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CN116453971A - Substrate processing apparatus and liquid leakage detection method - Google Patents

Substrate processing apparatus and liquid leakage detection method Download PDF

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Publication number
CN116453971A
CN116453971A CN202310026005.0A CN202310026005A CN116453971A CN 116453971 A CN116453971 A CN 116453971A CN 202310026005 A CN202310026005 A CN 202310026005A CN 116453971 A CN116453971 A CN 116453971A
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CN
China
Prior art keywords
pressure
substrate processing
processing apparatus
temperature control
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310026005.0A
Other languages
Chinese (zh)
Inventor
并木未央
笠木智仁
济藤晃至
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Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN116453971A publication Critical patent/CN116453971A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M3/00—Investigating fluid-tightness of structures
    • G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
    • G01M3/26—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/08—Means for indicating or recording, e.g. for remote indication
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M3/00—Investigating fluid-tightness of structures
    • G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
    • G01M3/26—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors
    • G01M3/28—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for pipes, cables or tubes; for pipe joints or seals; for valves ; for welds
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
    • G06Q50/10—Services
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Business, Economics & Management (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Tourism & Hospitality (AREA)
  • Marketing (AREA)
  • Economics (AREA)
  • General Health & Medical Sciences (AREA)
  • Human Resources & Organizations (AREA)
  • Health & Medical Sciences (AREA)
  • Primary Health Care (AREA)
  • Strategic Management (AREA)
  • General Business, Economics & Management (AREA)
  • Theoretical Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Examining Or Testing Airtightness (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

The present disclosure provides a substrate processing apparatus and a leakage detection method capable of detecting leakage from a flow path of a structure provided in a vacuum container with high accuracy. The substrate processing apparatus processes a substrate. The substrate processing apparatus includes: a vacuum container having an internal space that can be depressurized into a vacuum environment; a structure provided in the vacuum container and having a flow path through which a liquid temperature control medium flows; a pressure measuring device provided in a temperature-adjusting medium path communicating with the flow path, for measuring a pressure of the temperature-adjusting medium; and a notification device configured to notify information about a decrease in the pressure value when the pressure value measured by the pressure measuring device is equal to or less than a preset threshold value.

Description

Substrate processing apparatus and liquid leakage detection method
Technical Field
The present disclosure relates to a substrate processing apparatus and a liquid leakage detection method.
Background
The substrate processing apparatus includes a substrate transfer apparatus (structure) in a vacuum transfer module capable of being depressurized to a vacuum environment. In addition, the substrate processing apparatus circulates a temperature adjusting medium (e.g., cooling water) through a flow path formed inside the conveying apparatus to adjust the temperature of the substrate during conveyance. When the temperature control medium leaks from the flow path of the conveying device, defects such as corrosion in the vacuum conveying module and process abnormality due to pressure fluctuation may occur. Therefore, the substrate processing apparatus is required to detect the leakage in the vacuum transfer module in advance.
For example, patent document 1 discloses one of the following techniques: although not in the vacuum transport module, the temperature control medium of the leaked liquid is detected by the liquid leakage sensor in the cooling device disposed in the atmospheric environment.
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2020-190494
Disclosure of Invention
Problems to be solved by the invention
The present disclosure provides a technique capable of detecting leakage from a flow path of a structure provided in a vacuum container with high accuracy.
Solution for solving the problem
According to one aspect of the present disclosure, there is provided a substrate processing apparatus for processing a substrate, the substrate processing apparatus including: a vacuum container having an internal space that can be depressurized into a vacuum environment; a structure provided in the vacuum container and having a flow path through which a liquid temperature control medium flows; a pressure measuring device provided in a temperature-adjusting medium path communicating with the flow path, for measuring a pressure of the temperature-adjusting medium; and a notification device configured to notify information about a decrease in the pressure value when the pressure value measured by the pressure measuring device is equal to or less than a preset threshold value.
ADVANTAGEOUS EFFECTS OF INVENTION
According to one aspect, leakage from a flow path of a structure provided in a vacuum vessel can be detected with high accuracy.
Drawings
Fig. 1 is a schematic plan view showing a substrate processing apparatus according to an embodiment.
Fig. 2 is a schematic side view showing a conveying apparatus of the vacuum conveying module.
Fig. 3 is an explanatory view showing the structure of the regulator casing of the external temperature regulating device.
Fig. 4 is a partial side view schematically showing an installation state of the vacuum transport module and the regulator tank.
Fig. 5 is an explanatory diagram of a leakage detection method, fig. 5 (a) is a graph showing pressure measurement accompanied by leakage of cooling water from a flow path of a conveying device, and fig. 5 (B) is a graph showing a relationship between a leakage amount leaked from the flow path and a pressure value of a pressure switch.
Fig. 6 is a flowchart showing a processing flow of the leak detection method.
Detailed Description
The manner in which the present disclosure is implemented will be described below with reference to the accompanying drawings. In the drawings, the same constituent elements are denoted by the same reference numerals, and duplicate description may be omitted.
Fig. 1 is a schematic plan view showing a substrate processing apparatus 1 according to an embodiment. As shown in fig. 1, a substrate processing apparatus 1 according to one embodiment is configured as a multi-chamber type having a plurality of vacuum vessels capable of processing substrates in a vacuum environment. For example, the substrate processing apparatus 1 performs a substrate process such as an etching process for a metal film or an insulating film, an ashing process for a photoresist, a film forming process, and the like on a substrate for an FPD (hereinafter, simply referred to as a substrate G) formed of a glass material.
