CN116780749B - Electronic equipment - Google Patents

Abstract

The invention discloses an electronic device. The device includes: a power module, a SIM and a processor; the power module is electrically connected to the SIM through a main power supply circuit, and the power module is also electrically connected to the SIM through a backup power supply circuit. The backup power supply circuit is provided with switch; the processor is electrically connected to the switch. When the processor detects that the main power supply circuit is damaged, it controls the switch to close so that the power module supplies power to the SIM through the backup power supply circuit. This power supply control device sets a main power supply circuit and a backup power supply circuit. When the main power supply circuit is damaged, the power module supplies power to the SIM through the backup power supply circuit, which improves the ability of electronic equipment to handle faults.

Description

an electronic device

Technical field

The embodiments of the present application relate to the field of computer technology, and in particular, to an electronic device.

Background technique

Nowadays, during the use of electronic equipment, the power supply circuits of various modules of the electronic equipment may malfunction. Take the Subscriber Identity Module (SIM) of electronic equipment as an example. During the normal power supply process of the collector power supply voltage (Voltage Collector Collector (VCC)) of the power supply circuit of the SIM card, if it encounters an external surge or a DC overcurrent, If the SIM card power supply circuit VCC is under voltage, there is a certain probability that the VCC of the SIM card power supply circuit will be damaged, causing the power supply to be unable to supply power to the SIM card and the SIM card to be unrecognizable, affecting the normal use of electronic equipment.

Contents of the invention

The embodiment of the present application provides an electronic device. By setting a main power supply pin and a backup power supply pin, when the power module cannot power the SIM through the main power supply pin, the power module can power the SIM through the backup power supply pin, which improves the efficiency of the SIM. The ability of electronic equipment to handle failures.

The electronic device provided by the embodiment of the present application includes: a power module and a user identification module SIM;

The main power supply pin of the power module is electrically connected to the first pin of the SIM, the backup power supply pin of the power module is electrically connected to the first pin, and the backup power supply pin is electrically connected to the first pin. Control devices are provided between the feet;

When the path between the main power supply pin and the first pin is damaged, the control device changes from the off state to the on state, so that the power module supplies power to the power supply based on the backup power supply pin. The SIM is powered.

In one embodiment, the electronic device further includes: a processor;

The processor is electrically connected to the control device;

The processor is configured to control the control device to change from an off state to an on state when detecting that the path between the main power supply pin and the first pin is damaged.

In one embodiment, the control device is a MOS tube, and the processor is connected to the gate of the MOS tube;

The processor is specifically configured to, when detecting damage to the path between the main power supply pin and the first pin, increase the gate voltage of the MOS tube to a threshold voltage, so that the MOS tube is turned on, thereby causing the power module to supply power to the SIM based on the backup power supply pin.

In one embodiment, the processor is further configured to identify the SIM after the electronic device is powered on, and when it is detected that the SIM cannot be identified, determine whether the main power supply pin is connected to the first pin. Damage to the pathways between the feet.

In one embodiment, the backup power supply pin is a data signal pin, and the control device is a first diode;

The data signal pin is connected to the anode of the first diode, and the cathode of the first diode is connected to the first pin.

In one embodiment, when the path between the main power supply pin and the first pin is damaged, the first diode is turned on, and the power module supplies power to the power supply through the data signal pin. SIM powered.

In one embodiment, the backup power supply pin is a clock signal pin, and the control device is a second diode;

The clock signal pin is connected to the anode of the second diode, and the cathode of the second diode is connected to the first pin.

In one embodiment, when the path between the main power supply pin and the first pin is damaged, the second diode is turned on, and the power module supplies power to the clock signal pin through the clock signal pin. SIM powered.

In one embodiment, the backup power supply pin is a reset signal pin, and the control device is a third diode;

The reset signal pin is connected to the anode of the third diode, and the cathode of the third diode is connected to the first pin.

In one embodiment, when the path between the main power supply pin and the first pin is damaged, the third diode is turned on, and the power module sends a signal to the reset signal pin through the reset signal pin. SIM powered.

