CN116705735A - Preformed conductive column structure and manufacturing method thereof - Google Patents

Abstract

The invention discloses a preformed conductive column structure and a manufacturing method thereof, wherein the preformed conductive column structure comprises a plurality of conductive columns and a packaging body, and the conductive columns are vertically arranged and are arranged in parallel at intervals; the package body is coated outside the conductive posts, and is provided with a top surface and a bottom surface, one end of each conductive post is exposed to the top surface, and the other end is exposed to the bottom surface. Therefore, the back end of the monocrystalline packaging process has the advantages of simple process steps, shortening and improving the yield of finished products.

Description

Preformed conductive column structure and manufacturing method thereof

technical field

The present invention relates to a semiconductor packaging structure and a manufacturing method thereof, and in particular to a preformed conductive column structure and a manufacturing method thereof.

Background technique

As shown in Figure 1, first provide the conductive frame a1, the conductive frame a1 has a plate body a2 and a plurality of conductive columns a3 formed on the plate body a2; then provide the chip b1, the chip b1 has a plurality of electrode parts b2, and the chip b1 place on the conductive frame a1, and solder the plurality of electrode parts b2 on the plurality of conductive pillars a3; finally provide the package c, wrap the package c on the outside of the chip b1 and the plurality of conductive pillars a3, and then place the The plate body a2 exposing the package body c is removed, that is, a common single crystal packaging process is completed.

However, the above-mentioned single crystal packaging process has the following disadvantages. First, the chip b1 can only be inspected after removing the board a2. Therefore, when the chip b1 has a poor connection, the chip b1 has been covered by the package c and there is a need for recycling. Second, during the soldering process, solder balls tend to roll off from the top of the conductive pillar a3, causing inconvenience in soldering; third, the board body a2 needs to be removed in the latter stage of the single crystal packaging process, resulting in cumbersome and complicated process steps .

In view of this, the present inventor has focused on the above-mentioned prior art, devoted himself to research and combined with the application of theories, and tried his best to solve the above-mentioned problems, which became the goal of the inventor's development.

Contents of the invention

The present invention provides a preformed conductive post structure and a manufacturing method thereof. The preformed conductive post structure has been used to package the conductive post, and both ends of the conductive post are exposed to the package body, so as to achieve a single crystal packaging process with simple process steps. , shorten and improve the advantages of finished product yield.

In an embodiment of the present invention, the present invention provides a preformed conductive pillar structure, including: a plurality of conductive pillars, arranged upright with each other and juxtaposed at intervals; The body has a top surface and a bottom surface, one end of each conductive pillar is exposed on the top surface and the other end is exposed on the bottom surface.

Wherein, the package body is provided with a plurality of through holes, each of the conductive pillars includes a metal pillar embedded in each of the through holes, and each of the metal pillars has two ends that are exposed and flush with the top surface and the bottom surface. The two end faces of each metal column gradually reduce the size of the outer periphery from the two ends toward the middle.

Wherein, the package body is provided with a plurality of through holes, each of the conductive pillars includes a metal pillar embedded in each of the through holes, each of the metal pillars has an exposed end surface flush with the top surface at one end and A bare extension column protruding from the bottom surface extends from the other end, each metal column gradually reduces the outer peripheral dimension from two ends to the middle, and each extension column gradually reduces the outer peripheral dimension from both ends to the middle.

Wherein, the package body is provided with a plurality of through holes, and each of the conductive pillars includes a first metal pillar and a second metal pillar that are embedded and fixed in each of the through holes and welded up and down. The two ends of the second metal post are exposed and flush with the top surface and the bottom surface at the two ends far away from each other. Each of the first metal posts gradually reduces the outer peripheral dimension from the two ends toward the middle, and each of the first metal posts The size of the outer periphery of the two metal pillars gradually decreases from the two ends toward the middle.

Wherein, the package body is provided with a plurality of through holes, and each of the conductive pillars includes a first metal pillar and a second metal pillar that are embedded and fixed in each of the through holes and welded up and down. Extending from the two ends of the second metal post that are exposed and protruding from the top surface and the bottom surface are two extension posts that are exposed and protrude from the top surface and the bottom surface. The size of the outer peripheral edge of the second metal column gradually decreases from both ends toward the middle, and each extending column gradually reduces the size of the outer peripheral edge from both ends toward the middle.

Wherein, the package body is provided with a plurality of through holes, and each of the conductive pillars includes a first metal pillar and a second metal pillar that are embedded and fixed in each of the through holes and welded up and down. One end away from the second metal post has one end surface that is exposed and flush with one of the top surface and the bottom surface, and the other end has an exposed end surface that protrudes from the other one of the top surface and the bottom surface. The extension column, each of the first metal columns gradually reduces the outer peripheral dimension from both ends to the middle, each of the second metal columns gradually reduces the outer peripheral size from both ends to the middle, and each of the extension columns gradually decreases from both ends to the middle Reduce the size of the outer perimeter.

