CN116677592A - Piezoelectric micropump of high flow side direction air inlet - Google Patents

Abstract

The invention discloses a piezoelectric micropump with high-flow lateral air intake; vibrating layer. The side of the inlet layer facing the sealing layer is provided with a confluence chamber and one or more strip-shaped inlet channels; one end of the inlet channel is connected to the edge of the inlet layer to form an air inlet; the other side of each channel Both ends are connected to the confluence chamber. A flow hole is opened in the confluence cavity. An elastic buffer zone with a thickness of 40 μm to 60 μm is formed between the side of the inflow layer away from the sealing layer and the confluence chamber. The material of the inflow layer is metal. In the present invention, the air inlet of the piezoelectric micropump is transferred to the side surface of the pump body by setting the inlet flow channel directly connected with the side of the pump body on the inflow layer, so as to simplify the fixing method between the bottom surface of the pump body and the external structure , so that the piezoelectric micropump can adapt to more abundant usage scenarios.

Description

A Piezoelectric Micropump with High-Flow Side-intake

technical field

The invention belongs to the technical field of gas micropumps, and in particular relates to a piezoelectric micropump with high-flow lateral air intake.

Background technique

With the development of microfluidic technology, new methods and devices for microfluidic control have begun to be explored. Traditional gas delivery methods are limited by bulky, complex, and maneuverable issues, while piezoelectric micropumps are known for their tiny size, fast response, and precise control. For example, micro gas sensors have important applications in the fields of environmental monitoring, gas detection and biosensing. However, traditional gas sensors need external devices such as pumps or compressors to realize gas supply and removal, and piezoelectric micropumps, as a tiny, efficient, and integrable gas transmission device, can meet the needs of micro gas sensors for gas supply. requirements. In the medical field, gas delivery is an important part of many therapeutic and diagnostic procedures. For example, tiny gas pumps can be used to deliver oxygen, drugs or gas mixtures into a patient's respiratory system. Compared with traditional gas delivery methods, piezoelectric micropumps have the characteristics of small size, fast response, and low noise, which can provide more precise and personalized gas delivery.

Existing piezoelectric micropump structure as shown in Figure 1, its air inlet 115 is arranged on the bottom surface of pump body (that is sealing layer 100 is away from the side of inflow layer 101); Opening air intake holes can achieve gas circulation well; however, in most usage scenarios, the bottom surface of the piezoelectric micropump needs to be used for fixed installation, resulting in the air intake structure of the piezoelectric micropump being easily closed.

In addition, existing piezoelectric micropumps need to be provided with a buffer layer 104 between the inflow layer 101 and the vibrating substrate layer 107 to prevent the vibration of the vibrating substrate layer 107 from directly hitting the rigid barrier layer 101, resulting in damage. . The buffer layer 104 will increase the overall number of layers of the piezoelectric micropump, increase the seams on the piezoelectric micropump, increase the bonding process, increase the risk of leakage, and reduce the integration of the pump body.

Contents of the invention

The purpose of the present invention is to propose a piezoelectric micropump with high flow rate and lateral air intake, so as to realize gas transmission with high flow rate, low profile and higher integration.

In the first aspect, the present invention provides the first piezoelectric micropump with high-flow lateral air intake, which includes a sealing layer, an inflow layer, a vibrating substrate layer, a shell layer, and a vibrating substrate layer fixed in sequence. vibrating layer. An input chamber is formed between the sealing layer and the inflow layer; a pressure changing chamber is formed between the inflow layer and the vibrating substrate layer; an output chamber is formed between the vibrating substrate layer and the shell layer.

The side of the inlet layer facing the sealing layer is provided with a confluence chamber and one or more strip-shaped air inlet channels; one end of the inlet air channel is connected to the edge of the inlet layer to form an air inlet; each flow The other end of the channel is connected to the confluence chamber. A flow hole is opened in the confluence cavity. An elastic buffer zone with a thickness of 40 μm to 60 μm is formed between the side of the inflow layer away from the sealing layer and the confluence chamber. The material of the inflow layer is metal.

Preferably, a plurality of storage chambers staggered from the intake flow channel are provided on the side of the intake layer close to the vibrating substrate layer.