In the embodiment of this application, the power supply control device includes: a power module, a SIM and a processor; the power module is electrically connected to the SIM through a main power supply circuit, and the power module is also electrically connected to the SIM through a backup power supply circuit, and a switch is provided in the backup power supply circuit; The processor is electrically connected to the switch. When the processor detects that the main power supply circuit is damaged, it controls the switch to close so that the power module supplies power to the SIM through the backup power supply circuit. This power supply control device sets a main power supply circuit and a backup power supply circuit. When the main power supply circuit is damaged, the power module supplies power to the SIM through the backup power supply circuit, thereby improving the electronic equipment's ability to handle faults.

Description of drawings

Figure 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

Figure 2 is a schematic structural diagram of another electronic device provided by an embodiment of the present application;

Figure 3 is a flow chart of a power supply control method provided by an embodiment of the present application;

Figure 4 is a schematic structural diagram of another electronic device provided by an embodiment of the present application;

FIG. 5 is a schematic structural diagram of another electronic device provided by an embodiment of the present application.

Detailed ways

The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and cannot be construed as limiting the present invention.

In order to better understand the technical solutions of this specification, the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

It should be clear that the described embodiments are only some of the embodiments of this specification, but not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of this specification.

The terminology used in the embodiments of the present application is for the purpose of describing specific embodiments only and is not intended to limit the specification. As used in the embodiments and the appended claims, the singular forms "a," "the" and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise.

Electronic devices (such as smartphones, smart watches, tablets, etc.) are equipped with a power module inside, and the power module can supply power to the SIM inside the electronic device. After the electronic device is turned on, the power module supplies power to the SIM. The processor can identify the SIM after the SIM is powered on and confirm that the SIM can operate normally. During the use of electronic equipment, if an external surge or DC overvoltage is encountered, the path through which the power module supplies power to the SIM may be damaged, resulting in functional failure of the SIM. In response to the above problems, the power supply control device of the embodiment of the present application is equipped with a main power supply circuit and a backup power supply circuit. When the main power supply circuit is damaged, the power module supplies power to the SIM through the backup power supply circuit, which improves the ability of electronic equipment to handle faults.

Figure 1 is a schematic structural diagram of a power supply control device provided by an embodiment of the present application. As shown in FIG. 1 , the power supply control device may include a power module 110 , a SIM 120 and a control device 130 . The power module 110 is electrically connected to the SIM120 and is used to provide power to the SIM120. Specifically, on the one hand, the power module 110 is connected to the first pin of the SIM120 through the main power supply pin, and on the other hand, the power module 110 is connected to the first pin of the SIM120 through the backup power supply pin, wherein the backup power supply pin is connected to the first pin of the SIM120. A control device 130 is provided in the first pin. The pin pointed by arrow 101 is the main power supply pin of the power module 110, the pin pointed by arrow 102 is the backup power supply pin of the power module 110, and the pin pointed by arrow 103 is the first pin of SIM120. foot.

After the electronic device is turned on, the control device 130 is usually in a shutdown state, and the power module 110 supplies power to the SIM 120 through the main power supply pin. If the path between the main power supply pin and the first pin is damaged, the control device 130 will be turned on, and the power module 110 will power the SIM 120 through the backup power supply pin to ensure the normal operation of the SIM.

In one embodiment, the structure of the electronic device may be as shown in Figure 2 , including: a power chip 210, a processor 220, a SIM 230 and a MOS transistor 240. The control device between the backup power supply pin and the first pin is implemented with a MOS tube 240. The processor is connected to the gate of the MOS tube 240, and controls the MOS tube 240 to turn off or on by changing the gate voltage of the MOS tube 240. .

After the SIM230 is powered on and running, the processor 220 can identify the SIM230 and confirm that the SIM230 can operate normally. If the processor 220 detects that the SIM 230 cannot be recognized after the electronic device is turned on, or suddenly detects that the SIM 230 cannot be recognized during the normal operation of the SIM 230, it can be preliminarily determined that the path between the main power supply pin and the first pin is damaged. The power chip 210 cannot supply power to the SIM230 through the main power supply pin. In response to this emergency situation, the processor 220 will control the MOS transistor 240 to turn on, and the power chip 210 will supply power to the SIM 230 through the backup power supply pin.

