CN116356317A - Metal foil with carrier and manufacturing method thereof - Google Patents

Abstract

The invention discloses a metal foil with a carrier and a manufacturing method thereof, wherein the metal foil with the carrier comprises a carrier layer, a stripping layer and a metal foil layer, the carrier layer, the stripping layer and the metal foil layer are sequentially laminated, the stripping layer is made of a metal and nonmetal composite material, and the thickness of the stripping layer is 100-1000 angstroms. The stripping layer of the metal foil with the carrier is made of the metal and nonmetal composite material, so that the problems of easy adhesion and pinhole generation caused by similar properties of metal and metal foil layers are avoided, and the problems of poor conductivity of organic matters and uneven forming thickness are also avoided. The thickness of the release layer is controlled to be in the range of 100 to 1000 angstroms so that the metal foil layer can be uniformly formed on the release layer while also facilitating separation between the release layer and the metal foil layer.

Description

Metal foil with carrier and manufacturing method thereof

technical field

The invention relates to the field of material technology, in particular to a metal foil with a carrier and a manufacturing method thereof.

Background technique

At present, the substrate is a processing material of a flexible printed circuit board (Flexible Printed Circuit board, FPC), which usually consists of a flexible insulating base film and a metal foil with a carrier. When preparing the substrate in the prior art, usually the side of the metal foil with carrier (including the carrier layer and the metal foil layer) provided with the metal foil layer is pressed with the flexible insulating base film to obtain the substrate. When using the substrate, the carrier layer needs to be peeled off. However, since the metal foil with carrier and the flexible insulating base film need to be pressed under high temperature conditions, and the carrier layer and the metal foil layer are prone to mutual diffusion under high temperature conditions, resulting in the bonding of the carrier layer and the metal foil layer. , making it difficult to peel off between the carrier layer and the metal foil layer.

Patent document CN111286736A discloses a method for preparing a metal foil with a carrier. The carrier layer and the metal foil layer are easily peeled off by setting a peeling layer and a barrier layer between the carrier layer and the metal foil layer. The peeling layer is made of an organic polymer material. As a result, this kind of peeling layer has poor conductivity. During the molding process of the peeling layer, the adsorption of organic matter is uneven, resulting in uneven thickness of the peeling layer. Some places are easy to peel off, and some places are difficult to peel off.

Contents of the invention

The object of the present invention is to provide a metal foil with a carrier and its manufacturing method, the thickness of the peeling layer is uniform, so that the carrier layer and the metal foil layer can be easily and completely and stably peeled off.

For reaching this purpose, the present invention adopts following technical scheme:

In one aspect, a metal foil with a carrier is provided, comprising a carrier layer, a peeling layer and a metal foil layer, the carrier layer, the peeling layer and the metal foil layer are stacked in sequence, and the peeling layer is made of metal and non-metallic In the metal composite material, the peeling layer has a thickness of 100-1000 angstroms.

As a preferred solution of the present invention, the metal foil with a carrier further includes a first isolation layer and a second isolation layer, the first isolation layer is arranged between the carrier layer and the peeling layer, the The second isolation layer is arranged between the metal foil layer and the peeling layer, the first isolation layer is a nickel layer or a nickel alloy layer, and the second isolation layer is a copper layer.

As a preferred solution of the present invention, the metal foil with a carrier further includes a third isolation layer, the third isolation layer is arranged between the second isolation layer and the metal foil layer, and the metal foil layer is copper foil, and the third isolation layer is an aluminum layer.

As a preferred solution of the present invention, the metal foil with a carrier further includes a fourth isolation layer, the fourth isolation layer is arranged between the second isolation layer and the third isolation layer, and the fourth isolation layer The four isolation layers are made of non-metallic materials.

In another aspect, there is provided a method for manufacturing a metal foil with a carrier described in any of the above technical solutions, comprising the following steps:

S10. smoothing at least one side of the carrier layer to form a smooth surface;

S20. Corona treatment is performed on the smooth surface of the carrier layer, and then the carrier layer is placed in a plating solution for electroplating treatment to form a peeling layer on the smooth surface;

S30. Forming a metal foil layer on the release layer.