In a second aspect, the present invention provides a second high-flow piezoelectric micropump with lateral air intake, which includes an inflow layer, a buffer layer, a vibrating substrate layer, an upper power supply layer, a casing layer, and a vibrating layer fixed in sequence. The vibration layer on the substrate layer. An input cavity is formed between the inflow layer and the buffer layer; a variable pressure chamber is formed between the inflow layer and the vibrating substrate layer; an output cavity is formed between the vibrating substrate layer and the shell layer.

The side of the inlet layer close to the buffer layer is provided with a confluence chamber and one or more strip-shaped inlet channels; one end of the inlet channel is connected to the edge of the inlet layer to form an air inlet; each flow The other end of the channel is connected to the confluence chamber. The buffer layer is provided with flow holes. The flow hole is aligned with and communicated with the center of the confluence cavity. The buffer layer is made of metal and has a thickness of 40 μm˜60 μm.

As a preference, the side of the inflow layer close to the buffer layer is provided with a plurality of storage chambers that are staggered from the inlet flow channel; the buffer layer is provided with through grooves aligned with each storage chamber, so that each storage chamber communicated with the pressure chamber.

Preferably, the confluence chamber is located at the center of the inflow layer.

Preferably, a plugging layer is fixed on the side of the vibrating substrate layer facing the inlet layer; the plugging layer is aligned with the confluence cavity of the inflow layer, and the diameter of the plugging layer is larger than that of the confluence cavity.

Preferably, the plugging layer and the vibration substrate layer are integrally formed.

Preferably, the length of the inlet channel is 6mm-8mm, and the thickness is less than 300μm; the diameter of the confluence cavity is 7mm-10mm, and the depth is 300μm-400μm.

Preferably, the vibrating substrate layer includes an edge fixing part, an elastic connecting piece and a central vibrating part; the center hole edge of the edge fixing part is connected to the outer edge of the central vibrating part through an elastic connecting piece; the elastic connecting piece includes a first Connecting part, second connecting part and elastic segment; one end of the first connecting part is connected with the central vibration part, the other end of the first connecting part is connected with one end of the elastic segment; one end of the second connecting part is connected with the other end of the elastic segment ; The other end of the second connecting part is connected with the edge fixing part; one end of the first connecting part is connected with the central vibration part, and the other end of the first connecting part is connected with one end of the elastic section; one end of the second connecting part is connected with the elastic section The other end is connected; the other end of the second connecting part is connected to the edge fixing part; the elastic section is arc-shaped, and the position of the center of the circle coincides with the center point of the central vibrating part.

Preferably, an upper power supply layer is provided between the vibrating substrate layer and the shell layer; the vibrating layer is made of piezoelectric ceramics; the side of the vibrating layer away from the vibrating substrate layer is led to the first power supply terminal through the upper power supply layer; The side of the layer facing the vibrating substrate layer leads out the second power supply terminal through the barrier layer.

The beneficial effects that the present invention has are:

1. In the present invention, the air inlet of the piezoelectric micropump is transferred to the side surface of the pump body by setting the inlet flow channel directly connected with the side of the pump body on the inflow layer, so as to simplify the connection between the bottom surface of the pump body and the external structure. The fixed method enables the piezoelectric micropump to adapt to more abundant usage scenarios.

2. The present invention makes the middle part of the inflow layer form a confluence cavity and a flow hole by means of etching; an elastic buffer zone with a thickness of only 40 μm-60 μm is formed at the position of the confluence cavity; the elastic buffer zone with a smaller thickness can present good elasticity, By replacing the function of the buffer layer in the existing piezoelectric micropump, the structure of the piezoelectric micropump is further compacted, the complexity of assembly is reduced, and the risk of leakage of the piezoelectric micropump is reduced.

3. In the present invention, a storage chamber is provided on the side of the inflow layer close to the vibrating substrate layer, thereby increasing the internal volume of the pump body and increasing the gas output capacity of the piezoelectric micropump while maintaining a compact structure.

