CN116330505A - Silicon material processing device for manufacturing solar cell panel - Google Patents
Silicon material processing device for manufacturing solar cell panel Download PDFInfo
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- CN116330505A CN116330505A CN202310391338.3A CN202310391338A CN116330505A CN 116330505 A CN116330505 A CN 116330505A CN 202310391338 A CN202310391338 A CN 202310391338A CN 116330505 A CN116330505 A CN 116330505A
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- 239000002210 silicon-based material Substances 0.000 title claims abstract description 146
- 238000012545 processing Methods 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims abstract description 110
- 238000004140 cleaning Methods 0.000 claims abstract description 97
- 238000001035 drying Methods 0.000 claims abstract description 55
- 238000006073 displacement reaction Methods 0.000 claims description 48
- 238000003860 storage Methods 0.000 claims description 28
- 230000007704 transition Effects 0.000 claims description 23
- 238000007599 discharging Methods 0.000 claims description 18
- 238000013519 translation Methods 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 5
- 230000001502 supplementing effect Effects 0.000 claims description 5
- 238000001914 filtration Methods 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 32
- 230000008569 process Effects 0.000 abstract description 28
- 238000001179 sorption measurement Methods 0.000 abstract description 18
- 239000012634 fragment Substances 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 description 37
- 238000010438 heat treatment Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 238000012790 confirmation Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000002893 slag Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a silicon material processing device for manufacturing a solar cell panel, which relates to the technical field of silicon material processing and comprises a cutting assembly, a cleaning assembly, a drying assembly and a carrying manipulator, wherein the carrying manipulator is arranged on one side of the cutting assembly, the cleaning assembly is arranged on one side of the carrying manipulator away from the cutting assembly, the drying assembly is arranged on one side of the cleaning assembly away from the carrying manipulator, and the drying assembly and the cleaning assembly are connected with each other. According to the bearing table disclosed by the invention, the adsorption hole at the leakage part in the cutting process is used as an air flow channel, external air flow is led into the cover, on one hand, fragments mixed in the cutting gap are cleaned in the air flow leading-in process, and on the other hand, the cutting gap is reset through the pressure difference value, so that the cutting precision is greatly improved. After cutting, the carrying platform intensively collects the scraps through the process of air flow discharge, so that the scraps can be recovered and reused.
Description
Technical Field
The invention relates to the technical field of silicon material processing, in particular to a silicon material processing device for manufacturing a solar cell panel.
Background
The solar cell panel converts solar radiation energy into electric energy through a photoelectric effect, most of solar cell panels are mainly made of silicon, and in the production process of the solar cell panel, the silicon material needs to be cut, cleaned and other processing steps, but the existing silicon material processing equipment has more defects and cannot meet the use requirements.
In the processing process of large silicon materials, multiple cutting needs to be carried out, on one hand, the chopped silicon materials are not easy to fix in the cutting process, on the other hand, gaps appear among the silicon materials due to cutting of blades in the cutting process, fine deviation can appear in the original position of the silicon materials, and the position confirmation of subsequent cutting is not facilitated. Part of the equipment can push the cut position back to the original position in time after cutting, but scraps generated in the cutting process are easy to be blocked in a cutting gap at the moment, so that the surface of the silicon material is damaged.
In the conventional silicon material cleaning process, the silicon materials are mutually stacked, the cleaning liquid is difficult to completely clean the silicon materials, and if the silicon materials are stirred, the silicon materials are subjected to more collisions, so that the silicon materials are easy to damage. On the other hand, intractable impurities exist on the surface of part of the silicon material, the washing mode is difficult to remove, and an ordinary cleaning device does not have an effective cleaning means for cleaning dead angles and intractable impurities.
Disclosure of Invention
The invention aims to provide a silicon material processing device for manufacturing a solar cell panel, which is used for solving the problems in the background art.
In order to solve the technical problems, the invention provides the following technical scheme: a silicon material processingequipment for making solar cell panel, including cutting subassembly, cleaning module, drying module, handling manipulator, cutting subassembly, cleaning module, drying module, handling manipulator all with ground fastening connection, handling manipulator sets up in cutting subassembly one side, cleaning module sets up in the handling manipulator one side of keeping away from cutting subassembly, drying module sets up in the one side of keeping away from handling manipulator at cleaning module, drying module and cleaning module interconnect. The monoblock silicon material is carried cutting assembly department through AGV carrier, through cutting assembly's processing, and the silicon material is cut into the standard size of manufacturing solar cell panel, and little silicon material is carried cleaning assembly by the transport manipulator in, after wasing, the silicon material is by the quick drying of input drying assembly, and the silicon material is exported after the drying. According to the bearing table disclosed by the invention, the adsorption hole at the leakage part in the cutting process is used as an air flow channel, external air flow is led into the cover, on one hand, fragments mixed in the cutting gap are cleaned in the air flow leading-in process, and on the other hand, the cutting gap is reset through the pressure difference value, so that the cutting precision is greatly improved. After cutting, the carrying platform intensively collects the scraps through the process of air flow discharge, so that the scraps can be recovered and reused.
