CN116453996B - Silicon wafer carrier plate conveying and supporting device and working method thereof - Google Patents
Silicon wafer carrier plate conveying and supporting device and working method thereof Download PDFInfo
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- CN116453996B CN116453996B CN202310728160.7A CN202310728160A CN116453996B CN 116453996 B CN116453996 B CN 116453996B CN 202310728160 A CN202310728160 A CN 202310728160A CN 116453996 B CN116453996 B CN 116453996B
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 114
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 114
- 239000010703 silicon Substances 0.000 title claims abstract description 114
- 238000000034 method Methods 0.000 title claims abstract description 19
- 235000012431 wafers Nutrition 0.000 claims abstract description 105
- 238000007747 plating Methods 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 238000007664 blowing Methods 0.000 claims description 54
- 230000005540 biological transmission Effects 0.000 claims description 23
- 238000001179 sorption measurement Methods 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 9
- 230000005484 gravity Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application relates to the technical field of conveying and transporting, in particular to a silicon wafer carrier plate conveying and supporting device and a working method thereof. The application provides a silicon wafer carrier plate conveying and supporting device, which comprises: the device comprises a workbench, a conveying part, a cover plate, a bearing part and a plurality of supporting and adjusting parts, wherein one end of the cover plate is hinged to one side of the workbench; the workbench is suitable for coating the silicon wafer; the conveying part is rotatably arranged at two sides of the workbench and is suitable for driving the bearing part to horizontally move; the bearing part is of a frame structure and is suitable for bearing silicon wafers; the supporting and adjusting pieces are circumferentially arranged on the bearing parts, and the supporting and adjusting pieces are suitable for adjusting the distance between the silicon wafer and the frames of the bearing parts. The silicon wafer is prevented from shaking when the bearing part is transported; when the silicon wafer is coated, the adjusting plate moves upwards to prop against the silicon wafer, so that the phenomenon of coiling and plating can be avoided; the working efficiency is improved.
Description
Technical Field
The application relates to the technical field of conveying and transporting, in particular to a silicon wafer carrier plate conveying and supporting device and a working method thereof.
Background
When the silicon wafer is transported on the silicon wafer carrier, the silicon wafer carrier and the silicon wafer carrier are prevented from shaking due to movement of the conveyor belt, and the edge of the silicon wafer is lost due to overlarge shaking amplitude; in the process of coating the film, the edge of the lower end of the silicon wafer is wound with the film, and the quality of the silicon wafer is affected; it is therefore necessary to develop a silicon wafer carrier transport support device and a working method thereof.
Disclosure of Invention
The application aims to provide a silicon wafer carrier plate conveying and supporting device.
In order to solve the technical problems, the application provides a silicon wafer carrier plate conveying and supporting device, which comprises:
the device comprises a workbench, a conveying part, a cover plate, a bearing part and a plurality of supporting and adjusting parts, wherein one end of the cover plate is hinged to one side of the workbench;
the workbench is suitable for coating the silicon wafer;
the conveying part is rotatably arranged at two sides of the workbench, and is suitable for driving the bearing part to horizontally move;
the bearing part is of a frame structure and is suitable for bearing silicon wafers;
the supporting adjusting pieces are circumferentially arranged on the bearing part, and the supporting adjusting pieces are suitable for adjusting the distance between the silicon wafer and the frame of the bearing part.
Preferably, the bearing part includes: the fixing frame is rectangular, and the inside of the fixing frame is hollow;
the fixing frame is provided with a step groove, and the adjusting plate is arranged in the step groove in a lifting manner;
the adjusting cylinder is fixed in the fixing frame, and the adjusting plate is fixed at the movable end of the adjusting cylinder;
the supporting adjusting pieces are fixed in the step groove at equal intervals;
the adjusting plate is provided with a through groove matched with the supporting adjusting piece, and the adjusting plate is linked with the supporting adjusting piece; wherein,,
when the adjusting cylinder drives the adjusting plate to move upwards to be propped against the lower surface of the silicon wafer, the adjusting plate can avoid the phenomenon of coiling plating in the silicon wafer plating process;
when the adjusting plate moves downwards, the movable end of the supporting adjusting piece is suitable for being extruded, and the supporting adjusting piece is suitable for blowing air to the step groove to clean the step groove.