Description of drawings

FIG. 1 is a schematic diagram of the internal structure of an existing piezoelectric micropump;

Figure 2 is a schematic diagram of the internal structure of Embodiment 1 of the present invention;

Fig. 3 is the first explosion schematic diagram of Embodiment 1 of the present invention;

Fig. 4 is the second explosion schematic diagram of Embodiment 1 of the present invention;

Fig. 5 is the structural representation of sealing layer in the embodiment 1 of the present invention;

6 is a schematic structural view of the inflow layer in Embodiment 1 of the present invention;

7 is a schematic diagram of the side structure of the barrier layer facing the inflow layer in Example 1 of the present invention;

Fig. 8 is a schematic diagram of the side structure of the barrier layer facing away from the inflow layer in Example 1 of the present invention;

9 is a schematic structural diagram of the upper power supply layer in Embodiment 1 of the present invention;

Fig. 10 is a schematic diagram of the internal structure of Embodiment 2 of the present invention;

Figure 11 is a schematic structural view of the inflow layer in Example 2 of the present invention;

Figure 12 is a schematic structural view of the buffer layer in Example 2 of the present invention;

Detailed ways

The first embodiment of the present invention will be further described below in conjunction with the accompanying drawings.

As shown in Figures 2, 3 and 4, a piezoelectric micropump with high-flow lateral air intake includes a sealing layer 100, an inflow layer 101, a vibrating substrate layer 106, an upper power supply layer 111, and a shell layer stacked in sequence. 113, and the blocking layer 108 fixed on the side of the vibrating substrate layer 106 facing the inflow layer 101, and the vibrating layer 109 fixed on the side of the vibrating substrate layer 106 facing the housing layer. An input cavity is formed between the sealing layer 100 and the inflow layer 101 ; a variable pressure chamber 110 is formed between the inflow layer 101 and the vibrating substrate layer 106 ; an output cavity is formed between the vibrating substrate layer 106 and the casing layer 113 .

The sealing layer 100 is fixed on the side of the inflow layer 101 away from the vibrating substrate layer, and seals one side of the entire pump body. The side of the inlet layer 101 facing the sealing layer 100 is provided with a confluence chamber 103 and a plurality of strip-shaped inlet channels 102 ; the confluence chamber 103 is located at the center of the inlet layer 101 . One end of each channel 102 leads directly to the side surface of the inflow layer 101 to form an air inlet 115 on the side of the piezoelectric micropump; A through hole 105 communicating with the pressure changing chamber 110 is defined at the center of the confluence chamber 103 . The depth of the confluence cavity 103 is smaller than the thickness of the inflow layer 101, and the difference is 40 μm-60 μm; an elastic buffer zone with a thickness of only 40 μm-60 μm is formed between the side of the inflow layer 101 away from the sealing layer 100 and the confluence cavity 103 (Fig. In order to highlight the existence of the elastic buffer zone, its thickness is drawn larger, and its actual thickness is much smaller than that of the inflow layer 101).

The material of the inflow layer 101 is one or more of copper, silver, aluminum, and aluminum alloys, and when the thickness is relatively large (for example, 300 μm to 400 μm), it exhibits structural characteristics similar to rigid bodies in the piezoelectric micropump; its When the thickness is small (for example, 40 μm-60 μm), the piezoelectric micropump exhibits a large elastic structural characteristic, so that the elastic buffer zone integrally formed on the inflow layer 101 can play a role in buffering the vibration caused by the substrate layer 106. The effect of impact replaces the independent buffer layer in the prior art, while simplifying the piezoelectric micropump, it makes the structure of the piezoelectric micropump more compact, and improves the stability of the piezoelectric micropump in long-term use.

The plugging layer 108 fixed on the vibrating substrate layer 106 is aligned with the confluence cavity 103 of the inlet layer 101 , and the diameter of the plugging layer 108 is larger than that of the confluence cavity 103 .

The power supply terminals of the positive and negative electrodes are respectively placed on the inflow layer 101 and the power supply layer 111 , and are respectively electrically connected to opposite sides of the vibration layer 109 to realize power supply to the vibration layer 109 .

The inlet flow channel 102 on the inlet layer 101, the confluence cavity 103 and the flow hole 105 together form the input flow channel, and external air can enter the pump body through the inlet flow channel 102 on the side surface of the inlet layer 101. On the one hand, this structure can It allows external gas to be input from multiple directions; on the other hand, it can allow gas to be input from the side of the piezoelectric micropump, so that the end face of the piezoelectric micropump can be used to fix the micropump, thereby simplifying the installation of the piezoelectric micropump. The application scenarios of piezoelectric micropumps are broadened.

As shown in FIG. 5 , the sealing layer 100 has a side length of 10 mm to 20 mm and a thickness of 100 μm to 500 μm, and is fixed on the side of the inflow layer 101 away from the vibrating substrate layer 106 to seal the pump body. The material of the inlet layer 100 is one or a combination of copper, silver, aluminum, aluminum alloy, etc., which have relatively high thermal conductivity and low thermal expansion coefficient.

