the third photoelectric sensor 15 sends a signal to The third driving member 12 drives the cam 7 to stop rotating.
如图3所示,承载架1上固定设有用于感应抬升组件4的纠偏位置的第四光电传感器13和用于感应抬升组件4的工作位置的第五光电传感器14,第五光电传感器14位于第四光电传感器13的正上方。第四光电传感器13和第五光电传感器14均设有凹槽,抬升组件4上设有用于伸入凹槽以与第四光电传感器13或第五光电传感器14配合感应的第四光电感应片17。第四光电感应片17随抬升组件4一同沿竖直方向移动。第四光电传感器13和第五光电传感器14分别和第二驱动件11电连接。第二驱动件11用于驱动抬升组件4在竖直方向的移动。需要使抬升组件4位于纠偏位置时,当第四光电感应片17位于第四光电传感器13的凹槽内时,第四光电传感器13发送信号至第二驱动件11,第二驱动件11驱动抬升组件4停止移动;需要使抬升组件4位于工作位置时,当第四光电感应片17位于第五光电传感器14的凹槽内时,第五光电传感器14发送信号至第二驱动件11,第二驱动件11驱动抬升组件4停止移动。As shown in Figure 3, a fourth photoelectric sensor 13 for sensing the correction position of the lifting component 4 and a fifth photoelectric sensor 14 for sensing the working position of the lifting component 4 are fixed on the carrier 1. The fifth photoelectric sensor 14 is located at Directly above the fourth photoelectric sensor 13 . Both the fourth photoelectric sensor 13 and the fifth photoelectric sensor 14 are provided with grooves, and the lifting component 4 is provided with a fourth photoelectric sensor piece 17 for extending into the groove to cooperate with the fourth photoelectric sensor 13 or the fifth photoelectric sensor 14 for sensing. . The fourth photoelectric sensing sheet 17 moves in the vertical direction together with the lifting component 4 . The fourth photoelectric sensor 13 and the fifth photoelectric sensor 14 are electrically connected to the second driving member 11 respectively. The second driving member 11 is used to drive the lifting assembly 4 to move in the vertical direction. When it is necessary to position the lifting component 4 in the correction position, when the fourth photoelectric sensor sheet 17 is located in the groove of the fourth photoelectric sensor 13, the fourth photoelectric sensor 13 sends a signal to the second driving member 11, and the second driving member 11 drives to lift. The component 4 stops moving; when the lifting component 4 needs to be in the working position, when the fourth photoelectric sensor sheet 17 is located in the groove of the fifth photoelectric sensor 14, the fifth photoelectric sensor 14 sends a signal to the second driving member 11, and the second The driving member 11 drives the lifting assembly 4 to stop moving.
在本实施方式中,所述PCBA封装装置还可以包括分别与所述第一光电传感器82、第二光电传感器92、第三光电传感器15、第四光电传感器13、第五光电传感器14、第一驱动件10、第二驱动件11、第三驱动件12电连接的控制器(图未示)。该控制器用于接收第一光电传感器82、第二光电传感器92、第三光电传感器15、第四光电传感器13、第五光电传感器14的感应信号并控制第一驱动件10、第二驱动件11、第三驱动件12的启停。In this embodiment, the PCBA packaging device may further include a first photoelectric sensor 82 , a second photoelectric sensor 92 , a third photoelectric sensor 15 , a fourth photoelectric sensor 13 , a fifth photoelectric sensor 14 , a first photoelectric sensor 14 The driving member 10, the second driving member 11, and the third driving member 12 are electrically connected to a controller (not shown). The controller is used to receive sensing signals from the first photoelectric sensor 82 , the second photoelectric sensor 92 , the third photoelectric sensor 15 , the fourth photoelectric sensor 13 , and the fifth photoelectric sensor 14 and to control the first driving member 10 and the second driving member 11 , the start and stop of the third driving member 12.
