CN116638851A - Separation device and separation method for flexible display substrate production - Google Patents

Abstract

The invention relates to the technical field of display production and processing, in particular to a separation device and a separation method for flexible display substrate production, wherein the separation device comprises an adhesive conveying substrate and a substrate separation device, the adhesive conveying substrate consists of a flexible substrate, a base substrate and an adhesive, the base substrate consists of a glass substrate and a quartz substrate, the substrate separation device comprises a heat supply device, a liquid injector and a chemical solution, and the heat supply device consists of an electric heating plate and a microwave oven; the present invention can easily diffuse the chemical solution to the whole surface of the bonding interface by the heat generating device provided in the substrate separating device, so that the flexible substrate can be easily peeled from the adhesive, and in addition, the device can effectively prevent the flexible substrate from being deformed and damaged during the formation of the flexible display device, and simultaneously prevent the damage of the pattern caused by the impact transferred to the pattern such as the thin film formed on the flexible substrate.

Description

Separation device and separation method for flexible display substrate production

Technical Field

The invention relates to the technical field of display production and processing, in particular to a separation device and a separation method for flexible display substrate production.

Background

In modern information society, the image industry has an increasing demand for larger display size, purer screen and various functions. In addition, information needs to be recorded and exchanged freely at any time, and thus a portable and lightweight display is required. The glass substrate used in the existing flat panel display is formed to a predetermined thickness and has a disadvantage of being easily broken due to the nature of glass. Therefore, when applied to a mobile display or a large display, an additional protection window is required. In addition, the glass substrate has a disadvantage of being difficult to bend. Therefore, the flexible substrate overcomes the defect that the glass substrate is difficult to bend, is not broken, and has bending characteristics. Accordingly, technical development is underway for a flexible display device which is ultra-light and portable with the above characteristics as a substrate. In order to realize a flexible display device, a flexible substrate such as plastic or metal foil is used. However, it may be difficult for the flexible substrate to satisfy the applicability of the existing process because flexibility is a characteristic different from that of the hard glass substrate of the existing display device. That is, the flexibility is because patterns (thin film transistors having a layered structure, a plurality of lines, and the like) may be formed on the flexible substrate, and pattern alignment difficulties may occur.

Accordingly, a conveying technique capable of performing conveyance and processing by adhering a flexible substrate to a hard shape such as a glass substrate has been proposed. Fig. 1 is a perspective view illustrating a conventional adhesive carrier substrate, and fig. 2 is a view illustrating a process of separating a flexible substrate from the conventional adhesive carrier substrate.

As shown in fig. 1, the adhesive transfer substrate (501) may be formed by providing an adhesive (530) on a base substrate (520) and adhering a flexible substrate (510) to the adhesive (530).

The base substrate (520) is formed into a hard shape, such as a glass substrate. Due to the flexible nature of the flexible substrate (510), the base substrate (520) may have difficulty in transporting and handling only the flexible substrate (510).

Accordingly, the flexible substrate (510) is adhered to the base substrate (520) to maintain the shape of the flexible substrate (510). Accordingly, the ease of transporting the flexible substrate (510) and the safety of the process can be ensured.

An adhesive (530) is formed between the base substrate (520) and the flexible substrate (510). The adhesive (530) acts as an intermediate material capable of adhering the flexible substrate (510) to the substrate (520) while adhering to the substrate (520). That is, the pressure sensitive adhesive (530) makes it possible to maintain the shape of the flexible substrate (510) along the flat shape of the base substrate (520).

The flexible substrate (510) is a substrate having flexibility. Accordingly, a plurality of patterns may be formed on the flexible substrate (510), and then the flexible substrate (510) may be separated from the base substrate (520) to form a flexible display device.

In this way, the flexible substrate (510) on which the flexible display device can be formed is adhered to the substrate (520) to provide an adhesive transfer substrate (510) capable of easily performing transfer and manufacturing processes.

Here, by transferring the substrate (501) using an adhesive, a transfer and cleaning process of the flexible substrate (510), a pattern forming process, and the like may be performed.

And when a pattern is formed on the flexible substrate (510) through a pattern forming process or the like, the flexible substrate (510) is separated from the adhesive (530) to form a flexible display device using the flexible substrate (510). As shown in the separation process of the flexible substrate in fig. 2, the flexible substrate (510) is adhered to the substrate (520) on the adhesive transfer substrate (501) by an adhesive (530) as an intermediate material.

The adhesive transfer substrate (501) is a cleaning process for cleaning a flexible substrate (510) provided on a base substrate (520), a process for forming a pattern on the flexible substrate (510), or the like. Substrate (510) to production system equipment, etc.

The flexible substrate (510) may be transferred and the manufacturing process may be performed using the adhesive transfer substrate (501). Here, a pattern such as a thin film may be formed on the flexible substrate (510) through a manufacturing process or the like.

Further, the flexible substrate (510) having the pattern formed thereon is separated from the pressure-sensitive adhesive carrier substrate (501), and a flexible display device can be formed using the separated flexible substrate (510).