As shown in FIG. 6 , the inflow layer 101 is prepared by an etching process, the etching times are three times, and the thickness is less than 400 μm. The length of the inlet channel 102 is 6 mm-8 mm, and the thickness is less than 300 μm; the diameter of the confluence cavity 103 is 7 mm-10 mm, and the depth is 300 μm-400 μm. The diameter of the flow holes 105 ranges from 10 μm to 50 μm. On the outside of the inflow layer 101 is the lower power supply terminal connected to the power supply, which supplies power to the surface of the vibrating layer 109 near the inflow layer 101 due to the conductivity of the metal. The material of the inflow layer 101 may be one of copper, silver, aluminum, aluminum alloy, etc. or a combination of multiple materials.

As shown in Figures 7 and 8, the side length of the vibration substrate layer 106 is 10 mm to 20 mm, the thickness is 50 μm to 500 μm, and the material is stainless steel 304, 430, 429, Ni42, Ni36, copper, silver, aluminum, and aluminum alloy. One or more of the materials whose thermal expansion coefficient is 5-10um/(m*k), Young's modulus is 190-220GP, and Vickers hardness is 250-280HV.

The vibrating substrate layer 106 includes an edge fixing part, an elastic connecting piece 107 and a central vibrating part. The edge of the central hole of the edge fixing part is connected to the outer edge of the central vibrating part through an elastic connecting piece 107 . The elastic connecting member 107 includes a first connecting portion, a second connecting portion and an elastic section. Wherein, the elastic section is arc-shaped, with a length of 6mm-8mm and a thickness of 0.2mm-0.3mm. One end of the first connecting part is connected to the central vibrating part, and the other end of the first connecting part is connected to one end of the elastic section. One end of the second connecting part is connected with the other end of the elastic section; the other end of the second connecting part is connected with the edge fixing part. The elastic connectors 107 are elastic and non-linear metal strips. The central vibrating part of the vibrating substrate layer 106 is elastically supported on the four edges of the edge fixing parts through four elastic connectors 107 (distributed at 90 degrees between the elastic connectors). connection points; thus allowing the central vibrating part to vibrate up and down relative to the edge fixed parts.

The blocking layer 108 and the vibrating substrate layer 106 are integrally formed; the blocking layer 108 is formed by etching the edge of the side of the central vibrating part of the vibrating substrate layer 106; the blocking layer 108 has a diameter of 2mm-5mm and a height of 10μm-50μm.

The vibrating layer 109 is a piezoelectric material with a diameter of 3mm-6mm and a thickness of 50μm-300μm, which is bonded to the side of the central vibrating part of the vibrating substrate layer 106 away from the barrier layer 102; The material is one or more of aluminum nitride, scandium-doped aluminum nitride, zinc oxide, lithium nickelate or lead zirconate titanate, especially PZT4. The vibrating layer 109 and the vibrating substrate layer 106 are specifically bonded by one-component or two-component epoxy resin glue.

As shown in Figure 9, the upper power supply layer 111 is the upper power supply layer responsible for supplying power to the surface of the vibration layer 109 away from the vibration substrate layer 106 on the vibration substrate layer, and its internal terminal 112 is connected to the vibration node of the vibration layer 109 by welding The place where the vibration amplitude is the smallest, and its material is one or more of copper, silver, gold and other excellent conductive properties, especially red copper T2.

The side length of the shell layer 113 is 10 mm to 20 mm, and a material with a high hardness coefficient is selected, such as one or more of copper, silver, aluminum, and aluminum alloy, and is processed by 3D printing or CNC machining, and An air outlet 114 communicating with the output chamber is opened at its central position. The inner side edge of the housing layer 113 is fixed to the edge of the vibrating substrate layer 106, and is not in contact with the vibrating layer 109. The variable pressure chamber 110 on the vibrating substrate layer 106 and the air outlet hole 114 on the housing layer 113 pass through the output cavity Connected to form the output channel of the pump body.