如图2所示,两条传送带2分别设置于两个承载架1相对的侧面。传送带2包括沿第一方向X依次设置的上游传送带21、中游传送带22和下游传送带23。检测工位位于上游传送带21和中游传送带22之间。工作工位设置在中游传送带22处,也即抬升组件4和夹紧件设置在中游传送带22处。阻挡机构3位于抬升组件4远离上游传送带21的一侧。抬升件沿垂直于第二方向Y的竖直平面延伸且位于两个中游传送带22之间。夹紧件沿水平面延伸且位于承载架1的顶面上。两个夹紧件相对的侧边均沿第一方向X延伸。As shown in FIG. 2 , two conveyor belts 2 are respectively arranged on opposite sides of the two carriers 1 . The conveyor belt 2 includes an upstream conveyor belt 21 , a midstream conveyor belt 22 and a downstream conveyor belt 23 which are sequentially arranged along the first direction X. The detection station is located between the upstream conveyor belt 21 and the midstream conveyor belt 22 . The working station is arranged at the midstream conveyor belt 22 , that is, the lifting assembly 4 and the clamping member are arranged at the midstream conveyor belt 22 . The blocking mechanism 3 is located on the side of the lifting assembly 4 away from the upstream conveyor belt 21 . The lifting member extends along a vertical plane perpendicular to the second direction Y and is located between the two midstream conveyor belts 22 . The clamping member extends along the horizontal plane and is located on the top surface of the carrier 1 . Opposite sides of the two clamping parts extend along the first direction X.
PCBA100通过上游传送带21传送至中游传送带22,被阻挡机构3阻挡后,被抬升组件4抬起,由夹紧件夹紧调整角度,完成封装后抬升组件4下落,使PCBA100回落至中游传送带22,再经过下游传送带23传送至下一工位。The PCBA100 is transported to the midstream conveyor belt 22 through the upstream conveyor belt 21. After being blocked by the blocking mechanism 3, it is lifted up by the lifting component 4, and is clamped by the clamping piece to adjust the angle. After the packaging is completed, the lifting component 4 falls, causing the PCBA100 to fall back to the midstream conveyor belt 22. Then it is transferred to the next work station through the downstream conveyor belt 23.
优选的,第二光电感应片91设于中游传送带22和下游传送带23之间。阻挡机构3所在位置在第一方向X上的投影位于下游传送带23靠近中游传送带22的一端附近,使得被阻挡机构3阻挡的PCBA100具有位于中游传送带22和下游传送带23之间的部分,从而PCBA100能触发第二光电感应片91。Preferably, the second photoelectric sensing sheet 91 is provided between the midstream conveyor belt 22 and the downstream conveyor belt 23 . The projection of the position of the blocking mechanism 3 in the first direction The second photoelectric sensing piece 91 is triggered.
具体的,上游传送带21、中游传送带22和下游传送带23的上表面在同一水平面上,各个传送带沿第一方向X的长度可以不同,根据需要设置具体长度即可。上游传送带21、中游传送带22和下游传送带23的数量均为两个,且在第二方向Y上相对设置。上游传送带21和中游传送带22之间、中游传送带22和下游传送带23之间各具有预定间隙,分别用于容纳第一光电感应片81和第二光电感应片91。优选的,上游传送带21、中游传送带22和下游传送带23的移动速度相等。Specifically, the upper surfaces of the upstream conveyor belt 21, the midstream conveyor belt 22 and the downstream conveyor belt 23 are on the same horizontal plane, and the lengths of the respective conveyor belts along the first direction X can be different, and the specific lengths can be set as needed. The number of the upstream conveyor belt 21 , the midstream conveyor belt 22 and the downstream conveyor belt 23 is each two, and they are arranged oppositely in the second direction Y. There are predetermined gaps between the upstream conveyor belt 21 and the midstream conveyor belt 22, and between the midstream conveyor belt 22 and the downstream conveyor belt 23, respectively for accommodating the first photoelectric sensor sheet 81 and the second photoelectric sensor sheet 91. Preferably, the moving speeds of the upstream conveyor belt 21, the midstream conveyor belt 22 and the downstream conveyor belt 23 are equal.
