CN116879320A - Circuit board measuring device and carrier module rotation coordinate calibration method thereof - Google Patents
Circuit board measuring device and carrier module rotation coordinate calibration method thereof Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
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Abstract
The invention discloses a circuit board measuring device and a carrier module rotating coordinate calibrating method thereof, wherein the measuring device comprises a workbench, bases symmetrically arranged at two sides of the workbench, a left gantry and a right gantry which are arranged on the two bases in a crossing manner, wherein a set of measuring workpiece and a measuring camera are respectively arranged at the inner sides of the left gantry and the right gantry; one side of the measuring workpiece is provided with a workpiece tip; the workbench is provided with a carrier for placing the circuit board to be tested. In measurement, in order to obtain the actual photographing axis coordinates of each component of the circuit board, the camera, the carrier and the circuit board are subjected to coordinate calibration, and the conversion relation between the mechanical axis coordinates of the rotation center of the carrier module and the mechanical axis coordinates of the tip of the workpiece and the component coordinates of the circuit board is obtained.
Description
Technical Field
The invention relates to the technical field of circuit board detection, in particular to a circuit board measuring device and a carrier module rotation coordinate calibration method thereof.
Background
The circuit board is an important component in the information technology product, the defect inspection is needed in the production process of the circuit board, the circuit board is generally detected manually, in the detection process of the circuit board, one hand holds the circuit board, the other hand needs to hold a quick plug and a contact on the circuit board to conduct performance tests such as power on and signal transmission, and the like, but the manual detection workload is large, the efficiency is low, and the detection result is unstable. Therefore, quality inspection of circuit boards by measuring devices is gradually replacing manual inspection.
The measuring device detects the information of the circuit board by respectively touching the tips of the workpieces of the left measuring module and the right measuring module at different positions of the circuit board to be measured. In the left and right measuring modules, a set of measuring workpiece and a measuring camera (upper camera) are respectively arranged, when the device operates, the left and right cameras can shoot components at different points on the circuit board to be measured, the coordinates of the components at different positions are obtained and sent to the upper computer, and then the tip of the workpiece is guided to point contact with the different positions of the components of the circuit board so as to achieve the measuring purpose. The measuring device adopts a rotatable carrier moving platform, when the measuring device detects, the carrier carries the circuit board to move to a working position, the upper camera moves to the positions above different points of the circuit board to take pictures according to the rotation angle of the carrier, and mechanical axis coordinates of different positions are obtained, so that the mechanical axis coordinates of different points of the circuit board are calculated, and the aim of positioning and guiding the detection of the workpiece tip is achieved. In the detection process, the camera, the carrier and the circuit board are required to be subjected to coordinate calibration, and the conversion relation between the mechanical axis coordinate of the rotation center of the carrier module and the mechanical axis coordinate of the tip of the workpiece and the component coordinate of the circuit board is obtained.
Disclosure of Invention
The invention aims to solve the technical problem of providing a circuit board measuring device and a carrier module rotating coordinate calibrating method thereof, which can acquire actual photographing axis coordinates of components at different positions on a circuit board, calibrate the coordinates of a camera, a carrier and the circuit board, acquire the conversion relation between the rotating center mechanical axis coordinates of the carrier module and the coordinates of the components of the circuit board and the coordinates of the mechanical axes of the tips of workpieces, and improve the detection precision.
In order to solve the technical problems, the invention adopts the following technical scheme:
the circuit board measuring device comprises a workbench, bases symmetrically arranged on two sides of the workbench, a left gantry and a right gantry which are arranged on the two bases in a crossing manner, wherein the left gantry and the right gantry can move along the bases;
a set of measuring workpiece and measuring camera are respectively arranged on the inner sides of the left and right gantry, and the measuring workpiece and the measuring camera on the same side synchronously move along the gantry; one side of the measuring workpiece is provided with a workpiece tip; the measuring camera on the left gantry is defined as a left camera, the measuring camera on the right gantry is defined as a right camera, and the left camera and the right camera are downward shooting measurement;
the workbench is provided with a carrier for placing the circuit board to be tested, the carrier rotates under the drive of a carrier rotating module at the lower part, the lower part of the carrier rotating module is arranged on the mounting plate, and the mounting plate moves back and forth along the workbench under the drive of the moving mechanism.