The vibrating substrate layer 106, the blocking layer 108 and the vibrating layer 109 form a piezoelectric vibrator, and the power supply terminals of the inflow layer 101 and the power supply layer 111 are respectively applied with a peak value of 20Vpp, a first-order resonance frequency (about 23kHz), and a phase difference of 180°. Rectangular wave signal, when the vibrating layer 109 receives the first half of the excitation signal, due to the inverse piezoelectric effect, it drives the central vibrating part of the vibrating substrate layer 106 to move toward the shell layer 113, forcing the blocking layer 108 to separate from the inflow layer 101, thus During vibration, the deformation of the substrate layer 106 increases the volume of the variable pressure chamber 110 , and the external fluid is sucked into the input flow channel and the variable pressure chamber 110 through the inlet flow channel 102 , the confluence cavity 103 , and the flow hole 105 . The fluid in the output channel is forced to eject from the injection port to form propulsion.

When the vibrating layer 109 receives the second half of the excitation signal, also because of the inverse piezoelectric effect, it drives the central vibrating part of the vibrating substrate layer 106 to move toward the inflow layer 101, forcing the blocking layer 108 against the through hole 105, thereby blocking The air inlet hole, at this moment, the deformation of the vibrating substrate layer 106 reduces the volume of the pressure changing chamber 110, and the fluid in the pressure changing chamber 110 is input to the output channel. Therefore, applying a periodic alternating voltage to the vibrating layer 109 can enable the one-way transmission of the fluid in the cavity, and the one-way flow can be continuously generated at the air outlet 114 .

The inlet flow channel 102 provided on the inlet layer 101 is to make the structure of the micropump more compact and low under the condition of ensuring gas circulation. The quantity and area of the intake air passages 102 are not limited to three long strips, and the flow and quality of the micropump can achieve ideal results for the intake air passages of different numbers and sizes.

Example 2

A piezoelectric micropump with high-flow lateral air intake, the difference between this embodiment and Embodiment 1 is that this embodiment does not have a sealing layer 100, and a buffer layer 104 is added.

As shown in FIG. 10 , in this embodiment, the inlet layer 101 , the buffer layer 104 , the vibrating substrate layer 106 , the upper power supply layer 111 , and the housing layer 113 are stacked in sequence.

The confluence cavity 103 and a plurality of strip-shaped intake air passages 102 are set on the side of the intake layer 101 close to the buffer layer 104 . The flow holes 105 are not arranged on the inflow layer 101 , but are arranged on the buffer layer, and are aligned with and communicate with the center of the confluence chamber 103 . The buffer layer 104 is made of metal with a thickness of 40 μm-60 μm, and is preferably elastic material such as 316L or 316.

As shown in Figures 11 and 12, the side of the inflow layer 101 close to the buffer layer is provided with a plurality of storage chambers that are staggered from the inlet flow channels 102; the buffer layer is provided with through grooves aligned with the storage chambers, The storage chambers are communicated with the variable pressure chamber 110 formed between the inflow layer 101 and the vibrating substrate layer 106; thereby increasing the volume of the variable pressure chamber 110 and increasing the output capacity of the piezoelectric micropump. A single storage chamber is arc-shaped, has a length of 3 mm to 5 mm, and a depth of less than 300 μm.

In this embodiment, the piezoelectric micropump takes in air from the side.

In this embodiment, the omission of the sealing layer 100 makes the structure of the pump body more compact. The buffer layer 104 can ensure that the blocking layer 108 can better seal the intake air passage and reduce the impact when the pump body shrinks, so that the entire pump body can maintain high sealing performance during operation.

Claims (10)