Further, the cutting assembly comprises a supporting table, a support, a first displacement module, a second displacement module, a third displacement module, a rotating motor, a cutting knife and a bearing table, wherein the supporting table is in fastening connection with the ground, the support is in fastening connection with the supporting table, the first displacement module is in fastening connection with the support, the second displacement module is in fastening connection with a displacement platform of the first displacement module, the third displacement module is in fastening connection with a displacement platform of the second displacement module, a transition plate is arranged on the displacement platform of the third displacement module, the rotating motor is in fastening connection with the transition plate, an output shaft of the rotating motor is in fastening connection with the cutting knife, and the bearing table is in fastening connection with the supporting table. The big silicon material is placed on the plummer, and the removal of cutting knife is controlled to first displacement module, second displacement module, third displacement module, and the angle of rotating electrical machines control cutting knife realizes the automatic cutout to the silicon material, and the little silicon material of standard size is carried in the cleaning subassembly after the cutting.
Further, the plummer surface is provided with the accepting groove, it has the mesh board to accept the inslot cover, the plummer is inside to be provided with the transition storehouse, transition storehouse inside is provided with the cover, translation board, promote the electric jar, cover and transition storehouse inner wall fastening connection, translation board and cover sliding connection, promote electric jar and cover fastening connection, promote the output shaft of electric jar and translation board fastening connection, be provided with the input hole on the cover lateral wall, transition storehouse bottom is provided with the output hole, transition storehouse bottom is covered by the cover, the inside one-way input valve that is provided with of input hole, the inside unit output valve that is provided with of output hole, the supporting bench is inside to be provided with temporary storage box, output hole and temporary storage box intercommunicate. In the processing process of large silicon materials, multiple cutting needs to be carried out, on one hand, the chopped silicon materials are not easy to fix in the cutting process, on the other hand, gaps appear among the silicon materials due to cutting of blades in the cutting process, fine deviation can appear in the original position of the silicon materials, and the position confirmation of subsequent cutting is not facilitated. Part of the equipment can push the cut position back to the original position in time after cutting, but scraps generated in the cutting process are easy to be blocked in a cutting gap at the moment, so that the surface of the silicon material is damaged. Before cutting, the silicon material is placed on the mesh plate, the mesh plate is uniformly provided with a plurality of adsorption holes, when the silicon material is cut, the electric cylinder is pushed to pull the translation plate upwards, the translation plate is far away from the bottom surface of the transition bin, negative pressure is generated inside the cover, the negative pressure adsorbs the silicon material through each adsorption hole, the surface of the mesh plate is set to be a smooth surface, after the mesh plate is cut by the cutting knife at a certain position, the adsorption holes at the position leak out, negative pressure air flow is generated at the adsorption holes, external air quickly permeates into the cutting gaps, all the residual scraps in the cutting gaps are sucked into the adsorption holes, and the air flow passing through the adsorption holes slides into the cover. After the silicon material is cut, the electric cylinder is pushed to push the translation plate downwards, and the slag inside the cover is discharged into the temporary storage box from the output hole together with the air flow. According to the bearing table disclosed by the invention, the adsorption hole at the leakage part in the cutting process is used as an air flow channel, external air flow is led into the cover, on one hand, fragments mixed in the cutting gap are cleaned in the air flow leading-in process, and on the other hand, the cutting gap is reset through the pressure difference value, so that the cutting precision is greatly improved. After cutting, the carrying platform intensively collects the scraps through the process of air flow discharge, so that the scraps can be recovered and reused.
Further, be provided with the filter screen on the temporary storage case lateral wall, the filter screen sets up in temporary storage case upper portion, and temporary storage case upper end is provided with the admission pipe, and admission pipe and output hole intercommunication each other, the vertical downward setting of one end of admission pipe connection temporary storage case. The air current carries the piece and discharges together, and the air current is from the downhill entry temporary storage case in the admission pipe, and the piece falls into temporary storage case bottom, and the air current is turned back again and is discharged from the filter screen department after striking temporary storage case bottom, and this setting has avoided the piece direct and the contact of filter screen, has reduced the risk of filter screen jam.
Further, wash the subassembly and include U type upper tube, U type down tube, the fixing base, the driving pump, the crane, U type down tube and fixing base fastening connection, fixing base and ground fastening connection, driving pump and fixing base fastening connection, the input of driving pump, output and U type down tube bottom both sides UNICOM, crane and ground fastening connection, U type upper tube and crane fastening connection, U type down tube bottom is provided with the discharging pipe, the one end and the drying component that the U type down tube was kept away from to the discharging pipe are connected, the inside control valve that is provided with of discharging pipe, U type down tube side is provided with the fluid infusion mouth. The lifting frame can drive the U-shaped upper pipe to move up and down, and belongs to the conventional technical means in the field, and the specific structure is not described. Before cleaning, the U-shaped upper pipe and the U-shaped lower pipe are in a separation state, the carrying manipulator carries cut silicon materials and puts the cut silicon materials into the U-shaped lower pipe, after the silicon materials are put into the U-shaped lower pipe, the U-shaped upper pipe moves downwards and the U-shaped lower pipe form a sealing space, a liquid supplementing port arranged on the side edge of the U-shaped lower pipe is used for inputting cleaning liquid, the cleaning liquid fills the U-shaped upper pipe and the U-shaped lower pipe into the space, a small amount of space is reserved at the top of the U-shaped upper pipe, a driving pump starts to convey fluid, the cleaning liquid starts to circularly rotate along the sealing space formed by the U-shaped upper pipe and the U-shaped lower pipe under the conveying of the driving pump, and in the process of continuously rotating along with the cleaning liquid, the silicon materials originally concentrated are dispersed into the whole sealing space due to the difference of resistance, the silicon materials are mutually separated and continuously change along with the flowing of the cleaning liquid, the silicon materials are fully cleaned, and the cleaning cleanliness is greatly improved.