Examples of the FPD manufactured by processing the substrate G include a liquid crystal display (Liquid Crystal Display: LCD), electroluminescence (Electro Luminescence: EL), and a plasma display panel (Plasma Display Panel: PDP). As a material of the substrate G, a synthetic resin or the like can be applied in addition to glass. The substrate G may be any of a substrate having a circuit patterned on a surface thereof, a support substrate having no circuit, and the like. The planar dimensions of the substrate G are not particularly limited, and may be, for example, a range of about 1800mm to 3400mm on the long side and a range of about 1500mm to 3000mm on the short side.
Specifically, the substrate processing apparatus 1 includes one vacuum transport module 10, a plurality of process modules 20, and one load-lock module 30. The substrate processing apparatus 1 further includes a control unit 60 for controlling the operations of the respective modules.
The vacuum transfer module 10 is disposed in a center portion of the substrate processing apparatus 1, and is configured to transfer the substrate G to the plurality of process modules 20 and the load-lock module 30. The vacuum transfer module 10 includes a vacuum container (an example of a vacuum container) 11 for transfer, and a vacuum transfer device (a vacuum transfer robot: hereinafter simply referred to as a transfer device 12) provided in the vacuum container 11 for transfer and transferring the substrate G.
The vacuum conveyance container 11 is formed in a substantially hexagonal box shape in a plan view, and has an internal space 11a therein. The vacuum container 11 for conveyance can depressurize the internal space 11a to a vacuum environment by a depressurization mechanism, not shown. In the substrate processing apparatus 1, the load-lock module 30 is connected to one side of the vacuum chamber 11 for conveyance, and the process modules 20 are connected to the remaining five sides of the vacuum chamber 11 for conveyance.
Gate valves 21 are provided between the vacuum chamber 11 for transfer and each process module 20, and the gate valves 21 communicate with the spaces between the vacuum chamber 11 for transfer and each process module 20, so that the substrates G carried in and carried out can pass through the gate valves 21. A valve body 22 for opening and closing a carry-in/out port on the process module 20 side is provided inside each gate valve 21. Similarly, a gate valve 31 is provided between the vacuum chamber 11 for conveyance and the load-lock module 30, and the gate valve 31 communicates with the space between the vacuum chamber 11 for conveyance and the load-lock module 30, and the substrate G can pass through the gate valve 31. A valve body 32 for opening and closing a carry-in/out port on the side of the vacuum container 11 for conveyance is provided inside the gate valve 31.
Each process module 20 includes a process container (an example of a vacuum container) 23 having an internal space 23a, and a mounting table 24 for mounting the substrate G in the process container 23. After the substrates G are transferred onto the mounting table 24 by the vacuum transfer module 10, the process modules 20 decompress the internal space 23a by a decompression mechanism, not shown, and generate plasma to perform substrate processing. As described above, the substrate processing includes etching processing, ashing processing, film forming processing, and the like. The process module 20 may be configured to perform a substrate process in which plasma is not generated in the internal space 23 a. The five process modules 20 of the substrate processing apparatus 1 may perform the same substrate processing as each other, or may perform different types of substrate processing by any of the process modules 20.
The load-lock module 30 receives and delivers the substrate G between a load module (not shown) in the atmosphere and the vacuum transfer module 10 in the vacuum environment. Accordingly, the load-lock module 30 includes a load-lock container (an example of a vacuum container) 33, and the load-lock container 33 has an internal space that can be switched between an atmospheric environment and a vacuum environment. A gate valve 34 is provided between the load-lock module 30 and the load module, and the gate valve 34 communicates with the spaces of the load-lock module 30 and the load module, and the substrate G can pass through the gate valve 34. A valve body 35 for opening and closing a carry-in/out port on the load-lock module 30 side is provided inside the gate valve 34. The load-lock container 33 may independently have a loading space for loading the substrate G into the vacuum transfer module 10 and a discharging space for discharging the substrate G into the load module in the vertical direction.
Fig. 2 is a schematic side view showing the conveying device 12 of the vacuum conveying module 10. As shown in fig. 1 and 2, the transfer device 12 of the vacuum transfer module 10 transfers the substrate G in a vacuum environment in which the interior of the vacuum container 11 for transfer is depressurized. For example, the transfer device 12 advances and retreats from the vacuum transfer module 10 to and from each process module 20, thereby carrying in and carrying out the substrate G between the process modules 20. The transfer device 12 advances and retreats from the vacuum transfer module 10 to and from the load-lock module 30, thereby carrying the substrate G in and out between the load-lock module 30 and the vacuum transfer module.
Specifically, the conveying device 12 includes a fixed shaft 13, a support shaft 14, a rotation operation portion 15, a lifting operation portion 16, a base 17, a slider unit 18, and an end effector 19.
The fixed shaft 13 is formed in a cylindrical shape extending in the vertical direction. The upper end of the fixed shaft 13 is inserted into the vacuum container 11 for conveyance, and is fixed to the vacuum container 11 for conveyance. The fixed shaft 13 is fixed to an appropriate structure for supporting the vacuum transport module 10 outside the vacuum vessel 11 for transport. A support shaft 14 is disposed in the axial center of the inner side of the fixed shaft 13 so as to extend along the axial direction of the fixed shaft 13.
