CN116718305B - Oil charging pressure sensor based on PCB packaging - Google Patents
Oil charging pressure sensor based on PCB packaging Download PDFInfo
- Publication number
- CN116718305B CN116718305B CN202310998122.3A CN202310998122A CN116718305B CN 116718305 B CN116718305 B CN 116718305B CN 202310998122 A CN202310998122 A CN 202310998122A CN 116718305 B CN116718305 B CN 116718305B
- Authority
- CN
- China
- Prior art keywords
- pcb
- pressure
- interface
- shell
- isolation diaphragm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 7
- 238000002955 isolation Methods 0.000 claims abstract description 33
- 238000003466 welding Methods 0.000 claims abstract description 23
- 239000011258 core-shell material Substances 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 20
- 239000003921 oil Substances 0.000 claims description 40
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 239000010703 silicon Substances 0.000 claims description 11
- 229920002545 silicone oil Polymers 0.000 claims description 11
- 239000011324 bead Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 230000003750 conditioning effect Effects 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 claims 1
- WEJZHZJJXPXXMU-UHFFFAOYSA-N 2,4-dichloro-1-phenylbenzene Chemical compound ClC1=CC(Cl)=CC=C1C1=CC=CC=C1 WEJZHZJJXPXXMU-UHFFFAOYSA-N 0.000 description 9
- 230000000149 penetrating effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/0046—Fluidic connecting means using isolation membranes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
- G01L19/143—Two part housings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/10—Internal combustion engine [ICE] based vehicles
- Y02T10/40—Engine management systems
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention relates to the field of pressure sensors, in particular to a PCB (printed Circuit Board) packaging-based oil filling pressure sensor, which comprises a hexagonal shell, wherein a pressure interface is arranged at the upper end of the middle of the hexagonal shell, a PACK interface is riveted at the lower end of the hexagonal shell, an isolation diaphragm is welded at the lower end of the pressure interface, a sensor core shell is welded at the lower end of the isolation diaphragm, a main board is fixedly connected between the interface and the lower end of the hexagonal shell, a PCB (printed Circuit Board) is fixedly arranged in the sensor core shell, a MENS pressure sensing chip is fixedly connected to the upper end of the PCB towards the isolation diaphragm, a plurality of welding points are fixedly arranged on the PCB around the MENS pressure sensing chip in the circumferential direction, pins communicated with the welding points are fixedly connected with the main board, a plurality of pins are fixedly inserted in the middle of the interface, and are connected with the main board through metal wires, and an annular groove is formed in the lower end of the sensor core shell, so that the PCB can be prevented from being shorted.
Description
Technical Field
The invention relates to the field of pressure sensors, in particular to a PCB packaging-based oil filling pressure sensor.
Background
The pressure sensor is characterized in that the pressure sensing chip is packaged in the stainless steel cavity, external pressure is applied to the pressure sensing chip through the diaphragm and the silicone oil sealed inside, the external pressure is converted into an analog signal which can be sensed, and meanwhile, external substances do not directly act on the pressure sensing chip, so that the pressure sensing chip can be applied to various occasions, including severe corrosive medium environments.
The pressure sensor is connected with the pressure sensing chip through the metal wire and the PCB, the metal wire is usually very thin, the traditional mode is a metal wire direct connection mode, the special position for placing the metal wire is not arranged, the phenomenon of winding of the metal wire is easy to occur, and the phenomenon of short circuit is further caused.
It is therefore necessary to provide a PCB-package-based oil-filled pressure sensor to solve the above-mentioned technical problems.
Disclosure of Invention
The invention provides a PCB packaging-based oil filling pressure sensor capable of preventing occurrence of short circuit phenomenon by conducting hole passing on a metal wire.
