CN116984974A - Adjustable wafer loading and unloading platform - Google Patents

Abstract

The invention discloses an adjustable wafer loading and unloading platform, which comprises: the polishing head guide support seat is provided with a positioning clamping groove which can be matched with the polishing head; the lifting table is used for receiving the wafer and moving up and down relative to the polishing head guide support seat, and is concentric and coaxial with the positioning clamping groove; the guide blocks are distributed along the circumferential direction of the polishing head guide support seat; the relative positions of the guide blocks and the polishing head guide support seat are optional, or/and the relative positions of the guide blocks and the polishing head guide support seat are optional, so that the diameter of a space formed by the surrounding of the guide blocks can be changed. In the butt joint process of the polishing head and the loading platform, the concentric coaxiality of the wafer, the lifting platform and the polishing head guide support seat can be effectively ensured, so that the concentric coaxiality of the wafer and different transmission parts can be ensured in the wafer transmission process, the effective implementation of the wafer processing technology is facilitated, the subsequent wafer transmission is facilitated, and the success rate of the wafer taking by the manipulator is improved; the loading and unloading platform can adapt to wafers with different sizes, and the use flexibility is high.

Description

An adjustable wafer loading and unloading platform

Technical field

The invention belongs to the technical field of semiconductor integrated circuit chip manufacturing, and in particular relates to an adjustable wafer loading and unloading station.

Background technique

Chemical Mechanical Planarization (CMP) equipment usually includes a semiconductor equipment front-end module (EFEM), a cleaning unit and a polishing unit. EFEM mainly includes a wafer storage cassette, a wafer transfer robot and an air purification system; the cleaning unit mainly includes a varying number of megasonic cleaning components, roller brush cleaning components, drying components and devices for transferring wafers between components, etc. ; The polishing unit mainly includes polishing table, polishing head, polishing liquid supply system and polishing pad dressing system.

In recent years, with the rapid development of the semiconductor industry, CMP has gradually been applied to the polishing of third-generation semiconductor wafers. And as the processing technology of third-generation semiconductor wafers continues to be optimized, the size develops from 6 inches to 8 inches, and there is a need for wafer polishing with wafer sizes ranging from 6 inches to 12 inches. Therefore, the loading and unloading station needs to be compatible with many different wafer sizes.

Contents of the invention

In order to overcome the shortcomings of the prior art, the present invention provides an adjustable wafer loading and unloading table, which can support and load and unload wafers of various diameters, and the loaded wafers are concentric and coaxial with the lifting table and polishing head.

The technical solution adopted by the present invention to solve the technical problem is: an adjustable wafer loading and unloading station, including:

The polishing head guide support base has a positioning slot that can cooperate with the polishing head;

A lifting platform is used to receive the wafer and move up and down relative to the polishing head guide support base. The lifting platform is concentric and coaxial with the positioning slot;

Guide blocks, arranged along the circumferential direction of the polishing head guide support seat;

The guide block is optional, or/and the relative position of the guide block and the polishing head guide support seat is optional, so as to change the diameter of the space formed by the guide block.

The present invention can change the diameter of the space formed by the guide block by selecting the guide block, or by selecting the positional relationship between the guide block and the center of the polishing head guide support base, or a combination of the above two methods. When the polishing head When transferring the wafer to the loading and unloading table, it is only necessary to achieve the coaxiality of the polishing head and the positioning slot. Finally, the concentricity of the wafer, the lifting table, and the positioning slot can be achieved, that is, the guide block surrounds the wafer. Wafers of different diameters can be accurately placed in the space to ensure the effectiveness of the next wafer transfer action. The loading and unloading table can adapt to wafers of different sizes and is highly flexible in use.

Furthermore, the side of the guide block facing the wafer is provided with an inclined guide surface that can offset the side wall of the wafer. The inclined guide surface tilts from top to bottom in the direction close to the central axis of the lifting table. When the lifting table receives the wafer, the lifting table and the wafer are not necessarily concentric. As the wafer contacts the guide block, the wafer can move against the guide block. Slide along the inclined guide surface so that with the cooperation of the guide block, the wafer can be concentric and coaxial with the lifting table.

Further, the number of the inclined guide surfaces is one or two or more. When the number is two or more, the interface between the wafer and the adjacent inclined guide surfaces offsets each other. When the number of inclined guide surfaces is two, the intersection of the wafer and the two inclined guide surfaces offsets each other, which clamps the wafer more firmly, effectively ensuring that the wafer is on a horizontal plane without adversely affecting the wafer surface.