Further, the U-shaped upper tube and the U-shaped lower tube are provided with cleaning units, the cleaning units are uniformly distributed around the U-shaped upper tube and the U-shaped lower tube, each cleaning unit comprises a pressure plate, a pressure spring, an air bag, a one-way input hole and a one-way output hole, the air bag is fixedly connected with the U-shaped upper tube and the U-shaped lower tube, one end of the pressure plate is fixedly connected with the U-shaped upper tube and the U-shaped lower tube, the pressure spring is arranged on the inner wall of the air bag, one side of the pressure spring is fixedly connected with the air bag, the other side of the pressure spring is fixedly connected with the surface of the air bag, which is close to the pressure plate, of the U-shaped upper tube and the U-shaped lower tube, the one-way input hole is formed in the U-shaped upper tube and the U-shaped lower tube, one end of the one-way input hole is communicated with the outside, the other end of the one-way input hole is communicated with the air bag, the one-way output hole is formed on the pressure plate, the one end of the one-way output hole is communicated with the air bag, and the U-shaped upper tube is communicated with the U-shaped lower tube. When cleaning the silicon material, the cleaning liquid continuously rotates, the cleaning liquid continuously impacts the pressure plate, the pressure plate can press the pressure spring to rebound again, the air bag is repeatedly compressed and rebounded, the vibration of the pressure plate enables the side wall of the U-shaped upper pipe and the U-shaped lower pipe to generate vibration water waves concentrated in the middle direction, the vibration water waves generate primary constraint on the silicon material, the contact between the silicon material cleaning process and the side wall of the U-shaped upper pipe and the side wall of the U-shaped lower pipe is reduced, when the air bag contracts, air in the air bag is sprayed out from the pressure plate to the center of a pipeline to generate a plurality of air bubbles, the air bubbles are sprayed out from the different pressure plates, and air is supplemented from the outside when the air bag can bounce. The intermittent output of the bubbles forms secondary constraint of the silicon material, the silicon material is blocked from being close to the pipe wall, the bubbles are exploded after striking the surface of the silicon material, local impact can be generated on the surface of the silicon material, the cleaning effect of the silicon material is greatly improved, and after the cleaning is finished, the silicon material and the cleaning liquid are discharged from the discharging pipe together. According to the cleaning unit disclosed by the invention, the pressure plate is continuously impacted by the circulating flow of water flow, vibration water waves are formed on the outer ring of the pipeline by utilizing the counter-vibration force of the pressure plate to block the silicon material, and bubbles generated by gas sprayed by the air bags are used as secondary blocking, so that the contact between the silicon material and the side wall of the pipeline in the cleaning process of the silicon material is greatly reduced, the surface of the silicon material can be washed by cleaning liquid, and the cleaning rate is greatly improved. On the other hand, bubbles are broken in a dense small range on the surface of the silicon material, so that the cleaning effect of the surface of the silicon material is obviously improved.
Further, drying component includes drying cabinet, filter, water drainage tank, heater strip, drying cabinet and ground fastening connection, and drying cabinet one end and discharging pipe UNICOM, the filter setting is inside the drying cabinet, and the discharging pipe is towards filter one side, and the filter side is provided with the baffle, and the filter surface is provided with the filtration pore, and the water drainage tank setting is in the filter below, heater strip and drying cabinet inner wall top fastening connection. The silicon material flows onto the filter plate along with the cleaning liquid, the cleaning liquid falls into the drainage tank to be drained, and the silicon material is left on the filter plate to be dried by the heating wire.
Further, drying component still includes vibration generator, and vibration generator one end and drying cabinet inner wall bottom fastening connection, vibration generator other end and filter are close to the one end fastening connection of discharging pipe, and the one end and the drying cabinet hinge of vibration generator are kept away from to the filter, and drying cabinet and the articulated one end of filter are provided with the automatically-controlled door. At the in-process of silicon material input, vibration generator drives filter one end vibration, and the silicon material that originally concentrates is shared along with the vibration of filter, and remaining large granule washing liquid is got rid of on the silicon material, and at the in-process that the heater strip heated the dehydration to silicon material surface, the vibration of silicon material can also constantly adjust the position of being heated for the whole dehydration that can both be quick of silicon material. When the silicon material is dehydrated, the vibration generator can raise the vibration angle, the automatic door is opened, the silicon material is discharged in a vibration mode, and the silicon material is conveyed into the containing box from the automatic door, and the vibration generator belongs to conventional technical means in the field, and specific structures are not described.