The support shaft 14 supports the base 17 at its upper end portion, and the support shaft 14 is provided so as to be rotatable and liftable relative to the fixed shaft 13. That is, the conveyance device 12 rotates the support shaft 14 about the θ axis, thereby rotating the structure (the base 17, the slider unit 18, and the end effector 19) supported by the support shaft 14. The conveyor 12 also lifts and lowers the support shaft 14 in the vertical direction, thereby lifting and lowering the structure supported by the support shaft 14.
The rotation operation unit 15 has a motor and a drive transmission mechanism, not shown, and the rotation operation unit 15 is connected to the control unit 60. The rotation operation unit 15 rotates the motor based on the instruction of the control unit 60, and transmits the driving force of the motor to the support shaft 14 through the drive transmission mechanism, thereby rotating the support shaft 14 around the shaft. The conveyance device 12 adjusts the orientation of the end effector 19 about the θ axis by rotating the support shaft 14. Thus, the conveyor 12 can bring the front end of the end effector 19 into facing relation with each process module 20 or load-lock module 30.
The lifting operation unit 16 has a driving source (a cylinder, a motor, etc.) not shown, and the lifting operation unit 16 is connected to the control unit 60. The lifting operation unit 16 drives the drive source based on the instruction of the control unit 60, and transmits the drive force to the support shaft 14 through the drive transmission mechanism, thereby lifting the support shaft 14. The conveyor 12 adjusts the height of the end effector 19 by raising and lowering the support shaft 14. For example, the transfer device 12 can advance and retreat the end effector 19 with respect to each space by aligning the height position of the end effector 19 with the carry-in internal space and the carry-out internal space located at different height positions in the load-lock module 30.
The base 17 is a member that supports the slider unit 18 and the end effector 19, and the base 17 extends long in the sliding direction of the slider unit 18. An electronic component, a timing belt (not shown), and the like for operating the slider unit 18 are housed in the base 17.
The slider unit 18 includes one or more rails 181, a movable body 182 movable along the rails 181, and an unshown operation unit (including a timing belt) for operating the movable body 182. Further, the movable body 182 supports the end effector 19. The operation unit is connected to the control unit 60, and slides the movable body 182 along the rail 181 based on a command from the control unit 60.
The end effector 19 moves in the horizontal direction following the sliding of the movable body 182. Thus, the end effector 19 advances and retreats with respect to the interior of each process module 20 or the interior of the load-lock module 30.
For example, the end effector 19 has a plurality of support pickups 191 that contact the lower surface of the substrate G to support. The transfer device 12 transfers and receives the substrate G between a plurality of lift pins (not shown) of each process module 20 by moving each support pickup 191 above the mounting table 24 of each process module 20. The carrier device 12 transfers and receives the substrates G to and from the load-lock modules 30 by causing the support pickers 191 to enter grooves formed in a not-shown mounting table of the load-lock modules 30.
The vacuum transport module 10 is provided with an internal temperature control mechanism 40 for cooling electronic components and the like in the transport device 12. The internal temperature adjustment mechanism 40 in the present embodiment may have a heating function in addition to the cooling function, so as to heat or insulate the substrate G.
In detail, the internal temperature adjustment mechanism 40 includes a cooling plate (adjustmentA temperature plate) 41, a communication path 41a formed inside the cooling plate 41 and through which cooling water can flow, and a flow path 42 for allowing cooling water (temperature adjusting medium) to flow through the cooling plate 41. The flow path 42 includes an internal supply flow path 43 for supplying cooling water to the cooling plate 41 and an internal discharge flow path 44 for discharging cooling water from the cooling plate 41. The temperature adjusting medium is not particularly limited to water (H 2 O) may be any of other commonly used refrigerants such as methanol, ethanol, and ethylene glycol.
The internal supply channel 43 and the internal discharge channel 44 are constituted by a plurality of pipes 43a and 44a provided in the support shaft 14 and the base 17. The pipes 43a are connected to each other by a joint not shown. The pipes 44a are also connected to each other by a joint, not shown. One end of the internal supply channel 43 communicates with an inlet-side connector 141 provided on a support shaft 14 extending outside the vacuum container 11 for conveyance. The other end of the internal supply channel 43 communicates with the inlet side of the communication channel 41a of the cooling plate 41 via a pipe 43 a. In addition, one end of the internal discharge flow path 44 communicates with an outlet-side connector 142 provided on the support shaft 14 extending outside the vacuum container 11 for conveyance. The other end of the internal discharge flow path 44 communicates with the outlet side of the communication path 41a of the cooling plate 41 via a pipe 44 a.
The internal temperature control mechanism 40 of the conveying device 12 is connected to an external temperature control device 50 provided outside (atmosphere) the vacuum container 11 for conveyance. The external temperature control device 50 includes a cooling device 51 and a temperature control medium path 52 for circulating cooling water between the cooling device 51 and the conveyance device 12. The temperature control medium path 52 includes an external supply path 52A for supplying cooling water to the conveyor 12, and an external discharge path 52B for returning the cooling water flowing through the conveyor 12 to the cooling device 51. The external temperature control device 50 includes a regulator tank 54 for controlling the pressure of the cooling water at a position midway in the external supply path 52A.