The invention provides a PCB packaging-based oil filling pressure sensor, which comprises a hexagonal shell, wherein the upper middle end of the hexagonal shell is provided with a pressure interface, the lower end of the hexagonal shell is riveted with a PACK interface, the middle of the pressure interface is provided with a pressurizing hole which enables the pressure interface to be penetrated up and down, the lower end of the pressure interface is positioned in the hexagonal shell, an isolation diaphragm is welded with the hexagonal shell, the lower end of the isolation diaphragm is welded with a sensor core shell, the sensor core shell is in an inner penetrating shape, a main board which isolates the inside of the hexagonal shell from the inside of the interface is fixedly connected between the interface and the lower end of the hexagonal shell, the lower end of the edge of the inner wall of the sensor core shell is in a step shape, the upper end of the inner step of the sensor core shell is fixedly provided with a PCB board, the upper end surface of the PCB board is fixedly connected with a MENS pressure sensing chip in an isolating way, a plurality of isolation diaphragms are fixedly arranged on the PCB board around the MENS pressure sensing chip in the circumferential direction, a plurality of welding points are fixedly arranged between the MENS and the PCB, the metal pins are fixedly connected with the PCB pins through the metal pins, the pins are fixedly connected with the metal pins and the pins are fixedly connected with the PCB through the metal pins, and the pins are fixedly connected with the pins on the PCB.
Preferably, the side wall of the sensor core shell is provided with an oil filling hole which penetrates up and down, the lower end of the oil filling hole is in an opening shape, and the opening is welded by an oil sealing bead in a sealing way.
Preferably, the hexagonal shell and the pressure interface, the pressure interface and the isolation diaphragm, and the isolation diaphragm and the sensor core shell are all fixed in a welding mode.
Preferably, the cross section of the groove is semicircular.
The invention has the beneficial effects that:
(1) The invention prevents the phenomenon of short circuit by combing the metal wires into the grooves.
(2) According to the invention, silicone oil is injected between the PCB and the corrugated sheet through the oil filling hole, and the sealing is carried out through the oil sealing bead, so that the purpose of filling the silicone oil is achieved.
(3) The groove is provided with the semicircle, so that the metal wires are contacted with the semicircle, and the breakage of the metal wires is prevented.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an enlarged schematic view of the structure A in FIG. 1 according to the present invention;
FIG. 3 is a schematic view of the opening position of the groove in the present invention;
FIG. 4 is a cut-away top view of a PCB in the present invention;
Fig. 5 is a schematic diagram of the overall structure of the present invention.
In the figure: 1. a hexagonal shell; 2. a pressure interface; 21. a pressurizing hole; 3. an interface; 31. a contact pin; 4. an isolation diaphragm; 5. a sensor core housing; 51. a groove; 52. an oil filling hole; 53. sealing the oil bead; 6. a main board; 7. a PCB board; 71. a MENS pressure sensing chip; 72. pins; 73. welding points; 8. and filling the ring.
Detailed Description
The invention is further described in connection with the following detailed description in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
As shown in fig. 1,2, 3,4 and 5, the invention provides a PCB packaging-based oil filling pressure sensor, which comprises a hexagonal shell 1, wherein a pressure interface 2 is arranged at the upper middle end of the hexagonal shell 1, a PACK interface 3 is riveted at the lower end of the hexagonal shell 1, and a pressurizing hole 21 for vertically penetrating the pressure interface 2 is formed in the middle of the pressure interface 2.
The lower end of the pressure interface 2 is positioned in the hexagonal shell 1 and welded with the hexagonal shell 1, the lower end of the isolation diaphragm 4 is welded with a sensor core shell 5, the sensor core shell 5 is in an inner through shape, a main board 6 which isolates the interior of the hexagonal shell 1 from the interior of the interface 3 and conditions a circuit is fixedly connected between the interface 3 and the lower end of the hexagonal shell 1, the lower end of the edge of the inner wall of the sensor core shell 5 is in a step shape, the upper end of the inner step of the sensor core shell 5 is fixedly provided with a PCB 7, the upper end surface of the PCB 7 is fixedly connected with a MENS pressure sensing chip 71 facing the isolation diaphragm 4, a plurality of welding points 73 are fixedly arranged on the PCB 7 around the MENS pressure sensing chip 71 in the circumferential direction, the welding point 73 is connected with the MENS pressure sensing chip 71 through a metal wire, a filling ring 8 is fixedly clamped between the PCB 7 and the isolation diaphragm 4, pins 72 communicated with the welding point 73 are fixedly connected to the PCB 7, the pins 72 are connected with the main board 6, a plurality of pins 31 are fixedly inserted in the middle of the interface 3, the pins 31 are connected with the main board 6 through the metal wire, an annular groove 51 is formed in the lower end of the PCB 7 of the sensor core shell 5, the filling ring 8 is made of an adsorbing material hard material, the filling ring 8 arranged in an annular mode can play a role in filling, so that the amount of internal silicon oil is small, the silicon oil is prevented from expanding in volume along with the change of temperature, the sensor precision is increased, meanwhile, the filling ring 8 can play a role in supporting the isolation diaphragm 4, the external pressure is prevented from being excessively large instantaneously, the deformation of the isolation diaphragm 4 is large, so that the tens pressure sensing chip 71 is damaged.