As a preferred solution of the present invention, the surface of the carrier layer is smoothed by mechanical grinding treatment, so that the average surface roughness reaches 0.01-10 μm, and then the surface with the average surface roughness in the range of 0.01-10 μm is subjected to Electrochemical treatment to obtain the smooth surface with an average surface roughness of 0.01-2 μm.

As a preferred version of the present invention, the preparation method of the plating solution is as follows: the complexing agent potassium pyrophosphate, zinc sulfate, additive A and additive B are dissolved in water respectively, and after clarification, the plating solution is mixed to obtain the plating solution. Said additive A is a mixture of one or more of the soluble salts of Co, Fe, Mn, Al, Ti in any proportion, said additive B is oxalic acid, sodium thiosulfate, formic acid, sodium hypophosphite, One or more mixtures of ammonium chloride.

As a preferred solution of the present invention, the temperature of the plating solution is controlled to be 25° C., the carrier layer is put into the plating solution, and a layer of The nanoscale composite zinc coating is used as the peeling layer, and the electroplating time is 3s.

As a preferred solution of the present invention, a first metal layer is sputtered on the peeling layer, a second metal layer is electroplated on the first metal layer, and the first metal layer and the second metal layer constitute The metal foil layer.

As a preferred solution of the present invention, when sputtering the first metal layer on the peeling layer, the current is preferably 6-12A, the voltage is preferably 300-500V, and the vacuum degree is preferably 0.1-0.5Pa. The speed is preferably 4-10 m/min.

Beneficial effects of the present invention:

The peeling layer of the metal foil with a carrier of the present invention is made of metal and non-metal composite materials, which avoids the problems of easy adhesion and pinholes caused by the similar properties of the metal and metal foil layers, and avoids the poor conductivity of organic matter. The problem of uneven thickness. The thickness of the peeling layer is controlled within the range of 100-1000 angstroms, so that the metal foil layer can be uniformly formed on the peeling layer, and at the same time, the separation between the peeling layer and the metal foil layer is facilitated.

Description of drawings

1 is a schematic structural view of a metal foil with a carrier according to Embodiment 1 of the present invention;

2 is a schematic structural view of a metal foil with a carrier according to Embodiment 2 of the present invention;

3 is a schematic structural view of a metal foil with a carrier according to Embodiment 3 of the present invention;

4 is a schematic structural view of a metal foil with a carrier according to Embodiment 4 of the present invention;

FIG. 5 is a schematic structural view of a metal foil with a carrier according to Embodiment 5 of the present invention.

In the picture:

1. Carrier layer; 2. Peeling layer; 3. Metal foil layer; 4. First isolation layer; 5. Second isolation layer; 6. Third isolation layer; 7. Fourth isolation layer; 8. Barrier layer; 81 . High temperature resistant layer; 82. Metal bonding layer; 821. First bonding layer; 822. Second bonding layer.

Detailed ways

The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, the first feature being "on" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below" the first feature below the second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the level of the first feature is smaller than that of the second feature.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of these features.

As shown in Figure 1, the metal foil with a carrier in Example 1 includes a carrier layer 1, a peeling layer 2 and a metal foil layer 3, the carrier layer 1, the peeling layer 2 and the metal foil layer 3 are stacked in sequence, and the peeling layer 2 is a metal foil layer. With non-metallic composite materials, the thickness of the peeling layer 2 is 100-1000 angstroms.

The release layer 2 of the metal foil with a carrier of the present invention is made of metal and non-metal composite materials, which avoids the problems of easy adhesion and pinholes due to the similar properties of the metal and metal foil layers 3, and avoids the poor conductivity of organic matter , The problem of uneven molding thickness. The thickness of the peeling layer 2 is controlled within the range of 100-1000 angstroms, so that the metal foil layer 3 can be uniformly formed on the peeling layer 2 , and at the same time, the separation between the peeling layer 2 and the metal foil layer 3 is facilitated.

Specifically, the peeling layer 2 combines inorganic metal ions and organic functional groups by electroplating. The peeling layer 2 is thin and uniform in thickness, so that the laminated metal foil layer 3 can be completely and stably peeled off from the carrier layer 1 . The peeling layer 2 includes 5% to 40% metal by atomic percentage, and the remainder is nonmetal, wherein the metal is selected from nickel, chromium, titanium, copper, manganese, iron, cobalt, tungsten, molybdenum, tantalum and the like. Mixtures wherein the non-metal is selected from mixtures of oxides, phosphates and chromates of the above metals. The carrier layer 1 is made of metal or alloy material, such as aluminum foil, stainless steel foil, titanium foil, copper foil, aluminum alloy foil, titanium alloy foil or copper alloy foil.

