CN116571875A - Laser processing and detecting integrated equipment and method based on active projection technology - Google Patents

Abstract

The invention discloses laser processing and detection integrated equipment and a detection method based on active projection technology, comprising a protective room, a laser processing device is arranged inside the protective room, and a camera is arranged on the side wall of the protective room; the laser processing device includes a base , a workbench is set above the base, and a laser generator and a galvanometer are set on the workbench; the laser generator and the galvanometer are connected through an optical system; a structured light projector is also set inside the protective room, and the structured light projection The instrument is set on the upper end of the side wall of the protective room. Through the device in the invention, the volume of the optical path is reduced, and the space occupied by the laser processing device is saved. The processed workpiece is detected by setting up a camera and a structured light projector, and whether there is an error in the processing of the workpiece can be obtained through the detection result, and adjusted and corrected according to the error information, so as to achieve the purpose of assisting the laser processing device in processing the workpiece and ensure the processing quality. and processing efficiency.

Description

Laser processing and detection integrated equipment and detection method based on active projection technology

technical field

The invention belongs to the technical field of laser processing, and in particular relates to integrated laser processing and detection equipment and a detection method based on active projection technology.

Background technique

Ultraviolet laser processing is realized by photochemical ablation, that is, relying on ultraviolet laser energy to break the bonds between atoms or molecules, transform them into small molecules, and gasify and evaporate them. The focused spot of ultraviolet laser is very small, and the processing heat-affected area is very small, so it can carry out ultra-fine engraving and special material processing. Ultraviolet laser processing uses a cold light source, the wavelength is only 355nm, the diameter of the focused spot is small, the absorption rate of various materials for ultraviolet light is high, and the thermal influence is also very small (negligible). This characteristic enables UV laser processing to achieve fine processing effects.

In the prior art, the ultraviolet laser processing equipment emits laser light from the laser, and then enters the inside of the galvanometer through the optical path system, and acts on the surface of the workpiece after being deflected and focused by the galvanometer. Since the laser generated by the laser cannot be transmitted through the optical fiber line, the optical path and The laser must be in the same plane. When adjusting the laser focal length, the relative positions of the laser, the optical path, and the galvanometer must remain unchanged. This will cause the entire optical path to take up a large space and cannot be used in some places with small spaces. At the same time, the weight of high-power lasers is relatively heavy. The lifting system that adjusts the focal length of the optical path must simultaneously drive the laser, optical path, and vibrating mirror to move together, so the load requirements for the lifting platform are relatively high.

When processing materials, laser has the characteristics of being able to process complex textures without introducing tool damage, but laser processing is prone to processing defects such as taper and corrugation in the actual application process, and the existence of the heat-affected zone will also cause oxidation of the workpiece, Delamination, cracking and other phenomena. Therefore, the present invention proposes a laser processing and detection integrated equipment and detection method based on active projection technology, which can detect the surface defects of the material when processing the material, and adjust and correct the laser processing process according to the detection information. The purpose of assisting the laser processing device in processing the workpiece is achieved.

Structured light 3D reconstruction is a 3D shape detection method based on optical principles and computer vision technology. It uses a structured light projector to project a specific coded light pattern onto the target object, and obtains the three-dimensional geometry of the object surface by capturing the light reflected or scattered by the object surface and analyzing its deformation information.

In the past, the 3D reconstruction of target objects often required the use of expensive laser scanners or complex photogrammetry systems to obtain their geometric information. However, with the development of computer vision and projection technology, structured light 3D reconstruction has become a more efficient and economical method, which is widely used in computer graphics, computer vision, virtual reality, industrial manufacturing and other fields. The basic principle of structured light 3D reconstruction is to project a structured light pattern (usually stripes or coded patterns) onto the target object, and then use a camera or sensor to capture the light reflected or scattered on the surface of the object, and analyze the captured light pattern Deformation on the surface of the object, the depth or three-dimensional coordinates of the object surface can be inferred.

Contents of the invention

The purpose of the present invention is to provide laser processing and detection integrated equipment and detection method based on active projection technology to solve the problem in the background technology that the optical path occupies a large space in the prior art and cannot be used in some places with small space. The lifting system that adjusts the focal length of the optical path must simultaneously drive the laser, the optical path, and the vibrating mirror to move together, and some high-power lasers are heavy, which requires a higher load on the lifting platform, and the actual application of laser processing in the process of forming Problems that errors cannot be detected in time, such as processing defects such as taper and ripple that are prone to occur during processing.

In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is:

Integrated laser processing and testing equipment based on active projection technology, including a protective room, where a laser processing device is installed inside the protective room;

The laser processing device includes a base, and a worktable is arranged above the base, and a laser generator and a vibrating mirror are arranged on the working table; wherein, the laser generator and the vibrating mirror are connected through an optical system; a processing table is also arranged on the working table , the processing table is set under the vibrating mirror, and the processing table is used to install the workpiece;

A structured light projector is arranged inside the protective room, and the structured light projector is set on the upper end of the side wall of the protective room; the structured light projector is used to project the coded stripes onto the surface of the workpiece, and a There are cameras, which are used to record images of deformed fringes that are highly modulated by the imaged workpiece.

According to the above technical solution, the optical path system includes an optical tube, a laser refracting tube, and a telescopic tube; wherein, the optical tube includes a first optical tube and a second optical tube, and the laser refracting tube includes a first refracting tube, a second refracting tube, and a third refracting tube. One end of the first light tube is connected with the laser generator, the other end of the first light tube is connected with the first refracting tube; one end of the second light tube is connected with the first refracting tube, and the other end of the second light tube is connected with the first refracting tube Two refractor connection;

The second refracting cylinder is connected with the third refracting cylinder through the telescopic cylinder, and the third refracting cylinder is connected with the vibrating mirror.