Here, when the flexible substrate (510) is separated from the adhesive transfer substrate (501), a detachable chemical (625) is used. The detachable chemistry (625) may be injected into the adhesive interface to which the adhesive (530) and the flexible substrate (510) are adhered using a chemistry injector (620).

The desorption liquid (625) may be injected from a plurality of directions of the flexible substrate (510), but when the desorption liquid (625) is injected from a plurality of directions, the consumption amount of the desorption liquid (625) increases, which increases the manufacturing cost.

Fig. 3A is a plan view showing a phenomenon in which a conventional detachable chemical is transferred from an adhesive carrier substrate to an adhesive interface, and fig. 3B is a view showing a process of separating a flexible substrate from a conventional adhesive carrier substrate.

As shown in fig. 3A, to separate the flexible substrate (625) from the glue delivery substrate (501), a chemical liquid injector (620) from one side of the glue delivery substrate (501) is used to remove the chemical solution (625).

A release liquid (625) is injected into the adhesive interface between the adhesive 530 and the flexible substrate (510). The desorbing fluid (625) may dissolve the adhesive interface of the adhesive (530) with a solvent, such as a solvent. In addition, the desorption liquid (625) improves wettability of the glue interface, thereby facilitating adhesion of the glue (530) and detachment of the flexible substrate (510).

Here, to facilitate separation of the flexible substrate (510), a release liquid (625) is transferred to the front side of the adhesive (530) to improve wettability of the adhesive interface. However, the desorption chemical solution (625) needs a predetermined time to be transferred to the entire surface of the adhesive interface. That is, the working time may be increased by the time required for the desorption chemical solution (625) to be delivered to the front surface of the adhesive interface.

In addition, the desorption liquid (625) should be diffused to the entire surface of the adhesive interface, but there may be a case where the desorption liquid (625) is not gradually transferred to the section interface.

As in the desorption process shown in fig. 3B, a desorption solution (625) is provided to the adhesive interface of the pressure-sensitive adhesive carrier substrate such that the desorption solution (625) spreads over the pressure-sensitive adhesive (530).

Here, it may be difficult to transfer the desorption liquid (625) to the front surface of the adhesive (530) due to the adhesive force of the adhesive (530). Thus, a region (a') to which the desorption liquid (625) cannot be delivered is generated. That is, in the region (a') where the desorption liquid (625) cannot reach, the adhesive (530) and the flexible substrate (510) are adhered to each other with a predetermined adhesive force.

Accordingly, when the flexible substrate (510) bonded with a predetermined adhesive force is separated from the adhesive (530), a force corresponding to the adhesive force is provided to separate the flexible substrate (510) from the adhesive (530).

In this case, providing a force for separating the flexible substrate (510) may transmit an impact to the flexible substrate (510). The impact generated by the force transferred to the flexible substrate (510) may be transferred to a pattern such as a thin film formed on the flexible substrate (510). The impact may peel a pattern such as a film from the surface of the flexible substrate (510). Therefore, film defects such as thin films formed on the flexible substrate (510) may be caused due to the impact generated by the region a' to which the desorption liquid (625) is not transferred. In addition, when the flexible substrate (510) is separated from the adhesive (530) due to the adhesive force formed between the adhesive (530) and the flexible substrate (510) in the region a', the flexible substrate (510) may be damaged or deformed.

As such, there is a problem in that deformation and damage of the flexible substrate (510) may cause a working loss due to a non-transfer region (a') of the desorption chemical solution (625) or a defective film.

Disclosure of Invention

The invention aims to provide a separation device and a separation method for producing a flexible display substrate, which are used for solving the problems in the background technology.

In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a flexible display base plate production is with separator, includes adhesive delivery base plate and base plate separator, and adhesive delivery base plate comprises flexible substrate, base substrate and adhesive, base substrate comprises glass substrate and quartz substrate, base plate separator includes heating device, liquid injector and chemical solution, heating device comprises electric plate and microwave oven.

A separation method for flexible display substrate production comprises the following steps:

A. firstly, keeping a flexible substrate in a preset shape, setting a base substrate as a glass substrate and a quartz substrate, coating an adhesive on the surface of the base substrate, and attaching the flexible substrate on the base substrate, wherein the adhesive is a pressure-sensitive adhesive;

B. coating release paper on the surface of the adhesive, carrying out lamination process on the adhesive to improve the adhesive force between the adhesive and the base substrate, and carrying out lamination process for a plurality of times to form the adhesive and the flexible substrate into a sheet in the process of forming the flexible substrate and the pressure-sensitive adhesive;

C. a process of forming a pattern on a flexible substrate using an adhesive delivery substrate, and separating the flexible substrate from the adhesive to form a flexible display device, while a heating device is capable of supplying heat to the flexible substrate, while a chemical solution is supplied to the adhesive delivery substrate through a chemical injector, the chemical solution is injected between the adhesive and the flexible substrate, and the pressure sensitive adhesive is dissolved.

Preferably, in the step a, the adhesive is a pressure sensitive adhesive, and the adhesive itself may have fluidity.

