CN116820216A - Laminated conduction type power supply unit, power supply system and server - Google Patents

Abstract

This application relates to a laminated conductive power supply unit, a power supply system and a server. The laminated conductive power supply unit includes: a casing; a power motherboard located at the bottom of the casing; a first gold finger is provided on one side of the power motherboard, and the first gold finger protrudes from Outside the side wall of the casing; a power subcard is provided in the casing and located on the power motherboard; the power subcard is electrically connected to the power motherboard; the power subcard A second gold finger is provided on one side, the second gold finger protrudes outside the side wall of the housing, and the second gold finger is located above the first gold finger; the first gold finger The finger and the second golden finger can be electrically connected to a power connector at the same time. This application realizes high-power power supply to the power distribution mainboard by setting the golden fingers of the power supply unit into a laminated current conduction structure, and meets the power supply requirements of the power distribution mainboard for high-power electrical components.

Description

Laminated conductive power supply units, power supply systems and servers

Technical field

The present application relates to the technical field of laminated conductive power supply units, and in particular to a laminated conductive power supply unit, a power supply system and a server.

Background technique

With the continuous rise of cloud computing and AI technology, the volume of Internet business continues to increase. Higher requirements have been put forward for the data processing capabilities and storage capacity of servers in data center computer rooms. As a unit in a traditional computer room, the server cabinet system requires server computing nodes deployed inside the cabinet to have increasingly stronger data processing capabilities and higher deployment density.

With the growth of Internet user business, network data throughput is also increasing. As the basic data processing unit of the data center, the server's workload is also increasing. In particular, the workload current of the central processing unit (CPU) chip and graphics processing unit (GPU) components inside the server is getting larger and larger. The working current of a single central processing unit (CPU) chip can reach 300A to 600A.

The current server power supply structure uses a 12V direct-in power distribution motherboard from the power supply unit (PSU), which is transferred out through the electronic fuse (EFUSE) to supply power to the central processing unit (CPU) chip, memory, graphics processor (GPU) and other components.

As the power consumption of data computing and processing core components such as central processing unit (CPU) chips and graphics processing unit (GPU) components increases, the power consumption of the server is also increasing. Since the data center computer room is expensive, and the Structural size constraints for cabinets and the servers deployed within them are becoming increasingly stringent. As a result, the size restrictions on the PSU and power distribution motherboard inside the server are becoming more and more stringent.

In order to maintain the continuity of server products in the chassis structure to adapt to the stringent requirements of data centers for server structure size, while also taking into account the central processing unit (CPU) chips and graphics processing units (GPU) that support higher computing power and higher power consumption. )part. Therefore, while maintaining the existing server chassis structure and 12V board-level power supply structure, how to achieve high-power energy transmission from the internal power supply unit (PSU) to the board side poses a great challenge.

Contents of the invention

Based on this, a laminated conductive power supply unit, power supply system and server are provided, which can solve the current flow bottleneck problem at the interconnection between the power supply unit and the power distribution motherboard.

On the one hand, a stacked conductive power supply unit is provided. The stacked conductive power supply unit includes:

case;

A power motherboard is provided at the bottom of the housing; a first gold finger is provided on one side of the power motherboard, and the first gold finger protrudes outside the side wall of the housing;

A power subcard is provided in the housing and located on the power motherboard; the power subcard is electrically connected to the power motherboard; a second gold finger is provided on one side of the power subcard, so The second gold finger protrudes outside the side wall of the housing, and the second gold finger is located above the first gold finger;

Wherein, the first gold finger and the second gold finger can be electrically connected to a power connector at the same time.

In one embodiment, a positive busbar and a negative busbar are provided between the power daughter card and the power motherboard to achieve electrical connection.

On the other hand, a power supply system is provided, which includes the aforementioned laminated conductive power supply unit and a power connector.

In one embodiment, the power connector is provided with a power access surface and a switching output surface; the power connector is provided with a first power connector extending from the power access surface to the switching output surface. A pair of connecting terminals and a second pair of connecting terminals; on the side of the power access surface, the pins of the first pair of connecting terminals are docked with the first gold finger, and the pins of the second pair of connecting terminals are connected with The second golden finger is docked.

In one embodiment, the power access surface is a side surface of the power connector, and the switching output surface is the bottom surface or the top surface of the power connector; or, the power access surface and The switching output surfaces are respectively two sides of the power connector.

In one embodiment, the power supply system further includes a power distribution mainboard; the power distribution mainboard is connected to the first pair of connection terminals and the second pair of connection terminals on the switching output surface of the power connector. Pin electrical connection.

In one embodiment, the power supply system further includes a power supply busbar; one end of the power supply busbar is connected to the power distribution mainboard, and the other end of the power supply busbar is connected to the electrical equipment.

In one embodiment, the power supply busbar is provided with a copper bar body and welding pins provided at both ends of the copper bar body. The copper bar body is L-shaped, Z-shaped, E-shaped or S-shaped along the extension direction. Type, the welding pin is cylindrical.

In one embodiment, the power supply system further includes an electronic fuse; the electronic fuse is provided between the power supply busbar and the electrical equipment.

On the other hand, a server is provided, which includes the aforementioned power supply system and electrical equipment; the electrical equipment includes at least one of a central processor, a memory, a graphics processor, a voltage regulator, or a fan. kind.

The above-mentioned laminated conductive power supply unit, power supply system and server, by setting the golden finger of the power supply unit to a laminated current conduction structure, realize high-power power supply from the power supply unit to the power distribution motherboard, and meet the requirements of the power distribution motherboard for high-power applications. Power supply requirements for electrical components.

Description of the drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without exerting creative efforts.