Compared with the prior art, the invention has the following beneficial effects: according to the bearing table disclosed by the invention, the adsorption hole at the leakage part in the cutting process is used as an air flow channel, external air flow is led into the cover, on one hand, fragments mixed in the cutting gap are cleaned in the air flow leading-in process, and on the other hand, the cutting gap is reset through the pressure difference value, so that the cutting precision is greatly improved. After cutting, the carrying platform intensively collects the scraps through the process of air flow discharge, so that the scraps can be recovered and reused. According to the cleaning unit disclosed by the invention, the pressure plate is continuously impacted by the circulating flow of water flow, vibration water waves are formed on the outer ring of the pipeline by utilizing the counter-vibration force of the pressure plate to block the silicon material, and bubbles generated by gas sprayed by the air bags are used as secondary blocking, so that the contact between the silicon material and the side wall of the pipeline in the cleaning process of the silicon material is greatly reduced, the surface of the silicon material can be washed by cleaning liquid, and the cleaning rate is greatly improved. On the other hand, bubbles are broken in a dense small range on the surface of the silicon material, so that the cleaning effect of the surface of the silicon material is obviously improved. According to the invention, the vibration generator drives one end of the filter plate to vibrate, the originally concentrated silicon material is split along with the vibration of the filter plate, the residual large-particle cleaning liquid on the silicon material is thrown off, and the vibration of the silicon material can continuously adjust the heated position in the process of heating and dehydrating the surface of the silicon material by the heating wire, so that the whole silicon material can be dehydrated rapidly.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a cross-sectional view of the pallet of the present invention in a slag sucking state;
FIG. 3 is a cross-sectional view of the stage of the present invention in a deslagging state;
FIG. 4 is a sectional view showing the internal structure of the temporary storage box of the present invention;
FIG. 5 is a schematic diagram of the operation of the U-shaped upper tube and U-shaped lower tube of the present invention;
FIG. 6 is a cross-sectional view of the tube wall of the present invention;
FIG. 7 is a schematic illustration of the operation of the cleaning unit of the present invention;
FIG. 8 is a schematic view of the overall structure of the drying module of the present invention;
in the figure: 1-cutting assembly, 11-supporting table, 12-bracket, 13-first displacement module, 14-second displacement module, 15-third displacement module, 16-rotating motor, 17-cutting knife, 18-loading table, 181-receiving tank, 182-mesh plate, 183-transition bin, 184-covering hood, 185-translating plate, 186-pushing cylinder, 187-temporary storage tank, 188-filter screen, 189-inlet pipe, 2-cleaning assembly, 21-U-shaped upper pipe, 22-U-shaped lower pipe, 23-fixed seat, 24-driving pump, 25-lifting frame, 26-cleaning unit, 261-pressure plate, 262-pressure spring, 263-air bag, 264-one-way input hole, 265-one-way output hole, 3-drying assembly, 31-drying tank, 32-filter plate, 33-water draining tank, 34-heating wire, 35-vibration generator, 4-carrying manipulator.
Description of the embodiments
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1, a silicon material processing device for manufacturing a solar cell panel comprises a cutting component 1, a cleaning component 2, a drying component 3 and a carrying manipulator 4, wherein the cutting component 1, the cleaning component 2, the drying component 3 and the carrying manipulator 4 are all in fastening connection with the ground, the carrying manipulator 4 is arranged on one side of the cutting component 1, the cleaning component 2 is arranged on one side of the carrying manipulator 4 far away from the cutting component 1, the drying component 3 is arranged on one side of the cleaning component 2 far away from the carrying manipulator 4, and the drying component 3 and the cleaning component 2 are mutually connected. The monoblock silicon material is carried to cutting assembly 1 department through AGV carrier, and through the processing of cutting assembly 1, the silicon material is cut into the standard size of manufacturing solar cell panel, and little silicon material is carried in washing subassembly 2 by handling manipulator 4, washs the back that finishes, and the silicon material is imported dry subassembly 3 rapid draing, and the silicon material is exported after the drying finishes. According to the bearing table 18, the adsorption hole at the leakage position in the cutting process is used as an air flow channel, external air flow is led into the cover, on one hand, fragments mixed in the cutting gap are cleaned in the air flow leading-in process, and on the other hand, the cutting gap is reset through the pressure difference value, so that the cutting precision is greatly improved. After cutting, the carrying platform intensively collects the scraps through the process of air flow discharge, so that the scraps can be recovered and reused.
As shown in fig. 1-3, the cutting assembly 1 comprises a supporting table 11, a bracket 12, a first displacement module 13, a second displacement module 14, a third displacement module 15, a rotating motor 16, a cutting knife 17 and a bearing table 18, wherein the supporting table 11 is in fastening connection with the ground, the bracket 12 is in fastening connection with the supporting table 11, the first displacement module 13 is in fastening connection with the bracket 12, the second displacement module 14 is in fastening connection with a displacement platform of the first displacement module 13, the third displacement module 15 is in fastening connection with a displacement platform of the second displacement module 14, a transition plate is arranged on the displacement platform of the third displacement module 15, the rotating motor 16 is in fastening connection with the transition plate, an output shaft of the rotating motor 16 is in fastening connection with the cutting knife 17, and the bearing table 18 is in fastening connection with the supporting table 11. The large silicon material is placed on the bearing table 18, the first displacement module 13, the second displacement module 14 and the third displacement module 15 control the movement of the cutting knife 17, the rotating motor 16 controls the angle of the cutting knife 17, automatic cutting of the silicon material is achieved, and small silicon materials with standard sizes after cutting are conveyed into the cleaning assembly 2.
