CN116964932A - Piezoelectric vibration device manufacturing apparatus and piezoelectric vibration device manufacturing method - Google Patents

Abstract

The present invention provides a piezoelectric vibration device manufacturing apparatus and a piezoelectric vibration device manufacturing method capable of arranging a plurality of piezoelectric elements on a plurality of holding members in a predetermined position and a predetermined orientation. It has an adsorption head moving device (12) for reciprocating a plurality of adsorption heads (20) simultaneously. The plurality of adsorption heads (20) respectively adsorb the piezoelectric elements (P) through the adsorption nozzles (28). At least one of the horizontal movement mechanism (21) for the suction head, the vertical movement mechanism (24) for the suction head, and the rotational movement mechanism (26) for the suction head is based on a plurality of piezoelectric sensors that respectively adsorb with the plurality of suction nozzles (28). The information on the position of the component (P) and the information on the positions of the plurality of holding members (H) supplied to the holding member supply position (Sh) are independently adjusted so that the position of the suction nozzle (28) can be adjusted individually. The piezoelectric elements (P) sucked by the plurality of suction nozzles (28) are respectively arranged on corresponding holding members (H).

Description

Piezoelectric vibration device manufacturing device and piezoelectric vibration device manufacturing method

Technical field

The present invention relates to a piezoelectric vibration device manufacturing device and a piezoelectric vibration device manufacturing method.

Background technique

Piezoelectric vibration devices include, for example, a crystal vibrator using a crystal vibrating piece. The crystal resonator includes a crystal vibrating piece as a piezoelectric element and a holding member that holds the crystal vibrating piece. The crystal resonator holds the crystal vibrating piece in a box-shaped holding member made of an insulator such as ceramic. The crystal resonator is packaged in a state where the electrodes of the crystal vibrating piece are joined to the electrodes in the holding member.

In a piezoelectric vibration device manufacturing apparatus that manufactures such a piezoelectric vibration device, the piezoelectric element and the holding member are supplied separately. The piezoelectric vibration device manufacturing apparatus arranges the piezoelectric element supplied from a transfer device such as a suction head in the holding member coated with a bonding material. In this case, the piezoelectric element needs to be arranged in the holding member so that parts other than electrodes do not come into contact with the holding member. Then, the piezoelectric vibration device manufacturing apparatus is known in which the piezoelectric element positioned relative to the transfer device is arranged in the holding member. For example, Patent Document 1 discloses a component mounting device that positions a supplied component component and then mounts the component component on a component mounting component wafer.

The component mounting device described in Patent Document 1 includes a tray that is temporarily placed in order to position a plurality of the component components. The tray has a plurality of recesses for temporarily placing the component parts. The wall surface of the recess is inclined in the depth direction and exposed on the opening side of the recess. The element component inserted into the recessed part slides on the wall surface of the recessed part and is arranged on the bottom surface of the recessed part. The element component is positioned on the bottom surface of the recessed part through the wall surface of the recessed part. The component mounting device transports the plurality of component components positioned on the bottom surfaces of the plurality of recessed portions onto the component mounting component wafer. Thereby, the component mounting device can arrange the plurality of component components in predetermined directions at predetermined positions on the component mounting component wafer.

existing technical documents

patent documents

Patent Document 1: Japanese Patent Application Publication No. 2012/99560

Contents of the invention

The technical problem to be solved by the invention

The component loading device transports the plurality of supplied components to the tray by sucking the moving unit, and positions the components in the tray. Furthermore, the component mounting device adsorbs the plurality of component components positioned on the tray by the suction portion of the suction moving unit, and transports the component mounting component wafer to the component mounting component wafer. Therefore, there is a possibility that the position and orientation of the plurality of component parts may shift relative to the position positioned on the tray when the component parts are adsorbed. In addition, in order to arrange the component parts in the recessed part, the recessed part of the tray has a bottom surface of a size that creates a gap between the wall surface and the component component located on the bottom surface. Therefore, there is a possibility that the position and orientation of the component parts may shift with respect to the tray by the amount of the gap generated between the wall surface and the component parts located on the bottom surface.

An object of the present invention is to provide a piezoelectric vibration device manufacturing apparatus and a piezoelectric vibration device manufacturing method capable of arranging a plurality of piezoelectric elements in a predetermined position and a predetermined orientation on a plurality of holding members.

Solutions for solving the above technical problems

The inventors of the present invention have developed a piezoelectric vibration device manufacturing apparatus and a piezoelectric vibration device manufacturing method that can respectively arrange a plurality of piezoelectric elements at a prescribed position and a prescribed orientation on a plurality of holding members without increasing the production cycle time. Were studied. As a result of intensive research, the present inventors came up with the following configuration.

A piezoelectric vibration device manufacturing apparatus according to an embodiment of the present invention is used to manufacture at least a piezoelectric element and a holding member that holds the piezoelectric element, and the piezoelectric element is bonded to the holding member through a bonding material. Piezoelectric vibration device manufacturing device for piezoelectric vibration devices.

The piezoelectric vibration device manufacturing apparatus includes: a plurality of adsorption heads, which adsorb the piezoelectric elements one by one; and an adsorption head moving device, which is equipped with the plurality of adsorption heads, so that the plurality of adsorption heads are supplied with a plurality of the pressures. The piezoelectric element supply position of the electric element and the holding member supply position of the plurality of holding members are simultaneously moved back and forth. The adsorption head has: an adsorption nozzle to adsorb the piezoelectric element; a horizontal movement mechanism for the adsorption head to move the adsorption nozzle in the horizontal direction; a vertical movement mechanism for the adsorption head to move the adsorption nozzle vertically. move in the direction; the suction head uses a rotational movement mechanism to move the suction nozzle in the rotation direction around the vertical axis.

The plurality of adsorption heads respectively adsorb the piezoelectric elements supplied to the piezoelectric element supply position through the plurality of adsorption nozzles at the piezoelectric element supply position. The plurality of suction heads are moved from the piezoelectric element supply position to the holding member supply position by the suction head moving device. At least one of the horizontal movement mechanism for the suction head, the vertical movement mechanism for the suction head, and the rotational movement mechanism for the suction head is based on a plurality of piezoelectric elements that are respectively sucked by a plurality of the suction nozzles. Information related to the position and information related to the positions of the plurality of holding members supplied to the holding member supply position, the positions of the plurality of suction nozzles are independently adjusted to be able to adsorb a plurality of the plurality of suction nozzles. The piezoelectric elements adsorbed by the mouth are respectively arranged at the corresponding positions of the holding member.

In the above-mentioned structure, the plurality of adsorption heads adsorb the piezoelectric elements using respective adsorption nozzles, and transport the plurality of piezoelectric elements. At this time, the suction head is configured based on information about the positions of the plurality of piezoelectric elements to be sucked and the positions of the plurality of holding members that respectively arrange the plurality of piezoelectric elements to be sucked. information to independently adjust the positions of multiple suction nozzles. As a result, the plurality of adsorption heads can individually adjust the plurality of adsorbed objects in a manner corresponding to the horizontal position and the vertical position of the holding member, taking into account the deflection during adsorption. The position of the piezoelectric element. Furthermore, the plurality of suction heads individually adjust the positions of the suction nozzles based on information on the position of the piezoelectric element and information on the position of the holding member, which are numerical data. Therefore, the piezoelectric vibration device manufacturing apparatus does not need to temporarily place the piezoelectric element for positioning, etc. Therefore, the plurality of piezoelectric elements can be arranged on the plurality of holding members at predetermined positions and in predetermined orientations without increasing the production cycle time.

From another viewpoint, the piezoelectric vibration device manufacturing apparatus of the present invention preferably includes the following configuration. The piezoelectric vibration device manufacturing apparatus includes: a plurality of supply heads that supply the bonding materials to the holding members respectively; and a supply head moving device that mounts the plurality of supply heads so that the plurality of supply heads move from the The plurality of supply heads move back and forth simultaneously from the standby position to the holding member supply position.

The supply head has: a supply device that supplies the joining material; a horizontal movement mechanism for the supply head that moves the supply device in a horizontal direction; and a vertical movement mechanism for the supply head that moves the supply device in a vertical direction. Move up. The plurality of supply heads are moved from the standby position to the holding member supply position by the supply head moving device. At least one of the horizontal movement mechanism for the supply head or the vertical movement mechanism for the supply head independently adjusts the position of the plurality of holding members supplied to the supply position of the holding member. The supply device is positioned so that a plurality of the supply devices can respectively supply the bonding material to a plurality of the holding members.

In the above structure, the plurality of supply heads adjust the positions of the supply devices independently so as to correspond to the horizontal position and the vertical position of the holding member. This allows the supply device to discharge the bonding material to a predetermined position in the holding member. Furthermore, each of the plurality of supply heads independently adjusts the position of the supply device based on the information on the positions of the plurality of holding members that is the obtained numerical data. Therefore, the piezoelectric vibration device manufacturing apparatus does not need to perform positioning of the holding member with respect to the supply device or the like. Therefore, the bonding materials can be arranged at predetermined positions of the plurality of holding members without increasing the production cycle time. Thereby, the plurality of piezoelectric elements can be arranged on the plurality of holding members at predetermined positions and in predetermined directions.

From another viewpoint, the piezoelectric vibration device manufacturing apparatus of the present invention preferably includes the following configuration. At the holding member supply position, the plurality of supply heads individually supply the joining material to the plurality of holding members from the plurality of supply devices. At the holding member supply position, the plurality of adsorption heads individually arrange the piezoelectric elements respectively adsorbed by the plurality of adsorption nozzles on the plurality of holding members to which the bonding material is supplied.

In the above configuration, the plurality of supply heads independently adjust the horizontal position and the vertical position of the plurality of supply devices based on the information on the position of the holding member. Each of the plurality of supply devices independently supplies the bonding material to a predetermined position of a plurality of holding members. Thereby, the plurality of supply devices can discharge the bonding material to a predetermined position in the holding member while taking into consideration the positional deviation of the plurality of holding members. In addition, the plurality of suction heads independently adjust the horizontal position and vertical position of the plurality of suction nozzles based on the information related to the position of the piezoelectric element and the information related to the position of the holding member. position in the straight direction. The plurality of suction nozzles arrange the piezoelectric elements independently at predetermined positions of the plurality of holding members. Accordingly, the suction head can arrange the piezoelectric element on the holding member while taking into account variations in the shape of the holding member. Therefore, the plurality of piezoelectric elements can be arranged on the plurality of holding members at predetermined positions and in predetermined orientations without increasing the production cycle time.

From another viewpoint, the piezoelectric vibration device manufacturing apparatus of the present invention preferably includes the following configuration. The plurality of supply heads can simultaneously adjust the positions of the respective supply devices through at least one of the horizontal movement mechanism for the supply head or the vertical movement mechanism for the supply head. In addition, the plurality of suction heads can move their respective suction nozzles through at least one of the horizontal movement mechanism for the suction head, the vertical movement mechanism for the suction head, or the rotational movement mechanism for the suction head. The position is adjusted simultaneously.

In the above configuration, the piezoelectric vibration device manufacturing apparatus simultaneously adjusts the positions of the plurality of suction heads and the plurality of supply heads through each moving mechanism. Therefore, regardless of the number of the suction heads and the supply heads, The time required to adjust the positions of the plurality of suction heads and the plurality of supply heads can be suppressed. Therefore, the supply materials can be supplied to predetermined positions of the plurality of holding members without increasing the production cycle time. In addition, the plurality of piezoelectric elements can be arranged in predetermined directions at predetermined positions of the plurality of holding members without increasing the production cycle time.

From another viewpoint, the piezoelectric vibration device manufacturing apparatus of the present invention preferably includes the following configuration. The piezoelectric vibration device manufacturing apparatus includes: a piezoelectric element position measuring device that measures the horizontal position of the plurality of piezoelectric elements that are respectively adsorbed by the plurality of suction heads and the orientation of the piezoelectric element as the relationship between the piezoelectric element and the piezoelectric element position measuring device. Information related to the position of the piezoelectric element; a holding member position measuring device that measures the horizontal and vertical positions of a plurality of holding members supplied to the holding member supply position as a position related to the holding member Information.

In the above configuration, the piezoelectric element position measuring device measures the position of the piezoelectric element in the horizontal direction and the orientation of the piezoelectric element in a state where the piezoelectric element is respectively sucked by the plurality of suction nozzles. That is, the piezoelectric element position measuring device measures the deflections of the plurality of piezoelectric elements adsorbed on the suction nozzle respectively. Furthermore, the holding member position measuring device separately measures not only the horizontal position but also the vertical position of the plurality of holding members supplied to the holding member supply position. As a result, the holding member position measuring device can independently adjust the vertical directions of the piezoelectric elements respectively arranged in a plurality of the holding members based on the vertical positions of the corresponding holding members. s position. Therefore, the plurality of piezoelectric elements can be arranged on the plurality of holding members at predetermined positions and in predetermined orientations without increasing the production cycle time.

A method of manufacturing a piezoelectric vibration device according to an embodiment of the present invention includes at least a piezoelectric element and a holding member that holds the piezoelectric element, and the piezoelectric element is bonded to the holding member through the bonding material. Method of manufacturing piezoelectric vibration device.