Figure 1 is a schematic diagram of the power supply structure of a 2U universal server system in the prior art;

Figure 2 is a schematic diagram of the interconnection between a single PSU golden finger and a single PSU connector in the prior art;

Figure 3 is a schematic structural diagram of a power supply unit with a stacked current conductive structure and a power connector according to an embodiment of the present application;

Figure 4 is a schematic structural diagram of a stacked conductive power supply unit in one embodiment of the present application;

Figure 5 is a schematic structural diagram of a power connector in an embodiment of the present application;

Figure 6 is a schematic diagram of the connection structure of the power supply system in one embodiment of the present application;

Figure 7 is a schematic three-dimensional structural diagram of the power supply busbar in one embodiment of the present application;

Figure 8 is a schematic structural diagram of three special-shaped power supply busbars in one embodiment of the present application;

Figure 9 is an internal structure diagram of a server in an embodiment of the present application.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.

Example 1

As mentioned in the background art, Figure 1 is a schematic diagram of the power supply structure of a 2U universal server system. The 12V power module PSU0\PSU1 is directly connected to the power distribution mainboard. 12V is transferred out to 12V0 through the electronic fuse EFUSE0 to supply power to CPU0 VR\CPU1VR\DDR VR0\DDR VR1\DDR VR2\DDR VR3. 12V is transferred out to 12V1 through the electronic fuse EFUSE1 to power PCIE devices (such as GPU, network card, etc.). 12V is transferred out to 12V2 through the electronic fuse EFUSE2 to power the hard disk array. 12V is transferred out of 12V_FAN through the fan electronic fuse FAN EFUSE to supply power to fans FAN0\FAN1\FAN2\FAN3.

Among them, the Chinese full name of PSU is power supply unit, the Chinese full name of CPU is central processing unit, the Chinese full name of GPU is graphics processor, the Chinese full name of VR is voltage regulator, the Chinese full name of EFUSE is electronic fuse, and the Chinese full name of BUSBAR is The full name is power supply busbar, and the Chinese full name of FAN is fan. DDR is the abbreviation of Double Data Rate, and its full name in Chinese is double rate.

As the power consumption of the server's CPU, memory, GPU, and hard disk continues to increase, in order to take away more heat to meet the system cooling requirements, the power consumption of the system fan is also increasing. Therefore, there are many flow bottlenecks on the 12V power supply path from the PSU to the power distribution mainboard side and the power distribution mainboard side. As shown in Figure 1, there are four positions: ①, ②, ③, and ④.

Position ①: The interconnection position between the PSU and the power distribution motherboard. Usually the PSU with a golden finger is plugged into the PSU connector on the motherboard side of the power distribution. As the power consumption of the whole machine increases, the current flowing through position ① also continues to increase. As shown in Figure 2, in the previous interconnection method of single PSU gold finger with single PSU connector, the PSU gold finger (GOLD FINGER) had the problem of insufficient flow.

Positions 2, 3, and 4: Since the CPU’s Common System Interface (QPI) bus signal, High-Speed Serial Computer Extensions (PCIE) signal, and DDR5 signal occupy most of the space on the power distribution motherboard, leaving the PCB copper foil for current flow Space is limited. DDR5 is a computer memory specification. If more board layers are added, the cost of the power distribution motherboard will increase significantly and the chassis structure will be adjusted. Under the premise that the power distribution motherboard layer does not increase, as the power consumption of PCIE devices such as GPU, CPU, memory, and fans continues to increase, the current flowing through positions ②, ③, and ④ will be very large, and the large current will pass through the power distribution motherboard PCB. Copper foil conducts and there will be flow problems.

Therefore, combined with Figure 1 and Figure 2, the shortcomings of the existing technology are: 1) In application scenarios that support higher power CPU, GPU, and memory, there will be a flow bottleneck at the interconnection between the PSU and the power distribution motherboard. 2) In application scenarios that support higher-power CPU, GPU, and memory, the PCB copper foil on the power distribution path of the motherboard to the CPU, memory, GPU, and fan is not enough.

As shown in FIG. 3 , FIG. 3 is a schematic structural diagram of a power supply unit with a stacked current conductive structure and a power connector. In order to solve the problem of flow bottlenecks at the interconnection between the power supply unit (PSU) and the power distribution mainboard, embodiments of the present invention creatively propose a laminated conductive power supply unit, which combines the existing power supply structure with The interconnection method between the power supply unit (PSU) and the power distribution motherboard adopts: laminated current conduction structure.

As shown in Figure 4, Figure 4 is a schematic structural diagram of a power supply unit (PSU) with a stacked current conduction structure. Wherein, the laminated current conduction structure is to provide a laminated power motherboard (PSU motherboard) and a power daughter card (PSU daughter card) in the casing of the power supply unit (PSU). One side of the power motherboard is provided with a third A gold finger, the first gold finger protrudes from the side wall of the housing; the power subcard is electrically connected to the power motherboard; a second gold finger is provided on one side of the power subcard. Gold fingers, the second gold fingers protrude from the side wall of the housing, and the second gold fingers are located above the first gold fingers; in this way, the first gold fingers and the third gold fingers The two gold fingers can be electrically connected to one power connector at the same time, allowing the power supply unit (PSU) to be transferred to the power distribution motherboard through the power connector.

As shown in Figure 3 and Figure 4, the specific solution is: add a PSU daughter card with a gold finger on the PSU motherboard. The PSU daughter card and the PSU motherboard are interconnected through a pair of conductive power supply busbars (BUSBAR) to achieve PSU 12V interconnection. In Figure 3, a pair of conductive power supply busbars include a positive busbar and a negative busbar (GND), which are used to transmit 12V voltage.

