CN116855888A - Flexible high-entropy alloy coating and preparation method and application thereof - Google Patents

Abstract

The invention provides a flexible high-entropy alloy coating and a preparation method and application thereof, and belongs to the technical field of high-entropy alloy. The invention changes the space layout and the potential distribution of a vacuum chamber through magnetic filtration cathode vacuum arc deposition, improves the plasma density, enables the element components and the content in the high-entropy alloy to be adjustable, and the prepared high-entropy coating has good tribology, corrosiveness and oxidation resistance; the ionization rate of the deposited particles after magnetic filtration is nearly 100%, large particles are not generated, and the formed film is compact, flat and smooth, good in corrosion resistance and good in combination with a machine body; can prepare various element films; the film thickness can be controlled to be in the nanometer level to obtain a nanometer multilayer film; the design of the monobasic metal coating, the dibasic metal coating, the quaternary metal coating and the high-entropy coating is combined, so that the problems that the high-entropy coating prepared by the traditional technology has large internal stress and is difficult to realize flexibility are avoided.

Description

A flexible high-entropy alloy coating and its preparation method and application

Technical field

The invention relates to the technical field of high-entropy alloys, and in particular to a flexible high-entropy alloy coating and its preparation method and application.

Background technique

General high-entropy alloy preparation methods include sintering, laser cladding and magnetron sputtering. Sintering methods and laser cladding can achieve the preparation of high-entropy alloys when the requirements for film layer density and defects are not high; however, with increasing attention to film layer quality and defects, laser cladding and sintering methods have Not applicable. The magnetron sputtering method is the most commonly used method to prepare high-entropy alloy films in recent years, but it also has fatal flaws. The preparation of the magnetron sputtering target itself is a difficulty. The target preparation is difficult and extremely costly. High; it is difficult to control the elemental composition of the film layer after the target is prepared, which is not conducive to the diversified preparation of the film layer.

Generally, high-entropy alloy coatings prepared by traditional technology have large internal stress and are difficult to achieve flexibility.

Contents of the invention

In view of this, the object of the present invention is to provide a flexible high-entropy alloy coating and its preparation method and application. The flexible high-entropy alloy coating prepared by the invention has small internal stress and good flexibility.

In order to achieve the above-mentioned object of the invention, the present invention provides the following technical solutions:

The invention provides a method for preparing a flexible high-entropy alloy coating, which includes the following steps:

Magnetic filter cathode vacuum arc deposition is performed on the surface of the unary metal coating to sequentially form a binary metal coating, a quaternary metal coating and a high-entropy coating. There are no less than 5 types of elements in the high-entropy coating. The atomic content of each element is independently 8 to 30%.

Preferably, the thickness of the high-entropy coating is 1 to 10 μm.

Preferably, the elements in the high-entropy coating include at least five types of Ti, Cr, Co, Mo, Y, Ni, Au, Ag, Cu and Al.

Preferably, the one-element metal coating is a Ni metal layer or a Cr metal layer.

Preferably, the thickness of the one-element metal coating is no higher than 1/20 of the thickness of the flexible high-entropy alloy coating.

Preferably, the binary metal coating is a Cu-Ag metal layer or a Ni-Au metal layer.

Preferably, the thickness of the binary metal coating is no higher than 1/30 of the thickness of the flexible high-entropy alloy coating.

Preferably, the quaternary metal coating is a Cu-Ag-Mo-Y metal layer or a Ni-Au-Cr-Al metal layer.

The present invention also provides the flexible high-entropy alloy coating described in the above technical solution, including a one-element metal coating, a binary metal coating, a quaternary metal coating and a high-entropy coating that are stacked in sequence.

The present invention also provides the application of the flexible high-entropy alloy coating described in the above technical solution in the fields of aerospace and electronic communications.

The invention provides a method for preparing a flexible high-entropy alloy coating, which includes the following steps: performing magnetic filtering cathode vacuum arc deposition on the surface of a one-element metal coating, and sequentially forming a binary metal coating, a quaternary metal coating and a high-entropy alloy coating. Entropy coating, there are no less than 5 types of elements in the high-entropy coating, and the atomic content of each element is independently 8 to 30%.