The manufacturing method of a piezoelectric vibration device includes: a piezoelectric element supply step of supplying a plurality of the piezoelectric elements to a piezoelectric element supply position; and a piezoelectric element positioning step of positioning a plurality of the piezoelectric elements to the piezoelectric element. supply position; a holding member supplying step of supplying a plurality of holding members to a holding member supply position; a holding member positioning step of positioning a plurality of holding members to a holding member supplying position; and a piezoelectric element conveying step of positioning the holding members at The plurality of piezoelectric elements at the piezoelectric element supply position are transported from the piezoelectric element supply position to the holding member supply position; the piezoelectric element position adjustment process is based on the step of transporting the piezoelectric elements from the piezoelectric element supply position to the holding member supply position. Information on the positions of the plurality of piezoelectric elements at the holding member supply position and information on the position of the holding member positioned at the holding member supply position, so that the piezoelectric elements can be supplied from The plurality of piezoelectric elements whose positions are transferred to the supply position of the holding member are respectively arranged on the corresponding holding members, and the positions of the plurality of piezoelectric elements are independently adjusted.

In the above configuration, the method for manufacturing a piezoelectric vibration device includes a piezoelectric element position adjustment step based on the information on the position of the holding member and the piezoelectric element transportation step. The information related to the position of the piezoelectric element obtained in the method is used to independently adjust the positions of a plurality of the piezoelectric elements. The information on the position of the piezoelectric element includes information on the position taking into consideration the postures of the plurality of piezoelectric elements during transportation. This eliminates the need for a separate step of positioning the posture of the piezoelectric element by temporarily placing it after the piezoelectric element transportation step. Therefore, the plurality of piezoelectric elements can be arranged on the plurality of holding members at predetermined positions and in predetermined orientations without increasing the production cycle time.

From another viewpoint, the method for manufacturing a piezoelectric vibration device of the present invention preferably includes the following configuration. and a joining material supply position adjusting step of adjusting the joining material supplied to the holding member at the holding member supply position based on information on the position of the holding member supplied to the holding member supply position. supply location.

In the above configuration, in the step of adjusting the joining material supply position, the position at which the joining material is supplied is individually adjusted in accordance with the position of the holding member. Furthermore, since the supply position of the bonding material is individually adjusted based on the information on the positions of the plurality of holding members as the acquired numerical data, there is no need to perform separate positioning or the like for each of the holding members. Therefore, the plurality of piezoelectric elements can be arranged on the plurality of holding members at predetermined positions and in predetermined orientations without increasing the production cycle time.

From another viewpoint, the method for manufacturing a piezoelectric vibration device of the present invention preferably includes the following configuration. The manufacturing method of a piezoelectric vibration device includes: a bonding material supply step of supplying the bonding material to each of the plurality of holding members at the holding member supply position; and a piezoelectric element bonding step of supplying the bonding material at the holding member supply position. The plurality of piezoelectric elements transported from the piezoelectric element supply position to the holding member supply position are respectively arranged on the plurality of holding members to which the bonding material is supplied.

In the above configuration, in the joining material supply step, the supply positions of the joining materials among the plurality of holding members are adjusted based on the information on the positions of the plurality of holding members. Furthermore, in the piezoelectric element bonding step, a plurality of the pressures of the plurality of holding members are adjusted based on the information on the position of the piezoelectric element and the information on the position of the holding member. The placement of electrical components. Therefore, the plurality of piezoelectric elements can be arranged on the plurality of holding members at predetermined positions and in predetermined directions.

From another viewpoint, the method for manufacturing a piezoelectric vibration device of the present invention preferably includes the following configuration. The joining material supply position adjusting step is a step of simultaneously adjusting the positions at which the joining material is supplied to the plurality of holding members. Furthermore, the piezoelectric element position adjustment step is a step of simultaneously adjusting the positions of the plurality of piezoelectric elements so that the plurality of piezoelectric elements can be respectively arranged on the holding member.

In the above configuration, in the piezoelectric element position adjustment step, the arrangement positions of a plurality of piezoelectric elements are adjusted simultaneously, and in the bonding material supply position adjustment step, a plurality of supply positions of the bonding material are adjusted simultaneously. Therefore, regardless of the number of the piezoelectric elements arranged in the holding member, the time required to adjust the arrangement positions of the plurality of piezoelectric elements and the supply position of the bonding material can be suppressed. Therefore, the supply material can be supplied to the predetermined positions of the plurality of holding members without increasing the production cycle time. In addition, the plurality of piezoelectric elements can be arranged on the plurality of holding members at predetermined positions and in predetermined orientations without increasing the production cycle time.

From another viewpoint, the method for manufacturing a piezoelectric vibration device of the present invention preferably includes the following configuration. The method has a piezoelectric element position information acquisition step of acquiring horizontal positions of the plurality of piezoelectric elements transported from the piezoelectric element supply position to the holding member supply position and the piezoelectric element position information. Orientation-related information; the holding member position information acquisition step acquires information on the horizontal and vertical positions of the plurality of holding members supplied to the holding member supply position.

In the above configuration, in the piezoelectric element position information acquisition step, the horizontal position of the plurality of piezoelectric elements and the orientation of the piezoelectric elements in the piezoelectric element transportation step are measured. That is, in the piezoelectric element position information acquisition process, the posture of the adsorbed piezoelectric element is measured. In addition, in the holding member position information acquisition process, not only the horizontal position of the plurality of holding members is measured, but also the vertical position is measured respectively. Therefore, it is possible to measure the position of the holding member based on the vertical direction of the corresponding holding member. The positions of the piezoelectric elements respectively arranged in the plurality of holding parts are independently adjusted in the vertical direction. Therefore, the plurality of piezoelectric elements can be arranged on the plurality of holding members at predetermined positions and in predetermined orientations without increasing the production cycle time.

[Piezoelectric vibration device]

In this specification, a piezoelectric vibration device refers to an electronic component including a piezoelectric element that converts a force applied to a piezoelectric body into a voltage, or converts a voltage applied to a piezoelectric body into a force. Piezoelectric vibration devices include crystal oscillators, crystal oscillators, etc. Piezoelectric vibration devices are used in oscillation circuits, filter circuits, actuators, sensors, etc.

[Piezoelectric element]

In this specification, a piezoelectric element refers to a piezoelectric body that converts an applied force into a voltage or converts an applied voltage into a force. In this embodiment, the piezoelectric element is a plate-shaped crystal vibrating piece obtained by cutting crystal in a specific direction. The piezoelectric element has an electrode formed into a film by evaporation, sputtering, or the like.

[Hold parts]

In this specification, the holding member refers to a container made of an insulator for holding the piezoelectric element. In this embodiment, the holding member is a ceramic casing. The holding member has an electrode electrically connected to the piezoelectric element inside. The holding member has a recessed portion in which the piezoelectric element can be disposed.

[joining material]

In this specification, the joining material refers to a conductive material that joins the piezoelectric element to the holding container. The joining material is, for example, solder, adhesive material, or the like. In this embodiment, the bonding material is a thermosetting adhesive.

[relative distance]

In this specification, the relative distance refers to the distance between the centers of components.

[location-related information]

In this specification, position-related information refers to the X direction, Y direction, Z direction, and θ direction of a specific point in the target device, component, etc., with an arbitrary point in the piezoelectric vibration device manufacturing apparatus as the origin. coordinate of. The coordinates in this embodiment are a coordinate system with an arbitrary point in the piezoelectric vibration device manufacturing apparatus as the origin.

Invention effect

According to one embodiment of the present invention, a plurality of piezoelectric elements can be arranged on a plurality of holding members in a predetermined position and a predetermined orientation without increasing the production cycle time.

Description of the drawings

FIG. 1 is a schematic plan view showing the overall structure of a piezoelectric vibration device manufacturing apparatus according to Embodiment 1 of the present invention.

2A is a plan view showing a plurality of piezoelectric elements and a tray supplied to the piezoelectric vibration device manufacturing apparatus according to Embodiment 1 of the present invention.

2B is a schematic plan view showing a plurality of holding members supplied to the piezoelectric vibration device manufacturing apparatus according to the embodiment of the present invention.

3 is a schematic plan view showing the overall structure of a plurality of suction heads included in the piezoelectric vibration device manufacturing apparatus according to the embodiment of the present invention.

Fig. 4 is a view in direction A in Fig. 3 .

5 is a schematic side view showing the overall structure of a plurality of supply heads included in the piezoelectric vibration device manufacturing apparatus according to the embodiment of the present invention.

FIG. 6 is a block diagram showing the control structure of the piezoelectric vibration device manufacturing apparatus according to the embodiment of the present invention.

7 is a schematic plan view showing a state in which a plurality of suction heads of the piezoelectric vibration device manufacturing apparatus according to the embodiment of the present invention transport the piezoelectric element to a holding member supply position.

8 is a schematic plan view showing a state in which the positions of the suction nozzles are adjusted by the plurality of suction heads of the piezoelectric vibration device manufacturing apparatus according to the embodiment of the present invention.

FIG. 9 is a flowchart of a method of manufacturing a piezoelectric vibration device according to the embodiment of the present invention.

10 is a diagram illustrating the holding member position information acquisition step, the piezoelectric element supplying step, the holding member supplying step, the piezoelectric element positioning step, and the holding member positioning step in the manufacturing method of the piezoelectric vibration device according to the embodiment of the present invention. A top view of the working state of the piezoelectric vibration device manufacturing device.

11 is a plan view showing the operating state of the piezoelectric vibration device manufacturing apparatus in the bonding material supply position adjustment step and the bonding material supply step in the piezoelectric vibration device manufacturing method according to the embodiment of the present invention.

12 is a diagram illustrating the piezoelectric element transportation process, the piezoelectric element position information acquisition process, the piezoelectric element position adjustment process, and the piezoelectric element bonding process in the manufacturing method of the piezoelectric vibration device according to the embodiment of the present invention. A top view of the working state of the vibration device manufacturing equipment.

13 is a plan view showing the structure of a piezoelectric vibration device manufacturing line including the piezoelectric vibration device manufacturing device according to the embodiment of the present invention.

14 is a block diagram showing a control structure of a piezoelectric vibration device manufacturing line including the piezoelectric vibration device manufacturing apparatus according to the embodiment of the present invention.

Detailed ways

Each embodiment will be described below with reference to the drawings. In each drawing, the same parts are given the same reference numerals, and descriptions of the same parts will not be repeated. In addition, the dimensions of the component parts in each figure do not faithfully represent the actual dimensions of the component parts, the dimensional ratio of each component part, etc.

In addition, in the following description of the piezoelectric vibration device manufacturing apparatus 1 according to the embodiment of the present invention, the direction in which the piezoelectric element P is transported to the piezoelectric element supply position Sp is defined as the “X direction”. As a direction orthogonal to the X direction, the direction in which the piezoelectric element P is transported from the piezoelectric element supply position Sp to the holding member supply position Sh is defined as the "Y direction". The direction orthogonal to the X direction and the Y direction is defined as the "Z direction". The direction of rotation around an axis extending in the Z direction is defined as the θ direction. In addition, in this embodiment, the X direction and the Y direction are directions on the horizontal plane. The Z direction is the vertical direction. However, the definition of this direction is not intended to limit the direction in which the piezoelectric vibration device manufacturing apparatus 1 is used.

In addition, in the following description, expressions such as "fixing", "connecting", "joining" and "mounting" (hereinafter referred to as "fixing") include not only the case where components are directly fixed to each other, but also fixation via other components. etc. situation. That is, in the following description, expressions such as fixation include direct and indirect fixation of components to each other.

[Embodiment 1]

<Overall structure of piezoelectric vibration device manufacturing equipment>

A piezoelectric vibration device manufacturing apparatus 1 according to Embodiment 1, which is a piezoelectric vibration device manufacturing apparatus that is a device for manufacturing the piezoelectric vibration device of the present invention, will be described using FIGS. 1 to 6 . FIG. 1 is a schematic plan view showing the overall structure of a piezoelectric vibration device manufacturing apparatus 1 according to Embodiment 1 of the present invention. FIG. 2A is a plan view showing a plurality of piezoelectric elements P and a tray T supplied to the piezoelectric vibration device manufacturing apparatus 1 . FIG. 2B is a schematic plan view showing a plurality of holding members H supplied to the piezoelectric vibration device manufacturing apparatus 1 . FIG. 3 is a schematic plan view showing the overall structure of the plurality of suction heads 20 included in the piezoelectric vibration device manufacturing apparatus 1 . Fig. 4 is a view in direction A in Fig. 3 . FIG. 5 is a schematic side view showing the overall structure of the plurality of supply heads 30 included in the piezoelectric vibration device manufacturing apparatus 1 . FIG. 6 is a block diagram showing the control structure of the piezoelectric vibration device manufacturing apparatus 1 .

As shown in FIG. 1 , the piezoelectric vibration device manufacturing apparatus 1 includes a stage 2 , a piezoelectric element supply device 10 , a holding member supply device 11 , an adsorption head moving device 12 , a supply head moving device 13 , and a piezoelectric element position measuring device. Camera 14, laser measuring device 15 as a holding member position measuring device, control device 16, suction head 20 and supply head 30. The piezoelectric vibration device manufacturing apparatus 1 has various devices arranged on the mounting surface which is the horizontal surface of the stand 2 . The piezoelectric vibration device manufacturing apparatus 1 supplies a plurality of piezoelectric elements P and a plurality of holding members H from a supply line (not shown).