As shown in Figure 2, the metal foil with carrier of Embodiment 2 also includes a first isolation layer 4 and a second isolation layer 5, the first isolation layer 4 is arranged between the carrier layer 1 and the release layer 2, and the second isolation layer 5 is arranged between the metal foil layer 3 and the peeling layer 2, the first isolation layer 4 is a nickel layer or a nickel alloy layer, and the second isolation layer 5 is a copper layer. The first isolation layer 4 and the second isolation layer 5 can improve the heat resistance of the peeling layer 2 , and may not affect the peeling effect when facing a high temperature environment. The thickness of the first isolation layer 4 is preferably 0.001-5 μm, more preferably 0.005-3 μm. This is because, when the thickness of the first separation layer 4 is less than 0.001 μm, it is easily affected by the high temperature when the metal foil layer 3 is attached to the base material, and it may be difficult to peel off. When the thickness of the first separation layer 4 is thicker than 5 μm , nor can its function be further improved.

As shown in Figure 3, the metal foil with carrier of embodiment three also includes a third isolation layer 6, the third isolation layer 6 is arranged between the second isolation layer 5 and the metal foil layer 3, the third isolation layer 6 is aluminum layer, the metal foil layer 3 is copper foil, and the wire bonding performance can be improved by setting the third isolation layer 6 .

As shown in Figure 4, the metal foil with a carrier of the fourth embodiment also includes a fourth isolation layer 7, the fourth isolation layer 7 is arranged between the second isolation layer 5 and the third isolation layer 6, and the fourth isolation layer 7 adopts Made of non-metallic materials. Both the second isolation layer 5 and the third isolation layer 6 are metal layers, and interpenetration easily occurs between the two. The fourth isolation layer 7 made of non-metallic material can prevent the gap between the second isolation layer 5 and the third isolation layer 6. mutual penetration.

Embodiments of the present invention also provide a method for manufacturing a metal foil with a carrier, comprising the following steps:

S10. smoothing at least one side of the carrier layer 1 to form a smooth surface;

S20. Corona treatment is performed on the smooth surface of the carrier layer 1, and then the carrier layer 1 is placed in a plating solution for electroplating treatment to form a peeling layer 2 on the smooth surface;

S30 . Forming the metal foil layer 3 on the release layer 2 .

Corona treatment is a kind of electric shock treatment, which can make the surface of the carrier layer 1 have higher adhesion, and facilitate the formation of a peeling layer 2 with uniform thickness on the carrier layer 1 .

Further, in step S10, the surface of the carrier layer 1 is smoothed by mechanical grinding treatment, so that the average surface roughness reaches 0.01-10 μm, and then the surface with the average surface roughness in the range of 0.01-10 μm is electrochemically After treatment, a smooth surface with an average surface roughness of 0.01-2 μm can be obtained. When the surface roughness of the carrier layer 1 is 2 μm or more, the surface roughness of the metal foil layer 3 is also significantly affected. In addition, when the surface roughness of the carrier layer 1 is less than 0.01 μm, it is difficult to manufacture stably technically and the price is high, which is not conducive to practical use. Therefore, the average surface roughness of the smoothed surface of the carrier layer 1 is preferably 0.01 μm to 2 μm.

In step S20, the preparation method of the plating solution is: the complexing agent potassium pyrophosphate, zinc sulfate, additive A and additive B are dissolved in water respectively, and after clarification, the plating solution is obtained by mixing, and the additive A is Co, Fe, Mn, A mixture of one or more of soluble salts of Al and Ti in any proportion, and additive B is a mixture of one or more of oxalic acid, sodium thiosulfate, formic acid, sodium hypophosphite, and ammonium chloride .

Further, control the temperature of the plating solution to 25°C, put the carrier layer 1 into the plating solution, and electroplate a layer of nano-scale composite zinc coating as the peeling layer 2 under the action of a direct current with a voltage of 20V and a current of 5A. The time is 3s.