The present invention uses magnetic filter cathode vacuum arc deposition to change the spatial layout and potential distribution of the vacuum chamber, increase the plasma density, and make the element composition and content of the high-entropy alloy adjustable. The prepared high-entropy coating has good tribology, Corrosion and anti-oxidation properties, the high-entropy coating is formed into an amorphous phase structure, which promotes the release of internal stress and achieves flexibility; the ionization rate of deposited particles after magnetic filtration is close to 100%, and there are no large particles to form The film is dense, flat and smooth, has good corrosion resistance, and is well integrated with the body; it can prepare a variety of element films; it can control the film thickness at the nanometer level to obtain nanometer multi-layer films; it can combine with one-element metal coatings, binary metals The design of coatings, quaternary metal coatings and high-entropy coatings avoids the problem that high-entropy coatings prepared by traditional technology have large internal stress and are difficult to achieve flexibility.

Furthermore, the Ni and Cr metal elements in the one-element metal coating have strong toughness, and show excellent folding resistance when the thickness is 10 to 50nm. Ni or Cr deposition is greater than 50nm, and the nanocrystal size is too large, and the crystal size is too large. Folding resistance; too thin to achieve a transition effect.

Further, the binary metal coating is selected as Cu-Ag or Ni-Au, which is selected based on the composition of the quaternary metal coating and the one-element metal coating. The selection criteria are strong bonding strength and element compatibility. The main reason is good resistance; at the same time, the deposition of the one-element metal coating can induce the phase structure of the binary metal coating to be a fold-resistant phase, and the binary metal coating induces the quaternary metal coating to form a fold-resistant phase, and the fold-resistant phase is larger than the nanocrystal size. Smaller is better until an amorphous phase is formed.

Further, the quaternary metal coating is a stress release layer, and the stress release layer is no more than 1/10 of the overall thickness; at least two metals in the quaternary metal coating are incompatible with each other, and incompatible metals are easily Form a single phase and improve the folding resistance.

The present invention also provides a flexible high-entropy alloy coating prepared by the preparation method described in the above technical solution. The flexible high-entropy alloy coating of the present invention has small internal stress and good flexibility.

Description of the drawings

Figure 1 is a diagram of the bonding strength of the coatings of Examples 1 to 4;

Figure 2 is the internal stress diagram of the coating of Examples 1 to 4;

Figure 3 is a graph showing the folding endurance of the coatings of Examples 1 to 4;

Figure 4 is a diagram of the depth of the oxide layer obtained by holding the coatings of Examples 1 to 4 at 600°C for 30 minutes in an aerobic environment;

Figure 5 is a schematic diagram of the space structure of the vacuum chamber, in which 101 is the pulse bias access port, 102 is the molecular pump, 103 is the bevel flange, 104 is the No. 1 magnetic filtration system and magnetic field system, and 105 is the No. 2 magnetic filtration system and magnetic field. System, 106 is the magnetic field extraction system No. 1, 107 is the magnetic field suppression particle control system No. 1, 108 is the cathode target No. 1, 109 is the magnetic field extraction system No. 2, 110 is the magnetic field suppression particle control system No. 2, and 111 is the cathode No. 2 Target, 112 is the No. 3 magnetic field suppression particle control system, 113 is the No. 3 extraction magnetic field system, 114 is the No. 3 cathode target, 115 is the No. 4 cathode target, 116 is the No. 4 magnetic field suppression particle control system, and 117 is the No. 4 extraction magnetic field. System, 118 is the No. 3 magnetic filtration system and magnetic field system, 119 is the No. 4 magnetic filtration system and magnetic field system, 120 is the molecular pump, 121 is the vacuum chamber, and 122 is the bench.

Detailed ways

The invention provides a method for preparing a flexible high-entropy alloy coating, which includes the following steps:

Magnetic filter cathode vacuum arc deposition is performed on the surface of the unary metal coating to sequentially form a binary metal coating, a quaternary metal coating and a high-entropy coating. There are no less than 5 types of elements in the high-entropy coating. The atomic content of each element is independently 8 to 30%, preferably 10 to 25%.