According to the above technical solution, the telescopic cylinder includes a first connecting section and a second connecting section; wherein, one end of the first connecting section is connected to the second refracting cylinder, the second connecting section is connected to the third refracting cylinder, and the first connecting section and the second refracting cylinder are connected. The two connecting sections are connected through a tubular organ cover.

According to the above technical solution, the workbench includes a fixing seat and a supporting column; wherein, the supporting column is fixedly arranged on the fixing seat, a beam is arranged above the supporting column, and the laser generator is fixedly arranged on the beam.

According to the above technical solution, a driving assembly is also arranged on the beam, and the driving assembly is used to drive the vibrating mirror to move up and down.

According to the above technical solution, the driving assembly includes a slide rail seat, a driving device and a mounting table; wherein, the slide rail seat is fixedly arranged on the beam, the driving device is arranged above the slide rail seat, and a lead screw is arranged inside the slide rail seat. The driving device is used to drive the screw to rotate;

The installation platform is slidingly connected with the slide rail seat, and the installation platform passes through the slide rail seat and is connected with the lead screw; the rotation of the lead screw drives the installation platform to move up and down; the oscillating mirror is fixedly arranged on the installation platform.

According to the above technical solution, the laser processing device further includes a dust removal device; the dust removal device is used to remove dust during laser processing.

According to the above technical solution, the dust removal device includes a dust collection hood, a dust collection pipe, and a dust collection box; wherein, the dust collection cover is arranged on the side of the processing table, and the opening of the dust collection hood is arranged facing the processing table; the dust collection box is arranged on the side of the base. On the side, the dust collection pipe is used to connect the dust collection hood and the dust collection box.

According to the above technical solution, a sliding platform, a first driving device and a second driving device are also arranged on the workbench; wherein, the processing table is arranged on the sliding platform, and the sliding platform is slidably connected to the workbench; the first driving device drives the sliding platform Move left and right on the worktable, and the second driving device drives the processing table to move back and forth on the sliding platform;

The first driving device includes a first motor and a first leading screw; the second driving device includes a second motor and a second leading screw; wherein, the first leading screw is rotated inside the workbench, and the sliding platform is arranged on the first rotating screw On the rod, the first motor drives the first lead screw to rotate; the second lead screw is arranged inside the sliding platform, the processing table is slidably arranged on the second lead screw, and the second motor drives the second lead screw to rotate.

The detection method of laser processing and detection integrated equipment based on active projection technology includes the following steps:

Step S1, placing the calibration board horizontally on the workbench for dual-target calibration;

Step S2, use the GeneratePattern algorithm to generate black and white stripes, write them into the structured light projector to project the surface of the workpiece, and collect the deformed stripes through the camera, so as to obtain the wrapping phase of the workpiece;

Step 3: Perform phase unpacking by the PhaseAnalyse algorithm, perform stereo matching on the images acquired by the two cameras (200) after dual-target positioning, and calculate the horizontal offset of the corresponding pixels in the left and right images, that is, the parallax, calculated according to the parallax information Analyze and obtain 3D information; step 4, use efficient and robust image processing and segmentation technology to perform preprocessing operations such as denoising, filtering, and registration on the collected 3D data; then import GOMSoftware for point cloud reconstruction, and reconstruct the points The cloud performs point cloud stitching, segmentation, feature extraction, gridding and other processing operations to obtain more complete and accurate surface texture geometric features and realize non-contact measurement;

Step 5. Compare the ideal point cloud image, use Halcon to analyze the taper, waviness and bending characteristics of the material laser processing surface, and feed back the feature position to the laser processing device to optimize the structural characteristics of the surface texture of the workpiece until the measurement plane It is flat with the target plane surface, without ups and downs or bumps, that is, the tolerance range is ±20μm, and at the bend, the angle change is less than or equal to 1°.

Compared with the prior art, the present invention has the following beneficial effects:

Through the device in the present invention, the laser generator and the vibrating mirror are arranged above the workbench, and the laser generator and the vibrating mirror are connected through the optical path system, which reduces the volume of the optical path and saves the space occupied by the laser processing device .

In addition, by setting a camera and a structured light projector inside the protective room, the encoded stripes are projected onto the surface of the imaged workpiece through the structured light projector, and then the deformed stripes are captured by the set camera, and the processed workpiece is processed Detection, through the detection results, it is found whether there is an error in the processing of the workpiece. When the detection result shows that there is an error in the processing of the workpiece, the error information is transmitted to the laser control center, and the laser control center adjusts and corrects the processing process according to the error information.

The purpose of assisting the laser processing device in processing the workpiece is achieved, thereby ensuring the processing quality and processing efficiency.

Description of drawings

Fig. 1 is the side view structural representation of overall structure of the present invention;

Fig. 2 is a schematic diagram of the overall front view structure of the present invention;

Fig. 3 is one of structural schematic diagrams of the laser processing device of the present invention;

Fig. 4 is the second structural diagram of the laser processing device of the present invention;

Fig. 5 is the partially enlarged schematic diagram of place A of the present invention;

6 is a schematic cross-sectional structure diagram of the drive assembly of the present invention;

Fig. 7 is a schematic diagram of the three-dimensional structure of the drive assembly of the present invention;

Fig. 8 is the point cloud analysis result figure that the workpiece processing of the present invention does not meet the requirements;

Fig. 9 is a diagram of point cloud analysis results of workpiece processing in the present invention meeting the requirements.