Preferably, a fixing mechanism is arranged at a position below the left and right gantry and close to the base at one side, the fixing mechanism comprises a fixing plate, a lower camera arranged at one side of the fixing plate, a film marking sheet arranged above the lower camera, and a tool setting support arranged at one side of the lower camera, a tool setting rod is arranged at the top of the tool setting support, and the lower camera is used for upward shooting measurement.
Preferably, the fixing mechanism is provided with a mounting plate, the mounting plate is provided with a pushing cylinder, and the film marking sheet is driven by the pushing cylinder to reciprocate.
Preferably, the measuring workpiece comprises a workpiece rotating module, a vertical chute is arranged on the workpiece rotating module, a sliding block is slidably arranged in the chute, and the tip end of the workpiece is arranged on the sliding block.
In the measuring device, a measuring workpiece and a measuring camera move along a left gantry and a right gantry, and a moving mechanism of the measuring device can be a linear motor, a screw rod and the like, and a person skilled in the art can select a moving mechanism in the prior art to realize the measuring device. The rotating module of the carrier and the rotating module of the workpiece can be realized through a turntable, the rotating module of the workpiece drives the measuring workpiece to rotate for a certain angle, the tip of the workpiece moves up and down along the chute, the rotating module of the carrier drives the circuit board to be measured on the carrier to rotate for a certain angle together, the moving mechanism of the carrier can be realized by adopting a screw rod, a linear motor and other mechanisms, the rotating structure of the rotating module, the structure of the moving mechanism of the carrier, the structure of the sliding block moving up and down along the chute and the control mode of each part are all realized in the prior art, and the structure and the control mode can be understood and realized by a person skilled in the art, so the structure is not a range to be protected by the invention and is not repeated here.
The measuring device adopts a double gantry structure, a set of measuring workpiece and a set of measuring camera (upper camera) are respectively arranged on the left gantry and the right gantry, when the measuring device operates, the left measuring camera and the right measuring camera take pictures of components at different points on a circuit board to be measured, coordinates of the components are obtained, the upper computer is sent, and then the tip of the workpiece is guided to touch different positions of the components of the circuit board, so that the measuring purpose is achieved. Before normal measurement work starts, coordinate calibration is needed to be carried out on a measurement camera and a workpiece tip, and through film calibration sheet and tool setting rod assistance, photographing is carried out by matching with an upper camera and a lower camera, the mechanical axis coordinate conversion relation of the camera center image coordinates and the axis coordinate deviation of the workpiece tip and the camera center are obtained, and finally the conversion from the camera image coordinates to the workpiece tip coordinates is completed.
When the measuring is carried out, the circuit board to be measured is arranged on the carrier, the carrier moves on the workbench, the circuit board to be measured is driven to move to a position between the left and right gantry, and is positioned below the left and right gantry, the workpiece tip and the measuring camera respectively move along the gantry at two sides, the circuit board to be measured is measured, and the rotating coordinates of the carrier module are required to be calibrated during the measuring, and the specific calibration method is as follows.
The invention also relates to a method for calibrating the rotation coordinates of the carrier module of the circuit board measuring device, which comprises the following steps:
(1) The carrier bearing circuit board moves to a working position, the measuring camera (the left camera or the right camera) moves to the position above the characteristic points of the carrier to take a picture, and the coordinate (x) of the coincidence axis of the characteristic points and the center of the camera is calculated and obtained 1 y 1 ) Namely, the initial photographing bit axis coordinate; the carrier rotates by a fixed angle theta, and the characteristic point photographing bit axis coordinate (x 2 y 2 ) And the photographing bit axis coordinate (x) is obtained after rotating the angle theta again 3 y 3 ) Thus, the rotation center (x) r y r )。
(2) The carrier is restored to the initial position, the measuring camera is moved to the position above 3 fixed components on the circuit board to be measured to take a picture, and the characteristic point photographing bit axis coordinates (X G1 Y G1 )、(X G2 Y G2 )、(X G3 Y G3 ) And 3 component coordinates (x 1 y 1 )、(x 2 y 2 )、(x 3 y 3 ) Substituting the coordinate into CKVision mapping calibration tool to obtain the conversion relation xy-of-the-wafer from the coordinates of the circuit board components to the coordinates of the mechanical axis of the photographing position>XY G And according to the relative coordinate deviation between the current camera center and the left workpiece tip, adding the conversion result to obtain the conversion relation from the circuit board component coordinates to the workpiece tip mechanical axis coordinates.