Further, the polishing head guide support seat is provided with a slide groove, the slide groove extends along the radial direction of the polishing head guide support seat, and the guide block can move relative to the slide groove. The setting of the chute limits the moving direction of the guide block and ensures that the guide block translates along the radial direction.

Further, the guide block is locked by fasteners after moving relative to the slide groove to the target position. The guide block is fixedly connected to the polishing head guide support seat, so that the space formed by the guide block cannot be changed at will.

Further, the bottom or side of the chute is provided with multiple sets of sockets along the radial direction, and the bottom or side of the guide block is provided with positioning posts, which can be inserted into the sockets to realize the alignment of the guide block and the polishing head. The positioning and matching of the guide support seat. The positioning post can be selectively inserted into sockets with different diameters as needed to achieve changes in the diameter of the space surrounding the guide block. It is easy to adjust and the adjustment position is relatively accurate.

Further, the chute or its corresponding area is marked with scale lines. It is convenient for the operator to adjust the installation position of the guide block intuitively.

Further, the side wall of the polishing head guide support seat forms a notch for the guide block to extend. The moving stroke of the guide block is increased to accommodate wafers of more sizes.

Furthermore, the polishing head guide support base has a limiting step, which is concentric and coaxial with the positioning slot, and the slide groove is opened on the limiting step.

Further, the limiting step and the positioning slot share a surface. The limiting step not only forms a positioning slot, but also facilitates the formation of the chute, and the structural design is ingenious.

Furthermore, the size of the guide block can be selected, and guide blocks of different sizes can be detachably connected to the chute to change the diameter of the space formed by the guide block. When the size of the guide block selected is larger, the diameter of the space surrounding it is relatively small and suitable for small-sized wafers. When the size of the guide block selected is large, the diameter of the space surrounding it is relatively large and suitable for Large size wafers.

Further, the number of the guide blocks is two or more.

Further, the guide block moves the same or different distances to limit the movement of the wafer.

Further, it also includes a centering piece, which includes a main body part that can be adapted to extend into the positioning slot, and a centering part that is concentric and coaxial with the main body part, and the guide block moves relative to the polishing head guide support base to be in line with the positioning slot. After the middle parts are offset, they are positioned, and the centering piece is separated from the polishing head guide support seat. Using different centering parts, the guide block can be adjusted quickly, with easy operation and accurate position adjustment.

Furthermore, the centering parts are optional. The main parts of different centering parts are the same and the center parts are changed.

Further, the number of the guide blocks is 4-6. The problem of wafers with trimmed edges can be solved by having different guide blocks with different sizes, or different relative positions of the guide blocks and the chute. Even if the wafer has one or two trimmed edges, the problem with the centering piece can be solved. With cooperation, the wafer can also be aligned with the lifting table, and the adaptability is higher.

Further, the number of guide blocks is 6 or more. By setting 6 or more guide blocks, it can adapt to wafers of different sizes and with trimmed edges.

The beneficial effects of the present invention are: 1) During the docking process between the polishing head and the loading and unloading table, the concentricity and coaxiality of the wafer, the lifting table and the polishing head guide support seat can be effectively ensured, so that the wafer transmission process can ensure the coherence with different transmission components. Concentric and coaxial, it facilitates the effective wafer processing process, facilitates subsequent wafer transmission, and improves the success rate of wafer removal by the robot; 2) The loading and unloading table can adapt to wafers of different sizes and has high flexibility in use; 3) Guidance The block is in contact with the side wall of the wafer without affecting the wafer surface and minimizing wafer defects; 4) The guide block is easy to adjust and the adjustment position is relatively accurate; 5) Using different centering parts, the guide block can be quickly adjusted It is easy to adjust and operate, and the position adjustment is accurate.

Description of drawings

Figure 1 is a top view of the present invention and the polishing head.

Figure 2 is a front view of the present invention and the polishing head.

Figure 3 is a cross-sectional view along line A-A in Figure 2 .

Figure 4 is an enlarged view of the structure at B in Figure 3.

Figure 5 is a front view of the polishing head in Embodiment 1 of the present invention.

Fig. 6 is a cross-sectional view along line C-C in Fig. 5 .

FIG. 7 is a top view of Embodiment 1 of the present invention. At this time, a wafer is received on the lifting platform.