Preferably, the support adjuster includes: the fixed block and the two linkage bars are vertically fixed in the step groove; the upper ends of the two linkage bars are respectively hinged to the upper ends of the fixed blocks;
the adjusting plate is sleeved outside the fixed block and the two linkage bars; wherein,,
when the adjusting plate moves downwards, the adjusting plate is suitable for extruding the two linkage bars to move by taking the hinge point as the side wall of the axial fixed block.
Preferably, the support adjusting piece further comprises a piston sleeve, and the piston sleeve is slidably sleeved on the outer wall of the fixed block;
a piston silo is arranged in the fixed block, and a piston head is slidably arranged in the piston silo;
the upper end of the fixed block is provided with a plurality of adsorption holes, and the adsorption holes are communicated with the piston silo;
the piston head is linked with the piston sleeve; wherein,,
when the piston sleeve moves downwards, the piston head is driven to synchronously move downwards, so that the adsorption holes can adsorb and fix the silicon chip placed at the upper end of the fixed block under negative pressure.
Preferably, the two linkage bars are matched with the outer wall of the piston sleeve, wherein the two linkage bars move away from the fixed block in the direction of taking the hinge point as the axial direction, and the piston sleeve slides downwards under gravity reuse;
the two linkage bars move in the direction of axially approaching to the fixed block by taking the hinge point as an axial direction, and the two linkage bars are suitable for extruding the piston sleeve to move upwards.
Preferably, the lower end of the fixed block is provided with a through groove; a blowing supporting piece is slidably arranged in the through groove, and two movable ends of the blowing supporting piece are respectively hinged with the linkage bar; wherein,,
when the two linkage bars move in the direction of the axial fixed block by taking the hinge point as the axial fixed block, the two movable ends of the blowing support piece move in opposite directions so as to clean the step groove by blowing.
Preferably, the blowing support includes: the air blowing device comprises an air blowing sleeve and a supporting plunger, wherein the air blowing sleeve is hollow, the supporting plunger is matched with the air blowing sleeve, and the air blowing sleeve and the supporting plunger are sealed in a sliding mode;
the blowing sleeve is hinged at the lower end of one linkage bar, and the supporting plunger is hinged at the lower end of the other linkage bar;
a plurality of air outlet holes are formed in the outer wall of the air blowing sleeve; when the supporting plunger and the blowing sleeve move in opposite directions, the supporting plunger is suitable for extruding air in the blowing sleeve to flow to the step groove.
Preferably, a vertical cylinder is fixed on one side of the workbench, the movable end of the vertical cylinder is hinged to the cover plate, and the vertical cylinder is suitable for driving the cover plate to open or close.
Preferably, a workpiece groove is respectively formed in two sides of the workbench, the workpiece groove is formed along the length direction of the workbench, and the movable end of the conveying part circumferentially rotates to drive the bearing part and the silicon wafer to move from the interior of the workbench to the exterior of the workbench.
Preferably, the conveying section includes: the conveying motor, the transmission belt and the transmission columns are arranged on the side wall of the workbench in an equidistant and rotatable manner, and one end of each transmission column protrudes out of the inner wall of the workbench;
the conveying motor is fixed on the outer wall of the workbench, the transmission belt is sleeved on the outer wall of the transmission column and the end part of a rotating shaft of the conveying motor, and the conveying motor is suitable for driving the transmission belt to circumferentially rotate so as to drive the transmission column to circumferentially rotate synchronously.