As shown in Figure 5, Figure 5 is a schematic structural diagram of a power connector (PSU connector). The PSU connector used on the motherboard side of power distribution is an integrally formed connector that is stacked up and down. Figure 5 shows a cross-sectional view of the power connector. The left side of the cross-sectional view is the power access surface, and the bottom surface is the transfer output surface. On one side of the power access surface, the pins of the first pair of connection terminals are connected to the first gold fingers, the pins of the second pair of connection terminals are connected to the second gold fingers, and the first pair of the transfer output surface The pins of the connecting terminal and the pins of the second pair of connecting terminals can be soldered or crimped on the power distribution motherboard.

As shown in Figure 6, Figure 6 is a schematic diagram of the connection structure of the power supply system, which mainly reflects the high-power power supply structure of the stacked current conduction structure. Compared with the structure shown in Figure 1, the structure shown in Figure 6 uses power supply busbars (BUSBAR) to realize PSU 12V interconnection at the four positions ①, ②, ③, and ④.

As shown in Figure 7, Figure 7 is a schematic three-dimensional structural diagram of a power supply busbar. One end of the power supply busbar is connected to the power distribution mainboard, and the other end of the power supply busbar is connected to electrical equipment.

The power supply busbar is provided with a copper bus main body and welding pins provided at both ends of the copper bus main body. The copper bus main body is L-shaped, Z-shaped, E-shaped or S-shaped along the extending direction. The welding pins are Cylindrical shape.

In Figure 7, positions A and B represent the welding pins of the power supply busbar (BUSBAR). Position C represents the BUSBAR support pad (generally made of temperature-resistant insulating material), which is used to support and fix the BUSBAR position to prevent potential risks such as contact and collision between the BUSBAR and the PCB surface during transportation or machine vibration.

As shown in Figure 8, it is a schematic structural diagram of three special-shaped power supply busbars (BUSBAR). Includes: L-type BUSBAR, Z-type BUSBAR, E-type BUSBAR. details as follows:

L-type and Z-type BUSBAR, both left and right ends contain welding pins, and the number of welding pins on the left and right ends is equal. E-type BUSBAR, the left welding pin is the power supply input terminal, and the middle and right end welding pins are the power supply output terminal. The number of welding pins at the left end = the number of welding pins at the middle + the number of welding pins at the right end.

Among them: the number of pins can be determined based on the BUSBAR flow rate I and the single pin flow capacity I0. The number of pins N has the following relationship: N=[I/I0]+1.

In order to ensure the soldering rate of BUSBAR welding, the soldering pins need to be designed as cylindrical or elliptical cylindrical shapes, so as to improve the uniformity and fullness of tin on the surface of the pins during soldering.

Combined with Figure 6, this embodiment adopts L-type, Z-type, and E-type power supply busbars from the power supply input end of the power distribution mainboard to the fan power end, to the CPU and memory power end, to the GPU and hard disk array power end. (BUSBAR).

In order to clearly illustrate the implementation of the present invention, the specific working process of the technical solution of the present invention is explained as follows with reference to Figures 3, 5, 6, and 8:

1) First, according to the server system configuration: including CPU, memory, hard disk array, system fan, GPU total power consumption P _T of the node power distribution motherboard, according to the 80% derating standard, determine the power supply from PSU->power distribution motherboard The maximum current value of the path I _T .

2) Then, select the power supply busbar BUSBAR0 that meets the flow size of 0.5*I _T. Generally, BUSBAR can be customized according to the standard of 3.

3) Next, design a PSU daughter card that can support the flow of 0.5*I _T , and use a pair of prepared power supply busbars BUSBAR0 to interconnect the PSU motherboard and PSU daughter card.

4) According to the diagram on the right side of Figure 3, make an integrated connector that matches the PSU motherboard and the PSU daughter card gold finger, and install it on the power distribution mainboard side.

5) According to the power distribution, the PCIE device (GPU) I _G and the rated operating current I _H of the hard disk array at the power consumption end of the motherboard are distributed. The E-type BUSBAR: BUSBAR1 is made according to the actual layout of the power distribution motherboard. Make the flow of its left input part satisfy 1.25*(I _G +I _H ). The through-flow in the middle section of BUSBAR1 satisfies 1.25*I _G. The flow through the right section of BUSBAR1 satisfies 1.25*I _H. As shown in Figure 5, the BUSBAR1 input pin is welded next to the PSU connector on the power distribution motherboard, the middle pin is welded next to the GPU power end, and the right end pin is welded close to the hard drive array power end.

6) According to the total rated operating current I _C + I _D of the CPU and memory at the power-consuming end of the power distribution motherboard, make a Z-type BUSBAR: BUSBAR2 based on the actual layout of the power distribution motherboard. Make the flow satisfy 1.25*(I _C +I _D ). As shown in Figure 6, the left pin of BUSBAR2 is soldered next to the PSU connector on the power distribution motherboard, passing through the gap between the DIMM slot and the CPU. The other pin is soldered on the right side of the power distribution motherboard near the CPU and memory VR input terminals. .

7) According to the total rated operating current I _F of the system fan power terminal, and the actual layout of the power distribution motherboard, make an L-shaped BUSBAR: BUSBAR3. Make the flow satisfy 1.25*I _F. As shown in Figure 6, the left pin of BUSBAR3 is soldered next to the PSU connector of the power distribution motherboard, passing through the gap between the edge of the power distribution motherboard and the DIMM slot, and the other pin is soldered to the right side of the power distribution motherboard near the fan power end. nearby.

This embodiment selects and adapts L-type, Z-type, and E-type BUSBARs based on the layout of the power distribution mainboard and the power of the electrical equipment. From the power supply input end of the power distribution motherboard to the fan power end, to the CPU and memory power end, to the GPU and hard disk array power end, L-type, Z-type, and E-type BUSBAR are used in order. BUSBAR is used to replace the PCB copper foil to conduct large currents. In this way, the power distribution motherboard layers can be reduced, the cable-free design on the power distribution motherboard can be realized, and the power supply needs of the high-power electrical components of the power distribution motherboard can be met.