Figure 8 is a perspective view of Embodiment 1 of the present invention. At this time, a wafer is received on the lifting platform.

Figure 9 is an enlarged view of the structure at D in Figure 8.

Figure 10 is a perspective view of the guide block in Embodiment 1 of the present invention.

Figure 11 is an enlarged view of the structure at F in Figure 15.

Figure 12 is a schematic three-dimensional structural diagram in Embodiment 1 of the present invention.

Figure 13 is an enlarged view of the structure at G in Figure 12.

Figure 14 is a top view of Embodiment 2 of the present invention.

FIG. 15 is a cross-sectional view along E-E in FIG. 14 .

Figure 16 is a top view of the third embodiment of the present invention.

Figure 17 is an enlarged view of the structure at H in Figure 16.

Figure 18 is a schematic diagram of the matching structure of the guide block and the lifting platform in the third embodiment of the present invention.

Figure 19 is a perspective view of the guide block in Embodiment 3 of the present invention.

Figure 20 is a schematic diagram of a partial structure in Embodiment 4 of the present invention.

FIG. 21 is a schematic diagram of the matching structure of the guide block and the wafer in Embodiment 6 of the present invention.

Figure 22 is a schematic diagram of wafer trimming in Embodiment 6 of the present invention.

Among them, 1-polishing head guide support seat, 11-positioning slot, 12-slide, 13-jack, 14-notch, 15-limiting step, 16-travel groove, 2-lifting table, 3-crystal Circle, 31-wafer trimming, 4-guide block, 40-fixing hole, 41-inclined guide surface, 42-fastener, 43-positioning post, 5-centering piece, 51-main part, 52-pair Middle part, 6- polished head.

Detailed ways

In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only These are some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts should fall within the scope of protection of the present invention.

As shown in Figures 1 to 4, an adjustable wafer loading and unloading station includes a polishing head guide support base 1, a lifting platform 2 for receiving wafer 3, and is arranged along the circumferential direction of the polishing head guide support base 1 guide block 4. The polishing head guide support base 1 has a positioning slot 11 that can cooperate with the polishing head 6. The cooperation here means that the lower part of the polishing head 6 can be just stuck in the positioning slot 11, and the two form a radial limit fit. . The lifting table 2 can move up and down relative to the polishing head guide support base 1, and the lifting table 2 is concentric and coaxial with the positioning slot 11. In other words, the lifting table 2 and the polishing head guide support base 1 are concentric and coaxial.

In the first form, the guide block 4 is optional, so that the diameter of the space surrounded by the guide block 4 changes.

In the second form, the relative positions of the center of the circle of the guide block 4 and the polishing head guide support base 1 are selectable, so that the diameter of the space surrounded by the guide block 4 changes.

One of the above two forms can be selected, or both forms can exist at the same time to adapt to the loading and unloading of wafers of different diameters.

Embodiment 1

As shown in Figures 5 to 14, an adjustable wafer loading and unloading station is based on the above structure. The polishing head guide support base 1 is provided with a chute 12. The chute 12 is along the diameter of the polishing head guide support base 1. Extending in the direction, the side wall of the polishing head guide support base 1 forms a notch 14 for the guide block 4 to extend. The guide block 4 can move relative to the slide groove 12 , that is, the relative position of the guide block 4 and the polishing head guide support base 1 changes.

As shown in Figures 7 to 9, the polishing head guide support base 1 has a limiting step 15, which is concentric and coaxial with the positioning slot 11, and the slide groove 12 is located at the limiting step 15. In other words, the limiting steps 15 are discontinuous, and the end surfaces at the discontinuities form the side walls of the chute 12 . The limiting step 15 is formed on the lower surface of the positioning slot 11 . In other words, the top surface of the limiting step 15 is the bottom surface of the positioning slot 11 . The limiting step 15 and the positioning slot 11 share the same surface.

The number of guide blocks 4 is two or more. In this embodiment, the number of guide blocks 4 is three, and they are arranged at intervals along the circumferential direction of the polishing head guide support base 1 .