On the other hand, the application also provides a working method of the silicon wafer carrier plate conveying and supporting device, after the silicon wafer is placed on the bearing part, the upper end of the fixed block is propped against the silicon wafer, the adjusting cylinder drives the adjusting plate to move downwards so as to enable the piston sleeve to slide downwards, and the piston sleeve drives the piston head to slide downwards synchronously so as to enable the adsorption hole to adsorb the silicon wafer under negative pressure, thereby improving the stability of the silicon wafer moving along with the bearing part;
after the vertical cylinder drives the cover plate to cover the workbench, the conveying part is suitable for driving the bearing part and the silicon wafer to move into the workbench so as to facilitate the film plating work of the silicon wafer;
after the silicon wafer moves into the workbench, the adjusting cylinder drives the adjusting plate to move upwards to be propped against the lower surface of the silicon wafer, and the adjusting plate can avoid the phenomenon of coiling plating in the silicon wafer plating process;
when the adjusting plate moves downwards, the adjusting plate is suitable for extruding the linkage bars, so that the linkage bars move by taking the hinge point as an axial fixed block, the two linkage bars synchronously drive the blowing sleeve and the supporting plunger to move in opposite directions, and the supporting plunger is suitable for extruding air in the blowing sleeve to flow to the step groove.
The silicon wafer carrier plate conveying and supporting device has the beneficial effects that through the matching of the bearing part and the supporting adjusting piece, when the silicon wafer is placed on the bearing part, the silicon wafer can be prevented from shaking when the bearing part is transported; when the silicon wafer is coated, the adjusting plate moves upwards to prop against the silicon wafer, so that the phenomenon of coiling and plating can be avoided; after the film plating is finished, the step groove can be cleaned; not only improves the stability of silicon wafer transportation, but also improves the quality of the silicon wafer in the film plating process and improves the working efficiency.
Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present application, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a perspective view of a preferred embodiment of a silicon wafer carrier transport support apparatus of the present application;
FIG. 2 is a perspective view of a table and a transport section of the present application;
FIG. 3 is a perspective view of the carrier of the present application;
FIG. 4 is a perspective view of the support adjustment of the present application;
fig. 5 is a longitudinal cross-sectional view of the support adjustment of the present application.
In the figure:
1. a work table; 11. a vertical cylinder; 12. a workpiece groove; 2. a conveying section; 21. a conveying motor; 22. a drive belt; 23. a drive column; 3. a cover plate;
4. a carrying part; 41. a fixing frame; 42. an adjusting plate; 43. a step groove; 44. a through groove; 45. adjusting a cylinder;
5. a support adjustment member; 51. a fixed block; 52. a linkage bar; 53. a piston sleeve; 54. a piston silo; 55. a piston head; 56. adsorption holes; 57. a blowing sleeve; 58. supporting the plunger; 59. and an air outlet hole.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the present application will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In a first embodiment, as shown in fig. 1 to 5, the present application provides a silicon wafer carrier conveying and supporting device, including: the device comprises a workbench 1, a conveying part 2, a cover plate 3, a bearing part 4 and a plurality of supporting and adjusting pieces 5, wherein one end of the cover plate 3 is hinged to one side of the workbench 1; when the cover plate 3 moves downwards and covers the workbench 1, the workbench 1 is suitable for coating a silicon wafer; the conveying parts 2 are rotatably arranged on two sides of the workbench 1, and the conveying parts 2 are suitable for driving the bearing parts 4 to horizontally move; two sides of the workbench 1 are respectively provided with a workpiece groove 12, the workpiece grooves 12 are arranged along the length direction of the workbench 1, and the movable end of the conveying part 2 circumferentially rotates to drive the bearing part 4 and the silicon wafer to move from the interior of the workbench 1 to the exterior of the workbench 1. Two workpiece grooves 12 are symmetrically formed in two sides of the workbench 1, so that the bearing part 4 drives the silicon wafer to horizontally move towards the inside of the workbench 1, and the conveying part 2 is arranged, so that the workpiece is more stable and stable when moving towards the inside of the workbench 1. The bearing part 4 is in a frame structure, and the bearing part 4 is suitable for bearing silicon wafers; the supporting and adjusting pieces 5 are circumferentially arranged around the bearing part 4, and the supporting and adjusting pieces 5 are suitable for adjusting the distance between the silicon wafer and the frame of the bearing part 4. The bearing part 4 is matched with the supporting and adjusting piece 5, when a workpiece is placed in the fixing frame 41, the fixing block 51 can absorb silicon wafers under negative pressure, so that the workpiece is prevented from colliding with the fixing frame 41 in the moving process, and the stability of the silicon wafers when placed in the fixing frame 41 is improved; and when the silicon wafer is coated, the regulating plate 42 moves upwards and is propped against the bottom wall of the silicon wafer, so that the phenomenon of film winding of the silicon wafer during coating is avoided, and the working efficiency and the coating quality are improved.