Preferably, in the step a, the adhesive has a predetermined adhesive viscosity to adhere the adherend.

Preferably, in the step a, the adhesive has a property of being not affected by the desorption liquid or the like, but when the releasable desorption liquid is provided on the adhesive interface, the adhesive can be released from the adherend.

Preferably, in the step B, release paper is coated on one or both sides of the adhesive, and the adhesive is rolled during the coating process.

Preferably, in the step B, the adhesive forms a film on the base substrate and has a uniform adhesive force.

Preferably, in the step C, the chemical solution is acetone or methyl pyrrolidone.

Preferably, in the step C, the heat supplied from the heat supply device activates liquid molecules of the chemical solution to improve fluidity of the chemical solution, and the chemical solution does not spread to the entire surface of the adhesive interface.

Preferably, in the step C, when the heat supply device supplies heat to the adhesive delivery substrate, liquid molecules of the chemical solution are activated to improve fluidity, and as mobility of the chemical solution increases, internal energy increases, interface contact energy increases, thereby facilitating gradual movement of the chemical solution along the interface of the adhesive.

Compared with the prior art, the invention has the following beneficial effects:

the present invention can easily diffuse the chemical solution to the whole surface of the bonding interface by the heat generating device provided in the substrate separating device, so that the flexible substrate can be easily peeled from the adhesive, and in addition, the device can effectively prevent the flexible substrate from being deformed and damaged during the formation of the flexible display device, and simultaneously prevent the damage of the pattern caused by the impact transferred to the pattern such as the thin film formed on the flexible substrate.

Drawings

Fig. 1 is a perspective view showing a conventional adhesive carrier substrate.

Fig. 2 is a view one showing a process of separating a flexible substrate from a conventional adhesive transfer substrate.

Fig. 3a is a second view showing a process of separating a flexible substrate from a conventional adhesive transfer substrate.

Fig. 3b is a view illustrating a process of separating a flexible substrate from a conventional adhesive transfer substrate.

Fig. 4a is a plan view showing an adhesive carrier substrate according to the present invention.

Fig. 4b is a cross-sectional view taken along line IV-IV' of fig. 4 a.

Fig. 5 is a view showing a substrate peeling apparatus according to the present invention.

Fig. 6 is a view showing a chemical solution moved on an adhesive carrier substrate by the substrate separating apparatus of the present invention.

Fig. 7 is a view showing another embodiment of a heating device provided in the substrate peeling apparatus according to the present invention.

Fig. 8A to 8g are diagrams schematically showing processes for forming an adhesive transfer substrate and for attaching and detaching a flexible substrate according to the present invention.

In the figure: 1. an adhesive delivery substrate; 10. a flexible substrate; 20. a base substrate; 30. an adhesive; 100. a substrate separating device; 110. a heating device; 120. a liquid injector; 125. a chemical solution; 210. and (3) a pattern.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

Embodiment one:

in order to use the flexible substrate as a substrate of a display device, it is preferable to satisfy characteristics required for the existing display device. Accordingly, it is desirable to be able to utilize the infrastructure of existing factories by satisfying characteristics corresponding to those of existing glass substrates and satisfying applicability of existing hard display device processes. Fig. 4A is a plan view showing an adhesive carrier substrate according to the present invention, and fig. 4B is a sectional view taken along line IV-IV' of fig. 4A. As shown in fig. 4A, the adhesive transporting substrate 1 has a flexible substrate 10 having flexibility adhered to a base substrate 20.

The flexible substrate 10 is a substrate having flexibility, such as plastic or metal foil. The flexible substrate 10 is not broken and has bending characteristics. Therefore, an ultra-light, portable flexible display device can be formed using the substrate having the above characteristics.

The flexible substrate 10 is a substrate having flexibility, and is a substrate on which a pattern or the like is formed later. However, since the flexible substrate 10 has flexibility, when a process of forming a pattern on the flexible substrate 10 is performed, it may be difficult to align and form a switching device having a stacked structure due to the flexibility characteristics.

Therefore, in order to easily perform processes such as alignment and conveyance of the flexible substrate 10, it is preferable to allow the flexible substrate 10 to maintain a predetermined shape.

Accordingly, the base substrate 20 can be provided as a shape-retaining substrate having a hard shape such as a glass substrate or a quartz substrate. The base substrate 20 is a substrate capable of maintaining the shape of the flexible substrate 10.

In this way, the flexible substrate 10 is attached to the base substrate 20 to maintain the shape of the flexible substrate 10. Accordingly, the ease of transportation of the flexible substrate 510 and the stability of the manufacturing process of the flexible display device can be ensured.

As shown in fig. 4B, the adhesive transfer substrate 1 includes a flexible substrate 10 having a flexible characteristic, a base substrate 20 capable of maintaining the shape of the flexible substrate 10, and the base substrate 20 is provided with an adhesive 30 for adhesion. Flexible substrates 10 to.

