CN116899830A - Dispensing adjustment method and dispensing machine thereof - Google Patents
Dispensing adjustment method and dispensing machine thereof Download PDFInfo
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- CN116899830A CN116899830A CN202310919553.6A CN202310919553A CN116899830A CN 116899830 A CN116899830 A CN 116899830A CN 202310919553 A CN202310919553 A CN 202310919553A CN 116899830 A CN116899830 A CN 116899830A
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000003292 glue Substances 0.000 claims abstract description 310
- 230000007246 mechanism Effects 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 230000009471 action Effects 0.000 claims description 9
- 230000004044 response Effects 0.000 claims description 2
- 238000005303 weighing Methods 0.000 description 13
- 238000001514 detection method Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
- B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1026—Valves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Coating Apparatus (AREA)
Abstract
The application relates to the technical field of glue filling, and provides a glue dispensing adjustment method and a glue filling machine thereof. The dispensing adjustment method comprises the following steps: acquiring preset glue profile information, and acquiring a filling reference range according to the preset glue profile information; performing dispensing operation, acquiring product image information after dispensing, acquiring actual glue profile information based on the product image information, and acquiring an actual filling range according to the actual glue profile information; and performing glue solution compensation under the condition that the actual filling range is not matched with the filling reference range. According to the dispensing adjustment method provided by the application, only the comparison of the filling range of the glue solution is needed, the glue solution is photographed to obtain the contour information, the method is not limited by time or other parameters, and the whole operation is simple and convenient.
Description
Technical Field
The application relates to the technical field of glue filling, in particular to a glue dispensing adjustment method and a glue filling machine thereof.
Background
The glue filling machine is used for controlling glue solution to drop, coat and fill the glue solution on the surface of a product or in the product, so as to realize the functions of sealing, fixing, water proofing, shock proofing and the like. Therefore, the quality of dispensing tends to affect the sealing, fixing and other effects, so that the dispensing liquid needs to be detected during dispensing. However, in the related art, in order to improve the production efficiency, glue solution detection is often performed before dispensing, and timing of glue dispensing is performed based on time. However, as the requirement of the production precision is gradually increased, the situation of unequal glue solution, less glue or more glue still occurs in the mode; moreover, if time is taken as a reference, electrical control is needed, and if control interruption occurs, the glue amount is changed.
Disclosure of Invention
Based on the above, it is necessary to provide a dispensing adjustment method, which can satisfy the detection of dispensing glue solution and the monitoring of dispensing amount during dispensing, is not affected by parameters such as time, and is simple and convenient to operate.
A dispensing adjustment method comprises the following steps:
acquiring preset glue profile information, and acquiring a filling reference range according to the preset glue profile information;
performing dispensing operation, acquiring product image information after dispensing, acquiring actual glue profile information based on the product image information, and acquiring an actual filling range according to the actual glue profile information;
and performing glue solution compensation under the condition that the actual filling range is not matched with the filling reference range.
In other words, according to the dispensing adjustment method provided by the application, the actual glue profile information of the glue solution after dispensing is compared with the preset glue profile information, and the actual filling range of the actual glue profile information relative to the preset glue profile information is judged, so that whether the dispensing reaches the dispensing requirement or not can be obtained, and the glue solution compensation operation is needed or not. Because only the comparison of the glue filling ranges is carried out, the glue is photographed to obtain the contour information, the method is not limited by time or other parameters, and the method does not need to rely on electrical control, so that the whole operation is simple and convenient. In addition, the glue filling range can be compared, and the glue dispensing quantity of the dispensing glue can be monitored at any time.
In some embodiments, the acquiring the filling reference range according to the preset glue profile information includes: determining a pattern to be filled according to the preset glue profile information, wherein the area of the pattern to be filled is the area of a pattern surrounded by the preset glue profile; and/or, the obtaining the actual filling range according to the actual glue profile information includes: and determining an actual filling pattern according to the actual glue profile information, wherein the area of the actual filling pattern is the area of the pattern surrounded by the actual glue profile.
In some embodiments, the performing glue compensation in the case that the actual filling range does not match the filling reference range includes:
comparing the area of the actual filling pattern with the area of the pattern to be filled, and obtaining an area percentage;
and comparing the area percentage with a preset ratio range, and performing glue solution compensation under the condition that the area percentage is smaller or larger than the preset ratio range.
In some embodiments, the performing glue compensation includes:
obtaining an actual glue weight mP of an actual glue solution, and comparing the actual glue weight mP with a preset glue weight mT to obtain a glue weight difference value mC;
and performing glue solution compensation according to the glue weight difference value mC.