The cooling device 51 adjusts the temperature of the cooling water and circulates the cooling water between the cooling water and the conveying device 12. The cooling device 51 includes a tank for storing cooling water, a pump for pressurizing and conveying the cooling water to the external supply path 52A, a heat exchanger for cooling the cooling water recovered from the conveying device 12, and the like (none of which are shown) in the casing.
The temperature control medium path 52 is constituted by a plurality of flexible tubes having flexibility and pressure resistance, for example. Thus, even if the base 17 rotates, the temperature adjusting medium can be supplied to the cooling plate 41. A connector 53a connected to the inlet side connector 141 is provided at one end of the external supply path 52A. Similarly, a connector 53B connected to the outlet side connector 142 is provided at one end of the external discharge path 52B.
Fig. 3 is an explanatory view showing the structure of the regulator casing 54 of the external temperature regulating device 50. As shown in fig. 3, the regulator tank 54 includes a housing 541, and an inlet-side joint 542 and an outlet-side joint 543 for connecting the hoses of the external supply path 52A. The hose fixed to the external supply path 52A of the inlet-side joint 542 is connected to the cooling device 51, while the hose fixed to the external supply path 52A of the outlet-side joint 543 is connected to the conveying device 12.
The regulator box 54 includes an internal path 544 extending between the inlet-side joint 542 and the outlet-side joint 543 in the housing 541. The internal path 544 is constituted by a plurality of metal pipes, for example. The regulator tank 54 includes a shutoff valve 545, a regulator 546, and a pressure switch 547 in this order from the upstream (inlet-side joint 542) side to the downstream (outlet-side joint 543) side of the internal path 544. The user of the substrate processing apparatus 1 can operate the shutoff valve 545 and the regulator 546 by removing a cover portion, not shown, constituting the housing 541. The pressure switch 547 may be installed between the external discharge paths 52B.
The shutoff valve 545 is an on-off valve connected to the control unit 60 and capable of opening and closing the flow path of the internal path 544 under the control of the control unit 60. For example, the shutoff valve 545 is opened when the vacuum transport module 10 is normally operated, and is closed when an abnormality such as leakage of the transport device 12 occurs in the vacuum transport module 10. Thereby, the external temperature control device 50 can shut off the inflow of the cooling water into the vacuum container 11 for conveyance.
The regulator 546 is connected to the control unit 60, and is configured to adjust the pressure on the downstream side of the regulator 546 to a set pressure Pr (see fig. 5B) instructed from the control unit 60, and to maintain the set pressure Pr. The set pressure Pr is not particularly limited, but may be set in a range of about 0.1MPa to 1MPa, for example. The regulator 546 according to the present embodiment sets the set pressure Pr to 0.3MPa. The regulator 546 may also be operated manually by the user to adjust the set pressure Pr.
The pressure switch 547 is provided on the downstream side (secondary side) of the regulator 546, and thus functions as a pressure measuring device for measuring the pressure on the downstream side regulated to be constant by the regulator 546. The pressure switch 547 is connected to the control unit 60, and transmits information of the measured pressure (a signal of pressure drop) to the control unit 60. The accuracy of the pressure measurement by the pressure switch 547 is also determined by the set pressure Pr of the regulator 546, and is preferably set to a unit of about 0.01MPa, for example. The pressure switch 547 may be a pressure switch having a measurement error of less than ±0.05MPa in the measurement of pressure.
The pressure switch 547 according to the present embodiment has a function of transmitting a signal of pressure drop to the control unit 60 when the pressure value of the cooling water becomes equal to or smaller than a predetermined value. Upon receiving the signal of the pressure drop, the control unit 60 can issue an alarm, and can take measures such as changing the flow rate of the cooling water in the cooling device 51, or stopping the operation of the external temperature control device 50.
Fig. 4 is a partial side view schematically showing the installation state of the vacuum transport module 10 and the regulator box 54. As shown in fig. 4, the vacuum container 11 for conveyance of the vacuum conveyance module 10 is supported by a frame structure 55 standing from the floor in an installed state in a factory. The frame structure 55 includes a plurality of vertical frames 56 and a plurality of horizontal frames 57 connecting the plurality of vertical frames 56.
The regulator box 54 is fixed to the cross frame 57, for example, on the lower side in the vertical direction of the vacuum container 11 for conveyance. That is, the regulator box 54 is provided outside the vacuum container 11 for conveyance at a position that is easily visually checked and accessed by the user. The external supply path 52A, the external discharge path 52B, and the regulator tank 54 of the external temperature control device 50 can be visually confirmed by the user, and thus, even if the cooling water leaks (leaks) outside the vacuum container 11 for transportation, the user can easily recognize the cooling water.
Returning to fig. 1, the control unit 60 of the substrate processing apparatus 1 includes a controller main body 61 and a user interface 65 connected to the controller main body 61. The controller main body 61 can be a control computer having one or more processors 62, a memory 63, an input/output interface (not shown), and an electronic circuit. In the present embodiment, the controller main body 61 is illustrated as controlling the vacuum transfer module 10, each process module 20, and the load-lock module 30, but the control of each module may be performed by a control device (not shown) provided in each module.
