CN116375016A - Method for preparing high-heat-conductivity polyimide graphite film by chemical imidization of doped graphene - Google Patents
Method for preparing high-heat-conductivity polyimide graphite film by chemical imidization of doped graphene Download PDFInfo
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 93
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 66
- 229920001721 polyimide Polymers 0.000 title claims abstract description 32
- 239000004642 Polyimide Substances 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 25
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 24
- 239000010439 graphite Substances 0.000 title claims abstract description 24
- 239000000126 substance Substances 0.000 title claims abstract description 13
- 229920005575 poly(amic acid) Polymers 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 22
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000003153 chemical reaction reagent Substances 0.000 claims abstract description 18
- 150000004985 diamines Chemical class 0.000 claims abstract description 16
- 239000006185 dispersion Substances 0.000 claims abstract description 14
- 239000002131 composite material Substances 0.000 claims abstract description 11
- 239000002798 polar solvent Substances 0.000 claims abstract description 11
- 239000002002 slurry Substances 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims abstract description 8
- 238000003756 stirring Methods 0.000 claims abstract description 8
- 238000010000 carbonizing Methods 0.000 claims abstract description 3
- 238000001132 ultrasonic dispersion Methods 0.000 claims abstract description 3
- 238000001816 cooling Methods 0.000 claims abstract 6
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- 238000010345 tape casting Methods 0.000 claims abstract 2
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 claims description 27
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 19
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- 239000000203 mixture Substances 0.000 claims description 10
- 230000003014 reinforcing effect Effects 0.000 claims description 10
- 238000003763 carbonization Methods 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 9
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000005087 graphitization Methods 0.000 claims description 7
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims description 6
- 239000000178 monomer Substances 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 4
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 claims description 4
- 239000003880 polar aprotic solvent Substances 0.000 claims description 4
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- -1 diphenyl ether diamine Chemical class 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 2
- YXZUDXLWSOZHFN-UHFFFAOYSA-N 2,3-diethylpyridine Chemical compound CCC1=CC=CN=C1CC YXZUDXLWSOZHFN-UHFFFAOYSA-N 0.000 claims description 2
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 claims description 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- 229920001732 Lignosulfonate Polymers 0.000 claims description 2
- 229920001046 Nanocellulose Polymers 0.000 claims description 2
- 229920002472 Starch Polymers 0.000 claims description 2
- 239000012300 argon atmosphere Substances 0.000 claims description 2
- 235000010290 biphenyl Nutrition 0.000 claims description 2
- 239000004305 biphenyl Substances 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- 239000004816 latex Substances 0.000 claims description 2
- 229920000126 latex Polymers 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 2
- 235000019698 starch Nutrition 0.000 claims description 2
- 239000008107 starch Substances 0.000 claims description 2
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- 238000010030 laminating Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 31
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 230000002776 aggregation Effects 0.000 description 4
- 238000005054 agglomeration Methods 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000012024 dehydrating agents Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- FIVHKITUWGUSPD-UHFFFAOYSA-N C1=NC=CC2=CC=CC=C12.C(C)(=O)OC(C)=O Chemical compound C1=NC=CC2=CC=CC=C12.C(C)(=O)OC(C)=O FIVHKITUWGUSPD-UHFFFAOYSA-N 0.000 description 1
- UVBFASMDGVKRAM-UHFFFAOYSA-N acetyl acetate 2-methylpyridine Chemical compound CC1=NC=CC=C1.C(C)(=O)OC(C)=O UVBFASMDGVKRAM-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 150000001336 alkenes Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
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- 230000006872 improvement Effects 0.000 description 1
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- 239000011261 inert gas Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000011268 mixed slurry Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/20—Graphite
- C01B32/205—Preparation
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/182—Graphene
- C01B32/194—After-treatment
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/182—Graphene
- C01B32/198—Graphene oxide
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Abstract
Description
技术领域technical field
本发明属于薄膜技术领域,具体涉及一种掺杂石墨烯化学亚胺化制备高导热聚酰亚胺石墨膜的方法。The invention belongs to the technical field of thin films, and in particular relates to a method for preparing a high thermal conductivity polyimide graphite film by chemical imidization of doped graphene.