In some embodiments, the performing glue compensation according to the glue weight difference mC includes:
when single dispensing is obtained, a first parameter relation between output current and output air pressure and a second parameter relation between output air pressure and output adhesive weight are obtained;
obtaining a third parameter relation between the output current and the output glue weight according to the first parameter relation and the second parameter relation;
and adjusting output current according to the third parameter relation and the glue weight difference value mC so as to adjust the glue output.
In some embodiments, the adjusting the output current according to the third parameter relationship and the glue weight difference mC to adjust the glue amount includes:
obtaining output current A0 once per compensation, and corresponding output glue weight m:
m= ((mN-m (N-1)) + (m (N-1)) -m (N-2)) +,. M1)/N; the method comprises the steps of carrying out a first treatment on the surface of the Wherein N is more than or equal to 2, and N is an integer;
obtaining compensation times K=mC/m according to the glue weight difference value mC and the output glue weight m;
the compensation current amount a=k×a0, which is the total output current that needs to be compensated, is obtained.
In some embodiments, the first parameter relationship is: f=da, the second parameter relationship is: m= eF;
the obtaining a third parameter relationship between the output current and the output glue weight according to the first parameter relationship and the second parameter relationship includes: m= eF = edA.
In some embodiments, after the glue solution compensation, the glue dispensing adjustment method further includes the following steps:
obtaining the compensation glue weight of the compensated glue amount, and comparing the compensation glue weight with a preset glue weight range;
waiting for continuing the dispensing action under the condition that the compensation adhesive weight is in the preset adhesive weight range;
and under the condition that the compensation glue weight is smaller or larger than the preset glue weight range, re-acquiring the actual glue weight mP of the compensated glue amount, and repeating the steps after acquiring the actual glue weight mP of the actual glue solution.
In some of these embodiments, in the event that the actual fill range matches the fill reference range, the dispensing action is awaited to continue.
The application also provides a glue pouring machine, and the glue dispensing adjustment method is applied; the glue filling machine further comprises a moving mechanism, a glue dispensing valve connected with the moving mechanism and an image acquirer connected with the moving mechanism, wherein the moving mechanism is used for driving the glue dispensing valve and the image acquirer to reciprocate along a first direction.
In some embodiments, the glue dispenser includes a switching valve, a first supply unit, and a second supply unit; the first feeding unit and the second feeding unit are arranged at intervals along a second direction, and the switching valve is connected between the first feeding unit and the second feeding unit and is connected with the dispensing valve; the first feeding unit and the second feeding unit are respectively connected with inductors, and the two inductors are opposite and are arranged at intervals; the first feeding unit and the second feeding unit can be respectively communicated with the switching valve, the switching valve is connected with a triggering baffle, and the triggering baffle is configured to move in response to the driving of the switching valve so as to trigger the sensor alternatively; wherein the second direction is disposed at an angle to the first direction.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments or the conventional techniques of the present application, the drawings required for the descriptions of the embodiments or the conventional techniques will be briefly described below, and it is apparent that the drawings in the following descriptions are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.
FIG. 1 is a first flowchart of a dispensing adjustment method according to an embodiment of the present application;
FIG. 2 is a second flowchart of a dispensing adjustment method according to an embodiment of the present application;
FIG. 3 is a linear diagram showing the output air pressure and the output glue weight in the dispensing adjustment method according to an embodiment of the present application;
FIG. 4 is a linear diagram of output current versus output air pressure in a dispensing adjustment method according to an embodiment of the present application;
FIG. 5 is a first partial schematic view of a glue-pouring machine according to an embodiment of the present application;
FIG. 6 is a second partial schematic view of a glue-pouring machine according to an embodiment of the present application;
FIG. 7 is an enlarged view of a portion of FIG. 6 at A;
fig. 8 is a third partial schematic view of a glue-pouring machine according to an embodiment of the application.
Reference numerals: 10. a moving mechanism; 20. dispensing valve; 30. an image acquirer; 40. a switching valve; 41. triggering a baffle; 42. a connecting column; 50. a first feeding unit; 60. a second feeding unit; 70. an inductor; 80. a mounting base; 81. bending sections; 90. and (5) mounting a bracket.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and the like are used in the description of the present application for the purpose of illustration only and do not represent the only embodiment.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" on a second feature may be that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through intermedial media. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely under the second feature, or simply indicating that the first feature is less level than the second feature.
Unless defined otherwise, all technical and scientific terms used in the specification of the present application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used in the description of the present application includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, an embodiment of the present application provides a dispensing adjustment method, which can satisfy the detection of dispensing glue solution during dispensing, and is not affected by parameters such as time, and is simple and convenient to operate. The following describes the dispensing adjustment method in detail.
