CN116419495A

CN116419495A - Conductive pattern and forming method thereof

Info

Publication number: CN116419495A
Application number: CN202111645152.3A
Authority: CN
Inventors: 徐国良
Original assignee: Beijing Dream Ink Technology Co Ltd
Current assignee: Beijing Dream Ink Technology Co Ltd
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2023-07-11
Also published as: WO2023123804A1

Abstract

The invention discloses a conductive pattern and a forming method thereof, relating to the technical field of electronic circuit manufacture; the conductive pattern forming method comprises the following steps: providing a base layer; forming a patterned release layer over the base layer; wherein, at least a first area consistent with the target conductive pattern exists on the area of the base layer which is not covered by the release layer; a conductive material is applied over the first region of the base layer to form a conductive trace consistent with the target conductive pattern. According to the invention, the patterned release layer is formed on the base layer, and the patterned selective attachment interface for the conductive material is realized by utilizing the low adhesion characteristic of the release layer to the conductive material and matching with the high adhesion characteristic of the base layer to the conductive material; at this time, the conductive material may form the conductive pattern through a non-patterning molding process. Compared with the traditional chemical etching process, the method has the advantages of simple process, rapid molding and high cost.

Description

Conductive pattern and forming method thereof

Technical Field

The invention belongs to the technical field of electronic circuit manufacturing, and particularly relates to a conductive pattern and a forming method thereof.

Background

At present, most printed circuit boards on the market realize patterning of conductive lines through a chemical etching process, and the target circuit board is obtained through more than ten procedures of masking, exposure, development, etching, photoresist removal and the like, so that the defects of complex process, long period, high cost, environmental pollution and the like exist, and meanwhile, the method also does not meet the development requirements of energy conservation and environmental protection in the future.

Disclosure of Invention

Accordingly, an objective of the present invention is to provide a conductive pattern forming method to solve the problems of complex process, low efficiency and high cost in the prior art.

In some illustrative embodiments, the conductive pattern forming method includes: providing a base layer; forming a patterned release layer over the base layer; wherein, at least a first area consistent with the target conductive pattern exists on the area of the base layer which is not covered by the release layer; a conductive material is applied over the first region of the base layer to form a conductive trace consistent with the target conductive pattern.

In some alternative embodiments, the applying a conductive material on the first region of the base layer to form a conductive trace consistent with the target conductive pattern includes: and applying a conductive material covering the first area on the release layer to form a conductive line consistent with the target conductive pattern.

In some alternative embodiments, before the forming of the conductive line consistent with the target conductive pattern, the method further comprises: and removing the conductive material attached on the release layer.

In some alternative embodiments, the conductive material has a first adhesion on the base layer and the conductive material has a second adhesion on the release layer; wherein the first adhesion is greater than the second adhesion; the removing the conductive material attached to the release layer comprises: providing an external force between the first adhesive force and the second adhesive force, and removing the conductive material adhered on the release layer.

In some alternative embodiments, after the forming of the conductive line consistent with the target conductive pattern, further comprising: and removing the release layer.

In some alternative embodiments, before forming the patterned release layer over the base layer, further comprising: forming a patterned insulating layer over the base layer; the release layer is formed on the insulating layer and is consistent with the pattern of the insulating layer.

In some alternative embodiments, the insulating layer is a solder mask formed from a solder resist.

In some alternative embodiments, the conductive material is applied to the first region of the base layer by one or more of chemical vapor deposition, physical vapor deposition, spray coating, spin coating, dip coating, printing, direct writing, coating, knife coating.

In some alternative embodiments, the conductive material is selected from polymer composite conductive ink.

Another object of the present invention is to provide a conductive pattern to solve the problems of the prior art.

In some illustrative embodiments, the conductive pattern is formed by the conductive pattern forming method of any one of the above.

Compared with the prior art, the invention has the following advantages:

according to the invention, the patterned release layer is formed on the base layer, and the patterned selective attachment interface for the conductive material is realized by utilizing the low adhesion characteristic of the release layer to the conductive material and matching with the high adhesion characteristic of the base layer to the conductive material; at this time, the conductive material may form the conductive pattern through a non-patterning molding process. Compared with the traditional chemical etching process, the method has the advantages of simple process, rapid molding and high cost.

