CN116488672A - Carrier aggregation radio frequency receiving module - Google Patents
Carrier aggregation radio frequency receiving module Download PDFInfo
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- CN116488672A CN116488672A CN202310735777.1A CN202310735777A CN116488672A CN 116488672 A CN116488672 A CN 116488672A CN 202310735777 A CN202310735777 A CN 202310735777A CN 116488672 A CN116488672 A CN 116488672A
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- 230000002776 aggregation Effects 0.000 title claims abstract description 13
- 238000004220 aggregation Methods 0.000 title claims abstract description 13
- 239000003990 capacitor Substances 0.000 claims description 58
- 239000000758 substrate Substances 0.000 claims description 34
- 238000004804 winding Methods 0.000 claims description 4
- 238000010295 mobile communication Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 17
- 230000010354 integration Effects 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004931 aggregating effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L5/00—Arrangements affording multiple use of the transmission path
- H04L5/0001—Arrangements for dividing the transmission path
- H04L5/0003—Two-dimensional division
- H04L5/0005—Time-frequency
- H04L5/0007—Time-frequency the frequencies being orthogonal, e.g. OFDM(A) or DMT
- H04L5/001—Time-frequency the frequencies being orthogonal, e.g. OFDM(A) or DMT the frequencies being arranged in component carriers
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- Engineering & Computer Science (AREA)
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Abstract
The application belongs to the technical field of mobile communication, and particularly relates to a carrier aggregation radio frequency receiving module. Includes, a plurality of filter paths; the filter passageway includes radio frequency switch, inductance, base plate, wave filter, and the module input is in on the base plate, the input on the base plate with radio frequency switch input links to each other, and the radio frequency switch output pass through the base plate with the inductance links to each other, the inductance pass through the base plate with integrated electric capacity input links to each other in the wave filter, the wave filter output links to each other as the module output with the base plate output, and a radio frequency switch is shared to a plurality of filter passageways, electric capacity and the input of wave filter are connected, and the wave filter is the sound table wave filter, and electric capacity is interdigital electric capacity, and this application is for external paster electric capacity, and the device is less, and the volume is littleer, and the cost is lower, and the reliability is higher. The filter has low flow cost, the filter is customized to be specially designed, and the CA performance can be improved by adopting a goods shelf general switch product.
Description
Technical Field
The application belongs to the technical field of mobile communication, and particularly relates to a carrier aggregation radio frequency receiving module.
Background
With the advent of the mobile communication era, the communication frequency band is more and more, and the integration level is higher and higher. The definition requirements of the wireless transmission pictures and videos are higher and higher, and the data transmission quantity is larger and larger. In order to meet the requirements of mobile communication for peak rate and system capacity improvement, the mobile communication system requires a large bandwidth. The utilization is improved in limited spectrum resources by aggregating multiple contiguous or non-contiguous frequency bands into a larger bandwidth, i.e. carrier aggregation (Carrier Aggregation, hereinafter CA). Carrier aggregation, a technique for increasing transmission bandwidth, is applied to a radio frequency receiving module of a mobile communication system.
Disclosure of Invention
In order to solve the above-mentioned prior art problems, the present application provides a carrier aggregation radio frequency receiving module.
In order to achieve the above purpose, the technical scheme adopted in the application is as follows:
there is provided a carrier aggregation radio frequency receiving module comprising,
a plurality of filter paths;
the filter path comprises a radio frequency switch, an inductor, a substrate and a filter, wherein the input end of the module is arranged on the substrate, the input end of the substrate is connected with the input end of the radio frequency switch, the output end of the radio frequency switch is connected with the inductor through the substrate, the inductor is connected with the input end of the integrated capacitor in the filter through the substrate, the output end of the filter is connected with the output end of the substrate to serve as the output end of the module, and the plurality of filter paths share one radio frequency switch.
Preferably, the capacitor is connected to the input of the filter.
Preferably, the filter is a sound surface filter or a bulk acoustic wave filter.
Preferably, the filter is a sound surface filter, and the capacitor is an interdigital capacitor.
Preferably, the finger width of the interdigital capacitor is 0.3 micrometers-2 micrometers.