背景技术Background technique
高分子材料聚酰亚胺(PI)具有优异的耐高低温性、良好的耐化学腐蚀性、突出的电绝缘性和高尺寸稳定性等诸多优点,广泛应用于航天、电子等领域。为了拓宽其在高导热和高散热领域中的应用,提高聚酰亚胺PI树脂基体的导热性能是必不可少的。聚酰亚胺高导热石墨薄膜基本靠进口,我国聚酰亚胺薄膜生产主要采用热亚胺化法制膜工艺,和国外化学亚胺化法制膜工艺相比,生产效率低,热尺寸稳定性差,强度低,热稳定性低,采用此类热亚胺化法制膜工艺生产的前驱体PI基膜在高温碳化过程中裂解,表面起皱无光泽,导热系数低,不耐折,无法满足高导热石墨膜工艺制膜要求。中国专利CN106853966A将石墨烯加入到强极性有机溶剂中分散,先加入二胺,再将二酐分加入反应聚合化学亚胺化法制膜;氧化石墨由于存在着易分解的含氧官能团,在较高温度下极易脱氧变黑,且需避免与还原性物质接触,而优先加入的二胺一般具有还原性,二胺与二酐反应会放出较大热量,影响分散效果,会导致团聚,最终降低导热性能及均匀性。The polymer material polyimide (PI) has many advantages such as excellent high and low temperature resistance, good chemical corrosion resistance, outstanding electrical insulation and high dimensional stability, and is widely used in aerospace, electronics and other fields. In order to broaden its application in the fields of high thermal conductivity and high heat dissipation, it is essential to improve the thermal conductivity of polyimide PI resin matrix. Polyimide high thermal conductivity graphite film basically relies on imports. The production of polyimide film in my country mainly adopts thermal imidization film production process. Compared with foreign chemical imidization film production process, the production efficiency is low and the thermal dimensional stability is poor. Low strength and low thermal stability. The precursor PI base film produced by this kind of thermal imidization method is cracked during the high temperature carbonization process, the surface is wrinkled and dull, the thermal conductivity is low, and it is not resistant to folding and cannot meet high thermal conductivity. Film production requirements of graphite film process. Chinese patent CN106853966A joins graphene in strong polar organic solvent to disperse, first adds diamine, then adds dianhydride to reaction polymerization chemical imidization method to make membrane; It is very easy to deoxidize and turn black at high temperature, and it is necessary to avoid contact with reducing substances, and the diamine that is preferentially added is generally reducing, and the reaction between diamine and dianhydride will release a large amount of heat, which will affect the dispersion effect and lead to agglomeration. Reduce thermal conductivity and uniformity.
发明内容Contents of the invention
针对上述存在的技术问题,本发明提供了一种掺杂石墨烯化学亚胺化制备高导热聚酰亚胺石墨膜的方法,本发明通过在亚胺化试剂中分散氧化石墨烯,与氧化石墨烯表面羧基、羟基形成氢键作用,有利于氧化石墨烯片层剥离分散,避免团聚,解决氧化石墨烯容易团聚,不易分散的特性,导致薄膜取向较差,造成制备的石墨膜表面不同区域导热率差别较大的问题;本发明还通过在氧化石墨烯浆料中引入增强相在保证导热性能的基础上增强其强度。In view of the above-mentioned technical problems, the invention provides a method for preparing high thermal conductivity polyimide graphite film by chemical imidization of doped graphene. The present invention disperses graphene oxide in imidization reagent, and Carboxyl groups and hydroxyl groups on the surface of olefins form hydrogen bonds, which is conducive to the peeling and dispersion of graphene oxide sheets, avoiding agglomeration, and solving the characteristics of graphene oxide that is easy to agglomerate and difficult to disperse, resulting in poor film orientation, resulting in heat conduction in different areas on the surface of the prepared graphite film The problem of large difference in rate; the present invention also enhances its strength on the basis of ensuring thermal conductivity by introducing a reinforcing phase into the graphene oxide slurry.