As shown in FIGS. 2A and 2B , in the piezoelectric vibration device manufacturing apparatus 1 , a plurality of piezoelectric elements P are supplied while maintaining a relative distance between each other. In this embodiment, a plurality of recessed portions C in which the piezoelectric elements P can be arranged are provided on the tray T as a container for the piezoelectric elements P. The concave portion C has a rectangular shape in plan view. On the tray T, a plurality of recessed portions C are arranged at intervals Px in the X direction and arranged at intervals Py in the Y direction. That is, in the tray T, the plurality of recessed portions C are arranged in a matrix at intervals Px in the X direction and at intervals Py in the Y direction. The piezoelectric elements P are respectively located in the recessed portions C of the tray T. In addition, the distance Px and the distance Py between adjacent recessed portions C are the distances between the centers (intersections of diagonal lines) of the rectangular recessed portions C in plan view.

In the piezoelectric vibration device manufacturing apparatus 1 , the plurality of holding members H are supplied in a state where the relative distance between them is maintained. In this embodiment, a group of the plurality of holding members H aligned at intervals Px in the X direction is aligned at intervals Py in the Y direction. That is, the plurality of holding members H are arranged in a matrix with intervals Px in the X direction and intervals Py in the Y direction. In addition, the plurality of holding members H are formed in a sheet shape connected to each other. In addition, the plurality of holding members H arranged in a sheet shape are located at positions corresponding to the intervals Px in the X direction and the intervals Py in the Y direction of the recessed portions C.

The holding member H has a rectangular shape in plan view, for example. The holding member H is configured to have a long side of 2.0 mm and a short side of 1.6 mm, for example. In addition, the holding member H is configured to have a long side of 1.6 mm and a short side of 1.2 mm, for example. In addition, the holding member H is configured to have a size of 1.2 mm on the long side and 1.0 mm on the short side, for example. In addition, the size of the sheet formed by connecting a plurality of holding members to each other is configured to be the same size regardless of the size of the holding member H. That is, as a sheet, the number of holding members H contained in the sheet differs depending on the size of the holding members H. With such a configuration, even if the size of the holding member H is changed in the piezoelectric vibration device manufacturing apparatus 1, there is no need to replace the suction head moving device 12, the supply head moving device 13, etc., which will be described later.

As shown in FIG. 1 , the piezoelectric element supply device 10 transports the tray T storing a plurality of piezoelectric elements P to the piezoelectric element supply position Sp, and determines the piezoelectric element P to be supplied at the piezoelectric element supply position Sp. position positioning device. In this embodiment, the piezoelectric element supply device 10 is a single-axis linear drive unit including a servo motor as an actuator and a ball screw unit as a linear drive mechanism. The piezoelectric element supply device 10 is arranged on the gantry 2 with the direction in which the piezoelectric element P is transported when viewed in the vertical direction being the X direction.

The piezoelectric element supply device 10 has a tray placement portion 10a on which a tray T is placed. The piezoelectric element supply device 10 can move the tray mounting portion 10a to any position within the operating range based on the amount of rotation of the servo motor. In the piezoelectric element supply device 10, the tray T is supplied to the tray placement portion 10a from an external supply line (not shown) at the piezoelectric element standby position Wp. The tray T placed on the tray placement part 10a can be conveyed to the piezoelectric element supply position Sp. In addition, the piezoelectric element supply position Sp in the piezoelectric element supply device 10 is determined in advance. Furthermore, in order to position the piezoelectric element P to be supplied among the plurality of piezoelectric elements P accommodated in the tray T to the piezoelectric element supply position Sp, the piezoelectric element supply device 10 loads the piezoelectric element P on the tray based on the piezoelectric element P to be supplied. The stop position of the tray placing portion 10a is determined for each piezoelectric element P to be supplied, based on the position on the placing portion 10a. The piezoelectric element supply device 10 positions the piezoelectric element P of the supply target to the piezoelectric element supply position Sp based on the stop position determined for each piezoelectric element P of the supply target.

The holding member supply device 11 is a device that transports a plurality of holding members H connected in a sheet shape to the holding member supply position Sh and positions the holding member H to be supplied at the holding member supply position Sh. In this embodiment, the holding member supply device 11 is a single-axis linear drive unit including a servo motor as an actuator and a ball screw unit as a linear drive mechanism. The holding member supply device 11 is arranged on the stand 2 with the direction in which the holding member H is transported when viewed in the vertical direction being the X direction.

The holding member supply device 11 is arranged adjacent to the piezoelectric element supply device 10 on the gantry 2 . The holding member supply device 11 has a holding member placing portion 11a on which a plurality of holding members H are placed. The holding member supply device 11 can move the holding member placing portion 11a to any position within the operation range according to the amount of rotation of the servo motor. In the holding member supply device 11, a plurality of holding members H are supplied to the holding member placing portion 11a from an external supply line (not shown) at the holding member standby position Wh. The holding member supply device 11 can transport the plurality of holding members H placed on the holding member placement portion 11a to the holding member supply position Sh. In addition, the holding member supply position Sh in the holding member supply device 11 is determined in advance. In addition, in order to position the holding member H at any position among the plurality of holding members H arranged in a sheet shape to the holding member supply position Sh, the holding member supply device 11 places the holding member H based on the supply target on the holding member placement portion 11 a The stop position of the holding member placing portion 11a is determined for each holding member H to be supplied. The holding member supply device 11 positions the holding member H to be supplied to the holding member supply position Sh based on the stop position determined for each holding member H to be supplied.

The suction head moving device 12 is a device that moves a plurality of suction heads 20 simultaneously. In the present embodiment, the suction head moving device 12 is a single-axis linear drive unit including a servo motor as an actuator and a ball screw unit as a linear drive mechanism. The suction head moving device 12 is arranged on the gantry 2 with the direction in which the plurality of suction heads 20 are transported when viewed in the vertical direction being the Y direction. In addition, the suction head moving device 12 is located above the piezoelectric element supply device 10 and the holding member supply device 11 in the vertical direction (Z direction).

The suction head moving device 12 has a suction head placement part 12a on which a plurality of suction heads 20 are placed. The suction head placement part 12a has a horizontal placement surface on which the plurality of suction heads 20 are mounted. The suction head moving device 12 can move the suction head placement part 12a to any position within the operation range according to the rotation amount of the servo motor. The suction head moving device 12 reciprocates the plurality of suction heads 20 placed on the mounting surface of the suction head placement portion 12 a from the piezoelectric element supply position Sp to the holding member supply position Sh.

In order to move the plurality of suction heads 20 to the piezoelectric element supply position Sp, the suction head moving device 12 determines the piezoelectric element P for each supply target based on the position of the supply target piezoelectric element P on the tray mounting part 10 a. The stop position of the suction head mounting part 12a. Similarly, in order to move the plurality of suction heads 20 to the holding member supply position Sh, the adsorption head moving device 12 moves the holding member H to be supplied to each holding member H based on the position of the holding member H to be supplied on the holding member placement portion 11 a. The stop position of the suction head mounting part 12a is determined.

The supply head moving device 13 is a device that moves a plurality of supply heads 30 simultaneously. In the present embodiment, the supply head moving device 13 is a single-axis linear drive unit including a servo motor as an actuator and a ball screw unit as a linear drive mechanism. The supply head moving device 13 is arranged on the gantry 2 with the direction in which the plurality of supply heads 30 are transported when viewed in the vertical direction being the Y direction. The supply head moving device 13 is located above the holding member supply device 11 in the vertical direction (Z direction).

The supply head moving device 13 has a supply head placing portion 13 a on which a plurality of supply heads 30 are placed. The supply head mounting part 13a has a horizontal mounting surface on which the plurality of supply heads 30 are mounted. The supply head moving device 13 can move the supply head mounting portion 13a to any position within the operation range according to the amount of rotation of the servo motor. The supply head moving device 13 can transport the plurality of supply heads 30 placed on the supply head mounting portion 13a from the waiting position W to the holding member supply position Sh. In addition, in order to move the plurality of supply heads 30 to the holding member supply position Sh, the supply head moving device 13 determines the holding member H for each supply target based on the position of the supply target holding member H on the holding member placement portion 11a. The stop position of the head mounting part 13a is supplied.

As shown in FIGS. 3 and 4 , the adsorption head 20 is a device that adsorbs the piezoelectric element P using an adsorption nozzle 28 and arranges it in the recessed portion of the holding member H. The suction head 20 has a suction head horizontal movement mechanism 21 , a suction head vertical movement mechanism 24 , a suction head rotation movement mechanism 26 , and a suction nozzle 28 .

The horizontal moving mechanism 21 for the suction head has a plate-shaped first moving member 22 for the suction head that moves in the first direction, and a plate-shaped second moving member 22 for the suction head that moves in a second direction different from the first direction. Part 23. The first moving member 22 for the suction head can move in the first direction using a stepping motor and a cam mechanism as an actuator. The second moving member 23 for the suction head can move in the second direction using a stepping motor and a cam mechanism as an actuator.

The first moving member 22 for the suction head is arranged in the suction head placement portion 12 a of the suction head moving device 12 . At this time, when viewed in the vertical direction, the first moving member 22 for the suction head is arranged so that the first direction as the moving direction becomes the X direction in the horizontal direction. Thereby, the 1st moving member 22 for an adsorption head can move in the horizontal X direction with respect to the adsorption head placement part 12a.

The second moving member 23 for the suction head is arranged on the first moving member 22 for the suction head. When viewed in the vertical direction, the second moving member 23 for the suction head is arranged so that the second direction as the moving direction becomes the Y direction orthogonal to the X direction in the horizontal direction. Thereby, the 2nd moving member 23 for an adsorption head can move in the horizontal Y direction orthogonal to the X direction with respect to the 1st moving member 22 for an adsorption head.

The horizontal moving mechanism 21 for the suction head configured in this way can move the second moving member 23 for the suction head in the horizontal X direction with respect to the suction head placement portion 12a by the first moving member 22 for the suction head. In addition, the horizontal movement mechanism 21 for the suction head can move the second moving member 23 for the suction head in the horizontal Y direction orthogonal to the X direction relative to the first moving member 22 for the suction head. That is, the horizontal movement mechanism 21 for the suction head can move the second moving member 23 for the suction head in the horizontal X direction and the Y direction orthogonal to the X direction relative to the suction head placement portion 12 a.

The vertical moving mechanism 24 for the suction head has a plate-shaped third moving member 25 for the suction head that moves in a direction perpendicular to the first direction and the second direction, which are the moving directions of the horizontal movement mechanism 21 for the suction head. The third moving member 25 for the suction head can move in the third direction by a servo motor as an actuator, a ball screw unit as a linear drive mechanism, or the like.

The third moving member 25 for the suction head is mounted on the second moving member 23 for the suction head. At this time, the third moving member 25 for the suction head is arranged so that the third direction as the moving direction becomes the Z direction. Thereby, the third moving member 25 for the suction head can move in the horizontal X direction and the Y direction with respect to the suction head mounting part 12a, and can move in the vertical direction, that is, the Z direction.

The rotational movement mechanism 26 for the suction head has a cylindrical fourth movement member 27 for the suction head that moves (rotates) around an axis extending in the third direction, which is the movement direction of the vertical movement mechanism 24 . The fourth moving member 27 for the suction head can move in the rotation direction by a stepping motor or the like as an actuator.

The fourth moving member 27 for the suction head is mounted on the rotational movement mechanism 26 for the suction head. At this time, the fourth moving member 27 for the suction head is arranged so that the third direction as the rotation axis becomes the Z direction. That is, the fourth moving member 27 for the suction head can rotate in the θ direction which is the rotation direction about the vertical axis. Thereby, the fourth moving member 27 for the suction head can move in the X direction and the Y direction in the horizontal direction with respect to the suction head mounting portion 12a, can move in the vertical direction, that is, the Z direction, and can move in the θ direction. Rotate up.

The suction nozzle 28 is a nozzle that suctions the piezoelectric element P in the recessed portion C of the tray T. The suction nozzle 28 is mounted on the fourth moving member 27 for the suction head. The suction nozzle 28 is arranged at the lower end of the fourth moving member 27 for the suction head. The suction nozzle 28 has a lower end shape capable of suctioning the piezoelectric element P. In addition, the suction nozzle 28 has a suction hole at the lower end. The adsorption nozzle 28 adsorbs the piezoelectric element P by causing the pressure in the adsorption hole to become a negative pressure with the piezoelectric element P blocking the adsorption hole. The suction nozzle 28 arranged on the fourth moving member 27 for the suction head is movable in the X direction and the Y direction in the horizontal direction with respect to the suction head mounting part 12a, and is movable in the vertical direction, that is, the Z direction, and can Rotate in the θ direction.

In this way, the suction head horizontal movement mechanism 21 , the suction head vertical movement mechanism 24 , and the suction head rotation movement mechanism 26 that constitute the suction head 20 each have a servo motor as an actuator in each movement direction. In addition, the horizontal movement mechanism 21 for the suction head, the vertical movement mechanism 24 for the suction head, and the rotational movement mechanism 26 for the suction head are not configured to interlock with each other. That is, the horizontal movement mechanism 21 for the suction head, the vertical movement mechanism 24 for the suction head, and the rotational movement mechanism 26 for the suction head can move in each movement direction independently of each other.

