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CN116301243B - Water-cooling auxiliary heat dissipation device, storage equipment, server and computer - Google Patents

Water-cooling auxiliary heat dissipation device, storage equipment, server and computer Download PDF

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Publication number
CN116301243B
CN116301243B CN202310521233.5A CN202310521233A CN116301243B CN 116301243 B CN116301243 B CN 116301243B CN 202310521233 A CN202310521233 A CN 202310521233A CN 116301243 B CN116301243 B CN 116301243B
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heat dissipation
chamber
heat sink
water
cooling
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CN116301243A (en
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贾政
李文方
刘耀阳
马志强
吴恭英
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Suzhou Inspur Intelligent Technology Co Ltd
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Suzhou Inspur Intelligent Technology Co Ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明公开了一种水冷辅助散热装置、存储设备、服务器及计算机,涉及计算机技术领域,水冷辅助散热装置包括风扇组件和散热器组件;散热器组件包括上盖、散热主体以及下盖,散热主体设置有散热鳍片以及第一通孔;下盖与散热主体之间形成有液冷通道,液冷通道与第一通孔连通、形成液冷腔室;密封结构将液冷腔室分隔为独立的第一腔室和第二腔室,第一腔室内盛放冷却液且密封,第一腔室朝向风扇组件的表面设置有可移动的承压件;第二腔室设置有与外界连通出气孔。本发明提供的水冷辅助散热装置可同时实现液冷与风冷散热,可有效提高散热效率;相同的散热效率情况下,可使风扇组件的转速降低,避免因风扇组件转速过高而带来的噪音问题。

The invention discloses a water cooling auxiliary heat dissipation device, a storage device, a server and a computer, and relates to the technical field of computers. The water cooling auxiliary heat dissipation device includes a fan assembly and a radiator assembly; the radiator assembly includes an upper cover, a heat dissipation main body and a lower cover, and the heat dissipation main body A cooling fin and a first through hole are provided; a liquid cooling channel is formed between the lower cover and the cooling body, and the liquid cooling channel communicates with the first through hole to form a liquid cooling chamber; the sealing structure separates the liquid cooling chamber into independent The first chamber and the second chamber, the first chamber is filled with cooling liquid and sealed, the surface of the first chamber facing the fan assembly is provided with a movable pressure-bearing member; the second chamber is provided with an outlet communicating with the outside world stomata. The water-cooled auxiliary heat dissipation device provided by the present invention can realize liquid cooling and air-cooling heat dissipation at the same time, and can effectively improve heat dissipation efficiency; under the same heat dissipation efficiency, the speed of the fan assembly can be reduced to avoid damage caused by excessively high speed of the fan assembly. Noise problem.

Description

一种水冷辅助散热装置、存储设备、服务器及计算机A water-cooled auxiliary cooling device, storage device, server and computer

技术领域technical field

本发明涉及计算机技术领域,更具体地说,涉及一种水冷辅助散热装置。此外,本发明还涉及一种包括上述水冷辅助散热装置的存储设备、包括上述存储设备的服务器以及计算机。The invention relates to the technical field of computers, and more specifically, to a water-cooled auxiliary heat dissipation device. In addition, the present invention also relates to a storage device including the above-mentioned water-cooling auxiliary heat dissipation device, a server and a computer including the above-mentioned storage device.

背景技术Background technique

在计算机运行过程中,各运行模块会产生热量,一般通过散热装置对发热部件进行降温,以保证计算机正常运行。During the operation of the computer, each operating module will generate heat. Generally, the cooling device is used to cool down the heat-generating components to ensure the normal operation of the computer.

相关技术中,散热装置一般包括散热风扇以及散热器,并且散热风扇朝向散热器的鳍片吹气,对散热器的鳍片进行降温并增加鳍片周围空气热对流,通过散热器的鳍片与发热部件及周围空气进行热交换,实现对发热部件的降温。In the related art, the heat dissipation device generally includes a heat dissipation fan and a heat sink, and the heat dissipation fan blows air toward the fins of the heat sink to cool down the fins of the heat sink and increase the heat convection of the air around the fins. The heat exchange between the components and the surrounding air realizes the cooling of the heat-generating components.

当发热部件的发热效率较高的情况下,为了提高散热效率,需要增加散热风扇的转速,以加快鳍片周围空气流通速率,但是散热风扇的噪音大小与转速大小呈正比,转速越大,噪音越大,影响用户的使用体验。When the heating efficiency of the heating components is high, in order to improve the heat dissipation efficiency, it is necessary to increase the speed of the cooling fan to speed up the air circulation rate around the fins, but the noise of the cooling fan is proportional to the speed, the higher the speed, the higher the noise. The bigger it is, the more it affects the user experience.

综上所述,如何提高散热装置散热效率的同时提高用户的使用感受,是目前本领域技术人员亟待解决的问题。To sum up, how to improve the heat dissipation efficiency of the heat dissipation device and at the same time improve the user experience is an urgent problem to be solved by those skilled in the art.

发明内容Contents of the invention

有鉴于此,本发明的目的是提供一种水冷辅助散热装置,在使用的过程中,可以通过风扇组件向散热器组件吹气,实现风冷散热;同时,风扇组件吹出的气流作用于承压件并压缩第一腔室,使第一腔室内的冷却液流入液冷通道,实现液冷散热;风冷散热与液冷散热的组合可有效提高散热装置的散热效率,避免因风扇组件转速过高而带来的噪音问题,提高用户的使用感受。In view of this, the object of the present invention is to provide a water-cooled auxiliary heat dissipation device. During use, air can be blown to the radiator assembly through the fan assembly to realize air cooling and heat dissipation; at the same time, the airflow blown by the fan assembly acts on the pressure-bearing components and compress the first chamber, so that the coolant in the first chamber flows into the liquid cooling channel to realize liquid cooling and heat dissipation; The noise problem caused by high noise can improve the user experience.

本发明的另一目的是提供一种包括上述水冷辅助散热装置的存储设备、包括上述存储设备的服务器以及计算机。Another object of the present invention is to provide a storage device including the above-mentioned water-cooling auxiliary heat dissipation device, a server and a computer including the above-mentioned storage device.

为了实现上述目的,本发明提供如下技术方案:In order to achieve the above object, the present invention provides the following technical solutions:

一种水冷辅助散热装置,包括:A water-cooled auxiliary heat dissipation device, comprising:

风扇组件,用于向散热器组件吹气;a fan assembly for blowing air to the radiator assembly;

散热器组件,设置于所述风扇组件的一侧,所述散热器组件包括上盖、散热主体以及下盖,所述散热主体设置有散热鳍片以及贯穿其轴向的第一通孔;所述下盖与所述散热主体之间形成有液冷通道,所述液冷通道与所述第一通孔连通、形成液冷腔室;所述液冷腔室内设置有可移动的密封结构,所述密封结构将所述液冷腔室分隔为独立的第一腔室和第二腔室,所述第一腔室内盛放冷却液且密封,所述第一腔室朝向所述风扇组件的表面设置有可移动的承压件;所述第二腔室设置有与外界连通出气孔;The radiator assembly is arranged on one side of the fan assembly, the radiator assembly includes an upper cover, a heat dissipation main body and a lower cover, and the heat dissipation main body is provided with a heat dissipation fin and a first through hole passing through its axial direction; A liquid cooling channel is formed between the lower cover and the heat dissipation body, and the liquid cooling channel communicates with the first through hole to form a liquid cooling chamber; a movable sealing structure is arranged in the liquid cooling chamber, The sealing structure separates the liquid-cooled chamber into an independent first chamber and a second chamber, the first chamber contains cooling liquid and is sealed, and the first chamber faces the fan assembly. The surface is provided with a movable pressure-bearing member; the second chamber is provided with an air outlet communicating with the outside world;

所述风扇组件向所述承压件吹气时,所述承压件受气压作用力压缩所述第一腔室,所述密封结构向挤压所述第二腔室的方向移动,所述第一腔室内的冷却液流入所述液冷通道。When the fan assembly blows air to the pressure-bearing member, the pressure-bearing member is compressed by the air pressure to compress the first chamber, and the sealing structure moves in the direction of squeezing the second chamber, and the The cooling liquid in the first chamber flows into the liquid cooling channel.

可选地,所述第一通孔内设置有可吸收或释放冷却液的压缩结构,所述承压件受气压作用力压缩所述第一腔室时,所述压缩结构被压缩释放所述冷却液,所述承压件复位时,所述压缩结构恢复并吸收所述冷却液。Optionally, a compression structure capable of absorbing or releasing cooling fluid is provided in the first through hole, and when the pressure-bearing member compresses the first chamber under the force of air pressure, the compression structure is compressed to release the cooling liquid, when the pressure-bearing part is reset, the compression structure recovers and absorbs the cooling liquid.

可选地,所述压缩结构为吸湿海绵。Optionally, the compressed structure is a hygroscopic sponge.

可选地,所述下盖包括底板以及凸出设置于所述底板的柱状结构,所述散热主体设置有第二通孔,所述柱状结构伸入所述第二通孔内,且所述柱状结构的外壁面与所述第二通孔的内壁面之间形成环状腔室;Optionally, the lower cover includes a bottom plate and a columnar structure protruding from the bottom plate, the heat dissipation body is provided with a second through hole, the columnar structure extends into the second through hole, and the An annular chamber is formed between the outer wall of the columnar structure and the inner wall of the second through hole;

所述密封结构沿所述柱状结构的轴向可移动的套设于所述柱状结构的外周,并将所述环状腔室分隔为独立的两部分,其中一部分为所述第二腔室,另一部分与所述液冷通道、所述第一通孔形成所述第一腔室。The sealing structure is movably sleeved on the outer periphery of the columnar structure along the axial direction of the columnar structure, and divides the annular chamber into two independent parts, one of which is the second chamber, The other part forms the first chamber with the liquid cooling channel and the first through hole.

可选地,还包括用于为所述密封结构的复位提供动力的弹性件,所述弹性件一端抵接于所述密封结构,另一端抵接于所述上盖。Optionally, an elastic member for providing power for resetting the sealing structure is further included, one end of the elastic member abuts against the sealing structure, and the other end abuts against the upper cover.

可选地,所述弹性件为弹簧,所述弹簧套设于所述柱状结构。Optionally, the elastic member is a spring, and the spring is sleeved on the columnar structure.

可选地,所述柱状结构设置有用于限制所述密封结构移动距离的限位凸起,所述限位凸起凸出设置于所述柱状结构的外周侧面。Optionally, the columnar structure is provided with a limiting protrusion for limiting the moving distance of the sealing structure, and the limiting protrusion is protrudingly provided on the outer peripheral side of the columnar structure.

可选地,所述底板背离所述散热主体的一侧设置有导热层。Optionally, a heat conducting layer is provided on a side of the bottom plate away from the heat dissipation body.

可选地,所述导热层为散热硅脂层。Optionally, the heat conduction layer is a heat dissipation silicone grease layer.

可选地,所述上盖扣设于所述散热主体的上端面、并将所述第二通孔完全覆盖,所述出气孔设置于所述上盖。Optionally, the upper cover is fastened on the upper end surface of the heat dissipation main body and completely covers the second through hole, and the air outlet is provided on the upper cover.

可选地,所述第一通孔朝向所述风扇组件的一端设置有导风槽,所述导风槽的开口尺寸大于所述第一通孔的横截面尺寸。Optionally, an air guide slot is provided at one end of the first through hole facing the fan assembly, and an opening size of the air guide slot is larger than a cross-sectional size of the first through hole.

可选地,所述第一通孔的数量为多个,且多个所述第一通孔的轴向均与所述第二通孔的轴向平行,多个所述第一通孔环绕并间隔设置于所述第二通孔的外周。Optionally, there are multiple first through holes, and the axes of the multiple first through holes are all parallel to the axial directions of the second through holes, and the multiple first through holes surround and arranged at intervals on the outer periphery of the second through hole.

可选地,所述下盖设置有环状密封槽,所述散热主体设置有与所述环状密封槽配合的密封凸部,所述密封凸部位于所述第二通孔的外侧。Optionally, the lower cover is provided with an annular sealing groove, and the heat dissipation body is provided with a sealing convex part matched with the annular sealing groove, and the sealing convex part is located outside the second through hole.