The side of the guide block 4 facing the wafer 3 is provided with an inclined guide surface 41 that can offset the side wall of the wafer 3. In this embodiment, as shown in Figure 10, the number of the inclined guide surfaces 41 is two. The inclined guide surface 41 forms an obtuse angle. The inclined guide surface 41 is inclined from top to bottom in a direction close to the central axis of the lifting platform 2, and the angle between the upper inclined guide surface 41 and the horizontal line is greater than the angle between the lower inclined guide surface 41 and the horizontal line. corner, the wafer 3 falls along the upper inclined guide surface 41 until it contacts the lower inclined guide surface, so that the interface between the wafer 3 and the adjacent inclined guide surface 41 offsets, as shown in Figure 11. At this time, the wafer 3 Be securely clamped. Of course, in other embodiments, the number of inclined guide surfaces 41 may also be multiple, and is not specifically limited.

As shown in FIGS. 12 and 13 , a stroke groove 16 is provided in the lower part of the polishing head guide support base 1 . The stroke groove 16 extends along the radial direction of the polishing head guide support base 1 and is arranged vertically corresponding to the chute 12 . A fixing hole 40 is opened at the bottom of the guide block 4. When the guide block 4 moves to the target position relative to the chute 12, it is locked by the fastener 42. Specifically, the fastener 42 may be a screw, which passes through the travel groove 16 and is threadedly connected to the fixing hole 40 .

Since the three guide blocks 4 need to move relative to the chute 12 to be on the same circumferential surface, the moving distances of the guide blocks 4 relative to the chute 12 need to be consistent. In order to facilitate adjustment, the side walls of the chute 12 or the corresponding The area is marked with a scale mark, for example, a scale mark is marked at the position of the stroke groove 16. The sliding direction and distance of the guide block 4 can be intuitively judged through the scale mark.

The usage process of the present invention is to move the guide block 4 to the target position according to the outer diameter of the wafer 3 to be loaded. The movement of the guide block 4 can be realized manually or through an automatic mechanism, such as a motor or a cylinder driving it. Automatically travel, and the positions are fixed by fasteners 42, so that the diameter of the space surrounded by the three guide blocks 4 is the diameter of the wafer 3 to be loaded, to be precise, it is the two inclined guide surfaces of the three guide blocks 4 The diameter of the space formed by the junction of 41 is the diameter of the wafer 3 to be loaded, and the space formed by the surrounding space is concentric and coaxial with the lifting table 2 and the positioning slot 11; the polishing head 6 moves to the loading and unloading table with the wafer 3. , the polishing head 6 moves close to the polishing head guide support 1, and its lower part is inserted into the positioning slot 11, thereby realizing the concentricity of the polishing head 6 and the positioning slot 11; the lifting table 2 receives the wafer 3 on the polishing head 6 Descend, at this time it is not sure whether the wafer 3 is concentric with the lifting table 2. When the wafer 3 contacts the guide block 4, it slides downward against the upper inclined guide surface 41 until it falls between the two inclined guide surfaces. At the junction, at this time, the wafer 3 is coaxial with the lifting table 2 and the positioning slot 11, which facilitates the next transfer action.

Embodiment 2

As shown in Figures 14 and 15, in this embodiment, a centering piece 5 is also included. The centering piece 5 includes a main body part 51 that can be adapted to extend into the positioning slot 11, and a centering part 51 that is concentric and coaxial with the main body part 51. Central 52. The centering part 5 is optional, that is, the center part 52 can be of various types. The main body part 51 of each model is the same, and the center part 52 is different, that is, the outer diameter of the center part 52 is different.

When in use, the centering part 52 is adapted to the diameter of the wafer 3 to be loaded. The centering part 52 is located below the main part 51. The main part 51 of the centering part 5 extends into the positioning slot 11, and then the guide The block 4 moves relative to the polishing head guide support base 1 until it abuts against the outer wall of the central part 52 and fixes the guide block 4. At this time, multiple guide blocks 4 are located on the same circumferential surface and define a space with the same diameter as the wafer 3 to be loaded. . The centering piece 52 is separated from the polishing head guide support base 1 .

The polishing head 6 moves to the loading and unloading table with the wafer 3. The polishing head 6 moves close to the polishing head guide support 1, and its lower part is inserted into the positioning slot 11, thereby realizing the concentricity of the polishing head 6 and the positioning slot 11; lifting The stage 2 receives the wafer 3 on the polishing head 6 and then descends. At this time, it is not sure whether the wafer 3 is concentric and coaxial with the lifting stage 2. When the wafer 3 contacts the guide block 4, it moves upward against the upper inclined guide surface 41. Slide downward until it lands at the junction of the two inclined guide surfaces. At this time, the wafer 3 is concentric with the lifting table 2 and the positioning slot 11, which facilitates the next transfer action.