The piezoelectric vibration device manufacturing apparatus 1 has a plurality of suction heads 20 . The piezoelectric vibration device manufacturing apparatus 1 has, for example, four suction heads 20 . The four suction heads 20 are mounted on the suction head mounting portion 12 a of the suction head moving device 12 . Thereby, the four suction heads 20 are configured to be movable simultaneously between the piezoelectric element supply position Sp and the holding member supply position Sh by the suction head moving device 12 . On the other hand, the movable parts of the four suction heads 20 are not connected to each other. That is, the suction nozzles 28 of the four suction heads 20 can move in the X direction, Y direction, Z direction, and θ direction independently of each other while being mounted on the suction head mounting portion 12 a.

Two suction heads 20 are arranged side by side in the X direction. In addition, one suction head 20 is arranged in each row in the Y direction of the two suction heads 20 arranged in the X direction. That is, four suction heads 20 are arranged in a matrix shape arranged in the X direction and the Y direction. The suction nozzles 28 of the suction heads 20 arranged in the X direction are arranged at an interval Px that is an integer multiple of the interval Px, which is the interval Px between the recessed portion C and the sheet-shaped holding member H provided on the tray T. The suction nozzles 28 of the suction heads 20 arranged in the Y direction are arranged at an interval Py that is an integer multiple of the interval Py, which is the interval Py between the recessed portion C and the sheet-shaped holding member H provided on the tray T.

With this configuration, the four suction heads 20 can suction the piezoelectric elements P located on the tray T one by one through the suction nozzles 28 at the piezoelectric element supply position Sp. That is, the four suction heads 20 can respectively suck the arbitrarily selected piezoelectric element P, the A-th piezoelectric element P in the X direction from the arbitrarily selected piezoelectric element P, and the arbitrarily selected piezoelectric element P from the arbitrarily selected piezoelectric element P. The piezoelectric element P which is the Bth in the Y direction from the electric element P, and the Ath piezoelectric element P which is the Bth in the Y direction and which is the Ath in the X direction from the arbitrarily selected piezoelectric element P. Electrical components P.

Similarly, the four suction heads 20 can place the piezoelectric elements P adsorbed by the respective suction nozzles 28 in the recessed portions of the holding member H one by one at the holding member supply position Sh. That is, the four suction heads 20 can respectively suck the arbitrarily selected holding member H, the A-th holding member H in the X direction from the arbitrarily selected holding member H, and the arbitrarily selected holding member H starting from the arbitrarily selected holding member H. The B-th holding member H in the Y direction, and the A-th holding member H in the X direction starting from the arbitrarily selected holding member H and the B-th holding member H in the Y direction.

As shown in FIG. 5 , the supply head 30 is a device that supplies the bonding material into the recessed portions of the plurality of sheet-shaped holding members H. The supply head 30 has a horizontal movement mechanism 31 for the supply head, a vertical movement mechanism 34 for the supply head, and a supply device 36 .

The horizontal moving mechanism 31 for the supply head has a first moving member 32 for the supply head that moves in the first direction, and a second moving member 33 for the supply head that moves in a second direction different from the first direction. The first moving member 32 for the supply head can move in the first direction using a stepping motor and a cam mechanism as an actuator. The second moving member 33 for the supply head can move in the second direction using a stepping motor and a cam mechanism as an actuator.

The first moving member 32 for the supply head is arranged in the supply head placing portion 13 a of the supply head moving device 13 . At this time, the first moving member 32 for the supply head is arranged so that the first direction as the moving direction becomes the X direction when viewed in the vertical direction. Thereby, the first moving member 32 for the supply head can move in the horizontal X direction with respect to the supply head mounting part 13a.

The second moving member 33 for the supply head is arranged on the first moving member 32 for the supply head. The second moving member 33 for the supply head is arranged so that the second direction as the moving direction becomes the Y direction orthogonal to the X direction in the horizontal direction when viewed in the vertical direction. Thereby, the second moving member 33 for the supply head can move in the horizontal Y direction relative to the first moving member 32 for the supply head.

The horizontal moving mechanism 31 for the supply head configured in this way can move the second moving member 33 for the supply head in the horizontal X direction with respect to the supply head mounting portion 13 a through the first moving member 32 for the supply head. In addition, the horizontal moving mechanism 31 for the supply head can move the second moving member 33 for the supply head in the horizontal Y direction orthogonal to the X direction relative to the first moving member 32 for the supply head. That is, the supply head horizontal moving mechanism 31 can move the supply head second moving member 33 in the horizontal X direction and the Y direction orthogonal to the X direction relative to the supply head mounting portion 13 a.

The supply head vertical movement mechanism 34 has a plate-shaped third movement member 35 for the supply head that moves in a direction perpendicular to the first direction and the second direction, which are the movement directions of the supply head horizontal movement mechanism 31 . The third moving member 35 for the supply head can move in the third direction by a servo motor as an actuator, a ball screw unit as a linear drive mechanism, or the like.

The third moving member 35 for the supply head is arranged on the second moving member 33 for the supply head. At this time, the third moving member 35 for the supply head is arranged so that the third direction as the moving direction becomes the Z direction. Thereby, the third moving member 35 for the supply head is movable in the X direction and the Y direction in the horizontal direction and in the Z direction in the vertical direction with respect to the supply head mounting part 13a.

The supply device 36 is a device that supplies the bonding material into the recessed portion of the holding member H where the piezoelectric element P is arranged. The supply device 36 is a discharge device that discharges a predetermined amount of conductive adhesive in this embodiment. The supply device 36 is arranged on the third moving member 35 for the supply head. The supply device 36 has a discharge nozzle 36 a having a shape capable of supplying the bonding material into the recess of the holding member H downward in the vertical direction (Z direction). When viewed in the horizontal direction, the supply device 36 discharges the bonding material downward in the vertical direction (Z direction) from the discharge nozzle 36a. In addition, the discharge nozzle 36a is configured to be movable in the Z direction when contacting the holding member H from the Z direction. The supply device 36 mounted on the third moving member 35 for the supply head is movable in the X direction and Y direction in the horizontal direction and in the Z direction in the vertical direction with respect to the supply head mounting part 13a.

Furthermore, the supply device 36 has a cooling device 36b. The cooling device 36b is composed of a Peltier element which is a semiconductor thermoelectric element and an air-cooling fan that cools the Peltier element. The cooling device 36b is located near the discharge nozzle 36a. The cooling device 36b maintains the temperature of the bonding material in the supply device 36 at an appropriate temperature. Thereby, since the supply device 36 maintains the viscosity of the internal bonding material within a certain range, clogging of the bonding material in the discharge nozzle 36 a can be suppressed.

In addition, the supply device 36 has a contact sensor (not shown) that detects the position of the discharge nozzle 36a in the Z direction. The contact sensor is a sensor that detects the movement of the discharge nozzle 36a in the Z direction. Therefore, the contact sensor can detect that the tip of the discharge nozzle 36a comes into contact with the holding member H. The control device 16 described below uses the position of the third moving member 35 for the supply head when the contact sensor detects the contact between the discharge nozzle 36 a and the holding member H as a zero point to control the supply device 36 . The contact sensor is disposed closer to the supply device 36 than the Z-direction guide device (not shown) included in the third moving member 35 for the supply head. It is preferable that the contact sensor is arranged on the Z-axis of the discharge nozzle 36a.

In this way, the horizontal movement mechanism 31 for the supply head and the vertical movement mechanism 34 for the supply head which constitute the supply head 30 each have a servo motor as an actuator in each movement direction. In addition, the horizontal movement mechanism 31 for the supply head and the vertical movement mechanism 34 for the supply head are not configured to interlock with each other. That is, the horizontal movement mechanism 31 for the supply head and the vertical movement mechanism 34 for the supply head can move independently of each other.

The piezoelectric vibration device manufacturing apparatus 1 has a plurality of supply heads 30 . The piezoelectric vibration device manufacturing apparatus 1 has, for example, four supply heads 30 . The four supply heads 30 are arranged in the supply head placement portion 13 a of the supply head moving device 13 . Thereby, the four supply heads 30 are configured to be movable simultaneously between the standby position W and the holding member supply position Sh by the supply head moving device 13 . On the other hand, the movable parts of the four supply heads 30 are not connected to each other. That is, the supply devices 36 of the four supply heads 30 can move in the X direction, Y direction, and Z direction independently of each other while being mounted on the supply head mounting portion 13 a.

Two supply heads 30 are arranged side by side in the X direction. In addition, one supply head 30 is arranged in each row in the Y direction of the two supply heads 30 arranged in the X direction. That is, four supply heads 30 are arranged in a matrix shape in the X direction and the Y direction. The discharge nozzles 36 a of the supply devices 36 of the supply heads 30 arranged in the X direction are arranged at intervals that are A times an integral multiple of the intervals Px of the sheet-shaped holding members H. The discharge nozzles 36 a of the supply devices 36 of the supply heads 30 arranged in the Y direction are arranged at intervals that are an integral multiple of the interval Py of the sheet-shaped holding members H, that is, B times.

In addition, a confirmation camera 37 for confirming the coating diameter of the bonding material pre-discharged by the supply device 36 is mounted on the supply head mounting portion 13a. Furthermore, a pilot injection part 38 for performing pilot injection by the supply device 36 is disposed below the supply device 36 as a waiting position W to be described later.

With this structure, the four supply heads 30 can supply the bonding material to the holding member H at the holding member supply position Sh without moving the position of the supply device 36 by the supply head moving device 13 and the supply head horizontal movement mechanism 31. In this case, the bonding material is supplied to the holding member H from each supply device 36 . That is, the four supply heads 30 can supply the arbitrarily selected holding member H, the A-th holding member H in the X direction from the arbitrarily selected holding member H, and the arbitrarily selected holding member H starting from the arbitrarily selected holding member H. The bonding material is supplied to the B-th holding member H in the Y direction and to the A-th holding member H in the X direction and the B-th holding member H in the Y direction starting from the arbitrarily selected holding member H.

As shown in FIGS. 1 and 6 , the camera 14 as a piezoelectric element position measuring device is a camera that measures the positions of the piezoelectric elements P that are respectively sucked by the four suction nozzles 28 relative to the suction head 20 . The camera 14 is located vertically below the suction head moving device 12 on the stand 2 . When viewed in the vertical direction, the camera 14 is disposed in a position overlapping the suction head 20 moved by the suction head moving device 12 . In addition, the camera 14 is arranged to photograph vertically upward. Thereby, the camera 14 can photograph the suction head 20 moved by the suction head moving device 12 and the piezoelectric element P adsorbed by the suction head 20 from below. That is, the camera 14 can capture an image for measuring the position of the piezoelectric element P that is sucked by the four suction nozzles 28 with respect to the suction head 20 .

The laser measuring device 15 as a holding member position measuring device is a measuring device that measures the shape including the position of a plurality of holding members H connected in a sheet shape. The laser measuring device 15 is located vertically above the holding component supply device 11 on the stand 2 . When viewed in the vertical direction, the laser measuring device 15 is disposed in a position overlapping the sheet-like holding member H conveyed by the holding member supply device 11 . Furthermore, the laser measuring device 15 is configured to irradiate laser light vertically downward. Thereby, the laser measuring device 15 can measure the sheet-shaped holding member H supplied to the holding member supply device 11 from above the holding member H.

That is, the laser measuring device 15 can three-dimensionally measure the shape based on the shape, position, and thickness information of each location in the vertical direction of the plurality of holding members H connected in a sheet shape. In addition, the laser measuring device 15 is configured to be able to rotate and move in the horizontal direction in accordance with the position and degree of rotation of each holding member H in the horizontal direction. Thereby, the shape including the position of the holding member can be measured more accurately using laser scanning.

As shown in FIG. 6 , the control device 16 controls the piezoelectric element supply device 10 , the holding member supply device 11 , the suction head moving device 12 , the supply head moving device 13 , the suction head 20 , the supply head 30 , the camera 14 and the laser measurement device 15 . The control device 16 essentially connects CPU, ROM, RAM, etc. via a bus. Alternatively, the control device 16 may be composed of a single-chip LS I or the like. The control device 16 stores various programs and data for controlling the operations of each actuator, the camera 14 and the laser measurement device 15 or processing image data.

The control device 16 is electrically connected to each of the servo motors of the piezoelectric element supply device 10 , the holding member supply device 11 , the suction head moving device 12 and the supply head moving device 13 , and can control each of them independently. In addition, the control device 16 is electrically connected to the servo motors of the horizontal movement mechanism 21 for the suction head, the vertical movement mechanism 24 for the suction head, and the rotational movement mechanism 26 for the suction head of the suction head 20, and can be controlled independently. In addition, the control device 16 can control the solenoid valve for suction switching of the suction head 20 (not shown). In addition, the control device 16 is electrically connected to the servo motors of the horizontal movement mechanism 31 for the supply head and the vertical movement mechanism 34 for the supply head, and can control each of them independently. In addition, the control device 16 is electrically connected to the four supply devices 36 and can control each of them independently.