Preferably, when the test is inaccurate according to the result of the step (2), the mechanical axis coordinate of the workpiece tip of the component can be recalculated according to the mechanical axis coordinate conversion relation of the camera center image coordinate and the axis coordinate deviation of the workpiece tip and the camera center.
Preferably, the method for calibrating the rotation coordinates in the step (2) comprises the following steps:
set XY as the mechanical axis coordinate system, the default angle feature point photographing position coordinate (x) 1 y 1 ) Sequentially rotating by a fixed angle theta to obtain (x) 2 y 2 )、(x 3 y 3 ) Calculate the center of rotation (x r y r )；
From the rotation formula:
x 2 ＝(x 1 -x r )*cos(θ)-(y 1 -y r )*sin(θ)+x r ；
y 2 ＝(x 1 -x r )*sin(θ)+(y 1 -y r )*cos(θ)+y r ；
x 3 ＝(x 1 -x r )*cos(2θ)-(y 1 -y r )*sin(2θ)+x r ；
y 3 ＝(x 1 -x r )*sin(2θ)+(y 1 -y r )*cos(2θ)+y r ；
and then, calculating:
x r ＝[(x 2 -x 1 *cos(θ))*sin(2θ)-(x 3 -x 1 *cos(2θ)*sin(θ)]/[sin(θ)*(cos(2
θ)-1)-sin(2θ)*(cos(θ)-1)]；
y r ＝[(y 1 *cos(θ)-y 2 )*sin(2θ)-(y 1 *cos(2θ)-y 3 )*sin(θ])]/[(1-cos(2
θ))*sin(θ)-(1-cos(θ))*sin(2θ)]；
thus, the camera bit coordinates (x) 0 y 0 ) Obtaining the post-rotation photographing position coordinates under the condition of the rotation angle theta
xθ＝(x 0 -x r )*cos(θ)-(y 0 -y 0 )*sin(θ)+x r ；
yθ＝(x 0 -x r )*sin(θ)+(y 0 -y 0 )*cos(θ)+y r 。
Preferably, the mapping calibration method in the step (2) is as follows:
x is set as a mechanical axis coordinate system 0 Y 0 With origin, xy being the circuit board coordinate system, x 0 y 0 As an origin, a component photographing bit axis coordinate calculated by manual teaching under a known default angle is (X G1 Y G1 )(X G2 Y G2 )(X G3 Y G3 ) The shooting bit axis coordinates of the fixed component after the carrier rotates theta are (X) G1’ Y G1’ )(X G2 ’Y G2’ )(X G3’ Y G3 ') corresponds to the component board coordinates (x) 1 y 1 )(x 2 y 2 )(x 3 y 3 ) Generating a conversion relation xy-of-the-hole from the coordinates of the circuit board components to the coordinates of the mechanical axis of the photographing position through CKVision mapping calibration tool>XY G Substituting the circuit board coordinates (x n y n ) To obtain the current object photographing position coordinates (X Gn Y Gn ) When the relative coordinate deviation between the camera center and the left workpiece tip is (Δx, Δy), the workpiece tip contact coordinate is (X) Gn +ΔX,Y Gn +ΔY)；
In the case where the result obtained by calculation of the substituted circuit board coordinates is inaccurate, the calculated photographing bit coordinates (X Gn Y Gn ) The moving axis coordinate takes a picture so far, and the actual shooting position coordinate (X) of the current component can be converted according to the mechanical axis coordinate conversion relation of the camera center image coordinate Gn ’,Y Gn '), the contact coordinate of the workpiece center point is (X) Gn ’+ΔX,Y Gn’ +ΔY)。
The invention has the beneficial effects that:
the measuring device adopts the rotatable carrier moving platform, when the measuring is carried out, the carrier carries the circuit board to be measured and moves to a working position below the two side gantry, according to the rotation angle of the carrier, the upper camera moves to the position above the fixed 3 component points of the circuit board to shoot, and the mechanical axis coordinates of the components on the corresponding point are obtained, so that the mechanical axis coordinates of the rest components of the circuit board are calculated, and the aim of positioning and guiding the detection of the workpiece tip is achieved.