The power chip 210 is provided with multiple pins. Among them, the pin pointed by arrow 201 is the main power supply pin. The main power supply pin is connected to the first pin of SIM230. The pin pointed by arrow 203 is the first pin. The pin pointed by arrow 202 is a backup power supply pin, and the backup power supply pin is used to connect to the MOS tube 240, and the other end of the MOS tube 240 is connected to the SIM 230. The processor 220 is provided with a plurality of pins, one of which is connected to the gate of the MOS transistor 240, and controls the MOS transistor 240 to be turned on or off by changing the gate voltage. After the electronic device is powered on, the processor 220 outputs a first voltage to the gate of the MOS tube 240. The first voltage is less than the threshold voltage of the MOS tube 240. The MOS tube 240 is turned off, and the power chip 210 is supplied through the main power supply pin. Powered by SIM230. If the processor 220 detects that the SIM 230 cannot be recognized, it will usually perform a default card rescue operation, that is, control the power chip 210 to stop powering the SIM 230, and then control the power chip 210 to power the SIM 230 through the main power supply circuit again to recognize the SIM 230 again. After repeating the card rescue operation many times, if the SIM230 still cannot be recognized, it can be initially determined that the path between the main power supply pin and the first pin is damaged. In order to ensure the normal operation of SIM230, the processor 220 outputs a second voltage to the gate of the MOS transistor 240. If the second voltage is greater than or equal to the threshold voltage, the MOS transistor is turned on, and the power chip 210 can supply power to the SIM230 through the backup power supply pin.

In the embodiment of the present application, the control device is implemented through the MOS transistor 240. The processor 220 only needs to output different voltages to the gate of the MOS transistor 240 to control the MOS transistor 240 to turn off or on, without making other modifications to the hardware circuit. Saves hardware costs.

Figure 3 is a flow chart of a power supply method provided by an embodiment of the present application. The method can be applied to a processor of an electronic device. As shown in Figure 3, the method can include:

Step 301, SIM identification fails.

After the electronic device is powered on, the processor will execute the relevant post-startup processes, including identifying the SIM. In some cases, the processor cannot successfully identify the SIM.

Step 302: Perform card rescue operation.

In the case where the SIM cannot recognize the card, the processor first performs a card rescue operation. Normally, the processor first controls the power module to cut off power, and then controls the power module to re-power the card.

Step 303: Determine whether the SIM can be recognized.

After each card rescue operation is performed, the processor will identify the SIM again and determine whether the identification is successful. If the SIM can be identified, the entire process will be ended, otherwise step 304 will be entered.

Step 304: Determine whether the number of card rescue operations exceeds a preset threshold.

If the number of card rescue operations does not exceed the preset threshold, the card rescue operation continues, otherwise, step 305 is entered.

Step 305, control the MOS tube to turn on.

After rescuing the card several times and still unable to recognize the SIM, the processor will control the MOS tube to turn on so that the power module supplies power to the SIM through the backup power supply circuit. Specifically, the processor changes the gate voltage of the MOS tube to turn on the MOS tube.

Step 306: Identify the SIM.

The processor identifies the SIM again, and ends the entire process after successful identification.

In the embodiment of this application, when the processor cannot recognize the SIM, it first performs the card rescue operation. If the card cannot be recognized after multiple rescues, the backup power supply circuit is controlled to be turned on, so that the power module supplies power to the SIM through the backup power supply circuit, ensuring the reliability of the device. normal operation.

FIG. 4 is a schematic structural diagram of another electronic device provided by an embodiment of the present application. As shown in FIG. 4 , the device may include: a power chip 410 , a SIM 420 , a first diode 430 , a second diode 440 and a third diode 450 . In addition to being electrically connected to the first pin of the SIM420 through the main power supply pin, the power chip 410 is also electrically connected to the first pin of the SIM420 through the data DATA pin, the clock CLK pin and the reset RESET pin. Among them, the data pin is connected to the anode of the first diode 430, and the cathode of the first diode 430 is connected to the first pin; the clock pin is connected to the anode of the second diode 440, and the cathode of the second diode 440 is connected to the anode of the first diode 430. The cathode is connected to the first pin; the reset pin is connected to the anode of the third diode 450, and the cathode of the third diode 450 is connected to the first pin.