Since the flexible substrate 10 is flexible, it may be difficult to align patterns on the flexible substrate 10 and perform a process of transferring the flexible substrate 10. Therefore, by providing the base substrate 20 having a hard shape capable of maintaining a shape on the adhesive transfer substrate 1, it is possible to solve the difficulty of the transfer process and the like.

Further, an adhesive 30 capable of adhering the flexible substrate 10 to the base substrate 20 may be disposed between the flexible substrate 10 and the base substrate 20. In this way, the flexible substrate 10 is adhered to the adhesive 30 on the base substrate 20.

The pressure sensitive adhesive 30 may be used as an intermediate material that enables the flexible substrate 10 to adhere to the substrate 20. The adhesive 30 must have a predetermined adhesive viscosity to adhere the adherend. Here, the adhesive 30 may form a strong adhesive force in a direction in which it adheres to the base substrate 20, and may form a weak adhesive force between the flexible substrate 10 and the adhesive 30.

The pressure sensitive adhesive 30 is an adhesive, and the adhesive 30 itself may have fluidity as compared to a cured and bonded adhesive. Here, the pressure-sensitive adhesive 30 itself has a property of being not affected by a desorption liquid or the like, but when a releasable desorption liquid is provided on the adhesive interface, it can be released from the adherend.

And a release paper is provided on the surface of the pressure sensitive adhesive 30. Thus, the pressure sensitive adhesive 30 is coated with release paper. Release coatings are those that form a thin cured film on a substrate, such as paper, to release the adhesive material. In addition, release paper may be coated on one or both sides of the pressure sensitive adhesive 30 to protect the pressure sensitive adhesive 30 until it is used. The release paper also meets various requirements during processing while protecting the pressure-sensitive adhesive 30, so that the release paper has the characteristics of proper release force, long-term storage of the pressure-sensitive adhesive 30, crimping resistance and the like. The shape of the pressure sensitive adhesive 30 can be maintained. Here, the pressure-sensitive adhesive 30 may be subjected to a lamination process by rolling the pressure-sensitive adhesive 30. In this way, by performing the lamination process, the adhesion force of the adhesive 30 to the base substrate 20 can be improved. In addition, the pressure-sensitive adhesive 30 may form a film on the base substrate 20 and may have uniform adhesive force anchoring.

The adhesive 30 adheres to the base substrate 20 and the flexible substrate 20 adheres to the adhesive 30 to prevent the flow of the flexible substrate 20 and a flat plate such as the substrate 20, which allows it to maintain its shape.

Also here, in forming the flexible substrate 10 and the pressure-sensitive adhesive 30, a lamination process (lamination) may be performed a plurality of times to form the pressure-sensitive adhesive 30 and the flexible substrate 10 into a sheet.

In this way, the adhesive transfer substrate 1 is adhered to the base substrate 20, so that the flexible substrate 10 can be easily transferred. Further, since the flexible substrate 10 can maintain a predetermined shape, a manufacturing process of forming a pattern on the flexible substrate 10 can be easily performed.

Then, a process of forming a pattern on the flexible substrate 10 using the pressure-sensitive adhesive transfer substrate 1 is performed, and the flexible substrate 10 is separated from the pressure-sensitive adhesive 30 to form a flexible display device.

Here, the flexible substrate 10 is adhered to the base substrate 20 by an adhesive 30. Therefore, in order to form the flexible display device, the flexible substrate 10 must be separated from the adhesive 30.

In this way, the adhesive 30 adheres the flexible substrate 10 with a predetermined adhesive force. Accordingly, the flexible substrate 10 is separated from the pressure sensitive adhesive 30 using a chemical solution capable of reducing adhesive force.

Fig. 5 is a view showing a substrate separating apparatus according to the present invention, and fig. 6 is a view showing a chemical liquid moved on an adhesive transfer substrate by the substrate separating apparatus according to the present invention.

Here, as one embodiment of the substrate peeling apparatus, peeling of a flexible substrate provided on an adhesive carrier substrate with reference to fig. 4A and 4B will be described.

As shown in fig. 5, when the glue transfer substrate 1 performs a manufacturing process such as patterning on the flexible substrate 10, the flexible substrate 10 adhered by the glue 30 will be peeled off. For this purpose, a substrate separating apparatus 100 capable of separating the flexible substrate 10 may be provided.

The substrate separating apparatus 100 is a heat supplying apparatus that can supply heat to the flexible substrate 10, and includes a hot plate 110 and a hot plate 110, and a chemical injector 120 that can supply a chemical solution 125 capable of dissolving the pressure-sensitive adhesive 30 to the pressure-sensitive adhesive transporting apparatus 1 is provided.

The chemical injector 120 may contain a chemical solution 125 and may provide the chemical solution 125 to the adhesive carrier substrate 1.

More specifically, the chemical solution 125 may be injected between the adhesive 30 of the adhesive transfer substrate 1 and the flexible substrate 10 as an adherend. Here, the chemical may be acetone (acetone), NMP, or the like.

Here, the chemical solution 125 is preferably a material capable of improving wettability of an interface of the adhesive 30 by dissolving the adhesive 30 as a dissolving agent. That is, the chemical solution 125 may reduce the adhesive viscosity by improving the wettability at the adhesive interface of the adhesive 30.