The known conditions of the measuring device during normal operation are the component coordinates under the circuit board coordinate system and the default photographing axis coordinates of the circuit board fixed components, if the actual photographing axis coordinates of the components of the circuit board are required to be obtained, the camera, the carrier and the circuit board are required to be subjected to coordinate calibration, and the conversion relation between the rotation center mechanical axis coordinates of the carrier module and the mechanical axis coordinates of the components of the circuit board to the mechanical axis coordinates of the workpiece tip is obtained. The calibration method is based on a CKVision algorithm platform, and the calibration mode is rotation calibration and mapping calibration.
The calibration method disclosed by the invention has the advantages that the use process is simple, the third medium transfer is not needed, the calibration precision is high, in the actual production, the function of real-time coordinate conversion of different types of circuit boards can be met, the photographing time of a camera is saved, the mechanical axis coordinates of the photographing position of the circuit board after the carrier module rotates and the touch axis coordinates of the workpiece center point of the circuit board component are rapidly calculated, and the calibration precision can be less than 10 microns.
Drawings
FIG. 1 is a schematic diagram of a circuit board measuring device of the present invention;
FIG. 2 is a schematic view of the structure of a measurement workpiece and a measurement camera in a measurement device;
fig. 3 is an enlarged view of a portion a in fig. 2;
fig. 4 is an enlarged view of a portion B in fig. 2;
FIG. 5 is a coordinate schematic diagram of rotation calibration;
FIG. 6 is a coordinate diagram of map calibration.
Reference numerals in the drawings: 1 base, 2 left gantry, 3 right gantry, 4 left camera, 5 right camera; 6, a rotating module, 7 sliding grooves, 8 sliding blocks and 9 workpiece tips; 10 fixing plates, 11 lower cameras, 12 film standard plates, 13 tool setting brackets, 14 tool setting bars, 15 mounting plates and 16 pushing cylinders; 17 carrier.
Detailed Description
The following examples are given to illustrate the invention in detail, but are not intended to limit the scope of the invention in any way. The device elements referred to in the following examples are conventional device elements unless otherwise specified.
Example 1: referring to fig. 1-4, the circuit board measuring device comprises a workbench, bases 1 symmetrically arranged on two sides of the workbench, a left gantry 2 and a right gantry 3 which are arranged on the two bases 1 in a straddling mode, and the left gantry and the right gantry can move along the bases 1.
A set of measuring workpiece and measuring camera are respectively arranged on the inner sides of the left and right gantry, and the measuring workpiece and the measuring camera on the same side synchronously move along the gantry; one side of the measuring workpiece is provided with a workpiece tip 4; the measuring camera on the left gantry 2 is defined as a left camera 4, the measuring camera on the right gantry 3 is defined as a right camera 5, and the left and right cameras are all downward shooting measuring.
The workbench is provided with a carrier 17 for placing a circuit board to be tested, the carrier 17 rotates under the drive of a carrier rotating module at the lower part, the lower part of the carrier rotating module is arranged on the mounting plate, and the mounting plate moves back and forth along the workbench under the drive of the moving mechanism.
The fixing mechanism is arranged at a position below the left gantry and the right gantry and close to the base on one side and comprises a fixing plate 10, a lower camera 11 arranged on one side of the fixing plate 10, a film marking sheet 12 arranged above the lower camera 11, and a tool setting support 13 arranged on one side of the lower camera 11, wherein a tool setting rod 14 is arranged at the top of the tool setting support 13, and the lower camera 11 is used for upward shooting measurement. The fixing mechanism is provided with a mounting plate 15, a pushing cylinder 16 is arranged on the mounting plate 15, and the film marking sheet 12 is driven by the pushing cylinder 16 to reciprocate.