The processor 62 is a combination of one or more of CPU, GPU, ASIC, FPGA, a circuit composed of a plurality of discrete semiconductors, and the like. The memory 63 includes a volatile memory and a nonvolatile memory (for example, an optical disk, a DVD, a hard disk, and a flash memory), and stores a program for operating the substrate processing apparatus 1, a process condition for substrate processing, and the like.
The user interface 65 can apply a keyboard for a user to perform a command input operation or the like to manage the substrate processing apparatus 1, a display for visually displaying the operation state of the substrate processing apparatus 1, a touch panel having both functions of display and input, or the like. The user interface 65 may have a lamp, a speaker, or the like capable of notifying an alarm of the substrate processing apparatus 1. That is, the user interface 65 functions as a notification device of the substrate processing apparatus 1.
The control unit 60 controls the vacuum transfer module 10 to transfer the substrate G. At this time, as shown in fig. 2, the control unit 60 operates the external temperature control device 50 to supply cooling water from the cooling device 51 to the conveyance device 12. Thereby, the cooling plate 41 of the susceptor 17 is cooled inside the vacuum transport module 10.
When the cooling water is circulated between the external temperature control device 50 and the conveyance device 12, the control unit 60 detects leakage of the cooling water in the vacuum conveyance module 10 based on the signal of the pressure drop received from the pressure switch 547. Examples of reasons for leakage of the cooling water from the flow path 42 of the conveyor 12 include breakage of the piping constituting the internal supply flow path 43 and the internal discharge flow path 44, deterioration with age, and loosening of the fastening between the joints. For example, the flow path 42 in the base 17 extends long in the horizontal direction (see also fig. 2), and the leakage portion of the cooling water during operation is unknown. When the conveyor 12 rotates in a state where the leakage of the cooling water occurs, the position of the cooling water falling down also fluctuates.
As described above, in the substrate processing apparatus 1, when the leakage of the cooling water occurs outside the vacuum container 11 for conveyance, the user can immediately visually confirm the leakage. However, when the cooling water leaks in the vacuum container 11 for conveyance, the user cannot visually confirm the leakage. Therefore, the substrate processing apparatus 1 according to the present embodiment detects the leakage of the cooling water with high accuracy by using the pressure value of the pressure switch 547.
Next, a method of detecting leakage of cooling water based on the pressure value will be described with reference to fig. 5. Fig. 5 is an explanatory diagram of a liquid leakage detection method, fig. 5 (a) is a graph showing pressure measurement accompanying liquid leakage of cooling water from the flow path 42 of the conveying device 12, and fig. 5 (B) is a graph showing a relationship between the amount of leakage from the flow path 42 and the pressure value of the pressure switch 547.
When leakage of the cooling water occurs from the flow path 42 of the conveying device 12, the pressure of the cooling water flowing through the flow path 42 (the pressure in the flow path) decreases according to the leakage amount. The drop in pressure in the flow path is transmitted to the pressure switch 547 on the upstream side in the flow direction of the cooling water via the external supply path 52A. Thereby, the pressure switch 547 detects a pressure value that is lowered with respect to the set pressure Pr. For example, referring to fig. 5 (B), it can be seen that: as the leakage amount of the cooling water leaked from the flow path 42 increases, the pressure value also gradually decreases.
When the pressure switch 547 recognizes that the pressure value of the pressure switch 547 has fallen by a predetermined pressure drop amount Pd with respect to the set pressure Pr regulated by the regulator 546, the pressure switch transmits a pressure drop signal to the control unit 60. Preferably, the pressure drop amount Pd is set to an appropriate value in advance based on the set pressure Pr and the flow rate of the cooling water. The ratio (Pd/Pr) of the pressure drop amount Pd to the set pressure Pr may be set to 7% to 20% of the set pressure in consideration of the error of the pressure switch 547. If the ratio is less than 7%, the possibility of error in measurement including the pressure switch 547 increases, whereas if the ratio is greater than 20%, leakage of cooling water cannot be detected in advance, and the leakage amount increases.
In the present embodiment, since the pressure Pr is set to 0.3MPa and the error of the pressure switch 547 is ±0.02MPa, the pressure drop amount Pd is set to 0.05MPa so as to include a safety margin for the error. Thus, the ratio (Pd/Pr) of the pressure drop Pd to the set pressure Pr was 16.7%.
The pressure switch 547 can set a pressure determination threshold Th calculated based on the set pressure Pr and the pressure drop amount Pd. That is, when the set pressure Pr is 0.3MPa and the pressure drop amount Pd is 0.05MPa, the pressure determination threshold Th is set to 0.25MPa obtained by subtracting the pressure drop amount Pd from the set pressure Pr. As shown in fig. 5 (B), when the pressure determination threshold Th of 0.25MPa is set, the control unit 60 can detect the cooling water leaking from the flow path 42 by a leak amount of about 0.98L/min from the signal under the pressure sent from the pressure switch 547.
Here, it is also considered that a flowmeter, not shown, is provided in the external supply path 52A and the external discharge path 52B, and the leakage amount of the cooling water is calculated by detecting the difference in the flow rate of the cooling water. The leakage amount of the cooling water in this case depends on the detection accuracy of the flow meter, but the detection accuracy of the flow meter is generally not so high. For example, when a flowmeter is applied, the amount of change in the flow rate that can be detected is about 2.0L/min.