Example 2

Embodiment 2 contains all the technical features of Embodiment 1.

Specifically, as shown in Figures 3 and 4, in Embodiment 2, a stacked conductive power supply unit 10 is provided, including:

Shell 1;

The power motherboard 2 is located at the bottom of the housing 1; a first gold finger 4 is provided on one side of the power motherboard 2, and the first gold finger 4 protrudes from the side of the housing 1. outside the wall;

The power sub-card 3 is located in the housing 1 and on the power motherboard 2; the power sub-card 3 is electrically connected to the power motherboard 2; one side of the power sub-card 3 is provided with There is a second gold finger 5, the second gold finger 5 protrudes outside the side wall of the housing 1, and the second gold finger 5 is located above the first gold finger 4;

Wherein, the first gold finger 4 and the second gold finger 5 can be electrically connected to a power connector 20 at the same time.

As shown in FIG. 4 , in this embodiment, a positive busbar 41 and a negative busbar 42 are provided between the power subcard 3 and the power motherboard 2 to achieve electrical connection.

As shown in FIG. 3 and FIG. 5 , the present application also provides a power supply system, which includes the aforementioned laminated conductive power supply unit 10 and a power connector 20 .

As shown in Figure 5, in this embodiment, the power connector 20 is provided with a power access surface 201 and a switching output surface 202; the power connector 20 has a power connector extending from the power access surface 201. to the first pair of connection terminals 21 and the second pair of connection terminals 22 of the switching output surface 202; on the side of the power access surface 201, the pins of the first pair of connection terminals 21 are connected to the first pair of connection terminals 21. The golden fingers 4 are connected to each other, and the pins of the second pair of connecting terminals 22 are connected to the second golden fingers 5 .

In this embodiment, the power access surface 201 is one side of the power connector 20, and the switching output surface 202 is the bottom surface or the top surface of the power connector 20; or, the power connector The input surface 201 and the switching output surface 202 are respectively two side surfaces of the power connector 20 . As shown in FIG. 5 , preferably, the power access surface 201 is a side surface of the power connector 20 , and the switching output surface 202 is the bottom surface of the power connector 20 .

In this embodiment, the power supply system further includes a power distribution mainboard 40; a first pair of connection terminals 21 and a second pair of connection terminals 21 on the power distribution mainboard 40 and the transfer output surface 202 of the power connector 20. The pins of the connection terminal 22 are electrically connected.

As shown in Figures 6, 7, and 8, in this embodiment, the power supply system also includes a power supply bus 30; one end of the power supply bus 30 is connected to the power distribution mainboard 40. The other end of the busbar 30 is connected to the electrical equipment.

As shown in Figures 6, 7, and 8, in this embodiment, the power supply busbar 30 is provided with a copper bar body 31 and welding pins 32 provided at both ends of the copper bar body 31. The main body 31 is L-shaped, Z-shaped, E-shaped or S-shaped along the extending direction, and the welding pins 32 are cylindrical.

In Figure 7, positions A and B represent the welding pins 32 of the power supply busbar 30 (BUSBAR). Position C represents the support pad 33 of the BUSBAR, which is used to support and fix the BUSBAR position to prevent potential risks such as contact and collision between the BUSBAR and the PCB surface during transportation or machine vibration. The support gasket 33 is generally made of temperature-resistant insulating material.

As shown in Figure 8, there are three structural schematic diagrams of special-shaped BUSBAR. That is, the power supply busbar 30 (BUSBAR) includes: L-type BUSBAR, Z-type BUSBAR, and E-type BUSBAR. details as follows:

L-shaped and Z-shaped BUSBARs include welding pins 32 on both left and right ends, and the number of welding pins 32 on the left and right ends is equal. E-type BUSBAR, the left end welding pin 32 is the power supply input end, and the middle and right end welding pins 32 are the power supply output end. The number of welding pins 32 on the left end = the number of welding pins 32 on the middle + the number of welding pins 32 on the right end.

Among them: the number of welding pins 32 can be determined according to the BUSBAR flow rate I and the flow capacity I0 of a single welding pin 32. The number N of welding pins 32 has the following relationship: N=[I/I0]+1.

In order to ensure the soldering rate of BUSBAR welding, the welding pins 32 need to be designed into a cylindrical or elliptical cylindrical shape, so as to improve the uniformity and fullness of tin on the surface of the welding pins 32 during welding.

6, in this embodiment, L-type, Z-type, and E-type power supply connectors are used from the power supply input end of the power distribution motherboard 40 to the fan power end, to the CPU and memory power end, to the GPU and hard disk array power end. Row 30(BUSBAR).

In order to clearly illustrate the implementation of the present invention, the specific working process of the technical solution of the present invention is explained as follows with reference to Figures 3, 6, and 8:

1) First, according to the server system configuration: including CPU, memory, hard disk array, system fan, GPU, the total power consumption P _T of the node power distribution motherboard 40 is determined according to the 80% derating standard from PSU -> power distribution motherboard 40 Maximum current value I _T of the power supply path.

2) Then, select the power supply busbar BUSBAR0 that meets the flow size of 0.5*I _T. Generally, BUSBAR can be customized according to the standard of 3.

3) Next, design a PSU daughter card that can support the flow of 0.5*I _T , and use a pair of prepared power supply busbars BUSBAR0 to interconnect the PSU motherboard and PSU daughter card.

4) According to the diagram on the right side of Figure 3, make an integrated connector that matches the PSU motherboard and the PSU daughter card gold finger, and install it on the 40 end of the power distribution mainboard.