The measuring workpiece comprises a workpiece rotating module, a vertical chute 7 is arranged on the workpiece rotating module, a sliding block 8 is slidably arranged in the chute 7, and a workpiece tip 9 is arranged on the sliding block 8.
The moving mechanism of the measuring workpiece and the measuring camera can be a linear motor, a screw rod and the like, and the moving mechanism of the lower part of the carrier rotating module can also be a linear motor, a screw rod and the like, and the moving mechanisms can be realized by selecting the moving mechanisms in the prior art by a person skilled in the art. The workpiece rotating module 6 comprises a turntable, can drive the measured workpiece to rotate by a certain angle, the workpiece tip 9 moves up and down along the chute 7, and the carrier rotating module can also rotate through the turntable, wherein the rotating structure of the turntable, the structure of the sliding block moving up and down along the chute and the control mode of each part are all realized in the prior art, and the structure and the control mode can be understood and realized by a person skilled in the art and are not repeated here.
Example 2: a method for calibrating the rotation coordinates of a carrier module of a circuit board measuring device comprises the following steps:
(1) The carrier bearing circuit board moves to a working position, and the measuring camera moves to a characteristic point of the carrierSquare photographing, calculating and obtaining the coordinate (x) 1 y 1 ) Namely, the initial photographing bit axis coordinate; the carrier rotates by a fixed angle theta, and the characteristic point photographing bit axis coordinate (x 2 y 2 ) And the photographing bit axis coordinate (x) is obtained after rotating the angle theta again 3 y 3 ) Thus, the rotation center (x) r y r )；
(2) The carrier is restored to the initial position, the measuring camera is moved to the position above 3 fixed components on the circuit board to be measured to take a picture, and the characteristic point photographing bit axis coordinates (X G1 Y G1 )、(X G2 Y G2 )、(X G3 Y G3 ) And 3 component coordinates (x 1 y 1 )、(x 2 y 2 )、(x 3 y 3 ) Substituting the coordinate into CKVision mapping calibration tool to obtain the conversion relation xy-of-the-wafer from the coordinates of the circuit board components to the coordinates of the mechanical axis of the photographing position>XY G And according to the relative coordinate deviation between the current camera center and the left workpiece tip, adding the conversion result to obtain the conversion relation from the circuit board component coordinates to the workpiece tip mechanical axis coordinates.
The method for calibrating the rotation coordinates in the step (2) comprises the following steps:
set XY as the mechanical axis coordinate system, the default angle feature point photographing position coordinate (x) 1 y 1 ) Sequentially rotating by a fixed angle theta to obtain (x) 2 y 2 )、(x 3 y 3 ) Calculate the center of rotation (x r y r )；
From the rotation formula:
x 2 ＝(x 1 -x r )*cos(θ)-(y 1 -y r )*sin(θ)+x r ；
y 2 ＝(x 1 -x r )*sin(θ)+(y 1 -y r )*cos(θ)+y r ；
x 3 ＝(x 1 -x r )*cos(2θ)-(y 1 -y r )*sin(2θ)+x r ；
y 3 ＝(x 1 -x r )*sin(2θ)+(y 1 -y r )*cos(2θ)+y r ；
and then, calculating:
x r ＝[(x 2 -x 1 *cos(θ))*sin(2θ)-(x 3 -x 1 *cos(2θ)*sin(θ)]/[sin(θ)*(cos(2
θ)-1)-sin(2θ)*(cos(θ)-1)]；
y r ＝[(y 1 *cos(θ)-y 2 )*sin(2θ)-(y 1 *cos(2θ)-y 3 )*sin(θ])]/[(1-cos(2
θ))*sin(θ)-(1-cos(θ))*sin(2θ)]；
thus, the camera bit coordinates (x) 0 y 0 ) Obtaining the post-rotation photographing position coordinates under the condition of the rotation angle theta
xθ＝(x 0 -x r )*cos(θ)-(y 0 -y 0 )*sin(θ)+x r ；
yθ＝(x 0 -x r )*sin(θ)+(y 0 -y 0 )*cos(θ)+y r 。
The mapping calibration method in the step (2) comprises the following steps:
x is set as a mechanical axis coordinate system 0 Y 0 With origin, xy being the circuit board coordinate system, x 0 y 0 As an origin, a component photographing bit axis coordinate calculated by manual teaching under a known default angle is (X G1 Y G1 )(X G2 Y G2 )(X G3 Y G3 ) The shooting bit axis coordinates of the fixed component after the carrier rotates theta are (X) G1’ Y G1’ )(X G2’ Y G2’ )(X G3’ Y G3’ ) Corresponds to the component board coordinates (x 1 y 1 )(x 2 y 2 )(x 3 y 3 ) Generating a conversion relation xy-of-the-hole from the coordinates of the circuit board components to the coordinates of the mechanical axis of the photographing position through CKVision mapping calibration tool>XY G Substituting the circuit board coordinates (x n y n ) To obtain the current object photographing position coordinates (X Gn Y Gn ) The relative coordinate deviation of the camera center and the left workpiece tip is (DeltaX, deltaY), thenThe contact coordinate of the workpiece center point is (X) Gn +ΔX,Y Gn +ΔY)；