Marks in the figure: 100-protective room, 200-camera, 300-laser processing device, 400-base, 500-worktable, 600-laser generator, 700-galvanometer, 800-processing table, 900-structured light projector , 110-first light tube, 111-second light tube, 112-first refraction tube, 113-second refraction tube, 114-third refraction tube, 115-telescopic tube, 116-first connecting section, 117- The second connecting section, 118-tubular organ cover, 119-fixing seat, 120-supporting column, 121-beam, 122-driving assembly, 123-slide rail seat, 124-driving device, 125-installation platform, 126-lead screw , 127-dust removal device, 128-dust collection hood, 129-dust collection pipeline, 130-dust collection box, 131-sliding platform.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Embodiment one

As shown in Figure 1, the laser processing and detection integrated equipment and detection method based on active projection technology includes a protective room 100, a laser processing device 300 is arranged inside the protective room 100, and a camera is arranged on the side wall of the protective room 100 200, the camera 200 is used to record the deformed fringe image modulated by the height of the imaged workpiece;

As shown in Figure 2, the laser processing device 300 includes a base 400, a workbench 500 is arranged above the base 400, and a laser generator 600 and a vibrating mirror 700 are arranged on the workbench 500; wherein, the laser generator 600 and the vibrating mirror 700 is connected through an optical path system; a processing table 800 is also provided on the workbench 500, and the processing table 800 is arranged below the vibrating mirror 700, and the processing table 800 is used for installing workpieces;

A structured light projector 900 is arranged inside the protective room 100, and the structured light projector 900 is arranged on the upper end of the side wall of the protective room 100; A camera 200 is also arranged on the side wall of the camera 200, and the camera 200 is used to record the deformed fringe image modulated by the height of the imaged workpiece.

Through the device in the present invention, the laser generator 600 and the vibrating mirror 700 are arranged above the workbench 500, and the laser generator 600 and the vibrating mirror 700 are connected through the optical path system, which reduces the volume of the optical path and saves laser processing. The space occupied by the device 300.

Moreover, by setting the camera 200 and the structured light projector 900 inside the protective room 100, the encoded fringes are projected onto the surface of the imaged workpiece through the structured light projector 900, and then the set camera 200 is used to capture the deformed fringes. The processed workpiece is inspected, and whether there is an error in the processing of the workpiece is obtained through the inspection result. When the inspection result shows that there is an error in the processing of the workpiece, the error information is transmitted to the laser control center, and the laser control center adjusts the processing process according to the error information. correct.

The purpose of assisting the laser processing device 300 in processing the workpiece is achieved, thereby ensuring the processing quality and processing efficiency.

Embodiment two

This embodiment is a further refinement of Embodiment 1.

As shown in Figure 4, the optical path system includes an optical cylinder, a laser refracting cylinder, and a telescopic cylinder 115; wherein, the optical cylinder includes a first optical cylinder 110 and a second optical cylinder 111, and the laser refracting cylinder includes a first refracting cylinder 112, a second refracting cylinder cylinder 113 and the third refraction cylinder 114; one end of the first light cylinder 110 is connected to the laser generator 600, and the other end of the first light cylinder 110 is connected to the first refraction cylinder 112; one end of the second light cylinder 111 is connected to the first refraction cylinder The tube 112 is connected, and the other end of the second optical tube 111 is connected with the second refracting tube 113;

The second refracting cylinder 113 is connected to the third refracting cylinder 114 through the telescopic cylinder 115 , and the third refracting cylinder 114 is connected to the vibrating mirror 700 .

Further, both the first light cylinder 110 and the second light cylinder 111 are hollow cylindrical structures; both ends of the first light cylinder 110 need to be sealed, and both ends of the second light cylinder 111 also need to be sealed.

Further, the laser refracting tube is fixed with (for example, glued and fixed) a refracting lens inside, and the laser is refracted by 90° through the refracting lens installed inside the laser refracting tube.

As shown in Figure 5, the telescopic cylinder 115 includes a first connecting section 116 and a second connecting section 117; wherein, one end of the first connecting section 116 is connected to the second refracting cylinder 113, and the second connecting section 117 is connected to the third refracting cylinder 114 Connection, the first connection section 116 and the second connection section 117 are connected through a tubular organ cover 118 .

Further, as shown in FIG. 5 , one end of the tubular bellows 118 is fixedly connected to the second connecting section 117 , and the other end of the tubular bellows 118 is fixedly connected to the first connecting section 116 . The tubular bellows 118 has a certain degree of stretchability.

Since the second connecting section 117 is fixedly connected to the third refracting tube 114, and the third refracting tube 114 is fixedly connected to the vibrating mirror 700, when the driving assembly 122 drives the vibrating mirror 700 to move downward, it will drive the third refracting tube 114 and the vibrating mirror 700 to move downward. The two connecting sections 117 move downward together, so that the tubular bellows 118 is deformed, thereby elongating the tubular bellows 118 .

The height of the vibrating mirror 700 is changed by the driving assembly 122 and the telescopic tube 115, and the focal length of the laser is adjusted, making the processing of the laser processing device 300 more flexible; and ensuring that the relative positions of the laser generator 600, the optical path system, and the vibrating mirror remain unchanged , to ensure the processing effect; moreover, the device in the present invention has lower requirements on the load of the lifting system.

Further, the tubular organ cover 118 adopts an existing device, for example, adopts Shangyin KK118 tubular organ cover.