As shown in fig. 2-4, the surface of the bearing table 18 is provided with a receiving groove 181, a mesh plate 182 is covered in the receiving groove 181, a transition bin 183 is arranged in the bearing table 18, a cover cap 184, a translation plate 185 and a pushing electric cylinder 186 are arranged in the transition bin 183, the cover cap 184 is fixedly connected with the inner wall of the transition bin 183, the translation plate 185 is slidably connected with the cover cap 184, the pushing electric cylinder 186 is fixedly connected with the cover cap 184, an output shaft of the pushing electric cylinder 186 is fixedly connected with the translation plate 185, an input hole is formed in the side wall of the cover cap 184, an output hole is formed in the bottom of the transition bin 183, the bottom of the transition bin 183 is covered by the cover cap 184, a one-way input valve is arranged in the input hole, a unit output valve is arranged in the output hole, a temporary storage box 187 is arranged in the supporting table 11, and the output hole and the temporary storage box 187 are mutually communicated. In the processing process of large silicon materials, multiple cutting needs to be carried out, on one hand, the chopped silicon materials are not easy to fix in the cutting process, on the other hand, gaps appear among the silicon materials due to cutting of blades in the cutting process, fine deviation can appear in the original position of the silicon materials, and the position confirmation of subsequent cutting is not facilitated. Part of the equipment can push the cut position back to the original position in time after cutting, but scraps generated in the cutting process are easy to be blocked in a cutting gap at the moment, so that the surface of the silicon material is damaged. Before cutting, the silicon material is placed on the mesh plate 182, a plurality of adsorption holes are uniformly formed in the mesh plate 182, when the silicon material is cut, the translation plate 185 is pulled upwards by the pushing electric cylinder 186, the translation plate 185 is far away from the bottom surface of the transition bin 183, negative pressure is generated inside the cover 184, the negative pressure adsorbs the silicon material through each adsorption hole, the surface of the mesh plate 182 is set to be smooth, after the silicon material is cut by the cutting knife 17 at a certain position, the adsorption holes at the position leak out, negative pressure air flow is generated at the adsorption holes, external air quickly permeates into the cutting slits, all the residual chips in the cutting slits are sucked into the adsorption holes, the air flow passing through the adsorption holes slides into the cover, when the negative pressure air flow is generated, the air flow speed at the position of the cutting slits is higher, the air pressure is reduced, the air pressures at two sides can push the cutting slits to reset, and the cut silicon material is wholly recovered, and the subsequent cutting is not affected. After the silicon material is cut, the pushing cylinder 186 pushes the translation plate 185 downward again, and the slag covered inside the cover 184 is discharged from the output hole into the temporary storage box 187 together with the air flow. According to the bearing table 18, the adsorption hole at the leakage position in the cutting process is used as an air flow channel, external air flow is led into the cover, on one hand, fragments mixed in the cutting gap are cleaned in the air flow leading-in process, and on the other hand, the cutting gap is reset through the pressure difference value, so that the cutting precision is greatly improved. After cutting, the carrying platform intensively collects the scraps through the process of air flow discharge, so that the scraps can be recovered and reused.
As shown in fig. 4, a filter screen 188 is disposed on the side wall of the temporary storage case 187, the filter screen 188 is disposed on the upper half of the temporary storage case 187, an inlet pipe 189 is disposed at the upper end of the temporary storage case 187, the inlet pipe 189 is communicated with the output hole, and one end of the inlet pipe 189 connected with the temporary storage case 187 is disposed vertically downward. The air flow carries the scraps and is discharged together, the air flow is downwards input into the temporary storage box 187 from the inlet pipe 189, the scraps fall into the bottom of the temporary storage box 187, and the air flow is discharged from the filter screen 188 after striking the bottom of the temporary storage box 187 in a turning-back mode.
As shown in fig. 1 and 5, the cleaning assembly 2 comprises a U-shaped upper tube 21, a U-shaped lower tube 22, a fixed seat 23, a driving pump 24, a lifting frame 25, the U-shaped lower tube 22 and the fixed seat 23 are in fastening connection, the fixed seat 23 is in fastening connection with the ground, the driving pump 24 is in fastening connection with the fixed seat 23, an input end and an output end of the driving pump 24 are communicated with two sides of the bottom of the U-shaped lower tube 22, the lifting frame 25 is in fastening connection with the ground, the U-shaped upper tube 21 is in fastening connection with the lifting frame 25, a discharging tube is arranged at the bottom of the U-shaped lower tube 22, one end of the discharging tube, far away from the U-shaped lower tube 22, is connected with the drying assembly 3, a control valve is arranged in the discharging tube, and a liquid supplementing port is arranged on the side of the U-shaped lower tube 22. The lifting frame 25 of the invention can drive the U-shaped upper tube 21 to move up and down, and the lifting frame belongs to the conventional technical means in the field, and the specific structure is not described. Before cleaning, the U-shaped upper tube 21 and the U-shaped lower tube 22 are in a separated state, the carrying manipulator 4 carries the cut silicon materials and puts the cut silicon materials into the U-shaped lower tube 22, after the silicon materials are put in, the U-shaped upper tube 21 moves downwards and the U-shaped lower tube 22 form a sealed space, a liquid supplementing port arranged on the side edge of the U-shaped lower tube 22 inputs cleaning liquid, the space between the U-shaped upper tube 21 and the U-shaped lower tube 22 is filled with the cleaning liquid, a small amount of space is reserved at the top of the U-shaped upper tube, the driving pump 24 starts to convey fluid, the cleaning liquid starts to circularly rotate along the sealed space formed by the U-shaped upper tube 21 and the U-shaped lower tube 22 under the conveying of the driving pump 24, the silicon materials rotate along with the cleaning liquid, and in the process of continuously rotating, the originally concentrated silicon materials start to be dispersed into the whole sealed space due to the difference of resistance, the silicon materials are mutually separated and continuously flow along with the cleaning liquid, the state of the silicon materials continuously changes, the silicon materials are sufficiently cleaned, and the cleaning cleanliness is greatly improved.