The control device 16 is electrically connected to the camera 14 and can control the camera 14 . In addition, the control device 16 can acquire images captured by the camera 14 . In addition, the control device 16 is electrically connected to the laser measuring device 15 and can control the laser measuring device 15 . In addition, the control device 16 can acquire measurement values of the respective positions and shapes of the plurality of holding members H measured by the laser measuring device 15 .

The piezoelectric vibration device manufacturing apparatus 1 configured in this way has a plurality of suction heads 20 that can independently move the suction nozzles 28 in the X direction, the Y direction, the Z direction, and the θ direction. Furthermore, the piezoelectric vibration device manufacturing apparatus 1 can independently control the positions of the suction nozzles 28 in the plurality of suction heads 20 . Furthermore, the piezoelectric vibration device manufacturing apparatus 1 has a plurality of supply heads 30 that can independently move the bonding material supply device 36 in the X direction, the Y direction, and the Z direction. Furthermore, the piezoelectric vibration device manufacturing apparatus 1 can independently control the positions of the supply devices 36 in the plurality of supply heads 30 .

<About the adsorption position of the piezoelectric element and the position of the holding member>

Next, using FIGS. 2A and 2B , the positions of the piezoelectric elements P adsorbed by the four suction heads 20 of the piezoelectric vibration device manufacturing apparatus 1 of the present invention on the tray T and the holding member H on which the piezoelectric elements P are arranged are described. The location is explained.

The suction nozzles 28 in the four suction heads 20 have a distance A times the distance Px in the X direction and a distance B times the distance Py in the Y direction. Therefore, the first suction head 20 among the four suction heads 20 suctions the first piezoelectric element P1 accommodated in any of the plurality of recesses C on the tray T in which the piezoelectric element P is accommodated. The second suction head 20 among the four suction heads 20 suctions the second piezoelectric elements P2 accommodated in A concave portions C adjacent to each other in the X direction from the concave portion C in which the first piezoelectric element P1 is accommodated. The third suction head 20 among the four suction heads 20 suctions the third piezoelectric elements P3 accommodated in B adjacent recesses C in the Y direction from the recess C in which the first piezoelectric element P1 is accommodated. The fourth pair of suction heads 20 among the four suction heads 20 is accommodated in A adjacent recessed portions C in the X direction and B adjacent in the Y direction from the recessed portion C in which the first piezoelectric element P1 is accommodated. 4 Piezoelectric element P4 performs adsorption.

The four suction heads 20 adsorb the piezoelectric element P accommodated in the recess C adjacent to one in the X direction from the recess C in which the first piezoelectric element P1 is accommodated as the piezoelectric element P to be adsorbed. In this case, one adjacent recess C in the The piezoelectric element P accommodated in is adsorbed as the piezoelectric element P to be adsorbed. The four suction heads 20 adsorb the piezoelectric element P accommodated in the recess C adjacent to one in the Y direction from the recess C in which the first piezoelectric element P1 is accommodated as the piezoelectric element P to be adsorbed. In this case, one adjacent recess C in the Y direction is placed from the recess C in which the first piezoelectric element P1, the second piezoelectric element P2, the third piezoelectric element P3, and the fourth piezoelectric element P4 are respectively accommodated. The piezoelectric element P accommodated in is adsorbed as the piezoelectric element P to be adsorbed.

Therefore, the four suction heads 20 respectively suction the piezoelectric elements P housed in the recesses C included in the following four areas among the plurality of recesses C on the tray T. The four areas are composed of the first piezoelectric elements accommodated therein. The range from the recessed portion C of the electric element P1, the second piezoelectric element P2, the third piezoelectric element P3 and the fourth piezoelectric element P4 to the (A-1) adjacent recessed portions C in the X direction is the same as From the recessed portion C housing the first piezoelectric element P1, the second piezoelectric element P2, the third piezoelectric element P3, and the fourth piezoelectric element P4 to (B-1) adjacent recessed portions C in the Y direction. 4 areas surrounded by the range so far. That is, the first suction head 20 suctions the piezoelectric element P in the first piezoelectric element region Rp1 including the recessed portion C in which the first piezoelectric element P1 is accommodated. The second suction head 20 suctions the piezoelectric element P in the second piezoelectric element region Rp2 including the recessed portion C in which the second piezoelectric element P2 is accommodated. The third suction head 20 suctions the piezoelectric element P in the third piezoelectric element region Rp3 including the recessed portion C in which the third piezoelectric element P3 is accommodated. The fourth suction head 20 suctions the piezoelectric element P in the fourth piezoelectric element region Rp4 including the recessed portion C in which the fourth piezoelectric element P4 is accommodated. In this way, each suction head 20 suctions a number of piezoelectric elements P contained in an area of equal shape corresponding to the number of suction heads 20 .

The first suction head 20 having the first piezoelectric element P1 adsorbed disposes the first piezoelectric element P1 in the recessed portion of the first holding member H1 of the holding member H at an arbitrary position. The second suction head 20 that has adsorbed the second piezoelectric element P2 arranges the second piezoelectric element P2 in the recessed portion of the second holding member H2, which is the holding member H adjacent to A in the X direction from the first holding member H1. Inside. The third suction head 20 that has adsorbed the third piezoelectric element P3 arranges the third piezoelectric element P3 in the recessed portion of the third holding member H3 adjacent to B holding members H in the Y direction from the first holding member H1 Inside. The fourth suction head 20 that has adsorbed the fourth piezoelectric element P4 arranges the fourth piezoelectric element P4 on holding members H adjacent to A in the X direction and B adjacent to the Y direction from the first holding member H1 That is, inside the recessed portion of the fourth holding member H4. In this way, each holding member H holds the piezoelectric element P.

When the four suction heads 20 arrange the piezoelectric element P on the holding member H adjacent to the first holding member H1 in the X direction from the first holding member H1 on which the first piezoelectric element P1 is arranged, the piezoelectric element P It is arrange|positioned to the holding member H adjacent to the X direction from the 1st holding member H1, the 2nd holding member H2, the 3rd holding member H3, and the 4th holding member H4. When the four suction heads 20 arrange the piezoelectric element P in the recessed portion of the holding member H adjacent to the first holding member H1 in the Y direction from the first piezoelectric element P1, The element P is arranged in the recessed portion of the holding member H adjacent to the first holding member H1, the second holding member H2, the third holding member H3, and the fourth holding member H4 in the Y direction.

Therefore, the four suction heads 20 respectively arrange the piezoelectric elements P in the recessed portions of the holding members H included in the following four areas among the plurality of holding members H connected in a sheet shape. The four areas are formed from the first The range from the 1 holding member H1, the 2nd holding member H2, the 3rd holding member H3, and the 4th holding member H4 to the (A-1) holding members H adjacent to each other in the X direction is the same as the range from the 1st holding member Four regions encompassed by the range from H1, the second holding member H2, the third holding member H3, and the fourth holding member H4 to the (B-1) holding members H adjacent to each other in the Y direction. That is, the first suction head 20 arranges the first piezoelectric element P1 in the recessed portion of the holding member H in the first holding member region Rh1 including the first holding member H1. The second suction head 20 arranges the second piezoelectric element P2 in the recessed portion of the holding member H in the second holding member region Rh2 including the second holding member H2. The third suction head 20 arranges the third piezoelectric element P3 in the recessed portion of the holding member H in the third holding member region Rh3 including the third holding member H3. The fourth suction head 20 arranges the fourth piezoelectric element P4 in the recessed portion of the holding member H in the fourth holding member region Rh4 including the fourth holding member H4. In this way, each suction head 20 disposes the piezoelectric elements P in the recessed portions of the holding member H included in a number corresponding to the number of suction heads 20 and having mutually equal shapes.

In addition, when the piezoelectric element P to be sucked by the suction head 20 from the recessed portion C at an arbitrary position in the first piezoelectric element region Rp1 is arranged in the first holding member region Rh1, the piezoelectric element P to be sucked is accommodated in the first holding member region Rh1. In the case of the holding member H at a position corresponding to the recessed portion C in the first piezoelectric element region Rp1 of P, the first holding member region Rh1 and the first piezoelectric element region Rp1 have the same shape. The second holding member region Rh2 and the second piezoelectric element region Rp2 have the same shape. The third holding member region Rh3 and the third piezoelectric element region Rp3 have the same shape. The fourth holding member region Rh4 and the fourth piezoelectric element region Rp4 have the same shape. That is, the arrangement of the holding members H from the first holding member region Rh1 to the fourth holding member region Rh4 is equivalent to the arrangement of the piezoelectric elements P from the first piezoelectric element region Rp1 to the fourth piezoelectric element region Rp4.

<Adjustment of piezoelectric element placement>

Next, the position adjustment of the suction nozzle 28 in the suction head 20 of the piezoelectric vibration device manufacturing apparatus 1 of the present invention will be described using FIGS. 1 , 7 and 8 . FIG. 7 is a schematic plan view showing a state in which the plurality of suction heads 20 of the piezoelectric vibration device manufacturing apparatus 1 transport the piezoelectric element P to the holding member supply position Sh. FIG. 8 is a schematic plan view showing a state in which the positions of the suction nozzles 28 of the plurality of suction heads 20 of the piezoelectric vibration device manufacturing apparatus 1 are adjusted.

The control device 16 has information on the position of the holding component supply device 11 , information on the position of the suction head moving device 12 , information on the position of the supply head moving device 13 , information on the position of the camera 14 , and information on the position of the camera 14 . Information on the position of the laser measuring device 15 , information on the position of the suction head 20 , and information on the position of the supply head 30 .

As shown in FIG. 1 , the control device 16 measures the shape of a plurality of sheet-like holding members H conveyed by the holding member supply device 11 using the laser measuring device 15 . At this time, the control device 16 acquires the measurement value regarding the shape of the plurality of sheet-shaped holding members H measured by the laser measuring device 15 . After the control device 16 acquires the measurement value regarding the shape of the holding member H, the holding member supply device 11 transports the plurality of sheet-shaped holding members H to the holding member supply position Sh.

The control device 16 calculates the measured values for each holding member based on the acquired measurement values of the plurality of holding members H and the conveying positions of the plurality of holding members H in the holding member supply device 11 when measured by the laser measuring device 15 . The coordinate value of the center position of H in the X direction, Y direction and Z direction and the θ direction which is the longitudinal direction is H(n)(x0, y0, z0, θ0). In addition, (n) is the number of the holding member H. The control device 16 stores the measured coordinate value H(n)(x0n, y0n, z0n, θ0n) of the holding member H as information I h regarding the position of the holding member H.

As shown in FIG. 7 , the control device 16 controls the holding member supply device 11 based on the predetermined bonding order of the piezoelectric elements P among the plurality of holding members H, so that the first piezoelectric element among the plurality of holding members H is arranged. The first to fourth holding members H1 to H4 of the piezoelectric elements P1 to P4 are transported to the holding member supply position Sh. Based on the calculated information I h about the position of the holding member H, the control device 16 extracts the coordinate values H1 (x11, y11, z11, θ11), H2(x12, y12, z12, θ12), H3(x13, y13, z13, θ13), H4(x14, y14, z14, θ14).

The control device 16 controls the suction head moving device 12 so as to transport the four suction heads 20 in which the four piezoelectric elements P from the first piezoelectric element P1 to the fourth piezoelectric element P4 are suctioned respectively to the holding member supply position Sh. . The control device 16 controls the camera 14 so that the first to fourth piezoelectric elements P1 to P4 respectively adsorbed by the four suction heads 20 through the suction nozzles 28 are photographed from below.

The control device 16 acquires the image captured by the camera 14 . The control device 16 detects the suction head 20 and the first to fourth piezoelectric elements P1 to P4 adsorbed by the suction nozzle 28 from the acquired image. The control device 16 detects the suction head 20 , the first to fourth piezoelectric elements P1 to P4 adsorbed by the suction nozzle 28 , and the transport position of the suction head 20 in the suction head moving device 12 when capturing an image, respectively. Calculate the coordinate values P1 (x01, y01, θ01) and P2 (x02) showing the detected center positions in the X direction and the Y direction and the orientations in the longitudinal direction of the first to fourth piezoelectric elements P1 to P4. , y02, θ02), P3 (x03, y03, θ03), P4 (x04, y04, θ04).

The control device 16 controls the first holding member H1 to the fourth holding member H4 based on the coordinate values of the X direction, the Y direction and the θ direction at the holding member supply position Sh, that is, H1 (x11, y11, θ11), H2 (x12, y12, θ12), H3 (x13, y13, θ13), H4 (x14, y14, θ14), calculate the coordinates of the first to fourth piezoelectric elements P1 to P4 adsorbed by the suction nozzle 28 at the holding member supply position Sh The values are P1 (x11, y11, θ11), P2 (x12, y12, θ12), P3 (x13, y13, θ13), P4 (x14, y14, θ14), and serve as information related to the position of the piezoelectric element P I p is stored.