In the present invention, the thickness of the high-entropy coating is preferably 1 to 10 μm, and more preferably 2 to 6 μm.

In the present invention, the elements in the high-entropy coating preferably include more than five types of Ti, Cr, Co, Mo, Y, Ni, Au, Ag, Cu and Al, and more preferably a MoYNiAgCu coating or a MoNiYAgCu coating. The folding toughness of the film layer is greater than 5,000 times without cracking.

In the present invention, the high-entropy coating is formed from an amorphous phase structure, which promotes the release of internal stress and achieves the goal of flexibility.

In the present invention, when depositing the high-entropy coating, the negative pressure of the magnetic filter cathode vacuum arc deposition is preferably 10 to 50 kV, and the duty cycle is preferably 1 to 4%. The negative pressure of 10 to 50 kV can greatly increase the amorphous phase. The structure is formed to further promote the release of internal stress and further achieve the goal of flexibility. The duty cycle is 1 to 4% to avoid the problem that multi-element elements easily promote the formation of alloy phases and affect the folding resistance when the duty cycle exceeds 4%.

In the present invention, when depositing the high-entropy coating, the angle between each magnetic filter extraction system and the normal line of the workpiece is preferably 40-60°, and the magnetic fields in the exit directions of the four extraction systems are preferably N, S, N, S in sequence. The magnetic fields of the two adjacent outlets are preferably opposite. When used simultaneously, the concentration of a single induced plasma is preferably greater than 20% of that of the magnetic filtration system used alone. The deposition rate of the overall film layer is preferably not less than 5 μm/h.

In the present invention, the magnetic filter cathode vacuum arc deposition when depositing the high-entropy coating includes suppressing the particle magnetic field, extracting the magnetic field, and magnetic filtering magnetic field. The suppressing particle magnetic field is preferably a high-frequency magnetic field, and the high-frequency magnetic field is The current is preferably 0-100A, and the frequency is preferably 100-1kHz; the extraction magnetic field is preferably a DC magnetic field, and the current of the DC magnetic field is preferably 0-5A; the magnetic filtering magnetic field is a high-frequency magnetic field, and the current is preferably 0-5A. 2A, the frequency is preferably 1~10KH.

In the present invention, when depositing the high-entropy coating, the plasma density induced by magnetic filter cathode vacuum arc deposition is higher, the film layer has good density, is characterized by morphology, and has fewer defects such as holes.

In the present invention, the arcing current of each cathode target of magnetic filter cathode vacuum arc deposition when depositing the high-entropy coating is preferably 20 to 180 A, preferably continuously adjustable, and the voltage is preferably 20 to 30 V.

In the present invention, the one-element metal coating is preferably a Ni metal layer or a Cr metal layer, and the folding toughness of the film layer is greater than 5000 times without cracking.

In the present invention, the thickness of the one-element metal coating is preferably no higher than 1/20 of the thickness of the flexible high-entropy alloy coating.

In specific embodiments of the present invention, the thickness of the one-element metal coating is preferably 10 to 50 nm. The Ni and Cr metal elements have strong toughness and exhibit excellent folding resistance when the thickness is 10 to 50 nm. Ni or Cr If the deposition is greater than 50nm, the size of the nanocrystals will be too large. Excessive crystal size will affect the folding resistance, and too thin will not have a transition effect.

In the present invention, magnetic filter cathode vacuum arc deposition is preferably performed to form the one-element metal coating.

In the present invention, the negative pressure during vacuum arc deposition of the magnetic filter cathode is preferably 800V, and the duty cycle is preferably 20 to 50%.

In the present invention, the binary metal coating is preferably a Cu-Ag metal layer or a Ni-Au metal layer.

In the present invention, the thickness of the binary metal coating is preferably no higher than 1/30 of the thickness of the flexible high-entropy alloy coating.