As shown in fig. 1, in some embodiments, the dispensing adjustment method includes the following steps:
acquiring preset glue profile information, and acquiring a filling reference range according to the preset glue profile information;
performing dispensing operation, acquiring product image information after dispensing, acquiring actual glue profile information based on the product image information, and acquiring an actual filling range according to the actual glue profile information;
and performing glue solution compensation under the condition that the actual filling range is not matched with the filling reference range.
It should be noted in advance that the glue compensation referred to herein includes positive compensation and negative compensation. Specifically, the positive compensation is the situation that when the actual filling range is smaller than the filling reference range, glue solution needs to be added; negative compensation is the case when the actual filling range is larger than the filling reference range, and the glue solution needs to be reduced.
Specifically, when dispensing is performed, the glue solution forms a glue solution shape at the position of dispensing, and at the moment, the glue solution shape can be obtained through photographing or laser detection and the like and is recorded as product image information; and then obtaining the outline of the glue solution shape according to the glue solution shape, and marking the outline as actual glue shape outline information. And comparing the actual glue profile information with preset glue profile information to judge the actual filling range of the actual glue profile information relative to the preset glue profile information. When the judgment is performed, the actual graph surrounded by the actual glue-shaped outline and the preset graph surrounded by the preset glue-shaped outline are overlapped, the actual graph and the preset graph can show different colors, and whether the actual graph and the preset graph are completely overlapped is judged; if the two are completely overlapped, the situation that the actual filling range is matched with the filling reference range is considered, and the dispensing is indicated to meet the requirement; if the preset pattern is not different from the actual pattern, namely the preset pattern protrudes from the actual pattern or the actual pattern protrudes from the preset pattern, the situation that the actual filling range is not matched with the filling reference range is caused, and then glue solution compensation is needed. In addition, the glue filling range is required to be compared, so that the actual glue profile information can be monitored in real time, and the real-time monitoring of the glue outlet amount of the point glue outlet is met.
In an alternative embodiment, the size of the actual glue profile may be calculated and compared with the size of the preset glue profile; if the two dimensions are the same, the dispensing requirement is met; if the two sizes are different, glue solution compensation is needed. Wherein, considering the error, the two sizes can be compared in a certain range. Of course, the area may be compared by calculating the area of the preset pattern and the area of the actual pattern, respectively. In any way, the comparison result between the actual filling range and the filling reference range can be obtained, and whether the filling range is satisfied or the glue solution compensation is needed can be judged according to the comparison result.
It should be added that when the actual filling range matches the filling reference range, the dispensing operation is waited for to continue. That is, when the two are matched, that is, the actual glue profile is basically consistent with the preset glue profile, the dispensing is required, the glue solution compensation is not needed, and the dispensing valve only needs to wait for the command to perform the dispensing operation.
The preset glue profile information can be preset patterns simulated by an operator in a computer according to actual demands, and the preset glue profile information is stored in an upper computer and is called from the upper computer when the preset glue profile information is compared with the actual patterns. Of course, the operator can also carry out dispensing on the product according to the actual requirement, obtain the image after dispensing and record the image on the host computer as the preset graph, and the preset glue profile information can be obtained. Whichever way is adopted, the method only needs to obtain the preset glue profile information meeting the requirements.
As shown in fig. 1, exemplary, the acquiring the filling reference range according to the preset glue profile information includes: and determining a pattern to be filled according to the preset glue profile information, wherein the area of the pattern to be filled is the area of the pattern surrounded by the preset glue profile. Meanwhile, obtaining the actual filling range according to the actual glue profile information comprises the following steps: and determining an actual filling pattern according to the actual glue profile information, wherein the area of the actual filling pattern is the area of the pattern surrounded by the actual glue profile.
Further, in the case where the actual filling range does not match the filling reference range, performing the dope compensation includes: comparing the area of the actual filling pattern with the area of the pattern to be filled to obtain an area percentage, comparing the area percentage with a preset ratio range, and performing glue solution compensation under the condition that the area percentage is smaller than or larger than the preset ratio range.
That is, in this embodiment, the actual filling range and the filling reference range are determined by using the pattern area, and in this case, only the areas of the two areas need to be compared, which may be calculated or the pattern areas may be overlapped. Moreover, when the product image information is obtained by using a photographing mode, the actual filling pattern can be directly obtained, and the operation is simpler and more convenient. The size of the corresponding area of the contour can be calculated by using an image coordinate system, and the specific calculation process is the existing mature technology and is not described herein.
When the filling method is actually used, after the area value of the actual filling pattern and the area value of the pattern to be filled are obtained, the area value of the pattern to be filled can be used as a denominator, the area value of the actual filling pattern is used as a numerator, the ratio of the two is obtained, and the area percentage can be obtained by multiplying the ratio by the percentage. If the area of the actual filling pattern is matched with the area of the pattern to be filled, the ratio is 1, and the area percentage is 100%; if the area of the actual filling pattern is smaller than the area of the pattern to be filled, the ratio is smaller than 1, and the area percentage is smaller than 100%; if the area of the actual filling pattern is larger than the area of the pattern to be filled, the ratio is larger than 1, and the area percentage is larger than 100%. Thus, 100% of this point can be taken as the preset ratio.