In order to support the limit silicon wafer conveniently, the bearing part 4 comprises: the fixing frame 41, the adjusting plate 42 and the adjusting cylinder 45, wherein the fixing frame 41 is rectangular, and the inside of the fixing frame 41 is hollow; the fixing frame 41 is provided with a step groove 43, and the adjusting plate 42 is arranged in the step groove 43 in a lifting manner; the adjusting cylinder 45 is fixed in the fixing frame 41, and the lower end of the adjusting cylinder 45 does not protrude out of the lower bottom surface of the fixing frame 41; the adjusting plate 42 is fixed at the movable end of the adjusting cylinder 45; the adjusting cylinder 45 is adapted to drive the adjusting plate 42 vertically up and down in the stepped groove 43; the interior of the adjusting plate 42 is hollow and rectangular consistent with the fixing frame 41, and the inner side wall of the adjusting plate 42 is coplanar with the inner side wall of the fixing frame 41; a plurality of supporting and adjusting pieces 5 are fixed in the step groove 43 at equal intervals; the adjusting plate 42 is provided with a through groove 44 matched with the supporting adjusting piece 5, and the adjusting plate 42 is linked with the supporting adjusting piece 5; wherein, when the adjusting cylinder 45 drives the adjusting plate 42 to move upwards to be propped against the lower surface of the silicon wafer, the adjusting plate 42 can avoid the phenomenon of coiling plating in the silicon wafer plating process; the adjusting plate 42 is adapted to press the movable end of the support adjusting member 5 when it moves downward, and the support adjusting member 5 is adapted to blow air toward the step groove 43 to clean the step groove 43. When the adjusting plate 42 moves downwards, the adjusting plate 42 pushes the two linkage bars 52 to move in the direction of the axial fixed block 51 by taking the hinge point as the hinge point; the blowing sleeve 57 and the supporting plunger 58 are moved toward each other to blow air into the stepped groove 43 to clean the stepped groove 43. After the silicon wafer is placed above the fixed block 51, the adjusting plate 42 moves upwards, at this time, the two linkage bars 52 move outwards with the hinge point as the axis, at this time, the two linkage bars 52 lose the extrusion of the piston sleeve 53, the piston sleeve 53 slides vertically downwards, so that the adsorption hole 56 can adsorb the silicon wafer under negative pressure, thereby avoiding the silicon wafer from shaking when moving on the fixed frame 41, and improving the stability of the silicon wafer when moving in the fixed frame 41.
In order to realize the support and fixation of the silicon wafer, the support adjusting member 5 comprises: a fixed block 51 and two linkage bars 52, wherein the fixed block 51 is vertically fixed in the step groove 43; the upper ends of the two linkage bars 52 are respectively hinged to the upper ends of the fixed blocks 51; a torsion spring is fixed on the hinge shaft between the linkage bar 52 and the fixed block 51, and the torsion spring is suitable for pushing the linkage bar 52 to move the lower end of the linkage bar in a direction away from the fixed block 51; the adjusting plate 42 is sleeved outside the fixed block 51 and the two linkage bars 52; when the adjusting plate 42 moves downward, the adjusting plate 42 is adapted to press the two linkage bars 52 to move along the side wall of the axial fixing block 51 with the hinge point as the hinge point. The linkage bars 52 are linked with the piston sleeves 53, and when the two linkage bars 52 are opened outwards and moved, the piston sleeves 53 are suitable for sliding vertically downwards along the fixed blocks 51; and the two linkage bars 52 are contracted inwards towards each other, the linkage bars 52 are suitable for pressing the piston sleeve 53 to move upwards.