In contrast, the substrate processing apparatus 1 can detect leakage at a stage (for example, 0.98L/min) where the leakage amount is small by using the pressure value of the cooling water obtained by the pressure switch 547 (pressure measuring device). By detecting the stage in which the leakage amount is small, the influence of the cooling water leaking into the vacuum vessel 11 for conveyance can be reduced as much as possible. Specifically, the substrate processing apparatus 1 monitors the leakage of the cooling water from the conveyance device 12 in the vacuum environment of the conveyance vacuum container 11 in which the pressure outside the piping is lower than the atmospheric environment. The pressure in the flow path is greatly reduced depending on the pressure difference between the flow path 42 having the hole which causes the leakage and the outside of the pipe, and therefore the leakage can be detected more sensitively in the vacuum environment.
The substrate processing apparatus 1 according to the present embodiment is basically configured as described above, and the operation (liquid leakage detection method) thereof will be described below.
Fig. 6 is a flowchart showing a processing flow of the leak detection method. As shown in fig. 6, when the vacuum transport module 10 is operated, the control unit 60 of the substrate processing apparatus 1 controls the operation of the external temperature control device 50 to control the temperature of the transport apparatus 12 (cooling). At this time, the control unit 60 operates the cooling device 51 to circulate the cooling water between the cooling device 51 and the conveying device 12 (step S1). When the cooling water is supplied to the conveyance device 12, the regulator 546 regulates the pressure of the secondary cooling water to a preset pressure Pr set in advance by a command of the control unit 60 or a manual operation by a user.
In addition, the pressure switch 547 provided on the secondary side of the regulator 546 continuously acquires a pressure value while the cooling water is circulated (step S2).
The pressure switch 547 compares the pressure determination threshold Th calculated and set based on the set pressure Pr with the pressure value (step S3), and determines a drop in the pressure of the cooling water from the flow path of the conveying device 12. When it is determined that there is a pressure drop, the pressure switch 547 transmits a pressure drop signal to the control unit 60. If the pressure value is equal to or lower than the pressure determination threshold Th (step S3: no), the control unit 60 receives no signal of the pressure drop, and thus determines that no cooling water leakage is occurring, and the cooling water is continuously flowing, whereas if the pressure value is equal to or lower than the pressure determination threshold Th (step S3: no), the control unit 60 receives a signal of the pressure drop, and determines that the cooling water leakage is occurring.
When there is no leakage of the cooling water, the control unit 60 determines whether or not the operation of the vacuum transport module 10 is completed (step S4). When the operation of the vacuum transport module 10 is continued (no in step S4), the process returns to step S3, and the same process is repeated. On the other hand, when the operation of the vacuum transport module 10 is completed (yes in step S4), the flow proceeds to step S5.
In step S5, the control unit 60 performs normal stop processing of the vacuum transport module 10 including the external temperature control device 50. For example, in the normal stop process, the operation of the conveyor 12 is stopped and the operation of the cooling device 51 is stopped, so that the circulation of the cooling water to the conveyor 12 is stopped.
When it is determined that the leakage of the cooling water has occurred because the pressure value is equal to or less than the pressure determination threshold Th, the control unit 60 notifies an alarm concerning the leakage of the cooling water via the user interface 65 (step S6). The user can immediately recognize that the cooling water leaks from the vacuum container 11 for transportation by recognizing the alarm from the user interface 65.
The control unit 60 performs an abnormal-time stopping process for temporarily stopping the operation of the substrate processing apparatus 1 (step S7). In the abnormal-time stop process, the operations of the respective modules are stopped after the operations being performed in the vacuum transfer module 10, the respective process modules 20, the load-lock module 30, and the like are completed. The control unit 60 controls the cooling device 51 to stop, thereby preventing the supply of cooling water to the conveyor 12.
As described above, in the leakage detection method, the leakage of the cooling water can be detected with high accuracy by monitoring the pressure value of the pressure switch 547. In addition, the user of the substrate processing apparatus 1 can grasp the leakage of the cooling water in the vacuum container 11 for conveyance in advance, and can quickly perform handling such as maintenance.
In the above embodiment, the leakage of the cooling water in the vacuum transfer module 10 is detected, but the substrate processing apparatus 1 and the leakage detection method can be applied to various configurations using a liquid-like temperature control medium. For example, the substrate processing apparatus 1 and the leakage detection method can determine leakage of the temperature control medium flowing through the temperature control mechanism of the structure (the mounting table 24, the shower head, or the like, not shown) disposed in the processing container 23 of the process module 20. Alternatively, in the case where the load-lock module 30 has a temperature adjusting mechanism, the same configuration can be adopted, of course.
Technical ideas and effects of the present disclosure described in the above embodiments are described below.
A first aspect of the present invention is a substrate processing apparatus 1 for processing a substrate, the substrate processing apparatus 1 including: a vacuum container (vacuum container 11 for conveyance) having an internal space 11a that can be depressurized into a vacuum environment; a structure (conveying device 12) provided inside the vacuum container and having a flow path 42 through which a liquid temperature control medium (cooling water) flows; a pressure measuring device (pressure switch 547) provided in the temperature control medium path 52 communicating with the flow path 42, for measuring the pressure of the temperature control medium; and a notification device (user interface 65) for notifying information about a decrease in the pressure value when the pressure value measured by the pressure measuring device is equal to or less than a preset threshold value (pressure determination threshold value Th), the notification device (user interface 65).