在一种具体的应用场景中,使用上游传送带21传送PCBA100,PCBA100位于上游传送带21和中游传送带22之间(即检测工位)时,触发第一光电传感器82,此时控制器控制第一驱动件10启动,驱动阻挡机构3从避让位置移动至阻挡位置后,第一驱动件10关停。PCBA100被阻挡机构3阻挡并同时触发第二光电传感器92,控制器控制第二驱动件11和第三驱动件12启动;第二驱动件11驱动抬升组件4从待机位置移动至纠偏位置,使PCBA100被抬高,同时第四光电传感器13被触发,控制第二驱动件11关停,第二光电传感器92失去与第二光电感应片91的感应,控制第一驱动件10启动,驱动阻挡机构3从阻挡位置移动至避让位置后,第一驱动件10关停;第三驱动件12驱动凸轮7旋转使两个夹紧件相互靠近,夹紧位于纠偏位置的抬升组件4上的PCBA100,第三驱动件12继续驱动凸轮7旋转至原始位置,第三光电传感器15被触发,控制器控制第二驱动件11启动,驱动抬升组件4从纠偏位置移动至工作位置,使PCBA100位于喷胶组件正下方,同时第五光电传感器14被触发,控制第二驱动件11关停。待喷胶组件完成喷胶后,控制第二驱动件11启动,驱动抬升组件4从工作位置移动至待机位置,PCBA100继续被下游传送带23传送至下一工位。In a specific application scenario, the upstream conveyor belt 21 is used to transport the PCBA 100. When the PCBA 100 is located between the upstream conveyor belt 21 and the midstream conveyor belt 22 (ie, the detection station), the first photoelectric sensor 82 is triggered. At this time, the controller controls the first drive The first driving member 10 is started, and after the driving blocking mechanism 3 moves from the avoidance position to the blocking position, the first driving member 10 is shut down. The PCBA 100 is blocked by the blocking mechanism 3 and triggers the second photoelectric sensor 92 at the same time. The controller controls the second driving member 11 and the third driving member 12 to start; the second driving member 11 drives the lifting assembly 4 to move from the standby position to the correction position, so that the PCBA 100 is raised, and at the same time the fourth photoelectric sensor 13 is triggered, controlling the second driving member 11 to shut down, the second photoelectric sensor 92 loses induction with the second photoelectric sensing piece 91, controls the first driving member 10 to start, and drives the blocking mechanism 3 After moving from the blocking position to the avoidance position, the first driving part 10 is shut down; the third driving part 12 drives the cam 7 to rotate so that the two clamping parts are close to each other and clamp the PCBA 100 on the lifting assembly 4 in the correction position. The driving member 12 continues to drive the cam 7 to rotate to the original position, the third photoelectric sensor 15 is triggered, the controller controls the second driving member 11 to start, and drives the lifting assembly 4 to move from the correction position to the working position, so that the PCBA 100 is located directly below the glue spray assembly , and at the same time, the fifth photoelectric sensor 14 is triggered, controlling the second driving member 11 to shut down. After the glue spraying component completes the glue spraying, the second driving component 11 is controlled to start, driving the lifting component 4 to move from the working position to the standby position, and the PCBA 100 continues to be transported to the next work station by the downstream conveyor belt 23.
在本实施方式中,工作台18可以设置于支撑架19上。工作台18上还可以设有用于驱动其中一个承载架1沿第二方向Y移动的第四驱动件20。本实施方式中的第一驱动件10、第二驱动件11、第三驱动件12和第四驱动件20可以均为电机,或者根据需要设置合适的驱动件类型。In this embodiment, the workbench 18 can be disposed on the support frame 19 . The workbench 18 may also be provided with a fourth driving member 20 for driving one of the carriers 1 to move along the second direction Y. In this embodiment, the first driving member 10 , the second driving member 11 , the third driving member 12 and the fourth driving member 20 may all be motors, or appropriate driving member types may be provided as needed.