In order to improve the stability of the silicon wafer on the fixed block 51, the supporting and adjusting piece 5 further comprises a piston sleeve 53, wherein the piston sleeve 53 is slidably sleeved on the outer wall of the fixed block 51; a piston silo 54 is arranged in the fixed block 51, and a piston head 55 is slidably arranged in the piston silo 54; a vertical groove is formed in one side wall of the piston silo 54, a connecting block is fixed on the outer wall of the piston head 55, the connecting block is slidably arranged in the vertical groove, the other end of the connecting block is fixed on the inner wall of the piston sleeve 53, and the piston sleeve 53 is in sliding sealing with the fixed block 51; when the piston sleeve 53 moves downwards, the piston head 55 is driven to synchronously move downwards, and when the piston sleeve 53 moves downwards to the lowest end, the uppermost end of the vertical groove is still positioned in the piston sleeve 53, so that the tightness of the vertical groove is ensured. The upper end of the fixed block 51 is provided with a plurality of adsorption holes 56, and the adsorption holes 56 are communicated with the piston silo 54; the piston head 55 is linked with the piston sleeve 53; when the piston sleeve 53 moves downwards, the piston head 55 is driven to synchronously move downwards, so that the adsorption hole 56 can adsorb and fix the silicon wafer placed at the upper end of the fixed block 51 under negative pressure; and the silicon wafer is adsorbed and fixed through the adsorption holes 56, so that the silicon wafer cannot shake relative to the fixing frame 41 when the silicon wafer moves horizontally along with the fixing frame 41, and the stability of the silicon wafer during horizontal movement is improved.
Preferably, the two linkage bars 52 are adapted to the outer wall of the piston sleeve 53, wherein the two linkage bars 52 are pushed by the torsion spring to move away from the fixed block 51 with a hinge point as an axis, and the piston sleeve 53 slides downwards under the action of gravity; the piston sleeve 53 drives the piston head 55 to synchronously drive the piston head 55 to move downwards, and at this time, the adsorption hole 56 is propped against the bottom wall of the silicon wafer, so that the piston silo 54 is suitable for adsorbing and fixing the silicon wafer when negative pressure is formed in the piston silo 54. The two linkage bars 52 move in a direction axially approaching the fixed block 51 with the hinge point as an axis, and the two linkage bars 52 are adapted to press the piston sleeve 53 to move upwards.
In order to facilitate cleaning the step groove 43, a through groove 44 is formed at the lower end of the fixed block 51; a blowing supporting member is slidably disposed in the through groove 44, and two movable ends of the blowing supporting member are respectively hinged to the linkage bars 52; when the two linkage bars 52 move in the direction of the axial fixed block 51 with the hinge point as an axis, the two movable ends of the blowing support move in opposite directions to clean the step groove 43 by blowing. The blowing support includes: the air blowing device comprises an air blowing sleeve 57 and a supporting plunger 58, wherein the air blowing sleeve 57 is hollow, the supporting plunger 58 is matched with the air blowing sleeve 57, and the air blowing sleeve 57 and the supporting plunger 58 are in sliding sealing; the blowing sleeve 57 is hinged at the lower end of one of the linkage bars 52, and the supporting plunger 58 is hinged at the lower end of the other linkage bar 52; the air blowing sleeve 57 and the supporting plunger 58 are respectively slidably arranged in the through groove 44; a plurality of air outlet holes 59 are formed in the outer wall of the air blowing sleeve 57; the air-blowing sleeve 57 is disposed at one end of the fixed block 51 near the inner side wall of the step groove 43, wherein when the adjusting plate 42 moves downward, the adjusting plate 42 presses the two linkage bars 52, so that the two linkage bars 52 move in the direction of the axial fixed block 51 with the hinge point as an axis, and when the two adjustment bars synchronously drive the supporting plunger 58 and the air-blowing sleeve 57 to move in opposite directions, the supporting plunger 58 is adapted to press the air in the air-blowing sleeve 57 to flow toward the step groove 43. When the size of the inner ring of the adjusting plate 42 is smaller than that of the inner ring of the adjusting plate 42, the adjusting plate 42 moves upward to the uppermost end, and at this time, the two linkage bars 52 are opened outwards by taking the hinge point as the axial direction, and the linkage bars 52 drive the supporting plungers 58, so that the outer end parts of the two linkage bars protrude out of the inner side walls of the fixing frame 41, thereby achieving the effect of supporting the silicon wafer.