Drawings

FIG. 1 is a flowchart of a method for forming a conductive pattern according to an embodiment of the present invention;

fig. 2 is a process example of a conductive pattern forming method according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of an embodiment of a conductive pattern according to the present invention;

FIG. 4 is a second example of a process of the conductive pattern forming method according to the embodiment of the present invention;

FIG. 5 is a process example III of a conductive pattern forming method according to an embodiment of the present invention;

fig. 6 is a schematic diagram of a second embodiment of the conductive pattern;

fig. 7 is a structural example three of a conductive pattern in the embodiment of the present invention.

Detailed Description

The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may involve structural, logical, electrical, process, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in, or substituted for, those of others. The scope of embodiments of the invention encompasses the full ambit of the claims, as well as all available equivalents of the claims. These embodiments of the invention may be referred to herein, individually or collectively, by the term "invention" merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed.

Release agents (also known as mold release agents) in the prior art are commonly used in the field of mold manufacturing, and release agents are used to form a release film on the inner side of a mold, so that the subsequent mold release treatment of the mold is facilitated, and the quality of the mold is ensured. The applicant finds that the low adhesion property of the release agent after curing is also applicable to conductive materials in the field of electronic circuit manufacturing, and the adhesion force of the conductive materials on the release film is almost zero; therefore, the selective adhesion or adhesion differentiation of the conductive material can be realized by matching the conventional circuit substrate with the patterned release film, and the forming process of the conductive material is not dependent on the patterning forming process, and the patterned conductive circuit can be obtained only by non-patterning indifferent whole-surface forming technologies such as coating, knife coating and the like.

It should be noted that, all the technical features in the embodiments of the present invention may be combined with each other without conflict.

The embodiment of the invention discloses a conductive pattern forming method, in particular, as shown in fig. 1-3, fig. 1 is a flow example of the conductive pattern forming method in the embodiment of the invention; fig. 2 is a process example of a conductive pattern forming method according to an embodiment of the present invention; FIG. 3 is a schematic diagram of an embodiment of a conductive pattern according to the present invention; the conductive pattern forming method comprises the following steps:

step S11, providing a base layer 10;

step S12, forming a patterned release layer 20 on the base layer 10;

wherein, at least a first area 11 consistent with the target conductive pattern exists on the area of the base layer 10 not covered by the release layer 20;

the pattern of the release layer 20 is designed according to the target conductive pattern, which is opposite to the target conductive pattern, specifically, after the patterned release layer 20 is formed on the base layer 10, the surface of the base layer 10 not covered by the release layer 20 cooperates with the side surface of the release layer 20 to form a circuit groove (i.e. the first region 11 on the base layer) consistent with the target conductive pattern for accommodating the conductive material.

Optionally, a second region 12 that does not overlap the first region 11 may also be present on the region of the base layer 10 not covered by the release layer 20, and the second region 12 of the base layer 10 may be used to match with fixing, marking, other user-defined function requirements, and the like. If the area of the base layer not covered by the release layer has no effect, all the area of the base layer not covered by the release layer can be used as a first area and is consistent with the target conductive pattern.

Step S13, applying a conductive material on the first region 11 of the base layer 10 to form a conductive line 30 consistent with the target conductive pattern.

The base layer in the embodiments of the present invention is not limited to a light-transmitting substrate or a light-shielding substrate, a soft substrate or a hard substrate, a single substrate or a composite substrate, etc.; specifically, for example, one or more of glass fiber board, half glass fiber board, wood, glass, stone, plastic, PMMA (acryl), PET, PVC, PU, PC, PA, PI, TPE, TPU, PTV, PDMS, silica gel, fabric, and the like are compounded. When the composite substrate is selected as the base layer, a composite substrate with a conductive material (such as a metal material) may be selected, but the composite substrate needs to be far away from the conductive circuit formed in the embodiment of the present invention.

The release layer in the embodiment of the invention can be formed by a release agent or a release film (a sheet-shaped film material formed by the release agent); the release agent is not limited to an aqueous release agent or an oily release agent, and the curing method is not limited to photo-curing or thermal curing.