Normally, the voltage output by the power chip 410 through the main power supply pin is greater than or equal to the voltage output by the data pin, clock pin and reset pin. When the main power supply pin and the first pin are normally connected, the voltage of the anode of the first diode 430 is the voltage of the data pin, and the cathode of the first diode 430 is the voltage of the main power supply pin. When the first diode 430 is in the off state, the power chip 410 supplies power to the SIM 420 through the main power supply pin. Similarly, the anode voltage and cathode voltage of the second diode 440 are the voltage of the clock pin and the voltage of the main power supply pin respectively. The second diode 440 is in the off state, and the anode voltage of the third diode 450 is and the cathode voltage are the voltage of the reset pin and the voltage of the main power supply pin respectively, and the third diode 450 is in the off state.

When the main power supply circuit is accidentally damaged, the cathode voltage of the first diode 430 is 0, and the anode voltage is still the voltage of the data pin. Since the anode voltage is greater than the cathode voltage, the first diode 430 is turned on, and the current of the data pin It can flow through the first diode 430 and then reach the SIM420, and the power chip 410 can provide power to the SIM420 through the data pin. In the same way, the cathode voltage of the second diode is 0, the anode voltage is still the voltage of the clock pin, the anode voltage is greater than the cathode voltage, the second diode 440 is turned on, and the current of the clock pin can flow through the second diode. The diode 440 then reaches the SIM420, and the power chip 410 can supply power to the SIM420 through the clock pin; the cathode voltage of the third diode is 0, the anode voltage is still the voltage of the reset pin, and the anode voltage is greater than the cathode voltage. When the tube 450 is turned on, the current of the reset pin can flow through the third diode 450 and then reach the SIM420, and the power chip can supply power to the SIM420 through the reset pin.

In the embodiment of the present application, the data pins on the power chip 410 side have been connected to the data pins on the SIM420 side before, and the power chip 410 can perform data transmission with the SIM420 based on the data pins. On this basis, additional wires are drawn out from the data pins of the power chip 410 to connect to the diodes, and then connected to the first pin of the SIM 420. Two branches led by the data pin work in parallel, which will not affect data transmission and can also realize the function of the backup power supply pin. There is no need to set new pins, saving hardware costs. In the same way, the clock pin and the reset pin also lead to new branches on the original branches to realize the function of the backup power supply pin.

In the embodiment of this application, by drawing out wires and setting diodes in other circuits, the diodes can be turned on when the main power supply circuit is damaged, so that the power chip supplies power to the SIM through other circuits, ensuring the normal operation of the SIM.

FIG. 5 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. Electronic device 500 may include a processor 510, an internal memory 520, and the like.

It can be understood that the structure illustrated in the embodiment of the present application does not constitute a specific limitation on the electronic device 500 . In other embodiments of the present application, the electronic device 500 may include more or less components than shown in the figures, or some components may be combined, some components may be separated, or some components may be arranged differently. The components illustrated may be implemented in hardware, software, or a combination of software and hardware.

The processor 510 may include one or more processing units. For example, the processor 510 may include an application processor (application processor, AP), a modem processor, etc. Among them, different processing units can be independent devices or integrated in one or more processors.

The controller can generate operation control signals based on the instruction operation code and timing signals to complete the control of fetching and executing instructions.

The processor 510 may also be provided with a memory for storing instructions and data. In some embodiments, the memory in processor 510 is cache memory. This memory may hold instructions or data that have been recently used or recycled by processor 510 . If processor 510 needs to use the instructions or data again, it can be called directly from the memory. Repeated access is avoided and the waiting time of the processor 510 is reduced, thus improving the efficiency of the system.

In some embodiments, processor 510 may include one or more interfaces. The interface may include an integrated circuit (inter-integrated circuit, I2C) interface. The I2C interface is a bidirectional synchronous serial bus, including a serial data line (SDA) and a serial clock line (derail clock). line, SCL).

It can be understood that the interface connection relationships between the modules illustrated in the embodiments of the present application are only schematic illustrations and do not constitute a structural limitation of the electronic device 500 . In other embodiments of the present application, the electronic device 500 may also adopt different interface connection methods in the above embodiments, or a combination of multiple interface connection methods.

Internal memory 520 may be used to store computer executable program code, which includes instructions. The internal memory 520 may include a program storage area and a data storage area. Among them, the stored program area can store the operating system, at least one application program required for the function, etc. The storage data area may store data created during use of the electronic device 500 and the like. In addition, the internal memory 520 may include high-speed random access memory, and may also include non-volatile memory. The processor 510 executes various functional applications and data processing of the electronic device 500 by executing instructions stored in the internal memory 520 and/or instructions stored in a memory provided in the processor.