In specific embodiments of the present invention, the thickness of the binary metal coating is preferably 20 to 30 nm. The binary metal coating is an amorphous phase and has no alloy phase. The binary metal coating is selected from Cu -Ag or Ni-Au, the folding toughness of the film is greater than 5000 times without cracking. This is selected based on the composition of the quaternary metal coating and the one-element metal coating. The selection criteria are strong bonding strength and good element compatibility. Mainly; at the same time, the deposition of a one-element metal coating can induce the phase structure of the binary metal coating to be a fold-resistant phase, and the binary metal coating induces a quaternary metal coating to form a fold-resistant phase. The smaller the nanocrystal size, the better. until the amorphous phase is formed.

In the present invention, when depositing the binary metal coating, the negative pressure of the magnetic filter cathode vacuum arc deposition is preferably 10 to 50 kV, and the duty cycle is preferably 5 to 10%. During deposition, one cathode arc or two cathodes are preferably selected. The arc is carried out, and the high negative pressure setting can provide enough energy to promote the formation of fine nanocrystals and amorphous phases, and at the same time promote the generation of micro-area thermal peak effects, and at the same time release the internal stress, making the internal stress less than 100MPa; too high duty cycle The ratio will cause the coating temperature to rise suddenly, causing the grains to grow.

In the present invention, the quaternary metal coating is preferably a Cu-Ag-Mo-Y metal layer or a Ni-Au-Cr-Al metal layer, and the quaternary metal coating is an amorphous phase and has no alloy phase; The atomic content of Cu in the Cu-Ag-Mo-Y metal layer is preferably 40% to 60%, the atomic content of Ag is preferably 20% to 35%, the atomic content of Mo is preferably 5% to 15%, and the atomic content of Y is preferably 5% to 15%. The atomic content is preferably 3% to 9%; the atomic content of Ni in the Ni-Au-Cr-Al metal layer is preferably 20% to 60%, the atomic content of Au is preferably 10% to 15%, and the atomic content of Cr is preferably 20% to 60%. It is preferably 20% to 50%, and the atomic content of Al is preferably 10% to 15%.

In specific embodiments of the present invention, the thickness of the quaternary metal coating is preferably 100 to 200 nm.

In the present invention, the quaternary metal coating is a stress release layer, and at least two metals in the quaternary metal coating are incompatible with each other. Incompatible metals can easily form a single phase, thereby improving the folding endurance; the film The layer folding toughness is greater than 5,000 times without cracking.

In the present invention, the thickness of the quaternary metal coating is preferably no higher than 1/10 of the thickness of the flexible high-entropy alloy coating.

In the present invention, when depositing the quaternary metal coating, the negative pressure of the magnetic filter cathode vacuum arc deposition is preferably 10 to 50 kV, the duty cycle is preferably 5 to 10%, and the overall film temperature is preferably controlled to be room temperature to 150°C. , it is preferred to choose two or three cathode arc co-depositions during deposition.

In the present invention, under the action of high-power bias acceleration, a high-density ion beam impacts the surface of the substrate to be deposited, changes the surface structure of the substrate to be deposited, obtains a chemical bonding interface, and effectively improves the bonding condition of the film-base interface; at the same time, due to the joint operation of multiple cathode arcs Deposition, the spatial layout is more compact, so the deposition rate is greatly improved, while the preparation efficiency and the controllable range such as the element range and content range are improved; the spatial layout and the deposition of high-power pulse bias system greatly increase the energy of ions on the workpiece surface. The migration ability is also greatly improved, enabling uniform coating of special-shaped workpieces.

In the present invention, the device for magnetic filtering cathode vacuum arc deposition is preferably composed of a vacuum system, a high-power pulsed magnetic field system, a vacuum cathode arc deposition system and its control system. The vacuum chamber space layout of the vacuum system is shown in Figure 5 As shown, 101 is the pulse bias access port, 102 is the molecular pump, 103 is the bevel flange, 104 is the No. 1 magnetic filtration system and magnetic field system, 105 is the No. 2 magnetic filtration system and magnetic field system, and 106 is No. 1 Extract magnetic field system, 107 is the No. 1 magnetic field suppression particle control system, 108 is the No. 1 cathode target, 109 is the No. 2 extraction magnetic field system, 110 is the No. 2 magnetic field suppression particle control system, 111 is the No. 2 cathode target, and 112 is the No. 3 Magnetic field suppression particle control system, 113 is the magnetic field extraction system No. 3, 114 is the cathode target No. 3, 115 is the cathode target No. 4, 116 is the magnetic field suppression particle control system No. 4, 117 is the magnetic field extraction system No. 4, 118 is No. 3 Magnetic filtration system and magnetic field system, 119 is the No. 4 magnetic filtration system and magnetic field system, 120 is the molecular pump, 121 is the vacuum chamber, and 122 is the bench.