In this way, by reducing the adhesive viscosity of the adhesive interface of the adhesive 30, detachment of the flexible substrate 10 as an adherend, to which the flexible substrate 10 adheres, can be promoted.

Further, the substrate separating apparatus 100 may include a heat providing apparatus 110 capable of providing heat to the pressure sensitive adhesive 30. Here, the heating apparatus will be described using the hot plate 110 as an example.

The hot plate 110 is a means for generating heat and supplies the generated heat to the adhesive transfer substrate 1. Here, the adhesive transfer substrate 1 is in contact with a hot plate 110. In detail, the base substrate 20 of the adhesive transfer substrate 1 is in contact with the hot plate 110.

The heat supplied from the hot plate 110 may be transferred from the underlying substrate 20 to the pressure sensitive adhesive 30.

The heat supplied from the hot plate 110 reduces the adhesive force formed at the adhesive interface of the adhesive 30. That is, the viscosity of the adhesive may be reduced by reducing the viscosity of the adhesive 30 formed in the interface region of the adhesive.

Therefore, the adhesive force formed between the adhesive and the flexible substrate as an adherend can be reduced. Thus, the adherend can be easily separated from the adhesive.

In addition, the heat provided from the hot plate 110 may enhance the fluidity of the chemical solution 125 provided to the bonding interface. Referring to fig. 6, when heat is supplied to the pressure-sensitive adhesive carrier substrate 1, liquid molecules of the chemical solution 125 are activated to improve fluidity.

That is, as the mobility of the chemical solution 125 increases, the internal energy increases and the interfacial contact energy increases, thereby facilitating the gradual movement of the chemical solution 125 along the interface of the adhesive 30. Therefore, the processing time for separating the flexible substrate 10 from the adhesive transfer substrate 1 can be shortened.

Here, the chemical solution 125 described above is injected into the adhesive interface of the adhesive 30. The chemical solution 125 is a liquid capable of dissolving the adhesive 30 to separate the flexible substrate 10 as an adherend from the adhesive 125.

However, the chemical solution 125 requires a predetermined time to provide the adhesive interface of the adhesive 30 to the front surface of the flexible substrate 10.

And when the adhesive force of the adhesive 30 is strong, only the adhesive force with the chemical solution 125 is reduced, so that it may be difficult to separate the flexible substrate 10.

Accordingly, the hot plate 110 as the heat providing means activates liquid molecules of the chemical solution 125 to improve fluidity and reduces adhesive viscosity of the adhesive interface of the adhesive 30 to reduce the chemical solution 125 may be provided on all surfaces of the adhesive interface.

That is, the heat provided by the hot plate 110 activates the liquid molecules of the chemical solution 125 to improve the fluidity of the chemical solution 125, and the chemical solution 125 does not spread to the entire surface of the adhesive interface.

Thus, the fluidity of the chemical solution 125 is improved so that the chemical solution can be uniformly transferred to the front surface of the adhesive interface along the adhesive interface.

Thus, in the process of separating the flexible substrate 10 as an adherend from the pressure-sensitive adhesive 30, by providing the substrate separating device 100 having the heat supplying device 110, the heat supplying device hot plate (which is a plate that can reduce the adhesive force of the adhesive 30 having strong adhesive force by the heat supplied from 110, and by promoting the transfer of the chemical solution 125 due to the heat supplied, it becomes possible for the adhesive 30 as an adherend to be flexible to facilitate the separation of the substrate 10.

Therefore, stability of the process of separating the flexible substrate 10 from the adhesive transfer substrate 1 can be ensured.

Embodiment two:

fig. 7 is a view showing another embodiment of the heat supply device provided in the substrate separating apparatus according to the present invention. Here, the pressure sensitive adhesive carrier substrate is shown in fig. 4A and 4B.

In the adhesive transfer substrate 1, the flexible substrate 10 is adhered to the adhesive 30. The pressure sensitive adhesive 30 is also attached to the base substrate 20 to maintain the shape of the flexible substrate 10.

The substrate peeling apparatus 100 includes a chemical injector 120 and a microwave oven 115 as a heating apparatus. The microwave oven 115 as a heating device is a device capable of supplying heat to the adhesive transfer substrate 1. Here, the heating apparatus will describe a microwave oven 115 capable of generating microwaves as another embodiment.

The chemical solution 125 provided in the chemical solution injector 120 may be injected into the adhesive interface between the adhesive 30 and the flexible substrate 10.

Here, unlike the method of transferring heat to the pressure-sensitive adhesive 30 by bringing the base substrate 20 into contact with the heat supply device 110 to transfer heat (see fig. 5), in this embodiment, the microwave oven 115 may be provided to supply heat to the pressure-sensitive adhesive 30.