In order to facilitate the covering of the workbench 1, a vertical air cylinder 11 is fixed on one side of the workbench 1, the movable end of the vertical air cylinder 11 is hinged on the cover plate 3, and the vertical air cylinder 11 is suitable for driving the cover plate 3 to open or close. The intersection point of the cover plate 3 and the workbench 1 is arranged on the inner side of the hinge point of the cover plate 3 and the movable end of the vertical cylinder 11, so that when the movable end of the vertical cylinder 11 moves upwards, the cover plate 3 is suitable for being driven to move downwards to cover the workbench 1.
In order to facilitate transportation of the silicon wafer, the transport section 2 includes: the conveying motor 21, the transmission belt 22 and the transmission columns 23 are arranged on the side wall of the workbench 1 in an equidistant and rotatable manner, and one end of each transmission column 23 protrudes out of the inner wall of the workbench 1; when the bearing part 4 slides into the workbench 1 along the workpiece groove 12, the transmission column 23 is suitable for supporting the bearing part 4 from the lower end and driving the bearing part 4 to horizontally move in the workbench 1; the conveying motor 21 is fixed on the outer wall of the workbench 1, the transmission belt 22 is sleeved on the outer wall of the transmission column 23 and the rotating shaft end part of the conveying motor 21, and the conveying motor 21 is suitable for driving the transmission belt 22 to circumferentially rotate so as to drive the transmission column 23 to circumferentially rotate synchronously.
An embodiment two, the present embodiment also provides a working method of a silicon wafer carrier plate conveying and supporting device on the basis of the embodiment one, which includes that the silicon wafer carrier plate conveying and supporting device according to the embodiment one has the same specific structure as the embodiment one, and the working method of the specific silicon wafer carrier plate conveying and supporting device is not described here again, and is as follows:
after the silicon wafer is placed on the bearing part 4, the upper end of the fixed block 51 is propped against the silicon wafer, the adjusting cylinder 45 drives the adjusting plate 42 to move downwards so that the piston sleeve 53 can slide downwards, and the piston sleeve 53 drives the piston head 55 to slide downwards synchronously, so that the adsorption hole 56 can adsorb the silicon wafer under negative pressure, and the stability of the silicon wafer moving along with the bearing part 4 is improved;
after the vertical cylinder 11 drives the cover plate 3 to be covered on the workbench 1, the conveying part 2 is suitable for driving the bearing part 4 and the silicon wafer to move into the workbench 1 so as to facilitate the film plating work on the silicon wafer;
after the silicon wafer moves into the workbench 1, the adjusting air cylinder 45 drives the adjusting plate 42 to move upwards to prop against the lower surface of the silicon wafer, and the adjusting plate 42 can avoid the phenomenon of coiling plating in the silicon wafer plating process;
when the adjusting plate 42 moves downwards, it is suitable for pressing the linkage bars 52 to move with the hinge point as the axial fixing block 51, and the two linkage bars 52 synchronously drive the blowing sleeve 57 and the supporting plunger 58 to move towards each other, and the supporting plunger 58 is suitable for pressing the air in the blowing sleeve 57 to flow to the step groove 43.
The components (components not illustrating the specific structure) selected in the present application are common standard components or components known to those skilled in the art, and the structures and principles thereof are known to those skilled in the art through technical manuals or through routine experimental methods. Moreover, the software program related to the application is the prior art, and the application does not relate to any improvement on the software program.
In the description of embodiments of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In the description of the present application, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the several embodiments provided by the present application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of the units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
With the above-described preferred embodiments according to the present application as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present application. The technical scope of the present application is not limited to the description, but must be determined according to the scope of claims.