As shown in fig. 6 and 7, the cleaning units 26 are arranged on the side walls of the U-shaped upper tube 21 and the U-shaped lower tube 22, the cleaning units 26 are arranged in a plurality, the cleaning units 26 are uniformly distributed around the side walls of the U-shaped upper tube 21 and the U-shaped lower tube 22, the cleaning units 26 comprise a pressure plate 261, a pressure spring 262, an air bag 263, a unidirectional input hole 264 and a unidirectional output hole 265, the air bag 263 is fixedly connected with the side walls of the U-shaped upper tube 21 and the U-shaped lower tube 22, the pressure plate 261 is fixedly connected with the air bag 263, one end of the pressure plate 261 is hinged with the side walls of the U-shaped upper tube 21 and the U-shaped lower tube 22, the pressure spring 262 is arranged on the inner wall of the air bag 263, one side of the pressure spring 262 is fixedly connected with the side surfaces of the air bag 263 close to the U-shaped upper tube 21 and the U-shaped lower tube 22, the unidirectional input hole 264 is arranged in the side walls of the U-shaped upper tube 21 and the U-shaped lower tube 22, one end of the unidirectional input hole 264 is communicated with the outside, the other end of the unidirectional input hole 264 is communicated with the air bag 263, one end of the unidirectional output hole is arranged on the pressure plate 261, one end of the unidirectional output hole is communicated with the inside the air bag 265, and the inside the U-shaped output hole 265 is communicated with the inside the U-shaped upper tube 21 and the inside the U-shaped upper tube 22. When the silicon material is cleaned, the cleaning liquid continuously rotates, the cleaning liquid continuously impacts the pressure plate, the pressure plate can press the pressure spring to rebound again, the air bag is repeatedly compressed and rebounded, vibration of the pressure plate enables the side walls of the U-shaped upper pipe 21 and the U-shaped lower pipe 22 to generate vibration water waves concentrated in the middle direction, the vibration water waves generate primary constraint on the silicon material, contact between the silicon material cleaning process and the side walls of the U-shaped upper pipe 21 and the U-shaped lower pipe 22 is reduced, when the air bag 263 contracts, gas in the air bag 263 is sprayed out from the pressure plate 261 to the center of a pipeline, one air bubble is generated, multiple air bubbles are sprayed out from the pressure plate 261, and the air bag 263 supplements the gas from the outside when the air bag 263 can bounce. The intermittent output of the bubbles forms secondary constraint of the silicon material, the silicon material is blocked from being close to the pipe wall, the bubbles are exploded after striking the surface of the silicon material, local impact can be generated on the surface of the silicon material, the cleaning effect of the silicon material is greatly improved, and after the cleaning is finished, the silicon material and the cleaning liquid are discharged from the discharging pipe together. According to the invention, the cleaning unit 26 continuously impacts the pressure plate 261 through the circulating flow of water flow, vibration water waves are formed on the outer ring of the pipeline by utilizing the anti-vibration force of the pressure plate 261 to block the silicon material, and bubbles generated by gas sprayed by the air bags 263 are used as secondary blocking, so that the contact between the silicon material and the side wall of the pipeline in the cleaning process is greatly reduced, the surface of the silicon material can be washed by cleaning liquid, and the cleaning rate is greatly improved. On the other hand, bubbles are broken in a dense small range on the surface of the silicon material, so that the cleaning effect of the surface of the silicon material is obviously improved.
As shown in fig. 8, the drying assembly 3 comprises a drying box 31, a filter plate 32, a drainage groove 33 and a heating wire 34, wherein the drying box 31 is fixedly connected with the ground, one end of the drying box 31 is communicated with a discharge pipe, the filter plate 32 is arranged inside the drying box 31, the discharge pipe faces to one side of the filter plate 32, a baffle is arranged on the side edge of the filter plate 32, a filter hole is formed in the surface of the filter plate 32, the drainage groove 33 is arranged below the filter plate 32, and the heating wire 34 is fixedly connected with the top of the inner wall of the drying box 31. The silicon material flows onto the filter plate 32 together with the cleaning liquid, the cleaning liquid falls into the drain groove 33 to be discharged, and the silicon material remains on the filter plate 32 to be dried by the heater wire 34.