That is, by forming the microwave oven 115 as the heat supply device of the substrate desorption device 100, heat can be transferred to the pressure-sensitive adhesive 30 in a non-contact manner with the pressure-sensitive adhesive transfer substrate 1. In this way, when heat is supplied to the pressure-sensitive adhesive transfer substrate 1, the heat is transferred to the pressure-sensitive adhesive 30 in a noncontact manner, thereby minimizing damage to the components constituting the pressure-sensitive adhesive transfer substrate 1.

Here, the microwave oven 115 may supply the chemical solution 125 to the chemical liquid injector 120 while supplying heat to the adhesive transfer substrate 1, or heat it with the microwave oven 115. After the provision, the adhesive transfer substrate 1 may be removed and the chemical solution 125 may be injected from the microwave oven 115.

Accordingly, by providing the substrate separating apparatus 100 equipped with the heat supplying apparatus 110 in the process of separating the flexible substrate 10 as an adherend from the adhesive 30, the microwave oven as the heat supplying apparatus can reduce the adhesive force of the adhesive 30 having strong adhesive force by the heat supplied from the 110, and the adhesive 30 in the adhesive 30 is an adherend because the supplied heat promotes the transfer of the chemical solution 125. Separation of the flexible substrate 10 may be facilitated.

Therefore, stability of the process of separating the flexible substrate 10 from the adhesive transfer substrate 1 can be ensured. Fig. 8A to 8F are diagrams schematically showing a process of forming an adhesive carrier substrate and separating a flexible substrate according to the present invention.

The flexible substrate is not broken and has bending characteristics. Accordingly, a flexible display device which is lightweight and portable can be formed using the substrate having the above characteristics.

Since the flexible substrate has flexibility, it may be difficult to continuously maintain a predetermined shape. Further, since the flexible substrate is flexible, it may be difficult to transport the flexible substrate at the time of transportation. In addition, when a switching device having a laminated structure is formed on a flexible substrate, patterns of the laminated structure must be aligned on the flexible substrate, but misalignment may occur due to flexibility of the flexible substrate. Therefore, in order to improve the stability and simplicity of the process, a process of forming a pattern or the like on a flexible substrate by adhering the flexible substrate to a hard substrate has been performed. In this way, the flexible display device can be formed by carrying out a carrying process or the like using the adhesive carrying substrate to which the flexible substrate is attached. As shown in fig. 8A, a base substrate 20 having a predetermined shape is prepared to form a pressure-sensitive adhesive carrier substrate to which a flexible substrate can be adhered, and an adhesive 30 is applied on the base substrate 20.

The base substrate 20 allows the flexible substrate having flexibility to maintain a predetermined shape during a manufacturing process of patterning, transferring, etc. the flexible substrate. Accordingly, processes such as alignment and transfer of the flexible substrate can be easily performed.

One of the adhesive 30 mixtures, the adhesive 30 itself has fluidity compared to the curing and bonding of the adhesive. Here, the pressure-sensitive adhesive 30 itself has a property of being less susceptible to a desorption liquid or the like, but peeling may occur when a liquid capable of desorption is provided at the adhesive interface.

And a release paper is provided on the surface of the pressure sensitive adhesive 30. Thus, the pressure sensitive adhesive 30 is coated with release paper. Release coatings are those that form a thin cured film on a substrate, such as paper, to release the adhesive material. In addition, release paper may be coated on one or both sides of the pressure sensitive adhesive 30 to protect the pressure sensitive adhesive 30 until it is used. The release paper also meets various requirements during processing while protecting the pressure-sensitive adhesive 30, so that the release paper has the characteristics of proper release force, long-term storage of the pressure-sensitive adhesive 30, crimping resistance and the like. The shape of the pressure sensitive adhesive 30 can be maintained.

Here, release papers may be provided on both sides of the pressure-sensitive adhesive 30. The lamination process may be performed on the pressure sensitive adhesive 30 by rolling the pressure sensitive adhesive 30. In this way, by performing the lamination process, the adhesion force of the adhesive 30 to the base substrate 20 can be improved. In addition, the pressure-sensitive adhesive 30 may be thinly formed on the base substrate 20 and may have uniform adhesive force adhesion (adhesive).

As shown in fig. 8B, the upper release paper of the adhesive 30 is peeled off, and the flexible substrate 10, which can form a flexible display device, is attached on top of the adhesive 30. Here, the flexible substrate 10 may also be subjected to a lamination process.

This is because the flexible substrate 10 can be prevented from forming a sheet shape on the adhesive 30 due to the flexibility of the flexible substrate 10.

In addition, both sides of the pressure sensitive adhesive 30 may have different adhesive strengths. As such, the reason why the double-sided tape 30 of different adhesive strengths is provided is that the interface adhered to the base substrate 20 is formed with a strong adhesive force to prevent peeling during the manufacturing process, and the flexible substrate 100 and the adhesive interface are because the flexible substrate 10 must be separated from the adhesive 30 to form the flexible display device when the manufacturing process of the pattern formed on the flexible substrate 10 is completed.

In this way, by disposing the adhesive 30 on the base substrate 20 and adhering the flexible substrate 10 to the adhesive 30, the adhesive transfer substrate 1 can be formed.