可选地,所述下盖的环状密封槽与所述散热主体的密封凸部螺纹密封连接或粘接密封连接。Optionally, the annular sealing groove of the lower cover is screw-tightly connected or adhesively-tightly connected to the sealing protrusion of the heat dissipation body.

可选地,所述液冷通道包括多个连通所述第一通孔与所述第二通孔的通槽,且所述液冷通道设置于所述散热主体朝向所述下盖的端面。Optionally, the liquid cooling channel includes a plurality of through grooves connecting the first through hole and the second through hole, and the liquid cooling channel is disposed on an end surface of the heat dissipation body facing the lower cover.

可选地,所述散热主体中第一通孔的内侧壁凸出设置有导向槽,所述导向槽沿平行于所述第一通孔的轴向方向延伸,所述导向槽的一端贯穿所述散热主体的上端面,且所述导向槽的延伸长度小于所述散热主体的上端面与下端面之间的距离;Optionally, a guide groove protrudes from the inner side wall of the first through hole in the heat dissipation body, the guide groove extends parallel to the axial direction of the first through hole, and one end of the guide groove runs through the The upper end surface of the heat dissipation main body, and the extension length of the guide groove is less than the distance between the upper end surface and the lower end surface of the heat dissipation main body;

所述承压件设置有与所述导向槽配合的导向凸部、并相对于所述导向槽可移动。The pressure-bearing member is provided with a guide protrusion matched with the guide groove, and is movable relative to the guide groove.

可选地,所述风扇组件包括风扇框和设置于所述风扇框的风扇主体,所述风扇主体向所述散热器组件的投影将所述散热器组件完全覆盖。Optionally, the fan assembly includes a fan frame and a fan body disposed on the fan frame, and the projection of the fan body to the radiator assembly completely covers the radiator assembly.

一种存储设备,包括上述所述的水冷辅助散热装置。A storage device includes the aforementioned water-cooled auxiliary heat dissipation device.

一种服务器,包括上述所述的水冷辅助散热装置。A server includes the above water-cooled auxiliary heat dissipation device.

一种计算机,包括上述所述的水冷辅助散热装置。A computer includes the above water-cooled auxiliary heat dissipation device.

在使用本发明提供的水冷辅助散热装置的过程中,当发热元件高效散热时,风扇组件朝向散热器组件吹气,流经散热主体的散热鳍片的气流流速增加,可实现风冷散热;同时风扇组件可向承载件吹气,较大的气流压力作用于承载件的表面,使承载件在第一通孔内向压缩第一腔室的方向移动,第一腔室内盛放有冷却液,在承压件向压缩第一腔室的方向移动的过程中,第一腔室被挤压同时释放冷却液,冷却液流出至液冷通道,在液冷通道内冷却液吸热升华,第一腔室内的压力增加,使密封结构向挤压第二腔室的方向移动,第二腔室内的气体由出气孔流出且第二腔室的体积减小,在液冷通道内冷却液与下盖以及散热主体进行热量交换,同时冷却液受热气化,实现液冷散热;当但热元件的散热效率降低时,气化的冷却液因温度降低液化并积聚至液流通道,风扇组件转速降低,向下的冗余风量不足以推动承压件移动,密封结构在外力作用下复位,并挤压第一腔室,推动液冷通道内的冷却液回流、被压缩结构吸收,直至承压件复位至顶部。In the process of using the water-cooled auxiliary heat dissipation device provided by the present invention, when the heat-generating element dissipates heat efficiently, the fan assembly blows air toward the radiator assembly, and the air flow velocity of the heat-dissipating fins flowing through the heat-dissipating body increases, which can realize air-cooling and heat dissipation; at the same time The fan assembly can blow air to the carrier, and the larger airflow pressure acts on the surface of the carrier, causing the carrier to move in the direction of compressing the first chamber in the first through hole. The first chamber is filled with cooling liquid. When the pressure-bearing part moves in the direction of compressing the first chamber, the first chamber is squeezed and releases the cooling liquid at the same time, the cooling liquid flows out to the liquid cooling channel, and the cooling liquid absorbs heat and sublimates in the liquid cooling channel, and the first cavity The pressure in the chamber increases, causing the sealing structure to move in the direction of squeezing the second chamber, the gas in the second chamber flows out through the air outlet hole and the volume of the second chamber decreases, and the cooling liquid in the liquid cooling channel and the lower cover and The cooling body performs heat exchange, and at the same time, the coolant is heated and vaporized to realize liquid cooling and heat dissipation; when the heat dissipation efficiency of the thermal element is reduced, the vaporized coolant is liquefied and accumulated in the liquid flow channel due to the temperature drop, and the speed of the fan assembly is reduced. The redundant air volume below is not enough to push the pressure-bearing parts to move, the sealing structure resets under the action of external force, and squeezes the first chamber, pushes the coolant in the liquid cooling channel to flow back, and is absorbed by the compression structure until the pressure-bearing parts reset to top.

本发明提供的水冷辅助散热装置可同时实现液冷与风冷散热,相比于仅设置风冷散热装置,可有效提高散热效率,相同的散热效率情况下,可使风扇组件的转速降低,避免因风扇组件转速过高而带来的噪音问题,提高用户的使用感受;另外,冷却液位于密封设置的第一腔室内,可避免散热器漏液问题。The water-cooled auxiliary heat dissipation device provided by the present invention can realize liquid cooling and air-cooled heat dissipation at the same time. Compared with only the air-cooled heat dissipation device, it can effectively improve the heat dissipation efficiency. Under the same heat dissipation efficiency, the speed of the fan assembly can be reduced to avoid The noise problem caused by the high speed of the fan assembly improves the user experience; in addition, the coolant is located in the sealed first chamber, which can avoid the problem of radiator leakage.

此外,本发明还提供了一种上述水冷辅助散热装置的存储设备、包括上述存储设备的服务器以及计算机。In addition, the present invention also provides a storage device of the above-mentioned water-cooled auxiliary heat dissipation device, a server and a computer including the above-mentioned storage device.

附图说明Description of drawings

为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据提供的附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present invention, and those skilled in the art can also obtain other drawings according to the provided drawings without creative work.

图1为本发明所提供的水冷辅助散热装置的具体实施例的爆炸示意图;Fig. 1 is an exploded schematic diagram of a specific embodiment of the water-cooled auxiliary heat dissipation device provided by the present invention;

图2为图1中水冷辅助散热装置的剖面示意图;Fig. 2 is a schematic cross-sectional view of the water-cooled auxiliary heat dissipation device in Fig. 1;

图3为散热器组件的剖面示意图;Figure 3 is a schematic cross-sectional view of a radiator assembly;

图4为图3中散热器组件的气流方向示意图;Fig. 4 is a schematic diagram of the airflow direction of the radiator assembly in Fig. 3;

图5为散热主体的结构示意图;FIG. 5 is a schematic structural diagram of a heat dissipation body;

图6为下盖的结构示意图;Figure 6 is a schematic structural view of the lower cover;

图7为水冷辅助散热装置的结构示意图;FIG. 7 is a schematic structural diagram of a water-cooled auxiliary heat dissipation device;

图8为散热主体的另一角度的结构示意图;Fig. 8 is a structural schematic diagram of another angle of the heat dissipation main body;

图9为承压件的结构示意图。Fig. 9 is a structural schematic diagram of a pressure-bearing member.

图1-图9中:In Figure 1-Figure 9:

1为风扇组件、101为风扇框、102为风扇主体、1021为扇叶、2为弹簧螺丝、3为固定螺丝、4为散热器组件、401为上盖、402为散热主体、4021为导风槽、4022为散热鳍片、4023为导向槽、4024为液冷通道、4025为第一通孔、4026为第二通孔、403为下盖、4031为环状密封槽、4032为散热硅脂层、4033为柱状结构、4034为限位凸起、404为弹性件、405为密封结构、406为承压件、4061为导向凸部、407为压缩结构、408为冷却液、5为主板支架。1 is the fan assembly, 101 is the fan frame, 102 is the main body of the fan, 1021 is the fan blade, 2 is the spring screw, 3 is the fixing screw, 4 is the radiator assembly, 401 is the upper cover, 402 is the heat dissipation body, 4021 is the air guide Groove, 4022 is the cooling fin, 4023 is the guide groove, 4024 is the liquid cooling channel, 4025 is the first through hole, 4026 is the second through hole, 403 is the lower cover, 4031 is the annular sealing groove, 4032 is the heat dissipation silicone grease layer, 4033 is a columnar structure, 4034 is a limit protrusion, 404 is an elastic part, 405 is a sealing structure, 406 is a pressure-bearing part, 4061 is a guiding convex part, 407 is a compression structure, 408 is a coolant, 5 is a main board bracket .

具体实施方式Detailed ways

下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

本发明的核心是提供一种水冷辅助散热装置,在使用的过程中,可以通过风扇组件向散热器组件吹气,实现风冷散热;同时,风扇组件吹出的气流作用于承压件并压缩第一腔室,使第一腔室内的冷却液流入液冷通道,实现液冷散热;风冷散热与液冷散热的组合可有效提高散热装置的散热效率,避免因风扇组件转速过高而带来的噪音问题,提高用户的使用感受。The core of the present invention is to provide a water-cooled auxiliary heat dissipation device. During use, the fan assembly can blow air to the radiator assembly to realize air cooling and heat dissipation; at the same time, the airflow blown by the fan assembly acts on the pressure-bearing parts and compresses the first One chamber allows the coolant in the first chamber to flow into the liquid cooling channel to realize liquid cooling and heat dissipation; the combination of air cooling and liquid cooling can effectively improve the heat dissipation efficiency of the heat dissipation device and avoid damage caused by excessive fan assembly speed. Noise problem, improve user experience.

本发明的另一核心是提供一种包括上述水冷辅助散热装置的存储设备、包括上述存储设备的服务器以及计算机。Another core of the present invention is to provide a storage device including the above-mentioned water-cooling auxiliary heat dissipation device, a server and a computer including the above-mentioned storage device.

请参考图1至图9。Please refer to Figure 1 to Figure 9.

本具体实施例公开了一种水冷辅助散热装置,包括风扇组件1和散热器组件4,风扇组件1用于向散热器组件4吹气;散热器组件4包括上盖401、散热主体402以及下盖403,散热主体402设置有散热鳍片4022以及贯穿其轴向的第一通孔4025;下盖403与散热主体402之间形成有液冷通道4024,液冷通道4024与第一通孔4025连通、形成液冷腔室;液冷腔室内设置有可移动的密封结构405,密封结构405将液冷腔室分隔为独立的第一腔室和第二腔室,第一腔室内盛放冷却液408且密封,第一腔室朝向风扇组件1的表面设置有可移动的承压件406;第二腔室设置有与外界连通出气孔;风扇组件1向承压件406吹气时,承压件406受气压作用力压缩第一腔室,密封结构405向挤压第二腔室的方向移动,第一腔室内的冷却液408流入液冷通道4024。This specific embodiment discloses a water-cooled auxiliary heat dissipation device, including a fan assembly 1 and a radiator assembly 4, the fan assembly 1 is used to blow air to the radiator assembly 4; the radiator assembly 4 includes an upper cover 401, a heat dissipation body 402 and a lower The cover 403 and the heat dissipation main body 402 are provided with heat dissipation fins 4022 and a first through hole 4025 passing through the axial direction; a liquid cooling passage 4024 is formed between the lower cover 403 and the heat dissipation main body 402, and the liquid cooling passage 4024 and the first through hole 4025 connected to form a liquid cooling chamber; a movable sealing structure 405 is arranged in the liquid cooling chamber, and the sealing structure 405 separates the liquid cooling chamber into an independent first chamber and a second chamber. The first chamber is provided with a movable pressure bearing 406 on the surface facing the fan assembly 1; the second chamber is provided with an air outlet communicating with the outside world; when the fan assembly 1 blows air to the pressure bearing 406, the bearing The pressing member 406 is compressed by the air pressure to compress the first chamber, and the sealing structure 405 moves in the direction of pressing the second chamber, and the cooling liquid 408 in the first chamber flows into the liquid cooling channel 4024 .