Of course, in dispensing, because there is still a dispensing error due to the superposition of the manufacturing error and the control feedback error, the preset ratio is actually a range value within an acceptable range, i.e. a preset ratio range, for example, 95% -105%, which can meet the dispensing requirement as long as it can be within the range, and if it is greater than 105% or less than 95%, the dispensing requirement is not met, and the glue solution compensation is needed.
It should be added that this range is not limited to the range requirement, and it needs to be set according to the adhesive quality and the actual requirement.
In an alternative embodiment, the actual filling pattern is overlapped with the pattern to be filled, and then whether the actual filling pattern and the pattern to be filled are completely overlapped is observed, or the range of the actual filling pattern protrudes out of the range of the pattern to be filled, or the range of the actual filling pattern is in the range of the pattern to be filled, so that the pattern to be filled has a blank area which is not blocked. Then, the size of the protruding area or the blank area can be calculated and compared with a preset range; if the glue quantity is within the acceptable range, the glue dispensing requirement is met, and if the glue quantity is greater than or less than the preset range, glue liquid compensation is needed. In this case, the range of the protruding area or the blank area is calculated, and when 0, the range is set to-5% to +5% for the purpose of completely overlapping, which is exemplified in consideration of the error.
In an alternative embodiment, as shown in fig. 1 and 2, the glue compensation comprises the steps of: obtaining an actual glue weight mP of the actual glue solution, and comparing the actual glue weight mP with a preset glue weight mT to obtain a glue weight difference value mC; and performing glue solution compensation according to the glue weight difference value mC.
It should be noted that, when the weights of the glue are consistent, the glue output through the dispensing valve is basically the same, and the glue shape formed by spreading the glue on the plane is basically the same; if the glue weights are different, the corresponding glue output amounts are different, and the glue shapes formed by diffusion on a plane are also different. Therefore, when the area of the actual filling pattern is compared with the area of the pattern to be filled, the area percentage between the actual filling pattern and the area percentage of the pattern to be filled does not reach the preset ratio range; at this time, the actual glue solution corresponding to the actual filling image can be weighed to obtain the actual glue weight mP, and the glue weight difference mC is the difference between the actual glue weight mP and the preset glue weight mT, and the dispensing valve is adjusted according to the glue weight difference mC. Wherein the glue weight difference mC = actual glue weight mP-preset glue weight mT; or, the glue weight difference mc=preset glue weight mT-actual glue weight mP; or, the glue weight difference value mc= |actual glue weight mP-preset glue weight mt|.
Further, before the glue solution compensation step, the glue dispensing valve is moved to the position above the weighing platform, and glue is dispensed on the weighing platform by the glue dispensing valve so as to weigh. The setting can carry out dispensing compensation based on the dispensing state of the dispensing valve; and the compensation operation and the actual dispensing operation are not on the same platform, so that the actual dispensing operation is not influenced. The weighing platform adopts an electronic scale so as to weigh the glue solution discharged from the glue dispensing valve point.
As shown in fig. 1 and 2, in actual use, two different stations may be provided, the first station being a dispensing detection station and the second station being an actual dispensing station. Wherein, the weighing platform sets up at the point and glues detection station. Therefore, before the product to be dispensed is required to be dispensed, the dispensing quality of the dispensing valve is detected at the dispensing detection station. Specifically, when the glue dispensing valve dispenses glue to the weighing platform, taking a photo of the glue by a camera to obtain a glue profile of the glue, namely an actual glue profile; then, the actual glue profile is compared with the preset glue profile, and the specific comparison mode is described in detail above, which is not repeated here. If the actual glue profile is matched with the preset glue profile, the glue solution on the weighing platform is erased, the glue dispensing valve is moved to enter the actual glue dispensing station, and the glue dispensing action can be executed based on the to-be-upper computer instruction. If the actual glue profile is not matched with the preset glue profile, the weighing platform is required to obtain the actual glue weight mP of the glue solution, and the actual glue weight mP is compared with the preset glue weight mT to obtain a glue weight difference value mC, so that the glue outlet amount of the glue dispensing valve can be conveniently adjusted, and the glue dispensing requirement can be met.
Referring to fig. 3 and 4, exemplary glue compensation according to the glue weight difference mC includes: when single dispensing is obtained, a first parameter relation between output current and output air pressure and a second parameter relation between output air pressure and output adhesive weight are obtained; obtaining a third parameter relation between the output current and the output glue weight according to the first parameter relation and the second parameter relation; and adjusting the output current according to the third parameter relation and the glue weight difference value mC so as to adjust the glue output.