Wherein, each of the end surfaces is a plane or a concave arc surface gradually depressed from the outer periphery to the central point.

Wherein, the end surface of each extension column is a plane or a concave arc surface gradually depressed from the outer peripheral edge to the central point.

In an embodiment of the present invention, the present invention provides a method for manufacturing a preformed conductive column structure, the steps of which include: a) providing a metal plate, and performing an etching process on the metal plate, so that the metal plate is formed on one side forming an etched surface and a plurality of metal pillars remaining on the etched surface; and b) encapsulating the metal plate body, so that a package body is combined on the metal plate body, and the package body covers the metal plate body The etched surface and the peripheral surfaces of the plurality of metal pillars, each of the metal pillars has an exposed end surface flush with the top surface of the package body at one end.

Wherein, it further includes a step c) following the step b), and in step c), the metal plate body is removed, so that the other end of each metal post has an exposed and flush with the package body. one end of the bottom surface.

Wherein, it further includes a step d) after the step b), in the step d), the metal plate body is etched, so that the other end of each of the metal pillars is extended with a exposed and protruding from the package body An extension column at the base.

In an embodiment of the present invention, the present invention provides a method for manufacturing a preformed conductive post structure, the steps of which include: e) providing a first metal plate, and performing etching on the first metal plate, so that the first metal plate A metal plate is formed on one side with a first etched surface and a plurality of first metal columns remaining on the first etched surface; f) providing a second metal plate for etching the second metal plate processing, so that the second metal plate body forms a second etched surface and a plurality of second metal pillars remaining on the second etched surface on one side; g) combining the plurality of first metal pillars with the plurality of metal pillars stacking two second metal posts up and down, and welding one end of each first metal post to one end of each second metal post; and h) welding the first metal plate body and the second metal plate body packaging process, so that a package body is combined between the first metal plate body and the second metal plate body, and the package body covers the first etched surface, the second etched surface, and the plurality of first etched surfaces. The outer peripheral surface of the metal pillar and the outer peripheral surface of the plurality of second metal pillars.

Wherein, it further includes a step i) after the step h), in step i), the first metal plate body and the second metal plate body are removed, so that each of the first metal pillars and each The other end of the second metal pillar is exposed and flush with the top surface and the bottom surface of the package body.

Wherein, it further includes a step j) after the step h), in which step j), the first metal plate body and the second metal plate body are etched, so that each of the first metal pillars and each The other end of the second metal pillar is extended with two extending pillars that are exposed and protrude from the top surface and the bottom surface of the package body.

Wherein, it further includes a step k) after step h), in step k), one of the first metal plate body and the second metal plate body is subjected to removal treatment and the other is subjected to etching treatment, so that each of the first metal pillars and each of the second metal pillars has an exposed end surface flush with one of the top surface and the bottom surface of the package body and an exposed end surface protruding from the package body at the other end. An extension column of the other of the top surface and the bottom surface.

Wherein, in step g), tin is first brushed on the ends of the plurality of second metal pillars, and then the plurality of first metal pillars are stacked up and down with the plurality of second metal pillars, and the ambient temperature is increased, so that One end of each first metal post is welded to one end of each second metal post through tin heating and melting.

Based on the above, the preformed conductive post structure of the present invention has removed the metal plate body and packaged the conductive post, and the two ends of the conductive post are exposed to the package body, so that the preformed conductive post structure is shipped to the client for the latter part of the single crystal packaging process. , the customer does not need to remove the metal plate, and can be directly soldered to the chip by brushing tin on the conductive column, so as to achieve the advantages of simple and shortened process steps in the latter stage of the single crystal packaging process.

Based on the above, the preformed conductive pillar structure of the present invention has removed the metal plate body, so the steps of first packaging the chip and the plate body in the existing package body, and then removing the plate body can be omitted, so that the chip can be directly connected to the conductive pillar without being packaged. Welding, follow-up inspection of the chip and poor connection of the chip, the chip can be recycled and remanufactured because the chip is not packaged, thereby improving the yield rate of the single-chip packaging process.

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

Description of drawings

FIG. 1 is a combined cross-sectional view of a conventional single crystal package.

FIG. 2 is a flow chart of steps of the first manufacturing method of the preformed conductive pillar structure of the present invention.

3 is a perspective view of the metal plate body of the present invention formed with an etched surface and a plurality of metal pillars.

FIG. 4 is a cross-sectional view of a metal plate body formed with an etched surface and a plurality of metal pillars according to the present invention.

FIG. 5 is a perspective view of the package body of the present invention combined on the metal plate body.

FIG. 6 is a cross-sectional view of the package of the present invention combined with the metal plate.

FIG. 7 is a perspective view of the first embodiment of the preformed conductive column structure of the present invention.