需要进行说明的是,本具体实施例中的密封结构405可以是密封圈、密封胶塞等结构,具体根据实际情况确定,在此不做赘述。It should be noted that the sealing structure 405 in this specific embodiment may be a structure such as a sealing ring, a sealing rubber plug, etc., which are determined according to actual conditions and will not be repeated here.

本具体实施例中提到的冷却液408一般为冷却液408、纯水等液态冷却液408。The cooling liquid 408 mentioned in this specific embodiment is generally liquid cooling liquid 408 such as cooling liquid 408 and pure water.

液冷通道4024可以设置于散热主体402,也可以设置于下盖403,或者散热主体402与下盖403围设的空间内形成液冷通道4024,或者其它符合要求的设置方式。The liquid cooling channel 4024 can be arranged on the heat dissipation body 402 or the lower cover 403 , or the liquid cooling channel 4024 can be formed in the space surrounded by the heat dissipation body 402 and the lower cover 403 , or other suitable arrangement methods.

风扇组件1与散热器组件4可以如图1所示方向设置,风扇组件1设置于散热器组件4的一侧,且风扇组件1吹出的气体朝向散热器组件4,可对散热主体402的散热鳍片4022以及设置于第一通孔4025的承载件吹气。The fan assembly 1 and the radiator assembly 4 can be arranged in the direction shown in FIG. The fins 4022 and the carrier disposed in the first through hole 4025 blow air.

在使用本具体实施例提供的水冷辅助散热装置的过程中,当发热元件高效散热时,风扇组件1朝向散热器组件4吹气,流经散热主体402的散热鳍片4022的气流流速增加,可实现风冷散热;同时风扇组件1可向承载件吹气,较大的气流压力作用于承载件的表面,使承载件在第一通孔4025内向压缩第一腔室的方向移动,第一腔室内盛放有冷却液408,在承压件406向压缩第一腔室的方向移动的过程中,第一腔室被挤压同时释放冷却液408,冷却液408流出至液冷通道4024,在液冷通道4024内冷却液408吸热升华,第一腔室内的压力增加,使密封结构405向挤压第二腔室的方向移动,第二腔室内的气体由出气孔流出且第二腔室的体积减小,在液冷通道4024内冷却液408与下盖403以及散热主体402进行热量交换,同时冷却液408受热气化,实现液冷散热;当但热元件的散热效率降低时,气化的冷却液408因温度降低液化并积聚至液流通道,风扇组件1转速降低,向下的冗余风量不足以推动承压件406移动,密封结构405在外力作用下复位,并挤压第一腔室,推动液冷通道4024内的冷却液408回流、被压缩结构407吸收,直至承压件406复位至顶部。In the process of using the water-cooled auxiliary heat dissipation device provided in this specific embodiment, when the heat-generating element dissipates heat efficiently, the fan assembly 1 blows air toward the radiator assembly 4, and the airflow velocity flowing through the heat dissipation fins 4022 of the heat dissipation body 402 increases, which can Realize air cooling and heat dissipation; at the same time, the fan assembly 1 can blow air to the carrier, and the larger airflow pressure acts on the surface of the carrier, so that the carrier moves in the direction of compressing the first chamber in the first through hole 4025, and the first chamber There is cooling liquid 408 in the chamber. When the pressure-bearing member 406 moves toward the direction of compressing the first chamber, the first chamber is squeezed and the cooling liquid 408 is released at the same time. The cooling liquid 408 flows out to the liquid cooling channel 4024. The cooling liquid 408 in the liquid cooling channel 4024 absorbs heat and sublimates, and the pressure in the first chamber increases, causing the sealing structure 405 to move in the direction of squeezing the second chamber, and the gas in the second chamber flows out through the air outlet hole and the second chamber The volume of the cooling liquid is reduced, and the cooling liquid 408 exchanges heat with the lower cover 403 and the heat dissipation body 402 in the liquid cooling channel 4024. At the same time, the cooling liquid 408 is heated and vaporized to realize liquid cooling and heat dissipation; The melted coolant 408 is liquefied and accumulated in the liquid flow channel due to the temperature drop, the fan assembly 1 rotates at a lower speed, and the downward redundant air volume is not enough to push the pressure-bearing part 406 to move, and the sealing structure 405 resets under the action of external force and squeezes the first A cavity pushes the cooling liquid 408 in the liquid cooling channel 4024 to flow back and be absorbed by the compression structure 407 until the pressure bearing member 406 returns to the top.

本具体实施例提供的水冷辅助散热装置可同时实现液冷与风冷散热,相比于仅设置风冷散热装置,可有效提高散热效率;相同的散热效率情况下,可使风扇组件1的转速降低,避免因风扇组件1转速过高而带来的噪音问题,提高用户的使用感受;另外,冷却液408位于密封设置的第一腔室内,可避免散热器漏液问题。The water-cooled auxiliary heat dissipation device provided in this specific embodiment can realize liquid cooling and air-cooled heat dissipation at the same time, which can effectively improve the heat dissipation efficiency compared with only the air-cooled heat dissipation device; reduce the noise problem caused by the excessively high speed of the fan assembly 1, and improve user experience; in addition, the coolant 408 is located in the sealed first chamber, which can avoid the problem of radiator liquid leakage.

在一具体实施例中,第一通孔4025内设置有可吸收或释放冷却液408的压缩结构407,承压件406受气压作用力压缩第一腔室时,压缩结构407被压缩释放冷却液408,承压件406复位时,压缩结构407恢复并吸收冷却液408。In a specific embodiment, the first through hole 4025 is provided with a compression structure 407 that can absorb or release the cooling liquid 408. When the pressure bearing 406 is compressed by the pressure force of the first chamber, the compression structure 407 is compressed to release the cooling liquid. 408 , when the pressure bearing part 406 is reset, the compression structure 407 recovers and absorbs the cooling liquid 408 .

如图2所示,压缩结构407设置于第一通孔4025内,并且压缩结构407吸满冷却液408,在发热元件的散热效率较低,风扇组件1的转速较低,承压件406没有因风扇组件1吹出的气流压力而移动时,冷却液408被吸收于压缩结构407不释放;在发热元件的散热效率较高,风扇组件1的转速较高,承压件406在风扇组件1吹出的气流压力下向下移动挤压压缩结构407时,压缩结构407被挤压释放冷却液408,冷却液408流出至液冷通道4024内,实现液冷散热。当发热元件散热效率降低,风扇组件1停止吹风或风扇组件1的转速不足以使承压件406移动时,气化的冷却液408受冷液化、并积聚于液冷通道4024,密封结构405在气压或外界压力作用下,复位至原来位置,受密封结构405的挤压,第一腔室压缩、承压件406向上移动,压缩结构407恢复原来的体积,同时吸收之前释放的冷却液408,使液冷通道4024的冷却液408再次被吸入压缩结构407内。As shown in Figure 2, the compression structure 407 is arranged in the first through hole 4025, and the compression structure 407 is filled with the coolant 408, the heat dissipation efficiency of the heating element is low, the speed of the fan assembly 1 is low, and the pressure bearing part 406 has no When moving due to the pressure of the airflow blown out by the fan assembly 1, the coolant 408 is absorbed in the compression structure 407 and does not release; the heat dissipation efficiency of the heating element is high, the speed of the fan assembly 1 is high, and the pressure bearing 406 is blown out by the fan assembly 1 When the compression structure 407 is moved downward under the pressure of the air flow, the compression structure 407 is squeezed to release the cooling liquid 408, and the cooling liquid 408 flows out into the liquid cooling channel 4024 to realize liquid cooling and heat dissipation. When the heat dissipation efficiency of the heating element is reduced, the fan assembly 1 stops blowing or the rotation speed of the fan assembly 1 is insufficient to move the pressure bearing 406, the vaporized coolant 408 is liquefied and accumulated in the liquid cooling channel 4024, and the sealing structure 405 is Under the action of air pressure or external pressure, return to the original position, squeezed by the sealing structure 405, the first chamber is compressed, the pressure-bearing part 406 moves upward, the compression structure 407 restores its original volume, and at the same time absorbs the previously released cooling liquid 408, The cooling liquid 408 in the liquid cooling channel 4024 is sucked into the compression structure 407 again.

具体的,可以将压缩结构407设置为吸湿海绵。Specifically, the compression structure 407 can be configured as a hygroscopic sponge.

为了提高压缩结构407的吸湿效果,可以将压缩结构407设置为聚氨酯材料(聚氨基甲酸酯 Polyurethane),阻燃等级至少达到V0,可耐大于等于250℃的高温,隔热性能好,导热系数小于0.3w/m.k,吸水量可达自重的6倍以上。In order to improve the moisture absorption effect of the compression structure 407, the compression structure 407 can be set to polyurethane material (polyurethane), the flame retardant grade can reach at least V0, can withstand high temperature greater than or equal to 250 ° C, good heat insulation performance, and thermal conductivity Less than 0.3w/m.k, the water absorption can reach more than 6 times of its own weight.

当压缩结构407为吸湿海绵时,吸湿海绵设置于第一通孔4025内,并且吸湿海绵吸满冷却液408,在发热元件散热效率较低,风扇组件1转速低,承压件406没有因风扇组件1吹出的气流压力而移动时,冷却液408被吸收于吸湿海绵不释放,当发热元件高效散热,风扇转速增加,承压件406在风扇组件1吹出的气流压力下向下移动挤压吸湿海绵时,吸湿海绵被挤压变形释放冷却液408,冷却液408流出至液冷通道4024内,实现液冷散热。当发热元件散热效率降低,风扇组件1停止吹风或风扇组件1的转速不足以使承压件406移动时,气化的冷却液408受冷液化、并积聚于液冷通道4024,密封结构405在气压或外界压力作用下,复位至原来位置,受密封结构405的挤压,第一腔室压缩、承压件406向上移动,吸湿海绵恢复原来的体积,同时吸收之前释放的冷却液408,使液冷通道4024的冷却液408再次被吸入吸湿海绵内。When the compression structure 407 is a hygroscopic sponge, the hygroscopic sponge is arranged in the first through hole 4025, and the hygroscopic sponge absorbs the coolant 408, the heat dissipation efficiency of the heating element is low, the speed of the fan assembly 1 is low, and the pressure bearing part 406 is not affected by the fan. When the pressure of the airflow blown out by the component 1 moves, the coolant 408 is absorbed by the moisture-absorbing sponge and does not release it. When the heating element dissipates heat efficiently and the fan speed increases, the pressure-bearing part 406 moves downward under the pressure of the airflow blown out by the fan component 1 to squeeze and absorb moisture. When the sponge is used, the moisture-absorbing sponge is squeezed and deformed to release the cooling liquid 408, and the cooling liquid 408 flows out into the liquid cooling channel 4024 to realize liquid cooling and heat dissipation. When the heat dissipation efficiency of the heating element is reduced, the fan assembly 1 stops blowing or the rotation speed of the fan assembly 1 is insufficient to move the pressure bearing 406, the vaporized coolant 408 is liquefied and accumulated in the liquid cooling channel 4024, and the sealing structure 405 is Under the action of air pressure or external pressure, it is reset to its original position, squeezed by the sealing structure 405, the first chamber is compressed, the pressure-bearing part 406 moves upward, and the moisture-absorbing sponge recovers its original volume, and at the same time absorbs the cooling liquid 408 released before, so that The cooling liquid 408 in the liquid cooling channel 4024 is sucked into the hygroscopic sponge again.

具体的,可以将吸湿海绵设置为与第一通孔4025形状相似的结构,以使吸湿海绵可以完全将第一通孔4025填充,增大吸湿海绵体积,从而增大吸湿量,提高散热效率。Specifically, the hygroscopic sponge can be configured to have a structure similar in shape to the first through hole 4025, so that the hygroscopic sponge can completely fill the first through hole 4025, increasing the volume of the hygroscopic sponge, thereby increasing the moisture absorption capacity and improving the heat dissipation efficiency.