That is, the dispensing valve outputs the amount of glue in association with the single output current and the output air pressure when dispensing. Specifically, the dispensing valve adopts an electric proportional valve to control the dispensing quantity, and the electric proportional valve realizes the throttling control of the flow in an electric control mode, so that the output current can influence the output air pressure, and the output air pressure can influence the output glue weight. Therefore, the third parameter relation between the output current and the output glue weight can be obtained, and at the moment, the output glue weight can be regulated and controlled only by controlling the output current.
Further, the first parameter relationship between the output current and the output air pressure is: f=da, where F is an output air pressure value, a is an output current value, and d is a proportionality coefficient of the output air pressure and the output current; the second parameter relation between the output air pressure and the output adhesive weight is as follows: m= eF, wherein m is the output adhesive weight, F is the output air pressure value, and e is the proportionality coefficient of the output adhesive weight and the output air pressure; obtaining a third parameter relationship between the output current and the output glue weight according to the first parameter relationship and the second parameter relationship comprises: m= eF = edA. That is, the output current and the output air pressure are in a proportional function relationship, and the output air pressure and the output adhesive weight are in a proportional function relationship, so that the obtained output current and the output adhesive weight are also in a proportional function relationship. Specifically, as shown in fig. 3, as the output air pressure increases gradually, the output glue weight increases gradually; meanwhile, as shown in fig. 4, as the output current increases gradually, the output air pressure increases gradually. Therefore, when the output current increases, the output paste weight also gradually increases.
In an alternative embodiment, adjusting the output current according to the third parameter relationship and the glue weight difference mC, so as to adjust the glue output includes:
obtaining the corresponding output glue weight m when the output current A0 is compensated once:
obtaining compensation times K=mC/m according to the glue weight difference value mC and the output glue weight m;
the compensation current amount a=k×a0, which is the output current to be compensated, is obtained.
Wherein A0 is the amount of current of the single output current. That is, after the output glue weight m corresponding to the output current A0 is obtained according to the third parameter relationship, the compensation frequency K required for compensation when the glue weight difference mC is required to be compensated according to the ratio of the glue weight difference mC to the output glue weight m is obtained. Thus, the amount of compensation current a of the output current that needs to be compensated in total can be obtained. For example, given that the glue weight difference mC between the actual glue weight mP and the preset glue weight mT is 100mg, and the output glue weight m corresponding to the output current is 10mg for each compensation, the number of compensation times k=mc/m=10. The resulting compensation current a=10a0. In other embodiments, the unit of glue weight may be "g", and the specific glue amount is selected according to actual needs, which is only illustrated herein.
When the output glue weight corresponding to the output current is calculated for each compensation, multiple groups of data can be obtained through multiple times of measurement, and then the multiple groups of data are added to calculate an average value, so that the output glue weight m= ((mN-m (N-1))+ (m (N-1) -m (N-2))+. Times.m1)/N corresponding to the output current for each compensation can be obtained; wherein N is more than or equal to 2, and N is an integer. It will be appreciated that each set of data includes a corresponding number of previous measurements and corresponding data after compensating for one output current. For example, (mN-m (N-1)) is a set of data, and when N is 4, it represents 4 sets of data, where m= ((m 4-m 3) + (m 3-m 2) + (m 2-m 1) +m1)/4, with m1 as the initial amount, is compensated. This is only by way of example.
When in actual use, the compensation current quantity A is fed back to the electric proportional valve, and the electric proportional valve can increase or decrease the air flow according to the output air pressure of the adhesive dispensing valve; after the air flow is regulated, the dispensing valve is controlled to perform dispensing action so as to dispense the glue solution to the weighing platform, and the weighing platform can weigh the supplemented glue solution to obtain the compensation glue weight. Wherein, when the compensation current amount A is obtained, A can be added on the basis of the original current amount, or A can be reduced; the original current amount is the current amount corresponding to the actual glue weight mP.
In an alternative embodiment, as shown in fig. 2, after the glue solution compensation, the glue dispensing adjustment method further includes the following steps:
obtaining the compensation glue weight of the compensated glue amount, and comparing the compensation glue weight with a preset glue weight range; waiting for continuing the dispensing action under the condition that the compensation adhesive weight is in the preset adhesive weight range; and under the condition that the compensation glue weight is smaller or larger than the preset glue weight range, the actual glue weight mP of the compensated glue amount is obtained again, and the steps after the actual glue weight mP of the actual glue solution is obtained are repeated.