FIG. 8 is a cross-sectional view of the first embodiment of the preformed conductive pillar structure of the present invention.

FIG. 9 is a flow chart of the steps of the second manufacturing method of the preformed conductive pillar structure of the present invention.

FIG. 10 is a perspective view of a second embodiment of the preformed conductive post structure of the present invention.

FIG. 11 is a cross-sectional view of the second embodiment of the preformed conductive pillar structure of the present invention.

FIG. 12 is a flow chart of the steps of the third manufacturing method of the preformed conductive column structure of the present invention.

13 is a perspective view of the first metal plate body formed with the first etched surface and a plurality of first metal pillars according to the present invention.

Fig. 14 is a perspective view of welding one end of each first metal post and one end of each second metal post in the present invention.

Fig. 15 is a cross-sectional view of welding one end of each first metal post to one end of each second metal post in the present invention.

16 is a cross-sectional view of the package of the present invention combined between the first metal plate and the second metal plate.

FIG. 17 is a cross-sectional view of a third embodiment of the preformed conductive pillar structure of the present invention.

FIG. 18 is a flow chart of the steps of the fourth manufacturing method of the preformed conductive column structure of the present invention.

FIG. 19 is a perspective view of a fourth embodiment of the preformed conductive post structure of the present invention.

FIG. 20 is a cross-sectional view of a fourth embodiment of the preformed conductive pillar structure of the present invention.

FIG. 21 is a flow chart of the steps of the fifth manufacturing method of the preformed conductive column structure of the present invention.

FIG. 22 is a cross-sectional view of a fifth embodiment of the preformed conductive pillar structure of the present invention.

FIG. 23 is a perspective view of a sixth embodiment of the preformed conductive post structure of the present invention.

Among them, reference signs:

<current technology>

a1: conductive frame

a2: board body

a3: Conductive column

b1: chip

b2: electrode part

c: Encapsulation

<this invention>

10: Preformed conductive column structure

1: Conductive column

11: Metal plate body

111: etched surface

112: metal column

113: Outer peripheral surface

12: The first metal plate body

121: the first etched surface

122: First Metal Pillar

123: Outer peripheral surface

13: Second metal plate body

131: Second etched surface

132: Second metal pillar

133: Outer peripheral surface

14, 14': end face

15, 15': extension column

2: Encapsulation

21: top surface

22: bottom surface

23: through hole

Step a~k

Detailed ways

The detailed description and technical content of the present invention will be described as follows with accompanying drawings, but the attached drawings are only for illustration purposes and are not intended to limit the present invention.

Referring to FIG. 2 to FIG. 8 , the present invention provides a first embodiment of a preformed conductive post structure and a manufacturing method thereof. The preformed conductive post structure 10 mainly includes a plurality of conductive posts 1 and a package 2 .

As shown in Figure 2, it is the steps of the manufacturing method of the first embodiment of the preformed conductive column structure of the present invention, which are further described as follows; first, as shown in step a of Figure 2 and Figures 3 to 4, a metal plate is provided The body 11 is etched on the metal plate body 11 so that the metal plate body 11 forms an etched surface 111 and a plurality of metal pillars 112 remaining on the etched surface 111 on one side. Wherein, the metal plate body 11 can be made of conductive metals such as copper, silver, and gold, so that the metal pillars 112 can be made of conductive metals such as copper, silver, and gold.

Second, as shown in step b of Figure 2 and Figures 5 to 6, the metal plate body 11 is packaged so that a package body 2 is bonded to the metal plate body 11, and the package body 2 covers the etched surface 111 With the outer peripheral surface 113 of the plurality of metal pillars 112 , each metal pillar 112 has an exposed end surface 14 flush with the top surface 21 of the package body 2 at one end.

In addition, the package body 2 is made of polyimide (Polyimide, PI), dry film (Dry film), epoxy resin (Expoxy) or packaging material (Molding Compound), and the package body 2 can be lamination or molding (Molding) is formed on the metal plate body 11 , but not limited to the above.

Furthermore, before the metal plate body 11 is packaged, the surface to be etched 111 and the outer peripheral surfaces 113 of the plurality of metal pillars 112 can be roughened so that the etched surface 111 and the outer peripheral surfaces of the plurality of metal pillars 112 The surface of 113 is rough and easy to be stably combined with the package body 2, but this step is not necessary, and it can be retained or omitted depending on the actual situation.

Third, as shown in step c of FIG. 2 and FIG. 7 to FIG. 8, the metal plate body 11 is removed, so that each metal post 112 has an exposed and flush with the bottom surface 22 of the package body 2 at the other end. One end face 14 . Thereby, the first embodiment of the preformed conductive column structure 10 is produced.

Wherein, each end surface 14 in this embodiment is a plane, but not limited thereto, each end surface 14 can also be etched to form a concave arc surface that is gradually depressed from the outer periphery to the central point.