The processor 510 can execute various functional applications and data processing by running programs stored in the internal memory 520, for example, implementing the power supply control method provided in the embodiment of the present application.

Embodiments of the present application also provide a non-transitory computer-readable storage medium. The non-transitory computer-readable storage medium stores computer instructions. The computer instructions cause the computer to execute the power supply control method provided by the embodiments of the present application.

The above-mentioned non-transitory computer-readable storage medium may adopt any combination of one or more computer-readable media. The computer-readable medium may be a computer-readable signal medium or a computer-readable storage medium. The computer-readable storage medium may be, for example, but is not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus or device, or any combination thereof. More specific examples (non-exhaustive list) of computer readable storage media include: an electrical connection having one or more conductors, a portable computer disk, a hard drive, random access memory (RAM), read only memory (Read Only Memory) (hereinafter referred to as: ROM), Erasable Programmable Read Only Memory (hereinafter referred to as: EPROM) or flash memory, optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device , or any suitable combination of the above. As used herein, a computer-readable storage medium may be any tangible medium that contains or stores a program for use by or in connection with an instruction execution system, apparatus, or device.

A computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave carrying computer-readable program code therein. Such propagated data signals may take a variety of forms, including - but not limited to - electromagnetic signals, optical signals, or any suitable combination of the above. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium that can send, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device .

Program code embodied on a computer-readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

In the description of this specification, reference to the terms "one embodiment," "some embodiments," "an example," "specific examples," or "some examples" or the like means that specific features are described in connection with the embodiment or example. , structures, materials or features are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine different embodiments or examples and features of different embodiments or examples described in this specification unless they are inconsistent with each other.

In addition, the terms “first” and “second” are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Therefore, features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of this application, "plurality" means at least two, such as two, three, etc., unless otherwise expressly and specifically limited.

Any process or method descriptions in flowcharts or otherwise described herein may be understood to represent modules, segments, or portions of code that include one or more executable instructions for implementing customized logical functions or steps of the process. , and the scope of the preferred embodiments of the present application includes additional implementations in which functions may be performed out of the order shown or discussed, including in a substantially simultaneous manner or in the reverse order, depending on the functionality involved, which shall It should be understood by those skilled in the technical field to which the embodiments of this application belong.

Claims (6)

1. An electronic device, the electronic device comprising: a power module and a Subscriber Identity Module (SIM);

the main power supply pin of the power supply module is electrically connected with the first pin of the SIM, the standby power supply pin of the power supply module is electrically connected with the first pin, and a control device is arranged between the standby power supply pin and the first pin;

when the path between the main power supply pin and the first pin is damaged, the control device is changed from an off state to an on state, so that the power supply module supplies power to the SIM based on the standby power supply pin;

the standby power supply pin is a clock signal pin, and the control device is a second diode; the clock signal pin is connected with the anode of the second diode, and the cathode of the second diode is connected with the first pin; when the passage between the main power supply pin and the first pin is damaged, the second diode is conducted, and the power supply module supplies power to the SIM through the clock signal pin.

2. The device of claim 1, wherein the electronic device further comprises: a processor;

the processor is electrically connected with the control device;

the processor is used for controlling the control device to be changed from an off state to an on state when detecting that a passage between the main power supply pin and the first pin is damaged.

3. The apparatus of claim 2, wherein the control device is a MOS transistor, and the processor is connected to a gate of the MOS transistor;

the processor is specifically configured to increase the gate voltage of the MOS tube to a threshold voltage when detecting that the path between the main power supply pin and the first pin is damaged, so that the MOS tube is turned on, and the power module supplies power to the SIM based on the standby power supply pin.

4. The apparatus of claim 2, wherein the device comprises a plurality of sensors,

the processor is further configured to identify the SIM after the electronic device is powered on, and determine that a path between the primary power pin and the first pin is damaged when the SIM is detected to be unrecognizable.

5. The apparatus of claim 1, wherein the standby power pin is a reset signal pin and the control device is a third diode;

the reset signal pin is connected with the anode of the third diode, and the cathode of the third diode is connected with the first pin.

6. The apparatus of claim 5, wherein the device comprises a plurality of sensors,

when the passage between the main power supply pin and the first pin is damaged, the third diode is conducted, and the power module supplies power to the SIM through the reset signal pin.