In the case where the result obtained by calculation of the substituted circuit board coordinates is inaccurate, the calculated photographing bit coordinates (X Gn Y Gn ) The moving axis coordinate takes a picture so far, and the actual shooting position coordinate (X) of the current component can be converted according to the mechanical axis coordinate conversion relation of the camera center image coordinate Gn’ ,Y Gn’ ) The contact coordinate of the workpiece center point is (X) Gn’ +ΔX,Y Gn’ +ΔY)。
When the test is inaccurate according to the result of the step (2), the mechanical axis coordinate of the workpiece tip of the component can be recalculated according to the mechanical axis coordinate conversion relation of the camera center image coordinate and the axis coordinate deviation of the workpiece tip and the camera center, and the specific method is as follows:
(1) The left camera moves to the upper part of the lower camera, meanwhile, the film calibration piece moves to the position between the upper camera and the lower camera, a fixed point of the film calibration piece is set as a calibration point, the left camera moves for 9 times to take a picture to perform 9-point relative calibration, and the conversion relation between the center image coordinate of the left camera and the coordinate of the left mechanical axis is obtained;
(2) Removing the left camera and the film calibration sheet, moving the tip of the workpiece to the position above the lower camera, setting the center of the tip of the workpiece as a calibration point, and moving photographing to perform 9-point relative calibration to acquire the conversion relation between the center coordinate of the image of the lower camera and the coordinate of the left mechanical axis;
(3) Removing the tip of the workpiece, moving the left camera to the position above the lower camera, moving the film calibration sheet between the upper camera and the lower camera, and respectively photographing the calibration points by the upper camera and the lower camera to obtain a left mechanical axis coordinate when the centers of the upper camera and the lower camera are coincident;
(4) Moving the tip of the workpiece to the tool setting bar, respectively touching four edges of the tool setting bar from X, Y direction points, obtaining left mechanical axis coordinates of four tangential points of the tool setting bar, calculating left mechanical axis coordinates of a center point of the tool setting bar, moving a left camera to the upper part of the tool setting bar for photographing, obtaining left mechanical axis coordinates of the center of the tool setting bar, which are coincident with the center of the left camera, according to the conversion relation of the step (1), and finally subtracting the left mechanical axis coordinates of the center of the tool setting bar, so that the relative coordinate deviation of the center of the left camera and the tip of the left workpiece under the left mechanical axis coordinate system can be obtained;
(5) According to the results of the steps (3) and (4), acquiring theoretical left mechanical axis coordinates of the superposition of the tip of the left workpiece and the center of the lower camera, moving the theoretical left mechanical axis coordinates to the position, and photographing by the lower camera to calculate the calibration deviation of the tip of the left workpiece;
(6) And (3) according to the steps (1) - (5), sequentially moving the right camera and the right workpiece tip, similarly obtaining the conversion relation between the center coordinates of the image of the right camera and the coordinates of the right mechanical axis, converting the conversion relation between the center coordinates of the image of the lower camera and the coordinates of the right mechanical axis, aligning the centers of the upper camera and the lower camera, calculating the relative coordinate deviation between the center of the right camera and the right workpiece tip, and obtaining the calibration deviation of the right workpiece tip.