In another embodiment, the preparation method of plating solution is: potassium hydrogen tartrate, zinc sulfate, additive A are dissolved in water respectively, mix after clarification, control the content of each substance in the plating solution as follows: potassium hydrogen tartrate 20～60g/ L, zinc sulfate 8～16g/L, additive A5～20g/L, bath pH=3.0～5.0, additive A is 3-(2,3-epoxypropoxy)propyltrimethoxysilane, 3-( 2,3-Glycidoxy)propyltriethoxysilane, 3-(2,3-Glycidoxy)propylmethoxydiethoxysilane or 3-(methacryloyloxy)propane A mixture of at least one of trimethoxysilane and at least one of potassium thiocyanate, potassium dihydrogen phosphate, sodium acetate or ammonium sulfate in any proportion.

In step S30 , the first metal layer is sputtered on the peeling layer 2 , and the second metal layer is electroplated on the first metal layer. The first metal layer and the second metal layer constitute the metal foil layer 3 . A uniform and dense peeling layer 2 is formed by sputtering, which is beneficial to improving the peeling stability of the metal foil with carrier and can effectively reduce the number of pinholes. In addition, the second metal layer is preferably formed by electroplating. Before forming the second metal layer, a uniform and dense first metal layer is formed by sputtering, which is conducive to the uniform electroplating of the second metal layer, so that the formed second metal layer The surface roughness of the layer is uniform, which is beneficial to the fabrication of subsequent circuits and to the fabrication of a thinner second metal layer.

Further, when sputtering the first metal layer on the peeling layer 2, the current is preferably 6-12A, the voltage is preferably 300-500V, the vacuum degree is preferably 0.1-0.5Pa, and the sputtering speed is preferably 4-10m/min.

When the first isolation layer 4 is a nickel layer, its manufacturing method is as follows: by immersing the surface of the carrier layer 1 in a Watt bath (nickel sulfate 240-300g/L, nickel chloride 40-70g/L, boric acid 30-45mL/ L, pH3.8～4.2, bath temperature 50～60℃, current density 0.5～8A/dm ² ) or sulfamic acid bath (nickel sulfamate 440～500g/L, boric acid 30～50mL/L, pH3.8 ～4.4, bath temperature 50～60℃, current density 2～40A/dm ² ) for electroplating, or by immersing the surface of the metal foil carrier in a hydrazine bath (as a representative example, nickel acetate 60g/L, glycolic acid 60g/L , ethylenediaminetetraacetic acid 25g/L, hydrazine 100mL/L, pH 11, bath temperature 90°C) and the like, a nickel layer can be formed on the carrier layer 1 .

Additives such as brightener, sodium 1-naphthalene acetate, sodium lauryl sulfate, and saccharin can also be added to the Watt bath and the sulfamic acid bath as needed.

When the first isolation layer 4 is a nickel alloy layer, its manufacturing method is as follows: by immersing the surface of the carrier layer 1 in a Ni-P bath (nickel sulfate 20-300g/L, nickel chloride 35-50g/L, boric acid 30 ～50g/L, phosphorous acid 1～30g/L, sodium acetate acid 1～30g/L, pH 1～5, bath temperature 40～70℃, current density 1～15A/dm ² ), Ni-Co bath (nickel sulfate 50～200g/L, cobalt sulfate 50～200g/L, sodium citrate 15～30g/L, pH3～6, bath temperature 25～60℃, current density 1～15A/dm ² ), Ni-Mo bath (sulfuric acid Nickel 30～70g/L, sodium molybdate 30～120g/L, sodium citrate 15～30g/L, pH7～12, bath temperature 20～50℃, current density 1～15A/dm ² ), Ni-Zn bath (nickel sulfate 250~300g/L, zinc sulfate 50~400g/L, sodium citrate 15~30g/L, pH3~6, bath temperature 50~70℃, current density 3~15A/ ^dm2 ) or Ni-Co -Mo bath (nickel sulfate 50~200g/L, cobalt sulfate 50~200g/L, sodium molybdate 30~120g/L, sodium citrate 15~30g/L, pH7~12, bath temperature 20~50℃, current Density 1～15A/dm ² ), etc., or by immersing the surface of the metal foil carrier in a Ni-P bath (as a representative example, nickel chloride 16g/L, sodium hypophosphite 24g/L, sodium succinate 16g /L, sodium malate 18g/L, pH5.6, bath temperature 100°C), Ni-B bath (as a representative example, nickel chloride 30g/L, ethylenediamine 60g/L, sodium hydroxide 40g/L, Sodium borohydride 0.6g/L, bath temperature 90 ℃) etc. to carry out electroless plating, can form nickel alloy layer on the metal foil carrier.