That is, after the glue solution after dispensing is weighed and compensated on the weighing platform, the compensated glue solution needs to be weighed and calculated, and whether the weight of the compensated glue solution after compensation meets the requirement is judged; if the requirement is met, the dispensing valve is moved to the position above the product to be dispensed, and dispensing treatment is carried out; if the requirement cannot be met, the compensation is needed again until the compensation glue weight meets the requirement. By the arrangement, the accuracy of glue solution compensation can be effectively improved, and the operation is carried out on the weighing platform, so that the actual operation of glue dispensing of a product is not influenced.
When the compensation glue weight reaches the preset glue weight range in actual use, the glue discharging and wiping actions are required to be carried out on the symmetrical weight platform. At this time, the dispensing valve is in waiting for continuing the dispensing action so as to dispense the product. Meanwhile, when dispensing of a product to be dispensed is performed, the dispensing valve is required to be moved to the weighing platform for judgment before dispensing, and when the dispensed adhesive weight meets the requirement, the dispensing valve can be moved to the position above the product to be dispensed after an instruction. If the glue weight does not meet the requirement, the difference value is calculated to compensate the glue solution until the glue weight meets the requirement.
The application also provides a glue filling machine which is used for performing the glue dispensing operation in the glue dispensing adjustment method. Specifically, as shown in fig. 5, the glue dispenser at least includes a moving mechanism 10, a dispensing valve 20 connected to the moving mechanism 10, and an image capturing device 30 connected to the moving mechanism 10, wherein the moving mechanism 10 is used for driving the dispensing valve 20 and the image capturing device 30 to reciprocate along a first direction. The image acquirer 30 is used for acquiring product image information so as to determine actual glue profile information, and is used for judging glue profile and compensating glue solution. Meanwhile, the moving mechanism 10 can drive the dispensing valve 20 to move along the vertical direction relative to the product, so that the dispensing height of the dispensing valve 20 can be adjusted conveniently, and the dispensing valve 20 can be moved to avoid other structures acting on the product to be dispensed; meanwhile, the moving mechanism 10 can drive the image acquirer 30 to move relative to the product to be dispensed, so as to adjust the height to acquire a clearer image, thereby facilitating the subsequent glue profile judgment and glue solution compensation.
The first direction is a vertical direction, i.e. a Z-axis direction in fig. 6.
In practical use, the moving mechanism 10 may further drive the dispensing valve 20 and the image acquirer 30 to move along a horizontal direction, so that the dispensing valve 20 can switch positions between the product to be dispensed and the weighing platform. Of course, other mechanisms for realizing linear motion may be connected to the moving mechanism 10, and the moving mechanism 10 may drive the dispensing valve 20 and the image acquirer 30 to move in the horizontal direction. The moving mechanism 10 may be a screw drive, a belt drive, or the like, as long as it can realize a linear motion in the vertical direction, which is not particularly limited.
As shown in fig. 6 to 8, the glue dispenser further includes a switching valve 40, a first feeding unit 50 and a second feeding unit 60, the first feeding unit 50 and the second feeding unit 60 being arranged at intervals along the second direction, the switching valve 40 being connected between the first feeding unit 50 and the second feeding unit 60 and being connected to the dispensing valve 20, the switching valve 40 being capable of switching one of the first feeding unit 50 and the second feeding unit 60 to communicate with the dispensing valve 20. In this way, two feeding units can be adapted to one dispensing valve 20, and the two feeding units are respectively communicated with the dispensing valve 20 through the arrangement of the switching valve 40. When the glue solution in one of the feeding units is insufficient, the arrangement can be switched to the other feeding unit to be communicated with the dispensing valve 20, so that uninterrupted glue supply of the dispensing valve 20 is ensured, and the dispensing quality is improved.
The first feeding unit 50 has a first axis, the second feeding unit 60 has a second axis, and a vertical line is disposed between the first axis and the second axis, and the length direction of the vertical line is the second direction. As shown in fig. 6, the second direction may be an X-axis direction.
In actual use, in order to improve the switching accuracy of the first feeding unit 50 and the second feeding unit 60, the first feeding unit 50 and the second feeding unit 60 are connected with the sensors 70, and the two sensors 70 are opposite and spaced apart. Meanwhile, a valve core of the switching valve 40 is connected with a trigger baffle 41, and the trigger baffle 41 is positioned outside a valve cavity of the switching valve 40 so as to trigger any one of the two sensors 70. When the switching valve 40 switches the communication state, the valve core needs to move in the valve cavity, i.e. the trigger catch 41 is driven to move to trigger one of the two sensors 70. Therefore, when the trigger catch 41 triggers the sensor 70 corresponding to any one of the feeding units, the corresponding switching valve 40 is switched to the corresponding feeding unit and is communicated with the feeding unit. Thus, compared to human judgment, the arrangement can use the sensor 70 to send out sensing warning to assist in indicating whether the switching is in place, thereby improving the switching accuracy and further improving the dispensing quality and dispensing performance.