While the invention has been described with reference to the embodiments, those skilled in the art will understand that various specific parameters in the above embodiments may be changed without departing from the spirit of the invention, and thus a plurality of specific embodiments are common variation ranges of the invention, and will not be described in detail herein.
Claims (8)
1. The circuit board measuring device is characterized by comprising a workbench, bases symmetrically arranged on two sides of the workbench, a left gantry and a right gantry which are arranged on the two bases in a crossing manner, wherein the left gantry and the right gantry can move along the bases;
a set of measuring workpiece and measuring camera are respectively arranged on the inner sides of the left and right gantry, and the measuring workpiece and the measuring camera on the same side synchronously move along the gantry; one side of the measuring workpiece is provided with a workpiece tip; the measuring camera on the left gantry is defined as a left camera, the measuring camera on the right gantry is defined as a right camera, and the left camera and the right camera are downward shooting measurement;
the workbench is provided with a carrier for placing the circuit board to be tested, the carrier rotates under the drive of a carrier rotating module at the lower part, the lower part of the carrier rotating module is arranged on the mounting plate, and the mounting plate moves back and forth along the workbench under the drive of the moving mechanism.
2. The circuit board measuring device according to claim 1, wherein a fixing mechanism is provided at a position below the left and right gantry near the base on one side, the fixing mechanism including a fixing plate, a lower camera provided on one side of the fixing plate, a film marking sheet provided above the lower camera, and a tool setting bracket provided on one side of the lower camera, a tool setting bar is provided on a top of the tool setting bracket, and the lower camera is an upward shooting measurement.
3. The circuit board measuring device according to claim 1, wherein the fixing mechanism is provided with a mounting plate, a pushing cylinder is arranged on the mounting plate, and the film marking sheet is driven by the pushing cylinder to reciprocate.
4. The circuit board measuring device according to claim 1, wherein the measuring workpiece comprises a workpiece rotating module, a vertical chute is arranged on the workpiece rotating module, a sliding block is slidably arranged in the chute, and a workpiece tip is arranged on the sliding block.
5. The method for calibrating rotational coordinates of a carrier module of a circuit board measuring device according to claim 1, comprising the steps of:
(1) The carrier bearing circuit board moves to a working position, the measuring camera moves to the position above the characteristic points of the carrier to shoot, and the coordinate (x 1 y 1 ) Namely, the initial photographing bit axis coordinate; the carrier rotates by a fixed angle theta, and the characteristic point photographing bit axis coordinate (x 2 y 2 ) And the photographing bit axis coordinate (x) is obtained after rotating the angle theta again 3 y 3 ) Thus, the rotation center (x) r y r )；
(2) The carrier is restored to the initial position, the measuring camera is moved to the position above 3 fixed components on the circuit board to be measured to take a picture, and the characteristic point photographing bit axis coordinates (X G1 Y G1 )、(X G2 Y G2 )、(X G3 Y G3 ) And 3 component coordinates (x 1 y 1 )、(x 2 y 2 )、(x 3 y 3 ) Substituted into CKVisin the ion mapping calibration tool, the conversion relation xy->XY G And according to the relative coordinate deviation between the current camera center and the left workpiece tip, adding the conversion result to obtain the conversion relation from the circuit board component coordinates to the workpiece tip mechanical axis coordinates.
6. The method for calibrating rotational coordinates of a carrier module of a circuit board measuring device according to claim 5, wherein when the test is inaccurate according to the result of the step (2), the mechanical axis coordinates of the workpiece tip of the component can be recalculated according to the mechanical axis coordinate conversion relation of the camera center image coordinates and the axis coordinate deviation of the workpiece tip and the camera center.