本发明的技术方案为:Technical scheme of the present invention is:
本发明涉及一种掺杂石墨烯化学亚胺化制备高导热聚酰亚胺石墨膜的方法,包括以下步骤:The invention relates to a method for preparing a high thermal conductivity polyimide graphite film by chemical imidization of doped graphene, comprising the following steps:
S1、将二胺与二酐依次加入至极性溶剂A中,充分搅拌溶解,得到聚酰胺酸树脂溶液;S1, adding diamine and dianhydride to polar solvent A in sequence, fully stirring and dissolving to obtain a polyamic acid resin solution;
S2、将氧化石墨烯、增强相加入亚胺化试剂中,超声分散,得到氧化石墨烯分散液;S2, adding the graphene oxide and the reinforcing phase into the imidization reagent, and ultrasonically dispersing to obtain a graphene oxide dispersion;
S3、将步骤S1制得的聚酰胺酸树脂溶液和步骤S2制得的氧化石墨烯分散液混合,得到聚酰胺酸浆料,然后依次进行离心脱泡、流延成膜,并经高温亚胺化处理后,得到氧化石墨烯掺杂聚酰亚胺复合薄膜;S3. Mix the polyamic acid resin solution prepared in step S1 with the graphene oxide dispersion prepared in step S2 to obtain a polyamic acid slurry, which is then sequentially subjected to centrifugal defoaming, casting into a film, and subjected to high-temperature imine After chemical treatment, a graphene oxide-doped polyimide composite film is obtained;
S4、将氧化石墨烯掺杂聚酰亚胺复合薄膜进行高温碳化,然后降至室温,获得碳化膜;S4, carbonizing the graphene oxide-doped polyimide composite film at high temperature, and then lowering it to room temperature to obtain a carbonized film;
S5、将碳化膜进行高温石墨化,然后降至室温,获得高导热聚酰亚胺石墨膜。S5. Perform high-temperature graphitization on the carbonized film, and then lower it to room temperature to obtain a polyimide graphite film with high thermal conductivity.
优选地,步骤S1中,所述二胺为二苯醚二胺、对苯二胺、4,4'-联苯胺、4,4'-二氨基二苯酮中的一种或多种的混合;所述二酐为均苯四甲酸二酐、二苯醚二酐、联苯二酐中的一种或多种的混合;所述二胺与所述二酐为等摩尔比,总重占聚酰胺酸树脂溶液总质量的15-20%。Preferably, in step S1, the diamine is a mixture of one or more of diphenyl ether diamine, p-phenylenediamine, 4,4'-benzidine, and 4,4'-diaminobenzophenone ; The dianhydride is a mixture of one or more of pyromellitic dianhydride, diphenyl ether dianhydride, and biphenyl dianhydride; the diamine is in an equimolar ratio to the dianhydride, and the total weight accounts for 15-20% of the total mass of the polyamic acid resin solution.
优选地,步骤S1中,将二胺和二酐分别加入的具体操作方式为:先将二胺单体一次性加入极性溶剂A中,待充分溶解后,再将二酐单体随着搅拌反应的进行分批加入。Preferably, in step S1, the specific operation method of adding the diamine and dianhydride separately is: first add the diamine monomer into the polar solvent A at one time, and after fully dissolving, then add the dianhydride monomer with stirring The reaction was added in portions.
优选地,步骤S2中,所述的亚胺化试剂为乙酸酐与触媒以及极性溶剂B的混合物,触媒为吡啶、甲基吡啶、二乙基吡啶、异喹啉中的一种或多种;其中乙酸酐/触媒的摩尔比为2~5:1,乙酸酐与触媒质量之和占亚胺化试剂总重的20-50%。Preferably, in step S2, the imidization reagent is a mixture of acetic anhydride, catalyst and polar solvent B, and the catalyst is one or more of pyridine, picoline, diethylpyridine, and isoquinoline ; Wherein the molar ratio of acetic anhydride/catalyst is 2-5:1, and the sum of the mass of acetic anhydride and catalyst accounts for 20-50% of the total weight of the imidization reagent.
优选地,步骤S2中,氧化石墨烯是通过Humers法制得的氧化石墨烯,本发明通过将氧化石墨烯分散在亚胺化试剂中,避免了氧化石墨烯脱氧还原、团聚和聚集的现象,能够保持氧化石墨烯分散均匀,提升了产品的导热性能且导热更加均匀。Preferably, in step S2, graphene oxide is graphene oxide prepared by the Humers method. The present invention avoids the phenomenon of graphene oxide deoxidation reduction, agglomeration and aggregation by dispersing graphene oxide in the imidization reagent, and can Keep the graphene oxide dispersed evenly, improve the thermal conductivity of the product and make the heat conduction more uniform.