Accordingly, stability of the manufacturing process of the flexible display device can be ensured by the adhesive transfer substrate 1. As shown in fig. 8C, a flexible display device may be formed using the adhesive carrier substrate 1. Here, in order to form the flexible display device, the adhesive transfer substrate 1 is moved to the production system apparatus 200, such as a cleaning process and a patterning process.

The production system 200 may clean the adhesive transfer substrate 1 and may form a pattern on the flexible substrate 10 of the adhesive transfer substrate 1.

Here, if a process of forming a pattern on the pressure-sensitive adhesive carrier substrate 1 is described briefly, a film or the like may be formed by depositing a conductive material on the pressure-sensitive adhesive carrier substrate 1 by a deposition process to form a conductive film and photosensitive the shape of the formed conductive film.

The photosensitive pattern may be formed by exposing the photosensitive film and removing the photosensitive film classified as cured/uncured using chemicals. In addition, the shape of the conductive layer may be formed by using a conductive material as a barrier layer of the photosensitive pattern.

In this way, a pattern such as a thin film may be formed on the flexible substrate 10 by the production system apparatus 200 capable of performing a patterning process.

In addition, the flexible display device may be formed by separating the flexible substrate 10 from the adhesive transfer substrate 1.

As shown in fig. 8D, a pattern 210 such as a thin film may be formed on the adhesive transfer substrate 1 that has passed through the production system 200. The pattern 210 may be formed of a thin film transistor or a plurality of circuit lines. The pattern 210 is attached to the flexible substrate 10.

Further, the flexible substrate 1 having the pattern 210 formed thereon is separated from the adhesive 30 to form a flexible display device.

As shown in fig. 8E, a pattern 210 such as a film is formed on the flexible substrate on the adhesive transfer substrate 1 while passing through a manufacturing apparatus such as the production system 200.

Here, the flexible substrate 10 is separated from the base substrate 20, i.e., the adhesive 30, and a flexible display device may be formed using the separated flexible substrate 10.

Accordingly, there is provided a substrate separating apparatus 100 capable of separating the flexible substrate 10 from the adhesive 30, and a process of separating the flexible substrate 10 from the adhesive transfer substrate 1 is performed.

Here, in separating the flexible substrate 10 from the pressure-sensitive adhesive 30, a chemical solution may be used to prevent peeling, which is formed on the flexible substrate 10 and the pattern is peeled off.

The substrate separating apparatus 100 includes a chemical injector 120 for injecting a chemical 125 to an interface of the adhesive 30, and heats the adhesive 30 to reduce an adhesive viscosity of the adhesive 30. A heating apparatus 110 is provided.

Here, in order to form the flexible display device, the adhesive transfer substrate 1 needs to separate the flexible substrate 10 adhered to the adhesive 30. Here, since the flexible substrate 10 is adhered with a predetermined adhesive force by the adhesive 30, it is peeled off using the chemical solution 125 or the like, and the chemical solution 125 is applied to the front surface of the adhesive 30, and there is a possibility that the development occurs.

In this way, when the flexible substrate 10 is peeled off in a state where the adhesive 30 and the flexible substrate 10 are non-peelable areas, the adhesive force remains in the non-peelable areas. That is, in the process of separating the flexible substrate 10 from the adhesive 30, the influence of the release adhesive force may be transferred to the flexible substrate 10. Accordingly, the impact may be transferred to the pattern 210, for example, a thin film formed on the flexible substrate 10.

That is, the impact may cause a problem of peeling off the pattern 210 such as a film.

That is, since the pattern 210 such as a film is formed on the pressure-sensitive adhesive transfer substrate 1, it is preferable to minimize the transmission of the impact to the pattern 210 such as a film.

Accordingly, the substrate separating apparatus 100 having the heat providing apparatus 110 capable of increasing the mobility of the chemical solution 125 is provided. And the heat providing device 110 provides heat to the adhesive transfer substrate 1.

The heat provided by the heat supply device 110 may transfer heat to the interface of the pressure sensitive adhesive 30 to reduce the viscosity of the adhesive formed on the adhesive interface of the pressure sensitive adhesive 30.

And the heat supplied from the heat supply device 110 may also supply heat energy to the liquid molecules of the chemical solution 125. That is, the liquid molecules generate kinetic energy by the thermal energy, so that the fluidity of the chemical solution 125 can be improved by the kinetic energy. Here, heat may be used to reduce viscosity. In this way, the chemical solution 125 having thermal energy has increased fluidity and is easily diffused to the entire surface of the adhesive interface.

That is, as the viscosity decreases, the adhesive strength between the flexible substrate 10 and the adhesive 30 as an adherend may decrease. In addition, since the heat supply device 125 provides the energy required for the chemical solution 125 to flow, the chemical solution may spread over the entire surface of the adhesive interface. Accordingly, the flexible substrate 10 as an adherend can be easily separated from the pressure-sensitive adhesive 30.

As shown in fig. 8F, the flexible substrate 10 as an adherend is separated from the adhesive 30 of the adhesive transfer substrate 14 by the substrate separating device 100.