The present invention also provides the flexible high-entropy alloy coating described in the above technical solution, including a one-element metal coating, a binary metal coating, a quaternary metal coating and a high-entropy coating that are stacked in sequence.

In the present invention, the hardness of the flexible high-entropy alloy coating is preferably 10 to 20 Gpa, the internal stress is preferably 0 to 50 MPa, and the thickness of the oxide layer at 600°C for 30 minutes is preferably 0 to 50 nm, tested under 5% mass concentration HF The corrosion resistance current is two orders of magnitude smaller than the corrosion current of 304 stainless steel.

The present invention also provides the application of the flexible high-entropy alloy coating described in the above technical solution in the fields of aerospace and electronic communications.

In order to further illustrate the present invention, the flexible high-entropy alloy coating provided by the present invention and its preparation method and application are described in detail below with reference to examples, but they should not be understood as limiting the protection scope of the present invention.

Example 1

1) No deposited one-element metal layer

2) No deposited binary metal layer

3) The quaternary metal layer is Cu-Ag-Mo-Y quaternary metal layer (atomic content is Cu48%Ag32%Mo14%Y6%). During deposition, the negative pressure is 50kV, the duty cycle is 5%, and the deposition thickness is 200nm. ; The magnetic field that suppresses the particle magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100A, and the frequency is 100Hz; the extracted magnetic field is a DC magnetic field, and the extracted magnetic field current is 5A; the magnetic filtering magnetic field is a high-frequency magnetic field, the current is 2A, and the frequency is 1kH;

4) The high-entropy coating is MoYNiAgCu (atomic content is Mo12%Y5%Ni17%Ag21%Cu45%). Mo, NiY, Ag and copper are deposited together with four cathode arcs. During deposition, the negative pressure is 10kV and the duty cycle is 4%; the magnetic field that suppresses the particle magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100A, and the frequency is 1kHz; the extracted magnetic field is a DC magnetic field, and the extracted magnetic field current is 5A; the magnetic filtering magnetic field is a high-frequency magnetic field, the current is 2A, and the frequency is 10kHz. The deposition thickness is 5 μm.

Example 2

1) The one-element metal layer is a Ni metal layer, the negative pressure during deposition is 800V, the duty cycle is 50%, and the deposition thickness is 50nm; the magnetic field to suppress the particle magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100A, and the frequency is 100Hz; the magnetic field is extracted It is a DC magnetic field, and the magnetic field current is 5A; the magnetic filtering magnetic field is a high-frequency magnetic field, the current is 2A, and the frequency is 10kHz;

2) The binary metal layer is a Cu-Ag binary metal layer (atomic content is Cu75%Ag25%). During deposition, the negative pressure is 50kV, the duty cycle is 10%, and the deposition thickness is 100nm; the magnetic field that suppresses the particle magnetic field is high frequency. Magnetic field, high-frequency magnetic field current is 100A, frequency 1kHz; extracted magnetic field is DC magnetic field, extracted magnetic field current is 5A; magnetic filter magnetic field is high-frequency magnetic field, current is 2A, frequency is 10kHz;

3) The quaternary metal layer is Cu-Ag-Mo-Y quaternary metal layer (atomic content is Cu48%Ag32%Mo14%Y6%). During deposition, the negative pressure is 50kV, the duty cycle is 5%, and the deposition thickness is 200nm. ; The magnetic field that suppresses the particle magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100A, and the frequency is 1kHz; the extracted magnetic field is a DC magnetic field, and the extracted magnetic field current is 5A; the magnetic filtering magnetic field is a high-frequency magnetic field, the current is 2A, and the frequency is 10kHz;

4) The high-entropy coating is MoYNiAgCu (atomic content is Mo12%Y5%Ni17%Ag21%Cu45%). Four cathode arcs are selected to be co-deposited. During deposition, the negative pressure is 10kV and the duty cycle is 1%; suppress the particle magnetic field. It is a high-frequency magnetic field, the high-frequency magnetic field current is 100A, the frequency is 1kHz; the extracted magnetic field is a DC magnetic field, the extracted magnetic field current is 2A; the magnetic filtering magnetic field is a high-frequency magnetic field, the current is 2A, the frequency is 10KHz, and the deposition thickness is 5μm.