The control device 16 calculates P1 (x11, y11, θ11), which is the coordinate value of the first piezoelectric element P1 at the holding member supply position Sh, and the coordinate value of the first holding member H1 corresponding to the holding member supply position Sh, which is When H1 (x11, y11, θ11) is consistent, the required movement amount of the suction nozzle 28 in the X direction, Y direction, θ direction and Z direction is Ap1 (x11, y11, z11, θ11). Similarly, the control device 16 calculates the coordinate values P2 (x12, y12, θ12) and P3 (x13, y13, θ13) of the second to fourth piezoelectric elements P2 to P4 at the holding member supply position Sh. , P4 (x14, y14, θ14) and the coordinate values of the second holding member H2 to the fourth holding member H4 respectively corresponding to the holding member supply position Sh, that is, H2 (x12, y12, θ12), H3 (x13, y13, θ13), H4 (x14, y14, θ14) are consistent and the required adjustment amount of the suction nozzle 28 in the X direction, Y direction, θ direction and the movement amount in the Z direction are Ap2 (x11, y11, z11, θ11), Ap3 (x13, y13, z13, θ13), Ap4 (x14, y14, z14, θ14).

As shown in FIG. 8 , the control device 16 calculates the adjustment amounts of the four suction nozzles 28 in the X direction, the Y direction, and the θ direction and the movement amounts in the Z direction, that is, Ap1 (x11, y11, z11, θ11), Ap2 ( x11, y11, z11, θ11), Ap3 (x13, y13, z13, θ13), Ap4 (x14, y14, z14, θ14), control the horizontal movement mechanism 21 of the suction head and the rotational movement of the suction head of each suction head 20 The mechanism 26 is used to independently adjust the horizontal position and inclination of the suction nozzle 28 for each suction head 20 . Furthermore, the control device 16 controls the suction head vertical movement mechanism 24 of each suction head 20 based on the calculated movement amount in the Z direction so that the first to fourth piezoelectric elements P1 to P4 are arranged in the first holding position. part H1 to the fourth holding part H4. That is, the control device 16 controls the horizontal movement mechanism 21 for the suction head and the vertical movement mechanism 21 for the suction head of each suction head 20 based on the information I p about the position of the piezoelectric element P and the information I h about the position of the holding member H. At least one of the moving mechanism 24 or the suction head rotation moving mechanism 26 is used to adjust the position of the suction nozzle 28 .

<Adjustment of the supply position of the joining material>

Next, the position adjustment of the discharge nozzle 36a in the supply head 30 of the piezoelectric vibration device manufacturing apparatus 1 of the present invention will be described.

The control device 16 controls the supply head moving device 13 in order to transport the four supply heads 30 to the holding member supply position Sh. The control device 16 determines the coordinate values of the first to fourth holding members H1 to H4 at the holding member supply position Sh based on the information on the position of the supply head 30 and H1 (x11, y11, z11, θ11), H2 (x12 , y12, z12, θ12), H3 (x13, y13, z13, θ13), H4 (x14, y14, z14, θ14), calculate the coordinate values of the four discharge nozzles 36a at the holding component supply position Sh, which is J1 (x11 , y11), J2 (x12, y12), J3 (x13, y13), J4 (x14, y14), and are stored as information related to the position of the joining material.

The control device 16 calculates the coordinate value J1 (x11, y11) of one of the four supply devices 36 at the holding member supply position Sh and the coordinate value of the corresponding first holding member H1 at the holding member supply position Sh, that is, When H1 (x11, y11, z11, θ11) is consistent, the adjustment amount of the discharge nozzle 36a in the X direction, Y direction, θ direction and the movement amount in the Z direction required are Aj 1 (x11, y11, z11). Similarly, the control device 16 calculates the coordinate values of the other three discharge nozzles 36a at the holding member supply position Sh, that is, J2 (x12, y12), J3 (x13, y13), and J4 (x14, y14), respectively. The coordinate values of the second holding member H2 to the fourth holding member H4 at the holding member supply position Sh are H2 (x12, y12, z12, θ12), H3 (x13, y13, z13, θ13), H4 (x14, y14, z14, θ14) are consistent and the required adjustment amount of the discharge nozzle 36a in the X direction, Y direction and the movement amount in the Z direction are Aj2 (x12, y12, z12), Aj3 (x13, y13, z13), Aj4 (x14, y14, z14).

The control device 16 calculates Aj1 (x11, y11, z11), Aj2 (x12, y12, z12), and Aj3 based on the calculated adjustment amounts of the four suction nozzles 28 in the X direction, the Y direction, and the θ direction, and the movement amounts in the Z direction. (x13, y13, z13), Aj4 (x14, y14, z14), the supply head horizontal movement mechanism 31 of each supply head 30 is controlled to independently adjust the horizontal position of the discharge nozzle 36a for each supply head 30 . Furthermore, the control device 16 controls the supply heads of each supply head 30 based on Aj1 (x11, y11, z11), Aj2 (x12, y12, z12), Aj3 (x13, y13, z13), and Aj4 (x14, y14, z14). The vertical movement mechanism 34 is used to move the discharge nozzle 36 a in the vertical direction for each supply head 30 to arrange the bonding material in the recessed portion of the holding member H. That is, the control device 16 controls the horizontal movement mechanism 31 for the supply head or the vertical movement mechanism 31 for the supply head of each supply head 30 based on the information I p regarding the position of the piezoelectric element P and the information I h regarding the position of the holding member H. At least one of the mechanisms 34 is moved to adjust the position of the supply device 36 .

Next, the piezoelectric element mounting step S100 included in the method of manufacturing a piezoelectric vibration device using the piezoelectric vibration device manufacturing apparatus 1 will be described using FIGS. 9 to 12 . FIG. 9 is a flowchart of the piezoelectric element mounting step S100 included in the method of manufacturing a piezoelectric vibration device. 10 is a diagram showing the piezoelectric element in the holding member position information acquisition process S110 in the piezoelectric element mounting process S100, the piezoelectric element supply process S120, the holding member supply process S125, the piezoelectric element positioning process S130, and the holding member positioning process S135. A top view of the operating state of the vibration device manufacturing apparatus 1 . FIG. 11 is a plan view showing the operating state of the piezoelectric vibration device manufacturing apparatus 1 in the bonding material supply position adjustment process S140 in the piezoelectric element mounting process S100 and the bonding material supply process S150. FIG. 12 is a diagram illustrating the manufacturing of the piezoelectric vibration device in the piezoelectric element transportation step S160 in the piezoelectric element mounting step S100, the piezoelectric element position information acquisition step S170, the piezoelectric element position adjustment step S180, and the piezoelectric element bonding step S190. Top view of device 1 in working condition.

As shown in FIG. 9 , the piezoelectric element mounting step S100 includes a holding member position information acquisition step S110, a piezoelectric element supplying step S120, a holding member supplying step S125, a piezoelectric element positioning step S130, a holding member positioning step S135, and a bonding material supply. Position adjustment process S140, bonding material supply process S150, piezoelectric element transportation process S160, piezoelectric element position information acquisition process S170, piezoelectric element position adjustment process S180, and piezoelectric element bonding process S190.

As an initial state of the piezoelectric vibration device manufacturing apparatus 1 , in the piezoelectric element supply device 10 , a tray T housing a plurality of piezoelectric elements P is supplied to the tray placement portion 10 a from an external supply line (not shown). Furthermore, in the holding member supply device 11 , a plurality of sheet-shaped holding members H are supplied to the holding member placement portion 11 a from an external supply line (not shown) (see FIG. 1 ).

The holding member position information acquisition step S110 is a step of acquiring information I h regarding the positions of the plurality of holding members H. In the holding member position information acquisition step S110 , the laser measuring device 15 measures the shapes of the plurality of holding members H while moving the plurality of holding members H by the holding member supply device 11 . The laser measuring device 15 sends the measured values to the control device 16 . The piezoelectric element mounting process S100 moves to the piezoelectric element supply process S120 after completing the holding member position information acquisition process S110.

As shown in FIG. 10 , the piezoelectric element supply step S120 is a step of supplying the piezoelectric element P mounted on the holding member H among the plurality of piezoelectric elements P accommodated in the tray T to the piezoelectric element supply position Sp. In the piezoelectric element supply step S120 , the piezoelectric element supply device 10 transfers the target piezoelectric element P among the plurality of piezoelectric elements P stored in the tray T on the tray placement section 10 a from the piezoelectric element through the tray placement section 10 a. The electric element standby position Wp is conveyed to the conveyance reference position of the piezoelectric element supply position Sp. The piezoelectric element mounting process S100 moves to the holding member supply process S125 after completing the piezoelectric element supply process S120.

The holding member supply step S125 is a step of supplying the holding member H in which the piezoelectric element P is arranged among the plurality of holding members H to the holding member supply position Sh. In the holding member supply step S125, the holding member supply device 11 transports the target holding member H among the plurality of holding members H on the holding member placement portion 11a from the holding member standby position Wh to the holding member through the holding member placement portion 11a. The transportation reference position of the parts supply position Sh. The piezoelectric element mounting process S100 moves to the piezoelectric element positioning process S130 after completing the holding member supply process S125.

The piezoelectric element positioning step S130 is a step of positioning the piezoelectric element P to be joined to the holding member H among the plurality of piezoelectric elements P transported to the transportation reference position of the piezoelectric element supply position Sp. The piezoelectric element supply device 10 positions the target piezoelectric element P among the plurality of piezoelectric elements P accommodated in the tray T at the transportation reference position of the piezoelectric element supply position Sp through the tray mounting portion 10 a at the piezoelectric element supply device 10 . Location Sp. The piezoelectric element mounting process S100 moves to the holding member positioning process S135 after completing the piezoelectric element positioning process S130.

The holding member positioning step S135 is a step of positioning the holding member H to which the piezoelectric element P is bonded among the plurality of holding members H transported to the transportation reference position of the holding member supply position Sh. The holding member supply device 11 positions the target holding member H among the plurality of holding members H at the transportation reference position of the holding member supply position Sh at the holding member supply position Sh through the holding member placement portion 11 a. The piezoelectric element mounting process S100 moves to the bonding material supply position adjusting process S140 after completing the holding member positioning process S135.

As shown in FIG. 11 , the joining material supply position adjustment step S140 is a step of adjusting the position of the supply device 36 that supplies the joining material. In the bonding material supply position adjustment step S140, the supply head moving device 13 transports the supply head 30 from the standby position W to the holding member supply position Sh. The supply head horizontal movement mechanism 31 of each supply head 30 independently adjusts the discharge nozzle 36 a for each supply head 30 based on the adjustment amount of the discharge nozzle 36 a of each supply device 36 in the X direction and the Y direction calculated by the control device 16 the horizontal position. The piezoelectric element mounting process S100 moves to the bonding material supply process S150 after completing the bonding material supply position adjustment process S140.

The bonding material supply step S150 is a step of supplying the bonding material into the recessed portion of the holding member H. In the bonding material supply step S150 , the supply head vertical movement mechanism 34 of each supply head 30 moves the supply head vertical movement mechanism 34 for each supply head 30 based on the movement amount of the discharge nozzle 36 a of each supply device 36 in the Z direction calculated by the control device 16 . The supply device 36 independently moves downward in the vertical direction. The supply device 36 supplies the bonding material into the recessed portion of the holding member H. When the supply of the bonding material is completed, the supply head of each supply head 30 moves the supply device 36 upward in the vertical direction using the vertical movement mechanism 34 . The supply head moving device 13 transports the supply head 30 from the holding member supply position Sh to the waiting position W. The piezoelectric element mounting process S100 moves to the piezoelectric element conveyance process S160 after completing the bonding material supply process S150.

As shown in FIG. 12 , the piezoelectric element transport step S160 is a process of transporting the piezoelectric element P arranged in the holding member H from the piezoelectric element waiting position Wp to the holding member supply position Sh. In the piezoelectric element transport step S160, the suction head vertical movement mechanism 24 of each suction head 20 moves the suction nozzle 28 downward in the vertical direction at the piezoelectric element supply position Sp. Each suction head 20 suctions the piezoelectric element P from the tray T through the suction nozzle 28 . The suction head vertical movement mechanism 24 of each suction head 20 moves the suction nozzle 28 upward in the vertical direction at the piezoelectric element supply position Sp. The suction head moving device 12 transports the suction head 20 to the holding member supply position Sh. The piezoelectric element mounting process S100 moves to the piezoelectric element position information acquisition process S170 after completing the piezoelectric element transportation process S160.

The piezoelectric element position information acquisition step S170 is a step of acquiring information I p regarding the position of the adsorbed piezoelectric element P. In the piezoelectric element position information acquisition step S170 , the camera 14 takes an image of the piezoelectric element P sucked by the suction head 20 and the suction nozzle 28 that are being transported by the suction head moving device 12 . The camera 14 sends the captured image to the control device 16 . The piezoelectric element mounting process S100 moves to the piezoelectric element position adjustment process S180 after completing the piezoelectric element position information acquisition process S170.

The piezoelectric element position adjustment step S180 is a step of adjusting the position of the suction nozzle 28 . In the piezoelectric element position adjustment step S180 , the suction head horizontal movement mechanism 21 and the suction head rotation movement mechanism 26 of each suction head 20 move in the X direction, Y direction, and θ direction based on the respective suction nozzles 28 calculated by the control device 16 . The adjustment amount allows the horizontal position and orientation of the suction nozzle 28 to be adjusted independently for each suction head 20 (see FIGS. 7 and 8 ). The piezoelectric element mounting process S100 moves to the piezoelectric element bonding process S190 after completing the piezoelectric element position adjustment process S180.