7. The method for calibrating rotational coordinates of a carrier module of a circuit board measuring device according to claim 6, wherein the method for calibrating rotational coordinates in the step (2) comprises the steps of:
set XY as the mechanical axis coordinate system, the default angle feature point photographing position coordinate (x) 1 y 1 ) Sequentially rotating by a fixed angle theta to obtain (x) 2 y 2 )、(x 3 y 3 ) Calculate the center of rotation (x r y r )；
From the rotation formula:
x 2 ＝(x 1 -x r )*cos(θ)-(y 1 -y r )*sin(θ)+x r ；
y 2 ＝(x 1 -x r )*sin(θ)+(y 1 -y r )*cos(θ)+y r ；
x 3 ＝(x 1 -x r )*cos(2θ)-(y 1 -y r )*sin(2θ)+x r ；
y 3 ＝(x 1 -x r )*sin(2θ)+(y 1 -y r )*cos(2θ)+y r ；
and then, calculating:
x r ＝[(x 2 -x 1 *cos(θ))*sin(2θ)-(x 3 -x 1 *cos(2θ)*sin(θ)]/[sin(θ)*(cos(2
θ)-1)-sin(2θ)*(cos(θ)-1)]；
y r ＝[(y 1 *cos(θ)-y 2 )*sin(2θ)-(y 1 *cos(2θ)-y 3 )*sin(θ])]/[(1-cos(2
θ))*sin(θ)-(1-cos(θ))*sin(2θ)]；
thus, the camera bit coordinates (x) 0 y 0 ) Obtaining the post-rotation photographing position coordinates under the condition of the rotation angle theta
xθ＝(x 0 -x r )*cos(θ)-(y 0 -y 0 )*sin(θ)+x r ；
yθ＝(x 0 -x r )*sin(θ)+(y 0 -y 0 )*cos(θ)+y r 。
8. The method for calibrating rotational coordinates of a carrier module of a circuit board measuring device according to claim 6, wherein the method for mapping calibration in the step (2) is as follows:
x is set as a mechanical axis coordinate system 0 Y 0 With origin, xy being the circuit board coordinate system, x 0 y 0 As an origin, a component photographing bit axis coordinate calculated by manual teaching under a known default angle is (X G1 Y G1 )(X G2 Y G2 )(X G3 Y G3 ) The shooting bit axis coordinates of the fixed component after the carrier rotates theta are (X) G1’ Y G1’ )(X G2’ Y G2’ )(X G3’ Y G3’ ) Corresponds to the component board coordinates (x 1 y 1 )(x 2 y 2 )(x 3 y 3 ) Generating a conversion relation xy-of-the-hole from the coordinates of the circuit board components to the coordinates of the mechanical axis of the photographing position through CKVision mapping calibration tool>XY G Substituting the circuit board coordinates (x n y n ) To obtain the current object photographing position coordinates (X Gn Y Gn ) When the relative coordinate deviation between the camera center and the left workpiece tip is (Δx, Δy), the workpiece tip contact coordinate is (X) Gn +ΔX,Y Gn +ΔY)；
Substituting circuit board coordinatesIn the case of inaccurate calculation result, the position coordinates (X Gn Y Gn ) The moving axis coordinate takes a picture so far, and the actual shooting position coordinate (X) of the current component can be converted according to the mechanical axis coordinate conversion relation of the camera center image coordinate Gn’ ,Y Gn’ ) The contact coordinate of the workpiece center point is (X) Gn’ +ΔX,Y Gn’ +ΔY)。
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| CN202310812084.8A CN116879320A (en) | 2023-07-04 | 2023-07-04 | Circuit board measuring device and carrier module rotation coordinate calibration method thereof |
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Inventor after: Zou Yixin Inventor after: Zhang Chunyang Inventor after: Wang Zhenjie Inventor after: Yin Zhi Inventor after: Hou Bingxu Inventor after: Kou Yongjie Inventor after: Ma Kuo Inventor after: Wang Hongmiao Inventor after: Zhang Shuaifeng Inventor before: Hou Bingxu Inventor before: Kou Yongjie Inventor before: Ma Kuo Inventor before: Wang Hongmiao Inventor before: Zhang Shuaifeng |