Further, the vibrating mirror 700 adopts an existing device, for example: FL7210-3D-300 dynamic focusing vibrating mirror.

Further, the camera 200 adopts an existing device, for example, the MV-CH120-11UM camera of Hikvision.

The workbench 500 includes a fixed seat 119 and a supporting column 120; wherein, the supporting column 120 is fixedly arranged on the fixed seat 119, and a beam 121 is arranged above the supporting column 120, and the laser generator 600 is fixedly arranged on the beam 121; on the beam 121 A driving assembly 122 is also provided, and the driving assembly 122 is used to drive the vibrating mirror 700 to move up and down.

As shown in FIG. 3 , by fixing the laser generator 600 and the driving assembly 122 on the beam 121 , the occupied space of the laser processing device 300 can be effectively reduced on the premise of meeting the processing requirements of the workpiece.

As shown in Figures 6 and 7, the drive assembly 122 includes a slide rail seat 123, a driving device 124, and a mounting table 125; wherein, the slide rail seat 123 is fixedly arranged on the beam 121, and the drive device 124 is arranged above the slide rail seat 123 , a lead screw 126 is arranged inside the slide rail seat 123, and the driving device 124 is used to drive the lead screw 126 to rotate;

The mounting table 125 is slidingly connected to the slide rail seat 123, and the mounting table 125 is connected to the screw 126 through the slide rail seat 123; the screw 126 is rotated to drive the mounting table 125 to move up and down; the vibrating mirror 700 is fixedly arranged on the mounting table 125 .

Further, the driving device 124 adopts a motor.

Further, a track is provided inside the slide rail seat 123 , and the mounting table 125 is slidably connected to the track.

Further, there are two rails, and the two rails are respectively arranged on both sides of the lead screw 126 .

Further, the slide rail seat 123 includes a mounting seat and a cover plate; wherein, the mounting seat is fixedly arranged on the beam 121 , a gap is provided between the cover plate and the mounting seat, and the mounting platform 125 is slidably connected with the slide rail seat 123 through the gap.

The laser processing device 300 also includes a dust removal device 127; the dust removal device 127 is used to remove dust during laser processing. Dust removal device 127 comprises dust collection cover 128, dust collection pipeline 129 and dust collection box 130; Wherein, dust collection cover 128 is arranged on the side of processing table 800, and the opening of dust collection cover 128 is arranged facing processing table 800; Dust collection box 130 Set on the side of the base 400 , the dust collection pipe 129 is used to connect the dust collection cover 128 and the dust collection box 130 .

Further, a negative pressure fan is provided inside the dust collecting box 130, and the dust generated on the processing table 800 is collected by the negative pressure fan.

Also be provided with sliding platform 131, first driving device and second driving device on workbench; Wherein, processing station is arranged on sliding platform 131, and sliding platform 131 is slidingly connected with workbench; First driving device drives sliding platform 131 on The worktable moves left and right, and the second drive device drives the processing table to move back and forth on the sliding platform 131;

The first driving device includes a first motor and a first leading screw; the second driving device includes a second motor and a second leading screw; wherein, the first leading screw is rotated inside the workbench, and the sliding platform 131 is arranged on the first rotating On the lead screw, the first motor drives the first lead screw to rotate; the second lead screw is arranged inside the sliding platform 131, the processing table is slidably arranged on the second lead screw, and the second motor drives the second lead screw to rotate.

The working principle of the present invention is as follows: when in use, the laser generator 600 cooperates with the optical path system to transmit the laser light to the vibrating mirror 700 after multiple refractions, and then process the workpiece through the vibrating mirror 700 .

When the height of the vibrating mirror 700 needs to be adjusted, the driving assembly 122 drives the vibrating mirror 700, the third refracting tube 114 and the second connecting section 117 to move downward together, so that the tubular bellows 118 is deformed, thereby pulling the tubular bellows 118 Long, to complete the height adjustment of the galvanometer 700.

Embodiment three

The detection method of laser processing and detection integrated equipment based on active projection technology includes the following steps:

Step S1, place the calibration plate horizontally on the workbench 500, and perform double-target calibration;

Step S2, using the GeneratePattern algorithm to generate black and white stripes, writing them into the structured light projector 900 to project the surface of the workpiece, and collecting the deformed stripes through the camera 200, so as to obtain the wrapping phase of the workpiece;

Step S3: Perform phase unpacking by the PhaseAnalyse algorithm, perform stereo matching on the images acquired by the two cameras (200) after dual-target positioning, and calculate the horizontal offset of the corresponding pixels in the left and right images, that is, the parallax, which is calculated according to the parallax information Analyze and obtain three-dimensional information;

Step S4, use efficient and robust image processing and segmentation technology to perform preprocessing operations such as denoising, filtering, and registration on the collected 3D data; then import GOMSoftware for point cloud reconstruction, and perform point cloud splicing on the reconstructed point cloud , Segmentation, feature extraction, meshing and other processing operations to obtain more complete and accurate surface texture geometric features and realize non-contact measurement;

Step S5, compare the ideal required point cloud image, use Halcon to analyze the taper, waviness and bending characteristics of the material laser processing surface, and feed back the feature position to the laser processing device to optimize the structural characteristics of the surface texture of the workpiece until the measurement plane It is flat with the target plane surface, without ups and downs or bumps, that is, the tolerance range is ±20μm, and at the bend, the angle change is less than or equal to 1°.

Halcon uses its image processing and machine vision algorithms to realize the identification of workpiece surface defects. Using Halcon's feature extraction algorithm, features of surface defects are extracted from the image. These features can include texture, shape, edge, etc., and select the corresponding feature extraction method according to different defect types.