As shown in FIG. 7 to FIG. 8, it is the first embodiment of the preformed conductive post structure 10 of the present invention, which is described in detail as follows. A plurality of conductive posts 1 are arranged upright and spaced side by side; the package body 2 is wrapped on the plurality of conductive posts. 1 , the package body 2 has a top surface 21 and a bottom surface 22 , one end of each conductive post 1 is exposed and flush with the top surface 21 and the other end is exposed and flush with the bottom surface 22 .

In addition, the package body 2 is provided with a plurality of through holes 23, and each conductive pillar 1 includes a metal pillar 112 embedded in each through hole 23, and each metal pillar 112 has exposed and flush with the top surface 21 and the bottom surface at both ends. The two end surfaces 14 of 22 are formed by etching the metal pillars 112 , so each metal pillar 112 gradually reduces the outer peripheral dimension from the two ends toward the middle.

As shown in Figures 7 to 8, the use state of the first embodiment of the preformed conductive column structure 10 of the present invention is that the package body 2 is used to cover the outside of a plurality of conductive columns 1, and one end of each conductive column 1 is exposed It is flush with the top surface 21 of the package body 2 and the other end is exposed and flush with the bottom surface 22 of the package body 2 . In this way, the preformed conductive post structure 10 of the present invention has removed the metal plate body 11 and encapsulated the conductive post 1, and both ends of the conductive post 1 are exposed to the package body 2, so that the preformed conductive post structure 10 is shipped to the client for single In the later stage of the crystal packaging process, the customer does not need to remove the metal plate body 11, but can directly solder the chip to the conductive post 1 by brushing tin, so as to achieve the advantages of simple and shortened process steps in the latter stage of the single crystal packaging process.

In addition, the metal plate body 11 has been removed from the preformed conductive column structure 10 of the present invention, so the step of first packaging the chip and the plate body in the existing package body, and then removing the plate body can be omitted, so that the chip can be directly connected to the conductive column without being packaged. Column 1 is soldered, and when the chip is subsequently inspected and the chip connection is poor, the chip can be recycled and remanufactured because the chip is not packaged, thereby improving the yield rate of the single-chip packaging process.

Also, during the soldering process, one end of the conductive post 1 in this embodiment is exposed and flush with the top surface 21 of the package body 2 and the other end is exposed and flush with the bottom surface 22 of the package body 2, so the solder balls are not easy to separate from the conductive post. The end of 1 rolls off, so that the preformed conductive column structure 10 has the effect of facilitating welding.

Please refer to FIG. 3 to FIG. 6 , and FIG. 9 to FIG. 11 , which are the second embodiment of the preformed conductive column structure of the present invention and the manufacturing method thereof, which are further described as follows.

The steps a to b of the manufacturing method of the second embodiment of the preformed conductive column structure of the present invention are the same as the steps a to b of the first embodiment of the preformed conductive column structure, and the fabrication of the first and second embodiments of the preformed conductive column structure The method differs in the steps after step b.

First go through step a (shown in Figure 3 to Figure 4) and step b (shown in Figure 5 to Figure 6) of Figure 9, and then step d in Figure 9, as shown in Figure 10 to Figure 11, for the metal The board body 11 is etched, so that each metal post 112 is extended with an extended post 15 that is exposed and protrudes from the bottom surface 22 of the package body 2 at the other end. Thereby, the second embodiment of the preformed conductive column structure 10 is produced.

Wherein, the end surface of each extension column 15 in this embodiment is a plane, but it is not limited thereto. The end surface of each extension column 15 can also be etched to form a concave shape that is gradually depressed from the outer periphery to the center point. curved surface.

As shown in Figure 10 to Figure 11, it is the second embodiment of the preformed conductive column structure 10 of the present invention, which is described in detail as follows. On the bottom surface 22 , one end of each conductive post 1 is exposed and flush with the top surface 21 and the other end is exposed and protrudes from the bottom surface 22 .

In addition, the package body 2 is provided with a plurality of through holes 23, and each conductive pillar 1 includes a metal pillar 112 embedded in each through hole 23, and each metal pillar 112 has an exposed end surface flush with the top surface 21 at one end. 14 and an extension column 15 that is bare and protrudes from the bottom surface 22 is extended at the other end. Because the metal column 112 is etched and formed first, and the extension column 15 is etched and formed again, each metal column 112 gradually reduces the outer circumference from both ends toward the middle. Edge size, each extension column 15 gradually reduces the outer peripheral edge size from both ends to the middle. In this way, the same effect as that of the first embodiment of the preformed conductive column structure 10 and its manufacturing method can be achieved.

Furthermore, in this embodiment, the extension column 15 is extended at one end of the metal column 112 by etching the metal plate body 11 , thereby increasing the length of the conductive column 1 , so that the preformed conductive column structure 10 has the function of extending the length of the conductive column 1 .