It should be noted that, during the operation of the oil-filled pressure sensor, external gas enters the pressure interface 2 through the pressurizing hole 21 and acts on the isolation diaphragm 4, the silicon oil is filled between the PCB boards 7 of the isolation diaphragm 4, the isolation diaphragm 4 transmits pressure to the MENS pressure sensing chip 71 through the silicon oil, the MENS pressure sensing chip 71 converts the pressure into an electronic signal and transmits the electronic signal to the welding point 73, the welding point 73 transmits the signal to the motherboard 6 through the pin 72, the motherboard 6 processes the signal and transmits the signal to the pin 31, and transmits the signal to the external through the pin 31, and the PCB via hole is realized through the groove 51, thereby preventing internal circuit breaking.
As shown in fig. 1 and 2, the side wall of the sensor core housing 5 is provided with an oil filling hole 52 penetrating up and down, the lower end of the oil filling hole 52 is in an opening shape, and the opening is sealed and welded by an oil sealing bead 53 and is welded by resistance welding.
In the process of filling the silicone oil, the silicone oil is injected between the PCB 7 and the corrugated sheet through the oil filling hole 52 and sealed by the oil sealing bead 53.
As shown in fig. 1 and 2, the hexagonal shell 1 and the pressure interface 2, the pressure interface 2 and the isolation diaphragm 4, and the isolation diaphragm 4 and the sensor core shell 5 are all fixed by welding.
The sealing performance of the device can be effectively improved through the mode, so that the air leakage phenomenon and the silicone oil leakage phenomenon are prevented.
As shown in fig. 3, the cross section of the groove 51 is semicircular, and the groove 51 is annular.
It should be noted that, the groove 51 is provided with a semicircle shape, so that the metal wire is located in the groove 51, thereby realizing the wiring of the metal wire, preventing the metal wire from breaking, preventing the breakdown phenomenon, and simultaneously, saving the space.
The working principle of the invention is that in the working process of the oil filling pressure sensor, external gas enters the pressure interface 2 through the pressurizing hole 21 and acts on the isolation diaphragm 4, the silicon oil is filled between the PCB 7 and the isolation diaphragm 4, in the silicon oil filling process, the silicon oil is injected between the PCB 7 and the corrugated sheet through the oil filling hole 52 and sealed through the oil sealing bead 53, the isolation diaphragm 4 transmits pressure to the MENS pressure sensing chip 71 through the silicon oil, the MENS pressure sensing chip 71 transmits signals to the welding point 73, the welding point 73 transmits signals to the main board 6 through the pin 72, the main board 6 transmits the signals to the pin 31 after processing, and transmits the signals to the outside through the pin 31, thereby realizing PCB via holes, preventing short circuits, and the hexagonal shell 1 is fixed with the pressure interface 2, the isolation diaphragm 4 and the outer shell 5 of the sensor core body through welding, thereby reducing the phenomena of gas leakage and silicon oil leakage.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the foregoing examples, and that the foregoing description and description are merely illustrative of the principles of this invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (1)