As described above, the substrate processing apparatus 1 can accurately detect leakage from the flow path 42 of the structure (the conveying device 12) provided in the vacuum container (the vacuum container 11 for conveyance) depressurized to the vacuum environment. Thus, the substrate processing apparatus 1 can quickly cope with defects such as corrosion in the vacuum chamber due to leakage of the temperature control medium and process abnormality due to pressure fluctuation.
Further, a regulator 546 for regulating the pressure of the temperature control medium in the temperature control medium path 52 to a set pressure Pr is provided upstream of the pressure measuring device (pressure switch 547) in the temperature control medium path 52, and the pressure measuring device measures the pressure on the secondary side of the regulator 546. In this way, the substrate processing apparatus 1 can measure the pressure adjusted to the set pressure Pr by the regulator 546 by the pressure measuring device, and can stably monitor the pressure drop of the temperature control medium caused by the leakage of the liquid from the flow path 42.
Further, the substrate processing apparatus 1 includes a control unit 60 for controlling the substrate processing apparatus, and the control unit 60 acquires a pressure drop signal from a pressure measuring device (pressure switch 547). The pressure measuring device sets a threshold value (pressure determination threshold Th) based on the set pressure Pr, and determines that the temperature control medium is flowing normally when the pressure value of the pressure measuring device is larger than the threshold value, and transmits a signal of pressure drop to the control unit 60 when the pressure value of the pressure measuring device is equal to or smaller than the threshold value, and the control unit 60 determines that the temperature control medium leaks. Thus, the substrate processing apparatus 1 can determine the leakage of the temperature control medium with higher accuracy based on the pressure value of the pressure measuring device.
The control unit 60 is provided with a module (vacuum conveyance module 10) including a vacuum container (conveyance vacuum container 11) and a structure (conveyance device 12), and when it is determined that the temperature control medium leaks, it cuts off the supply of cooling water to the structure and stops the operation of the module after the current operation of the module is completed. Thus, the substrate processing apparatus 1 can suppress the influence of the leakage of the temperature control medium on the substrate G in advance without wasting the substrate G currently being processed.
The structure is a conveyor 12 configured to convey the substrate G. Thus, the substrate processing apparatus 1 can easily detect the leakage of the temperature control medium from the conveyor 12 when the leakage occurs.
The conveying device 12 includes: an end effector 19 that supports the substrate G; a temperature control plate (cooling plate 41) disposed opposite to the end effector 19, wherein a communication path 41a through which a temperature control medium flows is provided inside the temperature control plate (cooling plate 41); and a flow path 42 that communicates with the communication path 41a of the temperature adjustment plate. Thus, the substrate processing apparatus 1 can detect leakage of the temperature control medium with high accuracy when the temperature control medium is circulated through the temperature control plate.
The conveyor 12 can rotate the end effector 19 and the temperature adjustment plate (cooling plate 41). Thus, even when the flow path 42 of the temperature control medium in the vacuum container 11 for conveyance moves along with the rotation of the temperature control plate, the substrate processing apparatus 1 can quickly recognize the leakage of the temperature control medium, and the influence of the leakage can be reduced.
In addition, the temperature adjusting medium is cooling water. Thus, the substrate processing apparatus 1 can stably detect the leakage of the cooling water even in the vacuum container 11 for conveyance in the vacuum environment.
In addition, a second aspect of the present disclosure is a liquid leakage detection method of a substrate processing apparatus 1, the substrate processing apparatus 1 including: a vacuum container (vacuum container 11 for conveyance) having an internal space 11a that can be depressurized into a vacuum environment; and a structure (conveying device 12) provided inside the vacuum container and having a flow path 42 through which a liquid temperature-adjusting medium flows, wherein the liquid leakage detection method comprises the steps of: acquiring a pressure value of the temperature-adjusting medium measured by a pressure measuring device (pressure switch 547) provided in the temperature-adjusting medium path 52 communicating with the flow path 42; and notifying, by a notification device (user interface 65), information on a decrease in the pressure value when the acquired pressure value is equal to or less than a preset threshold value. In this case, the leak detection method can also detect a leak with high accuracy from the flow path 42 of the structure provided in the vacuum container depressurized to the vacuum environment.
Further, a regulator 546 is provided in the temperature control medium path 52 upstream of the pressure measuring device (pressure switch 547), and the regulator 546 is configured to regulate the pressure of the temperature control medium in the temperature control medium path 52 to a set pressure Pr, and in the step of acquiring the pressure value of the temperature control medium, the pressure on the secondary side of the regulator 546 is acquired. The substrate processing apparatus 1 is further provided with a control unit 60, and the control unit 60 controls the substrate processing apparatus 1 to acquire a pressure drop signal from the pressure measuring instrument. The pressure measuring device sets a threshold value based on the set pressure Pr, and determines that the temperature is to be adjusted when the pressure value of the pressure measuring device is greater than the threshold value
On the other hand, when the pressure value of the pressure measuring instrument is equal to or smaller than the threshold value, the control unit 60 sends a signal indicating a pressure drop to the control unit 5, and the control unit 60 determines that the temperature-adjusting medium leaks. In addition, in the case of the optical fiber,
the temperature control device comprises a module (vacuum conveying module 10) comprising a vacuum container (vacuum container 11 for conveying) and a structure (conveying device 12), and when the leakage of a temperature control medium is determined, the supply of cooling water to the structure is cut off, and the operation of the module is stopped. The structure is a conveying device 12 configured to convey the substrate G. In addition, the temperature adjusting medium is cooling water.
