CN116285720A - Low-temperature cured silica gel protective film - Google Patents
Low-temperature cured silica gel protective film Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2483/00—Presence of polysiloxane
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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- Y02E10/50—Photovoltaic [PV] energy
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Abstract
本发明公开了一种低温固化硅胶保护膜,包括依次设置的基材层、胶黏剂层和离型层,胶黏剂层由有机硅压敏胶黏剂烘烤固化获得,此有机硅压敏胶黏剂由以下组分在反应釜中搅拌得到:A组分100份、B组分80~120份、硅烷偶联剂1~1.8份、Pt催化剂1.5~2.2份、2‑甲基‑3‑丁炔‑2‑醇3~8份、稀释溶剂75~150份;所述A组分的组成为:乙烯基聚硅氧烷、含氢聚硅氧烷和3‑氯丙基三乙氧基硅烷,所述B组分的成分为:硅酸钠与氯三甲基硅烷和异丙醇的反应产物、含氢聚硅氧烷、四甲基二乙烯基二硅氧烷。本发明低温固化硅胶保护膜中有机硅压敏胶黏剂在50℃下固化时间降低到25分钟以下,提高了保护膜生产快速收卷效率。
The invention discloses a low-temperature curing silica gel protective film, which comprises a substrate layer, an adhesive layer and a release layer arranged in sequence. The adhesive layer is obtained by baking and curing a silicone pressure-sensitive adhesive. The sensitive adhesive is obtained by stirring the following components in a reactor: 100 parts of A component, 80~120 parts of B component, 1~1.8 parts of silane coupling agent, 1.5~2.2 parts of Pt catalyst, 2-methyl- 3-8 parts of 3-butyne-2-alcohol, 75-150 parts of dilution solvent; the composition of the A component is: vinyl polysiloxane, hydrogen-containing polysiloxane and 3-chloropropyl triethyl Oxysilane, the components of the B component are: the reaction product of sodium silicate, chlorotrimethylsilane and isopropanol, hydrogen-containing polysiloxane, and tetramethyldivinyldisiloxane. The curing time of the silicone pressure-sensitive adhesive in the low-temperature curing silicone protective film of the present invention is reduced to less than 25 minutes at 50° C., which improves the production and rapid winding efficiency of the protective film.
Description
技术领域technical field
本发明涉及硅胶保护膜技术领域,尤其涉及一种低温固化硅胶保护膜。The invention relates to the technical field of silica gel protective films, in particular to a low-temperature curing silica gel protective film.
背景技术Background technique
硅胶保护模是一款主要应用于保护电子产品的屏幕保护膜,现在主流的硅胶保护膜是PET硅胶屏幕保护膜,随着电子制造技术的飞速发展,很多制造过程都需要保护膜,例如:手机、电脑和各类屏幕显示器等。现有硅胶保护膜受限于胶黏剂层的固化时间,收卷时间较长,从而不利于改善生产效率。Silicone protective film is a screen protective film mainly used to protect electronic products. Now the mainstream silicone protective film is PET silicone screen protective film. With the rapid development of electronic manufacturing technology, many manufacturing processes require protective films, such as: mobile phones , computers and various screen monitors, etc. The existing silicone protective film is limited by the curing time of the adhesive layer, and the winding time is relatively long, which is not conducive to improving production efficiency.
发明内容Contents of the invention
本发明要解决的技术问题是提供一种低温固化硅胶保护膜,该低温固化硅胶保护膜中有机硅压敏胶黏剂在50℃下固化时间降低到25分钟以下,提高了保护膜生产快速收卷效率。The technical problem to be solved by the present invention is to provide a low-temperature curing silica gel protective film, the curing time of the silicone pressure-sensitive adhesive in the low-temperature curing silica gel protective film is reduced to less than 25 minutes at 50°C, which improves the rapid yield of the protective film production. volume efficiency.