1. The utility model provides a fill oil pressure sensor based on PCB encapsulation, includes hexagonal shell (1), the middle upper end of hexagonal shell (1) is provided with pressure interface (2), the lower extreme of hexagonal shell (1) is riveted with PACK interface (3), pressure interface (2) middle has seted up pressure hole (21) with pressure interface (2) link up from top to bottom; the method is characterized in that: the pressure interface (2) is characterized in that the lower end of the pressure interface (2) is positioned at the inner part of the hexagonal shell (1) and welded with the hexagonal shell (1) to form an isolation diaphragm (4), the lower end of the isolation diaphragm (4) is welded with a sensor core shell (5), the sensor core shell (5) is in an inner through shape, a mainboard (6) for isolating the inner part of the hexagonal shell (1) from the inner part of the PACK interface (3) and conditioning a circuit is fixedly connected between the PACK interface (3) and the lower end of the hexagonal shell (1), the lower end of the inner wall edge of the sensor core shell (5) is in a step shape, the upper end of the inner step of the sensor core shell (5) is fixedly provided with a PCB (7), the upper end surface of the PCB (7) is fixedly connected with a MENS pressure sensing chip (71) towards the isolation diaphragm (4), a plurality of welding points (73) are fixedly installed on the PCB (7) around the MENS pressure sensing chip (71) in the circumferential direction, the MENS (73) and the welding points (71) are fixedly connected with the PCB (72) through the welding points (72), the welding points are fixedly connected with the PCB (7) through the welding points (72), a plurality of contact pins (31) are fixedly inserted in the middle of the PACK interface (3), the contact pins (31) are connected with the main board (6) through metal wires, and an annular groove (51) is formed in the lower end of the PCB (7) of the sensor core shell (5);
The side wall of the sensor core shell (5) is provided with an oil filling hole (52) which is penetrated up and down, the lower end of the oil filling hole (52) is in an opening shape, and the opening is sealed and welded by an oil sealing bead (53);
The hexagonal shell (1) and the pressure interface (2), the pressure interface (2) and the isolation diaphragm (4) and the sensor core shell (5) are fixed in a welding mode;
The cross section of the groove (51) is semicircular;
The filling ring (8) is made of an adsorbing material hard material, the filling ring (8) arranged in an annular mode can play a role in filling, so that the amount of silicon oil in the filling ring is small, the volume expansion of silicon oil along with the change of temperature is prevented, the accuracy of a sensor is increased, meanwhile, the filling ring (8) can play a role in supporting the isolation diaphragm (4), and the situation that the deformation of the isolation diaphragm (4) is large and the MENS pressure sensing chip (71) is damaged can be prevented;
in the process of working of the oil filling pressure sensor, external gas enters the pressure interface (2) through the pressurizing hole (21) and acts on the isolation diaphragm (4), the isolation diaphragm (4) is filled with silicone oil between the PCB (7), silicone oil is injected between the PCB (7) and the corrugated sheet through the oil filling hole (52) in the process of filling the silicone oil, and the isolation diaphragm (4) is sealed through the oil sealing bead (53), the pressure is transmitted to the MENS pressure sensing chip (71) through the silicone oil, the MENS pressure sensing chip (71) transmits signals to the welding point (73), the welding point (73) transmits signals to the main board (6) through the pin (72), the main board (6) transmits signals to the inserting needle (31) after processing, and the signals are transmitted to the outside through the inserting needle (31), so that the PCB through holes are realized, the short circuit is prevented, the pressure interface (2) and the isolation diaphragm (4) and the sensor core body (5) are fixed by adopting the silicone oil, and thus the phenomenon of leakage is prevented.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310998122.3A CN116718305B (en) | 2023-08-09 | 2023-08-09 | Oil charging pressure sensor based on PCB packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310998122.3A CN116718305B (en) | 2023-08-09 | 2023-08-09 | Oil charging pressure sensor based on PCB packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116718305A CN116718305A (en) | 2023-09-08 |