优选地,步骤S1中,极性溶剂A为极性非质子溶剂,包括N-甲基吡咯烷酮、N,N-二甲基甲酰胺、N,N-二甲基乙酰胺或二甲基亚砜中的任意一种或多种;步骤S2中,亚胺化试剂所用极性溶剂B也为极性非质子溶剂,包括N-甲基吡咯烷酮、N,N-二甲基甲酰胺、N,N-二甲基乙酰胺或二甲基亚砜中的任意一种或多种。Preferably, in step S1, the polar solvent A is a polar aprotic solvent, including N-methylpyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide or dimethylsulfoxide Any one or more of them; in step S2, the polar solvent B used in the imidization reagent is also a polar aprotic solvent, including N-methylpyrrolidone, N, N-dimethylformamide, N, N - any one or more of dimethylacetamide or dimethyl sulfoxide.
优选地,步骤S2中,所述增强相为溶胀型淀粉醚及其衍生物、木质纤维素及其衍生物、可再分散性乳胶粉、木质素磺酸盐及其衍生物、纳米纤维素及其衍生物、碳纳米管、碳纤维中一种或多种按任意比例混合而成;所述增强相与氧化石墨烯质量比为(0~50):(50~100)。Preferably, in step S2, the reinforcing phase is swelling starch ether and its derivatives, lignocellulose and its derivatives, redispersible latex powder, lignosulfonate and its derivatives, nanocellulose and One or more of its derivatives, carbon nanotubes, and carbon fibers are mixed in any proportion; the mass ratio of the reinforcing phase to graphene oxide is (0-50): (50-100).
优选地,步骤S2中,超声分散的时间为60-180min。Preferably, in step S2, the time for ultrasonic dispersion is 60-180 minutes.
优选地,步骤S3所用的氧化石墨烯分散液中氧化石墨烯的含量为聚酰胺酸树脂溶液固含重量的0.1-1%。Preferably, the content of graphene oxide in the graphene oxide dispersion used in step S3 is 0.1-1% of the solid content of the polyamic acid resin solution.
优选地,步骤S3中,制得聚酰胺酸浆料后,将所得的聚酰胺酸浆料经离心脱泡机脱泡后,在玻璃板上流延成膜,采用阶段升温的方式,在60-80℃下保温20-30min,在170-190℃下保温20-30min,在300-320℃下保温10-20min,在400-425℃下保温5-10min,得到氧化石墨烯掺杂聚酰亚胺复合薄膜。Preferably, in step S3, after the polyamic acid slurry is prepared, the obtained polyamic acid slurry is degassed by a centrifugal degassing machine, and cast on a glass plate to form a film, and the temperature is raised in stages, at 60- Insulate at 80°C for 20-30min, at 170-190°C for 20-30min, at 300-320°C for 10-20min, and at 400-425°C for 5-10min to obtain graphene oxide doped polyimide Amine composite film.
优选地,S4步骤中,高温炭化的具体步骤如下:将氧化石墨烯掺杂聚酰亚胺复合薄与石墨纸交叉层叠置于真空碳化炉中的恒温区间,并施加一定压力(10-20g/cm2),然后进行碳化处理,在400-500℃保持20-30min,600-700℃保持20-30min,750-850℃保持20-30min,900-1000℃保持20-30min,1100-1200℃保持20-30min,然后自然降温至室温,获得碳化膜。Preferably, in the S4 step, the specific steps of high-temperature carbonization are as follows: the graphene oxide-doped polyimide composite thin and graphite paper are cross-laminated in the constant temperature interval in the vacuum carbonization furnace, and a certain pressure (10-20g/ cm 2 ), then carry out carbonization treatment, keep at 400-500°C for 20-30min, at 600-700°C for 20-30min, at 750-850°C for 20-30min, at 900-1000°C for 20-30min, at 1100-1200°C Keep for 20-30min, then cool down to room temperature naturally to obtain carbonized film.
优选地,S5步骤中,高温石墨化的具体步骤如下:将碳化膜与石墨纸交叉层叠置于石墨化炉中的恒温区间,并施加一定压力(10-20g/cm2),在氩气氛围中先1.5-2h升温至1100-1200℃,再2.5-3h升温至1900-2000℃保持,再2-2.5h升温至2600-2800℃并保持50-60min,然后自然降温至室温,获得高导热聚酰亚胺石墨膜。Preferably, in step S5, the specific steps of high-temperature graphitization are as follows: the carbonized film and graphite paper are cross-laminated and placed in the constant temperature range of the graphitization furnace, and a certain pressure (10-20g/cm 2 ) is applied, in an argon atmosphere In the first 1.5-2h, the temperature is raised to 1100-1200°C, then the temperature is raised to 1900-2000°C for 2.5-3h, and then the temperature is raised to 2600-2800°C and kept for 50-60min, and then the temperature is naturally cooled to room temperature to obtain high thermal conductivity. Polyimide graphite film.