为达到上述目的,本发明采用的技术方案是:一种低温固化硅胶保护膜,包括依次设置的基材层、胶黏剂层和离型层,所述胶黏剂层由有机硅压敏胶黏剂烘烤固化获得,此有机硅压敏胶黏剂由以下组分在反应釜中搅拌得到:In order to achieve the above object, the technical solution adopted in the present invention is: a low-temperature curing silicone protective film, including a substrate layer, an adhesive layer and a release layer arranged in sequence, and the adhesive layer is made of silicone pressure-sensitive adhesive The adhesive is baked and cured. This silicone pressure-sensitive adhesive is obtained by stirring the following components in a reactor:
A组分 100份,A component 100 parts,
B组分 80~120份,B component 80~120 parts,
硅烷偶联剂 1~1.8份,
Pt催化剂 1.5~2.2份,1.5~2.2 parts of Pt catalyst,
2-甲基-3-丁炔-2-醇 3~8份,2-methyl-3-butyn-2-
稀释溶剂 75~150份;Dilute solvent 75~150 parts;
所述A组分的组成为:乙烯基聚硅氧烷43~50份、含氢聚硅氧烷13~20份和3-氯丙基三乙氧基硅烷2~6份,The composition of the A component is: 43-50 parts of vinyl polysiloxane, 13-20 parts of hydrogen-containing polysiloxane and 2-6 parts of 3-chloropropyltriethoxysilane,
所述B组分的成分为:硅酸钠与氯三甲基硅烷和异丙醇的反应产物31~38份、含氢聚硅氧烷20~34份、四甲基二乙烯基二硅氧烷1~8份。The components of the B component are: 31-38 parts of the reaction product of sodium silicate, chlorotrimethylsilane and isopropanol, 20-34 parts of hydrogen-containing polysiloxane,
上述技术方案中进一步改进的技术方案如下:The technical scheme further improved in the above-mentioned technical scheme is as follows:
1、上述方案中,所述A组分25℃时粘度为10000~50000mpa.s,非挥发性物质含量为55%~65%。1. In the above scheme, the viscosity of the component A at 25°C is 10000-50000mpa.s, and the content of non-volatile substances is 55%-65%.
2、上述方案中,所述B组分25℃时粘度为5000~20000mpa.s,非挥发性物质含量为55%~65%。2. In the above scheme, the viscosity of component B at 25°C is 5000-20000mpa.s, and the content of non-volatile substances is 55%-65%.
3、上述方案中,所述Pt催化剂中铂含量为3000ppm-4000ppm;所述铂金催化剂为与甲基乙烯基硅氧烷配位的铂催化剂。3. In the above solution, the platinum content in the Pt catalyst is 3000ppm-4000ppm; the platinum catalyst is a platinum catalyst coordinated with methylvinylsiloxane.
4、上述方案中,所述Pt催化剂为利用含长链烷基和乙烯基的硅氧烷低聚物对卡尔斯特催化剂进行配位交换,配成铂-a,w-二(n-辛基)聚甲基乙烯基硅氧烷配合物的催化剂。4. In the above scheme, the Pt catalyst is the use of siloxane oligomers containing long-chain alkyl and vinyl groups to carry out coordination exchange on the Karst catalyst to form platinum-a,w-bis(n-octyl base) catalyst for polymethylvinylsiloxane complexes.
5、上述方案中,所述溶剂为甲苯、二甲苯、乙酸乙酯中的一种或多种混合。5. In the above scheme, the solvent is a mixture of one or more of toluene, xylene, and ethyl acetate.
6、上述方案中,所述硅烷偶联剂为r-缩水甘油醚氧丙基三甲氧基硅烷或者r-甲基丙烯酰氧基丙基三甲氧基硅烷。6. In the above solution, the silane coupling agent is r-glycidoxypropyltrimethoxysilane or r-methacryloxypropyltrimethoxysilane.
由于上述技术方案的运用,本发明与现有技术相比具有下列优点:Due to the application of the above-mentioned technical solution, the present invention has the following advantages compared with the prior art:
本发明低温固化硅胶保护膜,其基于2-甲基-3-丁炔-2-醇3~8份、双组份中A组分含有3-氯丙基三乙氧基硅烷,使得有机硅压敏胶黏剂在50℃下固化时间降低到25分钟以下,提高了保护膜生产快速收卷效率。The low-temperature curing silica gel protective film of the present invention is based on 3 to 8 parts of 2-methyl-3-butyn-2-ol, and the A component of the two-component contains 3-chloropropyltriethoxysilane, so that the silicone The curing time of the pressure-sensitive adhesive is reduced to less than 25 minutes at 50°C, which improves the efficiency of rapid winding in the production of protective films.