5) Distribute the rated operating current I _H of the PCIE device (GPU) I _G and the hard disk array at the power consumption end of the motherboard 40 according to the power supply. An E-type BUSBAR: BUSBAR1 is produced according to the actual layout of the power distribution mainboard 40 . Make the flow of its left input part satisfy 1.25*(I _G +I _H ). The through-flow in the middle section of BUSBAR1 satisfies 1.25*I _G. The flow through the right section of BUSBAR1 satisfies 1.25*I _H. As shown in Figure 5, the BUSBAR1 input pin is welded next to the 40PSU connector on the power distribution motherboard, the middle pin is welded next to the GPU power end, and the right end pin is welded next to the hard disk array power end.

6) According to the total rated working current I _C + I _D of the CPU and memory at the power-consuming end of the power distribution mainboard 40 , make a Z-type BUSBAR: BUSBAR2 based on the actual layout of the power distribution mainboard 40 . Make the flow satisfy 1.25*(I _C +I _D ). As shown in Figure 6, the left pin of BUSBAR2 is soldered next to the 40PSU connector on the power distribution motherboard, passing through the gap between the DIMM slot and the CPU. The other end pin is soldered on the right side of the power distribution motherboard 40, close to the CPU and memory VR input. nearby.

7) According to the total rated operating current I _F of the system fan power terminal, and the actual layout of the power distribution mainboard 40, make an L-shaped BUSBAR: BUSBAR3. Make the flow satisfy 1.25*I _F. As shown in Figure 6, the left pin of BUSBAR3 is soldered next to the PSU connector of the power distribution motherboard 40, passing through the gap between the edge of the power distribution motherboard 40 and the DIMM slot, and the other end pin is soldered to the right side of the power distribution motherboard 40 close to the fan. near the electrical terminal.

In this embodiment, L-type, Z-type, and E-type BUSBARs are selected and adapted according to the layout of the power distribution mainboard 40 and the power of the electrical equipment. From the power supply input end of the power distribution motherboard 40 to the fan power end, to the CPU and memory power end, to the GPU and hard disk array power end, L-type, Z-type, and E-type BUSBARs are used in sequence. BUSBAR is used to replace the PCB copper foil to conduct large currents, thereby reducing the power distribution motherboard 40 board layers, realizing a cable-free design on the power distribution motherboard 40 , and meeting the power supply needs of the high-power electrical components of the power distribution motherboard 40 .

Example 3

As shown in Figure 6, Embodiment 3 contains all the technical features of Embodiment 2. The difference is that the power supply system in Embodiment 3 also includes an electronic fuse; the electronic fuse is arranged on the power supply between busbar 30 and the electrical equipment. The electrical device includes at least one of a central processing unit, a memory, a graphics processor, a voltage regulator or a fan.

As shown in Figure 6, there are multiple electronic fuses, each of which is provided at the input end of the electrical equipment. It can be understood that the electronic fuse is usually provided after the power distribution mainboard 40, and the power distribution mainboard 40 is connected to the electronic fuse through the power supply busbar 30 (BUSBAR), and the electronic fuse is then connected to the electrical equipment. Moreover, a power supply busbar 30 (BUSBAR) can also be provided between the electronic fuse and the electrical equipment.

Specifically, as shown in Figures 3 and 4, in Embodiment 2, a stacked conductive power supply unit 10 is provided, including:

Shell 1;

The power motherboard 2 is located at the bottom of the housing 1; a first gold finger 4 is provided on one side of the power motherboard 2, and the first gold finger 4 protrudes from the side of the housing 1. outside the wall;

The power sub-card 3 is located in the housing 1 and on the power motherboard 2; the power sub-card 3 is electrically connected to the power motherboard 2; one side of the power sub-card 3 is provided with There is a second gold finger 5, the second gold finger 5 protrudes outside the side wall of the housing 1, and the second gold finger 5 is located above the first gold finger 4;

Wherein, the first gold finger 4 and the second gold finger 5 can be electrically connected to a power connector 20 at the same time.

As shown in Figure 4, in this embodiment, a positive busbar 41 and a negative busbar 42 are provided between the 22 power supply daughter card 3 and the power motherboard 2 to achieve electrical connection.

As shown in FIG. 3 and FIG. 5 , the present application also provides a power supply system, which includes the aforementioned laminated conductive power supply unit 10 and a power connector 20 .

As shown in Figure 5, in this embodiment, the power connector 20 is provided with a power access surface 201 and a switching output surface 202; the power connector 20 has a power connector extending from the power access surface 201. to the first pair of connection terminals 21 and the second pair of connection terminals 22 of the switching output surface 202; on the side of the power access surface 201, the pins of the first pair of connection terminals 21 are connected to the first pair of connection terminals 21. The golden fingers 4 are connected to each other, and the pins of the second pair of connecting terminals 22 are connected to the second golden fingers 5 .

In this embodiment, the power access surface 201 is one side of the power connector 20, and the switching output surface 202 is the bottom surface or the top surface of the power connector 20; or, the power connector The input surface 201 and the switching output surface 202 are respectively two side surfaces of the power connector 20 . As shown in FIG. 5 , preferably, the power access surface 201 is a side surface of the power connector 20 , and the switching output surface 202 is the bottom surface of the power connector 20 .

In this embodiment, the power supply system further includes a power distribution mainboard 40; a first pair of connection terminals 21 and a second pair of connection terminals 21 on the power distribution mainboard 40 and the transfer output surface 202 of the power connector 20. The pins of the connection terminal 22 are electrically connected.

As shown in Figures 6, 7, and 8, in this embodiment, the power supply system also includes a power supply bus 30; one end of the power supply bus 30 is connected to the power distribution mainboard 40. The other end of the busbar 30 is connected to the electrical equipment.

As shown in Figures 6, 7, and 8, in this embodiment, the power supply busbar 30 is provided with a copper bar body 31 and welding pins 32 provided at both ends of the copper bar body 31. The main body 31 is L-shaped, Z-shaped, E-shaped or S-shaped along the extending direction, and the welding pins 32 are cylindrical.