如图4所示,本申请实施方式还提供一种PCBA偏移调整方法,包括以下步骤:As shown in Figure 4, the embodiment of the present application also provides a PCBA offset adjustment method, which includes the following steps:
步骤S10:将PCBA100移送至工作工位;Step S10: Move PCBA100 to the work station;
步骤S20:将移送至工作工位的PCBA100抬升至纠偏位置;Step S20: Lift the PCBA100 transferred to the work station to the deviation correction position;
步骤S30:控制纠偏机构5水平夹紧PCBA100进行纠偏,在纠偏后将PCBA100释放;Step S30: Control the correction mechanism 5 to clamp the PCBA100 horizontally for correction, and release the PCBA100 after correction;
步骤S40:再次抬升PCBA100至工作位置执行喷涂封装。Step S40: Lift PCBA100 to the working position again to perform spraying and encapsulation.
本实施方式所提供的PCBA偏移调整方法,可以采用上述任一种PCBA封装装置执行。该方法实施方式与装置实施方式相对应,其能够解决装置实施方式所解决的技术问题,相应的达到装置实施方式的技术效果,具体的本申请在此不再赘述。The PCBA offset adjustment method provided in this embodiment can be performed using any of the above-mentioned PCBA packaging devices. The method implementation corresponds to the device implementation, which can solve the technical problems solved by the device implementation, and accordingly achieves the technical effects of the device implementation. The specific details will not be repeated here.
在本实施方式中,PCBA移送至工作工位后,可以通过抬升组件4抬升至纠偏位置,此时纠偏机构5可以水平夹紧PCBA进行纠偏,以调整PCBA的角度,并在纠偏后将PCBA释放,从而能快速可靠地在封装前调整PCBA的角度,避免PCBA偏移。纠偏将PCBA释放后,可以通过抬升组件4进一步抬升PCBA至工作位置,从而对PCBA执行喷涂封装,完成封装。In this embodiment, after the PCBA is transferred to the work station, it can be lifted to the correction position by the lifting assembly 4. At this time, the correction mechanism 5 can clamp the PCBA horizontally for correction to adjust the angle of the PCBA, and release the PCBA after correction. , so that the angle of the PCBA can be quickly and reliably adjusted before packaging to avoid PCBA deviation. After the PCBA is corrected and released, the PCBA can be further lifted to the working position by lifting the component 4, thereby spraying and encapsulating the PCBA to complete the encapsulation.
需要说明的是,在本说明书的描述中,术语“第一”、“第二”等仅用于描述目的和区别类似的对象,两者之间并不存在先后顺序,也不能理解为指示或暗示相对重要性。此外,在本说明书的描述中,除非另有说明,“多个”的含义是两个或两个以上。It should be noted that in the description of this specification, the terms "first", "second", etc. are only used for descriptive purposes and to distinguish similar objects. There is no order between the two, nor can it be understood as indicating or implies relative importance. Furthermore, in the description of this specification, "plurality" means two or more unless otherwise specified.
本文引用的任何数值都包括从下限值到上限值之间以一个单位递增的下值和上值的所有值,在任何下值和任何更高值之间存在至少两个单位的间隔即可。举例来说,如果阐述了一个部件的数量或过程变量(例如温度、压力、时间等)的值是从1到90,优选从20到80,更优选从30到70,则目的是为了说明该说明书中也明确地列举了诸如15到85、22到68、43到51、30到32等值。对于小于1的值,适当地认为一个单位是0.0001、0.001、0.01、0.1。这些仅仅是想要明确表达的示例,可以认为在最低值和最高值之间列举的数值的所有可能组合都是以类似方式在该说明书明确地阐述了的。Any numerical value quoted herein includes all values from the lower value to the upper value in increments of one unit from the lower value to the upper value, with a separation of at least two units between any lower value and any higher value i.e. Can. For example, if it is stated that the quantity of a component or the value of a process variable (e.g. temperature, pressure, time, etc.) is from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, the purpose is to illustrate that The instructions also clearly list values such as 15 to 85, 22 to 68, 43 to 51, 30 to 32, etc. For values less than 1, it is appropriate to consider a unit to be 0.0001, 0.001, 0.01, 0.1. These are merely examples intended to make it clear that all possible combinations of numerical values listed between the lowest value and the highest value are considered to be explicitly set out in this description in a similar manner.