Here, since the heating device 110 of the substrate peeling apparatus 100 is used, the chemical solution 125 provided for peeling the flexible substrate 10 is uniformly distributed on the adhesive interface of the adhesive 30, and the adhesive 30 may reduce the adhesive force.

However, areas where the chemical solution 125 is not delivered may occur at the interface of the pressure sensitive adhesive 30. That is, the region to which the chemical solution 125 is not supplied becomes a region to bond the adhesive 30 and the flexible substrate 10.

In this way, when the flexible substrate 10 is separated from the adhesive 30 in a state of a residual part bonding region, a force for releasing the adhesive force of the adhesive 30 is transmitted to the flexible substrate 10 as an impact.

That is, the impact is transferred to the pattern 210 such as a thin film formed on the flexible substrate 10, and the transferred impact may peel off the pattern 210 such as a thin film on the flexible substrate.

However, in the present invention, the chemical solution 125 may be transferred to the entire surface of the adhesive interface through the heat supply device 110 provided in the substrate separation device 100.

In this way, the flexible substrate 10 can be safely and easily separated from the gel 30. Accordingly, deformation and damage of the flexible substrate 10 during formation of the flexible display device using the substrate separating device 100 can be prevented.

And the chemical solution 125 can be easily diffused to the front of the adhesive interface by the heat providing device 100 provided in the substrate separating device 100, so that a pattern such as a thin film formed on the flexible substrate 10 can be prevented. Damage due to the impact transmitted to 21. Therefore, stability of the manufacturing process of the flexible display device can be ensured.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (10)

1. A separation device for flexible display substrate production, comprising an adhesive delivery substrate (1) and a substrate separation device (100), characterized in that: the adhesive delivery substrate (1) is composed of a flexible substrate (10), a base substrate (20) and an adhesive (30), the base substrate (20) is composed of a glass substrate and a quartz substrate, the substrate separation device (100) comprises a heat supply device (110), a liquid injector (120) and a chemical solution (125), and the heat supply device (110) is composed of an electric heating plate and a microwave oven.

2. A separation method for flexible display substrate production is characterized in that: the method comprises the following steps:

A. firstly, keeping a flexible substrate (10) in a preset shape, setting a base substrate (20) as a glass substrate and a quartz substrate, coating an adhesive (30) on the surface of the base substrate (20), attaching the flexible substrate (10) on the base substrate (20), and enabling the adhesive (30) to be a pressure-sensitive adhesive;

B. coating release paper on the surface of the adhesive (30), and performing a lamination process on the adhesive (30) to improve the adhesion of the adhesive (30) to the base substrate (20), and performing a plurality of lamination processes to form the adhesive (30) and the flexible substrate (10) into a sheet in the process of forming the flexible substrate (10) and the pressure-sensitive adhesive (30);

C. a process of forming a pattern on a flexible substrate (10) using an adhesive delivery substrate (1), and separating the flexible substrate (10) from an adhesive (30) to form a flexible display device, while a heat supply device (110) is capable of supplying heat to the flexible substrate (10), while a chemical solution (125) is supplied to the adhesive delivery substrate (1) through a chemical injector (120), the chemical solution (125) is injected between the adhesive (30) and the flexible substrate (10), and the pressure sensitive adhesive (30) is dissolved.

3. The separation method for producing a flexible display substrate according to claim 2, wherein: in the step A, the adhesive (30) is a pressure-sensitive adhesive, and the adhesive (30) itself may have fluidity.

4. The separation method for producing a flexible display substrate according to claim 2, wherein: in the step A, the adhesive (30) has a predetermined adhesive viscosity to adhere the adherend.

5. The separation method for producing a flexible display substrate according to claim 2, wherein: in the step A, the adhesive (30) has a property of being not affected by the desorption liquid or the like, but when the releasable desorption liquid is provided on the adhesive interface, the adhesive (30) can be released from the adherend.

6. The separation method for producing a flexible display substrate according to claim 2, wherein: in the step B, release paper is coated on one side or both sides of the adhesive (30), and the adhesive (30) is rolled during the coating process.

7. The separation method for producing a flexible display substrate according to claim 2, wherein: in the step B, the adhesive (30) forms a film on the base substrate (20) and has a uniform adhesive force.

8. The separation method for producing a flexible display substrate according to claim 2, wherein: in the step C, the chemical solution (125) is acetone or methyl pyrrolidone.

9. The separation method for producing a flexible display substrate according to claim 2, wherein: in the step C, the heat supplied from the heat supply device (110) activates the liquid molecules of the chemical solution (125) to improve the fluidity of the chemical solution (125), and the chemical solution (125) does not spread over the entire surface of the adhesive interface.

10. The separation method for producing a flexible display substrate according to claim 2, wherein: in the step C, when the heat supply device (110) supplies heat to the adhesive delivery substrate (1), liquid molecules of the chemical solution (125) are activated to improve fluidity, and as mobility of the chemical solution (125) increases, internal energy increases and interface contact energy increases, thereby facilitating gradual movement of the chemical solution (125) along the interface of the adhesive (30).