Referring to FIG. 12 to FIG. 17 , the present invention provides a third embodiment of a preformed conductive post structure and a manufacturing method thereof. The preformed conductive post structure 10 mainly includes a plurality of conductive posts 1 and a package body 2 .

As shown in Figure 12, it is the steps of the manufacturing method of the third embodiment of the preformed conductive column structure of the present invention, which are further described as follows; first, as shown in step e of Figure 12 and Figure 13, a first metal plate body is provided 12. Etching the first metal plate body 12 to form a first etched surface 121 and a plurality of first metal pillars 122 remaining on the first etched surface 121 on one side of the first metal plate body 12 .

Second, as shown in step f of Figure 12 and Figures 14 to 15, a second metal plate body 13 is provided, and the second metal plate body 13 is etched so that the second metal plate body 13 is formed on one side with a The second etched surface 131 and the plurality of second metal pillars 132 remaining on the second etched surface 131 .

Third, as shown in step g of Figure 12 and Figures 14 to 15, a plurality of first metal columns 122 and a plurality of second metal columns 132 are stacked up and down, and one end of each first metal column 122 is It is welded with one end of each second metal pillar 132 .

Step g is described in detail as follows. First brush tin on the ends of the plurality of second metal pillars 132, then stack the plurality of first metal pillars 122 and the plurality of second metal pillars 132 up and down, and increase the ambient temperature to make each One end of the first metal post 122 is welded to one end of each second metal post 132 by heating and melting tin.

Fourth, as shown in step h of FIG. 12 and FIG. 16, the first metal plate body 12 and the second metal plate body 13 are packaged so that a package body 2 is combined with the first metal plate body 12 and the second metal plate body 12. Between the metal plates 13 , the package body 2 covers the first etched surface 121 , the second etched surface 131 , the outer peripheral surfaces 123 of the plurality of first metal pillars 122 and the outer peripheral surfaces 133 of the plurality of second metal pillars 132 .

In addition, the package body 2 is made of polyimide (Polyimide, PI), dry film (Dry film), epoxy resin (Expoxy) or packaging material (Molding Compound), and the package body 2 can be lamination or molding (Molding) is formed between the first metal plate body 12 and the second metal plate body 13 , but not limited to the above.

Furthermore, before encapsulating the first metal plate body 12 and the second metal plate body 13, the first etched surface 121, the second etched surface 131, and the outer peripheral surfaces 123 of a plurality of first metal pillars 122 may be first etched. Surface roughening treatment is carried out with the outer peripheral surface 133 of a plurality of second metal pillars 132, so that the first etched surface 121, the second etched surface 131, the outer peripheral surface 123 of a plurality of first metal pillars 122 and the plurality of second metal pillars The outer peripheral surface 133 of the post 132 is rough and easy to be stably combined with the package body 2 , but this step is not necessary, and it can be reserved or omitted according to the actual situation.

Fifth, as shown in step i of Figure 12 and Figure 17, the first metal plate body 12 and the second metal plate body 13 are removed so that each first metal column 122 and each second metal column 132 The other end has two end surfaces 14 ′ that are exposed and flush with the top surface 21 and the bottom surface 22 of the package body 2 . In this way, the third embodiment of the preformed conductive column structure 10 is produced.

Wherein, each end surface 14' of this embodiment is a plane, but it is not limited thereto, and each end surface 14' can also be etched to form a concave arc surface that is gradually depressed from the outer periphery to the central point.

As shown in FIG. 17 , it is a third embodiment of the preformed conductive pillar structure 10 of the present invention, and the details are as follows. The package body 2 is wrapped on the outside of a plurality of conductive pillars 1 , and the package body 2 has a top surface 21 and a bottom surface 22. One end of each conductive pillar 1 is exposed and flush with the top surface 21 and the other end is exposed and flush with the bottom surface 22 .

In addition, the package body 2 is provided with a plurality of through holes 23, and each conductive post 1 includes a first metal post 122 and a second metal post 132 embedded in each through hole 23 and welded up and down. The metal post 122 and the second metal post 132 have two end surfaces 14 ′ that are exposed and flush with the top surface 21 and the bottom surface 22 at the two ends far away from each other. Because the first metal post 122 and the second metal post 132 are etched and formed, so Each first metal column 122 gradually reduces the size of the outer periphery from both ends to the middle, and each second metal column 132 gradually reduces the size of the outer periphery from both ends to the middle. In this way, the same effect as that of the first embodiment of the preformed conductive column structure 10 and its manufacturing method can be achieved.

Furthermore, in this embodiment, the first metal post 122 and the second metal post 132 are welded up and down to increase the length of the conductive post 1 , so that the preformed conductive post structure 10 has the function of extending the length of the conductive post 1 .