According to needs, you can also add an appropriate amount of brightener, saccharin, sodium 1-naphthalene acetate, dodecyl Additives such as sodium sulfate.

As shown in FIG. 5 , the metal foil with a carrier of the fifth embodiment includes a carrier layer 1 , a release layer 2 , a metal foil layer 3 and a barrier layer 8 , and the barrier layer 8 is disposed between the release layer 2 and the metal foil layer 3 . The peel strength between the metal foil layer 3 and the barrier layer 8 is greater than the peel strength between the release layer 2 and the barrier layer 8, so that when the metal foil with a carrier is used, peeling occurs between the release layer 2 and the barrier layer 8, And the barrier layer 8 remains on the metal foil layer 3 , so that the barrier layer 8 can prevent oxidation of the metal foil layer 3 , thereby protecting the metal foil layer 3 . Of course, the peel strength between the metal foil layer 3 and the barrier layer 8 can also be less than or the peel strength between the peeling layer 2 and the barrier layer 8, so that when the metal foil with the carrier is peeled off, the barrier layer 8 can be completely left behind. on the release layer 2, and peel off from the metal foil layer 3 simultaneously with the carrier layer 1 and the release layer 2.

For when the metal foil with carrier is peeled off, the barrier layer 8 can stay on the metal foil layer 3, thereby preventing the oxidation of the metal foil layer 3, the barrier layer 8 includes a high temperature resistant layer 81 and a metal bonding layer 82, and the metal bonding layer 82 It is located between the high temperature resistant layer 81 and the metal foil layer 3 . The metal bonding layer 82 includes a first bonding layer 821 capable of bonding with the metal foil layer 3 and a second bonding layer 822 capable of bonding with the high temperature resistant layer 81 . Specifically, the first adhesive layer 821 is copper or zinc, and the second adhesive layer 822 is nickel, iron or manganese. It can be understood that the metal bonding layer 82 is made of any one or more of copper, zinc, nickel, iron and manganese; or, the metal bonding layer 82 is made of one of the materials in copper or zinc and nickel , iron and manganese in one of the materials. The structure of the metal bonding layer 82 may include but not limited to the following situations: (1) The metal bonding layer 82 is a single metal layer composed of the first bonding layer 821, wherein the first bonding layer 821 is copper or Zinc; (2) metal bonding layer 82 is formed single metal layer by the second bonding layer 822, and wherein, the second bonding layer 822 is nickel or iron or manganese; (3) metal bonding layer 82 is made of the first A single-layer alloy structure composed of the bonding layer 821 and the second bonding layer 822, such as a single-layer alloy structure made of copper-nickel alloy; (4) the metal bonding layer 82 includes a multilayer composed of an alloy layer and a single metal layer structure; wherein, the alloy layer of the metal bonding layer 82 is made of the first bonding layer 821 and the second bonding layer 822, and the single metal layer of the metal bonding layer 82 is made of the first bonding layer 821 or the second bonding layer layer 822; for example, an alloy layer made of copper-nickel alloy and a single metal layer made of manganese; The single-layer structure of the layer 822 is composed of a multi-layer structure, for example, a multi-layer structure composed of a copper metal layer and a nickel metal layer. When the metal bonding layer 82 is a multilayer structure consisting of a single-layer structure of the first bonding layer 821 and a single-layer structure of the second bonding layer 822, the single-layer structure of the first bonding layer 821 is arranged on the metal foil Between layer 3 and the single-layer structure of the second adhesive layer 822, because the adhesive force between the first adhesive layer 821 and the metal foil layer 3 is relatively strong, between the second adhesive layer 822 and the high temperature resistant layer 81 The bonding force is relatively strong, so the single-layer structure of the first adhesive layer 821 is arranged between the metal foil layer 3 and the single-layer structure of the second adhesive layer 822, so that the first adhesive layer 821 is not easy to contact with The metal foil layer 3 is separated. By setting the metal bonding layer 82, so that the part in the barrier layer 8 can be firmly connected with the metal foil layer 3, when the metal foil with the carrier is peeled off, the part in the barrier layer 8 can stay on the metal foil layer 3 , thereby preventing the oxidation of the metal foil layer 3, thereby protecting the metal foil layer 3.