The piezoelectric element bonding step S190 is a step of arranging the piezoelectric element P in the recess of the holding member H to which the bonding material is supplied, and bonding the piezoelectric element P and the holding member H. In the piezoelectric element bonding step S190 , the suction head vertical movement mechanism 24 of each suction head 20 moves the suction nozzle 28 for each suction head 20 based on the movement amount of each suction nozzle 28 in the Z direction calculated by the control device 16 . Move independently and vertically downward. Thereby, the piezoelectric element P is joined to the holding member H via the joining material. Each suction head 20 releases the piezoelectric element P from the suction nozzle 28 . The suction head vertical movement mechanism 24 of each suction head 20 moves the supply device 36 upward in the vertical direction. The suction head moving device 12 transports the suction head 20 to the piezoelectric element supply position Sp. The piezoelectric element mounting process S100 moves to the piezoelectric element positioning process S130 after completing the piezoelectric element bonding process S190.

In addition, in the piezoelectric element bonding step S190, when the piezoelectric elements P are bonded to all the holding members H, the plurality of holding members H to which the piezoelectric elements P are bonded are transported from the holding member supply position Sh to Maintain component standby position Wh. Furthermore, in order to confirm the mounting state of the piezoelectric element P with respect to the transported plurality of holding members H, the laser measurement device 15 acquires information I h on the positions of the plurality of holding members H.

The piezoelectric vibration device manufacturing apparatus 1 configured in this way allows the plurality of piezoelectric elements P to be supplied in a matrix state in which the relative distance between them is maintained. Similarly, the plurality of holding members H are supplied in a matrix state in which the relative distances between them are maintained. Accordingly, the piezoelectric vibration device manufacturing apparatus 1 can simultaneously acquire the information I p on the positions of the plurality of piezoelectric elements P that are sucked by the suction head 20 and the information I h on the positions of the holding members H.

Furthermore, the piezoelectric vibration device manufacturing apparatus 1 uses the suction head horizontal The moving mechanism 21 and the suction head rotation movement mechanism 26 independently adjust the positions of the plurality of suction nozzles 28 in the X direction, the Y direction, and the θ direction. Thereby, the plurality of suction heads 20 can individually adjust the positions of the plurality of piezoelectric elements P that are respectively suctioned based on the position of the holding member H. Thereby, the suction head 20 can arrange the piezoelectric element P in the recessed portion of the holding member H while taking into consideration the variation in the shape of the holding member H. Furthermore, the plurality of suction heads 20 can individually adjust the positions of the suction nozzles 28 based on the information I p on the position of the piezoelectric element P and the information I h on the position of the holding member H, which are numerical data. Therefore, there is no need to perform Temporary placement of alignment, etc.

In addition, the plurality of supply heads 30 are adjusted independently by matching the position of the supply bonding material with the position of the holding member H by the horizontal movement mechanism 31 for the supply head and the vertical movement mechanism 34 for the supply head. Furthermore, since the plurality of supply heads 30 can individually adjust the position of the supply device 36 by acquiring the information I h regarding the position of the holding member H as numerical data, there is no need to perform positioning of the holding member H or the like. In addition, the laser measuring device 15 individually measures not only the horizontal position but also the vertical position of the plurality of holding members H supplied to the holding member supply position Sh. Therefore, the vertical positions of the piezoelectric elements P respectively arranged in the plurality of holding members H can be independently adjusted based on the vertical positions of the holding members H. Therefore, the plurality of piezoelectric elements P can be arranged in the recessed portions of the plurality of holding members H at predetermined positions and in predetermined directions with high accuracy without increasing the production cycle time.

In addition, the manufacturing method of the piezoelectric vibration device includes a piezoelectric element position adjustment step S180, which is based on the information I h related to the position of the holding member H and the piezoelectric element P acquired during transportation in the piezoelectric element transportation step S160. The position-related information I p independently adjusts the positions of the plurality of piezoelectric elements P. The camera 14 simultaneously captures the piezoelectric element P and the suction nozzle 28 sucked by the suction nozzle 28 of the suction head 20 . Therefore, in the information Ip related to the position of the piezoelectric element P, the offset of the piezoelectric element P with respect to the plurality of suction nozzles 28 is taken into account. Therefore, there is no need to provide a separate step of positioning the piezoelectric element P with respect to the suction nozzle 28 by temporarily placing the piezoelectric element P or the like after the piezoelectric element transport step S160 . In addition, the joining material supply position adjustment step S140 individually adjusts the supply position of the joining material based on the information Ih regarding the position of the holding member H which is numerical data. Therefore, the manufacturing method of the piezoelectric vibration device does not require separate positioning and the like for each holding member H. Therefore, the plurality of piezoelectric elements P can be arranged in the recessed portions of the plurality of holding members H at predetermined positions and in predetermined directions without increasing the production cycle time.

[Embodiment 2]

<Composition of Piezoelectric Vibration Device Manufacturing Equipment>

Next, a part of the piezoelectric vibration device manufacturing line 100 of Embodiment 2 including the piezoelectric vibration device manufacturing apparatus 1 of the present invention will be described using FIGS. 13 and 14 . FIG. 13 is a plan view showing the structure of the piezoelectric vibration device manufacturing line 100 including the piezoelectric vibration device manufacturing apparatus 1 . FIG. 14 is a block diagram showing the control structure of the piezoelectric vibration device manufacturing line 100 including the piezoelectric vibration device manufacturing apparatus 1 . A part of the piezoelectric vibration device manufacturing line 100 in this embodiment is the mounting portion 110 for mounting the piezoelectric element P on the holding member H.

As shown in FIG. 13 , the mounting unit 110 includes a transport device that transports a tray T housing a plurality of piezoelectric elements P and a plurality of holding members H arranged in a sheet shape, and a plurality of piezoelectric vibration device manufacturing devices 1 . In this embodiment, the mounting unit 110 is composed of a robot moving device 111 as a conveying device, a supply table 112 and a conveying robot 113, and four piezoelectric vibration device manufacturing devices 1. The mounting part 110 is controlled by the line control device 120 (see FIG. 14 ) of the piezoelectric vibration device manufacturing line 100 .

The robot moving device 111 and the transport robot 113 transport the tray T containing the plurality of piezoelectric elements P to the piezoelectric element supply devices 10 of the four piezoelectric vibration device manufacturing apparatuses 1 respectively. In addition, the robot moving device 111 and the transport robot 113 transport the plurality of holding members H arranged in a sheet shape to the holding member supply devices 11 of the four piezoelectric vibration device manufacturing apparatuses 1 respectively. Furthermore, the robot moving device 111 and the transport robot 113 collect the sheet-shaped holding member H to which the piezoelectric element P is bonded from the holding member supply devices 11 of the four piezoelectric vibration device manufacturing apparatuses 1 .

The robot moving device 111 is a device that moves the transportation robot 113 . The robot transport device is, for example, a single-axis linear drive unit including a servo motor as an actuator and a ball screw unit as a linear drive mechanism. The transport robot 113 is mounted on the movable portion of the robot moving device 111 . The robot moving device 111 is provided so that the direction in which the transport robot 113 moves when viewed in the Z direction is defined as the Y direction. Therefore, the robot moving device 111 is configured to be able to move the transport robot 113 to any position in the Y direction.

The supply table 112 is a table that stores the tray T storing the plurality of piezoelectric elements P and the sheet-shaped holding member H. The tray T accommodating the piezoelectric element P and the sheet-shaped holding member H are supplied to the supply table 112 by a supply device or an operator in an upstream process (not shown). The supply table 112 is arranged at an end of the robot moving device 111 .

The transport robot 113 supplies the tray T containing the piezoelectric element P to the piezoelectric element supply device 10 of the piezoelectric vibration device manufacturing apparatus 1 . Furthermore, the transport robot 113 supplies the sheet-shaped holding member H to the holding member supply device 11 of the piezoelectric vibration device manufacturing apparatus 1 . The transport robot 113 is, for example, a double-armed horizontal articulated robot (SCARA type robot) having two arms. The transport robot 113 is mounted on the movable part of the robot moving device 111 . Therefore, the transport robot 113 is configured to be movable to any position in the Y direction by the robot moving device 111 when viewed in the Z direction. In addition, when viewed in the vertical direction, the transport robot 113 is configured to move the tray T and the sheet-like holding member H to the X direction perpendicular to the Y direction (the direction of movement by the robot moving device 111 ) with each arm. one side (X+ direction side) and the other side in the X direction (X- direction side).

Each of the four piezoelectric vibration device manufacturing apparatuses 1 independently joins the piezoelectric element P and the holding member H. When viewed in the vertical direction, two of the four piezoelectric vibration device manufacturing devices 1 are arranged on one side of the robot moving device 111 . In addition, two piezoelectric vibration device manufacturing apparatuses 1 are arranged side by side in the Y direction. At this time, the two piezoelectric vibration device manufacturing apparatuses 1 are arranged so that the moving direction (Y direction) of the suction head moving device 12 is parallel to the moving direction of the robot moving device 111 . Furthermore, the two piezoelectric vibration device manufacturing apparatuses 1 are positioned so that the piezoelectric element standby position Wp in the piezoelectric element supply device 10 and the holding member standby position Wh in the holding member supply device 11 are located on the robot moving device 111 side and are located on the transport robot. 113 ways to configure within the movable range.

When viewed in the vertical direction, the other two piezoelectric vibration device manufacturing devices 1 among the four piezoelectric vibration device manufacturing devices 1 are arranged on the other side of the robot moving device 111 . In addition, two piezoelectric vibration device manufacturing apparatuses 1 are arranged side by side in the Y direction. At this time, the two piezoelectric vibration device manufacturing apparatuses 1 are arranged so that the moving direction (Y direction) of the suction head moving device 12 is parallel to the moving direction of the robot moving device 111 . Furthermore, the two piezoelectric vibration device manufacturing apparatuses 1 are positioned so that the piezoelectric element standby position Wp in the piezoelectric element supply device 10 and the holding member standby position Wh in the holding member supply device 11 are located on the robot moving device 111 side and are located on the transport robot. 113 ways to configure within the movable range.

The loading unit 110 configured in this way can supply the trays T stored on the supply table 112 to the piezoelectric element waiting positions Wp in the piezoelectric element supply devices 10 of the four piezoelectric vibration device manufacturing apparatuses 1 via the transport robot 113 . Furthermore, the mounting unit 110 can supply the sheet-like holding members H stored in the supply table 112 to the holding member waiting positions Wh in the holding member supply devices 11 of the four piezoelectric vibration device manufacturing apparatuses 1 via the transport robot 113 . Furthermore, the mounting unit 110 can use the transport robot 113 to collect the sheet-shaped holding members H in which the piezoelectric elements P are respectively stored from the holding member standby positions Wh in the holding member supply devices 11 of the four piezoelectric vibration device manufacturing apparatuses 1 . The mounting unit 110 is configured to be able to supply the sheet-shaped holding member H collected by the transport robot 113 to an adhesive curing furnace (not shown) on the downstream side.

As shown in FIGS. 13 and 14 , when a control signal related to the start of production is input from the line control device 120 of the piezoelectric vibration device manufacturing line 100 , at least one of the four piezoelectric vibration device manufacturing devices 1 in the mounting unit 110 Taiwan started manufacturing piezoelectric vibration devices. In addition, the line control device 120 determines the number of operating piezoelectric vibration device manufacturing apparatuses 1 based on the production volume of piezoelectric element devices.

For example, when it is necessary to supply the piezoelectric element P, the operating piezoelectric vibration device manufacturing apparatus 1 outputs a supply signal of the piezoelectric element P to the line control device 120 . When acquiring the supply signal of the piezoelectric element P, the line control device 120 outputs a control signal for supplying the piezoelectric element P to the conveying device. The robot moving device 111 and the transport robot 113 supply the tray T containing the plurality of piezoelectric elements P from the supply table 112 to the piezoelectric element waiting position Wp in the piezoelectric element supply device 10 of the piezoelectric vibration device manufacturing apparatus 1 .

For example, when it is necessary to eject the tray T containing the piezoelectric element P, the operating piezoelectric vibration device manufacturing apparatus 1 outputs a signal to eject the tray T containing the piezoelectric element P to the line control device 120 . When acquiring a signal to eject the tray T containing the piezoelectric element P, the line control device 120 outputs a control signal to the robot moving device 111 and the transport robot 113 to eject the pallet T containing the piezoelectric element P. The robot moving device 111 and the transport robot 113 collect the tray T containing the piezoelectric element P from the holding member standby position Wh in the holding member supply device 11 of the piezoelectric vibration device manufacturing apparatus 1, and supply it to a bonding agent (not shown). Curing oven.

In this way, the piezoelectric vibration device manufacturing line 100 can flexibly cope with the production volume of piezoelectric vibration devices by combining a plurality of piezoelectric vibration device manufacturing devices 1 .

[Other embodiments]

In addition, in the above-described embodiment, the piezoelectric vibration device manufacturing apparatus 1 includes four suction heads 20 and four supply heads 30 . However, the piezoelectric vibration device manufacturing apparatus 1 only needs to have a plurality of suction heads 20 and supply heads 30 respectively.