本发明的有益效果是:The beneficial effects of the present invention are:
(1)本发明将氧化石墨烯分散在亚胺化试剂中,一方面亚胺化试剂内的脱水剂乙酸酐与氧化石墨烯(GO)上的羰基、羟基氢形成氢键,减少氧化石墨烯片层间结合,有更好的分散效果,再通过化学亚胺化试剂中的脱水剂和催化剂的共同作用,使聚酰胺酸转化为聚酰亚胺,制备出具有高取向的薄膜;(1) The present invention disperses graphene oxide in the imidization reagent. On the one hand, the dehydrating agent acetic anhydride in the imidization reagent forms hydrogen bonds with the carbonyl and hydroxyl hydrogen on the graphene oxide (GO), reducing the amount of graphene oxide. The inter-lamellar combination has a better dispersion effect, and through the combined action of the dehydrating agent and the catalyst in the chemical imidization reagent, the polyamic acid is converted into polyimide, and a film with high orientation is prepared;
(2)本发明通过在氧化石墨烯浆料中引入增强相得到氧化石墨烯混合浆料,将其掺杂到聚酰亚胺酸中制备的导热膜在保证导热性能的基础上层间取向更好、强度更高;(2) In the present invention, the graphene oxide mixed slurry is obtained by introducing a reinforcing phase into the graphene oxide slurry, and the thermal conduction film prepared by doping it into polyimide acid has a better interlayer orientation on the basis of ensuring thermal conductivity. Good, higher strength;
(3)实际生产中,在反应溶剂釜内超声分散氧化石墨烯,设备工艺难以实现,本发明提出的在亚胺化试剂中分散石墨烯,设备易实现,适应大规模生产;本发明通过化学亚胺化制备高导热聚酰亚胺石墨膜,生产效率高,综合性能更优越,本发明更贴近实际产业化生产工艺,设备可行性高。(3) in actual production, ultrasonically disperse graphene oxide in the reaction solvent tank, and equipment technology is difficult to realize, and disperse graphene in the imidization reagent that the present invention proposes, equipment is easy to realize, adapts to large-scale production; The present invention adopts chemical The high thermal conductivity polyimide graphite film prepared by imidization has high production efficiency and superior comprehensive performance. The present invention is closer to the actual industrial production process and has high equipment feasibility.
具体实施方式Detailed ways
为使本发明的目的、技术方案和优点更加清楚明了,下面结合具体实施方式,对本发明进一步详细说明。应该理解,这些描述只是示例性的,而并非要限制本发明的范围。此外,在以下说明中,省略了对公知结构和技术的描述,以避免不必要地混淆本发明的概念。In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with specific embodiments. It should be understood that these descriptions are exemplary only, and are not intended to limit the scope of the present invention. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concept of the present invention.
实施例1Example 1
在氮气气氛中,将二胺19.15g ODA(4,4'-二氨基二苯醚)和二酐20.85g PMDA(均苯四甲酸二酐)按等摩尔比分别加入到168.7mL DMF(N,N-二甲基甲酰胺)中,具体操式为:先将二胺ODA单体一次性加入到DMF溶液中,待充分溶解后,再将二酐PMDA单体随着搅拌反应的进行分批加入,恒温保护搅拌反应5h,得到溶质浓度为20wt%聚酰胺酸树脂溶液。In a nitrogen atmosphere, diamine 19.15g ODA (4,4'-diaminodiphenyl ether) and dianhydride 20.85g PMDA (pyromellitic dianhydride) were added to 168.7mL DMF (N, In N-dimethylformamide), the specific operation formula is: firstly add the diamine ODA monomer into the DMF solution at one time, after fully dissolving, then add the dianhydride PMDA monomer in batches with stirring reaction Adding, stirring and reacting at constant temperature for 5 hours to obtain a polyamic acid resin solution with a solute concentration of 20 wt%.
以天然鳞片石墨为原料,采用Hummer法制备得到氧化石墨烯。Graphene oxide was prepared from natural flake graphite by the Hummer method.