Optionally, the manner of forming the patterned release layer on the base layer in step S12 is not limited to the following implementation of the molding process:

a. directly attaching the patterned release film on the base layer to obtain a patterned release layer;

b. attaching a whole release film on the base layer, and then carrying out patterning treatment on the release film through a patterning material reduction process (such as laser etching, mechanical etching and the like) to obtain a patterned release layer;

c. directly printing a release agent on the base layer through a patterning printing technology (such as screen printing, letterpress printing, intaglio printing, pad printing, transfer printing and the like), and curing to obtain a patterned release layer;

d. applying a release agent (such as roll coating, spray coating, spin coating, dipping, knife coating, etc.) on the base layer based on the mask, and curing to obtain a patterned release layer;

f. printing the whole surface of the UV release agent on the base layer, and removing the cured release agent by a selective development exposure technology to obtain the patterned release layer.

The forming manner of the patterned release layer in the embodiment of the present invention may be implemented by other processes in the prior art besides the above, which is not described herein again.

The conductive material in the embodiments of the present invention may be applied to the base layer by one or more of chemical vapor deposition, physical vapor deposition, direct writing, spraying, printing, coating, knife coating. The conductive material may be formed by chemical vapor deposition or physical vapor deposition, or by direct writing, spraying, printing, coating, or knife coating, by liquid metal or polymer composite conductive ink.

The polymer composite conductive ink in this embodiment is not limited to carbon-based conductive ink, metal particle conductive ink (e.g., conductive silver paste, conductive aluminum paste, conductive copper paste, silver nanowires, gold nanowires, etc.), liquid metal conductive ink (e.g., liquid metal, composite conductive paste doped with liquid metal), particle-free conductive ink, etc.

The liquid metal in the embodiment of the invention refers to low-melting-point metal simple substances or alloys with melting points below 300 ℃, such as gallium-based alloys, indium-based alloys, bismuth-based alloys, tin-based alloys and the like; preferably, the liquid metal in the embodiment of the invention is gallium simple substance or gallium-based alloy with the melting point below 30 ℃. In other embodiments, the liquid metal of embodiments of the present invention may also be doped with conductive or non-conductive particles to form a viscous paste material.

Preferably, the conductive material application manner in the embodiment of the present invention is particularly suitable for non-patterned forming processes, such as chemical vapor deposition, physical vapor deposition, coating, and knife coating processes; the conductive material is attached only to the underlying layer not covered by the release layer based on a patterned selection interface for the conductive material formed by the cooperation of the underlying layer and the release layer.

Furthermore, when the polymer composite conductive ink is selected as the conductive material, the coating of the conductive material can be realized through a knife coating process, compared with the coating (roller coating), the process of ink homogenizing, ink transferring and the like between rollers is not needed, and the pressurizing pair roller between rollers does not exist, so that the problem of material phase separation of the polymer composite conductive ink is not easy to cause.

Although the adhesion of the release layer to the conductive material is significantly reduced compared with the conventional circuit substrate, the adhesion between the release layer formed by the release agent made of different materials and the conductive material made of different materials is still different, so that when the conductive material is applied, the situation that the conductive material adheres to the release layer is easy to occur, but the adhesion of the conductive material on the release layer is extremely low and is far smaller than that of the conductive material on the base layer, so that the conductive material adhering to the release layer can be removed by providing an external force between the two adhesion forces, and the conductive line is not easily damaged due to the fact that the external force is smaller than that of the conductive material on the base layer, and further, the effect that the conductive material adheres only to the target area of the base layer is achieved by removing the conductive material on the release layer.

As shown in fig. 4, fig. 4 is a process example two of a conductive pattern forming method according to an embodiment of the invention; specifically, the conductive material has a first adhesive force on the base layer, and the conductive material has a second adhesive force on the release layer; wherein the first adhesion is greater than the second adhesion; the removing the conductive material 30a attached on the release layer 20 includes: providing an external force between the first adhesive force and the second adhesive force, and removing the conductive material 30a adhered on the release layer 20.

Preferably, the manner of removing the conductive material attached to the release layer is not limited to scraping, rubbing, shaking, bumping, etc., and in other embodiments, the conductive material with poor adhesion on the release layer may be adhered by an adhesive tape or the like.