Claims (10)
1. The utility model provides a silicon chip carrier carries strutting arrangement which characterized in that includes:
the device comprises a workbench (1), a conveying part (2), a cover plate (3), a bearing part (4) and a plurality of supporting adjusting pieces (5), wherein one end of the cover plate (3) is hinged to one side of the workbench (1);
the workbench (1) is suitable for coating a silicon wafer;
the conveying part (2) is rotatably arranged at two sides of the workbench (1), and the conveying part (2) is suitable for driving the bearing part (4) to horizontally move;
the bearing part (4) is of a frame structure, and the bearing part (4) is suitable for bearing silicon wafers;
the supporting adjusting pieces (5) are circumferentially arranged around the bearing part (4), and the supporting adjusting pieces (5) are suitable for adjusting the distance between the silicon chip and the frame of the bearing part (4);
the carrying part (4) comprises: the fixing frame (41), the adjusting plate (42) and the adjusting cylinder (45), wherein the fixing frame (41) is rectangular, and the inside of the fixing frame (41) is hollow;
a step groove (43) is formed in the fixing frame (41), and the adjusting plate (42) is arranged in the step groove (43) in a lifting mode;
the adjusting cylinder (45) is fixed in the fixing frame (41), and the adjusting plate (42) is fixed at the movable end of the adjusting cylinder (45);
the supporting adjusting pieces (5) are fixed in the step groove (43) at equal intervals;
the adjusting plate (42) is provided with a through groove (44) matched with the supporting adjusting piece (5), and the adjusting plate (42) is linked with the supporting adjusting piece (5); wherein,,
when the adjusting air cylinder (45) drives the adjusting plate (42) to move upwards to be propped against the lower surface of the silicon wafer, the adjusting plate (42) can avoid the phenomenon of coiling plating in the silicon wafer plating process;
the adjusting plate (42) is suitable for pressing the movable end of the supporting adjusting piece (5) when moving downwards, and the supporting adjusting piece (5) is suitable for blowing air to the step groove (43) to clean the step groove (43).
2. A silicon wafer carrier transport supporting device as defined in claim 1, wherein,
the support adjustment (5) comprises: a fixed block (51) and two linkage bars (52), wherein the fixed block (51) is vertically fixed in the step groove (43); the upper ends of the two linkage strips (52) are respectively hinged to the upper ends of the fixed blocks (51);
the adjusting plate (42) is sleeved outside the fixed block (51) and the two linkage bars (52); wherein,,
when the adjusting plate (42) moves downwards, the adjusting plate (42) is suitable for extruding the two linkage bars (52) to move by taking the hinge point as the side wall of the axial fixed block (51).
3. A silicon wafer carrier transport supporting device as defined in claim 2, wherein,
the supporting and adjusting piece (5) further comprises a piston sleeve (53), and the piston sleeve (53) is slidably sleeved on the outer wall of the fixed block (51);
a piston silo (54) is arranged in the fixed block (51), and a piston head (55) is slidably arranged in the piston silo (54);
the upper end of the fixed block (51) is provided with a plurality of adsorption holes (56), and the adsorption holes (56) are communicated with the piston silo (54);
the piston head (55) is linked with the piston sleeve (53); wherein,,
when the piston sleeve (53) moves downwards, the piston head (55) is driven to synchronously move downwards, so that the adsorption holes (56) can adsorb and fix the silicon chip placed at the upper end of the fixed block (51) under negative pressure.
4. A silicon wafer carrier transport supporting device as defined in claim 3, wherein,
the two linkage strips (52) are matched with the outer wall of the piston sleeve (53), wherein the two linkage strips (52) move in the direction away from the fixed block (51) by taking the hinge point as the axial direction, and the piston sleeve (53) slides downwards under the gravity reuse;
the two linkage strips (52) move in the direction of axially approaching the fixed block (51) by taking the hinge point as an axial direction, and the two linkage strips (52) are suitable for extruding the piston sleeve (53) to move upwards.
5. A silicon wafer carrier transport supporting device as defined in claim 4, wherein,
the lower end of the fixed block (51) is provided with a through groove (44); a blowing supporting piece is slidably arranged in the through groove (44), and two movable ends of the blowing supporting piece are respectively hinged with the linkage strip (52); wherein,,
when the two linkage bars (52) move in the direction of the axial fixed block (51) by taking the hinge point as the direction of the axial fixed block, the two movable ends of the blowing support piece move in opposite directions so as to clean the step groove (43) by blowing.