Preferably, the finger thickness of the interdigital capacitor is 0.1-0.5 micrometers.
Preferably, the inductor is a substrate wire winding or patch inductor.
Preferably, the filter is constituted by 1 or more IDT resonators.
Preferably, the filter is formed of 1 or more DMS type resonance units.
Preferably, the filter is composed of IDT resonators and DMS-type resonance units.
The application provides a carrier aggregation radio frequency receiving module, which comprises a plurality of filter paths; the filter path comprises a radio frequency switch, an inductor, a substrate and a filter, wherein the input end of the module is arranged on the substrate, the input end of the substrate is connected with the input end of the radio frequency switch, the output end of the radio frequency switch is connected with the inductor through the substrate, the inductor is connected with the input end of the integrated capacitor in the filter through the substrate, and the output end of the filter is connected with the output end of the substrate to serve as the output end of the module. The beneficial effects of this application are embodied in: compared with an external patch capacitor, the external patch capacitor has the advantages of fewer devices, smaller volume, lower cost and higher reliability.
Drawings
FIG. 1 is a schematic representation of one embodiment of the present application;
FIG. 2 is a cross-sectional view of one embodiment of the present application;
FIG. 3 is a top view of a prior art filter;
FIG. 4 is a schematic diagram of adding capacitance to a filter according to the present application;
FIG. 5 is a top view of a filter incorporating capacitors according to the present application;
FIG. 6 is a schematic diagram of an embodiment of a capacitor of the present application;
FIG. 7 is a schematic diagram of a Band25 single-pass mode of the present application;
FIG. 8 is a schematic diagram of a Band40 single-pass mode of the present application;
fig. 9 is a schematic diagram of CA mode of carrier aggregation between Band25 and Band40 of the present application;
FIG. 10 is a schematic diagram of Band25 filter path and CA mode loss difference for a filter without integrated capacitors;
FIG. 11 is a schematic diagram of Band40 filter path and CA mode loss difference for a filter without an integrated capacitor;
FIG. 12 is a schematic diagram of Band25 filter path and CA mode loss difference for the filter integration capacitor of the present application;
FIG. 13 is a schematic diagram of Band40 filter path and CA mode loss difference for the filter integration capacitor of the present application;
FIG. 14 is a schematic diagram of Band25 filter impedance at Band40 frequencies 2300-2400MHz without integrated capacitors in the present application;
FIG. 15 is a schematic diagram of Band25 filter with integrated capacitors according to the present application at Band40 frequencies 2300-2400 MHz.
Description of the reference numerals
1. A radio frequency switch; 2. an inductance; 3. a substrate; 4. a filter; 5. an IDT resonator; 6. a DMS type resonance unit; 7. band25 filter; 8. band40 filters; 41. a capacitor; 411. finger strips;
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings of the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Referring to fig. 1-15, the following specific embodiments are provided in this application:
example 1:
a carrier aggregation radio frequency receiving module includes,
a plurality of filter paths;
the filter path comprises a radio frequency switch, an inductor, a substrate and a filter, wherein the input end of the module is arranged on the substrate, the input end of the substrate is connected with the input end of the radio frequency switch, the output end of the radio frequency switch is connected with the inductor through the substrate, the inductor is connected with the input end of the integrated capacitor in the filter through the substrate, and the output end of the filter is connected with the output end of the substrate to serve as the output end of the module.
Preferably, the capacitor is connected to the input of the filter.
Preferably, the filter is a sound surface filter or a bulk acoustic wave filter.
Preferably, the filter is a sound surface filter, and the capacitor is an interdigital capacitor.
Preferably, the finger width of the interdigital capacitor is 0.3 micrometers-2 micrometers.
Preferably, the finger thickness of the interdigital capacitor is 0.1-0.5 micrometers.
Preferably, the inductor is a substrate wire winding or patch inductor.
Preferably, the filter is constituted by 1 or more IDT resonators.
Preferably, the filter is formed of 1 or more DMS type resonance units.
Preferably, the filter is composed of IDT resonators and DMS-type resonance units.