1. A piezoelectric micropump with high-flow lateral air intake, comprising sequentially laminated sealing layer (100), inflow layer (101), vibration substrate layer (106), housing layer (113), and fixed on The vibration layer (109) on the vibration substrate layer (106); it is characterized in that: an input cavity is formed between the sealing layer (100) and the inflow layer (101); the inflow layer (101) and the vibration substrate layer (106) A variable pressure chamber (110) is formed between them; an output chamber is formed between the vibrating substrate layer (106) and the shell layer (113); The side of the inlet layer (101) facing the sealing layer (100) is provided with a confluence cavity (103), and one or more strip-shaped inlet channels (102); one end of the inlet channel (102) is connected to To the edge of the inflow layer (101), an air inlet (115) is formed; the other end of each flow channel (102) is connected to the confluence chamber (103); a flow hole (105) is opened in the confluence chamber (103) ); an elastic buffer zone with a thickness of 40 μm to 60 μm is formed between the side of the inflow layer (101) away from the sealing layer (100) and the confluence cavity (103); the material of the inflow layer (101) is metal. 2. A piezoelectric micropump with high-flow lateral air intake according to claim 1, characterized in that: the side of the inflow layer (101) close to the vibrating substrate layer (106) is provided with an inlet and outlet A plurality of storage chambers in which the air flow channel (102) is staggered. 3. A piezoelectric micropump with high-flow lateral air intake, comprising sequentially stacked inflow layer (101), buffer layer (104), vibration substrate layer (106), housing layer (113), and fixed on The vibration layer (109) on the vibration substrate layer (106); it is characterized in that: an input cavity is formed between the described inflow layer (101) and the buffer layer (104); the inflow layer (101) and the vibration substrate layer ( 106) to form a variable pressure chamber (110); an output cavity is formed between the vibration substrate layer (106) and the shell layer (113); The side of the inlet layer (101) close to the buffer layer (104) is provided with a confluence chamber (103), and one or more strip-shaped inlet flow passages (102); one end of the inlet flow passage (102) is connected to To the edge of the inlet layer (101), an air inlet (115) is formed; the other end of each flow channel (102) is connected to the confluence chamber (103); the buffer layer (104) is provided with a flow hole (105 ); the flow hole (105) is aligned with and communicated with the center of the confluence chamber (103); the buffer layer is made of metal with a thickness of 40 μm-60 μm. 4. A piezoelectric micropump with high-flow lateral air intake according to claim 2, characterized in that: the side of the inflow layer (101) close to the buffer layer is provided with an air intake channel (102 ) a plurality of storage chambers staggered; on the buffer layer aligned with each storage chamber, there are through grooves, so that each storage chamber communicates with the pressure-transforming chamber (110). 5. A piezoelectric micropump for high-flow lateral air intake according to any one of claims 1 to 4, characterized in that: the confluence cavity (103) is located at the center of the inflow layer (101) Location. 6. A piezoelectric micropump with high-flow lateral air intake according to any one of claims 1 to 4, characterized in that: the vibrating substrate layer (106) faces towards the inflow layer (101) A blocking layer (108) is fixed on the side; the blocking layer (108) is aligned with the confluence cavity (103) of the inflow layer (101), and the diameter of the clogging layer (108) is greater than that of the confluence cavity (103). 7. A piezoelectric micropump with high-flow lateral air intake according to any one of claims 1 to 4, characterized in that: the blocking layer (108) and the vibrating substrate layer (106) are integrally formed . 8. A piezoelectric micropump with high-flow lateral air intake according to any one of claims 1 to 4, characterized in that: the length of the air intake channel (102) is 6 mm to 8 mm, and the thickness less than 300 μm; the diameter of the confluence chamber (103) is 7 mm to 10 mm, and the depth is 300 μm to 400 μm. 9. A piezoelectric micropump with high-flow lateral air intake according to any one of claims 1 to 4, characterized in that: the vibrating substrate layer (106) includes edge fixing parts, elastic connectors (107) and the central vibrating part; the central hole edge of the edge fixing part is connected by an elastic connector (107) between the outer edge of the central vibrating part; the elastic connector (107) includes a first connecting part, a second connecting part and Elastic segment; one end of the first connecting part is connected with the central vibration part, the other end of the first connecting part is connected with one end of the elastic segment; one end of the second connecting part is connected with the other end of the elastic segment; the other end of the second connecting part Connected with the edge fixing part; one end of the first connecting part is connected with the central vibrating part, the other end of the first connecting part is connected with one end of the elastic segment; one end of the second connecting part is connected with the other end of the elastic segment; the second connecting part The other end of the other end is connected with the edge fixing part; the elastic section is arc-shaped, and the position of the center of the circle coincides with the center point of the central vibrating part. 10. A piezoelectric micropump with high-flow lateral air intake according to any one of claims 1 to 4, characterized in that: a vibrating substrate layer (106) and a housing layer (113) are provided with The upper power supply layer (111); the vibration layer (109) is made of piezoelectric ceramics; the side of the vibration layer (109) away from the vibration substrate layer (106) is drawn to the first power supply terminal through the upper power supply layer (111); The side of the vibrating layer (109) facing the vibrating substrate layer (106) leads out the second power supply terminal through the barrier layer (102).