In Figure 7, positions A and B represent the welding pins 32 of the power supply busbar 30 (BUSBAR). Position C represents the support pad 33 of the BUSBAR, which is used to support and fix the BUSBAR position to prevent potential risks such as contact and collision between the BUSBAR and the PCB surface during transportation or machine vibration. The support gasket 33 is generally made of temperature-resistant insulating material.

As shown in Figure 8, there are three structural schematic diagrams of special-shaped BUSBAR. That is, the power supply busbar 30 (BUSBAR) includes: L-type BUSBAR, Z-type BUSBAR, and E-type BUSBAR. details as follows:

L-shaped and Z-shaped BUSBARs include welding pins 32 on both left and right ends, and the number of welding pins 32 on the left and right ends is equal. E-type BUSBAR, the left end welding pin 32 is the power supply input end, and the middle and right end welding pins 32 are the power supply output end. The number of welding pins 32 on the left end = the number of welding pins 32 on the middle + the number of welding pins 32 on the right end.

Among them: the number of welding pins 32 can be determined according to the BUSBAR flow rate I and the flow capacity I0 of a single welding pin 32. The number N of welding pins 32 has the following relationship: N=[I/I0]+1.

In order to ensure the soldering rate of BUSBAR welding, the welding pins 32 need to be designed into a cylindrical or elliptical cylindrical shape, so as to improve the uniformity and fullness of tin on the surface of the welding pins 32 during welding.

6, in this embodiment, from the power supply input end of the power distribution motherboard 40 to the fan power end, to the CPU and memory power end, to the GPU and hard disk array power equipment, L-type, Z-type, and E-type power supply connectors are used in sequence. Row 30(BUSBAR).

In order to clearly illustrate the implementation of the present invention, the specific working process of the technical solution of the present invention is explained as follows with reference to Figures 3, 6, and 8:

1) First, according to the server system configuration: including CPU, memory, hard disk array, system fan, GPU, the total power consumption P _T of the node power distribution motherboard 40 is determined according to the 80% derating standard from PSU -> power distribution motherboard 40 Maximum current value I _T of the power supply path.

2) Then, select the power supply busbar BUSBAR0 that meets the flow size of 0.5*I _T. Generally, BUSBAR can be customized according to the standard of 3.

3) Next, design a PSU daughter card that can support the flow of 0.5*I _T , and use a pair of prepared power supply busbars BUSBAR0 to interconnect the PSU motherboard and PSU daughter card.

4) According to the diagram on the right side of Figure 3, make an integrated connector that matches the PSU motherboard and the PSU daughter card gold finger, and install it on the 40 end of the power distribution mainboard.

5) Distribute the rated operating current I _H of the PCIE device (GPU) I _G and the hard disk array at the power consumption end of the motherboard 40 according to the power supply. An E-type BUSBAR: BUSBAR1 is produced according to the actual layout of the power distribution mainboard 40 . Make the flow of its left input part satisfy 1.25*(I _G +I _H ). The through-flow in the middle section of BUSBAR1 satisfies 1.25*I _G. The flow through the right section of BUSBAR1 satisfies 1.25*I _H. As shown in Figure 5, the BUSBAR1 input pin is welded next to the 40PSU connector on the power distribution motherboard, the middle pin is welded next to the GPU power end, and the right end pin is welded next to the hard disk array power end.

6) According to the total rated working current I _C + I _D of the CPU and memory at the power-consuming end of the power distribution mainboard 40 , make a Z-type BUSBAR: BUSBAR2 based on the actual layout of the power distribution mainboard 40 . Make the flow satisfy 1.25*(I _C +I _D ). As shown in Figure 6, the left pin of BUSBAR2 is soldered next to the 40PSU connector on the power distribution motherboard, passing through the gap between the DIMM slot and the CPU. The other end pin is soldered on the right side of the power distribution motherboard 40, close to the CPU and memory VR input. nearby.

7) According to the total rated operating current I _F of the system fan power terminal, and the actual layout of the power distribution mainboard 40, make an L-shaped BUSBAR: BUSBAR3. Make the flow satisfy 1.25*I _F. As shown in Figure 6, the left pin of BUSBAR3 is welded next to the PSU connector of the power distribution motherboard 40, passing through the gap between the edge of the power distribution motherboard 40 and the DIMM slot, and the other end pin is welded to the right side of the power distribution motherboard 40 close to the fan. near the electrical terminal.

In this embodiment, L-type, Z-type, and E-type BUSBARs are selected and adapted according to the layout of the power distribution mainboard 40 and the power of the electrical equipment. From the power supply input end of the power distribution motherboard 40 to the fan power end, to the CPU and memory power end, to the GPU and hard disk array power end, L-type, Z-type, and E-type BUSBARs are used in sequence. BUSBAR is used to replace the PCB copper foil to conduct large currents, thereby reducing the power distribution motherboard 40 board layers, realizing a cable-free design on the power distribution motherboard 40 , and meeting the power supply needs of the high-power electrical components of the power distribution motherboard 40 .

Example 4

Please refer to Figure 6. In Embodiment 4, a server is provided, which includes the power supply system and electrical equipment described above; the electrical equipment includes a central processing unit, a memory, a graphics processor, a voltage regulator, and a central processing unit. at least one of a heater or a fan.

As shown in Figures 3 and 4, in this embodiment, the power supply unit includes:

Shell 1;

The power motherboard 2 is located at the bottom of the housing 1; a first gold finger 4 is provided on one side of the power motherboard 2, and the first gold finger 4 protrudes from the side of the housing 1. outside the wall;

The power sub-card 3 is located in the housing 1 and on the power motherboard 2; the power sub-card 3 is electrically connected to the power motherboard 2; one side of the power sub-card 3 is provided with There is a second gold finger 5, the second gold finger 5 protrudes outside the side wall of the housing 1, and the second gold finger 5 is located above the first gold finger 4;

Wherein, the first gold finger 4 and the second gold finger 5 can be electrically connected to a power connector 20 at the same time.