In an alternative embodiment, the module is composed of a radio frequency switch, an inductor, a capacitor, and a filter. As shown in fig. 1-2, the left side is input, the right side is output, and the present application can have multiple filter paths; may be a first filter path, a second filter path, …, an nth filter path.
The first filter path, the module input sets up on the base plate, and the input on the base plate links to each other with the radio frequency switch input, and the radio frequency switch output links to each other with the inductance through the base plate, and the inductance links to each other with integrated electric capacity input in the first passband filter through the base plate, and the filter output links to each other as the module output with the base plate output.
The second filter path, the module input end sets up on the base plate, and the input on the base plate links to each other with the radio frequency switch input, and the radio frequency switch output links to each other with the inductance through the base plate, and the inductance links to each other with integrated electric capacity input in the second passband filter through the base plate, and the filter output links to each other as the module output with the base plate output.
And the third filter path is formed by arranging a module input end on a substrate, connecting an input end on the substrate with a radio frequency switch input end, connecting a radio frequency switch output end with an inductor through the substrate, connecting the inductor with an integrated capacitor input end in a third passband filter through the substrate, and connecting a filter output end with a substrate output end to be used as a module output end.
The N-th filter path, the module input end is set on the base plate, the input end on the base plate is connected with the radio frequency switch input end, the radio frequency switch output end is connected with the inductance through the base plate, the inductance is connected with the integrated capacitance input end in the N-th passband filter through the base plate, the filter output end is connected with the base plate output end as the module output end.
Here, N is determined according to actual needs, and the number of paths N is not particularly limited.
Preferably, the inductance is realized by a substrate wire winding or a patch inductance,
wherein the capacitors are implemented by the internal circuit of the filter, and the implementation modes comprise interdigital capacitors, bulk acoustic wave filters and LTCC filter interpolar plate capacitors without being limited to acoustic surface filters. According to the filter, the capacitors are integrated into the filter, the number of the capacitor devices can be reduced, and when the switch simultaneously leads in two paths of filters and outputs of multiple paths of filters, the CA performance can be improved, and the integration level of the radio frequency receiving module is improved.
In an alternative embodiment, the filter is a phonogram filter and the capacitance is an interdigital capacitance. The width of the finger strip of the interdigital capacitor is 0.3-2 microns, and the thickness of the finger strip of the interdigital capacitor is 0.1-0.5 microns.
Since the conventional filter has no capacitance, the conventional filter may be composed of 1 IDT resonator and one DMS-type resonator element, may be composed of one or more IDT resonators, may be composed of one or more DMS-type resonator elements, may be composed of a filter including only IDT resonators and no DMS-type resonator element, or may be composed of a filter including only DMS-type resonator elements and no IDT-type resonator element, or may be composed of an FBar filter, as shown in fig. 3 in a plan view.
In the scheme that the filter is not added with a capacitor, the CA performance depends on the performance of a radio frequency switch in the module, special design is needed for the radio frequency switch, products are needed to be customized, and the cost of the customized switch current sheet is extremely high and reaches millions. The filter has low flow cost, and the CA performance can be improved by customizing special design of the filter and adopting a goods shelf general switch product.
In the present application, as shown in fig. 4-5, the filter may be formed by 1 IDT resonator and one DMS-type resonator element, and the filter composition is not limited to one or more IDT resonators, or to one or more DMS-type resonator elements, or to a filter including only IDT resonators and no DMS-type resonator element, or to a filter including only DMS-type resonator elements and no IDT-type resonator element, or to an FBar filter.
As shown in fig. 6, a capacitor is added to the filter, and the capacitor is implemented by an internal circuit of the filter, and the implementation modes include, but are not limited to, an interdigital capacitor of a sound surface filter and a plate capacitor between electrodes of a bulk acoustic wave filter. The method can reduce capacitance devices, and can improve CA performance when the switch simultaneously introduces two paths of filter outputs and multiple paths of filter outputs.