Please refer to FIG. 13 to FIG. 16 , and FIG. 18 to FIG. 20 , which are the fourth embodiment of the preformed conductive column structure and its manufacturing method according to the present invention, which are further described as follows.

The steps e to h of the manufacturing method of the fourth embodiment of the preformed conductive column structure of the present invention are the same as the steps e to h of the third embodiment of the preformed conductive column structure, and the fabrication of the third and fourth embodiments of the preformed conductive column structure The method differs in the steps after step h.

First go through step e (as shown in FIG. 13 ) of FIG. 18 , step f (as shown in FIG. 14 to FIG. 15 ), step g (as shown in FIG. 14 to FIG. 16 ), and step h (as shown in FIG. 16 ) Afterwards, as shown in step j of FIG. 18 and FIG. 19 to FIG. 20, the first metal plate body 12 and the second metal plate body 13 are etched so that each first metal column 122 and each second metal column The metal pillar 132 is extended with two extending pillars 15 ′ that are exposed at the other end and protrude from the top surface 21 and the bottom surface 22 of the package body 2 . In this way, the fourth embodiment of the preformed conductive column structure 10 is produced.

Wherein, the end surface of each extension column 15' in this embodiment is a plane, but it is not limited thereto. A concave arc.

As shown in Figure 10 to Figure 11, it is the fourth embodiment of the preformed conductive column structure 10 of the present invention, which is described in detail as follows. On the bottom surface 22 , one end of each conductive pillar 1 is exposed and protrudes from the top surface 21 and the other end is exposed and protrudes from the bottom surface 22 .

In addition, the package body 2 is provided with a plurality of through holes 23, and each conductive post 1 includes a first metal post 122 and a second metal post 132 embedded in each through hole 23 and welded up and down. The metal post 122 and the second metal post 132 have two extended posts 15 ′ that are exposed and protrude from the top surface 21 and the bottom surface 22 at both ends of the metal post 122 and the second metal post 132 , because the first metal post 122 and the second metal post 132 are etched first. , the extension column 15' is etched and shaped again, so each first metal column 122 gradually reduces the size of the outer periphery from both ends to the middle, and each second metal column 132 gradually reduces the size of the outer periphery from both ends to the middle, and each extension The size of the outer peripheral edge of the column 15' gradually decreases from both ends toward the middle. In this way, the same effect as that of the third embodiment of the preformed conductive pillar structure 10 and its manufacturing method can be achieved.

Furthermore, in this embodiment, the first metal post 122 and the second metal post 132 are welded up and down, and the first metal plate body 12 and the second metal plate body 13 are etched and the first metal post 122 and the second metal post 132 are etched. Two extension columns 15 extend from both ends of the column 132 , thereby increasing the length of the conductive column 1 , so that the preformed conductive column structure 10 has the function of extending the length of the conductive column 1 .

Please refer to FIG. 13 to FIG. 16 and FIG. 21 to FIG. 22 , which are the fifth embodiment of the preformed conductive column structure and the manufacturing method thereof according to the present invention, and further descriptions are as follows.

The steps e to h of the manufacturing method of the fifth embodiment of the preformed conductive column structure of the present invention are the same as the steps e to h of the third embodiment of the preformed conductive column structure, and the fabrication of the third and fifth embodiments of the preformed conductive column structure The method differs in the steps after step h.

First go through step e (as shown in FIG. 13 ) of FIG. 21 , step f (as shown in FIG. 14 to FIG. 15 ), step g (as shown in FIG. 14 to FIG. 16 ), and step h (as shown in FIG. 16 ) Afterwards, as shown in step k of FIG. 21 and FIG. 22, one of the first metal plate body 12 and the second metal plate body 13 is subjected to removal treatment and the other is subjected to etching treatment, so that each first The other end of the metal post 122 and each second metal post 132 has an end surface 14 ′ that is exposed and flush with one of the top surface 21 and the bottom surface 22 of the package body 2 and is exposed and protrudes from the top surface of the package body 2 21 and an extension column 15 ′ of the other of the bottom surface 22 . In this way, the fifth embodiment of the preformed conductive pillar structure 10 is produced.

Wherein, each end surface 14' of this embodiment is etched to form a concave arc surface that is gradually depressed from the outer periphery to the central point, but it is not limited thereto, and each end surface 14' can also be a plane; each extension The end surface of the column 15' is etched to form a concave arc surface gradually depressed from the outer periphery to the central point, but not limited thereto, and the end surface of each extending column 15' can also be a plane.

As shown in FIG. 22 , it is a fifth embodiment of the preformed conductive post structure 10 of the present invention. The details are as follows. The package 2 is wrapped on the outside of a plurality of conductive posts 1 . The package 2 has a top surface 21 and a bottom surface 22 . One end of each conductive post 1 is exposed and flush with one of the top surface 21 and the bottom surface 22 , and the other end is exposed and protrudes from the other one of the top surface 21 and the bottom surface 22 .