当然,还可以将压缩结构407设置为类似于注射器结构,注射器结构内存储有冷却液408,承压件406与注射器结构的活塞杆连接,注射器结构设置于第一通孔4025内,在发热元件散热效率较低,风扇转速较低,承压件406没有因风扇组件1吹出的气流压力而移动时,冷却液408被吸收于注射器结构内且不释放,当发热元件高效散热,风扇转速增加,承压件406在风扇组件1吹出的气流压力下向下移动挤压注射器结构的活塞杆时,活塞杆向下移动,挤压注射器结构内的冷却液408,使冷却液408流出至液冷通道4024内,实现液冷散热。当发热元件散热效率降低,风扇组件1停止吹风或风扇组件1的转速不足以使承压件406移动时,气化的冷却液408受冷液化、并积聚于液冷通道4024,密封结构405在气压或外界压力作用下,复位至原来位置,受密封结构405的挤压,第一腔室压缩、承压件406向上移动,注射器结构的活塞杆恢复原来的位置,同时吸收之前释放的冷却液408,使液冷通道4024的冷却液408再次被吸入注射器结构内,压缩结构407还可以为其它满足要求的结构,在此不做赘述。Of course, the compression structure 407 can also be set to be similar to the syringe structure, the coolant 408 is stored in the syringe structure, the pressure bearing member 406 is connected with the piston rod of the syringe structure, the syringe structure is arranged in the first through hole 4025, and the heating element The heat dissipation efficiency is low, and the fan speed is low. When the pressure-bearing part 406 does not move due to the airflow pressure blown out by the fan assembly 1, the coolant 408 is absorbed in the injector structure and does not release. When the heating element dissipates heat efficiently, the fan speed increases. When the pressure-bearing member 406 moves downward under the pressure of the airflow blown out by the fan assembly 1 to squeeze the piston rod of the syringe structure, the piston rod moves downward, squeezing the cooling liquid 408 in the syringe structure, so that the cooling liquid 408 flows out to the liquid cooling channel Inside the 4024, liquid cooling is realized. When the heat dissipation efficiency of the heating element is reduced, the fan assembly 1 stops blowing or the rotation speed of the fan assembly 1 is insufficient to move the pressure bearing 406, the vaporized coolant 408 is liquefied and accumulated in the liquid cooling channel 4024, and the sealing structure 405 is Under the action of air pressure or external pressure, return to the original position, squeezed by the sealing structure 405, the first chamber is compressed, the pressure-bearing part 406 moves upward, the piston rod of the syringe structure returns to the original position, and at the same time absorbs the previously released coolant 408 , the cooling liquid 408 in the liquid cooling channel 4024 is sucked into the injector structure again, and the compression structure 407 can also be other structures that meet the requirements, which will not be repeated here.

在一具体实施例中,下盖403包括底板以及凸出设置于底板的柱状结构4033,散热主体402设置有第二通孔4026,柱状结构4033伸入第二通孔4026内,且柱状结构4033的外壁面与第二通孔4026的内壁面之间形成环状腔室;密封结构405沿柱状结构4033的轴向可移动的套设于柱状结构4033的外周,并将环状腔室分隔为独立的两部分,其中一部分为第二腔室,另一部分与液冷通道4024、第一通孔4025形成第一腔室。In a specific embodiment, the lower cover 403 includes a bottom plate and a columnar structure 4033 protruding from the bottom plate, the heat dissipation body 402 is provided with a second through hole 4026, the columnar structure 4033 extends into the second through hole 4026, and the columnar structure 4033 An annular chamber is formed between the outer wall surface of the second through hole 4026 and the inner wall surface of the second through hole 4026; the sealing structure 405 is movably sleeved on the outer periphery of the columnar structure 4033 along the axial direction of the columnar structure 4033, and the annular chamber is divided into Two independent parts, one part is the second chamber, and the other part forms the first chamber with the liquid cooling channel 4024 and the first through hole 4025 .

如图5所示,散热主体402设置有第二通孔4026,如图6所示,下盖403包括底板以及凸出设置于底板的柱状结构4033;如图3、图4所示,柱状结构4033伸入第二通孔4026内,且柱状结构4033的外径尺寸小于第二通孔4026的径向尺寸,使柱状结构4033与第二通孔4026的内侧壁之间形成环状腔室,密封结构405设置于环状腔室,并且将环状腔室分为位于不同轴向位置的两部分,其中一部分环状腔室与液冷通道4024连通、并与液冷通道4024、第一通孔4025组合为第一腔室,环状腔室的另一部分为第二腔室。As shown in Figure 5, the heat dissipation main body 402 is provided with a second through hole 4026, as shown in Figure 6, the lower cover 403 includes a bottom plate and a columnar structure 4033 protruding from the bottom plate; as shown in Figure 3 and Figure 4, the columnar structure 4033 extends into the second through hole 4026, and the outer diameter of the columnar structure 4033 is smaller than the radial dimension of the second through hole 4026, so that an annular chamber is formed between the columnar structure 4033 and the inner side wall of the second through hole 4026, The sealing structure 405 is arranged in the annular chamber, and divides the annular chamber into two parts located at different axial positions, wherein a part of the annular chamber communicates with the liquid cooling channel 4024, and communicates with the liquid cooling channel 4024, the first channel The holes 4025 are combined as the first chamber, and the other part of the annular chamber is the second chamber.

在具体使用的过程中,在发热元件散热效率较低,风扇转速较低,承压件406没有因风扇组件1吹出的气流压力而移动时,冷却液408被吸收于压缩结构407内且不释放,当发热元件高效散热,风扇组件1转速增加,承压件406在风扇组件1吹出的气流压力下向下移动挤压第一腔室时,压缩结构407被挤压释放冷却液408,使冷却液408流出至液冷通道4024内,冷却液408受热气化,压缩结构407继续释放冷却液408,流经液冷通道4024的冷却液408继续流动至环状腔室,气化后的冷却液408也可流动至环状腔室,实现液冷散热。在风扇组件1转速较高,承压件406向下挤压第一腔室的过程中,因第一腔室被挤压同时释放的冷却液408受热气化,第一腔室内的压力增加,密封结构405向挤压第二腔室的方向移动,使环状腔室中位于第一腔室的空间增加,以使冷却液408进入柱状结构4033与第二通孔4026内壁之间的环状腔室,冷却液408在吸热的同时气化使第一腔室内压力增加,密封结构405在压力作用下向挤压第二腔室的方向移动;当发热元件散热效率降低,风扇组件1停止吹风或风扇组件1的转速不足以使承压件406移动时,气化的冷却液408受冷液化、并积聚于液冷通道4024,密封结构405在气压或外界压力作用下,复位至原来位置,受密封结构405的挤压,第一腔室压缩、承压件406向上移动,压缩结构407恢复原来的体积,同时吸收之前释放的冷却液408,使液冷通道4024的冷却液408再次被吸入压缩结构407内。During specific use, when the heat dissipation efficiency of the heating element is low, the fan speed is low, and the pressure-bearing member 406 is not moved by the airflow pressure blown out by the fan assembly 1, the cooling liquid 408 is absorbed in the compression structure 407 and does not release , when the heating element dissipates heat efficiently, the speed of the fan assembly 1 increases, and the pressure-bearing member 406 moves downward under the pressure of the airflow blown out by the fan assembly 1 to squeeze the first chamber, the compression structure 407 is squeezed to release the cooling liquid 408, so that the cooling The liquid 408 flows out into the liquid cooling channel 4024, the cooling liquid 408 is heated and vaporized, the compression structure 407 continues to release the cooling liquid 408, the cooling liquid 408 flowing through the liquid cooling channel 4024 continues to flow into the annular chamber, and the gasified cooling liquid 408 can also flow to the annular chamber to realize liquid cooling and heat dissipation. When the fan assembly 1 rotates at a high speed and the pressure-bearing member 406 presses the first chamber downward, the pressure in the first chamber increases due to the cooling fluid 408 released while the first chamber is being squeezed and vaporized by heat. The sealing structure 405 moves in the direction of squeezing the second chamber, so that the space in the first chamber in the annular chamber increases, so that the cooling liquid 408 enters the annular space between the columnar structure 4033 and the inner wall of the second through hole 4026. chamber, the coolant 408 gasifies while absorbing heat to increase the pressure in the first chamber, and the sealing structure 405 moves to the direction of squeezing the second chamber under pressure; when the heat dissipation efficiency of the heating element decreases, the fan assembly 1 stops When the speed of the blower or the fan assembly 1 is insufficient to move the pressure-bearing part 406, the vaporized coolant 408 is cooled and liquefied, and accumulates in the liquid cooling channel 4024, and the sealing structure 405 returns to its original position under the action of air pressure or external pressure , being squeezed by the sealing structure 405, the first chamber is compressed, the pressure-bearing member 406 moves upward, the compression structure 407 restores its original volume, and at the same time absorbs the cooling liquid 408 released before, so that the cooling liquid 408 in the liquid cooling channel 4024 is again Inhaled into the compression structure 407.

本具体实施例中的水冷辅助散热装置在具体使用的过程中,冷却液408可流入下盖403的柱状结构4033与散热主体402的第二通孔4026的内壁之间的环状腔室,可有效增加冷却液408与下盖403、散热主体402的接触面积,从而提高散热效率。During the specific use of the water-cooled auxiliary heat dissipation device in this specific embodiment, the cooling liquid 408 can flow into the annular chamber between the columnar structure 4033 of the lower cover 403 and the inner wall of the second through hole 4026 of the heat dissipation body 402, and can The contact area between the cooling liquid 408 and the lower cover 403 and the heat dissipation main body 402 is effectively increased, thereby improving heat dissipation efficiency.

为了使密封结构405能够顺利复位,可以设置用于为密封结构405的复位提供动力的弹性件404,弹性件404一端抵接于密封结构405,另一端抵接于上盖401。In order to make the sealing structure 405 reset smoothly, an elastic member 404 may be provided to provide power for resetting the sealing structure 405 . One end of the elastic member 404 abuts against the sealing structure 405 , and the other end abuts against the upper cover 401 .

如图3所示,上盖401和下盖403分别扣设于散热主体402相对的两端,在具体使用的过程中,当发热元件散热效率降低,风扇组件1停止吹风或风扇组件1的转速不足以使承压件406移动时,密封结构405在弹性件404的弹力作用下,复位至原来位置,复位过程中,气化的冷却液408受冷液化、并积聚于液冷通道4024,气体由出气孔进入第二腔室,密封结构405向第一腔室的方向移动,并挤压第一腔室,使第一腔室内的气压增加,直至承压件406面向第一腔室内的侧面所受压力大于承压件406朝向风扇组件1一侧所受压力,承压件406向靠近风扇组件1的一侧移动,压缩结构407复原、并吸收之前释放的冷却液408,使液冷通道4024的冷却液408再次被吸入压缩结构407内。当承压件406在风扇组件1吹出的气流压力下向下移动挤压第一腔室时,因第一腔室被挤压同时释放的冷却液408受热气化,第一腔室内的气压增加,推动密封结构405向挤压第二腔室的方向移动,密封结构405在向挤压第二腔室的方向移动的过程中,需要克服弹性件404的弹性力,使弹性件404发生形变,第二腔室内的气体由出气孔吹出;同时,压缩结构407被挤压释放冷却液408,使冷却液408流出至液冷通道4024内,冷却液408受热气化,压缩结构407继续释放冷却液408,流经液冷通道4024的冷却液408继续流动至环状腔室,实现液冷散热。As shown in Figure 3, the upper cover 401 and the lower cover 403 are fastened on opposite ends of the heat dissipation body 402 respectively. When it is not enough to move the pressure bearing part 406, the sealing structure 405 is reset to its original position under the action of the elastic force of the elastic part 404. Entering the second chamber through the air outlet, the sealing structure 405 moves toward the first chamber, and squeezes the first chamber to increase the air pressure in the first chamber until the pressure-bearing member 406 faces the side of the first chamber The pressure received is greater than the pressure on the side of the pressure bearing 406 facing the fan assembly 1, the pressure bearing 406 moves to the side close to the fan assembly 1, the compression structure 407 recovers and absorbs the previously released cooling liquid 408, making the liquid cooling channel The coolant 408 at 4024 is sucked into the compression structure 407 again. When the pressure-bearing member 406 moves downwards and squeezes the first chamber under the pressure of the airflow blown out by the fan assembly 1, the cooling fluid 408 that is released while the first chamber is being squeezed is heated and vaporized, and the air pressure in the first chamber increases. , to push the sealing structure 405 to move in the direction of squeezing the second chamber. When the sealing structure 405 moves in the direction of squeezing the second chamber, it needs to overcome the elastic force of the elastic member 404 to deform the elastic member 404. The gas in the second chamber is blown out from the air outlet; at the same time, the compression structure 407 is squeezed to release the cooling liquid 408, so that the cooling liquid 408 flows out into the liquid cooling channel 4024, the cooling liquid 408 is heated and vaporized, and the compression structure 407 continues to release the cooling liquid 408 , the cooling liquid 408 flowing through the liquid cooling channel 4024 continues to flow to the annular chamber to realize liquid cooling and heat dissipation.