附图说明Description of drawings
附图1为本发明低温固化硅胶保护膜的结构示意图。Accompanying
以上附图中:1、基材层;2、胶黏剂层;3、离型层。In the above drawings: 1. Substrate layer; 2. Adhesive layer; 3. Release layer.
实施方式Implementation
在本发明的描述中,需要说明的是,术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制;术语“第一”、“第二”、“第三”仅用于描述目的,而不能理解为指示或暗示相对重要性;此外,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the illustrated orientation or positional relationship, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be configured in a specific orientation, and operations, and therefore cannot be construed as limiting the present invention; the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be construed as indicating or implying relative importance; in addition, unless otherwise expressly Provisions and limitations, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection ; It can be directly connected, or indirectly connected through an intermediary, and can be internally connected between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.
下面结合实施例对本发明作进一步描述:The present invention will be further described below in conjunction with embodiment:
实施例1~4:一种低温固化硅胶保护膜,包括依次设置的基材层、胶黏剂层和离型层,所述胶黏剂层由有机硅压敏胶黏剂烘烤固化获得,此有机硅压敏胶黏剂由以下组分在反应釜中搅拌得到,如表1所述:Embodiments 1-4: A low-temperature curing silicone protective film, including a substrate layer, an adhesive layer and a release layer arranged in sequence, the adhesive layer is obtained by baking and curing a silicone pressure-sensitive adhesive, This silicone pressure-sensitive adhesive is obtained by stirring the following components in a reaction kettle, as described in Table 1:
表1Table 1
;;
上述A组分的组成,如表2所述:The composition of above-mentioned A component, as described in table 2:
表2Table 2
;;
上述B组分的组成,如表3所述:The composition of above-mentioned B component, as described in table 3:
表3table 3
实施例1中A组分25℃时粘度为10000~50000mpa.s,非挥发性物质含量为55%~65%;B组分25℃时粘度为5000~20000mpa.s,非挥发性物质含量为55%~65%;Pt催化剂中铂含量为3000ppm~4000ppm;所述铂金催化剂为与甲基乙烯基硅氧烷配位的铂催化剂;溶剂为甲苯、二甲苯按照重量比1:1混合,上述硅烷偶联剂为r-缩水甘油醚氧丙基三甲氧基硅烷。In Example 1, the viscosity of component A at 25°C is 10000-50000mpa.s, and the content of non-volatile substances is 55%-65%; the viscosity of component B at 25°C is 5000-20000mpa.s, and the content of non-volatile substances is 55%~65%; the platinum content in the Pt catalyst is 3000ppm~4000ppm; the platinum catalyst is a platinum catalyst coordinated with methylvinylsiloxane; the solvent is toluene and xylene mixed in a weight ratio of 1:1, the above The silane coupling agent is r-glycidyl etheroxypropyltrimethoxysilane.
实施例2中A组分25℃时粘度为10000~50000mpa.s,非挥发性物质含量为55%~65%;B组分25℃时粘度为5000~20000mpa.s,非挥发性物质含量为55%~65%;Pt催化剂为利用含长链烷基和乙烯基的硅氧烷低聚物对卡尔斯特催化剂进行配位交换,配成铂-a,w-二(n-辛基)聚甲基乙烯基硅氧烷配合物的催化剂;上述溶剂为甲苯、乙酸乙酯按照重量比1:2混合,上述硅烷偶联剂为r-甲基丙烯酰氧基丙基三甲氧基硅烷。In Example 2, the viscosity of component A at 25°C is 10000-50000mpa.s, and the content of non-volatile substances is 55%-65%; the viscosity of component B at 25°C is 5000-20000mpa.s, and the content of non-volatile substances is 55%~65%; Pt catalyst is the use of siloxane oligomers containing long-chain alkyl and vinyl groups to perform coordination exchange on Karlster catalysts to form platinum-a,w-bis(n-octyl) Catalyst for polymethylvinylsiloxane complex; the above solvent is mixed with toluene and ethyl acetate at a weight ratio of 1:2, and the above silane coupling agent is r-methacryloxypropyltrimethoxysilane.