As shown in FIG. 4 , in this embodiment, a positive busbar 41 and a negative busbar 42 are provided between the power subcard 3 and the power motherboard 2 to achieve electrical connection.

As shown in FIG. 3 and FIG. 5 , the present application also provides a power supply system, which includes the aforementioned laminated conductive power supply unit 10 and a power connector 20 .

As shown in Figure 5, in this embodiment, the power connector 20 is provided with a power access surface 201 and a switching output surface 202; the power connector 20 has a power connector extending from the power access surface 201. to the first pair of connection terminals 21 and the second pair of connection terminals 22 of the switching output surface 202; on the side of the power access surface 201, the pins of the first pair of connection terminals 21 are connected to the first pair of connection terminals 21. The golden fingers 4 are connected to each other, and the pins of the second pair of connecting terminals 22 are connected to the second golden fingers 5 .

In this embodiment, the power access surface 201 is one side of the power connector 20, and the switching output surface 202 is the bottom surface or the top surface of the power connector 20; or, the power connector The input surface 201 and the switching output surface 202 are respectively two side surfaces of the power connector 20 . As shown in FIG. 5 , preferably, the power access surface 201 is a side surface of the power connector 20 , and the switching output surface 202 is the bottom surface of the power connector 20 .

In this embodiment, the power supply system further includes a power distribution mainboard 40; a first pair of connection terminals 21 and a second pair of connection terminals 21 on the power distribution mainboard 40 and the transfer output surface 202 of the power connector 20. The pins of the connection terminal 22 are electrically connected.

As shown in Figures 6, 7, and 8, in this embodiment, the power supply system also includes a power supply bus 30; one end of the power supply bus 30 is connected to the power distribution mainboard 40. The other end of the busbar 30 is connected to the electrical equipment.

As shown in Figures 6, 7, and 8, in this embodiment, the power supply busbar 30 is provided with a copper bar body 31 and welding pins 32 provided at both ends of the copper bar body 31. The main body 31 is L-shaped, Z-shaped, E-shaped or S-shaped along the extending direction, and the welding pins 32 are cylindrical.

In Figure 7, positions A and B represent the welding pins 32 of the power supply busbar 30 (BUSBAR). Position C represents the support pad 33 of the BUSBAR, which is used to support and fix the BUSBAR position to prevent potential risks such as contact and collision between the BUSBAR and the PCB surface during transportation or machine vibration. The support gasket 33 is generally made of temperature-resistant insulating material.

As shown in Figure 8, there are three structural schematic diagrams of special-shaped BUSBAR. That is, the power supply busbar 30 (BUSBAR) includes: L-type BUSBAR, Z-type BUSBAR, and E-type BUSBAR. details as follows:

L-shaped and Z-shaped BUSBARs include welding pins 32 on both left and right ends, and the number of welding pins 32 on the left and right ends is equal. E-type BUSBAR, the left end welding pin 32 is the power supply input end, and the middle and right end welding pins 32 are the power supply output end. The number of welding pins 32 on the left end = the number of welding pins 32 on the middle + the number of welding pins 32 on the right end.

Among them: the number of welding pins 32 can be determined according to the BUSBAR flow rate I and the flow capacity I0 of a single welding pin 32. The number N of welding pins 32 has the following relationship: N=[I/I0]+1.

In order to ensure the soldering rate of BUSBAR welding, the welding pins 32 need to be designed into a cylindrical or elliptical cylindrical shape, so as to improve the uniformity and fullness of tin on the surface of the welding pins 32 during welding.

6, in this embodiment, from the power supply input end of the power distribution motherboard 40 to the fan power end, to the CPU and memory power end, to the GPU and hard disk array power equipment, L-type, Z-type, and E-type power supply connectors are used in sequence. Row 30(BUSBAR).

In order to clearly illustrate the implementation of the present invention, the specific working process of the technical solution of the present invention is explained as follows with reference to Figures 3, 6, and 8:

1) First, according to the server system configuration: including CPU, memory, hard disk array, system fan, GPU, the total power consumption P _T of the node power distribution motherboard 40 is determined according to the 80% derating standard from PSU -> power distribution motherboard 40 Maximum current value I _T of the power supply path.

2) Then, select the power supply busbar BUSBAR0 that meets the flow size of 0.5*I _T. Generally, BUSBAR can be customized according to the standard of 3.

3) Next, design a PSU daughter card that can support the flow of 0.5*I _T , and use a pair of prepared power supply busbars BUSBAR0 to interconnect the PSU motherboard and PSU daughter card.

4) According to the diagram on the right side of Figure 3, make an integrated connector that matches the PSU motherboard and the PSU daughter card gold finger, and install it on the 40 end of the power distribution mainboard.

5) Distribute the rated operating current I _H of the PCIE device (GPU) I _G and the hard disk array at the power consumption end of the motherboard 40 according to the power supply. An E-type BUSBAR: BUSBAR1 is produced according to the actual layout of the power distribution mainboard 40 . Make the flow of its left input part satisfy 1.25*(I _G +I _H ). The through-flow in the middle section of BUSBAR1 satisfies 1.25*I _G. The flow through the right section of BUSBAR1 satisfies 1.25*I _H. As shown in Figure 5, the BUSBAR1 input pin is welded next to the 40PSU connector on the power distribution motherboard, the middle pin is welded next to the GPU power end, and the right end pin is welded next to the hard disk array power end.