具体的,弹性件404可以是弹簧,如图3、图4所示,弹簧套设于柱状结构4033的外周,如图6所示,柱状结构4033设置有用于限制密封结构405移动距离的限位凸起4034,限位凸起4034凸出设置于柱状结构4033的外周侧面。Specifically, the elastic member 404 can be a spring. As shown in FIGS. 3 and 4, the spring is sleeved on the outer periphery of the columnar structure 4033. As shown in FIG. The protrusion 4034 , the limiting protrusion 4034 protrudes from the outer peripheral side of the columnar structure 4033 .

在具体的使用的过程中,自然状态下,承压件406没有因风扇组件1吹出的气流压力而沿第一通孔4025移动时,在弹簧的弹性力作用下,使密封结构405与限位凸起4034接触,且弹簧的一端与密封结构405抵接,另一端与上盖401抵接。当承压件406在风扇组件1吹出的气流压力下向下移动挤压第一腔室时,因第一腔室被挤压同时释放的冷却液408受热气化,第一腔室内的气压增加,推动密封结构405向挤压第二腔室的方向移动,密封结构405在向挤压第二腔室的方向移动的过程中,需要克服弹簧的弹性力,使弹簧压缩形变,第二腔室内的气体由出气孔吹出;同时,压缩结构407被挤压释放冷却液408,使冷却液408流出至液冷通道4024内,冷却液408受热气化,压缩结构407继续释放冷却液408,流经液冷通道4024的冷却液408继续流动至环状腔室,实现液冷散热。In the specific use process, under the natural state, when the pressure-bearing member 406 does not move along the first through hole 4025 due to the airflow pressure blown out by the fan assembly 1, under the elastic force of the spring, the sealing structure 405 and the stop The protrusion 4034 contacts, and one end of the spring abuts against the sealing structure 405 , and the other end abuts against the upper cover 401 . When the pressure-bearing member 406 moves downwards and squeezes the first chamber under the pressure of the airflow blown out by the fan assembly 1, the cooling fluid 408 that is released while the first chamber is being squeezed is heated and vaporized, and the air pressure in the first chamber increases. , to push the sealing structure 405 to move toward the direction of squeezing the second chamber. During the process of moving toward the direction of squeezing the second chamber, the sealing structure 405 needs to overcome the elastic force of the spring, so that the spring is compressed and deformed. At the same time, the compression structure 407 is squeezed to release the cooling liquid 408, so that the cooling liquid 408 flows out into the liquid cooling channel 4024, the cooling liquid 408 is heated and gasified, and the compression structure 407 continues to release the cooling liquid 408, flowing through The cooling liquid 408 in the liquid cooling channel 4024 continues to flow to the annular chamber to realize liquid cooling and heat dissipation.

当然,弹性件404还可以设置为弹片、弹力绳等结构,具体根据实际情况确定,在此不做赘述。Of course, the elastic member 404 can also be configured as a structure such as a shrapnel or an elastic cord, which is determined according to actual conditions, and will not be described in detail here.

限位凸起4034可以是环绕设置于柱状结构4033的外周侧面的环状凸起,也可以是环绕设置于柱状结构4033的外周侧面的扇形凸起,具体根据实际情况确定。The limiting protrusion 4034 can be an annular protrusion arranged around the outer peripheral side of the columnar structure 4033 , or can be a fan-shaped protrusion arranged around the outer peripheral side of the columnar structure 4033 , which is determined according to the actual situation.

在一具体实施例中,还可以在下盖403的柱状结构4033内设置若干与第一腔室连通的连通通道,以增大下壳的柱状结构4033与冷却液408的接触面积。In a specific embodiment, a plurality of communication channels communicating with the first chamber may also be provided in the columnar structure 4033 of the lower cover 403 to increase the contact area between the columnar structure 4033 of the lower case and the cooling liquid 408 .

在具体使用的过程中,承压件406没有因风扇组件1吹出的气流压力而移动时,冷却液408被吸收于压缩结构407内且不释放,液冷通道4024及连通通道内均没有冷却液408;当承压件406在风扇组件1吹出的气流压力下向下移动挤压第一腔室时,压缩结构407被挤压释放冷却液408,使冷却液408流出至液冷通道4024内,冷却液408受热气化,压缩结构407继续释放冷却液408,流经液冷通道4024的冷却液408继续流动至环状腔室及连通通道,流至环状腔室内的冷却液408与散热主体402及下盖403的柱状结构4033进行热交换,流至连通通道内的冷却液408与下盖403的柱状结构4033进行热交换,实现液冷散热。在承压件406向下挤压第一腔室的过程中,因第一腔室被挤压同时释放的冷却液408受热气化,第一腔室内的压力增加,密封结构405向挤压第二腔室的方向移动,使环状腔室中位于第一腔室的空间增加,以使冷却液408进入柱状结构4033与第二通孔4026内壁之间的环状腔室;当发热元件散热效率降低,风扇组件1停止吹风或风扇组件1的转速不足以使承压件406移动时,气化的冷却液408受冷液化、并积聚于液冷通道4024,密封结构405在气压或外界压力作用下,复位至原来位置,受密封结构405的挤压,第一腔室压缩、承压件406向上移动,压缩结构407恢复原来的体积,同时吸收之前释放的冷却液408,使液冷通道4024的冷却液408再次被吸入压缩结构407内。During specific use, when the pressure-bearing member 406 does not move due to the pressure of the airflow blown out by the fan assembly 1, the cooling liquid 408 is absorbed in the compression structure 407 and does not release, and there is no cooling liquid in the liquid cooling channel 4024 and the communication channel 408; when the pressure-bearing member 406 moves downward under the pressure of the airflow blown out by the fan assembly 1 to squeeze the first chamber, the compression structure 407 is squeezed to release the cooling liquid 408, so that the cooling liquid 408 flows out into the liquid cooling channel 4024, The cooling liquid 408 is heated and vaporized, the compression structure 407 continues to release the cooling liquid 408, the cooling liquid 408 flowing through the liquid cooling channel 4024 continues to flow to the annular chamber and the communication channel, and flows to the cooling liquid 408 in the annular chamber and the heat dissipation body 402 and the columnar structure 4033 of the lower cover 403 perform heat exchange, and the cooling liquid 408 flowing into the communication channel exchanges heat with the columnar structure 4033 of the lower cover 403 to realize liquid cooling and heat dissipation. When the pressure-bearing member 406 presses the first chamber downward, the cooling liquid 408 released while being squeezed is heated and vaporized, the pressure in the first chamber increases, and the sealing structure 405 presses the second chamber The direction of the two chambers moves, so that the space in the first chamber in the annular chamber increases, so that the cooling liquid 408 enters the annular chamber between the columnar structure 4033 and the inner wall of the second through hole 4026; when the heating element dissipates heat Efficiency decreases, when the fan assembly 1 stops blowing or the speed of the fan assembly 1 is insufficient to move the pressure bearing 406, the vaporized cooling liquid 408 is liquefied by cooling and accumulates in the liquid cooling channel 4024, the sealing structure 405 is under air pressure or external pressure Under the action, it returns to the original position, squeezed by the sealing structure 405, the first chamber is compressed, the pressure-bearing part 406 moves upward, the compression structure 407 restores its original volume, and at the same time absorbs the previously released cooling liquid 408, making the liquid cooling channel The coolant 408 at 4024 is sucked into the compression structure 407 again.

本具体实施例中,进一步在下盖403的柱状结构4033设置连通通道,在具体使用的过程中,可有效增加冷却液408与下盖403的接触面积,进一步提高散热效果。In this specific embodiment, a communication channel is further provided in the columnar structure 4033 of the lower cover 403 , which can effectively increase the contact area between the cooling liquid 408 and the lower cover 403 during specific use, and further improve the heat dissipation effect.

在一具体实施例中,下盖403的底板背离散热主体402的一侧设置有导热层,用于实现下盖403与发热元件之间的热传递,提高散热效果。In a specific embodiment, the side of the bottom plate of the lower cover 403 facing away from the heat dissipation body 402 is provided with a heat conduction layer for realizing heat transfer between the lower cover 403 and the heating element and improving the heat dissipation effect.

具体的,可以将导热层为散热硅脂层4032。Specifically, the heat conduction layer can be a heat dissipation silicone grease layer 4032 .

发热元件的热量经导热层传递至下盖403及散热主体402的散热鳍片4022,由于冷却液408的比热容较大,可以短时间内吸收大量热量并气动生化,提高散热效率。The heat of the heating element is transferred to the lower cover 403 and the heat dissipation fins 4022 of the heat dissipation body 402 through the heat conduction layer. Due to the large specific heat capacity of the coolant 408, it can absorb a large amount of heat in a short time and aerodynamically biochemically improve the heat dissipation efficiency.

在上述实施例的基础上,可以使第一通孔4025的数量为多个,且多个第一通孔4025的轴向均与第二通孔4026的轴向平行,多个第一通孔4025环绕并间隔设置于第二通孔4026的外周。On the basis of the above-mentioned embodiments, the number of the first through holes 4025 can be multiple, and the axial directions of the plurality of first through holes 4025 are all parallel to the axial directions of the second through holes 4026, and the plurality of first through holes 4025 4025 are arranged around and spaced apart from the outer periphery of the second through hole 4026 .

如图5所示,散热主体402的中心设置有第二通孔4026,第二通孔4026的外周环绕且沿周向间隔设置有若干第一通孔4025,第一通孔4025的轴向与第二通孔4026的轴向平行,由于散热主体402的外周设置有散热鳍片4022,因此,没有将第一通孔4025设置为环状结构,而是将第一通孔4025设置为横截面为扇形的通孔,当然,第一通孔4025的横截面还可以是其它形状,具体根据实际情况确定,在此不做赘述。As shown in Figure 5, the center of the heat dissipation body 402 is provided with a second through hole 4026, and the outer circumference of the second through hole 4026 is surrounded and provided with a plurality of first through holes 4025 at intervals along the circumferential direction. The axial direction of the second through hole 4026 is parallel. Since the outer periphery of the heat dissipation body 402 is provided with heat dissipation fins 4022, the first through hole 4025 is not arranged as a ring structure, but the first through hole 4025 is arranged as a cross section It is a fan-shaped through hole. Of course, the cross section of the first through hole 4025 can also be in other shapes, which are determined according to actual conditions, and will not be described here.

进一步,可以在下盖403设置环状密封槽4031,散热主体402设置有与环状密封槽4031配合的密封凸部,密封凸部位于第二通孔4026的外侧;下盖403的环状密封槽4031与散热主体402的密封凸部螺纹密封连接或粘接密封连接,以避免冷却液408漏液。Further, the lower cover 403 can be provided with an annular sealing groove 4031, and the heat dissipation body 402 is provided with a sealing convex portion matched with the annular sealing groove 4031, and the sealing convex portion is located outside the second through hole 4026; the annular sealing groove of the lower cover 403 4031 is threaded or adhesively sealed with the sealing convex part of the heat dissipation body 402 to avoid leakage of the cooling liquid 408 .

具体的,可以将液冷通道4024设置为多个连通第一通孔4025与第二通孔4026的通槽,且液冷通道4024设置于散热主体402朝向下盖403的端面。Specifically, the liquid cooling channel 4024 can be arranged as a plurality of through grooves communicating with the first through hole 4025 and the second through hole 4026 , and the liquid cooling channel 4024 is arranged on the end surface of the heat dissipation body 402 facing the lower cover 403 .