Match the phase values in the left and right images, and find the matching point where each pixel in the left image has the smallest phase difference in the right image. For each matching point, calculate the horizontal offset of the corresponding pixel in the left and right images, that is, the disparity. The geometric relationship between depth and parallax is established by using the principle of triangulation ranging, so as to obtain the depth information of each point on the surface of the target object.

Compared with pure binocular stereo matching, the advantages of binocular stereo matching based on structured light:

Stronger robustness: Structured light projects coded information onto the surface of the target object. By adding feature information, the robustness of matching can be improved. Compared with pure binocular matching, structured light provides additional constraints, reducing the influence of factors such as illumination changes and texture loss.

Intensive matching points: Structured light forms encoded information on the surface of the target object, so that more matching points can be obtained, which improves the density of depth estimation. Compared with pure binocular matching, structured light provides more feature points, which can achieve higher matching accuracy and density.

Small impact of illumination: The encoded information of structured light projection can effectively reduce the impact of illumination changes on depth estimation. Through the encoding of structured light, the matching process is more stable, reducing the depth estimation error caused by changes in lighting conditions.

Further, the specific implementation of the GeneratePattern algorithm is:

function[Is,Is_img]=GeneratePattern(A,B,T,N,W,H)Is=cell(N,1);

Is_img=cell(N,1);

xs=1:W;

f_2pi=1./double(T)*2.*pi;fork=0:N-1Is{k+1}=A+B*cos(f_2pi*xs+2*k/N*pi);Is_img{k +1}=repmat(Is{k+1}/255.,H,1);

end

The GeneratePattern function first creates empty cell arrays Is and Is_img with a size of N to store the generated stripe pattern and image results. A row vector xs from 1 to W is created to represent the abscissa of the pattern. Then a constant f_2pi is calculated for the subsequent calculation of the phase change. Next, generate the fringe pattern in each phase shift step using a cycle from 0 to N-1. The fringe pattern is generated using a cosine function, where f_2pi represents the amount of phase change. The generated stripe pattern is stored in the Is array, and it is converted into an image format at the same time, and stored in the Is_img array.

Function input parameters:

A: The benchmark brightness of the stripes (value range: 0-255)

B: Amplitude of stripes (value range: 0-255)

T: period of stripes (unit: pixel)

N: Number of phase shift steps (number of fringes)

W: Width of pattern (unit: pixel)

H: the height of the pattern (unit: pixel)

Through the GeneratePattern algorithm, the amplitude, phase, period and number of stripes can be customized as required. This enables flexible generation of fringe patterns of different shapes, frequencies, and contrasts for structured light imaging needs. By adjusting the parameters, the degree and shape of each fringe's phase shift can be precisely controlled. High-quality fringe patterns can be obtained. Since the fringe patterns are generated using the cosine function, the GeneratePattern algorithm has high signal quality and low noise levels when generating fringes, which helps to improve the accuracy and stability of structured light imaging. Ease of Implementation: Code is written in MATLAB and uses simple and intuitive syntax and functions. This makes implementing the streak generation algorithm simple and efficient, without the need for complex programming skills.

Embodiment four

The PhaseAnalyse algorithm is specifically implemented as:

#include <opencv2/opencv.hpp>

#include <stdint.h>

#include<string>

#include <fstream>

Using namespace cv;

using namespace std;

1. #include<opencv2/opencv.hpp>: The header file used to introduce the OpenCV library, including functions and classes for image processing, computer vision and machine learning.

2. #include<stdint.h>: used to introduce the stdint.h header file, which defines fixed-size integer types, such as uint8_t, int16_t, etc.

3. #include<string>: used to introduce the string header file, which provides functions and classes for manipulating strings.

4. #include<fstream>: used to introduce the fstream header file, which provides functions and classes for reading and writing files.

#define F32 float

#define PIXEL uint8_t

#define PI 3.1415926535897932384626433832795

#define PI2 (PI*2)

static int m_dFreq[5]={1,3,9,27,85};

static int m_nHeight;

static int m_nWidth;

1. #define F32 float: defines the macro constant F32, indicating the float type. By definition, the use of F32 can replace the use of float type.

2. #define PIXEL uint8_t: defines the macro constant PIXEL, representing the uint8_t type. By definition, the use of PIXEL can replace the use of uint8_t type.

3. #define PI 3.1415926535897932384626433832795: defines the macro constant PI, indicating the value of pi. In the code, use PI instead of the specific value 3.1415926535897932384626433832795.

4. #define PI2(PI*2): Defines the macro constant PI2, which means twice the circumference ratio π. In the code, use PI2 to replace the specific value PI*2.

5. static int m_dFreq[5]={1,3,9,27,85}: defines a static integer array m_dFreq, which contains 5 elements. This array is initialized to {1,3,9,27,85}.

6. static int m_nHeight; and static int m_nWidth: Two static integer variables m_nHeight and m_nWidth are defined, but no initial value is assigned to them. This means that their initial value will be 0 (initialized to 0 in static memory).