Taking a sound surface filter as an example, an interdigital capacitor implementation mode is adopted for adding the capacitor in the sound surface filter, mutually parallel staggered finger strips are adopted, and each finger strip is connected with an input electrode and an output electrode through electrodes at intervals, so that a larger capacitance value range can be realized. The finger direction is perpendicular to the direction of the IDT finger so that the interdigital capacitor does not excite spurious signals. In an alternative embodiment, the finger width of the interdigital capacitor is greater than 108% of the maximum width of the IDT finger, or the finger width of the interdigital capacitor is less than 92% of the minimum width of the IDT finger.
Fig. 7-9 are schematic diagrams of different operation modes in the present application, in which the module component is in a single-pass mode or CA mode, and the module component is in the single-pass mode when only one passband of the switch is on. And when the switch is conducted in two paths simultaneously, the switch is in a CA mode. In the operation of the module, the optimal condition is that the path loss in the CA mode and the path loss in the single-path mode are not changed, and the actual condition is that when two paths simultaneously operate, the two paths interfere with each other, so that the loss is reduced. Fig. 10-13 are diagrams showing the loss difference between the CA mode and the single-path mode, wherein fig. 10-11 are diagrams showing the loss difference between the single-path mode and the CA mode without the integrated capacitor in the conventional filter, and fig. 12-13 are diagrams showing the loss difference between the single-path mode and the CA mode with the integrated capacitor in the filter of the present application.
As can be seen from fig. 10 to 11, band25 is reduced by 0.5dB and b40 is reduced by 1.1dB in the comparative example without the integration capacitance in the conventional filter.
Fig. 12-13 are schematic diagrams of loss difference between a single-path mode and a CA mode of an integrated capacitor in the filter of the present application, and the CA mode of the module generally controls loss drop to about 0.6 dB. The loss of Band40 is greatly reduced because Band25 is conducted, signals enter the module from the input end, and the Band25 filter 7 has the function of allowing signals with the frequency of 1930-1995MHz to pass and preventing signals with other frequencies from passing. In practice, band25 filter 7 cannot completely block the passage of signals of other frequencies, and signals of some Band40 frequencies, i.e., 2300-2400MHz frequencies, pass through Band25 filter 7. In the case of the double-on, some of the signals of Band40 leak into the Band25 path and pass through Band25, as the signals that all pass through Band40 filter 8 at the time of single-on. Resulting in an increase in the path loss of Band40 filter 8.
The integration of the capacitor in Band25 filter 7 can effectively improve the blocking of Band25 channel to Band40 signal. Before the Band25 filter 7 does not integrate a capacitor, the impedance of the input end of the filter is far away from the infinity point of the impedance circle diagram at the Band40 frequency 2300-2400MHz, namely, the open circuit point is far away, as shown in fig. 14, after the Band25 filter integrates the capacitor, the impedance of the input end of the filter is near the 2300-2400MHz distance of the Band40 frequency, as shown in fig. 15, the closer to the open circuit point, the better the corresponding open circuit effect of the Band25 filter 7 at the 2300-2400MHz distance of the Band40 frequency. The actual design of the filter cannot achieve complete open circuit in the ideal situation, and can only approach the open circuit point as much as possible, so that the signal loss is increased and controlled within a reasonable range.
For this reason, the interdigital capacitor is designed at the input end, as shown in fig. 12-13, the performance of the single-path mode is not affected basically, the performance of the CA mode can be improved, the loss in the Band40 CA mode is reduced by only 0.5dB, and the CA performance of the non-integrated capacitor filter in the prior art is reduced by 1.1dB to the CA performance of the integrated capacitor filter is reduced by 0.5dB.
And this application is for external paster electric capacity, and the device is less, and the volume is littleer, and the cost is lower, and the reliability is higher.
In the description of the embodiments of the present application, it is to be understood that terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate an azimuth or positional relationship.
In the description of the embodiments of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, a removable connection, or an integral connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.
In the description of the embodiments of the present application, a particular feature, structure, material, or characteristic may be combined in any one or more embodiments or examples in a suitable manner.
In the description of the embodiments of the present application, it is to be understood that "-" represents a range of two values that are the same, and that the range includes endpoints. For example, "A-B" means a range greater than or equal to A and less than or equal to B.
Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the application, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A carrier aggregation radio frequency receiving module is characterized by comprising,
a plurality of filter paths;
the filter path comprises a radio frequency switch, an inductor, a substrate and a filter, wherein the input end of the module is arranged on the substrate, the input end of the substrate is connected with the input end of the radio frequency switch, the output end of the radio frequency switch is connected with the inductor through the substrate, the inductor is connected with the input end of the integrated capacitor in the filter through the substrate, the output end of the filter is connected with the output end of the substrate to serve as the output end of the module, and the plurality of filter paths share one radio frequency switch.
2. The carrier-aggregated Radio Frequency (RF) receiver module of claim 1, wherein,
the capacitor is connected with the input end of the filter.
3. The carrier-aggregated Radio Frequency (RF) receiver module of claim 2, wherein,
the filter is a sound surface filter or a bulk acoustic wave filter.
4. The carrier-aggregated Radio Frequency (RF) receiver module of claim 2, wherein,
the filter is an acoustic surface filter, and the capacitor is an interdigital capacitor.
5. The carrier-aggregated Radio Frequency (RF) receiver module of claim 4, wherein,
the width of the finger strip of the interdigital capacitor is 0.3-2 microns.
6. The carrier-aggregated Radio Frequency (RF) receiver module of claim 5, wherein,
the finger thickness of the interdigital capacitor is 0.1-0.5 microns.
7. The carrier-aggregated Radio Frequency (RF) receiver module of claim 6, wherein,
the inductor is a substrate wire winding or patch inductor.
8. The carrier-aggregated Radio Frequency (RF) receiver module of claim 7, wherein,
the filter is composed of 1 or more IDT resonators.
9. The carrier-aggregated Radio Frequency (RF) receiver module of claim 7, wherein,
the filter is composed of 1 or more DMS type resonance units.
10. The carrier-aggregated Radio Frequency (RF) receiver module of claim 7, wherein,
the filter is composed of an IDT resonator and a DMS type resonance unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310735777.1A CN116488672A (en) | 2023-06-21 | 2023-06-21 | Carrier aggregation radio frequency receiving module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310735777.1A CN116488672A (en) | 2023-06-21 | 2023-06-21 | Carrier aggregation radio frequency receiving module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110892640A (en) * | 2017-07-20 | 2020-03-17 | 株式会社村田制作所 | Multiplexer, high-frequency front-end circuit and communication device |
| CN212183523U (en) * | 2020-06-30 | 2020-12-18 | 天通凯美微电子有限公司 | Diversity radio frequency front-end module with high carrier aggregation performance |
| CN217522815U (en) * | 2022-05-30 | 2022-09-30 | 锐石创芯(重庆)科技有限公司 | Sonic chip device and RF front-end module |
| CN218734299U (en) * | 2022-09-22 | 2023-03-24 | 杭州左蓝微电子技术有限公司 | Carrier aggregation circuit suitable for radio frequency front-end module |
| CN115882813A (en) * | 2023-03-08 | 2023-03-31 | 成都频岢微电子有限公司 | Based on surface acoustic wave-lumped element combination syntonizer and band-pass filter |
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- 2023-06-21 CN CN202310735777.1A patent/CN116488672A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110892640A (en) * | 2017-07-20 | 2020-03-17 | 株式会社村田制作所 | Multiplexer, high-frequency front-end circuit and communication device |
| CN212183523U (en) * | 2020-06-30 | 2020-12-18 | 天通凯美微电子有限公司 | Diversity radio frequency front-end module with high carrier aggregation performance |
| CN217522815U (en) * | 2022-05-30 | 2022-09-30 | 锐石创芯(重庆)科技有限公司 | Sonic chip device and RF front-end module |
| CN218734299U (en) * | 2022-09-22 | 2023-03-24 | 杭州左蓝微电子技术有限公司 | Carrier aggregation circuit suitable for radio frequency front-end module |
| CN115882813A (en) * | 2023-03-08 | 2023-03-31 | 成都频岢微电子有限公司 | Based on surface acoustic wave-lumped element combination syntonizer and band-pass filter |
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