As shown in fig. 8, the drying assembly 3 further comprises a vibration generator 35, one end of the vibration generator 35 is fixedly connected with the bottom of the inner wall of the drying box 31, the other end of the vibration generator 35 is fixedly connected with one end of the filter plate 32 close to the discharging pipe, one end of the filter plate 32 far away from the vibration generator 35 is hinged with the drying box 31, and one hinged end of the drying box 31 and the filter plate 32 is provided with an automatic door. In the process of inputting the silicon material, the vibration generator 35 drives one end of the filter plate 32 to vibrate, the originally concentrated silicon material is split along with the vibration of the filter plate 32, the residual large-particle cleaning liquid on the silicon material is thrown off, and in the process of heating and dehydrating the surface of the silicon material by the heating wire 34, the vibration of the silicon material can also continuously adjust the heated position, so that the silicon material can be dehydrated rapidly as a whole. When the silicon material is dehydrated, the vibration generator 35 can raise the vibration angle, the automatic door is opened, the silicon material is discharged in a vibration mode, and the silicon material is conveyed into the containing box from the automatic door, wherein the vibration generator 35 belongs to conventional technical means in the field, and specific structures are not described.
The working principle of the invention is as follows: the big silicon material is placed on plummer 18, first displacement module 13, second displacement module 14, the removal of third displacement module 15 control cutting knife 17, rotating electrical machines 16 control the angle of cutting knife 17, realize the automatic cutout to the silicon material, after the silicon material is cut by cutting knife 17 in certain position, the absorption hole of this position is leaked, absorption hole department produces negative pressure air current, outside air is quick to infiltration in this cutting gap, the piece that remains in the cutting gap is all inhaled in the absorption hole, and the air current that passes the absorption hole then carries the piece and slides into the cover, when producing negative pressure air current, cutting gap position air current velocity is bigger, the air pressure reduces, the atmospheric pressure of both sides can promote the cutting gap and reset, the silicon material after the cutting wholly resumes. Before cleaning, the U-shaped upper tube 21 and the U-shaped lower tube 22 are in a separated state, the conveying manipulator 4 conveys the cut silicon material and puts the cut silicon material into the U-shaped lower tube 22, after the silicon material is put in, the U-shaped upper tube 21 moves downwards to form a sealed space with the U-shaped lower tube 22, a liquid supplementing port arranged on the side edge of the U-shaped lower tube 22 inputs cleaning liquid, the cleaning liquid fills the space between the U-shaped upper tube 21 and the U-shaped lower tube 22, a small amount of space is reserved at the top of the U-shaped upper tube, the driving pump 24 starts to convey the fluid, the cleaning liquid starts to circularly rotate along the sealed space formed by the U-shaped upper tube 21 and the U-shaped lower tube 22 under the conveying of the driving pump 24, and the silicon material rotates along with the cleaning liquid. The cleaned silicon material flows onto the filter plate 32 together with the cleaning liquid, the cleaning liquid falls into the drain tank 33 to be drained, and the silicon material remains on the filter plate 32 to be dried by the heater wire 34.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A silicon material processingequipment for making solar cell panel, characterized in that: the processing device comprises a cutting assembly (1), a cleaning assembly (2), a drying assembly (3) and a carrying manipulator (4), wherein the cutting assembly (1), the cleaning assembly (2), the drying assembly (3) and the carrying manipulator (4) are all in fastening connection with the ground, the carrying manipulator (4) is arranged on one side of the cutting assembly (1), the cleaning assembly (2) is arranged on one side, far away from the cutting assembly (1), of the carrying manipulator (4), the drying assembly (3) is arranged on one side, far away from the carrying manipulator (4), of the cleaning assembly (2), and the drying assembly (3) and the cleaning assembly (2) are connected with each other.
2. A silicon processing apparatus for manufacturing a solar cell panel according to claim 1, wherein: the cutting assembly (1) comprises a supporting table (11), a support (12), a first displacement module (13), a second displacement module (14), a third displacement module (15), a rotating motor (16), a cutting knife (17) and a bearing table (18), wherein the supporting table (11) is in fastening connection with the ground, the support (12) is in fastening connection with the supporting table (11), the first displacement module (13) is in fastening connection with the support (12), the second displacement module (14) is in fastening connection with a displacement platform of the first displacement module (13), the third displacement module (15) is in fastening connection with a displacement platform of the second displacement module (14), a transition plate is arranged on the displacement platform of the third displacement module (15), the rotating motor (16) is in fastening connection with the transition plate, an output shaft of the rotating motor (16) is in fastening connection with the cutting knife (17), and the bearing table (18) is in fastening connection with the supporting table (11).
3. A silicon processing apparatus for manufacturing a solar cell panel according to claim 2, wherein: the bearing table (18) surface is provided with and accepts groove (181), and it has mesh board (182) to accept to cover in groove (181), and bearing table (18) inside is provided with transition storehouse (183), transition storehouse (183) inside is provided with cover (184), translation board (185), promotes electric jar (186), cover (184) and transition storehouse (183) inner wall fastening connection, translation board (185) and cover (184) sliding connection, promote electric jar (186) and cover (184) fastening connection, the output shaft and the translation board (185) fastening connection of promotion electric jar (186), be provided with the input hole on cover (184) lateral wall, transition storehouse (183) bottom is provided with the output hole, transition storehouse (183) bottom is covered by cover (184), the inside one-way input valve that is provided with of input hole, the inside unit output valve that is provided with of output hole, supporting table (11) inside is provided with temporary storage case (187), output hole and temporary storage case (187) intercommunicate.