In addition, the package body 2 is provided with a plurality of through holes 23, and each conductive post 1 includes a first metal post 122 and a second metal post 132 embedded in each through hole 23 and welded up and down. The metal post 122 and the second metal post 132 have an exposed end surface 14' flush with one of the top surface 21 and the bottom surface 22 at one end away from each other, and the other end has a bare end surface protruding from the top surface 21 and the bottom surface 22. The other one extension column 15', because the first metal column 122 and the second metal column 132 are etched and formed first, and the extension column 15' is etched and formed again, so each first metal column 122 is gradually formed from two ends toward the middle. To reduce the size of the outer periphery, each second metal column 132 gradually reduces the size of the outer periphery from both ends to the middle, and each extension column 15 ′ gradually reduces the size of the outer periphery from both ends to the middle. In this way, the same effect as that of the third embodiment of the preformed conductive pillar structure 10 and its manufacturing method can be achieved.

Furthermore, in this embodiment, the first metal post 122 and the second metal post 132 are welded up and down, and the first metal plate body 12 or the second metal plate body 13 is etched and the first metal post 122 or the second metal post 132 is etched. An extension column 15 ′ is extended from one end of the column 132 to increase the length of the conductive column 1 , so that the preformed conductive column structure 10 has the function of extending the length of the conductive column 1 .

As shown in Figure 23, it is the sixth embodiment of the preformed conductive column structure 10 of the present invention, the sixth embodiment of the preformed conductive column structure 10 is substantially the same as the second embodiment of the preformed conductive column structure 10, the preformed conductive The differences between the sixth embodiment of the post structure 10 and the second embodiment of the preformed conductive post structure 10 are further described as follows.

By performing etching treatment with different parameters on different parts of the metal plate body 11, a part of the metal pillar 112 is extended with an extension pillar 15 that is exposed and protrudes from the bottom surface 22 of the package body 2 at the other end, and another part of the metal pillar 112 is exposed on the other end. The other end has an exposed end surface 14 flush with the bottom surface 22 of the package body 2 . In this way, the position of the end surface 14 and the extension column 15 is matched with the chip arrangement, so as to enhance the linking capability of the preformed conductive column structure 10 of the present invention and the chip.

Similarly, as shown in FIG. 19 to FIG. 20 and FIG. 22 , different parts of the first metal plate body 12 or the second metal plate body 13 can also be etched with different parameters to make the first metal pillar 122 At the other end, there is an end surface 14 ′ that is exposed and flush with the top surface 21 of the package body 2 or an extension post 15 ′ that protrudes from the top surface 21 of the package body 2 . The end surface 14 ′ of the bottom surface 22 of the package body 2 or the extension column 15 ′ protrudes from the bottom surface 22 of the package body 2 . In this way, the position of the end surface 14' or the extension column 15' is matched with the chip arrangement, so as to enhance the ability of the preformed conductive column structure 10 of the present invention to link with the chip.

Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding changes All changes and modifications should belong to the protection scope of the claims of the present invention.

Claims (16)