The connection of the valve element to the trigger catch 41 can be realized by means of a connecting post 42. One end of the connecting column 42 is connected with the valve core, the other end of the connecting column 42 is provided with a mounting groove, one end of the triggering baffle 41 is provided with an annular part, and the triggering baffle is sleeved in the mounting groove to realize the assembly with the connecting column 42.
Further, the switching valve 40 has a first port connected to the first supply unit 50, a second port connected to the second supply unit 60, and a third port connected to the dispensing valve 20. When the first through hole is communicated with the third through hole, the first feeding unit 50 feeds the dispensing valve 20; when the second port is communicated with the third port, the second feeding unit 60 feeds the dispensing valve 20. The valve core is rotated in the valve body of the switching valve 40 to switch the communication state between the ports, so that the trigger baffle 41 also rotates synchronously with the valve core to trigger one of the two sensors 70.
In an alternative embodiment, the communication state of each port in the switching valve 40 may be switched by means of translation of the valve core. For example, the spool moves in the axial direction of the switching valve 40 within the valve body so as to satisfy that one of the first port and the second port communicates with the third port. At this time, the axial direction of the switching valve 40 is the direction of the first feeding unit 50 facing the second feeding unit 60, and the movement of the blocking piece 41 between the first feeding unit 50 and the second feeding unit 60 is triggered along with the valve core.
With continued reference to fig. 6 and 7, the glue-pouring machine further includes a mounting bracket 90, wherein the mounting bracket 90 is disposed between the first feeding unit 50 and the second feeding unit 60, and each sensor 70 is disposed on the mounting bracket 90 at intervals. Each sensor 70 corresponds to a mounting seat 80, a bending section 81 is formed on one side of the mounting seat 80 towards the axis of the valve core of the switching valve 40 in an extending mode, and the sensor 70 is mounted at the bending section 81. The trigger interval between the sensor 70 and the trigger baffle 41 is reduced by using the bent section, so as to improve the trigger stability. Meanwhile, as the name suggests, the bending section is provided with at least two angularly arranged segmented bodies, so that the sensor 70 is arranged at a target position while other structures are arranged in a suitable mode, and interference between the sensor 70 and the other structures is reduced.
It should be noted that, when the trigger block 41 is used to trigger the sensor 70, the thickness of the trigger block should not be too thick, which would affect the structure of the sensor 70, such as wear. Therefore, when the length of the trigger fence 41 is too long, fluctuation, bending, or the like occurs due to the force. Therefore, the trigger blade 41 needs to be small in length. At this time, the sensor 70 is required to be mounted at a position close to the axis of the valve core by the arrangement of the bending section 81, so that the trigger interval of the trigger block 41 is reduced.
In some specific embodiments, the sensor 70 employs a slot type photosensor. Specifically, the sensor 70 includes opposite emitting ends and receiving ends that are arranged at intervals, and when the triggering baffle 41 moves into the sensing groove of any sensor, the receiving ends can trigger without receiving the light of the emitting ends.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of the application should be determined from the following claims.
Claims (11)
1. The dispensing adjustment method is characterized by comprising the following steps of:
acquiring preset glue profile information, and acquiring a filling reference range according to the preset glue profile information;
performing dispensing operation, acquiring product image information after dispensing, acquiring actual glue profile information based on the product image information, and acquiring an actual filling range according to the actual glue profile information;
and performing glue solution compensation under the condition that the actual filling range is not matched with the filling reference range.
2. The method of dispensing adjustment according to claim 1, wherein the obtaining the filling reference range according to the preset glue profile information includes: determining a pattern to be filled according to the preset glue profile information, wherein the area of the pattern to be filled is the area of a pattern surrounded by the preset glue profile; and/or
The step of obtaining the actual filling range according to the actual glue profile information comprises the following steps: and determining an actual filling pattern according to the actual glue profile information, wherein the area of the actual filling pattern is the area of the pattern surrounded by the actual glue profile.
3. The method according to claim 2, wherein performing glue compensation in the case where the actual filling range does not match the filling reference range includes:
comparing the area of the actual filling pattern with the area of the pattern to be filled, and obtaining an area percentage;
and comparing the area percentage with a preset ratio range, and performing glue solution compensation under the condition that the area percentage is smaller or larger than the preset ratio range.
4. The method of dispensing adjustment according to claim 1, wherein the performing glue compensation includes:
obtaining an actual glue weight mP of an actual glue solution, and comparing the actual glue weight mP with a preset glue weight mT to obtain a glue weight difference value mC;
and performing glue solution compensation according to the glue weight difference value mC.