Example 3

1) The one-element metal layer is a Ni metal layer, the negative pressure during deposition is 800V, the duty cycle is 20%, and the deposition thickness is 50nm; the magnetic field to suppress the particle magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100A, and the frequency is 100Hz; the magnetic field is extracted It is a DC magnetic field, and the magnetic field current is 5A; the magnetic filtering magnetic field is a high-frequency magnetic field, the current is 2A, and the frequency is 10kHz;

2) The binary metal layer is a Cu-Ag binary metal layer (atomic content is Cu75%Ag25%). During deposition, the negative pressure is 50kV, the duty cycle is 5%, and the deposition thickness is 100nm; the magnetic field that suppresses the particle magnetic field is high frequency. The magnetic field, the high-frequency magnetic field current is 100A, the frequency is 500Hz; the extracted magnetic field is a DC magnetic field, the extracted magnetic field current is 5A; the magnetic filtering magnetic field is a high-frequency magnetic field, the current is 2A, and the frequency is 10kHz;

3) The quaternary metal layer is Cu-Ag-Mo-Y quaternary metal layer (atomic content is Cu48%Ag32%Mo14%Y6%). During deposition, the negative pressure is 50kV, the duty cycle is 10%, and the deposition thickness is 200nm. ; The magnetic field that suppresses the particle magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100A, and the frequency is 500Hz; the extracted magnetic field is a DC magnetic field, and the extracted magnetic field current is 5A; the magnetic filtering magnetic field is a high-frequency magnetic field, the current is 2A, and the frequency is 5kHz;

4) The high-entropy coating is MoYNiAgCu (atomic content is Mo12%Y5%Ni17%Ag21%Cu45%). Four cathode arcs are selected for co-deposition. During deposition, the negative pressure is 20kV and the duty cycle is 4%; suppress the particle magnetic field. It is a high-frequency magnetic field, the high-frequency magnetic field current is 100A, the frequency is 1kHz; the extracted magnetic field is a DC magnetic field, the extracted magnetic field current is 2A; the magnetic filtering magnetic field is a high-frequency magnetic field, the current is 2A, the frequency is 10KHz, and the deposition thickness is 5μm.

Example 4

1) The one-element metal layer is a Ni metal layer, the negative pressure during deposition is 800V, the duty cycle is 30%, and the deposition thickness is 50nm; the magnetic field to suppress the particle magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100A, and the frequency is 100Hz; the magnetic field is extracted It is a DC magnetic field, and the magnetic field current is 5A; the magnetic filtering magnetic field is a high-frequency magnetic field, the current is 2A, and the frequency is 10kHz;

2) The binary metal layer is a Cu-Ag binary metal layer (atomic content is Cu75%Ag25%). During deposition, the negative pressure is 30kV, the duty cycle is 8%, and the deposition thickness is 100nm; the magnetic field that suppresses the particle magnetic field is high frequency. The magnetic field, the high-frequency magnetic field current is 100A, the frequency is 500Hz; the extracted magnetic field is a DC magnetic field, the extracted magnetic field current is 5A; the magnetic filtering magnetic field is a high-frequency magnetic field, the current is 2A, and the frequency is 10kHz;

3) The quaternary metal layer is Cu-Ag-Mo-Y quaternary metal layer (atomic content is Cu48%Ag32%Mo14%Y6%). During deposition, the negative pressure is 10kV, the duty cycle is 10%, and the deposition thickness is 200nm. ; The magnetic field that suppresses the particle magnetic field is a high-frequency magnetic field, the high-frequency magnetic field current is 100A, and the frequency is 500Hz; the extracted magnetic field is a DC magnetic field, and the extracted magnetic field current is 5A; the magnetic filtering magnetic field is a high-frequency magnetic field, the current is 2A, and the frequency is 5kHz;