如图5所示,液冷通道4024沿散热主体402的径向设置,并连通第一通孔4025和第二通孔4026。As shown in FIG. 5 , the liquid cooling channel 4024 is arranged along the radial direction of the heat dissipation body 402 and communicates with the first through hole 4025 and the second through hole 4026 .

在具体使用的过程中,承压件406没有因风扇组件1吹出的气流压力而移动时,冷却液408被吸收于压缩结构407内且不释放,液冷通道4024及连通通道内均没有冷却液408;当承压件406在风扇组件1吹出的气流压力下向下移动挤压第一腔室时,压缩结构407被挤压释放冷却液408,使冷却液408由第一通孔4025流出至液冷通道4024内,流出的冷却液408受热升华,使第一腔室的气压增加,承压件406继续向下挤压第一腔室,压缩结构407继续释放冷却液408,流经液冷通道4024的冷却液408继续流动至环状腔室,流至环状腔室内的冷却液408与散热主体402及下盖403的柱状结构4033进行热交换,实现液冷散热。During specific use, when the pressure-bearing member 406 does not move due to the pressure of the airflow blown out by the fan assembly 1, the cooling liquid 408 is absorbed in the compression structure 407 and does not release, and there is no cooling liquid in the liquid cooling channel 4024 and the communication channel 408; when the pressure-bearing member 406 moves downward under the pressure of the airflow blown out by the fan assembly 1 to squeeze the first chamber, the compression structure 407 is squeezed to release the cooling liquid 408, so that the cooling liquid 408 flows out from the first through hole 4025 to In the liquid cooling channel 4024, the outflowing cooling liquid 408 is heated and sublimated, increasing the air pressure of the first chamber, the pressure bearing part 406 continues to squeeze the first chamber downward, and the compression structure 407 continues to release the cooling liquid 408, which flows through the liquid cooling channel 4024. The cooling liquid 408 in the channel 4024 continues to flow into the annular chamber, and the cooling liquid 408 flowing into the annular chamber performs heat exchange with the heat dissipation body 402 and the columnar structure 4033 of the lower cover 403 to realize liquid cooling and heat dissipation.

本具体实施例中,冷却液408由第一通道流出后,由于下盖403与散热主体402之间通过环状密封槽4031与密封凸部实现密封,可避免冷却液408漏液,使冷却液408向液冷通道4024流动。In this specific embodiment, after the cooling liquid 408 flows out from the first channel, since the sealing between the lower cover 403 and the heat dissipation body 402 is realized through the annular sealing groove 4031 and the sealing convex part, the leakage of the cooling liquid 408 can be avoided, so that the cooling liquid 408 flows to the liquid cooling channel 4024 .

在一具体实施例中,上盖401扣设于散热主体402的上端面、并将第二通孔4026完全覆盖,出气孔设置于上盖401。In a specific embodiment, the upper cover 401 is buckled on the upper surface of the heat dissipation body 402 and completely covers the second through hole 4026 , and the air outlet is provided on the upper cover 401 .

在具体使用的过程中,当承压件406在风扇组件1吹出的气流压力下向下移动挤压第一腔室时,压缩结构407被挤压释放冷却液408,使冷却液408流出至液冷通道4024内,冷却液408受热气化,气化后的冷却液408使第一腔室的气压增加,推动密封结构405向挤压第二腔室的方向移动,第二腔室上部的上盖401设置有出气孔,第二腔室内的气体经出气孔排出;当发热元件散热效率降低,风扇组件1停止吹风或风扇组件1的转速不足以使承压件406移动时,气化的冷却液408受冷液化、并积聚于液冷通道4024,密封结构405在气压或外界压力作用下,复位至原来位置,受密封结构405的挤压,第一腔室压缩、承压件406向上移动,压缩结构407恢复原来的体积,同时吸收之前释放的冷却液408,使液冷通道4024的冷却液408再次被吸入压缩结构407内。During specific use, when the pressure-bearing member 406 moves downward under the pressure of the airflow blown out by the fan assembly 1 to squeeze the first chamber, the compression structure 407 is squeezed to release the cooling liquid 408, so that the cooling liquid 408 flows out to the liquid In the cold channel 4024, the cooling liquid 408 is heated and vaporized, and the gasified cooling liquid 408 increases the air pressure of the first chamber, pushing the sealing structure 405 to move in the direction of squeezing the second chamber, and the upper part of the second chamber The cover 401 is provided with an air outlet, and the gas in the second chamber is discharged through the air outlet; when the heat dissipation efficiency of the heating element is reduced, the fan assembly 1 stops blowing or the speed of the fan assembly 1 is not enough to move the pressure member 406, the cooling of the gasification The liquid 408 is liquefied by cooling and accumulates in the liquid cooling channel 4024, the sealing structure 405 is reset to its original position under the action of air pressure or external pressure, squeezed by the sealing structure 405, the first chamber is compressed, and the pressure bearing member 406 moves upward , the compression structure 407 restores its original volume, and at the same time absorbs the cooling liquid 408 released before, so that the cooling liquid 408 in the liquid cooling channel 4024 is sucked into the compression structure 407 again.

还可以在散热主体402的第二通孔4026的侧壁设置用于与外界连通的出气孔,当第二通孔4026的侧壁设置有出气孔时,第二通孔4026可以不完全将散热主体402贯穿,当然,出气孔还可以设置于其它位置,具体根据实际情况确定,在此不做赘述。An air outlet for communicating with the outside world can also be provided on the side wall of the second through hole 4026 of the heat dissipation body 402. When the side wall of the second through hole 4026 is provided with an air outlet, the second through hole 4026 can not completely dissipate heat. The main body 402 runs through it. Of course, the air outlet can also be set at other positions, which are determined according to actual conditions, and will not be described in detail here.

为了避免外界杂质经出气孔进入第二腔室,可以设置多个尺寸较小的出气孔,或在上盖401内设置过滤网。In order to prevent external impurities from entering the second chamber through the air outlets, multiple air outlets with smaller sizes may be provided, or a filter screen may be provided in the upper cover 401 .

本申请文件中的水冷辅助散热装置如图1所示包括风扇组件1、散热器组件4、弹簧螺丝2、固定螺丝3以及主板支架5,在具体安装的过程中,散热主体402的周向均布有散热鳍片4022,风扇组件1强风场的主风量可加强散热鳍片4022四周空气对流,散热鳍片4022的四周合适位置预留螺纹孔,固定螺丝3用于连接风扇组件1与散热器组件4,弹簧螺丝2用于将散热器组件4连接至主板支架5。The water-cooled auxiliary heat dissipation device in this application document includes a fan assembly 1, a heat sink assembly 4, a spring screw 2, a fixing screw 3, and a main board bracket 5 as shown in FIG. Cooling fins 4022, the main air volume of the fan assembly 1 strong wind field can enhance the air convection around the cooling fins 4022, threaded holes are reserved around the cooling fins 4022, and the fixing screws 3 are used to connect the fan assembly 1 and the radiator assembly 4 , the spring screw 2 is used to connect the radiator assembly 4 to the motherboard bracket 5 .

具体的,如图2、图4所示,风扇组件1包括风扇框101和设置于风扇框101的风扇主体102,风扇主体102包括若干扇叶1021,由扇叶1021向散热器组件4的投影将散热器组件4完全覆盖,如图4所示,由扇叶1021吹出的气体垂直吹向散热主体402,以最大可能增加吹风强度,避免能量损失。Specifically, as shown in FIGS. 2 and 4 , the fan assembly 1 includes a fan frame 101 and a fan main body 102 disposed on the fan frame 101. The fan main body 102 includes a plurality of fan blades 1021, and the projection of the fan blades 1021 to the radiator assembly 4 The radiator assembly 4 is completely covered, as shown in FIG. 4 , the gas blown by the fan blades 1021 is blown vertically to the heat dissipation body 402 to increase the blowing intensity as much as possible and avoid energy loss.

在一具体实施例中,散热主体中第一通孔的内侧壁凸出设置有导向槽,导向槽沿平行于第一通孔的轴向方向延伸,导向槽的一端贯穿散热主体的上端面,且导向槽的延伸长度小于散热主体的上端面与下端面之间的距离;In a specific embodiment, a guide groove protrudes from the inner side wall of the first through hole in the heat dissipation body, the guide groove extends parallel to the axial direction of the first through hole, and one end of the guide groove penetrates through the upper end surface of the heat dissipation body. And the extension length of the guide groove is less than the distance between the upper end surface and the lower end surface of the heat dissipation body;

承压件设置有与导向槽配合的导向凸部4061、并相对于导向槽可移动。The pressure-bearing member is provided with a guide protrusion 4061 that cooperates with the guide groove and is movable relative to the guide groove.

如图5所示,导向槽4023设置于第一通孔4025内,可用于限制承压件406的移动方向。具体的,如图8所示,可以将导向槽4023设置为长条状凹槽,如图9所示,承压件406为的侧面设置有用于与导向槽4023配合的导向凸部4061,承压件406相对于导向槽4023移动的过程中,导向凸部4061沿导向槽4023滑动。As shown in FIG. 5 , the guide groove 4023 is disposed in the first through hole 4025 and can be used to limit the moving direction of the pressure bearing member 406 . Specifically, as shown in Figure 8, the guide groove 4023 can be set as a strip-shaped groove. During the movement of the pressing member 406 relative to the guide groove 4023 , the guide protrusion 4061 slides along the guide groove 4023 .

如图3所示,第一通孔4025朝向风扇组件1的一端设置有导风槽4021,导风槽4021的开口尺寸大于第一通孔4025的横截面尺寸,如图4所示,风扇组件1吹出的气体吹向散热主体402,大部分气体流经散热鳍片4022,以加快散热鳍片4022外周气体流动,少部分气体吹向导风槽4021,并对承压件406施加压力,以使承压件406向下移动。As shown in Figure 3, the first through hole 4025 is provided with an air guiding groove 4021 towards one end of the fan assembly 1, and the opening size of the air guiding groove 4021 is larger than the cross-sectional size of the first through hole 4025, as shown in Figure 4, the fan assembly 1 The air blown out is blown to the heat dissipation main body 402, most of the gas flows through the heat dissipation fins 4022 to speed up the gas flow around the heat dissipation fins 4022, and a small part of the gas is blown to the air guide groove 4021, and exerts pressure on the pressure bearing 406 so that The pressure receiving member 406 moves downward.

导风槽4021的设置可以对气流进行导向,使气体能够吹向承压件406。The setting of the air guide groove 4021 can guide the air flow, so that the air can blow to the pressure bearing member 406 .