The specific implementation of the Phase Unwrap function is as follows:

voidPhaseUnWrap(Mat&phaseHetero,Mat&phaseWrap,Mat&phaseUnwrap,floatfrqHetero,float frqWrap){

F32*ptr0=(F32*)phaseHetero.data;

F32*ptr1=(F32*)phaseWrap.data;

F32*ptr=(F32*)phaseUnwrap.data;

float R=frqWrap/frqHetero;

for(inty=0;y<m_nHeight;y++){

floatphaWrapPrev=ptr1[0];

int NWrap=0;

for (int x=0;x<m_nWidth;x++){

int xy=y*m_nWidth+x;

F32&phaUnwrap=ptr[xy];

F32 phaHeter=ptr0[xy];

F32 phaWrap=ptr1[xy];

NWrap=(int)((phaHeter*R-phaWrap)/PI2+0.5);

phaUnwrap=NWrap*PI2+phaWrap;

}}}

The above algorithm is used to unpack the input phase image, repair the discontinuity of the phase image, and generate a continuous phase image. The input parameters of the function include three matrix type parameters: phaseHetero, phaseWrap and phaseUnwrap. denote the clutter phase, wrapped phase and unwrapped phase, respectively. These phase images are usually stored as floating point numbers (F32). The function first converts the data pointer of the phase image into an F32 type pointer, that is, ptr0 points to the data of phaseHetero, ptr1 points to the data of phaseWrap, and ptr points to the data of phaseUnwrap. Next, the function calculates the R value according to the given frequency parameters (frqHetero and frqWrap), R=frqWrap/frqHetero. This R value is used to map the wrapped phase onto the clutter phase. R=frqWrap/frqHetero, you can get a proportional coefficient. By multiplying the wrapped phase by this scale factor, the wrapped phase can be mapped to the same frequency range as the clutter phase, so that it has the same variation law. Then, the function uses a double loop to iterate through the entire image, from top left to bottom right. At each pixel location, the function computes the value of the unwrapped phase. First get the values of clutter phase, wrap phase and unwrap phase at the current position. Next, the function calculates the wrapping number (NWrap) of the phase according to the phase difference and the R value. Then, based on the wrapping number and wrapping phase values, the value of the unwrapping phase is calculated. The unwrapping phase is obtained by multiplying the wrapping number by 2π and adding the wrapping phase. Finally, the function returns the unwrapped phase image, stored in the phaseUnwrap matrix.

The PhaseAnalyse algorithm is simple and efficient, the code implementation is concise, and it is easy to understand and use. It is based on simple mathematical operations without complex algorithms and iterative processes, so the execution speed is relatively fast.

Multi-frequency unpacking: The algorithm implements a multi-frequency phase unpacking algorithm, which uses different phase shift patterns to recover phase information more accurately. This multi-frequency unpacking method can improve the reliability and accuracy of unpacking.

Algorithms can be modified and adjusted as needed. The frequency, amplitude and other parameters of the phase shift pattern can be customized to suit different application scenarios and experimental requirements.

Understanding of the formula:

1. First, calculate the difference phaHeter*R-phaWrap. This difference represents the offset of the wrapped phase relative to the clutter phase.

2. Divide the difference by 2π (ie PI2) to convert the offset into the unit of the number of packages. The result thus obtained represents the wrapping number shift of the wrapping phase relative to the clutter phase.

3. Adding 0.5 is for rounding and converting the floating-point result to an integer.

The phase unpacking operation is realized by the phase unpacking code, and the continuous phase image is generated by repairing the discontinuity of the phase image.

void ImgShowAbsPhase(Mat mat, float offset, string title) {

Mat show = mat / offset;

imshow(title, show);

waitKey(0);}

1. Create a new Mat object show as the displayed image.

2. Divide the input phase image mat by offset to get the adjusted image. Scaling factor for the phase image, used to adjust the contrast of the display. Dividing the phase image by offset maps the phase values to the appropriate display range.

3. Use the imshow function of OpenCV to display the adjusted phase image show in a window, and the title of the window is title.

Call the waitKey(0) function to wait for the user to press any key on the keyboard to keep the window displayed.

The function of this function is to zoom and display the phase image, so that the user can observe the characteristics of the phase distribution. Typically after processing steps such as phase unwrapping, this function is used to display the final phase result.

void DecodeMultiPhase5(Mat* imgShift, Mat&imgAbsPhase) {

F32* dPtr = (F32*)imgAbsPhase.data;

Mat imgPhase[5];

for (int k = 0; k<5; k++) imgPhase[k] = Mat::zeros(m_nHeight, m_nWidth, CV_32FC1);

for (int n = 0; n<4; n++) {

PIXEL* I0 = (PIXEL*)imgShift[4 * n + 0].data;

PIXEL* I1 = (PIXEL*)imgShift[4 * n + 1].data;

PIXEL* I2 = (PIXEL*)imgShift[4 * n + 2].data;

PIXEL* I3 = (PIXEL*)imgShift[4 * n + 3].data;

F32* pha = (F32*)imgPhase[n].data;

for (int k = 0; k<m_nWidth * m_nHeight; k++) {

pha[k] =(float)atan2f((double)(I1[k] - I3[k]), (double)(I0[k] - I2[k]));

if (pha[k]<0)

pha[k] +=PI2;

}}

PIXEL* I[8];

for (int k = 0; k<8; k++)

I[k] = (PIXEL*)imgShift[16 + k].data;

F32* pha = (F32*)imgPhase[4].data;

float PI2_8 = PI2 / 8;

for (int k = 0; k<m_nWidth * m_nHeight; k++) {

double ssin = 0.0, scos = 0.0;

for (int i = 0; i<8; i++) {

ssin += I[i][k]* sin(PI2_8 * i);

scos += I[i][k]* cos(PI2_8 * i);}

pha[k] = (float)atan2f(ssin, scos);

if (pha[k]<0)

pha[k] +=PI2;

}

ImgShowAbsPhase(imgPhase[0], PI2, "imgPhase_0");

ImgShowAbsPhase(imgPhase[1], PI2,"imgPhase_1");