4) The high-entropy coating is MoYNiAgCu (atomic content is Mo12%Y5%Ni17%Ag21%Cu45%). Four cathode arcs are selected for co-deposition. During deposition, the negative pressure is 50kV and the duty cycle is 2%; suppress the particle magnetic field. It is a high-frequency magnetic field, the high-frequency magnetic field current is 100A, the frequency is 1kHz; the extracted magnetic field is a DC magnetic field, the extracted magnetic field current is 2A; the magnetic filtering magnetic field is a high-frequency magnetic field, the current is 2A, the frequency is 10KHz, and the deposition thickness is 5μm.

Figure 1 is a diagram of the bonding strength of the coatings of Examples 1 to 4. It can be seen from Figure 1 that the existence of one-element, two-element, and four-element metal transition layers can greatly improve the bonding strength, and when depositing a high-entropy coating, the deposition of negative The higher the bias voltage, the stronger the shallow ion implantation effect, and therefore the higher the bonding strength.

Figure 2 is a diagram of the internal stress of the coatings of Examples 1 to 4. It can be seen from Figure 2 that when the high-entropy coating is deposited, the higher the deposition negative pressure, the lower the internal stress. This is because ultra-high negative bias can form High-energy particle bombardment produces thermal peak effects, etc., which effectively reduces the internal stress of the film layer.

Figure 3 is a graph showing the folding endurance of the coatings of Examples 1 to 4. The test standard is GB/T457-2002. It can be seen from Figure 3 that the higher the bonding strength of the coating, the lower the internal stress, the better the toughness and the resistance. The higher the bending ability.

The oxide layer depth map obtained by holding the temperature at 600°C for 30 minutes in an aerobic environment is shown in Figure 4. It can be seen from Figure 4 that high-entropy films deposited by magnetic filtration technology have high resistance to high-temperature oxidation, but negative bias voltage The higher the value, the stronger the high-energy ion bombardment deposition effect, the fewer defects in the film layer, and therefore the better the high-temperature oxidation resistance.

The above descriptions are only preferred embodiments of the present invention and do not limit the present invention in any form. It should be pointed out that for those of ordinary skill in the art, several improvements and modifications can be made without departing from the principles of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims (10)

1. The preparation method of the flexible high-entropy alloy coating is characterized by comprising the following steps of:

and performing magnetic filtration cathode vacuum arc deposition on the surface of the monobasic metal coating to sequentially form a binary metal coating, a quaternary metal coating and a high-entropy coating, wherein the types of elements in the high-entropy coating are not less than 5, and the atomic content of each element is independently 8-30%.

2. The method of claim 1, wherein the high entropy coating has a thickness of 1 to 10 μm.

3. The method of claim 1 or 2, wherein the elements in the high entropy coating comprise five or more of Ti, cr, co, mo, Y, ni, au, ag, cu and Al.

4. The method of claim 1, wherein the single metal coating is a Ni metal layer or a Cr metal layer.

5. The method of claim 1 or 4, wherein the thickness of the monobasic metal coating is no greater than 1/20 of the thickness of the flexible high entropy alloy coating.

6. The method of claim 1, wherein the binary metal coating is a Cu-Ag metal layer or a Ni-Au metal layer.

7. The method of manufacturing according to claim 1 or 6, wherein the thickness of the binary metal coating is not higher than 1/30 of the thickness of the flexible high-entropy alloy coating.

8. The method of claim 1, wherein the quaternary metal coating is a Cu-Ag-Mo-Y metal layer or a Ni-Au-Cr-Al metal layer.

9. The flexible high-entropy alloy coating according to any one of claims 1 to 8, comprising a single-element metal coating, a dual-element metal coating, a quaternary metal coating and a high-entropy coating, which are sequentially stacked.

10. Use of the flexible high-entropy alloy coating of claim 9 in the fields of aerospace and electronic communication.