6. A silicon wafer carrier transport supporting device as defined in claim 5, wherein,
the blowing support includes: the air blowing device comprises an air blowing sleeve (57) and a supporting plunger (58), wherein the air blowing sleeve (57) is hollow, the supporting plunger (58) is matched with the air blowing sleeve (57), and the air blowing sleeve (57) and the supporting plunger (58) are in sliding sealing;
the blowing sleeve (57) is hinged at the lower end of one linkage bar (52), and the supporting plunger (58) is hinged at the lower end of the other linkage bar (52);
a plurality of air outlet holes (59) are formed in the outer wall of the air blowing sleeve (57); wherein, when the supporting plunger (58) and the blowing sleeve (57) move towards each other, the supporting plunger (58) is suitable for extruding the air in the blowing sleeve (57) to flow to the step groove (43).
7. A silicon wafer carrier transport supporting device as defined in claim 6, wherein,
a vertical air cylinder (11) is fixed on one side of the workbench (1), the movable end of the vertical air cylinder (11) is hinged to the cover plate (3), and the vertical air cylinder (11) is suitable for driving the cover plate (3) to be opened or closed.
8. A silicon wafer carrier transport supporting device as defined in claim 7, wherein,
the two sides of the workbench (1) are respectively provided with a workpiece groove (12), the workpiece grooves (12) are arranged along the length direction of the workbench (1), and the movable end of the conveying part (2) circumferentially rotates to drive the bearing part (4) and the silicon wafer to move from the interior of the workbench (1) to the exterior of the workbench (1).
9. A silicon wafer carrier transport supporting device as defined in claim 8, wherein,
the conveying section (2) comprises: the conveying motor (21), the transmission belt (22) and the transmission columns (23), wherein the transmission columns (23) are rotatably arranged on the side wall of the workbench (1) at equal intervals, and one end of each transmission column (23) protrudes out of the inner wall of the workbench (1);
the conveying motor (21) is fixed on the outer wall of the workbench (1), the transmission belt (22) is sleeved on the outer wall of the transmission column (23) and the rotating shaft end part of the conveying motor (21), and the conveying motor (21) is suitable for driving the transmission belt (22) to circumferentially rotate so as to drive the transmission column (23) to circumferentially rotate synchronously.
10. A working method of the silicon wafer carrier conveying and supporting device, which is characterized by comprising the silicon wafer carrier conveying and supporting device as claimed in claim 9,
after the silicon chip is placed on the bearing part (4), the upper end of the fixed block (51) is propped against the silicon chip, the adjusting cylinder (45) drives the adjusting plate (42) to move downwards so that the piston sleeve (53) can slide downwards, and the piston sleeve (53) drives the piston head (55) to slide downwards synchronously so that the adsorption hole (56) can adsorb the silicon chip under negative pressure, thereby improving the moving stability of the silicon chip along with the bearing part (4);
after the cover plate (3) is driven by the vertical air cylinder (11) to be covered on the workbench (1), the conveying part (2) is suitable for driving the bearing part (4) and the silicon wafer to move into the workbench (1) so as to facilitate the film plating work on the silicon wafer;
after the silicon wafer moves into the workbench (1), the adjusting air cylinder (45) drives the adjusting plate (42) to move upwards to prop against the lower surface of the silicon wafer, and the adjusting plate (42) can avoid the phenomenon of coiling plating in the silicon wafer plating process;
when the adjusting plate (42) moves downwards, the adjusting plate is suitable for extruding the linkage strips (52) to enable the linkage strips to move by taking a hinge point as an axial fixing block (51), the two linkage strips (52) synchronously drive the blowing sleeve (57) and the supporting plunger (58) to move towards each other, and the supporting plunger (58) is suitable for extruding air in the blowing sleeve (57) to flow to the step groove (43).
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| CN202310728160.7A CN116453996B (en) | 2023-06-20 | 2023-06-20 | Silicon wafer carrier plate conveying and supporting device and working method thereof |
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