6) According to the total rated working current I _C + I _D of the CPU and memory at the power-consuming end of the power distribution mainboard 40 , make a Z-type BUSBAR: BUSBAR2 based on the actual layout of the power distribution mainboard 40 . Make the flow satisfy 1.25*(I _C +I _D ). As shown in Figure 6, the left pin of BUSBAR2 is soldered next to the 40PSU connector on the power distribution motherboard, passing through the gap between the DIMM slot and the CPU. The other end pin is soldered on the right side of the power distribution motherboard 40, close to the CPU and memory VR input. nearby.

7) According to the total rated operating current I _F of the system fan power terminal, and the actual layout of the power distribution mainboard 40, make an L-shaped BUSBAR: BUSBAR3. Make the flow satisfy 1.25*I _F. As shown in Figure 6, the left pin of BUSBAR3 is soldered next to the PSU connector of the power distribution motherboard 40, passing through the gap between the edge of the power distribution motherboard 40 and the DIMM slot, and the other end pin is soldered to the right side of the power distribution motherboard 40 close to the fan. near the electrical terminal.

In this embodiment, L-type, Z-type, and E-type BUSBARs are selected and adapted according to the layout of the power distribution mainboard 40 and the power of the electrical equipment. From the power supply input end of the power distribution motherboard 40 to the fan power end, to the CPU and memory power end, to the GPU and hard disk array power end, L-type, Z-type, and E-type BUSBARs are used in sequence. BUSBAR is used to replace the PCB copper foil to conduct large currents, thereby reducing the power distribution motherboard 40 board layers, realizing a cable-free design on the power distribution motherboard 40 , and meeting the power supply needs of the high-power electrical components of the power distribution motherboard 40 .

In one embodiment, the server is specifically a computer device, and the computer device may be a terminal, and its internal structure diagram may be as shown in Figure 9. The computer equipment includes a processor, memory, network interface, display screen and input device connected by a system bus. Wherein, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes non-volatile storage media and internal memory. The non-volatile storage medium stores operating systems and computer programs. This internal memory provides an environment for the execution of operating systems and computer programs in non-volatile storage media. The network interface of the computer device is used to communicate with external terminals through a network connection. The display screen of the computer device may be a liquid crystal display or an electronic ink display. The input device of the computer device may be a touch layer covered on the display screen, or may be a button, trackball or touch pad provided on the computer device shell. , it can also be an external keyboard, trackpad or mouse, etc.

Those skilled in the art can understand that the structure shown in Figure 9 is only a block diagram of a partial structure related to the solution of the present application, and does not constitute a limitation on the computer equipment to which the solution of the present application is applied. Specific computer equipment can May include more or fewer parts than shown, or combine certain parts, or have a different arrangement of parts.

The above-mentioned laminated conductive power supply unit, power supply system and server, by setting the golden finger of the power supply unit to a laminated current conduction structure, realize high-power power supply from the power supply unit to the power distribution motherboard 40, and meet the needs of the power distribution motherboard 40 pairs of large Power supply requirements for power consuming components.

The technical features of the above embodiments can be combined in any way. To simplify the description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, all possible combinations should be used. It is considered to be within the scope of this manual.

The above-described embodiments only express several implementation modes of the present application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that, for those of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all fall within the protection scope of the present application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims (10)

1. A laminated conductive power supply unit, characterized in that it includes: case; A power motherboard is provided at the bottom of the housing; a first gold finger is provided on one side of the power motherboard, and the first gold finger protrudes outside the side wall of the housing; A power subcard is provided in the housing and on the power motherboard; the power subcard is electrically connected to the power motherboard; a second gold finger is provided on one side of the power subcard, so The second gold finger protrudes outside the side wall of the housing, and the second gold finger is located above the first gold finger; Wherein, the first gold finger and the second gold finger can be electrically connected to a power connector at the same time. 2. The laminated conductive power supply unit according to claim 1, wherein a positive busbar and a negative busbar are provided between the power daughter card and the power motherboard to achieve electrical connection. 3. A power supply system, characterized by comprising the laminated conductive power supply unit according to claim 1 or 2 and a power connector. 4. The power supply system according to claim 3, wherein the power connector is provided with a power access surface and a switching output surface; the power connector is provided with a power supply extending from the power access surface. to the first pair of connection terminals and the second pair of connection terminals on the transfer output surface; on the side of the power access surface, the pins of the first pair of connection terminals are docked with the first gold finger, so The pins of the second pair of connecting terminals are connected to the second golden fingers. 5. The power supply system according to claim 4, wherein the power access surface is a side surface of the power connector, and the switching output surface is a bottom surface or a top surface of the power connector. ; Alternatively, the power access surface and the switching output surface are two sides of the power connector respectively. 6. The power supply system according to claim 4, characterized in that the power supply system further includes a power distribution mainboard; the power distribution mainboard and the first pair of the switching output surface of the power connector The connecting terminal is electrically connected to the pins of the second pair of connecting terminals. 7. The power supply system according to claim 3, wherein the power supply system further includes a power supply busbar; one end of the power supply busbar is connected to the power distribution mainboard, and the other end of the power supply busbar is connected to the power distribution mainboard. One end is connected to the electrical equipment. 8. The power supply system according to claim 7, wherein the power supply busbar is provided with a copper bar body and welding pins provided at both ends of the copper bar body, and the copper bar body is in an extending direction. L-type, Z-type, E-type or S-type, the welding pin is cylindrical. 9. The power supply system according to claim 7, wherein the power supply system further includes an electronic fuse; the electronic fuse is disposed between the power supply busbar and the electrical equipment. 10. A server, characterized in that it includes the power supply system and electrical equipment according to any one of claims 3 to 9; the electrical equipment includes a central processing unit, a memory, a graphics processor, and a voltage regulator. Or at least one of the fans.