1. A preformed conductive column structure, characterized in that, comprising: A plurality of conductive columns are arranged upright and spaced apart; and A package is wrapped on the outside of the plurality of conductive columns, the package has a top surface and a bottom surface, one end of each conductive column is exposed on the top surface and the other end is exposed on the bottom surface. 2. The preformed conductive pillar structure according to claim 1, wherein the package body is provided with a plurality of through holes, each of the conductive pillars includes a metal pillar embedded in each of the through holes, each of the The two ends of the metal pillars are exposed and flush with the top surface and the bottom surface, and the size of the outer peripheral edge of each metal pillar gradually decreases from the two ends toward the middle. 3. The preformed conductive pillar structure according to claim 1, wherein the package body is provided with a plurality of through holes, each of the conductive pillars includes a metal pillar embedded in each of the through holes, and each of the conductive pillars The metal column has an exposed end surface flush with the top surface at one end and an extended column exposed at the other end and protruding from the bottom surface. A dimension of the outer peripheral edge of the extension column is gradually reduced from two ends toward the middle. 4. The preformed conductive pillar structure according to claim 1, wherein the package body is provided with a plurality of through holes, and each of the conductive pillars includes an upper and a lower welded joint embedded in each of the through holes. A first metal column and a second metal column, the first metal column and the second metal column have two end surfaces that are exposed and flush with the top surface and the bottom surface at the two ends far away from each other, each of the first metal columns The size of the outer periphery of the metal pillar gradually decreases from both ends toward the middle, and the size of each second metal pillar gradually reduces the size of the outer periphery from both ends toward the middle. 5. The preformed conductive post structure according to claim 1, wherein the package body is provided with a plurality of through holes, and each of the conductive posts includes an upper and a lower stacked welding post embedded in each of the through holes. A first metal column and a second metal column, the two ends of the first metal column and the second metal column extending away from each other have two extension columns that are exposed and protrude from the top surface and the bottom surface, each of the first metal columns A metal column gradually reduces the size of the outer periphery from both ends to the middle, each of the second metal columns gradually reduces the size of the outer periphery from both ends to the middle, and each of the extension columns gradually reduces the size of the outer periphery from both ends to the middle. 6. The preformed conductive post structure according to claim 1, wherein the package body is provided with a plurality of through holes, and each of the conductive posts includes an upper and a lower stacked welding post embedded in each of the through holes. A first metal column and a second metal column, the first metal column and the second metal column have one end surface and the other end which are exposed and flush with one of the top surface and the bottom surface at the ends away from each other There is an extending pillar exposed and protruding from the other of the top surface and the bottom surface, each of the first metal pillars gradually reduces the outer peripheral size from both ends toward the middle, and each of the second metal pillars decreases from both ends toward the middle The size of the outer periphery is gradually reduced, and the size of the outer periphery of each extending column is gradually reduced from two ends toward the middle. 7 . The preformed conductive post structure according to claim 2 , 3 , 4 or 6 , wherein each of the end surfaces is a plane or a concave arc surface that is gradually depressed from the outer periphery to the central point. 8. The preformed conductive post structure according to claim 3, 5 or 6, wherein the end surface of each extension post is a plane or a concave arc surface that is gradually depressed from the outer periphery to the central point. 9. A method for manufacturing a preformed conductive column structure, characterized in that the steps include: a) providing a metal plate body, which is etched to form an etched surface on one side of the metal plate body and a plurality of metal pillars remaining on the etched surface; and b) Encapsulate the metal plate, so that a package is combined on the metal plate, the package covers the etched surface and the outer peripheral surface of the plurality of metal pillars, each of the metal pillars is at one end One end surface is exposed and flush with the top surface of the package body. 10. The manufacturing method of the preformed conductive column structure according to claim 9, characterized in that, it further comprises a step c) following the step b), and in step c), removing the metal plate body , so that each of the metal pillars has an exposed end surface flush with the bottom surface of the package body at the other end. 11. The manufacturing method of the preformed conductive post structure according to claim 9, characterized in that, it further comprises a step d) after the b) step, in the step d), the metal plate is etched, The other end of each metal post is extended with an extended post that is exposed and protrudes from the bottom surface of the package. 12. A method for manufacturing a preformed conductive column structure, characterized in that the steps include: e) provide a first metal plate body, and perform etching treatment on the first metal plate body, so that a first etched surface and a plurality of remaining on the first etched surface are formed on one side of the first metal plate body; a first metal post; f) Provide a second metal plate, etch the second metal plate, so that the second metal plate forms a second etched surface on one side and a plurality of remaining on the second etched surface a second metal post; g) stacking the plurality of first metal posts and the plurality of second metal posts up and down, and welding one end of each first metal post to one end of each second metal post; and h) Encapsulating the first metal plate body and the second metal plate body, so that a package is combined between the first metal plate body and the second metal plate body, and the package body wraps the first metal plate body An etched surface, the second etched surface, the peripheral surfaces of the plurality of first metal pillars and the peripheral surfaces of the plurality of second metal pillars. 13. The manufacturing method of the preformed conductive post structure according to claim 12, characterized in that it further comprises a step i) after step h), in step i), the first metal plate body and the first metal plate The second metal plate is removed so that each of the first metal pillars and each of the second metal pillars has two end surfaces that are exposed at the other end and are flush with the top surface and the bottom surface of the package body. 14. The manufacturing method of the preformed conductive post structure according to claim 12, characterized in that, it further comprises a step j) after the step h), in step j), the first metal plate body and the first metal plate The second metal plate body is etched, so that each of the first metal pillars and each of the second metal pillars has two extending pillars that are exposed at the other end and protrude from the top surface and the bottom surface of the package body. 15. The manufacturing method of the preformed conductive column structure according to claim 12, characterized in that, it further comprises a step k) after the step h), and in the step k), the first metal plate and the first metal plate One of the second metal plates is removed and the other is etched, so that each of the first metal pillars and each of the second metal pillars has an exposed and flush with the package at the other end. An end surface of one of the top surface and the bottom surface and an extension post exposed and protruding from the other of the top surface and the bottom surface of the package body. 16. The manufacturing method of the preformed conductive post structure according to claim 12, characterized in that in step g), brushing tin on the ends of the plurality of second metal posts first, and then brushing the ends of the plurality of first metal posts Stacking up and down with the plurality of second metal pillars, and increasing the ambient temperature, so that one end of each first metal pillar and one end of each second metal pillar are welded through tin heating and melting.