配制亚胺化试剂乙酸酐-异喹啉和DMF混合物(亚胺化试剂浓度为24%,乙酸酐与触媒摩尔比为AA:IQ=5:2)。A mixture of imidization reagent acetic anhydride-isoquinoline and DMF was prepared (the imidization reagent concentration was 24%, and the molar ratio of acetic anhydride to catalyst was AA:IQ=5:2).
将木质纤维素(增强相)与制得的氧化石墨烯混合(木质纤维素与氧化石墨烯的质量比为1:10),加入配制的亚胺化试剂,超声分散2h,得到氧化石墨烯分散液。Mix lignocellulose (reinforcing phase) with the prepared graphene oxide (the mass ratio of lignocellulose to graphene oxide is 1:10), add the prepared imidization reagent, and ultrasonically disperse for 2 hours to obtain graphene oxide dispersion liquid.
向上述氧化石墨烯分散液中加入聚酰胺酸树脂溶液中(氧化石墨烯分散液的加入量为聚酰胺酸树脂溶液质量的40%,其中氧化石墨烯质量含量为聚酰胺酸树脂溶液固含的0.1%),然后迅速搅拌均匀,离心脱泡后在玻璃板上流延成膜,进入烘箱处理在80℃下保温20min,在180℃下保温30min,在300℃下保温20min,在425℃下保温5min,得到氧化石墨烯掺杂聚酰亚胺复合薄膜。Add in the above-mentioned graphene oxide dispersion liquid in the polyamic acid resin solution (the add-on of graphene oxide dispersion liquid is 40% of the polyamic acid resin solution quality, wherein the graphene oxide mass content is solidly contained in the polyamic acid resin solution 0.1%), then stir quickly evenly, cast film on a glass plate after centrifugation and defoaming, enter the oven for treatment, keep warm at 80°C for 20min, keep warm at 180°C for 30min, keep warm at 300°C for 20min, and keep warm at 425°C 5min, the graphene oxide doped polyimide composite film was obtained.
将所得的氧化石墨烯掺杂聚酰亚胺薄膜与石墨纸交叉层叠置于真空碳化炉中的恒温区间,并施加一定压力(17g/cm2),然后程序升温进行碳化处理,具体升温过程为:在500℃保持30min,700℃保持30min,850℃保持30min,1000℃保持30min,1200℃保持30min,然后自然降温至室温,获得碳化膜;The resulting graphene oxide-doped polyimide film and graphite paper are cross-laminated and placed in the constant temperature range of the vacuum carbonization furnace, and a certain pressure (17g/cm 2 ) is applied, and then the temperature is programmed to raise the carbonization treatment. The specific temperature rise process is as follows: : Keep at 500°C for 30min, 700°C for 30min, 850°C for 30min, 1000°C for 30min, 1200°C for 30min, then cool down to room temperature naturally to obtain carbonized film;
将碳化膜与石墨纸交叉层叠置于石墨化炉中的恒温区间,并施加一定压力(20g/cm2),在惰性气体氛围中进行石墨化处理,具体为:先1.5h升温至1100℃,再2.5h升温至2000℃保持,再2h升温至2600℃并保持50min,然后自然降温至室温,获得高导热聚酰亚胺石墨膜。Lay the carbonized film and graphite paper cross-layered in the constant temperature zone of the graphitization furnace, and apply a certain pressure (20g/cm 2 ), and carry out graphitization treatment in an inert gas atmosphere. Then raise the temperature to 2000°C for another 2.5 hours, then raise the temperature to 2600°C for another 2 hours and keep it for 50 minutes, then cool down to room temperature naturally to obtain a polyimide graphite film with high thermal conductivity.
实施例2Example 2
氧化石墨烯质量含量为聚酰胺酸树脂溶液固含的0.3%,其他条件与实施例1相同。The mass content of graphene oxide is 0.3% of the solid content of the polyamic acid resin solution, and other conditions are the same as in Example 1.
实施例3Example 3
氧化石墨烯质量含量为聚酰胺酸树脂溶液固含的0.5%,其他条件与实施例1相同。The mass content of graphene oxide is 0.5% of the solid content of the polyamic acid resin solution, and other conditions are the same as in Example 1.
实施例4Example 4
氧化石墨烯质量含量为聚酰胺酸树脂溶液固含的0.7%,其他条件与实施例1相同。The mass content of graphene oxide is 0.7% of the solid content of the polyamic acid resin solution, and other conditions are the same as in Example 1.