ImgShowAbsPhase(imgPhase[2], PI2,"imgPhase_2");

ImgShowAbsPhase(imgPhase[3], PI2,"imgPhase_3");

ImgShowAbsPhase(imgPhase[4],PI2, "imgPhase_4");

Mat imgAbsPhase1 = Mat::zeros(m_nHeight, m_nWidth, CV_32FC1);

Mat imgAbsPhase2 = Mat::zeros(m_nHeight, m_nWidth, CV_32FC1);

Mat imgAbsPhase3 = Mat::zeros(m_nHeight, m_nWidth, CV_32FC1);

Mat M1 = Mat::zeros(m_nHeight, m_nWidth, CV_32FC1);

Mat M2 = Mat::zeros(m_nHeight, m_nWidth, CV_32FC1);

Mat M3 = Mat::zeros(m_nHeight, m_nWidth, CV_32FC1);

PhaseUnWrap(imgPhase[0], imgPhase[1], imgAbsPhase1, m_dFreq[0], m_dFreq[1]);

PhaseUnWrap(imgAbsPhase1, imgPhase[2], imgAbsPhase2, m_dFreq[1], m_dFreq[2]);

PhaseUnWrap(imgAbsPhase2, imgPhase[3], imgAbsPhase3, m_dFreq[2], m_dFreq[3]);

PhaseUnWrap(imgAbsPhase3, imgPhase[4], imgAbsPhase, m_dFreq[3], m_dFreq[4]);

ImgShowAbsPhase(imgAbsPhase1, 3 * PI2, "imgAbsPhase1");

ImgShowAbsPhase(imgAbsPhase2, 9 * PI2, "imgAbsPhase2");

ImgShowAbsPhase(imgAbsPhase3, 27 * PI2,"imgAbsPhase3");

ImgShowAbsPhase(imgAbsPhase, 81 * PI2, "imgAbsPhase");

imwrite("phase1.bmp", imgPhase[0]);

imwrite("phase2.bmp", imgPhase[1]);

imwrite("phase3.bmp", imgPhase[2]);

imwrite("phase4.bmp", imgPhase[3]);

imwrite("phase5.bmp", imgPhase[4]);

imwrite("unphase.bmp", imgAbsPhase);

return;}

The function takes as input an image array imgShift and a reference to a Mat object imgAbsPhase. Initialize with a Mat object array imgPhase of size 5. Each imgPhase element is initialized as an all-zero matrix with the same dimensions as imgAbsPhase. Next is a loop, the loop variable is n, traversing from 0 to 3. Inside the loop, for each value of n, the function gets four images I0, I1, I2 and I3 from the imgShift array. These images correspond to different phase shift steps. Then, the function iterates over m_nWidth*m_nHeight pixels, and for each pixel, calculates the phase value pha using the atan2f function. The calculation of the phase value is based on the difference between the pixel values in images I0, I1, I2 and I3. If the phase value pha is less than 0, it is increased by PI2 to ensure that the phase value is between 0 and 2π.

Next, the function processes the final set of eight-step phase-shifted images. Store these images in an array of pointers called I. Then, the function iterates over m_nWidth*m_nHeight pixels, and for each pixel, calculates the cumulative values of ssin and scos using the sine and cosine functions. These accumulated values are used to calculate the phase value pha. Similar to the previous step, if the phase value pha is less than 0, increase it by PI2. Finally, the function calls the ImgShowAbsPhase function to display each element in the imgPhase array and save it as an image file. Then, call the PhaseUnWrap function to unwrap the phase of the imgPhase array to obtain imgAbsPhase. Finally, the function saves imgAbsPhase as an image file and returns it.

Embodiment five

As shown in Figure 8, the point cloud image shows the corresponding defect area of the workpiece processing, which is manifested as the abnormality or lack of point cloud data. The device then determines the location, shape, and size of the defect, as well as the dimensional characteristics of the intact area, based on the results of the point cloud analysis. Based on these information, this device adjusts the laser power, scanning speed, spot diameter, etc. to optimize the processing process for the problem that the size does not meet the requirements. After parameter adjustment, the test result is shown in Figure 9. The size of the pattern of the processed workpiece meets the requirements, and the length, width and thickness of the reserved squares have reached the expected 10mm×10mm×1mm. The point cloud presents a shape consistent with the design and Dimensions, no apparent abnormalities or omissions.

It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is a relationship between these entities or operations. There is no such actual relationship or sequence. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or apparatus.

Finally, it should be noted that: the above is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it still The technical solutions recorded in the foregoing embodiments may be modified, or some technical features thereof may be equivalently replaced. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (10)