As shown in fig. 5, fig. 5 is a process example three of a conductive pattern forming method according to an embodiment of the present invention; in some embodiments, when the polymer composite conductive ink is selected as the conductive material, after the polymer composite conductive ink 30b is coated on the release layer 20, the uncured polymer composite conductive ink 30b on the release layer 20 may be removed by a doctor blade, and only the polymer composite conductive ink 30b attached to the base layer 10 remains and is cured. In other embodiments, after the polymer composite conductive ink 30b is cured, an external force between the first adhesion force and the second adhesion force is provided to remove the cured polymer composite conductive ink 30b adhered on the release layer 20.

In some embodiments, the release layer 20 is not a desired structure of the circuit board, and thus, after the formation of the target conductive trace, may further include: the release layer 20 is removed. Wherein, the release layer can be removed by a special cleaning agent corresponding to the components of the release layer. For example, an aqueous type cleaning agent (such as water) can be selected for removing the aqueous release agent, and an oily type cleaning agent (such as solvent oil or methylene dichloride) can be selected for removing the oily release agent.

In the embodiment of the present invention, the conductive circuit 30 is formed in the circuit groove of the first area of the base layer 10 not covered by the release layer 20, so the thickness of the release layer 20 determines the thickness of the conductive circuit 30 to a certain extent, but the thickness of the release layer 20 is extremely thin, generally 1-5 μm, and for some conductive materials, the conductive performance of the conductive circuit 30 in the thickness range is poor, and cannot meet the electrical performance index required by the user.

Fig. 6 is a schematic diagram of a second example of a conductive pattern according to an embodiment of the present invention, as shown in fig. 6-7; fig. 7 is a structural example three of a conductive pattern in the embodiment of the present invention; before forming the patterned release layer 20 in step S12 in the embodiment of the present invention, the method may further include: forming a patterned insulating layer 40 over the base layer 10; the pattern of the insulating layer 40 is identical to the pattern of the release layer 20, and is designed according to the actual pattern of the target conductive pattern, which is opposite to the target conductive pattern; after that, a release layer 20 is formed over the insulating layer 40 in conformity with the pattern of the insulating layer 40. At this time, the surface of the base layer 10 not covered by the insulating layer 40 (and the release layer 20) cooperates with the sides of the insulating layer 40 and the release layer 20 to form a circuit groove (i.e. the first region on the base layer) consistent with the target conductive pattern for accommodating the conductive material.

The purpose of the insulating layer in this embodiment is to deepen the depth of the line grooves, thereby increasing the thickness of the formed conductive line to achieve the electrical performance required by the user. The thickness of the insulating layer may range from 30 to 2000 μm; in some cases, the thickness of the release layer is negligible. Preferably, the thickness of the insulating layer in the embodiments of the present invention is 40-100 μm, thereby forming a conductive line of about 40-100 μm.

The forming process of the patterned insulating layer in the embodiment of the present invention may refer to the forming process of the release layer, which is not described herein.

Preferably, the insulating layer is made of UV (photo-curing) insulating ink, selective curing is realized by LCD, DLP or SLA photo-curing technology, and the patterned insulating layer can be obtained after the uncured insulating ink is removed.

The LCD light curing technology is to realize the light patterning by matching a light source with an LCD digital mask, the DLP light curing technology is to realize the light patterning by directly adopting a light pattern projection mode, and the SLA light curing technology is to realize the light patterning by controlling laser scanning. Compared with the traditional mask plate, the LCD, DLP or SLA light curing technology can realize light patterning by software control due to digital electronic driving, does not need a plate making process, can greatly improve the circuit manufacturing efficiency, and can meet the personalized circuit design requirement of users.

Specifically, insulating ink is applied on the base layer, then light opposite to the target conductive pattern is applied on the insulating ink through the selective photo-curing technology, the area of the insulating ink irradiated by the light is cured, and after the uncured insulating ink is removed, the insulating layer opposite to the target conductive pattern is obtained.