实施例5Example 5
氧化石墨烯质量含量为聚酰胺酸树脂溶液固含的0.9%,其他条件与实施例1相同。The mass content of graphene oxide is 0.9% of the solid content of the polyamic acid resin solution, and other conditions are the same as in Example 1.
实施例6Example 6
配制亚胺化试剂乙酸酐-甲基吡啶和DMF混合物(亚胺化试剂浓度为24%,乙酸酐与触媒摩尔比为AA:AP=5:2),其他条件与实施例1相同。Prepare imidization reagent acetic anhydride-picoline and DMF mixture (imidization reagent concentration is 24%, acetic anhydride to catalyst molar ratio is AA:AP=5:2), other conditions are the same as Example 1.
实施例7Example 7
增强相为碳纳米管,其他条件与实施例1相同。The reinforcing phase is carbon nanotubes, and other conditions are the same as in Example 1.
实施例8Example 8
将木质纤维素(增强相)与制得的氧化石墨烯按照1:1的的质量比混合,其他条件与实施例1相同。Lignocellulose (enhanced phase) was mixed with the obtained graphene oxide in a mass ratio of 1:1, and other conditions were the same as in Example 1.
实施例9Example 9
将木质纤维素(增强相)与制得的氧化石墨烯按照1:100的质量比混合,其他条件与实施例1相同。Lignocellulose (enhanced phase) was mixed with the obtained graphene oxide at a mass ratio of 1:100, and other conditions were the same as in Example 1.
对比例1Comparative example 1
氧化石墨烯质量含量为聚酰胺酸树脂溶液固含的0.05%,其他条件与实施例1相同。The mass content of graphene oxide is 0.05% of the solid content of the polyamic acid resin solution, and other conditions are the same as in Example 1.
对比例2Comparative example 2
氧化石墨烯质量含量为聚酰胺酸树脂溶液固含的1.2%,其他条件与实施例1相同。The mass content of graphene oxide is 1.2% of the solid content of the polyamic acid resin solution, and other conditions are the same as in Example 1.
对比例3Comparative example 3
氧化石墨烯不在亚胺化试剂中分散,改为在168.7mL DMF中分散2h,质量含量为聚酰胺酸树脂溶液固含的0.1%,其他条件与实施例1相同。Graphene oxide was not dispersed in the imidization reagent, but was instead dispersed in 168.7mL DMF for 2h, with a mass content of 0.1% of the solid content of the polyamic acid resin solution, and other conditions were the same as in Example 1.
对比例4Comparative example 4
不含增强相,其他条件与实施例1相同。Without reinforcing phase, other conditions are the same as in Example 1.
对比例5Comparative example 5
将木质纤维素(增强相)与制得的氧化石墨烯按照2:1的质量比混合,其他条件与实施例1相同。Lignocellulose (enhanced phase) was mixed with the obtained graphene oxide at a mass ratio of 2:1, and other conditions were the same as in Example 1.
将实施例1-9和对比例1-5的石墨膜进行性能测试The graphite film of embodiment 1-9 and comparative example 1-5 is carried out performance test
(1)导热系数能测试方法:参照ASTM E 1461相关规定进行。(1) Thermal conductivity test method: refer to the relevant regulations of ASTM E 1461.
实验室环境条件:23℃±2℃,50%±5%RH。Laboratory environmental conditions: 23°C±2°C, 50%±5%RH.
具体测试结果如表1所示:The specific test results are shown in Table 1:
表1Table 1
应当理解的是,本发明的上述具体实施方式仅仅用于示例性说明或解释本发明的原理,而不构成对本发明的限制。因此,在不偏离本发明的精神和范围的情况下所做的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。此外,本发明所附权利要求旨在涵盖落入所附权利要求范围和边界、或者这种范围和边界的等同形式内的全部变化和修改例。It should be understood that the above specific embodiments of the present invention are only used to illustrate or explain the principle of the present invention, and not to limit the present invention. Therefore, any modification, equivalent replacement, improvement, etc. made without departing from the spirit and scope of the present invention shall fall within the protection scope of the present invention. Furthermore, it is intended that the appended claims of the present invention embrace all changes and modifications that come within the scope and metesques of the appended claims, or equivalents of such scope and metes and bounds.
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