Furthermore, in the above-described embodiment, the plurality of supply heads 30 may be configured so that the positions of the respective supply devices 36 can be adjusted simultaneously. In addition, the plurality of suction heads 20 may be configured so that the positions of the respective suction nozzles 28 can be adjusted simultaneously. Accordingly, regardless of the number of suction heads 20 and supply heads 30 , the time required to adjust the positions of the plurality of suction heads 20 and the plurality of supply heads 30 can be suppressed.

Furthermore, in the above-described embodiment, the piezoelectric vibration device manufacturing apparatus 1 measures the position of the piezoelectric element P relative to the suction head 20 based on the image captured by the camera 14 as the piezoelectric element position measuring device. However, the piezoelectric element position measuring device only needs to be a device capable of measuring the position of the piezoelectric element adsorbed by the adsorption nozzle. The piezoelectric element position measuring device may be, for example, a laser measuring device.

Furthermore, in the above-described embodiment, the camera 14 is arranged on the gantry 2 . However, the camera may also be mounted on the suction head.

Furthermore, in the above-described embodiment, the piezoelectric vibration device manufacturing apparatus 1 calculates the positions of the plurality of holding members H based on the measurement values measured by the laser measuring device 15 as the holding member position measuring device. However, the holding member position measuring device only needs to be a device capable of measuring the shapes of a plurality of holding members. The holding member position measuring device may be a camera or the like.

In addition, in the above-described embodiment, the suction head moving device 12 is composed of a single-axis linear drive unit. However, the suction head moving device only needs to be a device capable of moving the suction head from the piezoelectric element supply position to the holding member supply position. The suction head moving device may be, for example, a horizontal multi-joint robot or a vertical multi-joint robot. The same applies to the piezoelectric element supply device and the holding member supply device.

Furthermore, in the above-described embodiment, the piezoelectric vibration device manufacturing apparatus 1 supplies a plurality of holding members H to the holding member supply position Sh through one holding member supply device 11 . However, the piezoelectric vibration device manufacturing apparatus may have a plurality of holding member supply devices. By having a plurality of holding member supply devices, the piezoelectric vibration device manufacturing apparatus can arrange the piezoelectric elements on other holding members while discharging the plurality of holding members that have completed the arrangement of the piezoelectric elements through one holding member supply device. A plurality of holding components supplied by a supply device.

Furthermore, in the above-described embodiment, the tray T has the recessed portion C for accommodating the piezoelectric element P. However, the tray T only needs to be capable of supplying a plurality of piezoelectric elements arranged in a matrix.

Furthermore, in the above-described embodiment, the plurality of holding members H supplied to the piezoelectric vibration device manufacturing apparatus 1 are connected in a sheet shape. However, it suffices as long as the plurality of holding members can be supplied in a matrix-like state. For example, each of the plurality of holding members may be accommodated in a tray in which a plurality of recessed portions are arranged in a matrix.

In addition, in the above-described embodiment, the piezoelectric element supply device 10, the holding member supply device 11, the suction head moving device 12, the supply head moving device 13, the suction head horizontal movement mechanism 21 of the suction head 20, the suction head vertical movement mechanism 20, and the suction head vertical movement mechanism 21. The moving mechanism 24 and the rotational movement mechanism 26 for the suction head, the horizontal movement mechanism 31 for the supply head and the vertical movement mechanism 34 for the supply head 30 are single-axis linear drive units using a servo motor as an actuator, but they are not It is not limited to this. The piezoelectric element supply device 10 , the holding member supply device 11 , the suction head moving device 12 , the supply head moving device 13 , the moving mechanism of the suction head 20 and the moving mechanism of the supply head 30 are configured as long as they can control the movement amount such as a linear motor. Can.

Furthermore, in the above-described embodiment, the laser measuring device 15 is configured to be able to rotate and move in the horizontal direction in accordance with the position and degree of rotation of each holding member H in the horizontal direction. However, when the holding member is arranged with high precision relative to the holding member supply device, the laser measuring device may be configured to be movable only in the Y direction. In this case, the holding member can be moved in the X direction by the holding member supply device. Therefore, the laser measuring device can measure the shape of the sheet-shaped holding member. The laser measuring device is configured to be movable only in the Y direction, thereby suppressing shaking, positional deviation, etc. of the movable part, so that measurement can be performed with higher accuracy. Alternatively, the laser measuring device may be fixed and only the holding member may be moved in the X direction and the Y direction by the holding member supply device.

Furthermore, in the above-described embodiment, the holding member H is a case having a recessed portion in which the piezoelectric element P can be arranged. The holding member H arranges the piezoelectric element P in the recess. However, the holding member may be a flat member without a recess in which the piezoelectric element can be arranged. The holding member arranges the piezoelectric element on the plane of the flat member. In this case, the holding member is covered with a cover member (drawn cover structure) having a recessed portion.

Furthermore, in the above-mentioned Embodiment 2, the mounting unit 110 includes four piezoelectric vibration device manufacturing apparatuses 1 . However, the mounting unit may include one or more and three or less piezoelectric vibration device manufacturing devices. In addition, the mounting unit may include five or more piezoelectric vibration device manufacturing devices.

The embodiments of the present invention have been described above, but the above-described embodiments are only examples for implementing the present invention. Therefore, the above-described embodiment is not limited to the above-described embodiment, and the above-described embodiment can be appropriately modified and implemented within a range that does not deviate from the gist of the invention.

Explanation of reference signs

1 Piezoelectric vibration device manufacturing equipment

2 racks

10 Piezoelectric element supply device

10a Pallet placement section

11Hold parts supply device

11a Holding component placement portion

12 adsorption head moving device

12a suction head placement part

13 Supply head moving device

13a Supply head mounting part

14 cameras

15laser measuring device

16 control devices

20 adsorption heads

21 Horizontal moving mechanism for adsorption head

22. First moving part for suction head

23Second moving part for suction head

24 Vertical moving mechanism for adsorption head

25Third moving part for suction head

26 Rotary moving mechanism for suction head

27The fourth moving part for suction head

28 suction mouth

30 supply heads

31 Horizontal moving mechanism for supply head

32 First moving part for supply head

33 Second moving part for supply head

34 vertical moving mechanism for supply head

35. Third moving part for supply head

36 supply device

36a discharge nozzle

36b cooling device

36c contact sensor

100 piezoelectric vibration device manufacturing line

110 mounting part

111 Robot Mobile Device

112 supply station

113Conveying robot

120 line control device

P piezoelectric element

P1 first piezoelectric element

P2 second piezoelectric element

P3 third piezoelectric element

P4 4th piezoelectric element

H holding parts

H1 first holding part

H2 second holding member

H3 third holding component

H4 4th holding part

I p information related to the position of the piezoelectric element

I h Information related to the position of the holding component

C concavity.

Claims (12)

1. A piezoelectric vibration device manufacturing apparatus for manufacturing a piezoelectric vibration device having at least a piezoelectric element and a holding member for holding the piezoelectric element, wherein the piezoelectric element is bonded to the holding member by a bonding material in the holding member,

the piezoelectric vibration device manufacturing apparatus includes:

a plurality of adsorption heads for adsorbing the piezoelectric elements one by one;

A suction head moving device for mounting the plurality of suction heads to move the plurality of suction heads back and forth simultaneously between a piezoelectric element supply position for supplying the plurality of piezoelectric elements and a holding member supply position for supplying the plurality of holding members,

the adsorption head has:

an adsorption nozzle for adsorbing the piezoelectric element;

the adsorption head moves the adsorption nozzle in the horizontal direction by using a horizontal moving mechanism;

the adsorption head moves the adsorption nozzle in the vertical direction by using a vertical moving mechanism;

the adsorption head uses a rotary moving mechanism to move the adsorption nozzle in the rotating direction around a vertical shaft,

the plurality of suction heads are provided at the piezoelectric element supply position to suction the piezoelectric elements supplied to the piezoelectric element supply position by the plurality of suction nozzles, and the plurality of suction heads are moved from the piezoelectric element supply position to the holding member supply position by the suction head moving means,

at least one of the horizontal moving mechanism for the suction head, the vertical moving mechanism for the suction head, and the rotary moving mechanism for the suction head

Based on information on positions of the plurality of piezoelectric elements respectively adsorbed by the plurality of adsorption nozzles and information on positions of the plurality of holding members supplied to the holding member supply position, positions of the adsorption nozzles are individually and independently adjusted so that the piezoelectric elements respectively adsorbed by the plurality of adsorption nozzles can be arranged on the corresponding holding members.

2. The piezoelectric vibration device manufacturing apparatus according to claim 1, comprising:

a plurality of supply heads for supplying the joining materials to the holding members, respectively;

a head moving device for mounting the plurality of heads and simultaneously reciprocating the plurality of heads from the standby position of the plurality of heads to the holding member feeding position,

the supply head has:

a supply device for supplying the bonding material;

a horizontal moving mechanism for the supply head, which moves the supply device in a horizontal direction;

a vertical moving mechanism for the supply head, which moves the supply device in a vertical direction,

moving the plurality of supply heads from the standby position to the holding member supply position by the supply head moving means,

at least one of the horizontal moving mechanism for the supply head and the vertical moving mechanism for the supply head individually adjusts the positions of the supply devices based on information on positions of the plurality of holding members supplied to the holding member supply positions, respectively, so that the plurality of supply devices can supply the joining material to the plurality of holding members, respectively.

3. The apparatus for manufacturing a piezoelectric vibration device according to claim 2,

in the holding member supply position, a plurality of the supply heads individually supply the joining material to a plurality of the holding members by a plurality of the supply means, respectively,

in the holding member supply position, the plurality of suction heads individually and individually dispose the piezoelectric elements sucked by the suction nozzles on the plurality of holding members to which the joining material is supplied.

4. The apparatus for manufacturing a piezoelectric vibration device according to any one of claim 2 to 3,

the plurality of heads can simultaneously adjust the positions of the respective feeding devices by at least one of the horizontal moving mechanism for the heads or the vertical moving mechanism for the heads.

5. The apparatus for manufacturing a piezoelectric vibration device according to claim 1,

the plurality of suction heads may be configured to simultaneously adjust the positions of the suction nozzles by at least one of the suction head horizontal movement mechanism, the suction head vertical movement mechanism, and the suction head rotational movement mechanism.

6. The piezoelectric vibration device manufacturing apparatus according to claim 1, comprising:

a piezoelectric element position measurement device that measures, as information on the positions of the piezoelectric elements, positions in a horizontal direction of the plurality of piezoelectric elements and orientations of the piezoelectric elements, respectively, which are adsorbed by the plurality of adsorption heads;

and a holding member position measuring device that measures, as information relating to the positions of the holding members, positions in the horizontal direction and the vertical direction of the plurality of holding members supplied to the holding member supply position, respectively.

7. A method for manufacturing a piezoelectric vibration device, which comprises at least a piezoelectric element and a holding member for holding the piezoelectric element, wherein the piezoelectric element is bonded to the holding member by a bonding material, is characterized by comprising:

a piezoelectric element supply step of supplying a plurality of the piezoelectric elements to a piezoelectric element supply position;

a piezoelectric element positioning step of positioning a plurality of piezoelectric elements to a piezoelectric element supply position;

a holding member supply step of supplying a plurality of holding members to a holding member supply position;

A holding member positioning step of positioning a plurality of holding members to a holding member supply position;

a piezoelectric element transporting step of transporting the plurality of piezoelectric elements positioned at the piezoelectric element supply position from the piezoelectric element supply position to the holding member supply position;

and a piezoelectric element position adjustment step of adjusting the positions of the plurality of piezoelectric elements independently and individually, based on information on positions of the plurality of piezoelectric elements transported from the piezoelectric element supply position to the holding member supply position and information on positions of the holding members positioned at the holding member supply position, so that the plurality of piezoelectric elements transported from the piezoelectric element supply position to the holding member supply position can be arranged on the corresponding holding members.

8. The method of manufacturing a piezoelectric vibration device according to claim 7, comprising:

and a joining material supply position adjustment step of adjusting, at the holding member supply position, a supply position of the joining material supplied to the holding member based on information on a position of the holding member supplied to the holding member supply position.

9. The method of manufacturing a piezoelectric vibration device according to claim 8, comprising:

a joining material supply step of supplying the joining material to each of the plurality of holding members at the holding member supply position;

and a piezoelectric element joining step of disposing, at the holding member supply position, the plurality of piezoelectric elements transported from the piezoelectric element supply position to the holding member supply position, respectively, on the plurality of holding members to which the joining material is supplied.

10. The method for manufacturing a piezoelectric vibration device according to any one of claims 8 to 9,

the joining material supply position adjustment step is a step of simultaneously adjusting positions at which the joining materials are supplied to the plurality of holding members, respectively.

11. The method of manufacturing a piezoelectric vibration device according to claim 7,

the piezoelectric element position adjustment step is a step of simultaneously adjusting positions of the plurality of piezoelectric elements so that the plurality of piezoelectric elements can be arranged on the holding member, respectively.

12. The method of manufacturing a piezoelectric vibration device according to claim 7, comprising:

A piezoelectric element position information acquisition step of acquiring information on positions in a horizontal direction of the plurality of piezoelectric elements and orientations of the piezoelectric elements, which are transferred from the piezoelectric element supply position to the holding member supply position, respectively;

a holding member position information acquisition step of acquiring information on positions in the horizontal direction and the vertical direction of the plurality of holding members supplied to the holding member supply position, respectively.