In some embodiments, after forming a patterned insulating layer on the base layer, forming a patterned release layer on the insulating layer may be accomplished by:

the release agent is applied on the patterned insulating layer in a roller coating mode, wherein the thickness of the insulating layer is ensured to be larger than that of the release agent on the roller, so that when the release agent is coated by roller, the release agent is only in contact with the surface of the insulating layer and cannot be in contact with the base layer lower than the insulating layer, the release agent on the roller is only transferred onto the patterned insulating layer, and the release layer consistent with the pattern of the insulating layer is formed after curing.

In some embodiments, the release layer consistent with the insulating layer pattern may be formed by transfer printing, that is, a transfer film with a release agent is provided, the thickness of the release agent on the transfer film is smaller than that of the insulating layer, the transfer film is attached to the insulating layer, and the release layer consistent with the insulating layer pattern is obtained after removing the transfer film and curing.

In other embodiments, when the insulating layer is formed by using UV-type insulating ink, the insulating ink may be applied to the base layer first, then a transfer film (transparent film) with a release agent is attached to the insulating ink, and then selective curing of the insulating ink is achieved by a photo-curing technique, where the release agent is attached to the cured insulating layer, and the release agent has no adhesion to the uncured insulating ink, and after the transfer film is removed, the release agent is attached to the cured insulating layer only, and the release agent in contact with the uncured insulating ink is carried by the transfer film, and then the uncured insulating ink is removed, thereby obtaining a patterned insulating layer and a release layer consistent with the pattern of the insulating layer.

In other embodiments, the insulating ink and the UV-type release agent may be selected, the insulating ink is applied on the base layer, then the transfer film (transparent film) with the release agent is attached on the insulating ink, then the selective curing of the insulating ink and the release agent is realized by the photo-curing technology, and after the transfer film is removed, the uncured insulating ink and release agent are removed, thereby obtaining the patterned insulating layer and the release layer consistent with the pattern of the insulating layer.

In some embodiments, the purpose of the insulating layer is only to increase the thickness of the conductive line, so that the release layer and the insulating layer can be removed sequentially after the conductive line is formed. The removal of the insulating layer is not limited to the corresponding solvent or the like.

In some embodiments, the insulating layer in embodiments of the present invention is a solder mask formed from a solder resist (also referred to as solder resist ink, solder resist green oil, etc.), which can be used to avoid the attachment of solder, solder paste, etc. In the embodiment, the insulating layer is replaced by the solder mask layer formed by selecting the solder mask, so that the thickness of the conductive circuit can be increased, and on the other hand, the release layer is removed and then exposed after the conductive circuit is formed, so that the solder mask performance is provided for the subsequent welding and other processes, the solder mask process is integrated into the conductive circuit forming process, the subsequent processes of applying, exposing, developing and the like of the solder mask are avoided, the whole process is simplified, and the manufacturing efficiency is greatly improved.

The solder resist can realize the characteristic of low adhesion to the metal material in a molten state, and in some cases, the release agent can be replaced by the release agent to form a release layer, but the release agent still has extremely strong adhesive force to the high-polymer composite conductive ink, so that the release agent is required to be used to form the release layer when the high-polymer composite conductive ink is selected as the conductive material, thereby reducing the adhesive force to the conductive material.

Example 1

In this embodiment, the conductive material is conductive silver paste, and the conductive pattern forming method includes:

step S21, providing a base layer;

step S22, a release agent is printed on the basic layer through a silk screen, and a patterned release layer is formed after curing;

step S23, coating the conductive silver paste on the release layer, so that the conductive silver paste is only attached to the area of the base layer which is not covered by the release layer and is not attached to the release layer;

and step S24, curing to obtain the patterned conductive circuit.

In this embodiment, the conductive silver paste is applied by a roll coating manner, similar to a transfer printing technique, because the adhesion force of the release layer to the conductive silver paste is extremely low, the conductive silver paste still remains on the surface of the roll body after contacting the release layer, is not easy to adhere to the release layer, and can be removed by the cleaning method in the embodiment of the invention even if a small amount of adhesion occurs.

Example 2

In this embodiment, the conductive material is liquid metal, and the conductive pattern forming method includes:

step S31, providing a base layer;

step S32, applying the whole surface of the insulating ink on the base layer, obtaining a patterned insulating layer through a selective photo-curing technology, and removing uncured insulating ink;

step S33, coating a release agent on the patterned insulating layer, and curing to obtain a release layer consistent with the insulating layer;

and step S34, coating liquid metal on the release layer, so that the liquid metal only adheres to the area of the base layer which is not covered by the release layer and does not adhere to the release layer, and the target circuit board is obtained.