Other structures are the same as those in Embodiment 1 and will not be described again.

Embodiment 3

As shown in Figures 16 to 19, the bottom of the chute 12 is provided with multiple sets of sockets 13 in the radial direction, and the bottom of the guide block 4 is provided with positioning posts 43. The positioning posts 43 can be inserted into the sockets 13, thereby achieving the purpose of The positioning and matching of the polishing head guide support base 1. When the diameter of the space formed by the guide block 4 needs to be changed, the positioning post 43 of the guide block 4 can be inserted into different sockets 13 to achieve this.

Of course, the above-mentioned insertion hole 13 can also be provided on the side of the chute 12 , in which case the positioning post 43 is located at a corresponding position on the side of the guide block 4 .

Other structures are the same as those in Embodiment 1 and will not be described again.

Embodiment 4

As shown in Figure 20, in this embodiment, the number of inclined guide surfaces 41 is one. At this time, the diameter of the space formed by the inner wall of the guide block 4 is adapted to the diameter of the wafer 3 to be loaded. It is also through the guide The inner side walls of the block 4 clamp the wafer 3 .

Other structures are the same as those in Embodiment 1 and will not be described again.

Embodiment 5

In this embodiment, instead of adjusting the relative position of the guide block 4 and the polishing head guide support base 1, the guide blocks 4 of different sizes are selected, that is, the guide blocks 4 of different sizes are detachably connected to the chute 12. Same location. When the size of the guide block 4 is selected to be larger, the diameter of the space surrounding it is relatively small, which is suitable for small-sized wafers. When the size of the guide block 4 is selected to be large, the diameter of the space surrounding it is relatively large. Suitable for large size wafers.

Of course, it can also be detachably connected at different positions of the chute 12, and there is no specific limitation.

Other structures are the same as those in Embodiment 1 and will not be described again.

Embodiment 6

As shown in Figure 21, in this embodiment, two or more groups of inclined guide surfaces 41 can be provided on the guide block 4. An adjacent group of inclined guide surfaces 41 are arranged up and down along the inner wall of the guide block 4. Each group The inclined guide surface 41 includes an upper inclined guide surface and a lower inclined guide surface. Therefore, one guide block 4 can adapt to the positioning of wafers 3 of different sizes.

Embodiment 7

As shown in Figure 22, at this time, the wafer 3 has a trimming edge 31, and the number of the guide blocks 4 is 4-6. In this embodiment, the centering piece 5 in the second embodiment needs to be used. During use, take the main part 51 of the centering part 5 and extend it into the positioning slot 11, then move the guide block 4 relative to the polishing head guide support base 1 until it abuts against the outer wall of the centering part 52, and fix the guide block 4. At this time, if The guide block 4 uses an automatic mechanism to move. It automatically stops moving after touching the outer wall of the central part 52. Multiple guide blocks 4 are located on the same circumferential surface and define a space with the same diameter as the wafer 3 to be loaded. Since the number of guide blocks 4 is four or more and they are evenly distributed around the circumference, even if there is a cutting edge 31 on the wafer 3, at least three guide blocks 4 can contact the arc surface of the wafer 3, and these three guide blocks The central angle of the arc formed by the points 4 is equal to or exceeds 180°, so the position of the wafer 3 can be accurately determined. According to the relationship between the area of the trimming edge 31 and the diameter of the wafer 3 and the distribution of the guide blocks 4, the number of the guide blocks 4 is preferably six, which can adapt to the wafer 3 with one or two trimming edges 31.

Different guide blocks 4 move the same or different distances, thereby limiting the movement of the wafer 3 and preventing the wafer 3 from being translated or rotated.

The centering piece 52 is separated from the polishing head guide support base 1 . The polishing head 6 moves to the loading and unloading table with the wafer 3. The polishing head 6 moves close to the polishing head guide support 1, and its lower part is inserted into the positioning slot 11, thereby realizing the concentricity of the polishing head 6 and the positioning slot 11; lifting The stage 2 receives the wafer 3 on the polishing head 6 and then descends. At this time, it is not sure whether the wafer 3 is concentric and coaxial with the lifting stage 2. When the wafer 3 contacts the guide block 4, it moves upward against the upper inclined guide surface 41. Slide downward until it lands at the junction of the two inclined guide surfaces. At this time, the wafer 3 is concentric with the lifting table 2 and the positioning slot 11, which facilitates the next transfer action.