实施例3中A组分25℃时粘度为10000~50000mpa.s,非挥发性物质含量为55%~65%;B组分25℃时粘度为5000~20000mpa.s,非挥发性物质含量为55%~65%;Pt催化剂中铂含量为3000ppm~4000ppm;所述铂金催化剂为与甲基乙烯基硅氧烷配位的铂催化剂;溶剂为甲苯、二甲苯按照重量比1:1混合,上述硅烷偶联剂为r-缩水甘油醚氧丙基三甲氧基硅烷。In Example 3, the viscosity of component A at 25°C is 10000-50000mpa.s, and the content of non-volatile substances is 55%-65%; the viscosity of component B at 25°C is 5000-20000mpa.s, and the content of non-volatile substances is 55%~65%; the platinum content in the Pt catalyst is 3000ppm~4000ppm; the platinum catalyst is a platinum catalyst coordinated with methylvinylsiloxane; the solvent is toluene and xylene mixed in a weight ratio of 1:1, the above The silane coupling agent is r-glycidyl etheroxypropyltrimethoxysilane.
实施例4中A组分25℃时粘度为10000~50000mpa.s,非挥发性物质含量为55%~65%;B组分25℃时粘度为5000~20000mpa.s,非挥发性物质含量为55%~65%;Pt催化剂为利用含长链烷基和乙烯基的硅氧烷低聚物对卡尔斯特催化剂进行配位交换,配成铂-a,w-二(n-辛基)聚甲基乙烯基硅氧烷配合物的催化剂;上述述溶剂为甲苯、乙酸乙酯按照重量比1:2混合,上述硅烷偶联剂为r-甲基丙烯酰氧基丙基三甲氧基硅烷。In Example 4, the viscosity of component A at 25°C is 10000-50000mpa.s, and the content of non-volatile substances is 55%-65%; the viscosity of component B at 25°C is 5000-20000mpa.s, and the content of non-volatile substances is 55%~65%; Pt catalyst is the use of siloxane oligomers containing long-chain alkyl and vinyl groups to perform coordination exchange on Karlster catalysts to form platinum-a,w-bis(n-octyl) Catalyst for polymethylvinylsiloxane complexes; the above-mentioned solvent is mixed with toluene and ethyl acetate at a weight ratio of 1:2, and the above-mentioned silane coupling agent is r-methacryloxypropyltrimethoxysilane .
一种用于上述低温固化硅胶保护膜的制备方法,包括以下步骤:A preparation method for the above-mentioned low-temperature curing silica gel protective film, comprising the following steps:
步骤一、将稀释溶剂、A组分、B组分原料加入反应釜中,在常温下搅拌,得到分散液;
步骤二、在分散液搅拌时依次加入硅烷偶联剂、Pt催化剂和2-甲基-3-丁炔-2-醇,并混合均匀得到有机硅压敏胶黏剂;
步骤三、在基材上涂布所述有机硅压敏胶黏剂,通过胶带涂布机对基材表面进行涂布压敏胶,涂布完成后经烘箱50℃低温固化得到胶黏剂层;Step 3: Coating the silicone pressure-sensitive adhesive on the base material, coating the pressure-sensitive adhesive on the surface of the base material by a tape coater, and curing the adhesive layer in an oven at a low temperature of 50°C after the coating is completed ;
步骤四、在胶黏剂层上贴合一离型膜,制得所述低温固化硅胶保护膜Step 4: Paste a release film on the adhesive layer to prepare the low-temperature curing silicone protective film
上述步骤一中搅拌时间为1小时。The stirring time in the
对比例1~3:一种硅胶保护膜,包括依次设置的基材层、胶黏剂层和离型层,所述胶黏剂层由有机硅压敏胶黏剂烘烤固化获得,此有机硅压敏胶黏剂由以下组分在反应釜中搅拌得到,如表4所述:Comparative Examples 1-3: A silicone protective film, including a substrate layer, an adhesive layer and a release layer arranged in sequence, the adhesive layer is obtained by baking and curing a silicone pressure-sensitive adhesive, the organic The silicone pressure-sensitive adhesive is obtained by stirring the following components in a reactor, as described in Table 4:
表4Table 4
;;
上述A组分的组成,如表2所述:The composition of above-mentioned A component, as described in table 2:
表5table 5
;;
上述B组分的组成,如表3所述:The composition of above-mentioned B component, as described in table 3:
表6Table 6