In this embodiment, since the liquid metal is selected as the conductive material to form the conductive circuit, compared with the conductive silver paste, the liquid metal has a large surface tension and a lower adhesive force, so that the liquid metal is less likely to adhere to the release layer, and the liquid metal is not adhered to the release layer when the liquid metal is coated by the roller coating process.

Example 3

In the embodiment, the conductive material is conductive silver paste, the insulating ink is UV solder resist, and the conductive pattern forming method comprises the following steps:

step S41, providing a base layer;

step S42, the whole surface of the UV type solder resist is applied to the base layer, a patterned solder resist layer is obtained through a selective photo-curing technology, and uncured solder resist is removed;

step S43, coating a release agent on the patterned solder resist layer, and curing to obtain a release layer consistent with the solder resist layer;

step S44, scraping conductive silver paste on the release layer to enable the silver paste to cover the area of the base layer which is not covered by the release layer, and curing;

step S45, removing the solidified conductive silver paste on the release layer to obtain a patterned conductive circuit;

and S46, removing the release layer, and exposing the solder mask layer at the bottom layer to obtain the target circuit board.

Another object of the present invention is to propose a conductive pattern comprising: a base layer 10, a patterned release layer 20 formed over the base layer 10, and conductive traces 30 formed on areas of the base layer 10 not covered by the release layer 20. At least a first region 11 corresponding to the target conductive pattern exists on the region of the base layer 10 not covered by the release layer 20, and the conductive line 30 is formed on the first region 11.

In some embodiments, between the base layer 10 and the release layer 20 may further include: the insulating layer 40 is patterned in conformity with the release layer 20 to increase the thickness of the conductive trace 30.

In some embodiments, the release layer 20 and the insulating layer 40 in embodiments of the present invention may be removed to include only the base layer 10 and the conductive traces 30, or the base layer 10, the insulating layer 40, and the conductive traces 30.

In some embodiments, the insulating layer 40 may be a solder mask formed of a solder resist.

Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

Claims

1. A conductive pattern forming method, comprising:

providing a base layer;

forming a patterned release layer over the base layer; wherein, at least a first area consistent with the target conductive pattern exists on the area of the base layer which is not covered by the release layer;

a conductive material is applied over the first region of the base layer to form a conductive trace consistent with the target conductive pattern.

2. The method of forming a conductive pattern according to claim 1, wherein applying a conductive material on the first region of the base layer to form a conductive line consistent with the target conductive pattern comprises:

and applying a conductive material covering the first area on the release layer to form a conductive line consistent with the target conductive pattern.

3. The conductive pattern forming method according to claim 2, further comprising, before the forming of the conductive line conforming to the target conductive pattern:

and removing the conductive material attached on the release layer.

4. The conductive pattern forming method according to claim 3, wherein the conductive material has a first adhesive force on the base layer, and the conductive material has a second adhesive force on the release layer; wherein the first adhesion is greater than the second adhesion;

the removing the conductive material attached to the release layer comprises:

providing an external force between the first adhesive force and the second adhesive force, and removing the conductive material adhered on the release layer.

5. The conductive pattern forming method according to claim 1, further comprising, after the forming of the conductive line conforming to the target conductive pattern:

and removing the release layer.

6. The conductive pattern forming method according to claim 1 or 5, characterized by further comprising, before forming a patterned release layer over the base layer:

forming a patterned insulating layer over the base layer;

the release layer is formed on the insulating layer and is consistent with the pattern of the insulating layer.

7. The conductive pattern forming method according to claim 6, wherein the insulating layer is a solder resist layer formed of a solder resist.

8. The method of claim 1, wherein the conductive material is applied to the first region of the base layer by one or more of chemical vapor deposition, physical vapor deposition, spray coating, spin coating, dipping, printing, direct writing, coating, knife coating.

9. The method of forming a conductive pattern according to claim 1, wherein the conductive material is a polymer composite conductive ink.

10. A conductive pattern formed by the conductive pattern forming method according to any one of claims 1 to 9.