| CN116718305B true CN116718305B (en) | 2024-05-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310998122.3A Active CN116718305B (en) | 2023-08-09 | 2023-08-09 | Oil charging pressure sensor based on PCB packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116718305B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117387830B (en) * | 2023-12-11 | 2024-02-02 | 无锡芯感智半导体有限公司 | Packaging structure and packaging method suitable for MEMS pressure sensor |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11248573A (en) * | 1998-03-06 | 1999-09-17 | Yazaki Corp | Semiconductor pressure sensor |
| JP2004012406A (en) * | 2002-06-11 | 2004-01-15 | Saginomiya Seisakusho Inc | Pressure sensor |
| JP2004309329A (en) * | 2003-04-08 | 2004-11-04 | Saginomiya Seisakusho Inc | Pressure sensor |
| CN101226092A (en) * | 2008-01-16 | 2008-07-23 | 西安维纳信息测控有限公司 | SOI complete silicon structure silicone-oil-filling high-temperature-resistance pressure sensor |
| JP2014081271A (en) * | 2012-10-16 | 2014-05-08 | Denso Corp | Pressure sensor |
| CN107144391A (en) * | 2017-07-10 | 2017-09-08 | 深圳瑞德感知科技有限公司 | A kind of integrated form MEMS oil-filled pressure transducers |
| CN112345150A (en) * | 2020-10-28 | 2021-02-09 | 河北美泰电子科技有限公司 | Pressure sensor and method of making the same |
| CN215893878U (en) * | 2021-06-22 | 2022-02-22 | 成都凯天电子股份有限公司 | A high temperature resistant oil filling pressure detection device |
| CN114838865A (en) * | 2022-06-14 | 2022-08-02 | 宝鸡市兴宇腾测控设备有限公司 | Dual-redundancy wide-temperature type pressure sensor |
| CN218885058U (en) * | 2022-12-21 | 2023-04-18 | 昆山灵科传感技术有限公司 | Liquid level sensor |
| CN219369015U (en) * | 2022-12-13 | 2023-07-18 | 无锡盛邦电子有限公司 | An oil-filled pressure sensor |
| CN116558700A (en) * | 2023-07-12 | 2023-08-08 | 合肥皖科智能技术有限公司 | All-welded oil filling pressure sensor based on sintering seat packaging |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102023066B (en) * | 2010-05-31 | 2012-07-18 | 昆山双桥传感器测控技术有限公司 | Universal pressure sensor of automobile |
| US10720534B2 (en) * | 2014-12-24 | 2020-07-21 | Fujikura Ltd. | Pressure sensor and pressure sensor module |
-
2023
- 2023-08-09 CN CN202310998122.3A patent/CN116718305B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11248573A (en) * | 1998-03-06 | 1999-09-17 | Yazaki Corp | Semiconductor pressure sensor |
| JP2004012406A (en) * | 2002-06-11 | 2004-01-15 | Saginomiya Seisakusho Inc | Pressure sensor |
| JP2004309329A (en) * | 2003-04-08 | 2004-11-04 | Saginomiya Seisakusho Inc | Pressure sensor |
| CN101226092A (en) * | 2008-01-16 | 2008-07-23 | 西安维纳信息测控有限公司 | SOI complete silicon structure silicone-oil-filling high-temperature-resistance pressure sensor |
| JP2014081271A (en) * | 2012-10-16 | 2014-05-08 | Denso Corp | Pressure sensor |
| CN107144391A (en) * | 2017-07-10 | 2017-09-08 | 深圳瑞德感知科技有限公司 | A kind of integrated form MEMS oil-filled pressure transducers |
| CN112345150A (en) * | 2020-10-28 | 2021-02-09 | 河北美泰电子科技有限公司 | Pressure sensor and method of making the same |
| CN215893878U (en) * | 2021-06-22 | 2022-02-22 | 成都凯天电子股份有限公司 | A high temperature resistant oil filling pressure detection device |
| CN114838865A (en) * | 2022-06-14 | 2022-08-02 | 宝鸡市兴宇腾测控设备有限公司 | Dual-redundancy wide-temperature type pressure sensor |
| CN219369015U (en) * | 2022-12-13 | 2023-07-18 | 无锡盛邦电子有限公司 | An oil-filled pressure sensor |
| CN218885058U (en) * | 2022-12-21 | 2023-04-18 | 昆山灵科传感技术有限公司 | Liquid level sensor |
| CN116558700A (en) * | 2023-07-12 | 2023-08-08 | 合肥皖科智能技术有限公司 | All-welded oil filling pressure sensor based on sintering seat packaging |
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| Publication number | Publication date |
|---|---|
| CN116718305A (en) | 2023-09-08 |
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