According to the relationship between the area of the trimmed edge of the wafer 3, the diameter of the wafer 3, and the distribution of the guide blocks 4, it is inferred that when the number of the guide blocks 4 is 6 or more, it can adapt to wafers of different sizes with trimmed edges. .

The above-mentioned specific embodiments are used to explain the present invention, rather than to limit the present invention. Within the spirit of the present invention and the protection scope of the claims, any modifications and changes made to the present invention fall within the protection scope of the present invention.

Claims (17)

1. An adjustable wafer handling station, comprising:

a polishing head guide support seat (1) which is provided with a positioning clamping groove (11) matched with the polishing head (6);

the lifting table (2) is used for receiving the wafer (3) and moving up and down relative to the polishing head guide support seat (1), and the lifting table (2) and the positioning clamping groove (11) are concentric and coaxial;

the guide blocks (4) are distributed along the circumferential direction of the polishing head guide support seat (1);

the guide block (4) is optional, or/and the relative position of the guide block (4) and the polishing head guide support seat (1) is optional, so that the diameter of a space formed by the surrounding of the guide block (4) can be changed.

2. The adjustable wafer handling platform of claim 1, wherein: the side of the guide block (4) facing the wafer (3) is provided with an inclined guide surface (41) which can be propped against the side wall of the wafer (3).

3. The adjustable wafer handling station of claim 2, wherein: the number of the inclined guide surfaces (41) is one or two or more, and when the number of the inclined guide surfaces is two or more, the wafer (3) is abutted against the junction of the adjacent inclined guide surfaces (41).

4. The adjustable wafer handling platform of claim 1, wherein: the polishing head guide support seat (1) is provided with a chute (12), the chute (12) extends along the radial direction of the polishing head guide support seat (1), and the guide block (4) can move relative to the chute (12).

5. The adjustable wafer handling platform of claim 4, wherein: the guide block (4) is locked by a fastener (42) after moving to a target position relative to the chute (12).

6. The adjustable wafer handling platform of claim 4, wherein: the bottom or the side part of the sliding groove (12) is provided with a plurality of groups of jacks (13) along the radial direction, the bottom or the side part of the guide block (4) is provided with a positioning column (43), and the positioning column (43) can be inserted into the jacks (13) so as to realize the positioning fit of the guide block (4) and the polishing head guide support seat (1).

7. The adjustable wafer handling platform of claim 4, wherein: the chute (12) or the corresponding area is marked with graduation marks.

8. The adjustable wafer handling platform of claim 4, wherein: the side wall of the polishing head guide support seat (1) is provided with a notch part (14) for the guide block (4) to extend out.

9. The adjustable wafer handling platform of claim 4, wherein: the polishing head guide support seat (1) is provided with a limiting step (15) which is concentric and coaxial with the positioning clamping groove (11), and the sliding groove (12) is formed in the limiting step (15).

10. The adjustable wafer handling platform of claim 9, wherein: the limiting step (15) and the positioning clamping groove (11) share one surface.

11. The adjustable wafer handling platform of claim 4, wherein: the size of the guide block (4) is optional, and the guide blocks (4) with different sizes are detachably connected with the sliding groove (12) so as to change the space diameter formed by surrounding the guide blocks (4).

12. The adjustable wafer handling platform of claim 1, wherein: the number of the guide blocks (4) is two or more.

13. The adjustable wafer handling platform of claim 12, wherein: the guide blocks (4) are moved the same or different distances to limit the movement of the wafer (3).

14. The adjustable wafer handling platform of claim 1, wherein: the centering piece (5) comprises a main body part (51) which can be inserted into the positioning clamping groove (11) in an adapting mode, and a centering part (52) which is concentric and coaxial with the main body part (51), wherein the guide block (4) moves relative to the polishing head guide support seat (1) to be positioned against the centering part (52), and the centering piece (5) is separated from the polishing head guide support seat (1).

15. The adjustable wafer handling platform of claim 14, wherein: the centering members (5) are optional, the body portions (51) of different centering members (5) being identical, the centering portions (52) being varied.

16. The adjustable wafer handling platform of claim 1, wherein: the number of the guide blocks (4) is 4-6.

17. The adjustable wafer handling platform of claim 1, wherein: the number of the guide blocks (4) is 6 or more.