As a preferred embodiment of the present invention, in the description of this specification, descriptions with reference to the terms "preferred", "further", etc. mean that the specific features, structures, materials or characteristics described in conjunction with this embodiment or example are included in this specification. In at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above embodiments are only used to illustrate the detailed solutions of the present invention, and the present invention is not limited to the above detailed solutions, that is, it does not mean that the present invention can only be implemented depending on the above detailed solutions. Those skilled in the art should understand that any improvement of the present invention, the equivalent replacement of each raw material of the product of the present invention, the addition of auxiliary components, the selection of specific methods, etc., all fall within the scope of protection and disclosure of the present invention.

Claims (10)

1. a metal foil with carrier, it is characterized in that, comprise carrier layer, peeling layer and metal foil layer, described carrier layer, described peeling layer and described metal foil layer are laminated successively and set, and described peeling layer is metal As for the non-metallic composite material, the peeling layer has a thickness of 100-1000 angstroms. 2. The metal foil with carrier according to claim 1, further comprising a first isolation layer and a second isolation layer, the first isolation layer being arranged between the carrier layer and the release layer , the second isolation layer is disposed between the metal foil layer and the peeling layer, the first isolation layer is a nickel layer or a nickel alloy layer, and the second isolation layer is a copper layer. 3. The metal foil with carrier according to claim 2, further comprising a third isolation layer, the third isolation layer is arranged between the second isolation layer and the metal foil layer, the The metal foil layer is copper foil, and the third isolation layer is an aluminum layer. 4. The metal foil with carrier according to claim 3, further comprising a fourth isolation layer, the fourth isolation layer being arranged between the second isolation layer and the third isolation layer, The fourth isolation layer is made of non-metallic material. 5. A method for manufacturing the metal foil with carrier according to any one of claims 1 to 4, characterized in that, comprising the steps of: S10. smoothing at least one side of the carrier layer to form a smooth surface; S20. Corona treatment is performed on the smooth surface of the carrier layer, and then the carrier layer is placed in a plating solution for electroplating treatment to form a peeling layer on the smooth surface; S30. Forming a metal foil layer on the release layer. 6. The manufacturing method of metal foil with carrier according to claim 5, characterized in that, the surface of the carrier layer is smoothed by mechanical grinding treatment, so that the average surface roughness reaches 0.01-10 μm, and then The surface with an average surface roughness in the range of 0.01-10 μm is electrochemically treated to obtain the smooth surface with an average surface roughness of 0.01-2 μm. 7. the manufacture method of the metal foil with carrier according to claim 5, is characterized in that, the preparation method of described plating solution is: dissolving complexing agent potassium pyrophosphate, zinc sulfate, additive A and additive B respectively in Water, clarified and mixed to prepare the plating solution, the additive A is a mixture of one or more of the soluble salts of Co, Fe, Mn, Al, Ti in any proportion, and the additive B is oxalic acid , sodium thiosulfate, formic acid, sodium hypophosphite, ammonium chloride or a mixture of several. 8. The manufacturing method of the metal foil with carrier according to claim 5, characterized in that, the temperature of the plating solution is controlled to be 25° C., the carrier layer is put into the plating solution, and the voltage is 20V. , under the action of a direct current with a current of 5A, a layer of nano-scale composite zinc coating is electroplated as the peeling layer, and the electroplating time is 3s. 9. The manufacturing method of the metal foil with carrier according to claim 5, characterized in that, the first metal layer is sputtered on the peeling layer, and the second metal layer is electroplated on the first metal layer, so that The first metal layer and the second metal layer constitute the metal foil layer. 10. The manufacturing method of the metal foil with carrier according to claim 9, characterized in that, when sputtering the first metal layer on the peeling layer, the current preferably adopts 6-12A, and the voltage preferably adopts 300- 500V, the vacuum degree is preferably 0.1-0.5Pa, and the sputtering speed is preferably 4-10m/min.

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