4. A silicon processing apparatus for manufacturing a solar cell panel according to claim 3, wherein: the filter screen (188) is arranged on the side wall of the temporary storage box (187), the filter screen (188) is arranged on the upper half part of the temporary storage box (187), an inlet pipe (189) is arranged at the upper end of the temporary storage box (187), the inlet pipe (189) and the output hole are mutually communicated, and one end of the inlet pipe (189) connected with the temporary storage box (187) is vertically downwards arranged.
5. A silicon processing apparatus for manufacturing a solar cell panel according to claim 4, wherein: the cleaning assembly (2) comprises a U-shaped upper pipe (21), a U-shaped lower pipe (22), a fixed seat (23), a driving pump (24) and a lifting frame (25), wherein the U-shaped lower pipe (22) is in fastening connection with the fixed seat (23), the fixed seat (23) is in fastening connection with the ground, the driving pump (24) is in fastening connection with the fixed seat (23), the input end, the output end and the two sides of the bottom of the U-shaped lower pipe (22) of the driving pump (24) are communicated, the lifting frame (25) is in fastening connection with the ground, the U-shaped upper pipe (21) is in fastening connection with the lifting frame (25), the bottom of the U-shaped lower pipe (22) is provided with a discharging pipe, one end of the U-shaped lower pipe (22) is far away from the discharging pipe and the drying assembly (3), a control valve is arranged inside the discharging pipe, and the side of the U-shaped lower pipe (22) is provided with a fluid supplementing port.
6. A silicon processing apparatus for manufacturing a solar cell panel according to claim 5, wherein: the U-shaped upper tube (21) and the U-shaped lower tube (22) are provided with a plurality of cleaning units (26) on the side walls, the plurality of cleaning units (26) are evenly distributed around the side walls of the U-shaped upper tube (21) and the U-shaped lower tube (22), the cleaning units (26) comprise a pressure plate (261), a pressure spring (262), an air bag (263), a one-way input hole (264) and a one-way output hole (265), the air bag (263) is tightly connected with the side walls of the U-shaped upper tube (21) and the U-shaped lower tube (22), the pressure plate (261) is tightly connected with the side walls of the air bag (263), one end of the pressure plate (261) is hinged with the side walls of the U-shaped upper tube (21) and the U-shaped lower tube (22), the pressure spring (262) is arranged on the inner wall of the air bag (263), one side of the pressure spring (262) is tightly connected with the side of the air bag (263) close to the U-shaped upper tube (21), the other side of the pressure spring (262) is tightly connected with the side of the air bag (263) close to the pressure plate (261), the other side of the air bag (263) is tightly connected with the one-way input hole (264) and is arranged on the other side of the U-shaped upper tube (264) and is tightly connected with the one end of the air bag (264), the one-way output hole (265) is arranged on the pressure plate (261), one end of the one-way output hole (265) is communicated with the inside of the air bag (263), and the other end of the one-way output hole (265) is communicated with the inside of the U-shaped upper pipe (21) and the U-shaped lower pipe (22).
7. A silicon processing apparatus for manufacturing a solar cell panel according to claim 6, wherein: drying component (3) are including drying cabinet (31), filter (32), water drainage tank (33), heater strip (34), drying cabinet (31) and ground fastening connection, drying cabinet (31) one end and discharging pipe UNICOM, filter (32) set up inside drying cabinet (31), discharging pipe orientation filter (32) one side, filter (32) side is provided with the baffle, and filter (32) surface is provided with the filtration pore, water drainage tank (33) set up in filter (32) below, heater strip (34) and drying cabinet (31) inner wall top fastening connection.
8. A silicon processing apparatus for manufacturing a solar cell panel according to claim 7, wherein: drying component (3) still include vibration generator (35), vibration generator (35) one end and drying cabinet (31) inner wall bottom fastening connection, vibration generator (35) other end and filter (32) are close to the one end fastening connection of discharging pipe, vibration generator (35) one end and drying cabinet (31) are kept away from in filter (32), drying cabinet (31) and filter (32) articulated one end are provided with the automatically-controlled door.
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| CN109166808A (en) * | 2018-07-11 | 2019-01-08 | 安徽睿知信信息科技有限公司 | A kind of solar panel manufacture silicon material process equipment |
| CN211709741U (en) * | 2020-01-15 | 2020-10-20 | 长治高测新材料科技有限公司 | Quick automatic device that cuts of crystalline silicon |
| CN112310247A (en) * | 2020-11-05 | 2021-02-02 | 湖南旭昱新能源科技有限公司 | Silicon material processing equipment for manufacturing solar cell panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN206250161U (en) * | 2016-12-05 | 2017-06-13 | 安徽省天利能源有限公司 | Silicon material process equipment is used in a kind of solar panel manufacture |
| CN108527698A (en) * | 2018-04-13 | 2018-09-14 | 绍兴文理学院 | A kind of solar panel cutter device |
| CN109166808A (en) * | 2018-07-11 | 2019-01-08 | 安徽睿知信信息科技有限公司 | A kind of solar panel manufacture silicon material process equipment |
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