在使用本申请提供的如图1-图7所示的水冷辅助散热装置的过程中,当发热元件高负载运行状时,风扇组件1向下强风场的冗余风量通过导风槽4021向下施加下风压,驱动散热主体402外腔内的承压件406向下移动,挤压吸收有冷却液408的耐高温的吸湿海绵,冷却液408被挤出并在散热主体402下方的液冷通道4024内积聚,流动至散热主体402的第二通孔4026与下盖403的柱状结构4033之间的环状腔室,发热元件散发的热量经散热硅脂层4032热传导至下盖403的柱状结构4033,因冷却液408的比热容较大,可以短时内吸收大量热量并气化升华,提高水冷辅助散热装置的散热效率。冷却液408气化以及密闭的第一腔室被挤压,导致密封结构405向上移动,并推动弹簧压缩储能。当发热元件发热量降低时,气化的冷却液408因温降而液化流回并积聚至液冷通道4024,此时风扇组件1因转速降低,向下风场的冗余风量不足以驱动承压件406继续下行,弹簧压缩储能被释放,密封结构405下行挤压第一腔室,推动液冷通道4024内的积聚的冷却液408回吸至耐高温的吸湿海绵,吸湿海绵恢复形状并推动承压件406沿导向槽4023复位到顶部。如此往复循环,可实现利用风扇的冗余风量进行积水式辅助散热,提高散热装置散热效率。另外,发热元件常规状态时,冷却液408被吸收在耐高温的吸湿海绵内。针对散热装置的漏液问题,本申请提供的水冷辅助散热装置中使用吸湿海绵吸收冷却液408,所吸收的冷却液远少于纯液冷散热装置内的冷却液408,并且吸湿海绵具有吸收冷却液408的作用,在发热元件高效运行时,冷却液408的挤出量远小于液冷散热器,所以不存在漏液风险。During the process of using the water-cooled auxiliary heat dissipation device shown in Figures 1-7 provided by this application, when the heating element is operating under high load, the redundant air volume of the fan assembly 1 downward strong wind field passes through the air guide groove 4021 downward Apply downwind pressure to drive the pressure-bearing part 406 in the outer cavity of the heat dissipation body 402 to move downwards, squeeze the high temperature resistant moisture-absorbing sponge that absorbs the cooling liquid 408, and the cooling liquid 408 is squeezed out and enters the liquid cooling channel under the heat dissipation body 402 Accumulate in 4024 and flow to the annular chamber between the second through hole 4026 of the heat dissipation body 402 and the columnar structure 4033 of the lower cover 403, the heat emitted by the heating element is thermally conducted to the columnar structure of the lower cover 403 through the heat dissipation silicone grease layer 4032 4033, due to the large specific heat capacity of the coolant 408, it can absorb a large amount of heat in a short time and be vaporized and sublimated to improve the heat dissipation efficiency of the water-cooled auxiliary heat dissipation device. The cooling liquid 408 vaporizes and the sealed first chamber is squeezed, causing the sealing structure 405 to move upwards and pushing the spring to compress and store energy. When the calorific value of the heating element decreases, the vaporized coolant 408 liquefies and flows back to the liquid cooling channel 4024 due to the temperature drop. At this time, the fan assembly 1 is reduced in speed, and the redundant air volume of the downwind field is not enough to drive the pressure. The member 406 continues to descend, the compressed spring energy is released, the sealing structure 405 squeezes the first chamber downward, and pushes the accumulated cooling liquid 408 in the liquid cooling channel 4024 to suck back to the high temperature resistant hygroscopic sponge, and the hygroscopic sponge recovers its shape and pushes The pressure bearing member 406 resets to the top along the guide groove 4023 . Such a reciprocating cycle can realize the use of the redundant air volume of the fan to carry out water-accumulated auxiliary heat dissipation, and improve the heat dissipation efficiency of the heat dissipation device. In addition, when the heating element is in a normal state, the cooling liquid 408 is absorbed in the high temperature resistant hygroscopic sponge. Aiming at the liquid leakage problem of the cooling device, the water-cooling auxiliary cooling device provided by the application uses a hygroscopic sponge to absorb the cooling liquid 408, and the absorbed cooling liquid is far less than the cooling liquid 408 in the pure liquid cooling cooling device, and the hygroscopic sponge has the ability to absorb cooling The effect of the liquid 408 is that when the heating element is running efficiently, the extrusion amount of the cooling liquid 408 is much smaller than that of the liquid cooling radiator, so there is no risk of liquid leakage.

本发明提供的水冷辅助散热装置利用风扇组件1的冗余风量,实现散热器组件4内部积水式水冷辅助散热,增加风扇组件1利用率,降低风扇转速高噪音,提高了散热装置的散热效率。The water-cooled auxiliary heat dissipation device provided by the present invention utilizes the redundant air volume of the fan assembly 1 to realize water-filled water-cooled auxiliary heat dissipation inside the radiator assembly 4, increase the utilization rate of the fan assembly 1, reduce the high noise of the fan speed, and improve the heat dissipation efficiency of the heat dissipation device. .

除了上述水冷辅助散热装置,本发明还提供一种包括上述实施例公开的水冷辅助散热装置的存储设备,该存储设备的其他各部分的结构请参考现有技术,本文不再赘述。In addition to the above-mentioned auxiliary water-cooling heat dissipation device, the present invention also provides a storage device including the auxiliary water-cooling heat dissipation device disclosed in the above embodiments. For the structure of other parts of the storage device, please refer to the prior art, which will not be repeated here.

在一具体实施例中,该存储设备包括存储单元以及水冷辅助散热装置,存储单元在使用的过程中会散发热量,当存储单元高负载运行状时,风扇组件1向下强风场的冗余风量驱动散热主体402外腔内的承压件406向下移动,挤压吸收有冷却液408的耐高温的压缩结构407,冷却液408被挤出并在散热主体402下方的液冷通道4024内积聚,存储单元散发的热量传导至下盖403,因冷却液408的比热容较大,可以短时内吸收大量热量并气化升华,提高水冷辅助散热装置的散热效率。冷却液408气化以及密闭的第一腔室被挤压,导致密封结构405向挤压第二腔室的方向移动,并推动弹簧压缩储能。当存储单元发热量降低时,气化的冷却液408因温降而液化流回并积聚至液冷通道4024,此时风扇组件1因转速降低,向下风场的冗余风量不足以驱动承压件406继续下行,弹簧压缩储能被释放,密封结构405下行挤压第一腔室,推动液冷通道4024内的积聚的冷却液408回吸至耐高温的压缩结构407,压缩结构407恢复形状并推动承压件406复位到顶部。如此往复循环,可实现利用风扇的冗余风量进行积水式辅助散热,提高散热装置散热效率。另外,存储单元常规工作状态时,冷却液408被吸收在耐高温的压缩结构407内。而存储单元高效运行时,冷却液408的挤出量远小于液冷散热器,所以不存在漏液风险。In a specific embodiment, the storage device includes a storage unit and a water-cooled auxiliary heat dissipation device. The storage unit will dissipate heat during use. When the storage unit is running at a high load, the fan assembly 1 will force the redundant air volume of the wind field downward. Drive the pressure-bearing part 406 in the outer cavity of the heat dissipation body 402 to move downward, squeeze the high-temperature-resistant compression structure 407 that absorbs the cooling liquid 408, and the cooling liquid 408 is extruded and accumulated in the liquid cooling channel 4024 below the heat dissipation body 402 , the heat dissipated by the storage unit is transferred to the lower cover 403, because the coolant 408 has a large specific heat capacity, it can absorb a large amount of heat in a short time and be vaporized and sublimated, thereby improving the heat dissipation efficiency of the water-cooled auxiliary heat dissipation device. The cooling liquid 408 is vaporized and the sealed first chamber is squeezed, causing the sealing structure 405 to move in the direction of squeezing the second chamber, and pushing the spring to compress and store energy. When the calorific value of the storage unit decreases, the vaporized coolant 408 liquefies and flows back to the liquid cooling channel 4024 due to the temperature drop. At this time, due to the reduction in the speed of the fan assembly 1, the redundant air volume of the downwind field is not enough to drive the pressure The member 406 continues to descend, the compressed spring energy is released, the sealing structure 405 descends and squeezes the first chamber, pushing the accumulated coolant 408 in the liquid cooling channel 4024 back to the high temperature resistant compression structure 407, and the compression structure 407 recovers its shape And push the pressure bearing part 406 to reset to the top. Such a reciprocating cycle can realize the use of the redundant air volume of the fan to carry out water-accumulated auxiliary heat dissipation, and improve the heat dissipation efficiency of the heat dissipation device. In addition, when the storage unit is in a normal working state, the cooling liquid 408 is absorbed in the high temperature resistant compression structure 407 . When the storage unit operates efficiently, the amount of cooling liquid 408 squeezed out is much smaller than that of the liquid cooling radiator, so there is no risk of liquid leakage.

此外,本发明还提供了一种服务器,该服务器包括上述任一具体实施例提到的水冷辅助散热装置。In addition, the present invention also provides a server, which includes the water-cooling auxiliary heat dissipation device mentioned in any one of the above specific embodiments.

在一具体实施例中,服务器包括存储单元、运算单元等发热元件,在具体使用的过程中,当发热元件高负载运行状时,风扇组件1向下强风场的冗余风量通过导风槽4021向下施加下风压,驱动散热主体402外腔内的承压件406向下移动,挤压吸收有冷却液408的耐高温的压缩结构407,冷却液408被挤出并在散热主体402下方的液冷通道4024内积聚,流动至散热主体402的第二通孔4026与下盖403的柱状结构4033之间的环状腔室,发热元件散发的热量经散热硅脂层4032热传导至下盖403的柱状结构4033,因冷却液408的比热容较大,可以短时内吸收大量热量并气化升华,提高水冷辅助散热装置的散热效率。冷却液408气化以及密闭的第一腔室被挤压,导致密封结构405向上移动,并推动弹簧压缩储能。当发热元件发热量降低时,气化的冷却液408因温降而液化流回并积聚至液冷通道4024,此时风扇组件1因转速降低,向下风场的冗余风量不足以驱动承压件406继续下行,弹簧压缩储能被释放,密封结构405下行挤压第一腔室,推动液冷通道4024内的积聚的冷却液408回吸至耐高温的压缩结构407,压缩结构407恢复形状并推动承压件406沿导向槽4023复位到顶部。如此往复循环,可实现利用风扇的冗余风量进行积水式辅助散热,提高散热装置散热效率。另外,发热元件常规状态时,冷却液408被吸收在耐高温的压缩结构407内。而发热元件高效运行时,冷却液408的挤出量远小于液冷散热器,所以不存在漏液风险。In a specific embodiment, the server includes heat-generating elements such as a storage unit and a computing unit. During specific use, when the heat-generating element is operating under high load, the redundant air volume of the fan assembly 1 is forced downward to the wind field through the air guide slot 4021 Apply downward wind pressure to drive the pressure-bearing member 406 in the outer cavity of the heat dissipation body 402 to move downward, squeezing the high-temperature-resistant compression structure 407 that absorbs the cooling liquid 408, and the cooling liquid 408 is squeezed out and flows under the heat dissipation body 402. Accumulate in the liquid cooling channel 4024 and flow to the annular chamber between the second through hole 4026 of the heat dissipation body 402 and the columnar structure 4033 of the lower cover 403, and the heat emitted by the heating element is thermally conducted to the lower cover 403 through the heat dissipation silicone grease layer 4032 The columnar structure 4033 of the coolant 408 can absorb a large amount of heat in a short time and be vaporized and sublimated due to the large specific heat capacity of the coolant 408, thereby improving the heat dissipation efficiency of the water-cooled auxiliary heat dissipation device. The cooling liquid 408 vaporizes and the sealed first chamber is squeezed, causing the sealing structure 405 to move upwards and pushing the spring to compress and store energy. When the calorific value of the heating element decreases, the vaporized coolant 408 liquefies and flows back to the liquid cooling channel 4024 due to the temperature drop. At this time, the fan assembly 1 is reduced in speed, and the redundant air volume of the downwind field is not enough to drive the pressure. The member 406 continues to descend, the compressed spring energy is released, the sealing structure 405 descends and squeezes the first chamber, pushing the accumulated coolant 408 in the liquid cooling channel 4024 back to the high temperature resistant compression structure 407, and the compression structure 407 recovers its shape And push the pressure bearing member 406 to return to the top along the guide groove 4023 . Such a reciprocating cycle can realize the use of the redundant air volume of the fan to carry out water-accumulated auxiliary heat dissipation, and improve the heat dissipation efficiency of the heat dissipation device. In addition, when the heating element is in a normal state, the cooling liquid 408 is absorbed in the high temperature resistant compression structure 407 . When the heating element is running efficiently, the extrusion amount of the cooling liquid 408 is much smaller than that of the liquid cooling radiator, so there is no risk of liquid leakage.

在本具体实施例中,由于服务器内的发热元件较多,可以设置多个上述任一具体实施例提到的水冷辅助散热装置,并在发热元件设置温度感应结构,用于根据检测发热元件的温度,并通过控制器根据发热元件的温度调整对应风扇组件1的转速。In this specific embodiment, since there are many heating elements in the server, a plurality of water-cooled auxiliary heat dissipation devices mentioned in any of the above specific embodiments can be provided, and a temperature sensing structure is provided on the heating elements to detect the temperature of the heating elements. temperature, and adjust the rotation speed of the corresponding fan assembly 1 through the controller according to the temperature of the heating element.

此外,本发明还提供了一种计算机,该计算机包括上述任一具体实施例提到的水冷辅助散热装置。In addition, the present invention also provides a computer, which includes the water-cooling auxiliary heat dissipation device mentioned in any of the above specific embodiments.