5. The method of dispensing adjustment according to claim 4, wherein the performing glue compensation according to the glue weight difference mC comprises:
when single dispensing is obtained, a first parameter relation between output current and output air pressure and a second parameter relation between output air pressure and output adhesive weight are obtained;
obtaining a third parameter relation between the output current and the output glue weight according to the first parameter relation and the second parameter relation;
and adjusting output current according to the third parameter relation and the glue weight difference value mC so as to adjust the glue output.
6. The method of dispensing adjustment according to claim 5, wherein adjusting the output current according to the third parameter relationship and the glue weight difference mC to adjust the amount of the glue comprises:
obtaining output current A0 once per compensation, and corresponding output glue weight m:
m= ((mN-m (N-1)) + (m (N-1)) -m (N-2)) +,. M1)/N; wherein N is more than or equal to 2, and N is an integer;
obtaining compensation times K=mC/m according to the glue weight difference value mC and the output glue weight m;
the compensation current amount a=k×a0, which is the total output current that needs to be compensated, is obtained.
7. The method of dispensing adjustment according to claim 6, wherein the first parameter relationship is: f=da, the second parameter relationship is: m= eF;
the obtaining a third parameter relationship between the output current and the output glue weight according to the first parameter relationship and the second parameter relationship includes: m= eF = edA.
8. The method according to claim 4, wherein after the performing of the glue compensation, the method further comprises the steps of:
obtaining the compensation glue weight of the compensated glue amount, and comparing the compensation glue weight with a preset glue weight range;
waiting for continuing the dispensing action under the condition that the compensation adhesive weight is matched with the preset adhesive weight range;
and under the condition that the compensation glue weight is smaller or larger than the preset glue weight range, re-acquiring the actual glue weight mP of the compensated glue amount, and repeating the steps after acquiring the actual glue weight mP of the actual glue solution.
9. The dispensing adjustment method of claim 1, wherein the dispensing action is waited for to continue if the actual fill range matches the fill reference range.
10. A glue-pouring machine, characterized in that the glue-dispensing adjustment method according to any one of claims 1 to 9 is applied; the glue filling machine comprises a moving mechanism, a glue dispensing valve connected with the moving mechanism and an image acquirer connected with the moving mechanism, wherein the moving mechanism is used for driving the glue dispensing valve and the image acquirer to reciprocate along a first direction.
11. The glue dispenser of claim 10, wherein the glue dispenser comprises a switching valve, a first supply unit, and a second supply unit;
the first feeding unit and the second feeding unit are arranged at intervals along a second direction, and the switching valve is connected between the first feeding unit and the second feeding unit and is connected with the dispensing valve; the first feeding unit and the second feeding unit are respectively connected with an inductor, and the two inductors are opposite and are arranged at intervals;
the first feeding unit and the second feeding unit can be respectively communicated with the switching valve, the switching valve is connected with a trigger baffle, and the trigger baffle is configured to move in response to the driving of the switching valve so as to trigger one sensor alternatively;
wherein the second direction is disposed at an angle to the first direction.
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| CN202310919553.6A CN116899830A (en) | 2023-07-25 | 2023-07-25 | Dispensing adjustment method and dispensing machine thereof |
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| CN202310919553.6A CN116899830A (en) | 2023-07-25 | 2023-07-25 | Dispensing adjustment method and dispensing machine thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117380486A (en) * | 2023-12-04 | 2024-01-12 | 常州铭赛机器人科技股份有限公司 | Automatic calibration method, equipment and medium for glue dispensing valve glue amount |
| CN117583213A (en) * | 2024-01-19 | 2024-02-23 | 常州铭赛机器人科技股份有限公司 | Gel height compensation method, device, equipment and medium thereof |
| CN119951725A (en) * | 2025-04-09 | 2025-05-09 | 江苏东煦电子科技有限公司 | Glue dispensing method and system for printed circuit board |
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2023
- 2023-07-25 CN CN202310919553.6A patent/CN116899830A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117380486A (en) * | 2023-12-04 | 2024-01-12 | 常州铭赛机器人科技股份有限公司 | Automatic calibration method, equipment and medium for glue dispensing valve glue amount |
| CN117380486B (en) * | 2023-12-04 | 2024-03-12 | 常州铭赛机器人科技股份有限公司 | Automatic calibration method, equipment and medium for glue dispensing valve glue amount |
| CN117583213A (en) * | 2024-01-19 | 2024-02-23 | 常州铭赛机器人科技股份有限公司 | Gel height compensation method, device, equipment and medium thereof |
| CN117583213B (en) * | 2024-01-19 | 2024-04-02 | 常州铭赛机器人科技股份有限公司 | Gel height compensation method, device, equipment and medium thereof |
| CN119951725A (en) * | 2025-04-09 | 2025-05-09 | 江苏东煦电子科技有限公司 | Glue dispensing method and system for printed circuit board |
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