对比例1和对比例3中A组分25℃时粘度为10000~50000mpa.s,非挥发性物质含量为55%~65%;B组分25℃时粘度为5000~20000mpa.s,非挥发性物质含量为55%~65%;Pt催化剂中铂含量为3000ppm~4000ppm;所述铂金催化剂为与甲基乙烯基硅氧烷配位的铂催化剂;溶剂为甲苯、二甲苯按照重量比1:1混合,上述硅烷偶联剂为r-缩水甘油醚氧丙基三甲氧基硅烷。In Comparative Example 1 and Comparative Example 3, the viscosity of component A at 25°C is 10000-50000mpa.s, and the content of non-volatile substances is 55%-65%; the viscosity of component B at 25°C is 5000-20000mpa.s, and the content of non-volatile The content of the active substance is 55%~65%; the platinum content in the Pt catalyst is 3000ppm~4000ppm; the platinum catalyst is a platinum catalyst coordinated with methylvinylsiloxane; the solvent is toluene and xylene according to the weight ratio of 1: 1 mixing, the above-mentioned silane coupling agent is r-glycidyl etheroxypropyl trimethoxysilane.
对比例2中A组分25℃时粘度为10000~50000mpa.s,非挥发性物质含量为55%~65%;B组分25℃时粘度为5000~20000mpa.s,非挥发性物质含量为55%~65%;Pt催化剂为利用含长链烷基和乙烯基的硅氧烷低聚物对卡尔斯特催化剂进行配位交换,配成铂-a,w-二(n-辛基)聚甲基乙烯基硅氧烷配合物的催化剂;上述述溶剂为甲苯、乙酸乙酯按照重量比1:2混合,上述硅烷偶联剂为r-甲基丙烯酰氧基丙基三甲氧基硅烷。In Comparative Example 2, the viscosity of component A at 25°C is 10000-50000mpa.s, and the content of non-volatile substances is 55%-65%; the viscosity of component B at 25°C is 5000-20000mpa.s, and the content of non-volatile substances is 55%~65%; Pt catalyst is the use of siloxane oligomers containing long-chain alkyl and vinyl groups to perform coordination exchange on Karlster catalysts to form platinum-a,w-bis(n-octyl) Catalyst for polymethylvinylsiloxane complexes; the above-mentioned solvent is mixed with toluene and ethyl acetate at a weight ratio of 1:2, and the above-mentioned silane coupling agent is r-methacryloxypropyltrimethoxysilane .
对比例的制备方法同实施例的制备方法。The preparation method of the comparative example is the same as that of the embodiment.
上述实施例1~4和对比例1~3获得的硅胶保护膜,此硅胶保护膜中有机硅压敏胶黏剂在50℃下对固化时间进行检索,检测结果如下:For the silicone protective film obtained in the above-mentioned Examples 1-4 and Comparative Examples 1-3, the silicone pressure-sensitive adhesive in the silicone protective film was searched for the curing time at 50°C, and the test results were as follows:
表7Table 7
;;
如表7的评价结果所示,本发明实施例1~4的硅胶保护膜中有机硅压敏胶黏剂,在50℃检测固化时间分别为22分钟、24分钟、21分钟、23分钟,对比例1~3检测固化时间分别35分钟、41分钟、32分钟;本发明实施例有机硅压敏胶黏剂相对于对比例在50℃下固化时间降低。As shown in the evaluation results in Table 7, the silicone pressure-sensitive adhesives in the silicone protective films of Examples 1 to 4 of the present invention have a curing time of 22 minutes, 24 minutes, 21 minutes, and 23 minutes at 50°C. The curing times of
上述实施例只为说明本发明的技术构思及特点,其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施,并不能以此限制本发明的保护范围。凡根据本发明精神实质所作的等效变化或修饰,都应涵盖在本发明的保护范围之内。The above-mentioned embodiments are only to illustrate the technical concept and characteristics of the present invention, and the purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, and not to limit the protection scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention shall fall within the protection scope of the present invention.
Claims (7)
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