在一具体实施例中,计算机包括服务器、显示器的结构,在具体使用的过程中,当计算机高负载运行状时,风扇组件1向下强风场的冗余风量通过导风槽4021向下施加下风压,驱动散热主体402外腔内的承压件406向下移动,挤压吸收有冷却液408的耐高温的压缩结构407,冷却液408被挤出并在散热主体402下方的液冷通道4024内积聚,流动至散热主体402的第二通孔4026与下盖403的柱状结构4033之间的环状腔室,发热元件散发的热量经散热硅脂层4032热传导至下盖403的柱状结构4033,因冷却液408的比热容较大,可以短时内吸收大量热量并气化升华,提高水冷辅助散热装置的散热效率。冷却液408气化以及密闭的第一腔室被挤压,导致密封结构405向上移动,并推动弹簧压缩储能。当计算机发热量降低时,气化的冷却液408因温降而液化流回并积聚至液冷通道4024,此时风扇组件1因转速降低,向下风场的冗余风量不足以驱动承压件406继续下行,弹簧压缩储能被释放,密封结构405下行挤压第一腔室,推动液冷通道4024内的积聚的冷却液408回吸至耐高温的压缩结构407,压缩结构407恢复形状并推动承压件406沿导向槽4023复位到顶部。如此往复循环,可实现利用风扇的冗余风量进行积水式辅助散热,提高散热装置散热效率。另外,发热元件常规状态时,冷却液408被吸收在耐高温的压缩结构407内。而发热元件高效运行时,冷却液408的挤出量远小于液冷散热器,所以不存在漏液风险。In a specific embodiment, the computer includes a structure of a server and a display. In a specific use process, when the computer is running under a high load, the redundant air volume of the fan assembly 1 is forced downward through the wind guide slot 4021 to apply the downwind downward. pressure, driving the pressure bearing 406 in the outer cavity of the heat dissipation main body 402 to move downward, squeezing the high temperature resistant compression structure 407 that absorbs the cooling liquid 408, and the cooling liquid 408 is squeezed out and enters the liquid cooling channel 4024 under the heat dissipation main body 402 Accumulated inside, flows to the annular chamber between the second through hole 4026 of the heat dissipation body 402 and the columnar structure 4033 of the lower cover 403, the heat emitted by the heating element is thermally conducted to the columnar structure 4033 of the lower cover 403 through the heat dissipation silicone grease layer 4032 , because the specific heat capacity of the coolant 408 is large, it can absorb a large amount of heat in a short time and be vaporized and sublimated to improve the heat dissipation efficiency of the water-cooled auxiliary heat dissipation device. The cooling liquid 408 vaporizes and the sealed first chamber is squeezed, causing the sealing structure 405 to move upwards and pushing the spring to compress and store energy. When the calorific value of the computer decreases, the vaporized coolant 408 liquefies and flows back to the liquid cooling channel 4024 due to the temperature drop. At this time, the fan assembly 1 reduces the speed and the redundant air volume of the downwind field is not enough to drive the pressure-bearing parts. 406 continues to descend, the compressed energy storage of the spring is released, the sealing structure 405 presses the first chamber downward, and pushes the accumulated cooling liquid 408 in the liquid cooling channel 4024 to suck back to the high temperature resistant compression structure 407, and the compression structure 407 recovers its shape and Push the pressure bearing member 406 to return to the top along the guide groove 4023 . Such a reciprocating cycle can realize the use of the redundant air volume of the fan to carry out water-accumulated auxiliary heat dissipation, and improve the heat dissipation efficiency of the heat dissipation device. In addition, when the heating element is in a normal state, the cooling liquid 408 is absorbed in the high temperature resistant compression structure 407 . When the heating element is running efficiently, the extrusion amount of the cooling liquid 408 is much smaller than that of the liquid cooling radiator, so there is no risk of liquid leakage.

本申请文件中提到的第一通孔4025和第二通孔4026,第一腔室和第二腔室中的“第一”、“第二”仅仅是为了区分位置的不同,并没有先后顺序之分。The first through hole 4025 and the second through hole 4026 mentioned in this application document, the "first" and "second" in the first chamber and the second chamber are only to distinguish the difference in position, and there is no sequence sequence.

本说明书中各个实施例采用递进的方式描述,每个实施例重点说明的都是与其他实施例的不同之处,各个实施例之间相同相似部分互相参见即可。本发明所提供的所有实施例的任意组合方式均在此发明的保护范围内,在此不做赘述。Each embodiment in this specification is described in a progressive manner, each embodiment focuses on the difference from other embodiments, and the same and similar parts of each embodiment can be referred to each other. Any combination of all the embodiments provided by the present invention is within the protection scope of the present invention, and will not be repeated here.

以上对本发明所提供的水冷辅助散热装置、存储设备、服务器及计算机进行了详细介绍。本文中应用了具体个例对本发明的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本发明的方法及其核心思想。应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以对本发明进行若干改进和修饰,这些改进和修饰也落入本发明权利要求的保护范围内。The water-cooled auxiliary heat dissipation device, storage device, server and computer provided by the present invention have been introduced in detail above. In this paper, specific examples are used to illustrate the principle and implementation of the present invention, and the descriptions of the above embodiments are only used to help understand the method and core idea of the present invention. It should be pointed out that for those skilled in the art, without departing from the principle of the present invention, some improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims (19)

1. A water-cooled auxiliary heat sink, comprising:
A fan assembly (1) for blowing air towards the heat sink assembly (4);
the radiator assembly (4) is arranged on one side of the fan assembly (1), the radiator assembly (4) comprises an upper cover (401), a radiating main body (402) and a lower cover (403), and the radiating main body (402) is provided with radiating fins (4022) and first through holes (4025) penetrating through the radiating fins in the axial direction; a liquid cooling channel (4024) is formed between the lower cover (403) and the radiating main body (402), and the liquid cooling channel (4024) is communicated with the first through hole (4025) to form a liquid cooling chamber; a movable sealing structure (405) is arranged in the liquid cooling cavity, the liquid cooling cavity is divided into a first cavity and a second cavity by the sealing structure (405), cooling liquid (408) is contained in the first cavity and is sealed, and a movable bearing piece (406) is arranged on the surface of the first cavity facing the fan assembly (1); the second chamber is provided with an air outlet hole communicated with the outside;
when the fan assembly (1) blows air to the pressure-bearing member (406), the pressure-bearing member (406) compresses the first chamber under the action of air pressure, the sealing structure (405) moves towards the direction of extruding the second chamber, and the cooling liquid (408) in the first chamber flows into the liquid cooling channel (4024);
The device further comprises an elastic piece (404) for providing power for resetting of the sealing structure (405), one end of the elastic piece (404) is abutted to the sealing structure (405), and the other end of the elastic piece is abutted to the upper cover (401).
2. The water-cooled auxiliary heat sink device according to claim 1, wherein a compression structure (407) capable of absorbing or releasing the cooling liquid (408) is disposed in the first through hole (4025), when the pressure-bearing member (406) compresses the first chamber under the action of the air pressure, the compression structure (407) is compressed to release the cooling liquid (408), and when the pressure-bearing member (406) is reset, the compression structure (407) recovers and absorbs the cooling liquid (408).
3. The water-cooled auxiliary heat sink device according to claim 2, wherein the compression structure (407) is a hygroscopic sponge.
4. The water-cooling auxiliary heat sink according to claim 1, wherein the lower cover (403) comprises a bottom plate and a columnar structure (4033) protruding from the bottom plate, the heat sink main body (402) is provided with a second through hole (4026), the columnar structure (4033) extends into the second through hole (4026), and an annular chamber is formed between an outer wall surface of the columnar structure (4033) and an inner wall surface of the second through hole (4026);
The sealing structure (405) is movably sleeved on the periphery of the columnar structure (4033) along the axial direction of the columnar structure (4033), and divides the annular chamber into two independent parts, wherein one part is the second chamber, and the other part forms the first chamber with the liquid cooling channel (4024) and the first through hole (4025).
5. The water-cooled auxiliary heat sink as recited in claim 4 wherein the elastic member (404) is a spring, and the spring is sleeved on the columnar structure (4033).
6. The water-cooled auxiliary heat sink as recited in claim 4, wherein the columnar structure (4033) is provided with a limit protrusion (4034) for limiting a moving distance of the sealing structure (405), and the limit protrusion (4034) is convexly disposed on an outer peripheral side surface of the columnar structure (4033).
7. The water-cooled auxiliary heat sink of claim 4 wherein a side of the base plate facing away from the heat sink body (402) is provided with a thermally conductive layer.
8. The water-cooled auxiliary heat sink of claim 7 wherein the thermally conductive layer is a heat dissipating silicone grease layer (4032).
9. The water-cooled auxiliary heat sink as recited in claim 4, wherein the upper cover (401) is fastened to an upper end surface of the heat sink main body (402) and covers the second through holes (4026) completely, and the air outlet holes are provided in the upper cover (401).
10. The water-cooled auxiliary heat sink according to any one of claims 1-9, characterized in that an end of the first through hole (4025) facing the fan assembly (1) is provided with an air guiding groove (4021), and an opening size of the air guiding groove (4021) is larger than a cross-sectional size of the first through hole (4025).
11. The water-cooled auxiliary heat sink according to any one of claims 4 to 9, wherein the number of the first through holes (4025) is plural, and the axial directions of the first through holes (4025) are parallel to the axial direction of the second through holes (4026), and the first through holes (4025) are circumferentially and alternately arranged on the outer periphery of the second through holes (4026).
12. The water-cooled auxiliary heat sink as recited in claim 11, wherein the lower cover (403) is provided with an annular seal groove (4031), and the heat sink main body (402) is provided with a seal protrusion that mates with the annular seal groove (4031), the seal protrusion being located outside the second through hole (4026).
13. The water-cooled auxiliary heat sink as recited in claim 12, wherein the annular seal groove (4031) of the lower cover (403) is in screw-sealing connection or adhesive-sealing connection with the seal protrusion of the heat sink main body (402).
14. The water-cooled auxiliary heat sink as recited in claim 11, wherein the liquid cooling channel (4024) includes a plurality of through grooves communicating the first through hole (4025) and the second through hole (4026), and the liquid cooling channel (4024) is disposed on an end surface of the heat sink main body (402) facing the lower cover (403).
15. The water-cooling auxiliary heat sink according to any one of claims 1-9, wherein the inner side wall of the first through hole (4025) in the heat sink main body (402) is provided with a guide groove (4023) protruding, the guide groove (4023) extends in an axial direction parallel to the first through hole (4025), one end of the guide groove (4023) penetrates through an upper end face of the heat sink main body (402), and an extending length of the guide groove (4023) is smaller than a distance between the upper end face and a lower end face of the heat sink main body (402);
the pressure receiving member (406) is provided with a guide projection (4061) that mates with the guide groove (4023), and is movable with respect to the guide groove (4023).
16. The water-cooled auxiliary heat sink according to any of claims 1-9, wherein the fan assembly (1) comprises a fan frame (101) and a fan body (102) arranged to the fan frame (101), the projection of the fan body (102) to the heat sink assembly (4) completely covering the heat sink assembly (4).
17. A storage device comprising the water-cooled auxiliary heat sink of any one of claims 1-16.
18. A server comprising the water-cooled auxiliary heat sink of any one of claims 1-16.
19. A computer comprising the water-cooled auxiliary heat sink of any one of claims 1-16.
CN202310521233.5A 2023-05-10 2023-05-10 Water-cooling auxiliary heat dissipation device, storage equipment, server and computer Active CN116301243B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2882208Y (en) * 2006-01-17 2007-03-21 台达电子工业股份有限公司 heat sink
CN102368170A (en) * 2011-08-23 2012-03-07 李佟梅 Magnesium alloy heat radiator
CN107885295A (en) * 2017-11-08 2018-04-06 北京图森未来科技有限公司 A kind of cooling system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2882208Y (en) * 2006-01-17 2007-03-21 台达电子工业股份有限公司 heat sink
CN102368170A (en) * 2011-08-23 2012-03-07 李佟梅 Magnesium alloy heat radiator
CN107885295A (en) * 2017-11-08 2018-04-06 北京图森未来科技有限公司 A kind of cooling system

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