1. An integrated laser processing and testing device based on active projection technology, characterized in that it includes a protective room (100), and a laser processing device (300) is arranged inside the protective room (100); The laser processing device (300) includes a base (400), a workbench (500) is arranged above the base (400), and a laser generator (600) and a vibrating mirror (700) are arranged on the workbench (500); wherein , the laser generator (600) is connected to the galvanometer (700) through an optical system; a processing table (800) is also provided on the workbench (500), and the processing table (800) is set under the galvanometer (700), and the processing A table (800) is used to install workpieces; A structured light projector (900) is arranged inside the protective room (100), and the structured light projector (900) is set on the upper end of the side wall of the protective room (100); the structured light projector (900) is used to convert the encoded The fringes are projected onto the surface of the workpiece, and a camera (200) is also arranged on the side wall of the protective room (100), and the camera (200) is used to record the deformed fringe images modulated by the height of the imaged workpiece. 2. The laser processing and testing integrated equipment based on active projection technology according to claim 1, characterized in that: the optical path system includes a light tube, a laser refracting tube and a telescopic tube (115); wherein the light tube includes a first light tube (110) and the second light tube (111), the laser refraction tube includes the first refraction tube (112), the second refraction tube (113) and the third refraction tube (114); one end of the first light tube (110) and The laser generator (600) is connected, the other end of the first light tube (110) is connected with the first refracting tube (112); one end of the second light tube (111) is connected with the first refracting tube (112), and the second light The other end of the tube (111) is connected to the second refracting tube (113); The second refracting cylinder (113) is connected to the third refracting cylinder (114) through the telescopic cylinder (115), and the third refracting cylinder (114) is connected to the vibrating mirror (700). 3. The integrated laser processing and testing equipment based on active projection technology according to claim 2, characterized in that: the telescopic cylinder (115) includes a first connecting section (116) and a second connecting section (117); wherein, the first One end of a connecting section (116) is connected with the second refracting cylinder (113), the second connecting section (117) is connected with the third refracting cylinder (114), the first connecting section (116) and the second connecting section (117) Connected by tubular organ cover (118). 4. The integrated laser processing and detection equipment based on active projection technology according to claim 1, characterized in that: the workbench (500) includes a fixed seat (119) and a supporting column (120); wherein, the supporting column (120 ) is fixedly arranged on the fixing seat (119), a crossbeam (121) is arranged above the support column (120), and the laser generator (600) is fixedly arranged on the crossbeam (121). 5. The laser processing and detection integrated equipment based on active projection technology according to claim 4, characterized in that: the beam (121) is also provided with a drive assembly (122), and the drive assembly (122) is used to drive the vibrating mirror ( 700) to move up and down. 6. The laser processing and inspection integrated equipment based on active projection technology according to claim 5, characterized in that: the driving assembly (122) includes a slide rail seat (123), a driving device (124) and a mounting table (125); Wherein, the slide rail seat (123) is fixedly arranged on the beam (121), the driving device (124) is arranged above the slide rail seat (123), and a lead screw (126) is arranged inside the slide rail seat (123), The driving device (124) is used to drive the screw (126) to rotate; The installation table (125) is slidingly connected with the slide rail seat (123), and the installation table (125) passes through the slide rail seat (123) and is connected with the lead screw (126); through the rotation of the lead screw (126), the installation table (125) is driven ) moves up and down; the vibrating mirror (700) is fixedly arranged on the mounting table (125). 7. The laser processing and detection integrated equipment based on active projection technology according to claim 1, characterized in that: the laser processing device (300) also includes a dust removal device (127); the dust removal device (127) is used to remove the laser processing in the dust. 8. The integrated laser processing and inspection equipment based on active projection technology according to claim 7, characterized in that: the dust removal device (127) includes a dust collection cover (128), a dust collection pipe (129) and a dust collection box (130 ); wherein, the dust collection cover (128) is arranged on the side of the processing table (800), and the opening of the dust collection cover (128) is set facing the processing table (800); the dust collection box (130) is arranged on the base (400) On the side, the dust collection pipe (129) is used to connect the dust collection cover (128) and the dust collection box (130). 9. The integrated laser processing and inspection equipment based on active projection technology according to claim 1, characterized in that: a sliding platform (131), a first driving device and a second driving device are also provided on the workbench (500) ; Wherein, the processing table (800) is set on the sliding platform (131), and the sliding platform (131) is slidingly connected with the worktable (500); the first driving device drives the sliding platform (131) to move left and right on the worktable (500) , the second driving device drives the processing table (800) to move back and forth on the sliding platform (131); The first drive device includes a first motor and a first lead screw; the second drive device includes a second motor and a second lead screw; wherein, the first lead screw is rotated inside the workbench (500), and the sliding platform (131) Set on the first rotating lead screw, the first motor drives the first lead screw to rotate; the second lead screw is set inside the sliding platform (131), the processing table (800) is slidably set on the second lead screw, the second motor Drive the second lead screw to rotate. 10. The detection method of laser processing and detection integrated equipment based on active projection technology, characterized in that: using the active projection technology-based laser processing and detection integrated equipment according to any one of claims 1 to 9 for detection, the detection method includes The following steps: Step S1, placing the calibration board horizontally on the workbench (500) for dual-target calibration; Step S2, using the GeneratePattern algorithm to generate black and white stripes, writing them into the structured light projector (900) to project the surface of the workpiece, and collecting the deformed stripes through the camera (200), so as to obtain the wrapping phase of the workpiece; Step S3, perform phase unpacking by the PhaseAnalyse algorithm, perform stereo matching on the images acquired by the two cameras (200) after binocular positioning, that is, match corresponding pixel points, calculate parallax, and obtain three-dimensional information according to the calculation and analysis of the parallax information; Step S4, using efficient and robust image processing and segmentation technology to perform denoising, filtering, and registration preprocessing operations on the collected 3D data; then import GOMSoftware for point cloud reconstruction, and perform point cloud splicing on the reconstructed point cloud , segmentation, feature extraction, and grid processing to obtain more complete and accurate surface texture geometric features and realize non-contact measurement; Step S5, compare the ideal required point cloud image, use Halcon to analyze the taper, waviness and bending characteristics of the material laser processing surface, and feed back the feature position to the laser processing device to optimize the structural characteristics of the surface texture of the workpiece until the measurement plane It is flat with the target plane surface, without ups and downs or bumps, that is, the tolerance range is ±20μm, and at the bend, the angle change is less than or equal to 1°.