0 the substrate processing apparatus 1 and the leakage detection method according to the embodiment of the present disclosure are all
The faces are illustrative and not limiting. The embodiments can be modified and improved in various ways without departing from the spirit of the appended claims. The matters described in the above embodiments may be structured otherwise within the range of no contradiction, and may be combined within the range of no contradiction.
Description of the reference numerals
5 1: a substrate processing apparatus; 11: a vacuum container for conveyance; 11a: an inner space; 12: a conveying device; 52: a temperature regulating medium path; 547: a pressure switch; 65: a user interface; th: a pressure determination threshold.

Claims (14)

1. A substrate processing apparatus for processing a substrate, the substrate processing apparatus comprising:
a vacuum container having an internal space that can be depressurized into a vacuum environment;
a structure provided in the vacuum container and having a flow path through which a liquid temperature control medium flows;
a pressure measuring device provided in a temperature-adjusting medium path communicating with the flow path, for measuring a pressure of the temperature-adjusting medium; and
and a notification device configured to notify information about a decrease in the pressure value when the pressure value measured by the pressure measuring device is equal to or less than a preset threshold value.
2. The substrate processing apparatus according to claim 1, wherein,
a regulator that regulates the pressure of the temperature control medium in the temperature control medium path to a set pressure is provided on the upstream side of the pressure measuring device in the temperature control medium path,
the pressure measuring device measures the pressure on the secondary side of the regulator.
3. The substrate processing apparatus according to claim 2, wherein,
comprises a control unit for controlling the substrate processing apparatus,
the pressure gauge acquires the pressure value,
the pressure gauge sets the threshold value based on the set pressure,
when the pressure value is equal to or lower than the threshold value, the pressure measuring device transmits a pressure drop signal to the control unit,
the control unit determines that the temperature adjustment medium leaks when the control unit receives the signal of the pressure drop.
4. The substrate processing apparatus according to claim 3, wherein,
having a module comprising the vacuum vessel and the structure,
the control unit cuts off the supply of the temperature control medium to the structure when the leakage of the temperature control medium is determined, and stops the operation of the module after the current operation of the module is completed.
5. The substrate processing apparatus according to claim 1 or 2, wherein,
the structure is a conveying device configured to convey the substrate.
6. The substrate processing apparatus according to claim 5, wherein,
the conveying device comprises:
an end effector that supports the substrate;
a temperature control plate disposed opposite to the end effector, the temperature control plate having a communication path through which the temperature control medium flows; and
and the flow path is communicated with the communication path of the temperature regulating plate.
7. The substrate processing apparatus according to claim 6, wherein,
the conveyor is capable of rotating the end effector and the temperature adjustment plate.
8. The substrate processing apparatus according to any one of claims 1 to 7, wherein,
the temperature adjusting medium is cooling water.
9. A liquid leakage detection method is provided, which is a liquid leakage detection method of a substrate processing device,
the substrate processing apparatus includes:
a vacuum container having an internal space that can be depressurized into a vacuum environment; and
a structure provided in the vacuum container and having a flow path through which a liquid temperature control medium flows,
the liquid leakage detection method comprises the following steps:
acquiring a pressure value of the temperature-adjusting medium measured by a pressure measuring device provided in a temperature-adjusting medium path communicating with the flow path; and
when the acquired pressure value is equal to or less than a preset threshold value, information about the decrease in the pressure value is notified by a notification device.
10. The method for detecting leakage according to claim 9, wherein,
a regulator that regulates the pressure of the temperature control medium in the temperature control medium path to a set pressure is provided on the upstream side of the pressure measuring device in the temperature control medium path,
in the step of acquiring the pressure value of the temperature adjusting medium, the pressure on the secondary side of the regulator is acquired.
11. The method for detecting leakage according to claim 10, wherein,
comprises a control unit for controlling the substrate processing apparatus,
the pressure value is acquired by the pressure measuring device, the threshold value is set based on the set pressure, and when the pressure value is equal to or lower than the threshold value, a signal of pressure drop is sent to the control unit, and the control unit determines that the temperature control medium leaks.
12. The method for detecting leakage according to claim 11, wherein,
having a module comprising the vacuum vessel and the structure,
when it is determined that the temperature control medium leaks, the supply of the temperature control medium to the structure is cut off, and the operation of the module is stopped.
13. The liquid leakage detection method according to any one of claims 9 to 12, wherein,
the structure is a conveying device configured to convey a substrate.
14. The liquid leakage detection method according to any one of claims 9 to 13, wherein,
the temperature adjusting medium is cooling water.
CN202310026005.0A 2022-01-17 2023-01-09 Substrate processing apparatus and liquid leakage detection method Pending CN116453971A (en)

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