除非另有说明,所有范围都包括端点以及端点之间的所有数字。与范围一起使用的“大约”或“近似”适合于该范围的两个端点。因而,“大约20到30”旨在覆盖“大约20到大约30”,至少包括指明的端点。Unless otherwise stated, all ranges include the endpoints and all numbers between the endpoints. When used with a range, "about" or "approximately" applies to both endpoints of the range. Thus, "about 20 to about 30" is intended to cover "about 20 to about 30", at least including the indicated endpoints.
披露的所有文章和参考资料,包括专利申请和出版物,出于各种目的通过援引结合于此。描述组合的术语“基本由…构成”应该包括所确定的元件、成分、部件或步骤以及实质上没有影响该组合的基本新颖特征的其他元件、成分、部件或步骤。使用术语“包含”或“包括”来描述这里的元件、成分、部件或步骤的组合也想到了基本由这些元件、成分、部件或步骤构成的实施方式。这里通过使用术语“可以”,旨在说明“可以”包括的所描述的任何属性都是可选的。All articles and references disclosed, including patent applications and publications, are hereby incorporated by reference for all purposes. The term “consisting essentially of” when describing a combination shall include the identified element, component, component or step as well as other elements, components, components or steps that do not materially affect the essential novel character of the combination. The use of the term "comprises" or "comprising" to describe a combination of elements, components, parts or steps herein also contemplates embodiments that consist essentially of such elements, components, parts or steps. By using the term "may" herein, it is intended that any described attribute included in "may" is optional.
多个元件、成分、部件或步骤能够由单个集成元件、成分、部件或步骤来提供。另选地,单个集成元件、成分、部件或步骤可以被分成分离的多个元件、成分、部件或步骤。用来描述元件、成分、部件或步骤的公开“一”或“一个”并不说为了排除其他的元件、成分、部件或步骤。Multiple elements, components, components or steps can be provided by a single integrated element, component, component or step. Alternatively, a single integrated element, component, component or step may be divided into separate multiple elements, components, components or steps. The word "a" or "an" used to describe an element, component, component or step is not intended to exclude other elements, components, components or steps.
应该理解,以上描述是为了进行图示说明而不是为了进行限制。通过阅读上述描述,在所提供的示例之外的许多实施方式和许多应用对本领域技术人员来说都将是显而易见的。因此,本教导的范围不应该参照上述描述来确定,而是应该参照所附权利要求以及这些权利要求所拥有的等价物的全部范围来确定。出于全面之目的,所有文章和参考包括专利申请和公告的公开都通过参考结合在本文中。在前述权利要求中省略这里公开的主题的任何方面并不是为了放弃该主体内容,也不应该认为发明人没有将该主题考虑为所公开的发明主题的一部分。It should be understood that the above description is for purposes of illustration rather than limitation. Many embodiments and many applications beyond the examples provided will be apparent to those skilled in the art from reading the above description. The scope of the present teachings, therefore, should be determined, not with reference to the above description, but rather with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. For purposes of comprehensiveness, the disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference. The omission of any aspect of the subject matter disclosed herein from the preceding claims is not intended to be a disclaimer of that subject matter, nor should it be deemed that the inventors failed to consider such subject matter to be part of the disclosed inventive subject matter.
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